JP2006086258A - Nonsuction head pickup for electronic device waiting test - Google Patents

Nonsuction head pickup for electronic device waiting test Download PDF

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JP2006086258A
JP2006086258A JP2004268035A JP2004268035A JP2006086258A JP 2006086258 A JP2006086258 A JP 2006086258A JP 2004268035 A JP2004268035 A JP 2004268035A JP 2004268035 A JP2004268035 A JP 2004268035A JP 2006086258 A JP2006086258 A JP 2006086258A
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electronic
standby electronic
elastic
terminals
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JP4139368B2 (en
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Motatsu Rei
孟達 黎
Yuan-Ji Lin
源記 林
Shih-Bau Chang
世寶 張
Dann-Fun Lin
殿方 林
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King Yuan Electronics Co Ltd
京元電子股▲ふん▼有限公司
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a nonsuction head pickup for electronic device waiting test. <P>SOLUTION: The nonsuction head pickup formed by an airtight cover having a plurality of openings sucks an electronic device waiting test having a plurality of terminals (pads) on the surface wherein each opening is used for containing each terminal and the electronic device waiting test is sucked by suction force generated through pressure reduction. Test is carried out while keeping some distance between each terminal of the electronic device waiting test and a corresponding test terminal (pogo pin) by means of a resilient device, and bringing each terminal into contact with the corresponding test terminal through compression of the resilient device. Terminal of the electronic device waiting test is separated from the test terminal by releasing compression of the resilient device after completing the test, and the electronic device waiting test is moved to a tray area where vacuum is broken and released. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は試験待機電子装置用ピックアップ装置に係り、特に気密カバーで形成した無吸着ヘッド式ピックアップ装置により試験待機電子装置をピックアップする装置に関する。   The present invention relates to a pick-up device for a test standby electronic device, and more particularly to an apparatus for picking up a test standby electronic device by a non-adsorption head type pickup device formed by an airtight cover.

電子装置は製造完成後に通常試験を行なう必要があり、それによって所定の機能を達成できるか否かを確定できる。試験時には、通常、バッチ全体の電子装置を試験機(tester)のトレイ(tray)中に放置し、試験機上のハンドラー(handler)で一つ或いは複数の電子装置をシャトル装置(shuttle means)に運び、続いてシャトル装置で試験待機電子装置を試験エリアに運送し、更に試験エリアのピックアップ装置で電子装置を吸着し、更にソケットに運び、試験を行ない、並びに試験完成後に、電子装置をシャトル装置に渡してトレイエリアに戻し、更に試験結果により電子装置を合格トレイ或いは不合格のトレイ中に入れる。   The electronic device needs to be subjected to a normal test after completion of manufacture, thereby determining whether or not a predetermined function can be achieved. During testing, the entire batch of electronic devices is typically left in a tester tray, and one or more electronic devices are placed on a shuttle means by a handler on the tester. Then, the test standby electronic device is transported to the test area by the shuttle device, the electronic device is further picked up by the pickup device in the test area, further transported to the socket, the test is performed, and after the test is completed, the electronic device is shuttled. Is returned to the tray area, and the electronic device is placed in a pass tray or a reject tray depending on the test result.

伝統的に、ピックアップ装置は軟式吸着ヘッドとされ、真空吸着方式でパッケージ完成した試験待機電子装置の上表面(即ち平坦な表面)を吸着し、その後、吸い上げた電子装置を試験機に運び、下圧動作で電子装置中の複数の端子(pads)を具えた下表面をソケット中の試験端子(pogo pins)と接触させ、電子装置の試験を行なう。   Traditionally, the pick-up device is a soft suction head that picks up the upper surface (ie, a flat surface) of the test standby electronic device that has been packaged using the vacuum suction method, and then transports the picked-up electronic device to the testing machine. The electronic device is tested by bringing a lower surface having a plurality of terminals (pads) in the electronic device into contact with test terminals (pogo pins) in the socket by pressure operation.

このほか、製品の多様化要求に合わせ、多くの電子装置はパッケージの上表面と下表面に共に端子或いはその他の特殊アクセサリ、例えば電荷結合素子(CCD)180を取り付ける必要が生じ、この電荷結合素子180は通常、一つの表面に一層の感光層184が配置され光線を受け取り、並びにもう一つの表面に端子182が配置され外界と接触する。しかし、試験時には、必要とする試験光が試験機より発射され、ゆえに感光層が下表面に設けられ、端子182が上表面に設けられなければならない。このとき、試験待機電子装置のサイズが小さいか或いは被吸着表面の端子が密集しすぎる時、例えばボールグリッドアレイ(BGA)パッケージの装置であり、そのソルダーバンプとソルダーバンプの間の距離が0.7mmより小さい時、図1に示されるように、被吸着表面の端子が被吸着表面の各所に分布し、吸着表面は吸着ヘッドの吸着に供されて気密を発生することができる端子がなく且つ大きな表面積の部分を提供できない。また試験待機電子装置のサイズが小さ過ぎると、吸着ヘッドもこれに合わせて小さくしなければならず、受力が一層不平均となりやすくなり、歪みの問題が更に厳重となる。   In addition, in response to the diversification demand of products, many electronic devices need to attach terminals or other special accessories such as a charge coupled device (CCD) 180 to the upper and lower surfaces of the package. In 180, a single photosensitive layer 184 is disposed on one surface to receive light, and a terminal 182 is disposed on the other surface to contact the outside. However, at the time of testing, the required test light is emitted from the testing machine, and therefore the photosensitive layer must be provided on the lower surface and the terminal 182 must be provided on the upper surface. At this time, when the size of the test standby electronic device is small or the terminals on the surface to be adsorbed are too dense, for example, the device is a ball grid array (BGA) package, and the distance between the solder bumps is 0. When it is smaller than 7 mm, as shown in FIG. 1, the terminals of the surface to be adsorbed are distributed in various places on the surface to be adsorbed, and the adsorbing surface is used for the adsorption of the adsorption head and has no terminals capable of generating airtightness. Can not provide a large surface area part. On the other hand, if the size of the test standby electronic device is too small, the suction head must be reduced accordingly, and the receiving force is more likely to become non-average, and the problem of distortion becomes more severe.

このため、両面にアクセサリが取り付けられた電子装置のピックアップ時に、電子装置表面の端子と試験端子の衝突を防止できるようにすると共に、比較的小さいBGAパッケージ電子装置に適用可能で端子の分布状況の制限を受けないようにすることが大きな難題となっている。   Therefore, at the time of picking up an electronic device with accessories attached on both sides, it is possible to prevent collision between the terminal on the surface of the electronic device and the test terminal, and it can be applied to a relatively small BGA package electronic device. The challenge is not to be restricted.

本発明は一種の試験待機電子装置用無吸着ヘッド式ピックアップ装置を提供し、それは従来の技術中のピックアップ装置が表面の端子が過密状態の試験待機電子装置を吸着できない問題を解決し、或いは試験待機電子装置が吸着された後に歪みを発生してフローティングサイトに滑り込む時に、歪みにより上表面の端子が試験端子に衝突し、これにより端子或いは試験端子の損傷を発生したり、或いは試験待機電子装置の脱落の問題を解決することができる装置であるものとする。   The present invention provides a kind of non-adsorptive head-type pickup device for test standby electronic devices, which solves the problem that the pickup device in the prior art cannot absorb the test standby electronic device whose surface terminals are overcrowded. When the standby electronic device is adsorbed and distorted and slides into the floating site, the upper surface terminal collides with the test terminal due to the distortion, thereby causing damage to the terminal or the test terminal, or the test standby electronic device. It is assumed that the apparatus can solve the problem of falling off.

本発明は一種の試験待機電子装置用無吸着ヘッド式ピックアップ装置を提供することを目的とし、それは、気密カバーを従来の吸着ヘッドの代わりに採用し、気密カバーの各開口により被吸着表面の端子を収容し、並びに各開口により吸気し、試験待機電子装置を吸着し、並びに試験待機電子装置を吸着後に、端子と試験端子に一定の距離を保持させることで衝突の問題を防止する。   An object of the present invention is to provide a kind of non-adsorptive head type pick-up device for a test standby electronic device, which adopts an airtight cover instead of a conventional adsorption head, and is provided with terminals on the surface to be adsorbed by each opening of the airtight cover And sucking in through each opening, adsorbing the test standby electronic device, and holding the test standby electronic device, the terminal and the test terminal are held at a certain distance, thereby preventing a collision problem.

請求項1の発明は、吸気装置、ベース、気密カバー、弾性装置を具えた試験待機電子装置用無吸着ヘッド式ピックアップ装置であり、
該吸気装置は吸気により吸引力を発生し、
該ベースは気密空間と複数の試験端子を具え、該気密空間の一端の開口が該吸気装置に接続され、
該気密カバーは、弾性材料で形成され、その一端が該気密空間に接続され並びに該気密空間と気密接触を保持し、別端に複数の開口が設けられ、該複数の開口が複数の試験端子と気密接触を形成し、且つ該複数の開口が試験待機電子装置の被吸着表面の複数の端子に対応し、
該弾性装置は弾性係数を具え、その一端が該ベースの別端に接続され、該弾性装置の別端は該気密カバーに接続され、
該複数の開口が、吸気装置の吸気により吸引力を発生して試験待機電子装置を吸着し、並びに該試験待機電子装置が吸着される時、該複数の端子と該複数の試験端子が不接触とされ、該気密カバーが該弾性装置により気密空間の第1位置と第2位置の間に制御され、該弾性装置は吸引力を受けない時に該気密カバーを第1位置に制御することを特徴とする、試験待機電子装置用無吸着ヘッド式ピックアップ装置としている。
請求項2の発明は、請求項1記載の試験待機電子装置用無吸着ヘッド式ピックアップ装置において、弾性装置がその弾性係数より大きい圧力を受ける時、気密カバーが第2位置に制御され、並びに複数の端子が複数の試験端子と接触させられ、この圧力が消失した後、弾性装置が複数の端子と複数の試験端子を分離させることを特徴とする、試験待機電子装置用無吸着ヘッド式ピックアップ装置としている。
請求項3の発明は、請求項1記載の試験待機電子装置用無吸着ヘッド式ピックアップ装置において、弾性装置が、環形リング、スプリングセット、スポンジのいずれかとされたことを特徴とする、試験待機電子装置用無吸着ヘッド式ピックアップ装置としている。
請求項4の発明は、請求項1記載の試験待機電子装置用無吸着ヘッド式ピックアップ装置において、気密カバーが試験待機電子装置を固定するための保護スカートを具えたことを特徴とする、試験待機電子装置用無吸着ヘッド式ピックアップ装置としている。
請求項5の発明は、請求項1記載の試験待機電子装置用無吸着ヘッド式ピックアップ装置において、試験待機電子装置が電荷結合素子(CCD)とされ、該電荷結合素子がボールグリッドアレイ(BGA)方式でパッケージされ、且つ該ボールグリッドアレイのボールピッチが0.7mmより小さいものとされたことを特徴とする、試験待機電子装置用無吸着ヘッド式ピックアップ装置としている。
The invention of claim 1 is a non-adsorption head type pickup device for a test standby electronic device comprising an intake device, a base, an airtight cover, and an elastic device,
The intake device generates suction force by intake air,
The base includes an airtight space and a plurality of test terminals, and an opening at one end of the airtight space is connected to the intake device;
The hermetic cover is formed of an elastic material, one end of which is connected to the hermetic space and maintains airtight contact with the hermetic space, and a plurality of openings are provided at the other end, and the plurality of openings are a plurality of test terminals. And the plurality of openings correspond to a plurality of terminals on the surface to be adsorbed of the test standby electronic device,
The elastic device has an elastic modulus, one end of which is connected to the other end of the base, and the other end of the elastic device is connected to the hermetic cover;
The plurality of openings generate suction force by suction of the intake device to adsorb the test standby electronic device, and when the test standby electronic device is adsorbed, the plurality of terminals and the plurality of test terminals are not in contact with each other The airtight cover is controlled between the first position and the second position of the airtight space by the elastic device, and the elastic device controls the airtight cover to the first position when receiving no suction force. The non-adsorptive head type pickup device for the test standby electronic device.
According to a second aspect of the present invention, in the non-adsorption head type pickup device for the test standby electronic device according to the first aspect, when the elastic device receives a pressure larger than its elastic coefficient, the hermetic cover is controlled to the second position, and a plurality of The non-adsorptive head type pick-up device for test standby electronic device, wherein the elastic device separates the plurality of terminals and the plurality of test terminals after the terminal is brought into contact with the plurality of test terminals and the pressure disappears It is said.
The invention according to claim 3 is the non-adsorption head type pickup device for the test standby electronic device according to claim 1, wherein the elastic device is any one of an annular ring, a spring set, and a sponge. This is a non-adsorption head type pickup device.
According to a fourth aspect of the present invention, in the non-adsorption head type pickup device for the test standby electronic device according to the first aspect, the airtight cover includes a protective skirt for fixing the test standby electronic device. It is a non-adsorptive head type pickup device for electronic devices.
The invention according to claim 5 is the non-adsorption head type pickup device for the test standby electronic device according to claim 1, wherein the test standby electronic device is a charge coupled device (CCD), and the charge coupled device is a ball grid array (BGA). The non-adsorptive head type pickup device for the test standby electronic device is characterized in that it is packaged in a system and the ball pitch of the ball grid array is smaller than 0.7 mm.

これにより、本発明では、複数の開口を具えた気密カバーが形成する無吸着ヘッド式ピックアップ装置により表面に複数の端子(pads)を具えた試験待機電子装置を吸着し、各開口は各端子を収容するのに用いられ、並びに吸気により発生する吸力により試験待機電子装置を吸着する。更に弾性装置で試験待機電子装置の各端子と対応する試験端子(pogo pin)にある距離を保持させ、弾性装置の圧縮により各端子と対応する試験端子が接触させられ、試験が行なわれる。試験完了後に弾性装置の圧縮が解除されることで、試験待機電子装置の端子と試験端子が分離し、更に試験待機電子装置がトレイエリアに移動され、真空が破壊されて釈放される。   Accordingly, in the present invention, the test standby electronic device having a plurality of terminals (pads) on the surface is adsorbed by the non-adsorption head type pick-up device formed by the airtight cover having a plurality of openings, and each opening has each terminal. The test standby electronic device is adsorbed by the suction force that is used for housing and generated by suction. Further, the elastic device is used to hold a distance at a test terminal (pogo pin) corresponding to each terminal of the test stand-by electronic device, and the test terminal corresponding to each terminal is brought into contact by the compression of the elastic device to perform the test. When the compression of the elastic device is released after the test is completed, the terminal of the test standby electronic device and the test terminal are separated, and the test standby electronic device is moved to the tray area, and the vacuum is broken and released.

本発明は以下に具体的実施例を以て説明される。しかし、その詳細な記述のほか、本発明は更に広く他の実施例で実施可能であり、且つ本発明の範囲は実施例の記載に限定されるものではなく、特許請求の範囲の記載に準じるものとする。   The invention is illustrated below with specific examples. However, in addition to the detailed description, the present invention can be implemented in a wider range of other embodiments, and the scope of the present invention is not limited to the description of the embodiments, but conforms to the description of the claims. Shall.

更に、明らかな記載を提供し本発明の理解を容易とするため、図中の各部分はその相対寸法により描かれておらず、ある寸法とその他の関係寸法の比は誇張されている。関係のない細部は完全には記載されておらず、図示を簡潔としている。   Further, in order to provide a clear description and facilitate understanding of the present invention, each part in the figure is not drawn by its relative dimensions, and the ratio of certain dimensions to other related dimensions is exaggerated. Unrelated details are not fully described and the illustration is simplified.

従来の技術によると、試験待機電子装置はその端子を具備する表面が吸着に供されるか或いは電子装置のサイズが小さ過ぎる時のいずれも、伝統的な吸着ヘッド式ピックアップ装置による試験待機電子装置の吸着には適合しなかった。本発明は一種の試験待機電子装置用無吸着ヘッド式ピックアップ装置を提供する。本発明は弾性を有する気密カバーが形成する無吸着ヘッド式ピックアップ装置により表面に複数の端子(pads)を具えた試験待機電子装置を吸着し、試験待機電子装置の吸着後に、気密カバーの保護スカートにより固定位置に位置決めされるようにし、並びに試験待機電子装置の端子と試験端子がある距離を保持するものとする。   According to the prior art, the test stand-by electronic device is a test stand-by electronic device with a traditional pick-up head type pick-up device, either when the surface with its terminals is subjected to suction or when the size of the electronic device is too small It was not compatible with the adsorption. The present invention provides a kind of non-adsorption head type pickup device for a test standby electronic device. The present invention adsorbs a test standby electronic device having a plurality of pads (pads) on its surface by a non-adsorptive head pickup device formed by an elastic hermetic cover, and after the test standby electronic device is adsorbed, a protective skirt for the hermetic cover And the test standby electronic device terminal and the test terminal are kept at a certain distance.

続いて、試験待機電子装置が試験機に移動させた後、試験機の提供する下圧力により試験待機電子装置の端子と試験端子を接触させて試験を行なう。この時、試験待機電子装置の端子と試験端子の接触応力を減らすため、本発明は更に弾性装置(一組のスプリング或いは一組の弾性スポンジとされる)を緩衝装置として接触の応力を減らす。試験待機電子装置の試験完成後に、試験機の下圧力が消失すると、弾性装置により試験待機電子装置の端子と試験端子をもとの位置に戻す。このほか、気密カバーは複数の開口を有するものとし、該開口は試験待機電子装置の複数の端子と対応し、試験待機電子装置吸着時に試験待機電子装置の端子を収容し、並びに弾性装置が圧縮される時に試験待機電子装置の端子と試験端子を収容して内部で接触させる。   Subsequently, after the test standby electronic device is moved to the test machine, the test is performed by bringing the terminal of the test standby electronic device into contact with the test terminal by the lower pressure provided by the test machine. At this time, in order to reduce the contact stress between the terminal of the test standby electronic device and the test terminal, the present invention further reduces the contact stress by using an elastic device (a set of springs or a set of elastic sponge) as a shock absorber. After the completion of the test of the test standby electronic device, when the lower pressure of the testing machine disappears, the terminals of the test standby electronic device and the test terminals are returned to their original positions by the elastic device. In addition, the hermetic cover has a plurality of openings, which correspond to the plurality of terminals of the test standby electronic device, accommodate the terminals of the test standby electronic device when the test standby electronic device is attracted, and the elastic device is compressed. The test standby electronic device terminal and the test terminal are accommodated and contacted internally when the test is performed.

更に気密カバーはベースの気密空間中に制限され、気密カバーとベース間は気密接触を保持するものとし、並びに吸気装置(例えばポンプ)で気密空間に対して吸気を行ない真空を形成し、これにより各開口に吸引力を発生させて試験待機電子装置を吸着させる。試験待機電子装置が吸着された後、各開口は気密を形成し、気密空間も気密を形成し、これにより試験待機電子装置を吸着する吸引力が発生する。こうして、従来の技術中の試験待機電子装置の端子と試験端子が衝突することで試験待機電子装置が脱落する欠点が防止され、並びに気密カバーの各開口が電子装置に対する吸着力を分散させ、電子装置の被吸着表面の端子位置による制限を受けないものとされる。   Furthermore, the airtight cover is limited to the airtight space of the base, and the airtight cover and the base are kept in airtight contact. In addition, an air intake device (for example, a pump) performs intake to the airtight space to form a vacuum. A suction force is generated at each opening to attract the test standby electronic device. After the test standby electronic device is adsorbed, each opening forms an airtight state, and the airtight space also forms an airtight state, thereby generating a suction force for adsorbing the test standby electronic device. In this way, the disadvantage that the test standby electronic device falls off due to the collision between the terminal of the test standby electronic device and the test terminal in the prior art is prevented, and each opening of the airtight cover disperses the adsorption force with respect to the electronic device. It is assumed that the device is not restricted by the position of the terminal on the surface to be adsorbed.

本発明の具体的実施例によると、試験待機電子装置のピックアップ装置100は、図2に示されるように、ベース24、弾性を具えた気密カバー22、吸気装置26、及び気密カバー22とベース24の間に位置する弾性装置30を具えている。気密カバー22はベース24の気密空間242中に位置し、試験待機電子装置28の複数の端子282に対応する複数の開口222を具え、該開口222は試験待機電子装置28を吸着する時、試験待機電子装置28の端子282を収容できる。このほか、気密カバー22は更に保護スカート226を具え、吸気装置26が吸気を行ない、気密空間242及び開口222に負圧を形成させ、発生した吸引力により試験待機電子装置28の端子を具えた表面を吸着する時、この保護スカート226が試験待機電子装置28を固定し、試験待機電子装置28の吸着過程で歪みにより発生する衝突により試験待機電子装置28が脱落する欠点を防止する。   According to a specific embodiment of the present invention, the pick-up device 100 of the test standby electronic device includes a base 24, an airtight cover 22 having elasticity, an air intake device 26, and an airtight cover 22 and a base 24, as shown in FIG. The elastic device 30 is located between the two. The hermetic cover 22 is located in the hermetic space 242 of the base 24 and includes a plurality of openings 222 corresponding to the plurality of terminals 282 of the test standby electronic device 28, and the opening 222 is configured to test when the test standby electronic device 28 is sucked. The terminal 282 of the standby electronic device 28 can be accommodated. In addition, the airtight cover 22 further includes a protective skirt 226, and the air intake device 26 performs air intake to form a negative pressure in the airtight space 242 and the opening 222, and the terminal of the test standby electronic device 28 is provided by the generated suction force. This protective skirt 226 secures the test standby electronic device 28 when adsorbing the surface, and prevents the test standby electronic device 28 from dropping off due to a collision caused by distortion during the adsorption process of the test standby electronic device 28.

このほか、ベース24に複数の試験端子246と気密空間242が配置される。気密空間242の第1開口244は吸気装置26との接続に用いられ、第2開口は気密カバー22の接続端224と接触し、気密カバー22と気密空間242の間を気密接触させる。このほか、気密カバー22の接続端224は気密空間242内を移動可能であるが、その移動はxの範囲に制限され、即ち気密カバー22は僅かに接続端224(即ち第1位置と定義される)と第2位置248の範囲内で活動可能である。吸気装置26が吸気する時、気体は気密空間242及び気密カバー22の開口222のみより進入し、気密カバー22の吸着端228に吸引力を発生させ、これにより試験待機電子装置28に対する吸着力が発生する。続いて、試験待機電子装置28が各開口222に吸着された後、試験待機電子装置28が開口222を塞ぐため、気密空間242は第1開口244から吸着端228の間に気密空間を形成し、これにより試験待機電子装置28がしっかりと吸着される。   In addition, a plurality of test terminals 246 and an airtight space 242 are arranged on the base 24. The first opening 244 of the airtight space 242 is used for connection with the intake device 26, and the second opening is in contact with the connection end 224 of the airtight cover 22, so that the airtight cover 22 and the airtight space 242 are in airtight contact. In addition, the connection end 224 of the hermetic cover 22 can move in the hermetic space 242, but the movement is limited to the range of x, that is, the hermetic cover 22 is slightly defined as the connection end 224 (that is, the first position). And the second position 248 is active. When the intake device 26 inhales, the gas enters only through the airtight space 242 and the opening 222 of the airtight cover 22 and generates a suction force at the suction end 228 of the airtight cover 22. appear. Subsequently, after the test standby electronic device 28 is attracted to each opening 222, the test standby electronic device 28 closes the opening 222, so that the airtight space 242 forms an airtight space between the first opening 244 and the suction end 228. As a result, the test standby electronic device 28 is firmly adsorbed.

気密カバー22は弾性を有する材料、例えばスポンジで形成され、ゆえに試験待機電子装置28が吸着端228に吸着される時、その具備する弾性特性により試験待機電子装置28が受ける応力を減らすことができる。このほか、気密カバー22は緩衝装置として試験待機電子装置28が吸着される時に発生する応力を吸収し、試験待機電子装置28が受ける応力を減らすほか、保護スカート226により試験待機電子装置28を吸着過程で水平の状態を保持させ、これにより試験待機電子装置28の吸着過程での脱落を防止する。このほか、気密カバー22の弾性特性により試験待機電子装置28の端子282と試験端子246の間の距離が制御され、これにより、試験待機電子装置28の端子282が吸着時に直接試験待機電子装置に衝突することが防止され、これは図3に示されるとおりである。   The hermetic cover 22 is formed of an elastic material, for example, a sponge. Therefore, when the test standby electronic device 28 is attracted to the suction end 228, the stress received by the test standby electronic device 28 can be reduced due to the elastic characteristics of the test standby electronic device 28. . In addition, the airtight cover 22 absorbs stress generated when the test standby electronic device 28 is adsorbed as a shock absorber, reduces the stress received by the test standby electronic device 28, and adsorbs the test standby electronic device 28 by the protective skirt 226. The horizontal state is maintained in the process, thereby preventing the test standby electronic device 28 from falling off during the adsorption process. In addition, the distance between the terminal 282 of the test standby electronic device 28 and the test terminal 246 is controlled by the elastic characteristic of the hermetic cover 22, so that the terminal 282 of the test standby electronic device 28 is directly connected to the test standby electronic device at the time of adsorption. Collisions are prevented, as shown in FIG.

続いて、試験待機電子装置28が試験機のソケット位置(図示せず)に移動させられる時、試験機が提供する下圧の動作により試験待機電子装置28がソケットと接合され、同時にこの下圧力が気密カバー22のスポンジ及び弾性装置30の弾性係数より大きい時は、更に圧縮されて、端子282と試験端子246が接触させられ、試験が行なわれ、これは図4に示されるとおりである。同様に、弾性装置30は応力を吸収する作用を有し、これにより、緩衝装置とされて試験機の下圧力の発生する圧力を吸収し、端子282と試験端子246を穏やかな力で接触させ、これにより課題な下圧力による試験待機電子装置28或いは試験端子246の損壊が防止される。   Subsequently, when the test standby electronic device 28 is moved to the socket position (not shown) of the tester, the test standby electronic device 28 is joined to the socket by the operation of the lower pressure provided by the tester, and at the same time, this lower pressure. Is larger than the elastic modulus of the sponge of the airtight cover 22 and the elastic device 30, it is further compressed, the terminal 282 and the test terminal 246 are brought into contact with each other, and a test is performed, as shown in FIG. Similarly, the elastic device 30 has a function of absorbing stress, whereby the elastic device 30 is used as a shock absorber and absorbs the pressure generated by the lower pressure of the test machine, thereby bringing the terminal 282 and the test terminal 246 into contact with a gentle force. This prevents the test standby electronic device 28 or the test terminal 246 from being damaged due to the lower pressure.

このほか、試験待機電子装置28の試験が完成した後、試験機は下圧の力を終了し、並びに引き上げの力を提供し、試験待機電子装置28をソケットより離脱させる。この時、弾性装置30もまた端子282と試験端子246を分離させ、気密カバー22を接続端224(即ち第1位置)まで下降させ、気密カバー22を固定位置に確実に戻す。続いて、吸気装置26が送気を行ない(即ち真空破壊)、並びに試験待機電子装置28をトレイ中に落とす。真空が破壊された後、吸気装置26が気体を気密空間242に流入させて気密空間242の気圧を外部気圧と等しくし、吸着装置22を第1位置まで下降させる。   In addition, after the test of the test standby electronic device 28 is completed, the testing machine terminates the lower pressure force and provides a pulling force to cause the test standby electronic device 28 to be detached from the socket. At this time, the elastic device 30 also separates the terminal 282 and the test terminal 246, lowers the hermetic cover 22 to the connection end 224 (that is, the first position), and reliably returns the hermetic cover 22 to the fixed position. Subsequently, the intake device 26 supplies air (i.e., vacuum break), and the test standby electronic device 28 is dropped into the tray. After the vacuum is broken, the suction device 26 causes the gas to flow into the airtight space 242 to make the air pressure in the airtight space 242 equal to the external air pressure, and lowers the adsorption device 22 to the first position.

このほか、上述の弾性装置30は一つ或いは複数の弾性部品で構成され、例えば環形リング、スポンジ或いはスプリングで構成され、本発明では弾性装置の種類と数量について制限を加えない。   In addition, the above-described elastic device 30 is configured by one or a plurality of elastic parts, for example, an annular ring, a sponge, or a spring, and the present invention does not limit the type and quantity of the elastic device.

本発明の試験待機電子装置用無吸着ヘッド式ピックアップ装置は上表面と下表面に共に端子或いはその他の特殊アクセサリ例えば電荷結合素子(CCD)が取り付けられた試験待機電子装置に対して吸着を行ない、試験に供することができる。特に、試験待機電子装置28のサイズが小さいか或いは被吸着表面の端子が過度に密集する時、例えばBGAパッケージの装置であってそのソルダバンプ間のピッチが0.7mmより小さい時にも本発明の試験待機電子装置用無吸着ヘッド式ピックアップ装置を利用することで試験を行なうことができる。   The non-adsorptive head type pick-up device for test standby electronic device of the present invention performs adsorption to the test standby electronic device in which terminals or other special accessories such as a charge coupled device (CCD) are attached to the upper surface and the lower surface. Can be used for testing. In particular, when the test standby electronic device 28 is small in size or the terminals on the surface to be adsorbed are excessively dense, for example, when the device is a BGA package and the pitch between the solder bumps is smaller than 0.7 mm, the test of the present invention is performed. A test can be performed by using a non-adsorption head type pickup device for a standby electronic device.

以上は本発明の実施例の説明であって本発明の特許請求範囲を限定するためのものではなく、以上の記述により本発明の属する技術の分野における通常の知識を有する者が本発明を明確に理解し実行できる。本発明に基づく細部の修飾或いは改変であって本発明の精神の下でなしうるものは、いずれも本発明の請求範囲に属するものとする。   The above is the description of the embodiments of the present invention, and is not intended to limit the scope of the claims of the present invention. By the above description, those having ordinary knowledge in the technical field to which the present invention belongs will clarify the present invention. Can understand and execute. Any modification or alteration in detail based on the present invention which can be made within the spirit of the present invention shall fall within the scope of the claims of the present invention.

周知の試験待機電子装置の表示図である。It is a display figure of a known test standby electronic device. 本発明の実施例の装置表示図である。It is an apparatus display figure of the Example of this invention. 本発明の実施例の装置表示図である。It is an apparatus display figure of the Example of this invention. 本発明の実施例の装置表示図である。It is an apparatus display figure of the Example of this invention.

符号の説明Explanation of symbols

100 ピックアップ装置
180 電荷結合素子
182 端子
184 感光層
22 気密カバー
222 開口
224 接続端
226 保護スカート
228 吸着端
24 ベース
242 気密空間
244 第1開口
246 試験端子
248 第2位置
26 吸気装置
28 電子装置
282 端子
30 弾性装置
100 pickup device 180 charge coupled device 182 terminal 184 photosensitive layer 22 airtight cover 222 opening 224 connection end 226 protective skirt 228 suction end 24 base 242 airtight space 244 first opening 246 test terminal 248 second position 26 air intake device 28 electronic device 282 terminal 30 Elastic device

Claims (5)

吸気装置、ベース、気密カバー、弾性装置を具えた試験待機電子装置用無吸着ヘッド式ピックアップ装置であり、
該吸気装置は吸気により吸引力を発生し、
該ベースは気密空間と複数の試験端子を具え、該気密空間の一端の開口が該吸気装置に接続され、
該気密カバーは、弾性材料で形成され、その一端が該気密空間に接続され並びに該気密空間と気密接触を保持し、別端に複数の開口が設けられ、該複数の開口が複数の試験端子と気密接触を形成し、且つ該複数の開口が試験待機電子装置の被吸着表面の複数の端子に対応し、
該弾性装置は弾性係数を具え、その一端が該ベースの別端に接続され、該弾性装置の別端は該気密カバーに接続され、
該複数の開口が、吸気装置の吸気により吸引力を発生して試験待機電子装置を吸着し、並びに該試験待機電子装置が吸着される時、該複数の端子と該複数の試験端子が不接触とされ、該気密カバーが該弾性装置により気密空間の第1位置と第2位置の間に制御され、該弾性装置は吸引力を受けない時に該気密カバーを第1位置に制御することを特徴とする、試験待機電子装置用無吸着ヘッド式ピックアップ装置。
It is a non-adsorptive head type pick-up device for test standby electronic devices comprising an intake device, a base, an airtight cover, and an elastic device
The intake device generates suction force by intake air,
The base includes an airtight space and a plurality of test terminals, and an opening at one end of the airtight space is connected to the intake device;
The hermetic cover is formed of an elastic material, one end of which is connected to the hermetic space and maintains airtight contact with the hermetic space, and a plurality of openings are provided at the other end, and the plurality of openings are a plurality of test terminals. And the plurality of openings correspond to a plurality of terminals on the surface to be adsorbed of the test standby electronic device,
The elastic device has an elastic modulus, one end of which is connected to the other end of the base, the other end of the elastic device is connected to the hermetic cover,
The plurality of openings generate suction force by suction of the intake device to adsorb the test standby electronic device, and when the test standby electronic device is adsorbed, the plurality of terminals and the plurality of test terminals are not in contact with each other The airtight cover is controlled between the first position and the second position of the airtight space by the elastic device, and the elastic device controls the airtight cover to the first position when receiving no suction force. Non-adsorptive head type pickup device for test standby electronic device.
請求項1記載の試験待機電子装置用無吸着ヘッド式ピックアップ装置において、弾性装置がその弾性係数より大きい圧力を受ける時、気密カバーが第2位置に制御され、並びに複数の端子が複数の試験端子と接触させられ、この圧力が消失した後、弾性装置が複数の端子と複数の試験端子を分離させることを特徴とする、試験待機電子装置用無吸着ヘッド式ピックアップ装置。   2. The non-adsorption head type pickup device for a test standby electronic device according to claim 1, wherein when the elastic device receives a pressure larger than its elastic modulus, the hermetic cover is controlled to the second position, and the plurality of terminals are a plurality of test terminals. A non-adsorptive head type pick-up device for a test standby electronic device, wherein the elastic device separates a plurality of terminals and a plurality of test terminals after the pressure is lost. 請求項1記載の試験待機電子装置用無吸着ヘッド式ピックアップ装置において、弾性装置が、環形リング、スプリングセット、スポンジのいずれかとされたことを特徴とする、試験待機電子装置用無吸着ヘッド式ピックアップ装置。   2. The non-adsorptive head type pickup device for test standby electronic device according to claim 1, wherein the elastic device is any one of an annular ring, a spring set and a sponge. . 請求項1記載の試験待機電子装置用無吸着ヘッド式ピックアップ装置において、気密カバーが試験待機電子装置を固定するための保護スカートを具えたことを特徴とする、試験待機電子装置用無吸着ヘッド式ピックアップ装置。   2. The non-adsorption head type pickup device for test standby electronic devices according to claim 1, wherein the airtight cover includes a protective skirt for fixing the test standby electronic device. Pickup device. 請求項1記載の試験待機電子装置用無吸着ヘッド式ピックアップ装置において、試験待機電子装置が電荷結合素子(CCD)とされ、該電荷結合素子がボールグリッドアレイ(BGA)方式でパッケージされ、且つ該ボールグリッドアレイのボールピッチが0.7mmより小さいものとされたことを特徴とする、試験待機電子装置用無吸着ヘッド式ピックアップ装置。
2. The non-adsorption head type pickup device for a test standby electronic device according to claim 1, wherein the test standby electronic device is a charge coupled device (CCD), the charge coupled device is packaged in a ball grid array (BGA) system, and A non-adsorptive head type pickup device for a test standby electronic device, wherein the ball pitch of the ball grid array is smaller than 0.7 mm.
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JP2010062337A (en) * 2008-09-04 2010-03-18 Shin Etsu Polymer Co Ltd Suction device for substrate and handling method of substrate
JP2014038954A (en) * 2012-08-17 2014-02-27 Apic Yamada Corp Suction head for semiconductor manufacturing apparatus and manufacturing method of the same
JP2014038962A (en) * 2012-08-17 2014-02-27 Apic Yamada Corp Suction head for semiconductor manufacturing apparatus and manufacturing method of the same, and semiconductor device sucking method
JP2015208938A (en) * 2014-04-28 2015-11-24 三星ダイヤモンド工業株式会社 Method and apparatus for transporting brittle material substrate
KR20160060961A (en) * 2014-11-21 2016-05-31 박종복 sensor inspection device with a cover for isolation from the outside environment

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CN110045160B (en) * 2019-05-24 2021-06-08 安徽鹰龙工业设计有限公司 Test seat that top of BGA encapsulation usefulness was got and is put

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010062337A (en) * 2008-09-04 2010-03-18 Shin Etsu Polymer Co Ltd Suction device for substrate and handling method of substrate
JP2014038954A (en) * 2012-08-17 2014-02-27 Apic Yamada Corp Suction head for semiconductor manufacturing apparatus and manufacturing method of the same
JP2014038962A (en) * 2012-08-17 2014-02-27 Apic Yamada Corp Suction head for semiconductor manufacturing apparatus and manufacturing method of the same, and semiconductor device sucking method
JP2015208938A (en) * 2014-04-28 2015-11-24 三星ダイヤモンド工業株式会社 Method and apparatus for transporting brittle material substrate
KR20160060961A (en) * 2014-11-21 2016-05-31 박종복 sensor inspection device with a cover for isolation from the outside environment
KR101659769B1 (en) * 2014-11-21 2016-09-26 박종복 sensor inspection device with a cover for isolation from the outside environment

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