JP2006083760A - Electronic controller and electric pump - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide technology for suppressing rise of temperature of electronic parts of an electronic controller up to high temperature by a simple configuration. <P>SOLUTION: This electronic controller is provided with a substrate 23, the electronic parts mounted actually on the substrate 23, and a stator coil 35 connected with a terminal 37 provided on the substrate 23 electrically. The electronic parts are not actually mounted in a region in which the stator coil 35 is projected for the substrate from an infinite remote part on an anti-substrate face side of the stator coil 35. A region of the substrate 23 on which the stator coil 35 is projected for the substrate from the infinite remote part on the anti-substrate face side of the stator coil 35 is heated by the stator coil 35 and its temperature rises. If the electronic parts are not actually mounted in the projection region, it is possible to suppress rise of temperature of the electronic parts up to high temperature by the simple configuration without requiring a special device. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic control device. Specifically, the present invention relates to a technique for suppressing an increase in the temperature of an electronic component mounted on a substrate of an electronic control device.

2. Description of the Related Art An electronic control device that controls the operation of a device (for example, an electric pump) that incorporates a motor is known. The electronic control device includes a substrate, an electronic component mounted on the substrate, and a stator coil that is electrically connected to a terminal provided on the substrate. The stator coil generates heat when energized. When the stator coil generates heat, the heat causes the electronic components mounted on the substrate to become hot. Electronic components that have reached a high temperature may fail or have a reduced lifetime.
In the pump device described in Patent Document 1, a water jacket is disposed around the stator coil of the electronic control device, and the stator coil is cooled by water in the water jacket. When the stator coil is cooled by the water jacket, the electronic component can be prevented from becoming high temperature.

JP 2002-357192 A

If the water jacket is arranged around the stator coil as in the pump device described in Patent Document 1, the configuration becomes complicated. This is because the water jacket requires a channel through which the cooling water flows and a wall that separates the cooling water from the stator.
The present invention has been made to solve the problem, and an object of the present invention is to provide a technique capable of suppressing the electronic component of the electronic control device from becoming high temperature with a simple configuration.

The electronic control device of the present invention includes a substrate, an electronic component mounted on the substrate, and a stator coil that is electrically connected to a terminal provided on the substrate. And the electronic component is not mounted in the area | region which projected the stator coil with respect to the board | substrate from the infinite distance of the stator coil on the opposite board | substrate surface side.
The stator coil generates heat and becomes high temperature. The region of the substrate on which the stator coil is projected onto the substrate from infinity on the side opposite to the substrate surface of the stator coil is heated by the stator coil and the temperature becomes high. Like this electronic control device, if the electronic component is not mounted on the region where the stator coil is projected on the substrate from infinity on the side opposite to the substrate side of the stator coil, no special device is required, that is, It is possible to suppress the electronic component from becoming high temperature with a simple configuration.

Another electronic control device of the present invention includes a substrate, an electronic component mounted on the substrate, and a stator coil that is electrically connected to a terminal provided on the substrate. The board is formed with a slit that divides the mounting surface into a terminal side region and a non-terminal side region, and no electronic component is mounted in the terminal side region.
Heat is transmitted to the substrate from the stator coil through the terminal. The substrate of the electronic control device is formed with a slit that divides the mounting surface into a terminal side region and a non-terminal side region. For this reason, the amount of heat transferred from the terminal side region of the substrate to the non-terminal side region can be reduced by the slit. If the amount of heat transferred from the terminal-side region of the board to the non-terminal-side region is reduced, the temperature of the terminal-side region increases. However, no electronic component is mounted on the terminal-side region, so no problem occurs. By reducing the amount of heat transferred from the terminal side region of the substrate to the non-terminal side region, it is possible to suppress the temperature of the electronic component mounted on the anti-terminal side region from increasing. Therefore, it is possible to suppress the electronic component from reaching a high temperature with a simple configuration in which a slit is formed in the substrate.

In the above electronic control device, the slit is formed in the region where the stator coil is projected onto the substrate from infinity on the side opposite to the surface of the stator coil, and on the outer side of the terminal as viewed from the center of the projection region. It is preferable that an electronic component is mounted on the outer side of the slit in the projection area.
According to this electronic control device, the slit of the substrate is in the region where the stator coil is projected onto the substrate from infinity on the side opposite to the surface of the stator coil, and outward of the terminal as viewed from the center of the projection region. Formed on the side. For this reason, the heat transmitted from the stator coil to the substrate through the terminal is first transmitted to the substrate region on the inner side of the slit. The slit can reduce the amount of heat transferred from the substrate region on the inner side of the slit to the region on the outer side of the slit. For this reason, even if it mounts an electronic component in the projection area | region heated by a stator coil, it can suppress that the temperature of an electronic component becomes high.

In the above electronic control device, the slit is preferably filled with a resin having a lower thermal conductivity than the substrate.
If the slit is filled with a resin having a lower thermal conductivity than the substrate, the amount of heat transmitted across the slit can be reduced.

An electric pump of the present invention is formed by a substrate case, the electronic control device according to claim 1 housed in the substrate case, a pump case provided adjacent to the substrate case, the substrate case, and the pump case. A rotor housed rotatably in the pump chamber. The rotor has fins and is arranged inside or outside of the stator coil, and an electronic component with a large amount of heat generation is mounted in a region on the substrate facing the rotor accommodating portion of the pump chamber. Yes.
The liquid passes through the pump chamber of the electric pump. In the electric pump described above, an electronic component that generates a large amount of heat is mounted in a region on the substrate that faces the rotor accommodating portion of the pump chamber. For this reason, the electronic component with a large calorific value is cooled by the fluid passing through the pump chamber. Therefore, it is possible to suppress the electronic component from reaching a high temperature with a simple configuration that does not require a special device.
Here, the electronic component having a large heat generation means an electronic component having a relatively large heat generation among the electronic components mounted on the substrate.

Another electric pump of the present invention includes a substrate, an electronic component mounted on the substrate, a substrate case that accommodates the substrate and the electronic component, a pump case provided adjacent to the substrate case, and a substrate case. And a rotor rotatably accommodated in a pump chamber formed by the pump case. The rotor has fins and is disposed inward or outward of the stator coil, and the substrate is formed with slits that divide the mounting surface into a terminal side region and a non-terminal side region, and the terminal side region of the substrate Is characterized in that no electronic components are mounted except for a region facing the rotor accommodating portion of the pump chamber.
A slit for partitioning the mounting surface into a terminal side region and a non-terminal side region is formed on the substrate of the electric pump. In the terminal side region of the substrate, the heat of the stator coil is transmitted through the terminal. Since the slit is formed in the substrate, the amount of heat transferred from the terminal side region to the non-terminal side region is small. For this reason, it can suppress that the temperature of the electronic component mounted in a non-terminal side area | region becomes high. The region facing the rotor accommodating portion of the pump chamber in the terminal side region is cooled by the liquid passing through the pump chamber. Therefore, the temperature of the region excluding the region facing the rotor accommodating portion of the pump chamber in the terminal side region is high. Like this electric pump, if the electronic component is not mounted on the terminal side region of the board except for the region facing the rotor accommodating portion of the pump chamber, the temperature of the electronic component can be prevented from increasing. it can.

(First embodiment)
An electric pump according to a first embodiment of the present invention will be described with reference to the drawings.
The electric pump sucks liquid (for example, water) to increase the pressure, and discharges the increased pressure. As shown in FIG. 1, the electric pump 10 includes a housing 12, a circuit board 23, a stator 33, a rotor 43, and a body 50. In the following, for convenience of explanation, the top and bottom of FIG. Further, the right side of FIG. 1 is one side of the electric pump 10, and the left side is the other side of the electric pump 10. The housing 12 is a resin molded product, and a lower portion of the housing 12 is formed with a first housing recess 14 that opens downward. A housing convex portion 15 having a circular cross section is formed on the other side of the upper portion of the housing 12. An outer wall 17 is formed around the side wall of the housing convex portion 15. The housing convex portion 15 and the outer wall 17 form an annular second housing concave portion 20 that is open upward.
A third housing recess 16 is formed in the housing protrusion 15 so that the lower portion communicates with the first housing recess 14. As will be described in detail later, the stator 33 is accommodated in the third housing recess 16. A connector 21 is provided on one side of the upper portion of the housing 12.

As shown in FIG. 2, the circuit board 23 includes a board body 24 and electronic components 25 and 29. The electronic component with the sign “25” has a large amount of heat (for example, a power transistor or a power diode), and the electronic component with the sign “29” has a small amount of heat (for example, a capacitor) Or power surge absorbing diode). The substrate body 24 is formed in a plate shape, and printed wiring (not shown) is provided on both surfaces thereof. The electronic components 25 and 29 are mounted on the front surface side (upper surface side) of the substrate body 24. A terminal 26 is mounted on the circuit board 24. The terminal 26 is connected to the connector 21 via an electric path 28 (see FIG. 1). The connector 21 is supplied with power for operating the circuit board 23. The substrate main body 24 is provided with three terminal lands 27. As will be described in detail later, a stator 33 is attached to the terminal land 27 via a terminal 37. In FIG. 2, illustration of the stator 33 is omitted.
As shown in FIG. 3, a chip transistor 30 and a chip resistor 31 are provided on the back side surface of the substrate body 24.
The A area and the B area shown in FIGS. 2 and 3 will be described in detail later.

As shown in FIG. 1, the stator 33 includes a stator core 34 and a stator coil 35. As shown in FIG. 4, six radial slots 36 are formed in the stator core 34. The stator core 34 is formed by laminating thin steel plates having a planar shape shown in FIG. The stator coil 35 is wound around each slot 36 of the stator core 34.
A terminal 37 shown in FIG. 1 is soldered to each terminal land 27 of the board body 24 in a standing state. The lower end portion of the stator core 34 is fixed to the upper end portion of the terminal 37. The terminal 37 is connected to the stator coil 35 by wiring not shown.
The stator 33 is accommodated in the third housing recess 16 of the housing 12. The circuit board 23 is accommodated in the first housing recess 14 of the housing 12. The remaining space of the first housing recess 14 is filled with a potting material 41. The housing 12 corresponds to a “board case” described in the claims.

The rotor 43 is made of resin, and a plurality of fins 44 are formed on the top thereof. A cylindrical portion 45 is formed at the lower portion of the rotor 43. The rotor 43 is magnetized by containing magnetic powder.
A bearing member 47 is fixed to the rotor 43. A shaft 46 is fixed to the housing convex portion 15. A bearing member 47 is rotatably mounted on a portion of the shaft 46 protruding from the housing convex portion 15. Accordingly, the rotor 43 can rotate around the shaft 46. When the rotor 43 is mounted on the shaft 46, the tubular portion 45 of the rotor 43 is disposed in the second housing recess 20 of the housing 12.
The body 50 is made of resin and is welded to the housing 12 so as to cover the upper portion of the rotor 43. The body 50 has a discharge port (not shown) and a suction port 51. The body 50 corresponds to a “pump case” described in the claims.
The circuit board 23 sequentially supplies power to the stator coils 35 of the stator 33. Then, the rotor 43 rotates by the magnetic action. When the rotor 43 rotates, the liquid is sucked from the suction port 51. The sucked liquid is pressurized by the rotor 43 and discharged from the discharge port. The sucked liquid also enters the second housing recess 20 of the housing 12. The liquid that has entered the second housing recess 20 is agitated and frequently replaced as the rotor 43 rotates.

2 is a circle including a region formed on the surface side of the substrate body 24 by the projection when the stator coil 35 is projected onto the substrate body 24. The region A shown in FIG. It is an area of shape. The area C shown in FIG. 3 is an area where the area A on the front surface side of the substrate body 24 is transmitted to the back surface side of the substrate body 24 as it is. The stator coil 35 generates heat when energized. When the stator coil 35 generates heat, the heat is conducted through the terminal 37 and the potting material 41 to heat the substrate circuit 23. In the electric pump 10 of the present embodiment, the electronic components 25 and 29 are not mounted in the A region on the front side surface of the substrate body 24. For this reason, it is prevented that the electronic components 25 and 29 become high temperature under the influence of a heat, and a lifetime falls or fails. Even if the electronic components 25 and 29 are not mounted in the C region on the back side surface of the substrate body 24, the electronic components 25 and 29 can be prevented from becoming high temperature.
2 is a region facing the second housing recess 20 of the housing 12 on the surface side of the substrate body 24. The region B shown in FIG. 2 (the donut-shaped region surrounded by two circular dotted lines) is there. A region D shown in FIG. 3 is a region in which the region B on the front side surface of the substrate body 24 is transmitted to the back side of the substrate body 24 as it is. An electronic component 25 that generates a large amount of heat is mounted in a region B on the front side surface of the substrate body 24. The liquid has entered the second housing recess 20. For this reason, the electronic components 25 and 29 mounted in the region B are cooled by the liquid in the second housing recess 20 via the housing 12 and the potting material 41. Therefore, the electronic component 25 having a large calorific value is prevented from becoming high temperature. It is also possible to prevent the electronic component 25 from becoming high temperature by mounting the electronic component 25 that generates a large amount of heat in the D region on the back side surface of the substrate body 24.

(Second Embodiment)
The content overlapping with the first embodiment described above is omitted, and only the characteristic part of the second embodiment will be described (the same applies to the third embodiment described later).
As shown in FIG. 5, three partial arc-shaped slits 60 are provided around the terminal land 27 of the substrate body 24. The electronic components 25 and 29 are mounted in a region outside the slit 60. The potting material 41 filled in the first housing recess 14 is also filled in the slit 60. The thermal conductivity of the potting material 41 is smaller than that of the substrate body 24. Such a magnitude relationship of the thermal conductivity can be realized, for example, by using the potting material 41 as an epoxy or silicon material and the substrate body as a glass epoxy. If the thermal conductivity of the potting material 41 is smaller than that of the substrate body, the heat transmitted from the stator 33 to the substrate body 24 via the terminal 37 is suppressed from spreading to the region where the electronic components 25 and 29 are mounted. The Therefore, the temperature of the electronic components 25 and 29 can be lowered.
The slit 60 may not be filled with the potting material 41. For example, if the slit 60 is masked with a tape and the potting material 41 is filled in that state, the inside of the slit 60 is left as a space. If the inside of the slit 60 is a space, the heat of the stator transmitted to the substrate body 24 via the terminal 37 is further suppressed from spreading to the mounting area of the electronic components 25 and 29.

(Third embodiment)
As shown in FIG. 6, a linear slit 70 is formed in the substrate body 24. The slit 70 is filled with a potting material 41. The thermal conductivity of the potting material 41 is smaller than that of the substrate body 24. A region A shown in FIG. 6 includes a circular shape including a region formed on the surface side of the substrate body 24 by projecting the stator coil 35 onto the substrate body 24, as in the first embodiment. It is an area. The region B is a region facing the second housing recess 20 of the housing 12 as in the first embodiment. An electronic component 71 is mounted on one side (left side in FIG. 6) of the substrate body 24 separated by the slit 70. An electronic component 73 is mounted on the other side of the substrate body 24 separated by the slit 70.
Since the potting material 41 having a lower thermal conductivity than the substrate body 24 is filled in the slit 70, the heat transmitted from the stator 33 to the substrate body 24 through the terminal 37 is difficult to be transmitted to the other side of the substrate body 24. . For this reason, it can suppress that the temperature of the electronic component 73 mounted in the other side of the board | substrate body 24 becomes high. In addition, the electronic component 71 mounted on one side of the substrate body 24 is mounted in an area A that is cooled by the liquid in the second housing recess 20. For this reason, since the slit 70 is filled with the potting material 41 having a lower thermal conductivity than the substrate body 24, heat is not easily transmitted to the other side of the substrate body 24, and the temperature of the electronic component 71 is increased. Can be suppressed. Electronic parts are not mounted in the area A heated by the stator coil 35.

  If the potting material 41 has a characteristic that has a thermal conductivity larger than that of the substrate body 24, the effects of the second embodiment and the third embodiment described above cannot be realized. In this case, it is preferable that a closing member having a lower thermal conductivity than the substrate body 24 is fixed (for example, fixed by welding) in the slit 27 or the slit 70. When the closing member is fixed in the slit 27 or the slit 70, heat transmitted across the slits 27 and 70 can be reduced.

According to the electric pumps of the first to third embodiments, the temperature of the electronic component can be efficiently reduced without providing a water jacket as described in Patent Document 1. Even if the water jacket is provided, the temperature of the electronic component can be lowered, but for that purpose, energy for circulating the liquid in the water jacket is required. When energy is required to circulate the liquid in the water jacket, the motor output must be increased. When the motor output is increased, the amount of heat generated by the motor increases. Moreover, if a water jacket is provided, the shape and weight of the electric pump will increase accordingly.
The present invention can be applied not only to the outer rotor type electric pump described in the embodiment but also to an inner rotor type electric pump.

Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.
In addition, the technical elements described in the present specification or drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

The longitudinal cross-sectional view of the electric pump which concerns on 1st Embodiment. FIG. 3 is a plan view of the front side surface of the circuit board according to the first embodiment (not shown in the stator). The top view of the back side surface of the circuit board which concerns on 1st Embodiment. FIG. 3 is a plan view of the front side surface of the circuit board according to the first embodiment. The top view of the front side surface of the circuit board which concerns on 2nd Embodiment. The top view of the front side surface of the circuit board which concerns on 3rd Embodiment.

Explanation of symbols

10: Electric pump 12: Housing 14: First housing recess 15: Housing protrusion 16: Third housing recess 17: Outer wall 20: Second housing recess 21: Connector 23: Circuit board 24: Board body 25: Electronic component 26: Terminal 27: Terminal land 28: Electrical path 29: Electronic component 30: Chip transistor 31: Chip resistor 33: Stator 34: Stator core 35: Stator coil 36: Slot 37: Terminal 40: Wiring 41: Potting material 43: Rotor 44: Fin 45: Rotor 46: Shaft 47: Bearing member 50: Body 51: Suction port 60: Slit 70: Slit 71: Electronic component 72: Slit material 73: Electronic component

Claims (6)

A substrate,
Electronic components mounted on a substrate;
It has a stator coil that is electrically connected to a terminal provided on the substrate,
An electronic control device, wherein an electronic component is not mounted in a region where the stator coil is projected onto the substrate from infinity on the side opposite to the substrate surface of the stator coil. A substrate,
Electronic components mounted on a substrate;
It has a stator coil that is electrically connected to a terminal provided on the substrate,
The board is formed with slits that divide its mounting surface into a terminal side region and an anti-terminal side region,
An electronic control device characterized in that no electronic component is mounted in the terminal side region.   The slit is in a region where the stator coil is projected onto the substrate from infinity on the side opposite to the substrate surface of the stator coil, and is formed on the outer side of the terminal as viewed from the center of the projection region. The electronic control device according to claim 2, wherein an electronic component is mounted on the outer side of the slit.   4. The electronic control device according to claim 2, wherein the slit is filled with a resin having a thermal conductivity smaller than that of the substrate. A board case,
The electronic control device according to claim 1 accommodated in a substrate case;
A pump case provided adjacent to the substrate case;
A rotor housed rotatably in a pump chamber formed by a substrate case and a pump case;
The rotor has fins and is arranged inside or outside the stator coil,
An electric pump characterized in that an electronic component having a large calorific value is mounted in a region on a substrate facing a rotor housing portion of the pump chamber. A substrate,
Electronic components mounted on a substrate;
A substrate case for housing the substrate and electronic components;
A pump case provided adjacent to the substrate case;
A rotor case rotatably accommodated in a pump chamber formed by the substrate case and the pump case;
The rotor has fins and is arranged inside or outside the stator coil,
The board is formed with slits that divide its mounting surface into a terminal side region and an anti-terminal side region,
The electric pump is characterized in that no electronic components are mounted in the terminal side region of the substrate except for the region facing the rotor accommodating portion of the pump chamber.

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