JP2006071778A - Liquid crystal display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To limit an incidence of leakage resulting from cullet with ITO on a cut face of a liquid crystal display panel which is cut from a mother substrate for multiple formation to a low value as far as possible with a simple method. <P>SOLUTION: In the liquid crystal display panels comprising respective panel substrates with transparent electrodes 2, which have been formed in a multiple formation manner respectively on the mother substrate 1, wherein arrestors A1-A3 containing a pair of electrical discharge electrodes which discharge static electricity charged on the transparent electrodes 2 in the manufacturing process are formed on at least the one mother substrate 1, and which have been individually cut from the mother substrates stuck to each other via a peripheral sealing material along cut lines determining outside shapes of the respective panel substrates, the arrestors A1-A3 are constructed in such a way that at least one of the electrical discharge electrodes are made to have an acuminate protrusion shape, and the one electrical discharge electrode is arranged facing a cut off line CL on the panel substrate 10 side. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a liquid crystal display panel, and more particularly to a technique for preventing leakage due to a cullet with ITO on a cut surface of a liquid crystal display panel cut out from a multi-sided mother substrate.

  First, a general configuration of the liquid crystal display panel will be described with reference to FIG. This liquid crystal display panel is a dot matrix display type, for example, a first panel substrate 10 having a transparent electrode 2 formed along the X-axis direction as a scanning electrode, and a transparent electrode formed along the Y-axis direction as a signal electrode. And a second panel substrate 20 having 5. The first panel substrate 10 and the second panel substrate 20 are pressure-bonded via the peripheral sealing material 6, and a liquid crystal substance such as TN or STN is sealed in the cell. Usually, the panel substrates 10 and 20 are made of a glass material.

  A lead wire 3 for the transparent electrode 2 is formed on the terminal portion 11 of the first panel substrate 10. Although not shown, the second panel substrate 20 also includes a terminal portion extending in a direction orthogonal to the paper surface of FIG. 4, and the lead wiring of the transparent electrode 5 is also formed on the terminal portion. The transparent electrode and its lead wiring are made of, for example, ITO (indium tin oxide). In some cases, the terminal portion is provided only on one panel substrate side. In that case, the lead wiring of the transparent electrode on the other panel substrate side is led out to the terminal portion through a transfer material such as conductive particles contained in the peripheral sealing material.

  Usually, from the viewpoint of productivity, the liquid crystal panel is multi-sided from a mother substrate having a size corresponding to a plurality of panel substrates. That is, after the first panel substrate 10 and the second panel substrate 20 are formed on separate mother substrates until the alignment film forming step, two mother substrates are printed on each panel substrate on one of the mother substrates. A blank cell substrate (a cell substrate into which no liquid crystal is injected) is cut out from the bonded body, and then a liquid crystal display panel as a finished product is manufactured through a liquid crystal injection step and the like. The

  As described above, the liquid crystal display panel is manufactured through a number of manufacturing processes, and static electricity is charged to the transparent electrode during the manufacturing process. In particular, when the alignment film is rubbed at the mother substrate stage, the charge amount to the transparent electrode is the largest, and when it reaches the limit, discharge occurs between adjacent transparent electrodes, and the arc heat at that time causes the transparent electrode and the alignment film to be discharged. May be damaged and cause display defects. In addition, after being cut out from the mother substrate, it is known that a large amount of static electricity is generated in the polarizing film attaching step.

  The invention described in Patent Document 1 discloses a technique for preventing electrostatic breakdown that occurs in the manufacturing process described above. This will be described with reference to FIG. FIG. 5 is a plan view showing a part of the mother substrate 1 on which the first panel substrate 10 is formed in a multifaceted manner, and the other second panel substrate 20 is multifaceted from the same mother substrate.

  According to the invention described in Patent Document 1, when forming the transparent electrode 2 of the first panel substrate 10 in each panel substrate formation region S, the lead wiring 3 is drawn from one end side toward the terminal portion 11 and the transparent electrode The lead wiring 13 is also pulled out from the other end side of 2. At that time, the lead wiring 3 is extended to the adjacent panel substrate forming region S beyond the terminal portion 11, and is opposed to the lead wiring 13 in the region with a minute gap to form an arrester 13a.

  Further, a series of ground patterns 4 for setting the transparent electrodes 2 to the same potential are formed on the discarded substrate portion around the mother substrate 1. At this time, the counter electrode 4a that forms an arrester 3a having a minute gap between the ground pattern 4 and the lead wiring 3 drawn from the right panel substrate forming region S and the left panel substrate forming region S are inserted. Then, a counter electrode 4b for forming an arrester 13a having a minute gap is provided between the lead wiring 13 in the region. The gap between the arresters 3a and 13a is set to be narrower than the gap between the transparent electrodes 2.

  According to this, even if a large amount of static electricity is charged in the transparent electrode 2 during the rubbing treatment, for example, the static electricity is discharged by the arresters 3a and 13a before the space between the transparent electrodes 2. Destruction can be prevented. In addition, by disposing the arrester 3a in the substrate portion and arranging the arrester 13a in the non-display area of the panel, the display is not adversely affected.

JP-A-9-329798

  When the manufacture of the first panel substrate 10 in each panel substrate formation region S is completed, the mother substrate 1 is bonded to a mother substrate on the other side (the second panel substrate 20 side) (not shown), and an empty cell substrate is formed from the bonded body. Cut out. The cutout is performed as follows, for example.

  In FIG. 5, assuming that the horizontal cut-out line is CH and the vertical cut-out line is CL, first, empty cell substrate runs are cut out in units of horizontal rows along the horizontal cut-out line CH, and then empty cell substrate runs from the empty cell substrate run. The substrates are cut out individually along the vertical cut lines CL. Usually, this cutting is performed by, for example, putting a cut groove in a glass substrate with a roll cutter and dividing the cut groove by applying stress to the cut groove from the opposite surface side.

  In this way, the empty cell substrate is cut out, but the following problem occurs when the edge of the terminal portion 11 is cut along the vertical cut line CL. With reference to FIG. 6 showing the cut portion, the lead wire 3 is laid across the edge of the terminal portion 11 to form the arrester 13a with the lead wire 13 of the adjacent panel substrate.

  Therefore, the lead wiring 3 is also cut as the edge of the terminal portion 11 is cut. At this time, the cullet (cullet: glass fine piece) C having ITO as a wiring material from the end of the lead wiring 3 is cut. When the cullet C with ITO is left on the terminal portion 11 and straddles between the adjacent lead wires 3, a leak (short circuit) occurs.

  Most of the cullet C with ITO falls from the terminal portion 11 when the terminal portion is removed by removing the flange portion 21 of the second panel substrate 20 covering the upper portion of the terminal portion 11 shown in FIG. However, since the base portion 21a of the flange portion 21 is left slightly protruding on the peripheral sealing material 6 side when the terminal portion is extended, the cullet C with ITO enters between them and leaks between the adjacent lead wirings 3 There is still something to do. In fact, leakage due to ITO cullet C occurs with a probability of about 0.5%.

  Leakage between the lead wires 3 due to the ITO cullet C appears as a display defect. However, since the size of the glass cullet is usually 0.1 mm or less, it is difficult to find its presence. Therefore, it takes time to determine the cause of the display failure.

  Further, depending on the model, wiring may be performed so as to straddle the panel cut-out line portion with the lead wirings of the panel substrates facing each other. In such a case, when the panel substrate is divided along the cut-out line, the lead wiring between the panel substrates may be leaked by the cullet with ITO.

  Accordingly, an object of the present invention is to suppress a leak occurrence rate due to a cullet with ITO on a cut surface of a liquid crystal display panel cut out from a multi-faced mother substrate as low as possible by a simple method.

  In order to solve the above-mentioned problem, the invention described in claim 1 includes two panel substrates that are bonded together via a peripheral sealing material with the electrode forming surfaces on which the transparent electrodes for display are formed facing each other. Each of the panel substrates is formed in a multifaceted manner on a mother substrate having a size corresponding to a plurality of the panel substrates, and at least one of the mother substrates is charged with the transparent electrode in a manufacturing process. A liquid crystal in which an arrester including a pair of discharge electrodes for discharging static electricity is formed, and each panel substrate is individually cut out from a mother substrate bonded through the peripheral sealing material along a cutting line that defines the outer shape In the display panel, at least one discharge electrode of the arrester has a sharp protrusion shape, and one discharge electrode faces the cut-out line on the panel substrate side. It is characterized by being arranged.

  The invention according to claim 2 includes two panel substrates bonded together via a peripheral sealing material with the electrode forming surfaces on which the transparent electrodes for display are formed facing each other, Each is formed in multiple faces on a mother board having a size corresponding to a plurality of the panel boards, and at least one of the mother boards has lead wires connected to the transparent electrodes on the outer shape of the panel board. In the liquid crystal display panel in which each panel substrate is individually cut out along the cut line from the mother substrate bonded via the peripheral sealing material, the lead wiring of the lead wiring is formed. Of these, the width of the part straddling the cut-out line is narrower than the width of the other part. In this aspect, it is preferable that one end of the lead wiring is connected to a ground pattern formed on a discarded substrate portion of the mother substrate.

  According to the first aspect of the present invention, at least one of the pair of discharge electrodes included in the arrester has a sharp projection shape, and the sharp projection-shaped discharge electrode is disposed on the liquid crystal display panel side, and thus is generated due to the division. The cullet with ITO is from the tip of the sharp protrusion, and does not have a size straddling between the lead wires, so that the leak occurrence rate between the lead wires due to the cullet with ITO can be made as small as possible. .

  According to the second aspect of the present invention, the width of the portion of the lead wiring that crosses the cut-out line in order to let the static electricity charged on the transparent electrode escape to the ground pattern formed on the discard substrate portion of the mother substrate is different. Therefore, the cullet with ITO generated by the division is from the narrow part. Therefore, similarly to the first aspect, since it does not have a size straddling between the lead wires, the leak occurrence rate between the lead wires by the cullet with ITO can be made as small as possible.

  Further, according to the first and second aspects of the present invention, since the cullet with ITO that is generated is smaller than the conventional one, the interval between the lead wires can be made narrower. That is, the wiring density can be increased.

  Next, an embodiment of the present invention will be described with reference to FIGS. 1 to 3, but the present invention is not limited to this. FIG. 1 is a plan view showing a part of a mother substrate used for manufacturing one panel substrate included in the liquid crystal display panel of the present invention. Note that the same reference numerals are used for components that may be the same as those of the conventional example described above. Refer to FIG. 4 for the basic configuration of the liquid crystal display panel.

  A plurality of panel substrate forming regions S are assigned to the mother substrate (material: glass material) 1. In this example, one panel shown in FIG. A substrate 10 is formed. Although only two panel substrate formation regions S are shown in FIG. 1, the panel substrate formation regions S may be allocated in an arbitrary arrangement of m × n.

  When a predetermined number of transparent electrodes 2 are formed in parallel in each panel substrate forming region S, the lead wiring 3 is drawn out from one end side of the transparent electrode 2 toward the terminal portion 11, and the other end side of the transparent electrode 2 Also, the lead wire 13 is pulled out toward the opposite terminal portion 11 side. The lead wirings 3 and 13 are integrally formed with the transparent electrode 2 by an ITO material.

  A ground pattern 40 for each transparent electrode 2 is formed on the discarded substrate portion around the mother substrate 1. The ground pattern 40 may be completed within the mother board 1 or may be connected to a ground circuit outside the mother board 1 via an appropriate connector, a flexible board, or the like.

  In the example of FIG. 1, arresters A <b> 1 to A <b> 3 are provided at three locations in order to discharge static electricity charged on the transparent electrode 2. The arrester A1 is provided between the terminal portion 11 of the left panel substrate 10 and the right panel substrate 10 in FIG. 1, and the arrester A2 is provided between the right panel substrate 10 and the ground pattern 40. The arrester A3 is provided between the left panel substrate 10 and the ground pattern 40. That is, each arrester A1-A3 is arrange | positioned on both sides of the vertical direction cutting line CL.

  The arrester A1 is formed by making the lead wiring 3 and the lead wiring 13 on the terminal portion 11 side face each other with a minute gap narrower than the gap between the transparent electrodes 2, but as shown in FIG. In the present invention, the abutting portions of the lead wiring 3 and the lead wiring 13 are the discharge electrodes 31 and 131 having a sharp protrusion shape (preferably a single sharp protrusion).

  The arrester A2 is formed by making the lead wiring 3 on the terminal portion 11 side and the extraction electrode 41 extracted from the ground pattern 40 face each other with the above-mentioned minute gap. The arrester A3 is formed by making the lead wiring 13 on the opposite terminal portion 11 side and the extraction electrode 42 extracted from the ground pattern 40 face each other with the above-mentioned minute gap.

  With respect to these arresters A2 and A3, as shown in FIG. 2B, the tip portions of the lead wirings 3 and 13 on the panel substrate 10 side may be formed as sharply protruding discharge electrodes 31 and 131. The extraction electrodes 41 and 42 on the ground pattern 40 side may be a simple cut surface parallel to the longitudinal cut line CL, but are preferably pointed projections from the viewpoint of prompt discharge.

  According to this, the cullet C with ITO generated from the lead wirings 3 and 13 when the panel substrate 10 is divided along the vertical cut-out line CL is from the front end portion and is sized to straddle between the lead wirings. Therefore, leakage between the lead wires 3 and 3 and between the lead wires 13 and 13 due to the cullet C with ITO can be prevented. This means that the width between the lead wires can be reduced, that is, the wiring density can be increased.

  FIG. 3 shows only the main part of another example of the present invention. This example is for the case where the ground pattern 40 shown in FIG. 1 is connected to a ground circuit outside the mother substrate 1 via an appropriate connector or flexible substrate, and the static electricity charged on the transparent electrode 2 is removed from the mother substrate. 1 All the parts of the arresters A1 to A3 are electrically connected so as to escape to the ground circuit outside, and the part extending over the vertical cut line CL, that is, between the lead wiring 3 and the lead wiring 13, and the lead wiring 3 and the lead A narrow connection portion 50 is formed between the electrode 41 and between the lead wiring 13 and the extraction electrode 42.

  The width of the connection portion 50 is selected to be at least smaller than the width between the lead wires. However, since the connection portion 50 only releases static electricity, it is sufficiently narrower than the width of the lead wires 3 and 13. Good. Therefore, also in this other example, the cullet C with ITO generated from the lead wirings 3 and 13 is from the narrow connection portion 50. Therefore, as in the example of FIG. The occurrence of leakage between the lead wires 3 and 3 and between the lead wires 13 and 13 can be prevented.

  As described above, the present invention has been described according to the illustrated example. However, the present invention is a liquid crystal display panel of a model that is wired so as to straddle the panel cut-out line portion with the lead wires of each panel substrate facing each other (for example, The present invention is also applicable to the liquid crystal display panel described in Japanese Patent Application No. 2003-187517 related to the applicant's application.

The top view which shows a part of mother board | substrate used for manufacture of one panel board | substrate contained in the liquid crystal display panel of this invention. (A) The enlarged view which shows typically the part of arrester A1 of FIG. 1, (b) The enlarged view which shows typically the part of arrester A2, A3 of FIG. The enlarged view which shows the principal part of another example of this invention. 1 is a schematic cross-sectional view showing a configuration of a general liquid crystal display panel. The top view which shows a part of the motherboard which gave the countermeasure against the conventional static electricity. The schematic diagram which shows the leak state of the lead wiring by the cullet with conventional ITO.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mother board 2 Transparent electrode 3,13 Lead wiring 10 Panel board 11 Terminal part 31,131 Discharge electrode 40 Ground pattern 41,42 Lead electrode 50 Connection part A1-A3 Arrester C Caret with ITO CL Vertical cut line

Claims (3)

Both of the panel substrates include two panel substrates that are bonded together via a peripheral sealing material with the electrode forming surfaces on which transparent electrodes for display are formed facing each other, and each of the panel substrates is equivalent to a plurality of panel substrates. Arrestors including a pair of discharge electrodes for discharging static electricity charged on the transparent electrode in the manufacturing process are formed on each of the mother substrates having a size on multiple sides. In the liquid crystal display panel in which each panel substrate is individually cut out along a cutting line that defines the outer shape from the mother substrate bonded through the peripheral sealing material,
A liquid crystal display panel, wherein at least one discharge electrode of the arrester has a sharp protrusion shape, and one of the discharge electrodes is arranged facing the cut-out line on the panel substrate side. Both of the panel substrates include two panel substrates that are bonded together via a peripheral sealing material with the electrode forming surfaces on which transparent electrodes for display are formed facing each other, and each of the panel substrates is equivalent to a plurality of panel substrates. Each of the mother boards is formed in multiple dimensions on a mother board having a size, and lead wiring connected to the transparent electrode is formed across at least one of the mother boards across a cutting line that defines the outer shape of the panel board. In the liquid crystal display panel in which each panel substrate is individually cut out along the cut line from the mother substrate bonded through the peripheral sealing material,
The liquid crystal display panel according to claim 1, wherein a width of a portion of the lead wiring straddling the cut-out line is narrower than a width of another portion.   The liquid crystal display panel according to claim 2, wherein one end of the lead wiring is connected to a ground pattern formed on a discarded substrate portion of the mother substrate.

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