JP2006066656A - Multiple patterning wiring substrate, electronic component housing package, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple patterning wiring substrate capable of being easily and correctly partitioned along partitioning grooves and reduced in the probability of generating burs, deformation or the like upon partitioning, and to provide a highly reliable electronic component receiving package and an electronic device. <P>SOLUTION: The electronic device comprises a matrix substrate 101 with a plurality of wiring substrate regions 102 formed transversely and laterally at the central part thereof; recesses 103 formed in the wiring substrate regions 102; level differences 104 formed on the bottom surface of the recesses 103 so as to be contacted with the inside surface of the recesses 103 and provided with a conductor layer 109 on the upper surface thereof; marginal regions 105 provided on the outer peripheral part of the matrix substrate 101; dummy recesses 106 formed in the throw-away regions 105; and dummy level difference sections 107 formed on the bottom surface of the dummy recesses 106 so as to be contacted with the inside surface of the wiring substrate region 102 side of the dummy recesses 106. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a multi-piece wiring board in which a plurality of wiring board regions are formed vertically and horizontally, an electronic component storage package, and an electronic device.

  2. Description of the Related Art Conventionally, an electronic component storage package that stores electronic components such as semiconductor elements and piezoelectric elements includes an insulating substrate having a recess in which an electronic component is stored in the center of the upper surface, and a side surface and a lower surface of the insulating substrate from the inside of the recess. And a conductor layer led out. Some electronic component storage packages have a stepped portion formed on the bottom surface of the recess and a conductor layer formed on the top surface of the stepped portion.

  Some electronic component storage packages are formed in the form of a multi-piece wiring board in which a plurality of wiring board regions are formed vertically and horizontally on a mother board (see, for example, Patent Document 1 below). The multi-cavity wiring board has dividing grooves formed on the boundary lines of the wiring board regions of the mother board. The multi-piece wiring board is divided into electronic component storage packages by being divided along the boundary line (dividing groove) of each wiring board region.

  In the electronic component storage package, the electronic component is accommodated in the recess, and the electrode of the electronic component is electrically connected to the conductor layer provided on the step portion on the bottom surface of the recess via a bonding wire or a conductive adhesive. Are connected to each other and the lid is bonded to the upper surface, whereby an electronic device in which the electronic component is hermetically sealed in the recess is obtained.

Note that the multi-cavity wiring board has a disposal margin area formed on the outer peripheral portion of the mother board in order to facilitate handling and form a lead wiring layer for plating. The dividing groove is also formed at the boundary between the disposal margin region and the wiring board region. The dividing groove is formed by cutting the cutter blade to a predetermined depth at the boundary between the wiring substrate regions or at the boundary between the wiring substrate region and the disposal margin region.
JP 2002-324870 A

  However, such a multi-cavity wiring board has a recess in which an electronic component is accommodated in the wiring board region, and thus the wiring board region has lower rigidity than the disposal margin region. Therefore, when the mother board is broken along the dividing groove at the boundary between the wiring board area and the disposal margin area, burrs, cracks, etc. may occur around the recesses in the wiring board area (especially the outermost wiring board area). was there. In particular, with the recent miniaturization of electronic devices, the thickness of the portion (frame portion) surrounding the concave portion of the wiring board region has been reduced, so that the frame portion of the wiring board region (especially the outermost wiring board region) has a variability. The possibility of occurrence of cracks and the like has increased.

  In addition, the following problems may occur in the process of manufacturing a multi-piece wiring board. In other words, when forming the dividing groove in the green sheet as the mother substrate, the cutting edge by the cutter blade is difficult to open on the highly rigid disposal margin side, and the width of the cutting once opened is reduced by the elasticity of the green sheet itself, There has been a problem in that the dividing groove formed between the wiring board region and the abandon margin region is likely to be firmly adhered during firing. In this case, it becomes difficult to divide the mother board along the dividing groove, and there is a possibility that burrs and cracks may occur in the wiring board region, particularly in the outermost periphery. Further, when forming the cuts to be the dividing grooves, there is a possibility that the wiring substrate region having the lower rigidity than the disposal margin region side may be deformed in the outermost wiring substrate region.

  The present invention has been devised in view of such conventional problems, and an object of the present invention is to easily and accurately divide the mother board along the dividing groove. It is an object of the present invention to provide a multi-piece wiring board in which the possibility of occurrence of occurrence is reduced. Another object of the present invention is to provide a highly reliable electronic component storage package and electronic device.

  The multi-cavity wiring board of the present invention includes a mother board in which a plurality of wiring board regions are formed vertically and horizontally in the center, a recess formed in the wiring board region, and a bottom surface of the recess on the inner surface of the recess. A step portion formed in contact with the conductor layer on the upper surface, a margin area provided on the outer periphery of the mother substrate, a dummy recess formed in the margin area, and a bottom surface of the dummy recess And a dummy step portion formed in contact with the inner surface of the dummy recess on the wiring board region side.

  The multi-cavity wiring board of the present invention is preferably characterized in that the dummy recess is formed adjacent to the recess formed on the outermost periphery of the central portion of the mother board. Is.

  Further, in the multi-cavity wiring board of the present invention, preferably, the wiring board region and the recess have a quadrangular shape, and the dummy recess has a quadrangular shape in which the lengths of the inner surfaces adjacent to the adjacent recess are equal. It is characterized by being.

  In the multi-cavity wiring board of the present invention, preferably, the dummy recess has the same depth as the recess.

  In the multi-piece wiring board of the present invention, preferably, the dummy step portion has the same shape and size as the step portion.

  In the multi-cavity wiring board of the present invention, preferably, a plurality of the dummy recesses and the dummy stepped portions are formed in the discard margin region, and the plurality of wirings formed on the outermost periphery of the central portion. The concave portion and the stepped portion of the substrate region and the plurality of dummy concave portions and the plurality of dummy stepped portions are based on a boundary line between the wiring substrate region and the discard margin region formed on the outermost periphery of the central portion. It is characterized by being formed in line symmetry.

  According to another aspect of the invention, there is provided a package for storing electronic components, wherein the multi-piece wiring board according to any one of claims 1 to 6 is divided into pieces by dividing the wiring board area into the wiring board regions. It is what.

  The electronic device of the present invention is housed in the recess of the electronic component housing package according to claim 7, and an electronic component in which an electrode is electrically connected to the conductor layer of the stepped portion, and the electronic component housing. And a lid bonded to the package so as to close the recess.

  The multi-cavity wiring board of the present invention includes a recess formed in the wiring board region, a step formed on the bottom surface of the recess in contact with the inner surface of the recess, a conductor layer provided on the top surface, and a disposal margin region. By providing a dummy recess formed and a dummy stepped portion formed on the bottom surface of the dummy recess in contact with the inner surface of the dummy recess on the side of the wiring board region, the rigidity of the disposal margin region is made to be the rigidity of the wiring substrate region. When dividing the mother board (particularly when dividing the mother board along the dividing groove between the abandon margin area and the outermost peripheral wiring board area adjacent thereto) It is possible to prevent a large impact from being applied to the surface. As a result, it is possible to reduce the possibility of occurrence of burrs, cracks, etc. in the wiring board region (individual packages after division).

  Further, the dummy recess has a dummy stepped portion formed on the bottom surface thereof in contact with the inner surface on the wiring board region side, so that the rigidity of the side wall of the dummy recess in the disposal margin region with respect to the side wall of the recess in the wiring substrate region is increased. It becomes possible to provide a multi-piece wiring board that can be suppressed from becoming extremely low and easy to handle. That is, the dummy recess has a dummy step formed on the bottom surface thereof in contact with the inner surface on the wiring board region side, so that the dummy recess is simply compared with a structure in which only the dummy recess is formed in the disposal margin region. Can provide a multi-piece wiring board that is easy to handle and can reduce the possibility of mechanical damage such as cracks from the dummy recess side to the mother board. It becomes possible to do.

  In addition, a dummy step is formed on the bottom surface of the dummy recess in contact with the inner surface on the wiring board region side, so that a cutter blade is inserted into a ceramic green sheet (hereinafter referred to as a green sheet) as a mother board and divided. When forming the groove, the possibility of large deformation on the discard margin area side is reduced, and the split groove is provided in an open shape with an equal width on the wiring board area side and the discard margin area side, so that the partitionability is improved. An improved multi-cavity wiring board can be provided.

  In addition, when the cutter blade is inserted into the ceramic green sheet that forms the mother board to form the dividing groove, the rigidity is approximated between the abandon margin area side and the wiring board area in the outermost wiring board area. The possibility that the deformation of the green sheet due to the intrusion of the blade is greatly generated in the wiring board region can be reduced, and the possibility that the concave portion of the wiring board region and the frame portion (side wall) surrounding it are deformed can be reduced.

  The multi-cavity wiring board of the present invention is preferably adjacent to the wiring board region because the dummy concave part is formed adjacent to the concave part formed on the outermost periphery of the central part of the mother board. Rigidity can be more approximated with the abandonment allowance area, and the impact when splitting along the split groove is further suppressed, and the adhesion of the split groove is further suppressed, reducing the possibility of burrs and cracks. can do. Further, the mother substrate can be more easily and accurately divided along the dividing groove.

  In addition, since the rigidity is further approximated between the wiring board region and the disposal margin region of the green sheet, when forming a cut that becomes a dividing groove between the wiring substrate region and the disposal margin region, the wiring substrate region side It is possible to reduce the possibility of deformation.

  Further, in the multi-cavity wiring board of the present invention, preferably, the wiring board region and the concave portion are in a quadrangular shape, and the dummy concave portion is in a quadrangular shape in which the lengths of the inner surfaces adjacent to the adjacent concave portion are equal. In addition, the mechanical strength and rigidity can be more approximated between the wiring board region and the adjacent margin allowance region, the impact at the time of dividing along the dividing groove is further suppressed, and the adhesion of the dividing groove is further increased. It is effectively prevented and the possibility of occurrence of burrs and cracks can be reduced. Further, the mother substrate can be divided more easily and accurately along the dividing groove.

  In addition, since the rigidity is further approximated between the wiring board region and the disposal margin region of the green sheet, when forming a cut that becomes a dividing groove between the wiring substrate region and the disposal margin region, the wiring substrate region side It is possible to further reduce the possibility of deformation.

  In the multi-cavity wiring board of the present invention, preferably, the depth of the dummy recess is the same as the depth of the recess, so that the rigidity is more approximated between the wiring board region and the adjacent disposal margin region. It is possible to further suppress the impact at the time of dividing along the dividing groove, further suppress the adhesion of the dividing groove, and further reduce the possibility of occurrence of burrs and cracks. Further, the mother substrate can be more easily and accurately divided along the dividing groove.

  In addition, since the rigidity is further approximated between the wiring board region and the disposal margin region of the green sheet, when forming a cut that becomes a dividing groove between the wiring substrate region and the disposal margin region, the wiring substrate region side It is possible to further reduce the possibility of deformation.

  In the multi-piece wiring board of the present invention, preferably, the dummy step portion has the same shape and dimensions as the step portion, so that the step portion reinforces the frame portion around the recess, and the dummy step portion. The effect of reinforcing the discard margin area around the dummy recess can be made the same level, and the rigidity can be more approximated between the wiring board area and the discard margin area.

  In the multi-cavity wiring board of the present invention, preferably, a plurality of dummy recesses and dummy step portions are formed in the disposal margin region, and the plurality of wiring substrate region recesses formed on the outermost periphery of the central portion and The step portion, the plurality of dummy recesses, and the plurality of dummy step portions are formed symmetrically with respect to the boundary line between the wiring board region formed on the outermost periphery of the center portion and the disposal margin region, thereby providing a step. The area where the part reinforces the frame around the recess and the area where the dummy step part reinforces the abandon margin side area around the dummy recess can be made the same level. The rigidity can be more approximated between.

  In addition, even at the boundary between the wiring board area and the dummy area, when forming the cuts that become the dividing grooves in the green sheet, the cutting can be made equally on both sides of the wiring board area side and the disposal margin area side, Even after firing, it is possible to suppress the adhesion of the dividing groove between the wiring board area and the disposal margin area, and when the mother board is divided between the wiring board area and the disposal margin area, burrs and cracks are formed in the wiring board area. It is possible to reduce the possibility of occurrence.

  In addition, the electronic component storage package of the present invention is separated into pieces by dividing the multi-cavity wiring board according to any one of claims 1 to 6 into wiring board regions. Therefore, the possibility of occurrence of burrs, cracks, etc. in the frame portion surrounding the recess is reduced, and an electronic component storage package with excellent reliability can be provided.

According to another aspect of the present invention, there is provided an electronic device housed in the recess of the electronic component storage package according to claim 7, wherein the electrode is electrically connected to the conductor layer of the step portion, and the electronic component storage package has the recess. With a lid that is joined so as to block the burrs, the possibility of occurrence of burrs, cracks, etc. in the frame surrounding the recesses in which the electronic components are housed is reduced. An apparatus can be provided.

  The multi-piece wiring board of the present invention will be described in detail with reference to FIGS. FIG. 1A is a plan view showing the structure of a multi-cavity wiring board according to the present invention, and FIG. 1B is an XX ′ line of the multi-cavity wiring board shown in FIG. FIG.

  The multi-cavity wiring board of the present invention includes a mother board 101 in which a plurality of wiring board regions 102 are formed vertically and horizontally at a central portion, a recess 103 formed in the wiring substrate region 102, and a stepped portion formed in the recess 103. 104, a disposal margin area 105 provided on the outer peripheral portion of the mother substrate 101, a dummy recess 106 formed in the disposal margin area 105, and a dummy stepped section 107 formed in the dummy recess 106. The step 104 is formed on the bottom surface of the recess 103 in contact with the inner surface of the recess 103. Further, the stepped portion 104 has a conductor layer on the upper surface. The dummy step 107 is formed on the bottom surface of the dummy recess 106 in contact with the inner surface of the dummy recess 106 on the wiring board region 102 side.

  The mother substrate 101 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or glass ceramics. The mother board 101 is formed by laminating a plurality of insulating layers made of a ceramic material. If the mother substrate 101 is made of, for example, an aluminum oxide sintered body, a raw material powder such as aluminum oxide or silicon oxide is formed into a sheet shape together with an organic solvent and a binder to form a plurality of ceramic green sheets (hereinafter referred to as green). The ceramic green sheet is punched and processed into a predetermined shape and size, and is laminated up and down to form a laminate, which is fired at about 1500 to 1600 ° C.

  The concave portion 103 of the wiring board region 102 is formed by punching out the central portion of each wiring board region 102 of the green sheet that becomes the upper layer when stacked, and forming a plurality of openings vertically and horizontally in the central portion of the green sheet. Is formed. The concave portion 103 of the wiring board region 102 is for housing electronic components (not shown) such as a semiconductor element, a piezoelectric element, a capacitive element, and a resistor. For example, the electronic component is hermetically sealed in the recess 103 by closing the recess 103 with a lid (not shown).

  The lid is formed of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy, a ceramic material, a resin material, or the like. For example, the plate material made of iron-nickel-cobalt alloy is subjected to metal processing such as punching or etching and formed into a plate shape that closes the recess 103. The lid is, for example, a frame-shaped portion (frame portion) that surrounds the concave portion 3 of the mother substrate 1 by means such as seam welding or electron beam welding, brazing, or bonding via a bonding material such as resin or glass. It is joined to the upper surface of the substrate so as to close the recess. In this case, a metallized layer 108 may be formed on the upper surface of the frame portion in order to make the joining by welding or brazing easy and strong.

  A stepped portion 104 is formed on the bottom surface of the recess 103 in the wiring board region 102 in contact with the inner surface of the recess 103, and a conductor layer 109 is provided on the top surface of the stepped portion 104. The conductor layer 109 functions as an electrode pad to which an electrode of an electronic component housed in the recess 103 is electrically connected and a part of a conductive path that leads the electrode to the outside of the recess 103.

  Electrodes of electronic components are electrically connected to the conductor layer 109 via conductive connection materials (not shown) such as bonding wires and solder. Then, the conductor layer 109 is led out to the lower surface side through the inside of the mother board 101 (each wiring board region 102), so that the electrodes of the electronic components pass through the mother layer 101 in each wiring board region 102. Derived to the lower surface side of the substrate 101.

  The conductor layer 109 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, or gold. For example, if the conductor layer 109 is made of tungsten, the tungsten paste becomes the step portion 11 of the ceramic green sheet. It can be formed by printing on the upper surface of the part and baking it integrally.

  In addition, it is preferable that the conductor layer 109 has a plating layer (not shown) made of nickel, gold, or the like on the exposed surface. As a result, the oxidation of the conductor layer 109 can be effectively prevented, the bonding wire connectivity to the conductor layer 109 and the solder wettability can be improved, and the reliability of electrical connection is improved. be able to. In such a plating layer, a plating conduction pattern is formed on the outer peripheral portion of the mother substrate 101, the plating conduction pattern is held by a plating jig, and the plating conduction is performed from a terminal of the jig in a plating solution. It is formed by supplying a current to the conductor layer 109 via a pattern.

  Note that the metallized layer 108 can be formed using the same material as that of the conductor layer 109 by the same means. Further, the metallized layer 108 may have a plating layer deposited on the surface thereof.

  In the mother board 101, a dividing groove 110 is formed at the boundary between the wiring board regions 102. By dividing the mother board 101 by applying stress along the dividing grooves 110, the wiring board areas 102 are divided. In the multi-cavity wiring board shown in FIG. 1, the division grooves 110 are formed on the upper and lower surfaces of the mother board 101 so as to be at the same position in plan view. In this case, it is possible to suppress the possibility that a crack progresses from the tip (bottom) of one of the upper and lower divided grooves 110 of the mother substrate 101 toward the tip of the opposing divided groove 110, and burrs and chips are generated in each wiring board region 102. Can be divided. Note that the productivity may be improved by forming the dividing grooves 110 only on either the upper surface or the lower surface of the mother substrate 101 in accordance with the thickness of the mother substrate 101 or the like. When the dividing groove 110 is formed only on either the upper surface or the lower surface of the mother substrate 101, the bending stress for dividing the mother substrate 101 is applied in the direction in which the dividing groove 110 opens.

  The dividing grooves 110 are formed on the upper and lower surfaces of the green sheet laminate to be the mother substrate 101 by a method such as pressing a cutter blade or a die to make a cut. Further, the depth of the dividing groove 110 is set to about 20 to 70% with respect to the thickness of the green sheet serving as the mother substrate 101 in order to suppress cracks, burrs, and chips during the division. It is good.

  Further, such a dividing groove 110 is formed so as to exceed the dummy recess 106 in the disposal margin region 105 (both ends of the dividing groove 110 are located on the outer peripheral side of the mother substrate 101 with respect to the dummy recess 106). Is preferred. This is to reduce the possibility of burrs and chips occurring on the outer periphery of the dummy recess 106. This is because if the end of the dividing groove 110 is adjacent to the dummy recess 106, a crack may occur from the end of the dummy recess 106.

  In order to prevent the mother substrate 101 from being broken at a site along the dividing groove 110 during handling such as transportation or mounting of electronic components, the depth of the dividing substrate 110 is set to a depth of the mother substrate 101. The thickness is preferably less than half of the thickness. Further, it is preferable that a through hole 111 is formed at the intersection of the dividing grooves 110.

  The discard margin area 105 is for facilitating handling of the multi-piece wiring board. Further, as described above, when supplying a current for plating to each wiring board region 102, it also functions as a space for routing a conductive path (not shown).

  The multi-piece wiring board of the present invention includes a recess 103 formed in the wiring board region 102, a step 104 formed on the bottom surface of the recess 103 in contact with the inner surface of the recess 103, and provided with a conductor layer on the upper surface. By providing the dummy recess 106 formed in the disposal margin region 105 and the dummy stepped portion 107 formed on the bottom surface of the dummy recess 106 in contact with the inner surface of the dummy recess 106 on the wiring board region 102 side, The rigidity of the discard margin area 105 can be approximated to the rigidity of the wiring board area 102. When the mother board 101 is divided (particularly, the division between the discard margin area 105 and the outermost peripheral wiring board area 102 adjacent thereto). It is possible to prevent a large impact from being applied to the wiring board region 102 side (when dividing the mother board 101 along the groove 110). As a result, it is possible to reduce the possibility of occurrence of burrs, cracks, and the like in the wiring board region 102 (individual wiring boards (packages) after division).

  The dummy recess 105 has a dummy stepped portion 107 formed on the bottom surface thereof in contact with the inner surface on the wiring substrate region 102 side. The rigidity of the side wall of the recess 106 can be prevented from becoming extremely low, and a multi-piece wiring board that can be easily handled can be provided. That is, the dummy recess 106 has a structure in which only the dummy recess 106 is formed in the disposal margin region 105 by forming the dummy stepped portion 107 in contact with the inner surface on the wiring board region 102 side on the bottom surface. In comparison, the rigidity of the side wall of the dummy recess 106 can be suppressed from becoming extremely low, and the possibility of mechanical damage such as a crack in the mother board 101 from the dummy recess 106 side to the wiring board region 102 can be reduced. It is possible to provide a multi-piece wiring board that can be handled easily.

  In addition, since the dummy stepped portion 107 is formed on the bottom surface of the dummy recess 106 in contact with the inner surface on the wiring substrate region 102 side, a cutter blade is inserted into the green sheet serving as the mother substrate 101 to form the dividing groove 110. In this case, the possibility that a large deformation is generated on the side of the discard margin area 105 is reduced, and the dividing groove 110 is provided in an open shape with a uniform width on the wiring board area 102 side and the discard margin area 105 side. Thus, it is possible to provide a multi-piece wiring board with improved resistance.

  Further, when forming the dividing groove 110 by inserting a cutter blade into the green sheet to be the mother board 101, the rigidity approximates between the disposal margin area 105 side and the wiring board area 102 side in the outermost wiring board area 102. Therefore, the possibility that the deformation of the green sheet due to the intrusion of the cutter blade is greatly generated in the wiring board region 102 can be reduced, and the recess 103 of the wiring board region 102 and the frame portion (side wall) surrounding it can be deformed. Can be reduced.

  Further, in the multi-piece wiring board of the present invention, the dummy recess 106 is preferably formed so as to be adjacent to the recess 103 formed at the outermost periphery of the central portion of the mother substrate 101. In the multi-piece wiring board of the present invention, the rigidity can be more approximated between the wiring board region 102 and the adjacent margin allowance region 105. And the impact at the time of the division | segmentation along the division | segmentation groove | channel 110 can be suppressed more, the possibility that the division | segmentation groove | channel 110 adheres can further be reduced, and the possibility that a burr | flash and a crack will generate | occur | produce can be further reduced. Become. Further, the mother substrate 101 can be more easily and accurately divided along the dividing groove 110.

  In addition, since the rigidity is further approximated between the wiring board region 102 and the disposal margin region 105 in the green sheet, when the notch that forms the dividing groove 110 is formed between the wiring substrate region 102 and the disposal margin region 105. In addition, it is possible to reduce the possibility of excessive deformation on the wiring board region 102 side.

  Further, in the multi-cavity wiring board of the present invention, the wiring board region 102 and the recess 103 are in a quadrangular shape, and the dummy recess 106 is in a quadrangular shape in which the lengths of the inner surfaces adjacent to the adjacent recess 103 are equal. Is preferred. With such a configuration, the multi-cavity wiring board according to the present invention can more closely approximate the mechanical strength and rigidity between the wiring board region 102 and the adjacent margin allowance region 105, along the dividing groove 110. Further, the impact at the time of splitting is further suppressed, and adhesion of the split grooves 110 is further suppressed, and the possibility of occurrence of burrs and cracks can be reduced. Further, the mother substrate 101 can be more easily and accurately divided along the dividing groove 110.

  Further, since the rigidity is further approximated between the wiring board region 102 and the disposal margin region 105 in the green sheet, when forming a cut that becomes the dividing groove 110 between the wiring substrate region 102 and the disposal margin region 105. The possibility of excessive deformation on the wiring board region 102 side can be further reduced.

  In addition, since the wiring board region 102 has a large area in the green sheet and the recess 103 is formed, the wiring substrate region 102 tends to be affected by heat during firing and tends to have a high shrinkage rate. In the multi-cavity wiring board of the present invention, the dummy recess 106 is formed in a quadrangular shape in which the lengths of the adjacent recesses 103 and the adjacent inner side surfaces are equal to each other. And deformation due to the difference in shrinkage during firing.

  Further, when the dummy recesses 106 are formed in a quadrangular shape in which the lengths of the adjacent recesses 103 and the adjacent inner side surfaces are equal, the lengths of the inner side surfaces of the recesses 103 are made uniform in all one row of the wiring board region 102. As a result, the rigidity of the mother board 101 can be made uniform by making the distance between the concave portion 103 and the dividing groove 110 and the distance between the dummy concave portion 106 and the dividing groove 110 equal in one row of the wiring board regions 102. Therefore, when a bending stress is applied to the mother substrate 101 along the dividing groove 110, it is possible to reduce the possibility of cracks occurring between some of the recesses 103 and the dummy recesses 106 and the dividing grooves 110. The mother board 101 can be more reliably divided along the dividing groove 110.

  In addition, the die and the like can be aligned at the same time on the concave portion 103 side and the dummy concave portion 106 side when the opening portion to be the concave portion 103 and the dummy concave portion 106 is punched and formed in the ceramic green sheet, thereby improving productivity. You can also

  Further, in the multi-piece wiring board of the present invention, it is preferable that the depth of the dummy recess 102106 is the same as the depth of the recess 103. With such a configuration, the multi-cavity wiring board of the present invention can more closely approximate the rigidity between the wiring board region 102 and the adjacent disposal margin region 105, and the impact at the time of division along the dividing groove 110 can be made. Is further reduced, the adhesion of the dividing grooves 110 is further suppressed, and the possibility of occurrence of burrs and cracks can be further reduced. Further, the mother substrate 101 can be more easily and accurately divided along the dividing groove 110.

  Further, since the rigidity is further approximated between the wiring board region 102 and the disposal margin region 105 in the green sheet, when forming a cut that becomes the dividing groove 110 between the wiring substrate region 102 and the disposal margin region 105. The possibility of deformation on the wiring board region 102 side can be reduced.

  In order to make the depths of the recess 103 and the dummy recess 106 the same, it is only necessary to form the opening serving as the recess 103 and the opening serving as the dummy recess 106 only in the same green sheet. In this case, compared with the case where one of the depths is increased, the number of punching processes using a mold or the like can be reduced, and the productivity as a multi-piece wiring board can be improved.

  Further, in the multi-piece wiring board of the present invention, as shown in FIGS. 2A and 2B, the dummy step portion 207 preferably has the same shape and dimensions as the step portion 104. FIG. 2A is a plan view showing the structure of another example of the multi-cavity wiring board of the present invention, and FIG. 2B is an X of the multi-cavity wiring board shown in FIG. It is sectional drawing in the -X 'line. In the multi-cavity wiring board shown in FIG. 2, the same components as those of the multi-cavity wiring board shown in FIG. The multi-piece wiring board according to the present invention has such a structure that the step 104 reinforces the frame (side wall) around the recess 103, and the dummy step 207 is disposed around the dummy recess 106. The effect of reinforcing the marginal area 105) can be made to the same extent, and the rigidity can be more approximated between the wiring board area 102 and the disposal marginal area 105.

  Further, in the multi-cavity wiring board of the present invention, a plurality of dummy recesses 106 and dummy stepped portions 207 are formed in the disposal margin region 105, and the recesses of the plurality of wiring substrate regions 102 formed on the outermost periphery of the central portion. 103 and the step 104, the plurality of dummy recesses 106, and the plurality of dummy steps 202 are formed symmetrically with respect to the boundary line between the wiring board region 102 and the disposal margin region 105 formed on the outermost periphery of the central portion. It is preferable that With this configuration, the multi-cavity wiring board according to the present invention has a region in which the step 104 reinforces the frame around the recess 103 and a dummy step 207 in the disposal margin side region 105 around the dummy recess 106. The regions to be reinforced can be aligned to the same extent, and the rigidity can be more approximated between the wiring board region 102 and the disposal margin region 105.

  In addition, when the cuts that become the dividing grooves 110 are formed in the green sheet at the boundary line between the wiring board region 102 and the discard margin region 105, the cuts are equally opened on both sides of the wiring substrate region 102 and the discard margin region 105. Therefore, even after firing, it is possible to suppress the adhesion of the dividing groove 110 between the wiring board region 102 and the disposal margin region 105, and when dividing the mother substrate 101 at the boundary between the wiring substrate region 102 and the disposal margin region 105. In addition, the possibility of occurrence of burrs and cracks in the wiring board region 102 can be further reduced.

  It should be noted that the present invention is not limited to the examples of the above-described embodiments, and changes and modifications can be made without departing from the scope of the present invention. For example, in the multi-cavity wiring board shown in FIGS. 1 and 2, the dummy recess 106 and the dummy step 107 (or the dummy step 207) are formed only on the upper surface of the mother board 101. A recess may be formed, and a dummy recess 106 and a dummy step 107 (or a dummy step 207) may be formed on both upper and lower surfaces.

  In addition, the electronic component storage package of the present invention is obtained by dividing the multi-piece wiring board shown in FIG. 1 or FIG. With such a configuration, the electronic component storage package of the present invention reduces the possibility of occurrence of burrs, cracks, and the like in the frame portion surrounding the recess 103, and provides an electronic component storage package with excellent reliability. can do.

  Further, the electronic device of the present invention is housed in the recess 103 of the electronic component storage package, the electronic component having the electrode electrically connected to the conductor layer 109 of the stepped portion 104, and the recess 103 in the electronic component storage package. And a lid joined so as to close the cover. With such a configuration, the electronic device according to the present invention reduces the possibility of occurrence of burrs, cracks, and the like in the frame portion surrounding the recess 103 in which the electronic component is accommodated, and provides an electronic device with excellent reliability. can do. The electronic component may be mounted in the recess 103 in a state of a multi-piece wiring board, or may be mounted in the concave portion 103 of the electronic component storage package after the multi-piece wiring board is divided.

(A) is a top view which shows the structure of the multi-cavity wiring board of this invention, (b) is sectional drawing in the X-X 'line | wire of the multi-cavity wiring board shown to (a). (A) is a top view which shows the structure of the other example of the multi-cavity wiring board of this invention, (b) is the cross section in the XX 'line | wire of the multi-cavity wiring board shown to (a). FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 ... Mother board | substrate 102 ... Wiring board area | region 103 ... Concave part 104 ... Step part 105 ... Discard allowance area | region 106 ... Dummy recessed part 107 ... Dummy step part 108 ... Metallization layer 109 ... conductor layer 110 ... divided groove 111 ... through hole

Claims (8)

A mother board in which a plurality of wiring board regions are formed vertically and horizontally in the center, a recess formed in the wiring board area, a bottom surface of the recess is formed in contact with an inner surface of the recess, and a conductor layer is formed on the upper surface. A stepped portion provided, a discarding region provided in an outer peripheral portion of the mother substrate, a dummy recess formed in the discarding region, and a bottom surface of the dummy recess on the wiring substrate region side of the dummy recess. A multi-cavity wiring board comprising a dummy step portion formed in contact with an inner surface. 2. The multi-cavity wiring board according to claim 1, wherein the dummy recess is formed adjacent to the recess formed on the outermost periphery of the central portion of the mother board. 3. The multi-piece manufacturing method according to claim 2, wherein the wiring board region and the recess have a quadrangular shape, and the dummy recess has a quadrangular shape in which adjacent inner surfaces are equal in length to each other. Wiring board. 4. The multi-cavity wiring board according to claim 1, wherein the dummy recess has the same depth as the recess. 5. The multi-piece wiring board according to claim 1, wherein the dummy step portion has the same shape and dimensions as the step portion. A plurality of the dummy recesses and the dummy stepped portions are formed in the discard margin region, and the recesses and the stepped portions of the plurality of wiring board regions formed on the outermost periphery of the central portion and the plurality of dummy recesses The plurality of dummy stepped portions are formed symmetrically with respect to a boundary line between the wiring board region formed on the outermost periphery of the central portion and the discard margin region. The multi-piece wiring board according to any one of claims 1 to 5. 7. A package for storing electronic parts, wherein the multi-piece wiring board according to claim 1 is separated into pieces by dividing the wiring board area into the wiring board regions. An electronic component housed in the recess of the electronic component storage package according to claim 7, wherein an electrode is electrically connected to the conductor layer of the stepped portion, and the recess is closed by the electronic component storage package. An electronic device comprising: a joined lid.

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