JP2006065376A - Rfid media manufacturing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily mount an inlet at a minute position on a base material even when manufacturing RFID media by mounting the inlet on the base material in a matrix shape. <P>SOLUTION: When the inlet 110 is mounted on a sheet base material 30b mounted on a stage 6, movement control of the stage 6 is carried out in the X-Y direction of the inlet loading position by an inlet loading machine 5 by control of a movement control section 8. Thereby, the inlet 110 conveyed by the inlet loading machine 5 is mounted on the sheet base material 30b mounted on the stage 6. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an RF-ID media manufacturing apparatus that manufactures an RF-ID media capable of writing and / or reading information in a non-contact state, and in particular, can write and / or read information in a non-contact state. The present invention relates to an RF-ID media manufacturing apparatus that mounts inlets on which various IC chips are mounted in a matrix on a substrate, and then cuts the substrate on which the inlets are mounted into a single piece for each RF-ID media.

  In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. In addition, information is recorded on tags and labels attached to products and the like, and management of products and the like using these labels is also performed.

  In such information management using a card, tag, or label, a non-contact type IC equipped with an IC chip capable of writing and reading information in a non-contact state with respect to the card, tag, or label Cards, non-contact type IC tags, and non-contact type IC labels are rapidly spreading due to their excellent convenience.

  5A and 5B are diagrams showing the structure of a general non-contact type IC tag. FIG. 5A is a diagram showing the internal structure, and FIG. 5B is a cross-sectional view taken along the line AA ′ shown in FIG. .

  As shown in FIG. 5, the non-contact type IC tag in this conventional example includes an IC chip 611 capable of writing and reading information from the outside on a resin sheet 615, and an IC chip via a contact 614. A current is supplied to the IC chip 611 by electromagnetic induction from an information writing / reading device (not shown) provided outside and connected to the H.611, and information is written to and read from the IC chip 611 in a non-contact state. An inlet 610 in which a conductive antenna 612 is formed protects the IC chip 611 and the antenna 612 via the adhesive layers 640a and 640b, and two surface sheets 630a that can print information on the surface. The layers are stacked so as to be sandwiched by 630b.

  In the non-contact type IC tag 600 configured as described above, the IC chip 611 is connected from the antenna 612 to the IC chip 611 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Thus, information is written to the IC chip 611 from the information writing / reading device or information written to the IC chip 611 is read by the information writing / reading device in a non-contact state. Or

  In the non-contact type IC tag 600 as described above, for example, after the inlet 610 is mounted on the surface sheet 630b on which the adhesive layer 640b is laminated, the surface sheet 630a on which the adhesive layer 640a is laminated is the inlet. It is laminated and manufactured so as to cover 610.

Here, in recent years, an IC data transmitter / receiver in which an IC chip is mounted on a substrate on which a circuit is formed is mounted in a matrix on the substrate, and then the IC chip is mounted. A technique for manufacturing a base material for each IC data transmitter / receiver and thereby improving the mounting efficiency of the IC chip has been considered (for example, see Patent Document 1). Similarly to this technology, when manufacturing an RF-ID by mounting an inlet on a base material such as a surface sheet, the inlet is mounted in a matrix on the base material, and then the base material on which the inlet is mounted is mounted. Cutting is performed for each RF-ID medium, thereby efficiently manufacturing a plurality of RF-ID media.
JP 2001-127416 A

  However, as described above, when an RF-ID medium is manufactured by mounting inlets in a matrix on a base material, it is difficult to precisely define the mounting position of the inlet on the base material. There is a problem that it is difficult to handle the inlet when the inlet is mounted on the top.

  The present invention has been made in view of the problems of the conventional techniques as described above, and even when an RF-ID medium is manufactured by mounting inlets in a matrix on a substrate, the substrate is An object of the present invention is to provide an RF-ID media manufacturing apparatus capable of easily mounting an inlet at a fine position above.

In order to achieve the above object, the present invention provides:
An RF-ID media manufacturing apparatus for manufacturing an RF-ID media in which an inlet having an IC chip capable of writing and / or reading information in a non-contact state is mounted on a substrate,
Supply means for supplying the inlet;
A stage on which a sheet base material that becomes the base material by being cut is mounted;
Inlet mounting means for transporting and mounting the inlet supplied from the supply means on a sheet substrate mounted on the stage;
Movement control means for controlling the movement of the stage in the XY direction with respect to the inlet mounting position by the inlet mounting means so that the inlet mounting position on the sheet base material mounted on the stage is in a matrix shape; ,
First cutting means for cutting the sheet substrate on which the inlet is mounted by the inlet mounting means for each RF-ID medium.

The supply means supplies the inlet continuously,
An adhesive layer applying means for applying an adhesive layer to one surface of the continuous inlet supplied from the supply means;
A continuous inlet supplied from the supply means and provided with the pressure-sensitive adhesive layer by the pressure-sensitive adhesive layer applying means is formed into a single piece by irradiating a laser beam from the surface side provided with the pressure-sensitive adhesive layer. A second cutting means for cutting,
The inlet mounting means adsorbs and conveys the inlet cut into a single piece by the second cutting means with the surface to which the pressure-sensitive adhesive layer is not applied being adsorbed, and the pressure-sensitive adhesive layer is It mounts on the said sheet | seat base material so that the provided surface may become a mounting surface.

  In the present invention configured as described above, the inlet supplied from the supply unit is transported and mounted on the sheet base material mounted on the stage by the inlet mounting unit. At this time, the stage is controlled to move in the XY direction with respect to the inlet mounting position by the inlet mounting means by the movement control means, so that the inlet conveyed by the inlet mounting means is the sheet mounted on the stage. Mounted in a matrix on the substrate. Thereafter, in the first cutting means, the sheet base material on which the inlet is mounted is cut for each RF-ID medium.

  Thus, when the inlet is mounted on the sheet substrate mounted on the stage, the stage is controlled to move in the XY direction with respect to the inlet mounting position by the inlet mounting means by the control of the movement control means. When the inlet transported by the inlet mounting means is mounted in a matrix on the sheet substrate mounted on the stage, the RF-ID media is manufactured by mounting the inlet in a matrix on the substrate. In this case, the inlet is easily mounted at a fine position on the substrate.

  As described above, in the present invention, when the inlet is mounted on the sheet base material mounted on the stage, the stage is placed in the XY direction with respect to the inlet mounting position by the inlet mounting means under the control of the movement control means. Since the inlet is transported and controlled so that the inlet transported by the inlet mounting means is mounted in a matrix on the sheet substrate mounted on the stage, the inlet is mounted in a matrix on the substrate. Even in the case of manufacturing RF-ID media, the inlet can be easily mounted at a fine position on the substrate.

  Also, the inlet is supplied continuously from the supply means, and an adhesive layer applying means for applying an adhesive layer to one surface of the continuous inlet supplied from the supply means, and an adhesive layer supplied from the supply means A second cutting means for cutting the continuous inlet provided with the pressure-sensitive adhesive layer by the applying means into a single piece by irradiating a laser beam from the surface side provided with the pressure-sensitive adhesive layer; In the inlet mounting means, the inlet cut into a single piece by the second cutting means is transported by adsorbing the surface to which the adhesive layer is not applied as the surface to be adsorbed, and the surface having the adhesive layer applied thereto. In the case of mounting on the sheet base material so that the surface becomes the mounting surface, the inlet is directly mounted on the sheet base material after the inlet is transported on the sheet base material, so that the inlet pressure-sensitive adhesive layer can Can be bonded to the sheet base material, and for this purpose, the inlet mounting means adsorbs the surface on which the pressure-sensitive adhesive layer of the inlet is not formed as the adsorbed surface, but the second cutting means has an adhesive. The inlet can be cut without the layers sticking together and the inlet lifting up. Moreover, an adhesive layer can be easily provided to an inlet by supplying an inlet continuously.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a diagram showing an embodiment of an RF-ID media manufacturing apparatus of the present invention, and shows an example of an apparatus for manufacturing a non-contact type IC tag.

  In this embodiment, as shown in FIG. 1, a roller 1 a that is a supply unit wound with an inlet 110 as a continuous inlet sheet, and an adhesive layer 140 b are laminated on one surface of a continuous release paper 121. A roller 1b around which a double-sided tape is wound, rollers 1c and 1d for pulling out an inlet sheet wound around the roller 1a and a double-sided tape wound around the roller 1b by rotating in opposite directions opposite to each other, and a roller A roller 1e which is an adhesive layer applying means for applying an adhesive layer 140b to one surface of the inlet sheet by applying a double-sided tape drawn from 1b to one surface of the inlet sheet pulled from the roller 1a; Of the double-sided tape affixed to the inlet sheet by the roller 1e, only the release paper 121 is The roller 1f that peels the release paper 121 from the inlet sheet and the pressure-sensitive adhesive layer 140b, and the release paper 121 peeled from the inlet sheet and the pressure-sensitive adhesive layer 140b by the roller 1f. 1g, and the inlet sheet from which the release paper 121 has been peeled off by the roller 1f and the adhesive layer 140b are irradiated with laser light 2a from the adhesive layer 140b side, whereby a continuous inlet sheet The laser light source 2 which is a second cutting means for cutting the pressure-sensitive adhesive layer 140b into a single piece and producing the single-piece inlet 110 provided with the pressure-sensitive adhesive layer 140b, and a laser irradiated from the laser light source 2 Writing and reading information to and from the inlet 110 cut into a single piece by the light 2a The reader / writer 3 for inspecting the operation state of the inlet 110, the roller 1h for collecting the inlet 110 determined to be defective by the reader / writer 3, and the non-contact type IC tag by cutting. The stage 6 on which the sheet substrate 30b to be one of the top sheets is mounted, the inlet 110 and the adhesive layer 140b from which the release paper 121 has been peeled off by the roller 1f, and the laser beam 2a to the inlet 110 and the adhesive layer 140b. A region where the surface on the inlet 110 side is adsorbed from the irradiated region and the operation state is inspected by the reader / writer 3, and a region where the inlet 110 is mounted on the sheet substrate 30b mounted on the stage 6 In addition, the inlet mounting machine 5 that sequentially conveys the inlet 110 to the area for the collection by the roller 1h, and the inlet The sheet substrate 30b on which the sheet substrate 30a, which is the other surface sheet of the non-contact type IC tag is mounted by the let 110 being mounted and further cut, is formed into the shape of the surface sheet for each non-contact type IC tag. A cutting section 4 that is a first cutting means for cutting, and a conveyor 7 that conveys the topsheets 130a and 130b and the adhesive layer 140a cut into the shape of the topsheet of the non-contact type IC tag by the cutting section 4; A movement control unit that controls the movement of the stage 6 in the XY direction with respect to the mounting position of the inlet 110 by the inlet mounting machine 5 so that the mounting position of the inlet 110 on the sheet base material 30b mounted on the stage 6 is a matrix. 8. In addition, the inlet mounting machine 5 is configured to be able to mount the inlet 110 and the adhesive layer 140b drawn from the roller 1a. The suction unit 5a that adsorbs the mounted inlet 110 and the adhesive layer 140b, and the adsorption unit 5a And an arm 5b for mounting the adsorbed inlet 110 and the pressure-sensitive adhesive layer 140b on the sheet base material 30b. By rotating these, the inlet 110 and the pressure-sensitive adhesive layer 140b are moved to the inlet 110 and From the region where the adhesive layer 140b is irradiated with the laser light 2a, the region where the operation state is inspected by the reader / writer 3, the region where the inlet 110 is mounted on the sheet base material 30b mounted on the stage 6, At the same time, the rollers 110 sequentially convey the inlet 110 to an area where the inlet 110 is collected. Moreover, the surface where the inlet 110 and the adhesive layer 140b of the adsorption | suction part 5a are adsorb | sucked is comprised from the nonelectroconductive material. It is also conceivable to use a V-shaped sheet metal or the like instead of the rollers 1e and 1f. It is also conceivable to use a collection means such as a collection box instead of the roller 1h.

  Below, the manufacturing method of the non-contact-type IC tag in the RF-ID media manufacturing apparatus comprised as mentioned above is demonstrated.

  2A and 2B are diagrams showing the structure of a non-contact type IC tag manufactured by the RF-ID media manufacturing apparatus shown in FIG. 1, wherein FIG. 2A shows the internal structure, and FIG. 2B shows the structure of FIG. It is sectional drawing in the AA 'part shown in FIG.

  As shown in FIG. 2, the non-contact type IC tag manufactured in this embodiment has an IC chip 111 capable of writing and reading information from the outside on a resin sheet 115 and via a contact 114. The IC chip 111 is connected to the IC chip 111, current is supplied to the IC chip 111 by electromagnetic induction from an information writing / reading device (not shown) provided outside, and information is written to and read from the IC chip 111 in a non-contact state. Inlet 110 in which conductive antenna 112 is formed and adhesive layer 140b laminated on the surface of resin sheet 115 opposite to the surface on which IC chip 111 is mounted is an adhesive layer. 140a is laminated to protect the IC chip 111 and the antenna 112, and the surface sheet 130a on which information is printed, and the surface sheet It is configured to be sandwiched and 30b.

  In the non-contact type IC tag 100 configured as described above, the IC chip 111 is connected from the antenna 112 to the IC chip 111 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Thus, information is written from the information writing / reading device to the IC chip 111 in a non-contact state, and information written in the IC chip 111 is read by the information writing / reading device. Or Note that the IC chip 111 is not limited to one that can write and read information in a non-contact state, and may be one that can only write and read information.

  The operation when the non-contact type IC tag 100 shown in FIG. 2 is manufactured by the RF-ID media manufacturing apparatus shown in FIG. 1 will be described below.

  First, the sheet base material 30b to be the top sheet 130b is mounted on the stage 6 by being cut, and is conveyed to a region where the inlet 110 is mounted on the sheet base material 30b.

  When the inlet sheet wound around the roller 1a and the double-sided tape wound around the roller 1b are pulled out by the rotation of the rollers 1c and 1d, first, one of the inlet sheets pulled out from the roller 1a by the roller 1e. The double-sided tape drawn from the roller 1b is affixed to the surface, and then peeled off from the inlet sheet and the adhesive layer 140b of the double-sided tape and the release paper 121 by the roller 1f. Here, the inlet sheet and the adhesive layer 140b out of the inlet sheet and the double-sided tape drawn out from the roller 1a are pulled in a predetermined direction by the rotation of the rollers 1c and 1d. 121 is pulled in the direction of being wound around the roller 1g, whereby the inlet sheet and the adhesive layer 140b of the double-sided tape and the release paper 121 are separated from the inlet sheet and adhesive layer 140b and the release paper 121 by the roller 1f. Then, the inlet sheet and the pressure-sensitive adhesive layer 140b are conveyed to the region irradiated with the laser light 2a by the laser light source 2, and the release paper 121 is wound around the roller 1g. Thereby, the adhesive layer 140b is provided to one surface of the inlet sheet pulled out from the roller 1a.

  The inlet sheet and the adhesive layer 140b from which the release paper 121 has been peeled off by the roller 1f are conveyed to a region irradiated with the laser light 2a by the rotation of the rollers 1c and 1d. In this region, the inlet 110 is continuous and the single sheet-like inlet 110 and the adhesive layer 140b included in one non-contact type IC tag 100 of the inlet sheet and the adhesive layer 140b are arranged on the inlet 110 side. Is mounted on the suction portion 5a of the inlet mounting machine 5 as a mounted surface.

  Of the inlet sheet and the adhesive layer 140b drawn from the roller 1a, the single-piece inlet 110 and the adhesive layer 140b included in one non-contact type IC tag 100 are mounted on the suction portion 5a, and then the inlet. The sheet and the pressure-sensitive adhesive layer 140b are adsorbed by the adsorbing portion 5a from the inlet 110 side. In this state, the laser light 2a is irradiated from the laser light source 2 to the inlet sheet and the pressure-sensitive adhesive layer 140b, and the single-piece inlet 110 is irradiated. And the adhesive layer 140b is cut. Here, since the inlet 110 and the pressure-sensitive adhesive layer 140b mounted on the suction portion 5a are mounted on the suction portion 5a with the inlet 110 side as a mounted surface, the inlet 110 and the pressure-sensitive adhesive layer 140b are separated from the pressure-sensitive adhesive layer 140b side. It will be cut. Therefore, when the inlet 110 and the pressure-sensitive adhesive layer 140b are cut using a blade such as a cutter, the pressure-sensitive adhesive layer 140b sticks to the blade such as a cutter, and the inlet 110 and the pressure-sensitive adhesive layer 140b move along with the movement of the blade such as a cutter. For example, it is lifted upward. Therefore, in the laser light source 2, if the continuous inlet 110 and the adhesive layer 140b are cut by irradiating the laser beam 2a from the adhesive layer 121 side of the inlet 110 and the adhesive layer 121, the inlet 110 and the adhesive layer 140b can be accurately cut into a single piece without being lifted upward.

  The inlet 110 and the adhesive layer 140b cut into a single piece by the laser light 2a emitted from the laser light source 2 are adsorbed by the adsorbing portion 5a, and the inlet mounting machine 5 rotates in the direction of arrow A in the figure. As a result, it is transported to the area facing the reader / writer 3.

  In the reader / writer 3, when the inlet 110 and the pressure-sensitive adhesive layer 140b are conveyed to the opposing areas, information is written to and read from the IC chip 111 in the inlet 110, and the operation state of the inlet 110 is inspected. The At this time, since the surface of the suction portion 5a on which the inlet 110 and the adhesive layer 121 are sucked is made of a non-conductive material, the suction portion 5a does not affect the inspection in the reader / writer 3.

  The inlet 110 and the pressure-sensitive adhesive layer 140b, whose operation states have been inspected by the reader / writer 3, are in the state of being adsorbed by the adsorbing portion 5a, and the inlet mounting machine 5 further rotates in the direction of arrow A in the figure, whereby the stage 6 Are conveyed to a region facing the sheet base material 30b mounted on the sheet. Here, when the operation state is inspected by the reader / writer 3 and the inlet 110 determined to be normal is conveyed to a region facing the sheet base material 30b, the arm 5b of the inlet mounting machine 5 is moved to the sheet base material. While extending in the direction toward 30b, the suction force by the suction portion 5a is released, whereby the inlet 110 in which the adhesive layer 140b is formed is mounted on the sheet base material 30b. In addition, since the inlet 110 and the pressure-sensitive adhesive layer 140b are mounted and sucked in the suction portion 5a with the inlet 110 side as the mounting surface, the inlet 110 and the pressure-sensitive adhesive layer 140b are, as shown, the pressure-sensitive adhesive layer 140b. The inlet 110 is mounted on the sheet base 30b with the side to be mounted, whereby the inlet 110 is bonded to the sheet base 30b by the pressure-sensitive adhesive layer 140b. In addition, in the adsorption | suction part 5a, when the inlet 110 judged to be normal is conveyed to the area | region which opposes the sheet | seat base material 30b, it can also consider exhausting from the surface where the inlet 110 was adsorbed, In this case, the inlet 110 can be reliably bonded onto the sheet base material 30b.

  Here, the processing when the inlet 110 and the pressure-sensitive adhesive layer 140b that have been sucked and conveyed by the suction portion 5a of the inlet mounting machine 5 are mounted on the sheet substrate 30b mounted on the stage 6 will be described in detail. To do.

  3 is a view showing a state where the inlet 110 is mounted on the sheet base material 30b mounted on the stage 6 shown in FIG. 1 by the inlet mounting machine 5, and FIG. 4 is a view showing the stage 6 shown in FIG. It is a figure for demonstrating the process at the time of the inlet 110 being mounted by the inlet mounting machine 5 on the sheet | seat base material 30b mounted in FIG.

  As shown in FIG. 3, a plurality of inlets 110 are mounted in a matrix by the inlet mounting machine 5 on the sheet base material 30b mounted on the stage 6 shown in FIG. In this embodiment, 6 × 6 inlets 110 are mounted on one sheet base material 30b, but the number of inlets 110 mounted on one sheet base material 30b is not limited thereto. Absent.

  The inlet 110 and the adhesive layer 140b adsorbed by the adsorbing portion 5a of the inlet mounting machine 5 are conveyed to a predetermined point A in the figure by the rotation of the inlet mounting machine 5.

  In the movement control unit 8 that controls the movement of the stage 6 on which the sheet base material 30b is mounted in the XY directions, first, as shown in FIG. 4A, the mounting position of the inlet 110 on the sheet base material 30b is determined. Among them, the stage 6 is moved and controlled so that the mounting position on the most upstream side in the conveyance direction of the sheet base material 30b in FIG. 3 overlaps the point A in the figure, and the inlet 110 is placed on the sheet base material 30b at that position. Is installed.

  When the inlet 110 is mounted on the sheet base material 30b, the inlet mounting machine 5 rotates again, and the movement control unit 8 controls the movement of the stage 6 in the direction opposite to the conveyance direction of the sheet base material 30b. The inlet loading machine 5 stops rotating when the inlet 110 adsorbed by the adsorbing portion 5a reaches the point A in the drawing, and the stage 6 is shown in FIG. 3 among the mounting positions of the inlet 110 on the sheet base material 30b. In the rightmost row, the second mounting position from the most upstream side in the conveying direction of the sheet base material 30b moves to a position where it overlaps with the point A in the drawing and stops. And as shown in FIG.4 (b), the inlet 110 and the adhesive layer 140b adsorbed | sucked to the adsorption | suction part 5a of the inlet mounting machine 5 are the most in FIG. 3 among the mounting positions of the inlet 110 on the sheet | seat base material 30b. The sheet is mounted at the second mounting position from the most upstream side in the conveyance direction of the sheet base material 30b in the right row.

  Thereafter, in the same manner as described above, the rotation / stop of the inlet mounting machine 5 and the movement control of the stage 6 by the movement control unit 8 are performed on the sheet base material 30b as shown in FIGS. 4 (c) to 4 (f). Among the mounting positions of the inlet 110, the inlet 110 is sequentially mounted at the mounting position in the rightmost column in FIG.

  When the inlet 110 is mounted on all of the mounting positions in the rightmost row in FIG. 3 among the mounting positions of the inlet 110 on the sheet base material 30b, the stage 6 is then moved to the sheet base material 30b by the movement control unit 8. The movement direction is controlled in the vertical direction with respect to the conveyance direction, and among the mounting positions of the inlet 110 on the sheet base material 30b, the second position from the rightmost column in FIG. Moves to the position where it overlaps with point A in the figure and stops. And as shown in FIG.4 (g), the inlet 110 and the adhesive layer 140b adsorbed | sucked to the adsorption | suction part 5a of the inlet mounting machine 5 are the most in FIG. 3 among the mounting positions of the inlet 110 on the sheet | seat base material 30b. It is mounted at the mounting position on the most downstream side in the transport direction of the sheet base material 30b, which is second from the right column.

  When the inlet 110 is mounted on the sheet base material 30b, the inlet mounting machine 5 rotates again, and the movement control unit 8 controls the movement of the stage 6 in the transport direction of the sheet base material 30b. The inlet loading machine 5 stops rotating when the inlet 110 adsorbed by the adsorbing portion 5a reaches the point A in the drawing, and the stage 6 is shown in FIG. 3 among the mounting positions of the inlet 110 on the sheet base material 30b. The second mounting position from the most downstream side in the conveyance direction of the sheet base material 30b from the rightmost row moves to a position where it overlaps with the point A in the drawing and stops. And as shown in FIG.4 (h), the inlet 110 and the adhesive layer 140b adsorbed | sucked to the adsorption | suction part 5a of the inlet mounting machine 5 are the most in FIG. 3 among the mounting positions of the inlet 110 on the sheet | seat base material 30b. It is mounted at the second mounting position from the most downstream side in the transport direction of the sheet base material 30b, which is second from the right column.

  Thereafter, in the same manner as described above, by rotation / stop of the inlet loading machine 5 and movement control of the stage 6 by the movement control unit 8, 2 of the loading positions of the inlet 110 on the sheet base material 30 b from the rightmost column in FIG. The inlets 110 are sequentially mounted at the second mounting position.

  In this way, the inlet 110 that has been transported by the inlet mounting machine 5 is mounted in a matrix on the sheet base material 30b mounted on the stage 6, and then transported in the transport direction of the sheet base material 30b. .

  On the other hand, when the inlet 110 that has been inspected in the operation state by the reader / writer 3 and determined that the operation is not normal is conveyed to a region facing the sheet base material 30b, the arm 5b of the inlet mounting machine 5 It does not extend in the direction toward the base material 30b, and the suction force in the suction portion 5a is not released, and the inlet 110 and the adhesive layer 140b are further conveyed by the rotation of the inlet mounting machine 5 in a state of being sucked by the suction portion 5a. Then, it is conveyed to a region facing the roller 1h. When the inlet 110 that has been determined to be abnormal is conveyed to a region facing the roller 1h, the arm 5b of the inlet mounting machine 5 extends in the direction toward the roller 1h, and the suction force by the suction portion 5a is released. Thereby, the inlet 110 and the adhesive layer 140b are bonded to the roller 1h. In addition, since the inlet 110 and the pressure-sensitive adhesive layer 140b are mounted and sucked in the suction portion 5a with the inlet 110 side as the mounting surface, the inlet 110 and the pressure-sensitive adhesive layer 140b are, as shown, the pressure-sensitive adhesive layer 140b. The inlet 110 is bonded to the roller 1h by using the side as an adhesive surface, so that the inlet 110 is bonded and collected by the roller 1h without applying an adhesive or the like to the surface of the roller 1h. . In addition, when the box-shaped recovery member is provided below the region where the suction force by the suction portion 5a is released without providing the roller 1h, and the suction force by the suction portion 5a is released, the inlet mounting machine It is also conceivable that the inlet 110 that has been adsorbed by the nozzle 5 falls downward due to its own weight and is collected in the collecting member.

  The sheet base material 30b to which the inlet 110 is bonded via the pressure-sensitive adhesive layer 140b is cut on the surface on which the inlet 110 and the pressure-sensitive adhesive layer 140b are mounted and bonded to form a surface sheet 130a. And the pressure-sensitive adhesive layer 140a are overlaid and adhered to each other.

  Thereafter, in the cutting unit 4, the stacked sheet base materials 30a and 30b and the pressure-sensitive adhesive layer 140a are cut into the shape of the surface sheet of the non-contact type IC tag 100, whereby the non-contact type IC tag 100 is completed. In addition, the cutting method in the cutting part 4 can consider the method of irradiating a laser beam, the method of using an upper and lower body type cutter, etc.

  The non-contact type IC tag 100 cut by the cutting unit 4 is attracted to the conveyor 4a in the cutting unit 4, and then transferred onto the conveyor 7, and is sequentially conveyed on the conveyor 7, and a predetermined area. Stored in

  In this embodiment, the inlet 110 is inspected by the reader / writer 3 after the inlet sheet is cut into the single-piece inlet 110 by the laser beam 2a. However, the inlet 110 is not inspected. It is good also as a structure which mounts on the sheet | seat base material 30b and manufactures the non-contact-type IC tag 100. FIG.

  In this embodiment, the non-contact type IC tag 100 is described as an example of the RF-ID medium. However, the present invention is not limited to this, and can be applied to a non-contact type IC card and a non-contact type IC label. Needless to say. However, when manufacturing a non-contact type IC label, it is necessary to use either one of the two surface sheets as a release paper that can be peeled off, or to apply silicon to the adhesive surface with the other surface sheet. is there.

FIG. 1 is a diagram showing an embodiment of an RF-ID media manufacturing apparatus according to the present invention. It is a figure which shows the structure of the non-contact-type IC tag manufactured with the RF-ID media manufacturing apparatus shown in FIG. 1, (a) is a figure which shows an internal structure, (b) is A shown in (a). It is sectional drawing in -A 'part. It is a figure which shows the state in which the inlet was mounted by the inlet mounting machine on the sheet | seat base material mounted in the stage shown in FIG. It is a figure for demonstrating the process at the time of an inlet being mounted by the inlet mounting machine on the sheet | seat base material mounted in the stage shown in FIG. It is a figure which shows the structure of a common non-contact-type IC tag, (a) is a figure which shows an internal structure, (b) is sectional drawing in the A-A 'part shown to (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a-1h Roller 2 Laser light source 2a Laser light 3 Reader / writer 4 Cutting part 4a, 7 Conveyor 5 Inlet mounting machine 5a Adsorption part 5b Arm 6 Stage 8 Movement control part 30a, 30b Sheet base material 100 Non-contact type IC tag 110 Inlet 111 IC chip 112 Antenna 114 Contact 115 Resin sheet 130a, 130b Surface sheet 140a, 140b Adhesive layer

Claims (2)

An RF-ID media manufacturing apparatus for manufacturing an RF-ID media in which an inlet having an IC chip capable of writing and / or reading information in a non-contact state is mounted on a substrate,
Supply means for supplying the inlet;
A stage on which a sheet base material that becomes the base material by being cut is mounted;
Inlet mounting means for transporting and mounting the inlet supplied from the supply means on a sheet substrate mounted on the stage;
Movement control means for controlling the movement of the stage in the XY direction with respect to the inlet mounting position by the inlet mounting means so that the inlet mounting position on the sheet base material mounted on the stage is in a matrix shape; ,
An RF-ID media manufacturing apparatus comprising: a first cutting unit that cuts the sheet base material on which the inlet is mounted by the inlet mounting unit for each RF-ID medium. The RF-ID media manufacturing apparatus according to claim 1,
The supply means supplies the inlet continuously,
An adhesive layer applying means for applying an adhesive layer to one surface of the continuous inlet supplied from the supply means;
A continuous inlet supplied from the supply means and provided with the pressure-sensitive adhesive layer by the pressure-sensitive adhesive layer applying means is formed into a single piece by irradiating a laser beam from the surface side provided with the pressure-sensitive adhesive layer. A second cutting means for cutting,
The inlet mounting means adsorbs and conveys the inlet cut into a single piece by the second cutting means with the surface to which the pressure-sensitive adhesive layer is not applied being adsorbed, and the pressure-sensitive adhesive layer is An RF-ID media manufacturing apparatus, which is mounted on the sheet base material so that a given surface becomes a mounting surface.

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