JP2006062869A - Base board carrying device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely prevent the warp of a base board in carrying by generating a tensile force to the outside of the base board along a line orthogonal to the feeding direction of the base board as a component force of the torque of a roller in an inclination of a rotary shaft of the roller. <P>SOLUTION: This base board carrying device has a pair of roller trains 1 and 2 for sandwiching both side edges of the base board P from front and rear surfaces. The axis X of the rotary shaft of each roller 11 and 21 for constituting the roller trains 1 and 2 is inclined to the other side in the feeding direction of the base board P with respect to the line Y orthogonal to the feeding direction of the base board P. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention belongs to a technical field related to a substrate transfer apparatus used as a means for continuously moving a printed wiring board inside a reflow furnace where soldering is performed.

  In the substrate transfer apparatus, the substrate is transferred in a state where the central portion of the substrate to be subjected to various kinds of work is opened and only the side edge portion of the substrate is supported. Therefore, when a thin substrate such as a printed circuit board is transported, the substrate is warped (bent) during transportation due to the weight of the substrate or the weight of a mounted component mounted on the substrate, causing various problems. For this reason, development of the board | substrate conveyance apparatus which can prevent the curvature of the board | substrate during conveyance is anxious.

2. Description of the Related Art Conventionally, for example, the following devices are known as substrate transport devices aimed at preventing warping of a substrate being transported.
Japanese Patent No. 3306954 discloses a substrate transport device including a pair of roller rows that sandwich both side edges of the substrate from the front and back surfaces.

  The substrate transport apparatus according to Patent Document 1 prevents the warpage of the substrate being transported by causing the pinching of the roller array to function as a correction force against the warp of the substrate. Specifically, as shown in FIG. 6, the axis X of the rotation shaft of each of the rollers 11 and 21 constituting the roller rows 1 and 2 is coincident with a line Y orthogonal to the feeding direction of the substrate P.

  In the substrate transport apparatus according to Patent Document 1, since the substrate P is warped by being sandwiched between the small surfaces (lines) of the rollers 11 and 21 constituting the roller rows 1 and 2, the warp of the substrate P is corrected. Since the force is weak, there is a problem that the warp of the substrate P being transferred cannot be reliably prevented.

  The present invention has been made in consideration of such problems, and an object of the present invention is to provide a substrate transport apparatus that can reliably prevent warping of a substrate being transported.

  In order to solve the above-described problems, the substrate transfer apparatus according to the present invention employs means described in each of the claims.

  That is, according to the first aspect of the present invention, in the substrate transport apparatus provided with a pair of roller rows that sandwich both side edges of the substrate from the front and back surfaces, the axis of the rotation shaft of each roller constituting the roller row is orthogonal to the substrate feed direction. It is characterized in that it is inclined toward the front side in the substrate feeding direction with respect to the line to be moved.

  This means generates a tensile force to the outside of the substrate along a line perpendicular to the feed direction of the substrate as a component of the rotational force of the roller due to the inclination of the rotation shaft of the roller, and the tensile force applied to the clamping of the roller Prevents warping of the substrate with the straightening force.

  According to a second aspect of the present invention, in the substrate transfer apparatus according to the first aspect of the present invention, each pair of rollers via the substrate is connected so as to be rotationally driven in the reverse direction.

  In this means, each pair of rollers via the substrate applies a conveying force evenly from the front and back sides of the substrate.

  According to a third aspect of the present invention, in the substrate transfer apparatus according to the first or second aspect, a plurality of drive systems for the roller array are provided independently in the substrate transfer direction.

  In this means, the substrate conveyance speed is adjusted for each drive system of the roller array.

  The substrate transport device according to the present invention generates a tensile force to the outside of the substrate along a line orthogonal to the substrate feeding direction as a component of the rotational force of the roller due to the inclination of the rotation axis of the roller, and pinches the roller In addition, since the substrate is prevented from warping by the correction force due to the tensile force applied to the substrate, it is possible to reliably prevent the substrate from being warped during conveyance.

  Further, as claimed in claim 2, since each pair of rollers via the substrate applies a conveying force evenly from the front and back sides of the substrate, the substrate is reliably and precisely conveyed without causing twisting on the front and back sides of the substrate. There is an effect that can.

  According to a third aspect of the present invention, since the substrate conveyance speed is adjusted for each drive system of the roller array, there is an effect that a degree of freedom is brought about in designing the length of the substrate conveyance line.

  Hereinafter, the best mode for carrying out a substrate transfer apparatus according to the present invention will be described with reference to FIGS.

  In this embodiment, a device suitable for use as a means for continuously moving a printed wiring board inside a reflow furnace where soldering is performed is shown.

  This form includes a pair of roller rows 1 and 2 that sandwich both side edges of the substrate P from the front and back surfaces, as in the substrate transfer apparatus according to Patent Document 1.

  As shown in FIGS. 2 and 3, each of the rollers 11 constituting the lower roller row 1 is formed with a flange 12 for preventing lateral displacement of the substrate P, and is rotatably supported on the stationary machine frame 3 by a rotary shaft 13. Has been. A synchronous gear 14 and a drive sprocket 15 are coaxially fixed to the rotary shaft 13. As shown in FIGS. 1 and 2, the axis X of the rotary shaft 13 is inclined at a constant angle θ toward the front side of the substrate P feed direction with respect to a line Y orthogonal to the substrate P feed direction. . This angle θ is set to about 2 degrees. Therefore, the substrate P does not easily fall off the roller 11.

  Two independent drive systems 4 are connected to the lower roller row 1, and the drive system 4 is linked between a drive gear 41 and a guide gear 42 fixed to a motor shaft of a motor (not shown). The chain 43 is passed in an endless manner, and is disposed in the preheating portion Ha, the main heating portion, and the cooling portion Hb of the reflow furnace H (see FIG. 4). Note that the linearly arranged link chain 43 is partially meshed only with the lower end portion of the drive sprocket 15 of the lower roller row 1 so that the rotation shaft 13 of the lower roller row 1 is inclined. Regardless, the roller 11 can be driven to rotate.

  Each roller 21 constituting the upper roller row 2 is rotatably supported on the movable machine frame 5 by a rotary shaft 22 without forming a flange 12 like the roller 11 of the lower roller row 1. . A synchronous gear 23 that meshes with the synchronous gear 14 of the roller 11 of the lower roller row 1 is coaxially fixed to the rotary shaft 22. The axis X of the rotating shaft 22 is set to an inclination that coincides with the rotating shaft 14 of the roller 11 of the lower roller row 1.

  The movable machine frame 5 is pressed against the fixed machine frame 3 by a pusher 6 including a guide bolt 61 and a coil spring 62. Therefore, the rollers 11 and 21 of the upper and lower roller rows 1 and 21 securely clamp the both side edges of the substrate P from the front and back surfaces, respectively, and the synchronous gears 14 and 23 of the upper and lower roller rows 1 and 2 are reliably engaged. Is done.

  According to this embodiment, the driving system 4 drives the rollers 11 and 21 of the upper and lower roller rows 1 and 2 to rotate in the reverse direction to transport the substrate P, and the substrate P is moved inside the reflow furnace H. Will be. At this time, since both the rollers 11 and 21 of the upper and lower roller rows 1 and 2 are synchronously rotated, the rollers 11 and 121 of the pair via the substrate P are evenly spaced from the front and back sides of the substrate P. A conveying force is applied. Accordingly, the substrate P can be reliably and precisely transported without causing twisting on the front and back sides of the substrate P.

  In the transport of the substrate P, the transport speed can be adjusted by the drive system 4 independent between the preheating unit Ha, the main heating unit, and the cooling unit Hb of the reflow furnace H. Therefore, as shown in FIG. 4, even if the lengths of the transport lines of the preheating section Ha, the main heating section, and the cooling section Hb of the reflow furnace H are the same, the transport speed of the substrate P in the preheating section Ha is decreased. By doing so, the preheating part Ha can have substantially the same configuration in the heating amount as the normal apparatus configuration in which the transport line is set longer than the main heating part and the cooling part Hb. For this reason, a freedom degree is brought about in the length design of the conveyance line of the board | substrate P, and the whole apparatus scale can be reduced in size. In addition, when the conveyance speed of the board | substrate P in the preheating part Ha of the reflow furnace H, this heating part, and the cooling part Hb is varied, the preheating part Ha of the rollers 11 and 21 of the roller row | line | columns 1 and 2 of an up-and-down part side. By disposing the free roller 4 that can rotate freely without being driven at the boundary between the main heating unit and the cooling unit Hb, the delivery of the substrate P can be made smooth so that the conveyance is not stagnated.

  Similarly to the substrate transport apparatus according to Patent Document 1, the substrate P to be transported functions as a correction force by sandwiching the pair of roller rows 1 and 2 against the warp of the substrate P, and the substrate being transported P warpage is prevented.

  Furthermore, in this embodiment, as shown in FIG. 5, the rotational force a of the rollers 11 and 21 of the upper and lower roller rows 1 and 2 is divided by the inclination of the rotary shafts 13 and 22. That is, the force is divided into a conveying force b along the line in the feeding direction of the substrate P and a tensile force c on the outside of the substrate P along the line Y orthogonal to the feeding direction of the substrate P. This tensile force c assists the sandwiching of the substrate P by the rollers 11 and 21 of the upper and lower roller rows 1 and 2. Accordingly, since the correction force for preventing the warp of the substrate P is strengthened, it is possible to reliably prevent the warp of the substrate P being transported.

  As described above, in addition to the illustrated examples, it is also possible to arrange the drive systems 4 independently in three or more systems.

  Furthermore, it is also possible to synchronize the rollers 11 and 21 of the upper and lower roller rows 1 and 2 other than the gear meshing structure.

  The substrate transfer apparatus according to the present invention can be widely applied when various substrates are subjected to various movements in addition to continuously moving the printed wiring substrate inside the reflow furnace.

It is the simplified perspective view which shows the basic composition of the best form for implementing the board | substrate conveyance apparatus which concerns on this invention. It is an enlarged plan view of the principal part of FIG. It is a detailed side sectional view of the principal part of FIG. It is a detailed front view of the principal part of FIG. It is explanatory drawing of the tensile force divided from the rotational force of a roller. It is the simplified perspective view which shows the basic composition of a prior art example.

Explanation of symbols

1, 2 Roller row 11, 21 Roller 13, 22 Rotating shaft
4 Drive system P Substrate X Axis line Y A line perpendicular to the feed direction of the substrate P

Claims (3)

  In a substrate transport apparatus provided with a pair of roller rows that sandwich both side edges of the substrate from the front and back surfaces, the axis of the rotation shaft of each roller constituting the roller row has a substrate axis perpendicular to the substrate feed direction. A substrate transfer apparatus, wherein the substrate transfer apparatus is inclined toward the front side in the feed direction.   2. The substrate transfer apparatus according to claim 1, wherein each pair of rollers via the substrate is coupled so as to be rotationally driven in synchronization in the reverse direction.   3. The substrate transport apparatus according to claim 1, wherein a plurality of drive systems for the roller array are provided independently in the substrate transport direction.

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