JP2006060097A - Lead frame for semiconductor device, semiconductor device using the lead frame and manufacturing method for semiconductor device using the lead frame - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead frame for a semiconductor device preventing the drooping of an antenna, facilitating handling during a manufacturing process and capable of manufacturing the semiconductor device at a low cost, the semiconductor device using the lead frame and a manufacturing method for the semiconductor device using the lead frame. <P>SOLUTION: In the lead frame 11, semiconductor-element loading sections 14 with loaded semiconductor elements, the spiral antennas 15, and supporting lead 16 are molded in each region 12 partitioned into separate semiconductor devices. In the lead frame 11, a frame 13 surrounding each region 12 supports the semiconductor loading sections 14 and the antennas 15 through the supporting leads 16. In the lead frame 11, the supporting leads 16 support the antennas 15 extensively over at least central sections from the periphery of each region, and have thicknesses from undersides of the lead frames 16 to undersides of the antennas. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a lead frame for a semiconductor device, a semiconductor device using the lead frame, and a method for manufacturing the semiconductor device using the lead frame, and relates to a technique for manufacturing a lead frame used for a semiconductor device having an antenna by a batch molding method.

  This type of semiconductor device is used by being mounted on various articles, and is used for applications in which data is input / output wirelessly between a semiconductor element of the semiconductor device and an external electronic device via an antenna. Yes.

  For example, it is used for managing individual article information in the article distribution process. A semiconductor device is attached to the article itself or a box for storing the article, and data stored in the semiconductor element is read by the transmission / reception apparatus. The system is known.

  Or the example used for use management of the functional element member which comprises various equipment is also known, In this case, a semiconductor device is stuck on the functional element member which comprises various equipment, and the functional element memorize | stored in the semiconductor element Using individual information about the member, it is used for managing the use of the functional element member.

Conventionally, a semiconductor device having the same function has a structure in which an antenna is separately connected to a printed circuit board or the like on which a semiconductor element is mounted, and these are sealed with a sealing resin.
However, in the semiconductor device as described above, since the antenna is a separate component, the number of components is increased, and a process for connecting the antenna separately from the semiconductor element is required. It is necessary and difficult to manufacture in a general semiconductor manufacturing process.

  For this reason, a semiconductor device and a manufacturing method thereof have been devised as described below. As shown in FIGS. 9 to 10, the semiconductor element mounting portion 2 and the helical antenna portion 3 are integrally formed on one lead frame 1, and the semiconductor element mounting portion 2 and the helical antenna portion are formed. 3 is formed in each of a plurality of regions 4 set in the lead frame 1, and each region 4 is divided into individual semiconductor devices. The lead frame 1 is provided with a mounting portion supporting lead 5 for supporting the semiconductor element mounting portion 2 and an antenna supporting lead 6 for supporting the antenna portion 3, and the antenna supporting lead 6 is provided at the outermost peripheral portion of the helical antenna portion 3. It is provided at multiple locations.

  A semiconductor element 7 is mounted on each semiconductor element mounting portion 2 of the lead frame 1 via a die bond material (not shown), and the inner peripheral end 3a and the outer peripheral end 3b of each antenna portion 3 are connected to the interior of each semiconductor element 7. Each is connected to a circuit (not shown) by a thin metal wire 8.

  Then, the semiconductor element mounting portion 2, the antenna portion 3, and the semiconductor element 7 of the lead frame 1 are sealed with a sealing resin 9, and then the lead frame 1 is divided into each region 4 to manufacture individual semiconductor devices 10. .

As a method of configuring a semiconductor device having an antenna using a lead frame as described above, for example, there is one described in Patent Document 1.
JP 2000-124388 A

  Incidentally, since the performance of the antenna depends on the length of the loop of the antenna, it is necessary to form the antenna in a spiral shape in order to improve the performance. However, since the lead frame 1 shown in FIG. 10 has a structure in which the spiral antenna portion 3 is supported by the antenna support leads at a plurality of positions on the outermost peripheral portion, the antenna portion 3 is used during transportation during the manufacturing process. There is a problem that the inner peripheral end 3a side of the sag hangs down, making its handling difficult.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and a lead frame for a semiconductor device capable of preventing the antenna portion from sagging, facilitating handling during the manufacturing process, and producing an inexpensive semiconductor device, and the same. An object of the present invention is to provide a semiconductor device used and a method of manufacturing a semiconductor device using the same.

  In order to achieve the above object, a lead frame for a semiconductor device according to claim 1 of the present invention includes a semiconductor element mounting portion on which a semiconductor element is mounted and a spiral shape in each region divided into individual semiconductor devices. A lead frame that molds an antenna portion and a support lead, and a frame portion that surrounds each region supports the semiconductor element mounting portion and the antenna portion via the support lead, and each of the support leads places the antenna portion at the lower surface position of the antenna portion. It supports from the peripheral part of the region to at least the central part, and has a thickness from the lower surface of the lead frame to the lower surface of the antenna unit.

  In the configuration described above, the frame portion surrounding each region is formed by molding a pattern including the semiconductor element mounting portion, the spiral antenna portion, and the support lead into each region of the lead frame divided into individual semiconductor devices. Ensure the strength of the lead frame to withstand handling in the manufacturing process.

  The support lead supports the antenna portion from the peripheral portion of each region to at least the central portion at the lower surface position of the antenna portion, so that the antenna portion can be prevented from drooping during the manufacturing process, and the handling of the lead frame is facilitated.

  A semiconductor element is mounted on the semiconductor element mounting portion of the lead frame, and the input / output electrodes of the semiconductor element and the antenna portion are electrically joined with a metal wire, and the lead frame antenna portion, the semiconductor element mounting portion, the support lead, The semiconductor element is sealed with a sealing resin. This resin sealing simultaneously seals a plurality of semiconductor devices in one cavity of the mold.

  In this state, the spiral antenna portion is short-circuited between the strips by the support leads. Since the performance of the antenna depends on the length of the loop, the length of the loop will be shortened unless the support leads are removed, and the original performance cannot be achieved. Use a disc-shaped dicing saw after sealing. Remove the support leads.

  Since the support lead has a thickness from the lower surface of the lead frame to the lower surface of the antenna portion, the support lead is removed on one side surface of the lead frame. At this time, by adjusting the cutting amount of the dicing saw to be shallower than that at the time of cutting, only the support lead can be removed without removing the antenna portion. Thereafter, the lead frame is cut and divided using a dicing saw to divide into individual semiconductor devices. Each semiconductor device has a shape in which a groove is formed on the lower surface by removing the support lead.

  As described above, when the semiconductor element is mounted, the antenna portion is prevented from sagging with the support lead to facilitate the work, and the support lead is removed after the antenna portion is fixed and held by the sealing resin. An easy-to-handle lead frame can be realized without lowering the function of the part.

  According to a second aspect of the present invention, there is provided a lead frame for a semiconductor device in which a semiconductor element mounting portion is disposed at the center of a spiral antenna portion, and a support lead supports the semiconductor element mounting portion and the antenna portion at a lower surface position. .

  With the configuration described above, the support lead has a structure that can be removed after resin sealing by supporting the antenna portion and the semiconductor element mounting portion at the lower surface position. For this reason, even if the semiconductor element mounting portion is disposed at the center of the antenna portion, the antenna portion and the semiconductor element mounting portion are not short-circuited via the support lead in the completed semiconductor device.

  By arranging the semiconductor element mounting part at the center of the spiral antenna part, the antenna part can be arranged in the entire area around the semiconductor element mounting part in each region of the lead frame divided into individual semiconductor devices. The loop of the antenna portion becomes longer, and a semiconductor device having a higher performance antenna portion can be obtained.

  However, when the support lead supports the antenna part and the semiconductor element mounting part at its peripheral edge as in the prior art, the antenna part and the semiconductor element mounting part are not short-circuited via the support lead in the finished semiconductor device. Therefore, it is necessary to dispose the semiconductor element mounting portion at a position outside the antenna portion and to support the antenna portion and the semiconductor element mounting portion with separate support leads. In this case, the antenna portion cannot be disposed around the semiconductor element mounting portion because it is hindered by the support leads that support the semiconductor element mounting portion.

  A semiconductor device according to a third aspect of the present invention is a semiconductor device manufactured using the lead frame for a semiconductor device according to any one of the first and second aspects, wherein the semiconductor element is mounted on the semiconductor element mounting portion of the lead frame. The lead frame antenna portion, the semiconductor element mounting portion, and the semiconductor element are sealed with a sealing resin, and a groove as a trace from which the support lead is removed is formed on the lower surface of the semiconductor device. Some are exposed.

  A method of manufacturing a semiconductor device according to a fourth aspect of the present invention is a method of manufacturing a semiconductor device using the lead frame for a semiconductor device according to any one of the first and second aspects, wherein the semiconductor element is a semiconductor element of a lead frame. A die bonding step for fixing to the mounting portion, a wire bonding step for electrically joining the input / output electrodes of the semiconductor element and the antenna portion with metal wires, and the lead frame antenna portion, the semiconductor element mounting portion, and the semiconductor element are sealed. It consists of a batch sealing process that seals with a stop resin, a support lead removal process that removes the support lead using a dicing saw, and a dicing process that divides the lead frame into individual semiconductor devices using a dicing saw. is there.

  In the present invention, the lead frame is provided with a support lead that supports the antenna portion from the peripheral portion of each region to at least the central portion at the lower surface position of the antenna portion, thereby preventing the antenna portion from drooping and facilitating handling in the manufacturing process. By removing the support lead of the antenna portion in a state where the support lead of the antenna portion is no longer necessary due to the sealing resin, it is possible to manufacture a semiconductor device including a high-performance antenna with a long loop.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the lead frame 11 forms a frame portion 13 surrounding each region 12 divided into individual semiconductor devices, and the lead necessary for the frame portion 13 to withstand handling in the manufacturing process. The strength of the frame 11 is ensured.

  In each region 12, a pattern including a semiconductor element mounting portion 14, a spiral antenna portion 15, and a support lead 16 is molded. This pattern is arranged on a single lead frame 11 in a plurality of rows in one or both of the vertical and horizontal directions.

  The semiconductor element mounting portion 14 is disposed at the center of the spiral loop of the antenna portion 15, and one support lead 16 supports the semiconductor element mounting portion 14 and the antenna portion 15 simultaneously, and the frame portion 13 is interposed via the support lead 16. The semiconductor element mounting portion 14 and the antenna portion 15 are supported. The semiconductor element mounting portion 14 and the antenna portion 15 can be supported by separate support leads 16.

  The support lead 16 supports the antenna unit 15 at the lower surface position from the periphery of each region 12 to at least the center, and in this embodiment, the support lead 16 is disposed between the frame portions 13 facing each other in the region 12. is doing. The support lead 16 has a thickness from the lower surface of the lead frame 11 to the lower surface of the antenna unit. The resin filling portion 17 around the antenna portion 15 and between the strips 15 c penetrates the lead frame 11 on the front and back surfaces except for portions corresponding to the support leads 16.

  As described above, the support lead 16 supports the antenna unit 15 from the periphery to the center of each region 12 at the lower surface position, so that the antenna unit 15 can be prevented from sagging during the manufacturing process, and the handling of the lead frame 11 is easy. It becomes.

The manufacturing process of the semiconductor device using the lead frame 11 includes a die bonding process, a wire bonding process, a batch sealing process, a support lead removing process, and a dicing process.
In the die bonding process, as shown in FIG. 2, the semiconductor element 18 is die bonded to the semiconductor element mounting portion 14 of the lead frame 11, and then, in the wire bonding process, the internal circuit of the semiconductor element 18 and the antenna section 15 are connected by the metal wire 19. The inner peripheral end 15a and the outer peripheral end 15b are connected.

  In the collective sealing step, as shown in FIG. 3, the semiconductor element mounting portion 14, the antenna portion 15, the support lead 16, and the semiconductor element 18 of the lead frame 11 are sealed with a sealing resin 20. This resin sealing simultaneously seals a plurality of semiconductor devices in one cavity of the mold. In FIG. 3, a member such as a sealed semiconductor element is virtually indicated by a broken line, and a hatched portion is a region sealed with resin. This collective sealing may be single-sided sealing performed only on the side of the lead frame 11 where the semiconductor element 18 is mounted as in the present embodiment, or double-sided sealing in which the lead frame 11 is sandwiched from both the front and back sides. It may be.

  In this state, the spiral antenna portion 15 is short-circuited by the support leads 16 between the strips 17. Since the performance of the antenna depends on the length of the loop, the loop length becomes short unless the support lead 16 is removed, and the original performance cannot be exhibited. Therefore, the support lead 16 is removed in the support lead removal step.

  In the support lead removal step, as shown in FIG. 4, the support lead 16 is removed by a disc-shaped dicing saw 21 used in a dicing step described later. The dicing saw 21 is thicker than the width of the support lead 16. FIG. 4 is a view of the lead frame 11 as seen from the lower surface so that the position of the dicing saw 21 can be easily understood.

  Since the support lead 16 has a thickness from the lower surface of the lead frame 11 to the lower surface position of the antenna unit 15, the support lead 16 is removed on one side surface (lower surface) of the lead frame 11. That is, the cutting amount of the dicing saw 21 is adjusted to be shallower than that at the time of cutting, and only the support lead 16 is removed without removing the antenna portion 15 while moving along the support lead 16. The groove 22 is formed by cutting the support lead 16, and a part of the antenna portion 15 is exposed in the groove 22. The dicing saw 21 is thicker than the width of the support lead 16.

  In the dicing step, as shown in FIG. 5, the cutting amount of the dicing saw 21 is set deeper than the support lead removing step, and the frame portion 13 is removed while being moved along the frame portion 13. The lead frame 11 is cut and divided into individual semiconductor devices. The dicing saw 21 is thicker than the width of the frame portion 13.

  As shown in FIG. 6, in a state where the semiconductor device is cut and divided into individual semiconductor devices, each semiconductor device has a shape in which a groove 22 is formed on the lower surface by removing the support lead 16. FIG. 7 shows the semiconductor device 23 in a completed state when it is sealed on one side.

  As described above, by providing the lead frame 11 with the support lead 16 that supports the spiral antenna portion 15 from the peripheral portion to the central portion, the antenna portion 15 is prevented from sagging and can be easily handled in the manufacturing process, and sealed. By removing the support lead 16 in a state where the support lead 16 of the antenna unit 15 is no longer necessary due to the stop resin, it is possible to manufacture a semiconductor device including a high-performance antenna with a long loop.

  Further, as shown in FIG. 8, in the semiconductor device 23 using the lead frame 11 of the present invention, the support lead 16 does not exist in the completed state, and the semiconductor element mounting portion 14 is arranged at the center of the antenna portion 15. However, the antenna unit 15 and the semiconductor element mounting unit 14 are not short-circuited via the support lead 16.

  Therefore, by disposing the semiconductor element mounting portion 14 at the center of the spiral antenna portion 15, the antenna portion 15 can be disposed in the entire area around the semiconductor element mounting portion 14, and the loop of the antenna portion 15 is long. Thus, a semiconductor device having a higher-performance antenna unit 15 can be obtained.

  On the other hand, as shown in FIGS. 9 to 10, in the conventional semiconductor device 9, the semiconductor element mounting portion 2 is disposed at an outer position of the antenna portion 3, and the semiconductor element mounting portion 2 and the antenna portion 3 are respectively arranged at the peripheral portions. The antenna unit 3 is arranged around the semiconductor element mounting unit 2 by being supported by a separate mounting unit supporting lead 5 and an antenna supporting lead 6 and obstructed by the mounting unit supporting lead 5 that supports the semiconductor element mounting unit 2. I can't.

  The lead frame according to the present invention has an effect of preventing the antenna portion from sagging and facilitating handling during the manufacturing process, and is useful as a lead frame for a semiconductor device capable of producing an inexpensive semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the lead frame in embodiment of this invention, (a) is a top view, (b) is AA arrow sectional drawing, (c) is BB arrow sectional drawing, (d) is a figure. CC cross section It is a figure which shows the lead frame state after the die bond and wire bond in the embodiment, (a) is a top view, (b) is AA arrow sectional drawing. It is a figure which shows the lead frame state after collective sealing in the embodiment, (a) is a top view, (b) is AA arrow sectional drawing, (c) is BB arrow sectional drawing. It is a figure which shows the removal operation of the support lead by the die-sinking apparatus in the embodiment, (a) is a back view, (b) is AA arrow sectional drawing. It is a figure which shows the cutting | disconnection and division | segmentation operation by the die-sinking apparatus in the embodiment, (a) is a back view, (b) is AA arrow sectional drawing. The figure which shows the state which divided | segmented the lead frame in the embodiment separately 2A and 2B are diagrams illustrating the semiconductor device according to the embodiment, where FIG. 3A is a plan view, FIG. 3B is a front view, and FIG. The figure which shows the semiconductor device in the same embodiment The figure which shows the semiconductor device at the time of assembling with the lead frame which divided the conventional semiconductor mounting part and the support lead of the antenna The figure which shows the lead frame which divided the conventional semiconductor mounting part and the support lead of the antenna

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lead frame 2 Semiconductor element mounting part 3 Antenna part 3a Inner peripheral end 3b Outer peripheral end 4 Area | region 5 Mounting part support lead 6 Antenna support lead 7 Semiconductor element 8 Metal fine wire 9 Sealing resin 10 Semiconductor device 11 Lead frame 12 Area 13 Frame part DESCRIPTION OF SYMBOLS 14 Semiconductor element mounting part 15 Antenna part 15a Inner peripheral end 15b Outer peripheral end 15c Article 16 Support lead 17 Resin filling space 18 Semiconductor element 19 Metal fine wire 20 Sealing resin 21 Dicing saw 22 Groove 23 Semiconductor device

Claims (4)

A lead frame for molding a semiconductor element mounting portion for mounting a semiconductor element, a spiral antenna portion, and a support lead in each region divided into individual semiconductor devices, and a frame portion surrounding each region serving as a support lead The semiconductor element mounting portion and the antenna portion are supported via the support lead, and the support lead supports the antenna portion from the peripheral portion to at least the central portion of each region at the lower surface position of the antenna portion, and has a thickness from the lower surface of the lead frame to the lower surface of the antenna portion. A lead frame for a semiconductor device, comprising: 2. The lead frame for a semiconductor device according to claim 1, wherein a semiconductor element mounting portion is disposed at the center of the spiral antenna portion, and the support lead supports the semiconductor element mounting portion and the antenna portion at a lower surface position. A semiconductor device manufactured using the lead frame for a semiconductor device according to claim 1, wherein the semiconductor element is mounted on the semiconductor element mounting portion of the lead frame, and an antenna portion of the lead frame, A semiconductor element mounting portion, wherein the semiconductor element is sealed with a sealing resin, and has a groove as a trace from which the support lead is removed on the lower surface of the semiconductor device, and a part of the antenna portion is exposed in the groove. A semiconductor device. A method of manufacturing a semiconductor device using the lead frame for a semiconductor device according to claim 1, wherein the semiconductor element is fixed to a semiconductor element mounting portion of the lead frame, and the semiconductor A wire bonding step of electrically joining the input / output electrodes of the element and the antenna portion with a metal wire, and a batch sealing step of sealing the antenna portion of the lead frame, the semiconductor element mounting portion, and the semiconductor element with a sealing resin; A method of manufacturing a semiconductor device comprising: a support lead removing step of removing a support lead using a dicing saw; and a dicing step of dividing the lead frame into individual semiconductor devices using a dicing saw.

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