JP2005243857A - Lead frame, semiconductor device using it, and manufacturing method of semiconductor device - Google Patents

Lead frame, semiconductor device using it, and manufacturing method of semiconductor device Download PDF

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Publication number
JP2005243857A
JP2005243857A JP2004050602A JP2004050602A JP2005243857A JP 2005243857 A JP2005243857 A JP 2005243857A JP 2004050602 A JP2004050602 A JP 2004050602A JP 2004050602 A JP2004050602 A JP 2004050602A JP 2005243857 A JP2005243857 A JP 2005243857A
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Prior art keywords
lead frame
semiconductor device
frame
antenna
semiconductor
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JP3877732B2 (en
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Kunikazu Takemura
邦和 竹村
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead frame capable of increasing the number of semiconductor devices per unit area in the lead frame and inexpensively manufacturing the semiconductor device by improving manufacturing efficiency, and to provide the semiconductor device and a manufacturing method of the semiconductor device. <P>SOLUTION: The lead frame 1 for use in the semiconductor device having an antenna 12 is configured such that at least a part of a frame 3 partitioning a region where the semiconductor device is formed is used as the antenna 12. Consequently, parts of the frame removed in later processes are reduced in the number as compared with a lead frame including a frame and an antenna provided respectively individually, whereby the number of the semiconductor devices per unit area in the lead frame 1 is increased to raise manufacturing efficiency. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、一括成型工法により製造されるアンテナを有する半導体装置に用いられるリードフレームと、それを用いた半導体装置、その半導体装置の製造方法に関するものである。   The present invention relates to a lead frame used in a semiconductor device having an antenna manufactured by a batch molding method, a semiconductor device using the lead frame, and a method for manufacturing the semiconductor device.

アンテナを有する半導体装置は、各種物品に装着され、半導体装置に備えられた半導体素子と外部の電子機器との間で無線によりデータの入出力を行う用途に用いられる。例えば、物品の流通過程において、取扱う個々の物品情報を管理するために、物品自体あるいは物品の箱に半導体装置を貼付し、半導体素子に記憶されたデータ等を送受信装置によって読取るシステムが知られている。あるいは、各種機器を構成する機能要素部材に半導体装置を貼付し、半導体素子に記憶された機能要素部材に関する個別の情報を利用して、その機能要素部材の使用管理に使用する例も知られている。   A semiconductor device having an antenna is attached to various articles, and is used for applications in which data is input and output wirelessly between a semiconductor element provided in the semiconductor device and an external electronic device. For example, a system is known in which a semiconductor device is affixed to an article itself or an article box and data stored in a semiconductor element is read by a transmission / reception device in order to manage individual article information handled in the article distribution process. Yes. Alternatively, an example is also known in which a semiconductor device is attached to a functional element member constituting various devices, and individual information regarding the functional element member stored in the semiconductor element is used for use management of the functional element member. Yes.

従来、同機能の半導体装置を構成するためには、半導体素子が搭載されたプリント基板などに別途アンテナを接続して、封止樹脂により封止する必要があった。
しかし上記のような半導体装置では、部品点数が多い上に、別途アンテナを接続する工程、また封止する際にアンテナを保持する構造が必要となり、一般的な半導体製造工程では製造が困難である。これに対処すべく、図10に示すように、アンテナ31を一体に備えたリードフレーム30を用いた半導体装置が考案されている。
Conventionally, in order to configure a semiconductor device having the same function, it is necessary to separately connect an antenna to a printed circuit board or the like on which a semiconductor element is mounted and to seal it with a sealing resin.
However, in the semiconductor device as described above, the number of components is large, and a process for connecting the antenna separately and a structure for holding the antenna when sealing are required, which is difficult to manufacture in a general semiconductor manufacturing process. . In order to cope with this, as shown in FIG. 10, a semiconductor device using a lead frame 30 integrally provided with an antenna 31 has been devised.

すなわち、図10は従来の半導体装置の平面図であり、リードフレーム30に螺旋形状のアンテナ31と半導体素子搭載部32とが備えられている。また、半導体素子33がダイボンド材(図示せず)を介して半導体素子搭載部32に搭載されている。上記半導体素子33の内部回路(図示せず)とアンテナ31の内周端31aならびに外周端31bとは、それぞれ金属ワイヤ34によって接続されている。上記リードフレーム30とアンテナ31と半導体素子33とは封止樹脂35により封止されたのち、リードフレーム30の封止された領域以外の箇所を除去し、これによりアンテナ31を有する半導体装置が製造される。また、図10における36はリードフレーム30の枠で、このリードフレーム30の枠36は、組立工程中の取り扱いに耐えるだけのリードフレーム強度を保つために設けられ、封止工程後に除去される。   That is, FIG. 10 is a plan view of a conventional semiconductor device, in which a lead frame 30 is provided with a spiral antenna 31 and a semiconductor element mounting portion 32. The semiconductor element 33 is mounted on the semiconductor element mounting portion 32 via a die bond material (not shown). An internal circuit (not shown) of the semiconductor element 33 is connected to the inner peripheral end 31 a and the outer peripheral end 31 b of the antenna 31 by metal wires 34. The lead frame 30, the antenna 31, and the semiconductor element 33 are sealed with a sealing resin 35, and then portions other than the sealed region of the lead frame 30 are removed, whereby a semiconductor device having the antenna 31 is manufactured. Is done. 10 is a frame of the lead frame 30. The frame 36 of the lead frame 30 is provided to maintain the lead frame strength enough to withstand handling during the assembly process, and is removed after the sealing process.

なお、上記のようにリードフレームを用いてアンテナを有する半導体装置用のパッケージが、例えば、下記の特許文献1に開示されている。
特開2000−124388号公報
A package for a semiconductor device having an antenna using a lead frame as described above is disclosed in, for example, Patent Document 1 below.
JP 2000-124388 A

しかしながら図10に示した従来の半導体装置では、組立工程中の取り扱いに耐えるだけのリードフレーム強度を保つための枠36などの、封止された領域以外の箇所を除去して製品を製造する構造であるため、リードフレーム30の単位面積あたりの製品取れ数が少ないという課題があった。   However, the conventional semiconductor device shown in FIG. 10 has a structure in which a part other than the sealed region, such as a frame 36 for maintaining a lead frame strength enough to withstand handling during the assembly process, is removed to manufacture a product. Therefore, there has been a problem that the number of products obtained per unit area of the lead frame 30 is small.

本発明は上記課題を解決するもので、リードフレームにおける単位面積あたりの半導体装置の取れ数を多くでき、製造効率を上げることで安価に半導体装置を生産できるリードフレーム、半導体装置、半導体装置の製造方法を提供することを目的とする。   SUMMARY OF THE INVENTION The present invention solves the above problems, and can increase the number of semiconductor devices per unit area in a lead frame, and can manufacture semiconductor devices at low cost by increasing manufacturing efficiency. It aims to provide a method.

上記の目的を達成するために本発明のリードフレームは、アンテナを有する半導体装置用として用いられるリードフレームであって、所定方向に複数列の半導体装置となるパターンが形成され、半導体素子を搭載する搭載部と、開口窓部を介して搭載部を囲むように設けられ、半導体装置が形成される領域を区分する枠とを有し、前記枠の少なくとも一部がアンテナとして用いられるように構成されていることを特徴とする。また、枠に切断経路となる部分が設けられ、枠における開口窓部と切断経路との間の部分がアンテナとして用いられる。   In order to achieve the above object, a lead frame of the present invention is a lead frame used for a semiconductor device having an antenna, in which a pattern that forms a plurality of rows of semiconductor devices in a predetermined direction is formed, and a semiconductor element is mounted A mounting portion; and a frame provided so as to surround the mounting portion through the opening window portion, and configured to partition a region where the semiconductor device is formed, and configured so that at least a part of the frame is used as an antenna. It is characterized by. Moreover, the part used as a cutting | disconnection path | route is provided in a frame, and the part between the opening window part and cutting | disconnection path | route in a frame is used as an antenna.

この構成により、枠の少なくとも一部がアンテナとして共用されるので、枠とアンテナとをそれぞれ個別に設けたリードフレームと比較して、後工程で除去する部分が少なくなって、リードフレームにおける単位面積あたりの半導体装置の取れ数が多くなり、製造効率を上げることができる。   With this configuration, since at least a part of the frame is shared as an antenna, compared to a lead frame in which the frame and the antenna are individually provided, there are fewer parts to be removed in a later process, and the unit area in the lead frame As a result, the number of semiconductor devices that can be taken is increased, and the manufacturing efficiency can be increased.

また、本発明のリードフレームは、搭載部を枠に繋げる吊りリードの一部が切断経路に重なるように形成されていることを特徴とし、これにより、枠における切断経路に沿って切断した際に、吊りリードも切断されて搭載部がアンテナとなる部分から電気的に分離され、この後、搭載部とアンテナとを電気的に分離させる作業を個別に行わなくても済み、製造効率を上げることができる。   In addition, the lead frame of the present invention is characterized in that a part of the suspension lead that connects the mounting portion to the frame is formed so as to overlap the cutting path, and when this is cut along the cutting path in the frame Also, the suspension lead is cut and the mounting part is electrically separated from the part that becomes the antenna, and after that, it is not necessary to separately perform the work of electrically separating the mounting part and the antenna, thereby improving the manufacturing efficiency. Can do.

また、本発明のリードフレームは、枠における切断経路となる部分に、溝またはスリットなどの切欠部が設けられていることを特徴とし、これにより、溝やスリットなどの切欠部が設けられていないものと比較して、枠の切断体積を減少させることができ、切断作業の容易化を図ることができるとともに切断手段の刃への金属素材のへばりつきや刃の磨耗などを低減できる。   Further, the lead frame of the present invention is characterized in that a notch such as a groove or a slit is provided in a portion that becomes a cutting path in the frame, and thus a notch such as a groove or a slit is not provided. The cutting volume of the frame can be reduced as compared with the above, and the cutting operation can be facilitated, and the metal material can be prevented from sticking to the blade of the cutting means and the blade can be worn away.

また、本発明のリードフレームは、リードフレームの樹脂封止を行わない面に、封止樹脂の流れ込みを阻止するテープを貼り付けたことを特徴とする。
また、本発明の半導体装置は、前記リードフレームを用いて搭載部に半導体素子が搭載された半導体チップが封止樹脂で封止され、半導体装置の側面にアンテナの切断面が露出されたことを特徴とし、これにより、アンテナが封止樹脂などで覆われたものと比較して、性能が向上する。
The lead frame of the present invention is characterized in that a tape that prevents the sealing resin from flowing in is attached to a surface of the lead frame where resin sealing is not performed.
In the semiconductor device of the present invention, the semiconductor chip on which the semiconductor element is mounted on the mounting portion using the lead frame is sealed with a sealing resin, and the cut surface of the antenna is exposed on the side surface of the semiconductor device. As a feature, this improves the performance as compared with the antenna covered with sealing resin or the like.

また、本発明の半導体装置の製造方法は、前記リードフレームを用いて半導体装置を製造する半導体装置の製造方法であって、半導体素子をリードフレームの搭載部に固着させる固着(ダイスボンド)工程と、半導体素子の入出力用電極とアンテナとを金属ワイヤで電気的に接合させるワイヤボンド工程と、金型の1キャビティーで複数の半導体装置を一括して樹脂封止する一括封止工程と、切断手段で個々の半導体装置に切断、分割する切断分割(ダイシング)工程とを有することを特徴とする。   According to another aspect of the present invention, there is provided a semiconductor device manufacturing method for manufacturing a semiconductor device using the lead frame, wherein the semiconductor element is fixed to a mounting portion of the lead frame. A wire bonding step of electrically joining the input / output electrodes of the semiconductor element and the antenna with a metal wire, a batch sealing step of collectively sealing a plurality of semiconductor devices in one cavity of the mold, And a cutting division (dicing) step of cutting and dividing into individual semiconductor devices by a cutting means.

本発明によれば、枠の少なくとも一部をアンテナとして用いるように構成しているので、リードフレームにおける単位面積あたりの半導体装置の取れ数が多くなり、製造効率を上げることができ、アンテナを内蔵した半導体装置を安価に供給できる。また、半導体装置の外周に配置される枠部分をアンテナとして用いるとともにこのアンテナが外部に露出しているので、半導体装置自体をコンパクトに形成しながら、広い面積にわたって配置できる性能のよいアンテナを得ることができる利点もある。   According to the present invention, since at least a part of the frame is configured to be used as an antenna, the number of semiconductor devices to be taken per unit area in the lead frame is increased, the manufacturing efficiency can be increased, and the antenna is built-in. The manufactured semiconductor device can be supplied at low cost. In addition, since the frame portion arranged on the outer periphery of the semiconductor device is used as an antenna and the antenna is exposed to the outside, an antenna having good performance that can be arranged over a wide area while forming the semiconductor device itself compactly is obtained. There is also an advantage that can be.

以下に、本発明の実施の形態を図面に基づき説明する。
(実施の形態1)
本発明の第1の実施の形態を、図1〜図7を用いて説明する。
Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
A first embodiment of the present invention will be described with reference to FIGS.

図1(a)および(b)は第1の実施の形態に係るリードフレームの平面図および正面図、図2(a)〜(c)は同リードフレームを用いて製造した半導体装置の平面図、正面図および下面図である。なお、図面において見分けやすくするために、封止樹脂によるモールド箇所を灰色のハッチング部で示している。   1A and 1B are a plan view and a front view of the lead frame according to the first embodiment, and FIGS. 2A to 2C are plan views of a semiconductor device manufactured using the lead frame. They are a front view and a bottom view. In addition, in order to make it easy to distinguish in a drawing, the mold location by sealing resin is shown with the gray hatching part.

まず、図2(a)〜(c)を参照しながら、本発明に係るリードフレーム1(図1参照)を用いて製造する半導体装置について説明する。図2に示すように、半導体装置は、半導体素子6と、この半導体素子6を搭載するリードフレーム1の搭載部2と、半導体装置の完成時にアンテナ12となる部分と、アンテナ12の両端のワイヤボンド部12aと半導体素子6の入出力用電極とを電気的に接続する金属ワイヤ7と、半導体素子6などを封止する封止樹脂8などから構成されている。   First, a semiconductor device manufactured by using the lead frame 1 (see FIG. 1) according to the present invention will be described with reference to FIGS. As shown in FIG. 2, the semiconductor device includes a semiconductor element 6, a mounting portion 2 of a lead frame 1 on which the semiconductor element 6 is mounted, a portion that becomes an antenna 12 when the semiconductor device is completed, and wires at both ends of the antenna 12. A metal wire 7 that electrically connects the bond portion 12a and the input / output electrodes of the semiconductor element 6 and a sealing resin 8 that seals the semiconductor element 6 and the like are included.

図1(a)、(b)における1は銅板などの金属板を打ち抜いたり、エッチングしたりして形成したリードフレームであり、このリードフレーム1には、縦方向と横方向の何れか一方向または両方向に複数列の半導体装置となるパターンが配置されている。ここで、図1に示す場合には、1枚のリードフレーム1に、縦横それぞれ2列の半導体装置となるパターンが設けられている。リードフレーム1の各パターンは、半導体素子6を搭載する島状の搭載部2と、搭載部2の周りの空間である開口窓部4を介して搭載部2を外側から所定間隔をあけて囲むように設けられ、半導体装置が形成される領域を区分する矩形状の枠3と、搭載部2から枠3の一辺(図1(a)においては、表示面に対して下方となる辺)に向けて延びて搭載部2を枠3に物理的に繋げて保持する吊りリード5とを有している。また、枠3における吊りリード5が繋がっている箇所の両側方部分から、所定間隙をあけてそれぞれ搭載部2に近接するように延びるリード部3aが形成されているが、このリード部3aと吊りリード5との間の凹形状の空隙部(開口窓部4に続く空隙部分)4aは、枠3側に食い込むように深く形成されている。   1A and 1B, reference numeral 1 denotes a lead frame formed by punching or etching a metal plate such as a copper plate. The lead frame 1 has one of a vertical direction and a horizontal direction. Alternatively, a pattern that becomes a plurality of rows of semiconductor devices is arranged in both directions. Here, in the case shown in FIG. 1, a single lead frame 1 is provided with a pattern that forms two rows of semiconductor devices vertically and horizontally. Each pattern of the lead frame 1 surrounds the mounting portion 2 with a predetermined interval from the outside via an island-shaped mounting portion 2 on which the semiconductor element 6 is mounted and an opening window portion 4 that is a space around the mounting portion 2. The rectangular frame 3 that divides the region where the semiconductor device is formed, and one side of the frame 3 from the mounting portion 2 (the side that is lower than the display surface in FIG. 1A). It has a suspension lead 5 that extends toward and holds the mounting portion 2 physically connected to the frame 3. Further, lead portions 3a extending from both side portions of the frame 3 where the suspension leads 5 are connected to each other so as to be close to the mounting portion 2 with a predetermined gap therebetween are formed. A concave gap portion (a gap portion following the opening window portion 4) 4a between the lead 5 and the lead 5 is formed deep so as to bite into the frame 3 side.

枠3は、組立工程での取り扱いに耐えるに必要な強度を有すると同時に、製品完成時には製品(半導体装置)のアンテナ12として機能する。なお、理解しやすいように、図1(a)における右上の半導体装置に対応する箇所のアンテナ12となる位置のみ図示する。また、後述するが、枠3における前記リード部3aはアンテナ12の一部として機能し、さらにリード部3aの先端が、金属ワイヤ7の一端が接続されるワイヤボンド部12aとして機能する。   The frame 3 has a strength necessary to withstand handling in the assembly process, and at the same time functions as an antenna 12 of the product (semiconductor device) when the product is completed. For easy understanding, only the position to be the antenna 12 at the location corresponding to the upper right semiconductor device in FIG. As will be described later, the lead portion 3a in the frame 3 functions as a part of the antenna 12, and the tip of the lead portion 3a functions as a wire bond portion 12a to which one end of the metal wire 7 is connected.

次に、このリードフレーム1を用いてアンテナ12を有する半導体装置を製造する各工程について説明する。
まず、図3(a)、(b)に示すように、リードフレーム1の搭載部2に半導体素子6をダイスボンド(固着)する(固着(ダイスボンド)工程)。
Next, each step of manufacturing a semiconductor device having the antenna 12 using the lead frame 1 will be described.
First, as shown in FIGS. 3A and 3B, the semiconductor element 6 is die-bonded (fixed) to the mounting portion 2 of the lead frame 1 (adhesion (die-bonding) step).

次に、図4(a)、(b)に示すように、ダイスボンド後に、半導体素子6の内部回路との入出力用電極とアンテナ12のワイヤボンド部12a(リード部3aの先端)を結ぶ金属ワイヤ7をワイヤボンドして電気的に接合させる(ワイヤボンド工程)。   Next, as shown in FIGS. 4A and 4B, after die bonding, the input / output electrodes for the internal circuit of the semiconductor element 6 and the wire bond portion 12a of the antenna 12 (tip of the lead portion 3a) are connected. The metal wire 7 is wire-bonded and electrically joined (wire bonding process).

そして、ワイヤボンド後に、図5(a)、(b)に示すように、金型の1キャビティーで複数の半導体装置を封止樹脂8で一括封止する(一括封止工程)。ここで、図5は封止した状態を示すもので波線内が樹脂封止された領域である。実際には、封止樹脂8は不透明であるので、半導体素子6等の中身は見えない。なお、この一括封止は半導体素子6を側のみ行う片面封止であってもよいし、リードフレーム1を上下から挟み込む形での両面封止であってもよい。図5において片面封止の状態を示す。この樹脂封止により半導体装置の内部は樹脂により固定される。   Then, after wire bonding, as shown in FIGS. 5A and 5B, a plurality of semiconductor devices are collectively sealed with a sealing resin 8 in one cavity of the mold (collective sealing step). Here, FIG. 5 shows a sealed state, and the inside of the wavy line is a region sealed with resin. Actually, since the sealing resin 8 is opaque, the contents of the semiconductor element 6 and the like cannot be seen. The collective sealing may be single-side sealing in which the semiconductor element 6 is performed only on the side, or may be double-side sealing in which the lead frame 1 is sandwiched from above and below. FIG. 5 shows a state of single-side sealing. By this resin sealing, the inside of the semiconductor device is fixed with resin.

最後に、図6(a)〜(c)に示すように、切断手段としてのダイシングソー9で個々の半導体装置に切断、分割する(切断分割(ダイシング)工程)。なお、半導体装置は樹脂により固定されているので、この切断分割で切断されても封止樹脂内部の構造物は固定された状態で保持される。   Finally, as shown in FIGS. 6A to 6C, each semiconductor device is cut and divided by a dicing saw 9 as a cutting means (cutting division (dicing) step). Since the semiconductor device is fixed by resin, the structure inside the sealing resin is held in a fixed state even if the semiconductor device is cut by this cutting division.

ここで、前記リードフレーム1の枠3の幅は、ダイシングソー9の刃の厚みよりも大きく形成されており、図6に示すように、個々の半導体装置において、開口窓部4の周りに枠3が所定幅で残るように切断する。ここで、図6における10は、ダイシングソー9による切断経路であり、前記所定幅で残った枠3の部分、すなわち、枠3における開口窓部4と切断経路10との間の部分がアンテナ12として用いられる。このように、切断はダイシングソー9の刃の厚み分が除去される状態で行われ、この刃の厚みは個々の半導体装置における枠3の幅以下なので枠3における残った部分が半導体装置の中にアンテナ12として取り込まれる。   Here, the width of the frame 3 of the lead frame 1 is formed to be larger than the thickness of the blade of the dicing saw 9, and as shown in FIG. Cut so that 3 remains with a predetermined width. Here, 10 in FIG. 6 is a cutting path by the dicing saw 9, and the portion of the frame 3 remaining with the predetermined width, that is, the portion between the opening window 4 and the cutting path 10 in the frame 3 is the antenna 12. Used as In this way, the cutting is performed in a state where the thickness of the blade of the dicing saw 9 is removed. Since the thickness of the blade is equal to or less than the width of the frame 3 in each semiconductor device, the remaining portion in the frame 3 is in the semiconductor device. Is taken in as an antenna 12.

また、図6(a)〜(c)に示すように、搭載部2を枠3に繋げる吊りリード5の一部が切断経路10に重なるように形成されており、半導体装置に切断、分割する作業により、吊りリード5が枠3に繋がっている部分も切断されて搭載部2がアンテナ12となる部分から電気的に分離される。したがって、ダイシング後の完成時には半導体装置としてアンテナ12とチップ裏面が絶縁状態となった半導体装置が提供されることになる。なお、図6(b)、(c)における11は、半導体装置が載せられる切断用載置台である。   Further, as shown in FIGS. 6A to 6C, a part of the suspension lead 5 that connects the mounting portion 2 to the frame 3 is formed so as to overlap the cutting path 10, and is cut and divided into semiconductor devices. By the work, the portion where the suspension lead 5 is connected to the frame 3 is also cut, and the mounting portion 2 is electrically separated from the portion that becomes the antenna 12. Therefore, when completed after dicing, a semiconductor device in which the antenna 12 and the back surface of the chip are insulated is provided as a semiconductor device. Note that reference numeral 11 in FIGS. 6B and 6C denotes a cutting table on which the semiconductor device is mounted.

ここで、図7(a)、(b)に比較例としてのリードフレーム13を示す。このリードフレーム13では、枠3とアンテナ12とが別個に設けられており、アンテナ12および搭載部2が、枠3から延びる吊りリード16で保持されている。そして、枠3および吊りリード16を切断するように、ダイシングソー9により切断、分割される。なお、図7(a)、(b)における14はダイシングソー9による切断経路であり、枠3の幅は本実施の形態の枠3と同じ大きさで示している。   Here, FIGS. 7A and 7B show a lead frame 13 as a comparative example. In the lead frame 13, the frame 3 and the antenna 12 are provided separately, and the antenna 12 and the mounting portion 2 are held by suspension leads 16 extending from the frame 3. Then, the dicing saw 9 cuts and divides the frame 3 and the suspension leads 16. 7 (a) and 7 (b) is a cutting path by the dicing saw 9, and the width of the frame 3 is shown as the same size as the frame 3 of the present embodiment.

本発明の実施の形態に係るリードフレーム1によれば、リードフレーム1の枠3の一部をアンテナ12として共用するので、図7に示すような、枠3とアンテナ12とをそれぞれ別個に設けたリードフレーム13と比較して、後工程で除去する部分が少なくなって、リードフレーム1における単位面積あたりの半導体装置の取れ数が多くなり、製造効率を上げることができる。   According to the lead frame 1 according to the embodiment of the present invention, since a part of the frame 3 of the lead frame 1 is shared as the antenna 12, the frame 3 and the antenna 12 are provided separately as shown in FIG. Compared to the lead frame 13, the number of parts to be removed in the subsequent process is reduced, the number of semiconductor devices to be taken per unit area in the lead frame 1 is increased, and the manufacturing efficiency can be increased.

また、図7に示す場合であれば、4つの半導体装置を得るために、8つの切断経路14の切削作業が必要となるが、これと比較して本実施の形態では6つの切断経路11の切削作業だけで済む。すなわち、2つの半導体装置間の切断を、図7に示す比較例では2つの切断経路14が必要であるが、これに対して、本実施の形態では1の切断経路11で行うことができる。これにより、切断分割工程を能率良く、短時間で行える。   Further, in the case shown in FIG. 7, in order to obtain four semiconductor devices, the cutting operation of the eight cutting paths 14 is necessary. In this embodiment, however, the six cutting paths 11 are compared. Only cutting work is required. That is, in the comparative example shown in FIG. 7, two cutting paths 14 are necessary for cutting between two semiconductor devices. On the other hand, in this embodiment, one cutting path 11 can be used. Thereby, a cutting | disconnection division process can be performed efficiently and in a short time.

また、樹脂でリードフレーム1の片面のみを封止した場合には半導体装置を切断して各半導体装置に分割すると、枠3(アンテナ12)の切断面が必ず露出するので、アンテナが封止樹脂などで覆われたものと比較して、性能が向上する利点もある。   Further, when only one side of the lead frame 1 is sealed with resin, if the semiconductor device is cut and divided into each semiconductor device, the cut surface of the frame 3 (antenna 12) is necessarily exposed, so that the antenna is sealed resin. There is also an advantage that the performance is improved as compared with those covered with the above.

さらに、本実施の形態のリードフレーム1によれば、リード部3aと吊りリード5との間の凹形状の空隙部4aを枠3側に食い込むように深く形成して、搭載部2を枠3に繋げる吊りリード5の一部が切断経路10に重なるようにしたので、枠3における切断経路10に沿って切断した際に、吊りリード5も切断されて搭載部2がアンテナ12となる部分から電気的に分離される。したがって、この後、搭載部2とアンテナ12とを電気的に分離させる作業を個別に行わなくても済み、製造効率を上げることができる。
(実施の形態2)
本発明の第2の実施の形態を、図8を用いて説明する。
Furthermore, according to the lead frame 1 of the present embodiment, the concave portion 4a between the lead portion 3a and the suspension lead 5 is formed deep so as to bite into the frame 3 side, and the mounting portion 2 is formed in the frame 3. Since part of the suspension lead 5 connected to the cutting path 10 overlaps with the cutting path 10, when the cutting is performed along the cutting path 10 in the frame 3, the suspension lead 5 is also cut and the mounting portion 2 becomes the antenna 12. Electrically separated. Therefore, after that, it is not necessary to individually perform the work of electrically separating the mounting portion 2 and the antenna 12, and the manufacturing efficiency can be increased.
(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIG.

図8(a)および(b)は第2の実施の形態に係るリードフレームの平面図および正面図である。この実施の形態では、リードフレーム1の枠3における切断経路10の一部に切欠孔または薄肉部からなる切欠部15が設けられている。この切欠部15は、薄肉部からなる溝で構成してもよいし、完全に打ち抜いたり、エッチングしたりして形成したスリットで構成してもよく、その形状も長方形状に限るものではない。   8A and 8B are a plan view and a front view of the lead frame according to the second embodiment. In this embodiment, a cutout portion 15 formed of a cutout hole or a thin portion is provided in a part of the cutting path 10 in the frame 3 of the lead frame 1. The notch 15 may be formed by a groove formed of a thin portion, or may be formed by a slit formed by being completely punched or etched, and the shape is not limited to a rectangular shape.

この構成によれば、ダイシングし難い金属部分が少なくなり、ダイシングによる切断作業を容易にすることができる。つまり、リードフレーム1は金属としては柔らかく塑性がある銅素材が用いられるため、ダイシングソー9の刃に銅素材がへばり付いて切れ味を悪くする。したがって、切断する金属は少ない方が望ましい。上記構成によれば、枠3における切断経路10に溝やスリットなどの切欠部15が設けられていないものと比較して、枠3の切断体積を減少させることができるので、切断作業の容易化を図ることができるとともにダイシングソー9の刃への銅素材のへばりつきや刃の磨耗などを低減できる。
(実施の形態3)
本発明の第3の実施の形態を、図9を用いて説明する。
According to this configuration, the number of metal parts that are difficult to dice is reduced, and cutting work by dicing can be facilitated. That is, since the lead frame 1 is made of a soft and plastic copper material as the metal, the copper material sticks to the blade of the dicing saw 9 and the sharpness is deteriorated. Therefore, it is desirable that less metal is cut. According to the above configuration, the cutting volume of the frame 3 can be reduced as compared with a case in which the cutting path 10 in the frame 3 is not provided with a notch 15 such as a groove or a slit. In addition, the sticking of the copper material to the blade of the dicing saw 9 and the wear of the blade can be reduced.
(Embodiment 3)
A third embodiment of the present invention will be described with reference to FIG.

図9(a)および(b)は第3の実施の形態に係るリードフレームの平面図および正面図である。この実施の形態は、樹脂封止工程時に片面のみが樹脂封止される半導体装置に適用されるものであり、リードフレーム1の上側半分のみを封止する際に、アンテナ12や半導体素子6の搭載部2の裏面側に封止樹脂8が漏れて樹脂バリが付着するのを防止するために、耐熱性を有する、例えばポリイミドのテープ18をリードフレーム1の裏面全面に貼り付けている。なお、図9において、区別しやすいように、テープ18が見える箇所をハッチング部で示す。   FIGS. 9A and 9B are a plan view and a front view of a lead frame according to the third embodiment. This embodiment is applied to a semiconductor device in which only one surface is resin-sealed at the time of the resin-sealing process. When only the upper half of the lead frame 1 is sealed, the antenna 12 and the semiconductor element 6 are In order to prevent the sealing resin 8 from leaking to the back surface side of the mounting portion 2 and adhering resin burrs, heat-resistant, for example, polyimide tape 18 is attached to the entire back surface of the lead frame 1. In addition, in FIG. 9, the part which can see the tape 18 is shown by a hatching part so that it can distinguish easily.

このように、片面のみ樹脂封止を行う場合に、リードフレーム1の裏面(半導体素子6の搭載面2の逆面)に一括封止時の熱(約180℃)に耐えるテープ18を貼り付けることで、封止樹脂8がリードフレーム1の裏面に回り込んで樹脂バリとなることを防止でき、半導体装置としての製品の品質を向上させることができる。   In this way, when resin sealing is performed only on one side, a tape 18 that can withstand heat (about 180 ° C.) during batch sealing is attached to the back surface of the lead frame 1 (opposite surface of the mounting surface 2 of the semiconductor element 6). Thus, the sealing resin 8 can be prevented from flowing around the back surface of the lead frame 1 and becoming a resin burr, and the quality of a product as a semiconductor device can be improved.

なお、この耐熱性を有するテープ18はダイシング前に剥がしてもよい。また、剥がさずに封止樹脂8と一緒にダイシング工程で切断して、製品の一部としてもよい。
なお、上記実施の形態では、1枚のリードフレーム1に、縦横それぞれ2列の半導体装置となるパターンが配置されている場合を述べたが、これに限るものではなく、リードフレーム1における縦方向および横方向に半導体装置のパターンが何個並べられていてもよく、図10に示すように、長尺のテープ形状からなるリードフレームに適用することも可能である。また、アンテナ12や搭載部2の形状は上記形状に限られるものではないが、アンテナ12を半導体装置の外周に臨むように形成させることにより、半導体装置自体をコンパクトに形成しながら、広い面積にわたって配置できる性能のよいアンテナ12を得ることができる利点もある。また、上記実施の形態では、封止工程においてリードフレーム1全体を一括して封止する場合を述べ、この場合には、生産能率が向上する利点があるが、これに限るものではなく、それぞれの半導体装置の領域ごとに封止することも可能である。さらに、上記実施の形態では、切断手段としてダイシングソー9を用いた場合を述べたが、これ以外の切断手段を用いることも可能である。
The heat-resistant tape 18 may be peeled off before dicing. Moreover, it is good also as a part of product by cut | disconnecting by the dicing process with sealing resin 8 without peeling.
In the above-described embodiment, the case in which the patterns of the semiconductor devices in two rows each in the vertical and horizontal directions are arranged on one lead frame 1 is not limited to this, but the vertical direction in the lead frame 1 is described. Any number of semiconductor device patterns may be arranged in the horizontal direction, and as shown in FIG. 10, the present invention can be applied to a lead frame having a long tape shape. In addition, the shape of the antenna 12 and the mounting portion 2 is not limited to the above shape, but by forming the antenna 12 so as to face the outer periphery of the semiconductor device, the semiconductor device itself can be formed in a compact manner and over a wide area. There is also an advantage that the antenna 12 with good performance that can be arranged can be obtained. In the above embodiment, a case where the entire lead frame 1 is collectively sealed in the sealing step is described. In this case, there is an advantage that the production efficiency is improved, but the present invention is not limited to this. It is also possible to seal each region of the semiconductor device. Furthermore, in the above embodiment, the case where the dicing saw 9 is used as the cutting means has been described. However, other cutting means can be used.

本発明はアンテナを内蔵する半導体装置組立部材用のリードフレームとして特に有用である。   The present invention is particularly useful as a lead frame for a semiconductor device assembly member incorporating an antenna.

(a)および(b)は本発明の第1の実施の形態に係るリードフレームの平面図および正面図(A) And (b) is the top view and front view of a lead frame which concern on the 1st Embodiment of this invention. (a)〜(c)は同リードフレームを用いて製造した半導体装置の平面図、正面図および下面図(下方から見た図) なお、封止樹脂のモールドを灰色のハッチング部で示し、実際の封止部は内部が見えないがこの図では内部を示している。(A)-(c) are the top view of the semiconductor device manufactured using the lead frame, the front view, and the bottom view (figure seen from the bottom) In addition, the mold of sealing resin is shown by the gray hatching part, and actually Although the inside of the sealing part cannot be seen, this figure shows the inside. (a)および(b)は同実施の形態におけるダイスボンド後のリードフレームの状態を示す平面図および正面図(A) And (b) is the top view and front view which show the state of the lead frame after the die bonding in the same embodiment (a)および(b)は同実施の形態におけるワイヤボンド後のリードフレームの状態を示す平面図および正面図(A) And (b) is the top view and front view which show the state of the lead frame after the wire bond in the same embodiment (a)および(b)は同実施の形態における一括封止後のリードフレームの状態を示す平面図および正面図(なお、封止樹脂のモールドを灰色のハッチング部で示し、実際の封止部は内部が見えないがこの図では内部を示している。)(A) And (b) is a plan view and a front view showing the state of the lead frame after collective sealing in the same embodiment (note that the mold of the sealing resin is shown by a gray hatching portion, and the actual sealing portion Can not see the inside, but this figure shows the inside.) (a)〜(c)は同実施の形態におけるダイシングしているリードフレームの状態を示す平面図、正面図および側面図(なお、封止樹脂のモールドを灰色のハッチング部で示し、実際の封止部は内部が見えないがこの図では内部を示している。)(A)-(c) is the top view which shows the state of the lead frame which is dicing in the embodiment, a front view, and a side view (In addition, the mold of sealing resin is shown by a gray hatching part, (The inside of the stop is not shown, but this figure shows the inside.) (a)および(b)は比較例としての、強度を保つ枠とアンテナとを分離して設計したリードフレームの平面図および正面図(A) And (b) is a plan view and a front view of a lead frame designed as a comparative example by separating the strength maintaining frame and the antenna. (a)および(b)は本発明の第2の実施の形態に係るリードフレームの平面図および正面図(A) And (b) is the top view and front view of a lead frame which concern on the 2nd Embodiment of this invention. (a)および(b)は本発明の第3の実施の形態に係るリードフレームの平面図および正面図(A) And (b) is the top view and front view of a lead frame which concern on the 3rd Embodiment of this invention. 従来の半導体装置の平面図Plan view of a conventional semiconductor device

符号の説明Explanation of symbols

1 リードフレーム
2 搭載部
3 枠
4 開口窓部
5 吊りリード
6 半導体素子
7 金属ワイヤ
8 封止樹脂
9 ダイシングソー(切断手段)
10 切断経路
12 アンテナ
12a ワイヤボンド部
15 切欠部
18 テープ
DESCRIPTION OF SYMBOLS 1 Lead frame 2 Mounting part 3 Frame 4 Opening window part 5 Hanging lead 6 Semiconductor element 7 Metal wire 8 Sealing resin 9 Dicing saw (cutting means)
DESCRIPTION OF SYMBOLS 10 Cutting path 12 Antenna 12a Wire bond part 15 Notch part 18 Tape

Claims (7)

アンテナを有する半導体装置用として用いられるリードフレームであって、
所定方向に複数列の半導体装置となるパターンが形成され、
半導体素子を搭載する搭載部と、
開口窓部を介して搭載部を囲むように設けられ、半導体装置が形成される領域を区分する枠とを有し、
前記枠の少なくとも一部がアンテナとして用いられるように構成されているリードフレーム。
A lead frame used for a semiconductor device having an antenna,
A pattern that becomes a plurality of rows of semiconductor devices in a predetermined direction is formed,
A mounting portion for mounting a semiconductor element;
A frame that is provided so as to surround the mounting portion through the opening window, and that divides a region where the semiconductor device is formed;
A lead frame configured such that at least a part of the frame is used as an antenna.
枠に切断経路となる部分が設けられ、枠における開口窓部と切断経路との間の部分がアンテナとして用いられる請求項1記載のリードフレーム。   The lead frame according to claim 1, wherein the frame is provided with a portion serving as a cutting path, and a portion of the frame between the opening window and the cutting path is used as an antenna. 搭載部を枠に繋げる吊りリードの一部が切断経路に重なるように形成されている請求項2記載のリードフレーム。   The lead frame according to claim 2, wherein a part of the suspension lead that connects the mounting portion to the frame is formed to overlap the cutting path. 枠における切断経路となる部分に切欠部が設けられている請求項2または3に記載のリードフレーム。   The lead frame according to claim 2, wherein a notch portion is provided in a portion that becomes a cutting path in the frame. リードフレームの樹脂封止を行わない面に、封止樹脂の流れ込みを阻止するテープを貼り付けた請求項1〜4の何れか1項に記載のリードフレーム。   The lead frame according to any one of claims 1 to 4, wherein a tape that prevents the sealing resin from flowing in is attached to a surface of the lead frame that is not sealed with resin. 請求項1〜5の何れか1項に記載のリードフレームを用いて搭載部に半導体素子が搭載された半導体チップが封止樹脂で封止され、半導体装置の側面にアンテナの切断面が露出した半導体装置。   A semiconductor chip on which a semiconductor element is mounted on the mounting portion is sealed with a sealing resin using the lead frame according to claim 1, and a cut surface of the antenna is exposed on a side surface of the semiconductor device. Semiconductor device. 請求項1〜5の何れか1項に記載のリードフレームを用いて半導体装置を製造する半導体装置の製造方法であって、半導体素子をリードフレームの搭載部に固着させる固着工程と、半導体素子の入出力用電極とアンテナとを金属ワイヤで電気的に接合させるワイヤボンド工程と、金型の1キャビティーで複数の半導体装置を一括して樹脂封止する一括封止工程と、切断手段で個々の半導体装置に切断、分割する切断分割工程とを有する半導体装置の製造方法。   A semiconductor device manufacturing method for manufacturing a semiconductor device using the lead frame according to claim 1, wherein the semiconductor element is fixed to a mounting portion of the lead frame; A wire bonding process for electrically joining the input / output electrodes and the antenna with a metal wire, a batch sealing process for collectively sealing a plurality of semiconductor devices in one cavity of a mold, and a cutting means. A method for manufacturing a semiconductor device, comprising: a cutting and dividing step of cutting and dividing the semiconductor device.
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