JP2006059999A - Printed-wiring board and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed-wiring board comprising a material having a low dielectric loss tangent, a high glass-transition temperature, high flame retardance hard to increase a dielectric constant and the dielectric loss tangent in a high-humidity environment, and to provide an electronic component. <P>SOLUTION: Each the printed-wiring board and the electronic component comprises an epoxy resin; a polyester comprising an aromaic multiple carboxylic residue, and an aromatic multiple hydroxy compound residue having an aryloxy carbonyl group or an aryl carbonyl oxide group at a molecular chain end; a resin layer composed of at least one of an insulating layer comprising an organic insulating material including a hardening accelerator and a flame retardant, and a dielectric layer further including dielectric powder and a surface preparation agent in the organic insulating material; and at least one conductive element provided at least one of the insulating layer and the dielectric layer of the resin layer, and constituting a capacitor element or an inductor element. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a printed wiring board and an electronic component, and more particularly to a printed wiring board and an electronic component useful in a high frequency region.

  In recent years, with the rapid increase in communication information and the addition of functions, various characteristics have been demanded more severely for printed wiring boards, electronic parts, and the like. For example, in mobile mobile communications and satellite communications, radio waves in a high frequency range such as a gigahertz band are used, and in order to cope with radio waves in such a high frequency range, in printed wiring boards and electronic components, Is required to have low transmission loss.

  The transmission loss is obtained as the sum of dielectric loss and conductor loss as shown in Equation 1. As shown in Formula 2, the dielectric loss becomes lower as the dielectric constant and dielectric loss tangent are lower. For this reason, it is necessary to make a dielectric constant and a dielectric loss tangent low. A material having such characteristics is useful as a material for forming the wiring and the inductor element.

(Formula 1)
(Transmission loss) = (Dielectric loss) + (Conductor loss)

(Formula 2)
(Dielectric loss) = (Coefficient) x (Frequency) x (Dielectric constant) ^1/2 x (Dielectric loss tangent)

  In addition, with the rapid increase in communication information and the addition of functions, there is a strong demand for circuit miniaturization in communication devices. In order to reduce the size of the circuit, it is necessary to increase the capacitance value per unit area and reduce the electrode area when incorporating a circuit such as a capacitor element in addition to the multilayering of the circuit.

  As shown in Formula 3, the capacitance value is obtained by the product of the dielectric constant per thickness of the insulating layer and the electrode area. For this reason, it is effective to increase the dielectric constant in order to increase the capacitance value. It is advantageous to use a material having such characteristics as a material for forming a capacitor element, a resonator, or the like.

(Formula 3)
(Capacitance value) = (dielectric constant) × (electrode area) / (insulating layer thickness)

  Thus, for printed wiring boards and electronic components, in order to reduce transmission loss in the high frequency region, it is desirable to use a material having a low dielectric constant and dielectric loss tangent, and in order to achieve circuit miniaturization, A balanced material with a high dielectric constant and low dielectric loss tangent is desired.

  In addition, if the change in electrical characteristics due to the environment is large, it is unsuitable for an element that contributes to a resonator or a filter. Therefore, a material having a small change due to the environment is desired when used as such an element.

  Therefore, in order to achieve the high dielectric constant and low dielectric loss tangent of the dielectric layer while satisfying the basic performance required for the printed wiring board and the electronic component, the insulating material constituting the dielectric layer of the printed wiring board and the electronic component It is known to use a material obtained by dispersing a dielectric ceramic powder in a polyvinyl benzyl ether compound (see, for example, Patent Document 1).

  By the way, an epoxy resin excellent in electrical characteristics, mechanical characteristics, adhesiveness, and the like is used as an insulating material for a multilayer board used for printed wiring boards, electronic components, and the like. As a curing agent for this epoxy resin, compounds having active hydrogen such as amine compounds and phenol compounds are used. However, when an epoxy resin is cured using a curing agent having these active hydrogens, a highly polar hydroxy group is generated by the reaction between the epoxy group and the active hydrogen, which may lower the dielectric loss tangent. Have difficulty.

  For this reason, in order not to generate a highly polar hydroxyl group, for example, a method of using an ester compound composed of a carboxylic acid and an aromatic hydroxy compound as a curing agent for an epoxy resin has been proposed (for example, Patent Document 2). reference). This method utilizes the fact that the ester bond of an ester compound comprising a carboxylic acid and an aromatic hydroxy compound has a high reaction activity with respect to the epoxy group, and the epoxy resin is cured using this ester compound as a curing agent. In this case, since a highly polar hydroxy group is not generated, the obtained cured product can exhibit a low dielectric loss tangent. As such an ester compound, an ester compound of phthalic acid or trimellitic acid and a phenol, an ester compound of benzoic acid and bisphenol A or bisphenol S, or an ester compound of benzoic acid and a phenol resin are known. Yes.

  However, since these ester compounds have highly active ester bonds only at the ends of the molecules or molecular chains, the resulting epoxy resin cured product does not have a high crosslinking density, and hydrogen bonds are formed inside the cured product. Therefore, an epoxy resin cured product having a high glass transition temperature that can withstand lead-free soldering cannot be obtained. For this reason, the epoxy resin hardened | cured material which has high glass transition temperature (Tg) which can endure lead-free soldering was not able to be obtained. In particular, epoxy resin cured products using an ester of benzoic acid and an aromatic hydroxy compound as a curing agent are low molecular weight carboxylic acids when the benzoic ester bond formed by the curing reaction is hydrolyzed by moisture absorption. Since some benzoic acid is liberated, there is a problem that the dielectric loss tangent increases in a high humidity environment.

  Among ester compounds that have high reaction activity with respect to epoxy groups, as ester compounds that give cured epoxy resins with high glass transition temperatures, all ester bonds that form molecular chains are reactive with epoxy groups. There are known polyfunctional polyesters having, for example, a polyfunctional polyester obtained from an aromatic dicarboxylic acid and an aromatic dihydroxy compound (see, for example, Patent Document 3). When such an epoxy resin is cured using such a polyfunctional polyester as a curing agent, since all ester bonds that form molecular chains can participate in the curing reaction, the crosslinking density of the cured epoxy resin is high. Thus, the glass transition temperature can be increased.

  However, since both ends of the molecular chain of such a polyfunctional polyester are highly polar hydroxy groups or carboxy groups, when this polyfunctional polyester is used as a curing agent for an epoxy resin, the hydroxy groups are In addition to remaining in the cured product, the carboxy group reacts with the epoxy group to produce a hydroxy group, making it difficult to reduce the dielectric loss tangent of the cured epoxy resin. In addition, when unreacted carboxy groups remain in the cured product, the low molecular weight aromatic dicarboxylic acid having carboxy groups is liberated by hydrolysis due to moisture absorption, and the dielectric loss tangent increases in a high humidity environment. was there. Furthermore, when phthalic acid or bisphenol having no bulky structure is used as the aromatic dicarboxylic acid or aromatic dihydroxy compound, the resulting polyester is easily crystallized, and the solvent for the resin composition containing the polyester There was a problem that sufficient solubility was not obtained.

  In addition, as in the case of the polyfunctional polyester, the ester compound in which all ester bonds forming a molecular chain can participate in the curing reaction includes both an aromatic polyvalent carboxylic acid and an aromatic polyvalent hydroxy compound. There is a polyester obtained by esterifying a hydroxy group with a monocarboxylic acid of a polyester having a hydroxy group at the terminal (for example, see Patent Document 4). When such a polyester is used as a curing agent to cure the epoxy resin, the glass transition temperature can be increased, and the hydroxy group at the end of the molecular chain is esterified with a monocarboxylic acid, so the epoxy resin is cured. When produced, a highly polar hydroxy group is not produced.

  However, since the molecular chain end of such a polyester is an alkylcarbonyloxy group or an arylcarbonyloxy group, when this polyester is used as a curing agent, a low molecular weight carboxylic acid is easily liberated by hydrolysis. Therefore, the dielectric loss tangent is not lowered, and there is a problem that the dielectric constant and the dielectric loss tangent increase in a high humidity environment.

In addition, when using an epoxy resin cured material as a material for electrical insulation, flame retardance is required so that it does not easily burn due to electric leakage or short circuit, but the above-mentioned polyester is inferior in flame retardancy. There was a point.
JP 2001-247733 A JP 62-53327 A JP-A-5-51517 JP-A-10-101775

  Thus, a resin composition using a conventional ester compound as a curing agent has a low dielectric loss tangent, a high glass transition temperature, and a high flame retardancy. For this reason, printed wiring boards and electronic parts made of materials capable of realizing characteristics such as low dielectric loss tangent, high glass transition temperature, and high flame retardance have been demanded.

  The present invention has been made in view of the above circumstances, and is made of a material having a low dielectric loss tangent, a high glass transition temperature, a low dielectric constant and a dielectric loss tangent in a high humidity environment, and a high flame retardancy. An object is to provide a configured printed wiring board and an electronic component.

In order to achieve the above object, a printed wiring board according to the first aspect of the present invention includes:
Polyester comprising an aromatic polyvalent carboxylic acid residue and an aromatic polyvalent hydroxy compound residue having an aryloxycarbonyl group or an arylcarbonyloxy group at the molecular chain end, an epoxy resin, a curing accelerator, and a flame retardant The resin layer which consists of a resin composition containing these is provided, It is characterized by the above-mentioned.

The aromatic polyvalent hydroxy compound residue is at least one group selected from the group consisting of groups represented by the following formulas (1) to (4),
The aromatic polyvalent carboxylic acid residue is at least one group selected from the group consisting of groups represented by the following formulas (5) to (7),
The aryloxycarbonyl group or the aryl group in the arylcarbonyloxy group is preferably at least one aryl group selected from the group consisting of groups represented by the following formulas (8) to (10).

（１）

（式（１）中、ｋは０または１である。）

(1)

(In formula (1), k is 0 or 1.)

（２）

(2)

(In formula (2), Y represents an oxygen atom, a methylene group, a methylene group substituted with an alkyl group having 1 to 4 carbon atoms, a methylene group substituted with a phenyl group, a methylene group substituted with a naphthyl group, or a biphenyl group. Represents a methylene group substituted with a 9-fluorenyl group, a methylene group substituted with a phenyl group, a naphthyl group, or a biphenyl group with an alkyl group having 1 to 4 carbon atoms. n and m each represents an integer of 1 to 3)

（３）

(3)

（４）

(4)

（５）

(5)

（６）

(6)

（７）

(7)

(In the formula, A, B, D, E, and G are substituents, and each represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom. A, e, and g each represent B and d each represent an integer of 0 to _3. X represents a single bond, —S—, —O—, —CO—, —CH ₂ —, —C (CH ₃ ) _2. -, or -SO ₂ - represents a).

（８）

(8)

（９）

(9)

（１０）

(10)

(In the formula, P, Q, R, T, and U are substituents and each represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a nitro group, or a halogen atom. P, r Is an integer of 0-5, q, t is an integer of 0-4, u is an integer of 0-3, Z is a single bond, —O—, —CO—, —CH ₂ —, —C (CH ₃ ) _2- or -SO _2- .

  It is preferable to include at least one conductive element portion provided on the resin layer and constituting a capacitor element or an inductor element.

  The flame retardant is preferably a brominated aromatic flame retardant. The flame retardant is preferably ethane-1,2-bis (bentabromophenyl). The resin composition may contain at least one of a styrene elastomer and a polybutadiene polymer.

  At least one layer may include a resin layer containing the resin composition and a dielectric ceramic powder having a relative dielectric constant larger than that of the resin composition.

  Examples of the dielectric ceramic powder include at least one metal selected from the group consisting of magnesium, silicon, aluminum, titanium, zinc, calcium, strontium, zirconium, barium, tin, neodymium, bismuth, lithium, samarium, and tantalum. It is a metal oxide powder which has a relative dielectric constant of 3.7 to 10,000 and a Q value of 200 to 100,000.

  When the total of the dielectric ceramic powder and the resin composition is 100% by volume, the dielectric ceramic powder preferably contains 5 to 65% by volume.

  The resin layer may further include a magnetic powder dispersed in the resin composition. The resin layer may further include a cloth made of reinforcing fibers. The reinforcing fibers include E glass glass cloth, D glass glass cloth, NE glass glass cloth, H glass glass cloth, T glass glass cloth, aramid porous film, polyamide porous film, and poly-4. It is preferably at least one selected from the group consisting of a porous film of ethylene fluoride.

The electronic component according to the second aspect of the present invention is:
Polyester comprising an aromatic polyvalent carboxylic acid residue and an aromatic polyvalent hydroxy compound residue having an aryloxycarbonyl group or an arylcarbonyloxy group at the molecular chain end, an epoxy resin, a curing accelerator, and a flame retardant The resin layer which consists of a resin composition containing these is provided, It is characterized by the above-mentioned.

The aromatic polyvalent hydroxy compound residue is at least one group selected from the group consisting of groups represented by the following formulas (1) to (4),
The aromatic polyvalent carboxylic acid residue is at least one group selected from the group consisting of groups represented by the following formulas (5) to (7),
The aryloxycarbonyl group or the aryl group in the arylcarbonyloxy group is preferably at least one aryl group selected from the group consisting of groups represented by the following formulas (8) to (10).

（１）

（式（１）中、ｋは０または１である。）

(1)

(In formula (1), k is 0 or 1.)

（２）

(2)

(In formula (2), Y represents an oxygen atom, a methylene group, a methylene group substituted with an alkyl group having 1 to 4 carbon atoms, a methylene group substituted with a phenyl group, a methylene group substituted with a naphthyl group, or a biphenyl group. Represents a methylene group substituted with a 9-fluorenyl group, a methylene group substituted with a phenyl group, a naphthyl group, or a biphenyl group with an alkyl group having 1 to 4 carbon atoms. n and m each represents an integer of 1 to 3)

（３）

(3)

（４）

(4)

（５）

(5)

（６）

(6)

（７）

(7)

(In the formula, A, B, D, E, and G are substituents, and each represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom. A, e, and g each represent B and d each represent an integer of 0 to _3. X represents a single bond, —S—, —O—, —CO—, —CH ₂ —, —C (CH ₃ ) _2. -, or -SO ₂ - represents a).

（８）

(8)

（９）

(9)

（１０）

(10)

(In the formula, P, Q, R, T, and U are substituents and each represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a nitro group, or a halogen atom. P, r Is an integer of 0-5, q, t is an integer of 0-4, u is an integer of 0-3, Z is a single bond, —O—, —CO—, —CH ₂ —, —C (CH ₃ ) _2- or -SO _2- .

  It is preferable to include at least one conductive element portion provided on the resin layer and constituting a capacitor element or an inductor element.

  The flame retardant is preferably a brominated aromatic flame retardant. The flame retardant is preferably ethane-1,2-bis (bentabromophenyl). The resin composition may contain at least one of a styrene elastomer and a polybutadiene polymer.

  At least one layer may include a resin layer containing the resin composition and a dielectric ceramic powder having a relative dielectric constant larger than that of the resin composition.

  Examples of the dielectric ceramic powder include at least one metal selected from the group consisting of magnesium, silicon, aluminum, titanium, zinc, calcium, strontium, zirconium, barium, tin, neodymium, bismuth, lithium, samarium, and tantalum. It is a metal oxide powder which has a relative dielectric constant of 3.7 to 10,000 and a Q value of 200 to 100,000.

  When the total of the dielectric ceramic powder and the resin composition is 100% by volume, the dielectric ceramic powder preferably contains 5 to 65% by volume.

  The resin layer may further include a magnetic powder dispersed in the resin composition. The resin layer may further include a cloth made of reinforcing fibers. The reinforcing fibers include E glass glass cloth, D glass glass cloth, NE glass glass cloth, H glass glass cloth, T glass glass cloth, aramid porous film, polyamide porous film, and poly-4. It is preferably at least one selected from the group consisting of a porous film of ethylene fluoride.

  According to the present invention, there are provided a printed wiring board and an electronic component made of a material having a low dielectric loss tangent, a high glass transition temperature, a low dielectric constant and a dielectric loss tangent under high humidity, and a high flame retardancy. can do.

  Hereinafter, the printed wiring board and the electronic component of the present invention will be described in detail.

The printed wiring board and electronic component of the present invention comprise an epoxy resin, an aromatic polyvalent carboxylic acid residue having an aryloxycarbonyl group or an arylcarbonyloxy group at the molecular chain end and an aromatic polyvalent hydroxy compound residue. Insulating layer comprising an organic insulating material containing polyester (hereinafter abbreviated as “polyester (A)”), a curing accelerator and a flame retardant, and a dielectric further comprising a dielectric powder and a surface treatment agent in the organic insulating material A resin layer composed of at least one of a layer,
At least one conductive element portion that is provided on at least one of the insulating layer and the dielectric layer of the resin layer and constitutes a capacitor element or an inductor element;
It has.

  First, the insulating layer will be described. As described above, the insulating layer is made of an organic insulating material containing an epoxy resin, polyester (A), a curing accelerator, and a flame retardant.

  The epoxy resin contained in the organic insulating material used for the printed wiring board and the electronic component of the present invention is not particularly limited as long as it has two or more epoxy groups in one molecule. For example, cresol novolac, phenol Novolak, α-naphthol novolak, β-naphthol novolak, bisphenol A novolak, biphenyl novolak, bisphenol A, bisphenol F, bisphenol S, tetrabromobisphenol A, biphenol, tetramethylbiphenol, 1,1-bis (4-hydroxyphenyl) -1 Diphenyl obtained from glycidyl ether type epoxy resin of polyphenol such as 1-phenylethane, bisphenolfluorene, dihydroxynaphthalene, dicyclopentadienyl diphenol and epichlorohydrin Lopentadiene novolac epoxy resin, naphthalenediol aralkyl epoxy resin, naphthol aralkyl epoxy resin, triphenyl epoxy resin, tetraphenyl epoxy resin, polypropylene glycol, hydrogenated bisphenol A and other alcohol-based glycidyl ether epoxy resins, Glycidyl ester type epoxy resin made from hexahydrophthalic anhydride or dimer acid, glycidylamine type epoxy resin made from amine such as diaminodiphenylmethane, alicyclic epoxy resin, benzopyran type epoxy resin, and mixtures of these Can be mentioned.

  Among them, cresol novolac type epoxy resin, cresol novolac glycidyl ether type epoxy resin, phenol novolac type epoxy resin, naphthol novolac type epoxy resin, biphenyl novolac type epoxy resin, bisphenol type epoxy resin, biphenyl type epoxy resin, triphenyl type epoxy When a resin, a tetraphenyl type epoxy resin, a dicyclopentadiene novolac type epoxy resin, a naphthalene type epoxy resin, and a brominated epoxy resin are used, an epoxy resin cured product having excellent heat resistance can be obtained.

  The polyester (A) contained in the organic insulating material used for the printed wiring board and the electronic component of the present invention comprises an aromatic polyvalent carboxylic acid residue having an aryloxycarbonyl group or an arylcarbonyloxy group at the molecular chain terminal. It is a polyester comprising an aromatic polyvalent hydroxy compound residue and can be suitably used as a curing agent for epoxy resins. This is because the ester bond of the polyester (A) has a high reaction activity with respect to the epoxy group, and when the polyester (A) is used as a curing agent, a highly polar hydroxy group is not generated. The resulting cured epoxy resin exhibits a low dielectric loss tangent. Furthermore, an increase in dielectric constant is suppressed.

  In addition, since polyester (A) also has an ester bond reactive to epoxy groups inside the molecular chain, the epoxy resin cured product using polyester (A) as a curing agent has a high crosslinking density and a glass transition. The temperature is high.

  When the polyester (A) has an aryloxycarbonyl group at the molecular chain end, a low molecular weight carboxylic acid that increases the dielectric loss tangent even if the ester bond at the crosslinking point of the resulting cured epoxy resin is hydrolyzed by moisture absorption. Does not liberate, and the resulting cured epoxy resin exhibits a low dielectric loss tangent even under high humidity conditions. Furthermore, an increase in dielectric constant is suppressed.

  Further, when the aromatic polyvalent hydroxy compound is an aromatic dihydroxy compound that gives at least one group selected from the group consisting of groups represented by formulas (1) to (4) as a residue, the formula (1) ) To (4) all have a bulky aromatic ring or alicyclic structure in the molecule, so the polyester (A) is suppressed from crystallization of the molecular chain and dissolved in an organic solvent. Excellent in properties. For this reason, when dissolving the resin composition containing polyester (A) in a solvent or adjusting a varnish, the amount of the solvent used may be small.

（１）
（式（１）中、ｋは０または１である。）

(1)
(In formula (1), k is 0 or 1.)

（２）

(2)

(In formula (2), Y represents an oxygen atom, a methylene group, a methylene group substituted with an alkyl group having 1 to 4 carbon atoms, a methylene group substituted with a phenyl group, a methylene group substituted with a naphthyl group, or a biphenyl group. Represents a methylene group substituted with a 9-fluorenyl group, a methylene group substituted with a phenyl group, a naphthyl group, or a biphenyl group with an alkyl group having 1 to 4 carbon atoms. n and m each represents an integer of 1 to 3)

（３）

(3)

（４）

(4)

  It is also preferable to use a polyester (A) having an aromatic dihydroxy compound residue represented by the following general formula (11). In this case, since the polyester (A) has an aromatic dihydroxy compound residue having a bromine atom represented by the general formula (11), the cured product of the epoxy resin composition containing the polyester (A) is: Excellent flame retardancy.

（１１）
（式（１１）中、Ｊは−ＣＨ_２−、−Ｃ（ＣＨ_３）_２−、または−ＳＯ_２−からなる群から選ばれる二価の基を表す。）

(11)
(In formula (11), J represents a divalent group selected from the group consisting of —CH ₂ —, —C (CH ₃ ) ₂ —, or —SO ₂ —).

  The polyester (A) contained in the organic insulating material used for the printed wiring board and the printed board of the present invention is obtained by, for example, polycondensing an aromatic polyvalent carboxylic acid and an aromatic polyvalent hydroxy compound, and carboxy at both ends. It is obtained by synthesizing a polyester having a group and esterifying the carboxy group with an aromatic monohydroxy compound. The polyester (A) can also be produced by a transesterification reaction or a Schotten-Baumann reaction other than the dehydration esterification reaction.

  In the transesterification reaction, the polyester (A) is obtained by acetylating an aromatic polyvalent hydroxy compound and an aromatic monohydroxy compound with acetic anhydride and then acidifying the aromatic polyvalent carboxylic acid.

  When utilizing the Schotten-Baumann reaction, there are an interfacial polycondensation method in which the reaction is carried out at the interface and a solution polycondensation method in which the reaction is carried out in a homogeneous solution. In the interfacial polycondensation method, an organic solution phase containing an acid halide of an aromatic polyvalent carboxylic acid is brought into contact with an aqueous phase containing an aromatic polyvalent hydroxy compound and an aromatic monohydroxy compound, so that an acid scavenger coexists. Polyester (A) is obtained by interfacial polycondensation below. In the solution polycondensation method, a solution containing an acid halide of an aromatic polyvalent carboxylic acid and a solution containing an aromatic polyvalent hydroxy compound and an aromatic monohydroxy compound are mixed in the presence of an acid scavenger. The polyester (A) is obtained by dehydrohalogenation reaction.

  Polyester (A) can also be obtained by dehydration esterification reaction of aromatic polyvalent carboxylic acid, aromatic polyhydroxy compound, and aromatic monohydroxy compound, but generally the reactivity of aromatic hydroxy compound is low. It is preferable to use a transesterification reaction or a Schotten-Baumann reaction.

  Hereinafter, the polyester (A) used in the present invention will be specifically described with reference to a production method utilizing the Schotten-Baumann reaction. The aromatic polyvalent hydroxy compound used for the production of the polyester (A) may be any compound having two or more aromatic hydroxy groups. For example, in the above formulas (1) to (4) and (11) The compound which gives the group represented, Specifically, the aromatic polyvalent hydroxy compound represented by following formula (12)-(16) is mentioned.

（１２）
（式（１２）中、ｋは０または１である。）

(12)
(In the formula (12), k is 0 or 1.)

（１３）

(13)

(In formula (13), Y represents an oxygen atom, a methylene group, a methylene group substituted with an alkyl group having 1 to 4 carbon atoms, a methylene group substituted with a phenyl group, a methylene group substituted with a naphthyl group, or a biphenyl group. Represents a methylene group substituted with a 9-fluorenyl group, a methylene group substituted with a phenyl group, a naphthyl group, or a biphenyl group with an alkyl group having 1 to 4 carbon atoms. n and m represent an integer of 1 to 3.)

（１４）

(14)

（１５）

(15)

（１６）
（式（１６）中、Ｊは−ＣＨ_２−、−Ｃ（ＣＨ_３）_２−、または−ＳＯ_２−からなる群から選ばれる二価の基を表す。）

(16)
(In formula (16), J represents a divalent group selected from the group consisting of —CH ₂ —, —C (CH ₃ ) ₂ —, or —SO ₂ —).

  Among the aromatic polyvalent hydroxy compounds represented by the above formulas (12) to (16), the polyester (A) obtained using the aromatic polyvalent hydroxy compound represented by the formula (12) is a curing agent. Since the epoxy resin cured product has a hydrophobic alicyclic structure in the structure, it absorbs less water and exhibits stable dielectric properties even in a high humidity environment.

  However, those aromatic polyhydroxy compounds represented by the formula (12) having an average value of k exceeding 0.2 may cause gelation when dissolved in a solvent to synthesize polyester. In the case of using the aromatic polyvalent hydroxy compound represented by the formula (12), one having an average value of k in the range of 0 to 0.2 is used, or the formula (13) to ( It is preferable to use a mixture with the aromatic dihydroxy compound represented by 16). When used together with the aromatic dihydroxy compound represented by the formulas (13) to (16), the amount of the aromatic polyhydroxy compound represented by the formula (12) is appropriately adjusted according to the value of k. For example, when k is 1, the amount of the aromatic polyhydroxy compound represented by the formula (12) used when synthesizing the polyester (A) is the same as the aromatic polyhydroxy compound used. It is preferable to set it as 20 mol% or less with respect to the whole quantity.

  Since the epoxy resin cured product using the polyester (A) obtained by using the aromatic dihydroxy compound represented by the general formula (16) as a curing agent has a bromine atom in the structure, the epoxy resin cured product is heated. Hydrogen bromide is generated when decomposed, and the cured epoxy resin has flame retardancy due to the oxygen blocking effect of hydrogen bromide and the effect of capturing highly active free radicals during combustion and reducing the combustion energy.

  However, when only the aromatic dihydroxy compound represented by the general formula (16) is used when synthesizing the polyester (A), the crystallinity of the polyester (A) increases, and the polyester (A) In addition to the aromatic dihydroxy compound represented by the general formula (16), the aromatic polyhydroxy compound having sufficient solvent solubility may not be obtained. It is preferable to use a divalent hydroxy compound in combination. It is preferable that the usage-amount of the aromatic dihydroxy compound represented by General formula (16) at this time is the range of 30-60 mass% with respect to the aromatic polyvalent hydroxy compound whole quantity to be used.

  Examples of the aromatic polyvalent hydroxy compound that gives sufficient solvent solubility include compounds represented by the above formulas (12) to (15). However, when the aromatic polyhydroxy compound represented by the formula (12) is used together with the aromatic dihydroxy compound represented by the general formula (16), the aromatic polyhydroxy compound represented by the formula (12) is: It is preferable to use one having an average value of k in the range of 0 to 0.2, or to mix with an aromatic dihydroxy compound represented by the formulas (13) to (16). As described above.

  In the case of producing the polyester (A) using the Schotten-Baumann reaction, the aromatic polyvalent carboxylic acid is used in the form of an acid halide. As the halogen of the acid halide used here, chlorine or bromine is generally used. The aromatic polyvalent carboxylic acid used in the form of acid halide may be a compound having two or more carboxy groups, such as trimesic acid, trimellitic acid, pyromellitic acid, or the following general formula (17) to And aromatic dicarboxylic acid represented by (19).

（１７）

(17)

（１８）

(18)

（１９）

(19)

(In the general formulas (17) to (19), A, B, D, E, and G represent substituents, and each represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom. A, e, and g each represent an integer of 0 to 4, and b and d each represent an integer of 0 to 3. The substituents represented by A to G are all the same or different. X represents a single bond, —S—, —O—, —CO—, —CH ₂ —, —C (CH ₃ ) ₂ —, or —SO ₂ —.

  Among the aromatic polycarboxylic acids, the polyester (A) obtained from the acid halide of the aromatic dicarboxylic acid represented by the general formulas (17) to (19) has excellent solubility in various solvents. Moreover, the epoxy resin hardened | cured material which uses this polyester (A) as a hardening | curing agent shows a high glass transition temperature and a low dielectric loss tangent. Examples of the aromatic dicarboxylic acid represented by the general formulas (17) to (19) include isophthalic acid, terephthalic acid, 1,4-, 2,3-, or 2,6-naphthalenedicarboxylic acid. . Among these, polyester (A) obtained by using a mixture of isophthalic acid and terephthalic acid is particularly excellent in solubility in various solvents.

  Examples of the aromatic monohydroxy compound include aromatic monohydroxy compounds represented by the following general formulas (20) to (22).

（２０）

(20)

（２１）

(21)

（２２）

(22)

(In General Formulas (20) to (22), P, Q, R, T, and U each represent a substituent, each having an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a nitro group, or Represents a halogen atom, p and r are integers of 0 to 5, q and t are integers of 0 to 4 and u is an integer of 0 to 3. The substituents represented by P to U are all the same. Z may be a single bond, —O—, —CO—, —CH ₂ —, —C (CH ₃ ) ₂ —, or —SO ₂ —.

  Examples of the aromatic monohydroxy compound represented by the general formulas (20) to (22) include phenol, o-cresol, m-cresol, p-cresol, 3,5-xylenol, o-phenylphenol, p- Phenylphenol, 2-benzylphenol, 4-benzylphenol, 4- (α-cumyl) phenol, α-naphthol, β-naphthol and the like can be mentioned. Among these, epoxy resin cured products using polyester (A) using α-naphthol, β-naphthol, o-phenylphenol, p-phenylphenol, 4- (α-cumyl) phenol as a curing agent are particularly low dielectric loss tangents. Have

  As the solvent used in the organic solution phase when the polyester (A) is produced by the interfacial polycondensation method, an acid halide of an aromatic polyvalent carboxylic acid is dissolved, inert to the acid halide, and non-aqueous with water. Any compatible solvent may be used, and examples thereof include toluene and dichloromethane. An aromatic polyvalent hydroxy compound and an alkali as an acid scavenger are dissolved in the aqueous phase.

  Solvents used in the production by the solution polymerization method include an acid halide of aromatic polyvalent carboxylic acid, an aromatic polyhydroxy compound, and an aromatic monohydroxy compound, and is inert to the acid halide. Any solvent can be used, and toluene, dichloromethane and the like can be used. Moreover, pyridine, triethylamine, etc. can be used as an acid scavenger used for a polycondensation reaction.

  The obtained polyester (A) is preferably purified by operations such as washing and reprecipitation to reduce the impurity content. If impurities such as monomers, halogen ions, alkali metal ions, alkaline earth metal ions, or salts remain in the polyester (A), it causes a increase in dielectric loss tangent.

  The number average molecular weight in terms of polystyrene of the polyester (A) is preferably in the range of 550 to 7000. If the number average molecular weight is less than 550, the crosslinking density of the epoxy resin cured product is not sufficiently high, and thus the effect on the glass transition temperature is insufficient. If it exceeds 7000, gelation occurs when dissolved in a solvent. There is a case.

  Further, in the present invention, although not an essential component, as an epoxy resin curing agent, an aromatic ester obtained by esterifying all carboxy groups of an aromatic polycarboxylic acid with an aromatic monohydroxy compound (hereinafter referred to as the aromatic resin). The ester may be abbreviated as “aromatic ester (H)”).

  The aromatic ester (H) is an ester of an aromatic polyvalent carboxylic acid and an aromatic monohydroxy compound, and can be obtained by the same production method as the polyester (A).

  As aromatic polyvalent carboxylic acid used for manufacture of aromatic ester (H), the carboxylic acid similar to the aromatic polyvalent carboxylic acid used for the synthesis | combination of the said polyester (A) can be used, for example. Among them, the aromatic ester (H) using isophthalic acid or terephthalic acid has good solubility in the solvent of the epoxy resin composition.

  As an aromatic monohydroxy compound, the aromatic monohydroxy compound used for the synthesis | combination of the said polyester (A) can be used. Of these, aromatic esters (H) using α-naphthol and β-naphthol are preferable because the dielectric loss tangent of the resulting cured epoxy resin can be further reduced.

  When the polyester (A) and the aromatic ester (H) are used in combination, the ratio of the polyester (A) to the aromatic ester (H) contained in the epoxy resin composition is polyester (A): aromatic ester. When (H) is a mass ratio in the range of 85:15 to 55:45, particularly excellent glass transition temperature and dielectric loss tangent can be combined.

  As the curing accelerator contained in the organic insulating material used for the printed wiring board and the electronic component of the present invention, a known and commonly used epoxy resin curing accelerator can be used. For example, imidazole compounds such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-heptadecylimidazole and 2-undecylimidazole, and organic such as triphenylphosphine and tributylphosphine Phosphine compounds, organic phosphite compounds such as trimethyl phosphite, triethyl phosphite, phosphonium salts such as ethyltriphenylphosphonium bromide, tetraphenylphosphonium tetraphenylborate, trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, Benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, 1,8-diazabicyclo (5,4,0) -undecene-7 ( (Hereinafter abbreviated as DBU) and the like, and salts of DBU with terephthalic acid or 2,6-naphthalenedicarboxylic acid, tetraethylammonium chloride, tetrapropylammonium chloride, tetrabutylammonium chloride, tetrabutylammonium bromide, tetrahexyl Quaternary ammonium salts such as ammonium bromide and benzyltrimethylammonium chloride, 3-phenyl-1,1-dimethylurea, 3- (4-methylphenyl) -1,1-dimethylurea, chlorophenylurea, 3- (4- Chlorophenyl) -1,1-dimethylurea, urea compounds such as 3- (3,4-dichlorophenyl) -1,1-dimethylurea, alkalis such as sodium hydroxide and potassium hydroxide, potassium phenoxide and potassium acetate Etc. What crown salts of ether and the like, which may be used alone or plural. Of these, imidazole compounds are preferably used.

  Examples of the flame retardant contained in the organic insulating material used for the printed wiring board and the electronic component of the present invention include brominated aromatic, condensed phosphate ester, metal hydroxide, antimony, phosphorus, and the like. Conventional flame retardants can be used. In particular, brominated aromatic flame retardants have bromine atoms in the structure, so hydrogen bromide is generated when the epoxy resin cured product is thermally decomposed, and the oxygen blocking effect of hydrogen bromide and high activity during combustion. It is possible to impart excellent flame retardancy to the epoxy resin composition due to the effect of capturing free radicals and reducing combustion energy. Moreover, it is preferable because the transmission loss of the cured product of the epoxy resin composition is hardly deteriorated. A particularly preferred flame retardant from this point of view is ethane-1,2-bis (bentabromophenyl).

  Here, “flame retardant” means a characteristic relating to combustion, that is, incombustibility, until a flame or a heating element is brought close to ignite a test piece and extinguish again. The excellent flame retardancy in the present invention is the standard of flame retardancy of UL-94, which is a flame retardant test of plastic materials for parts of equipment, in the US UL standard. It satisfies the 94V-0 standard closely related to electronic materials (with a shelf life of less than 10 seconds).

  The compounding quantity of the epoxy resin and polyester (A) contained in the organic insulating material used for the printed wiring board and the electronic component of the present invention is the aryl in the polyester (A) with respect to 1 mol of the epoxy group in the epoxy resin. The amount of the oxycarbonyl group that is 0.15 to 5 mol is preferable, and the amount that is 0.5 to 2.5 mol is more preferable. When the blending amount of the polyester (A) is outside this range, the curing reaction of the epoxy resin by the polyester (A) does not proceed sufficiently, and the effect on the dielectric loss tangent and the glass transition temperature becomes insufficient.

  It is preferable that the compounding quantity of a hardening accelerator is the range of 0.01-5 mass parts with respect to 100 mass parts of epoxy resins. When the blending amount of the curing accelerator is less than 0.01 parts by mass, the curing reaction rate is slow, and when it exceeds 5 parts by mass, self-polymerization of the epoxy resin occurs and the curing reaction of the epoxy resin by the polyester (A) is inhibited. Sometimes.

  The organic insulating material used for the printed wiring board and the electronic component of the present invention is a desired type such as polyester (A), epoxy resin, curing accelerator, flame retardant, and a flexibility imparting material added as necessary. And containing amounts.

As the flexibility imparting material, at least one of a styrene-based elastomer and a polybutadiene-based polymer can be added.
As the styrenic elastomer, styrene and one or more selected from polybutadiene, polyisoprene, poly (ethylene / butylene), poly (ethylene / propylene), poly (vinyl / isopropylene), and polyethylene are used. A diblock copolymer or a triblock copolymer is mentioned.
Further, as the polybutadiene-based polymer, a polymer obtained by epoxidizing a part of double bonds of 1,2-polybutadiene or 1,4-polybutadiene can be used.

  The flexibility imparting material can impart toughness to the insulating layer, and when the insulating layer is a prepreg containing reinforcing fibers, its handleability is improved. It should be noted that the flexibility imparting material is not essential, and it is not particularly necessary to add it in applications where flexibility is not required for the semi-cured product in producing printed wiring boards and electronic components.

  The flexibility imparting material is preferably added in an amount of 5 to 30 parts by mass with respect to 100 parts by mass of the epoxy resin. When the amount of the flexibility imparting material is less than the above, there is almost no modification effect of the epoxy resin composition, and the brittle physical properties are not improved. In addition, if it is more than the above, the original physical properties of the epoxy resin composition cannot be exhibited, the solid content concentration cannot be increased when blended in a solvent, the solution viscosity increases, and the water absorption rate increases. There is a fear.

The organic insulating material used for the printed wiring board and the electronic component of the present invention may contain cloth, nonwoven fabric, filler, etc. made of glass or resin. For example, the filler used includes SiO ₂ and whiskers having a low dielectric constant and a low dielectric loss tangent. In this case, the deformation and loss of printed wiring boards and electronic components are sufficiently prevented by reducing the curing shrinkage of organic insulating materials, reducing the coefficient of linear expansion, strengthening the strength, and reducing the dielectric loss tangent of the material. It is possible to improve the manufacturing accuracy by reducing the above, improve the reliability such as thermal shock, reduce the dielectric loss tangent, and improve the transmission characteristics.

  Further, the organic insulating material used for the printed wiring board and the electronic component of the present invention may be magnetized. In this case, it is preferable that the filler contains magnetic powder. With this magnetic powder, magnetic properties can be added and the linear expansion coefficient can be reduced.

  Examples of the magnetic powder include ferrite such as Mn—MgZn, Ni—Zn, Mn—Mg, and planar materials, or carbonyl iron, iron-silicon alloys, iron-aluminum-silicon alloys, iron-nickel alloys, and amorphous materials. And ferromagnetic metals. These may be used alone or in combination of two or more.

  The average particle diameter of the magnetic powder is preferably in the range of 0.01 to 100 μm, and more preferably in the range of 0.2 to 20 μm. If the average particle size of the magnetic powder is less than 0.01 μm, the resin tends to be difficult to knead, and if it exceeds 100 μm, uniform dispersion tends to be impossible.

  The content of the magnetic powder is preferably in the range of 5 to 65% by volume when the total of the organic insulating material and the magnetic powder is 100% by volume, and an appropriate amount is selected within this range. do it. If the amount is less than 5% by volume, the effect of adding the magnetic powder tends not to be exhibited. If the amount exceeds 65% by volume, the fluidity is deteriorated.

  Moreover, when it contains the said filler, it is preferable that a surface treating agent is included. The surface treatment agent improves the adhesion between the filler and the organic insulating material, improves the substrate strength, and reduces the water absorption.

  Examples of such surface treatment agents include chlorosilane coupling agents, alkoxysilane coupling agents, organofunctional silane coupling agents, silazane silane coupling agents, titanate coupling agents, and aluminum couplings. Agents and the like. The surface treatment agent to be used may be used alone or in combination of two or more depending on the required properties.

  In printed wiring boards and electronic components, since heat resistance such as reflow is required, the surface treatment agent is preferably an organofunctional silane coupling agent or an alkoxysilane coupling agent.

  What is necessary is just to select the addition amount of a surface treating agent suitably in the range of 0.1-5 weight part with respect to 100 weight part of fillers. The selection of the addition amount is determined by the particle size and shape of the filler to be used and the type of the surface treatment agent to be added. Examples of the surface treatment method include a dry method, a wet method, a spray method, an integral blend method, and the like, and may be selected as necessary.

  Next, the dielectric layer will be described. The dielectric layer further includes a dielectric powder and a surface treatment agent in an organic insulating material.

  The dielectric layer used for the printed wiring board and the electronic component mainly has a purpose of reducing the area of the capacitor element and shortening the wavelength of the resonator. For example, in order to increase the dielectric constant of the dielectric layer, the organic insulating material described above may contain a filler having a higher dielectric constant in the high frequency region of 0.1 GHz or higher.

For example, to make the dielectric constant higher,
(1) A dielectric ceramic powder having a very high dielectric constant is contained. (2) There are two methods for increasing the content.

In order to make the dielectric loss tangent of the dielectric layer smaller,
(1) A ceramic powder having a high Q value is contained. (2) There are two methods for increasing the content.

The dielectric ceramic powder is a metal oxide containing at least one metal selected from the group consisting of magnesium, silicon, aluminum, titanium, zinc, calcium, strontium, zirconium, barium, tin, neodymium, bismuth, lithium, samarium and tantalum. It is preferably a metal oxide powder having a relative dielectric constant of 3.7 or more and a Q value of 200 or more, which is appropriate depending on the required dielectric constant and dielectric loss tangent. A ceramic powder may be selected. The relative permittivity and the Q value are in a trade-off relationship, and there is actually no dielectric having a very high relative permittivity and a very high Q value. For example, the relative dielectric constant of BaTiO ₃ is 1500, which is very high as compared with an organic insulator, but a Q value of 100 cannot be obtained.

  When the relative permittivity of the metal oxide powder is less than 3.7, the relative permittivity of the resin layer (dielectric layer) cannot be increased, and it is difficult to reduce the size of the printed wiring board and the electronic component. Tend. When the Q value of the metal oxide powder is less than 200, the Q value tends to decrease, so that it is difficult to incorporate an element with good electrical characteristics in a printed wiring board and an electronic component.

  Specific examples of the dielectric ceramic powder include those having the following components as main components. The relative dielectric constant and the Q value are values in the gigahertz band. In the present invention, the gigahertz band refers to a frequency band of 0.1 to 10 GHz.

That is, Mg ₂ SiO ₄ [ε = 7, Q = 20000], Al ₂ O ₃ [ε = 9.8, Q = 40000], MgTiO ₃ [ε = 17, Q = 22000], ZnTiO ₃ [ε = 26 , Q = 800], Zn ₂ TiO ₄ [ε = 15, Q = 700], TiO ₂ [ε = 104, Q = 15000], CaTiO ₃ [ε = 170, Q = 1800], SrTiO ₃ [ε = 255. , Q = 700], SrZrO ₃ [ε = 30, Q = 1200], BaTi ₂ O ₅ [ε = 42 · Q = 5700], BaTi ₄ O ₉ [ε = 38, Q = 9000], Ba ₂ Ti ₉ O ₂₀ [ε = 39, Q = 9000], Ba ₂ (Ti, Sn) ₉ O ₂₀ [ε = 37, Q = 5000], ZrTiO ₄ [ε = 39, Q = 7000], (Zr, Sn) TiO _{4 [ε = 38, Q =} 70 _{0], BaNd 2 Ti 5 O} 14 [ε = 83, Q = 2100], BaNd 2 Ti 4 O 12 [ε = 92, Q = 1700], BaSm 2 TiO 14 [ε = 74, Q = 2400], BaO —CaO—Nd ₂ O ₃ —TiO ₂ [ε = 90, Q = 2200], BaO—SrO—Nd ₂ O ₃ —TiO ₂ [ε = 90, Q = 1700], BaO—Nd ₂ O ₃ , MgO— TiO ₂ , MgO—SiO ₂ [ε = 6.1, Q = 5000], ZnO—TiO ₂ [ε = 26, Q = 840], Bi ₂ O ₃ —BaO—Nd ₂ O ₃ —TiO ₂ [ε = 88, Q = 2000], PbO—BaO—Nd ₂ O ₃ —TiO ₂ [ε = 90, Q = 5200], (Bi ₂ O ₃ , PbO) —BaO—Nd ₂ O ₃ —TiO ₂ [ε = 105 , Q = 2500], La ₂ Ti ₂ O ₇ [ε = 44, Q = 4000], Nd ₂ Ti ₂ O ₇ [ε = 37, Q = 1100], (Li, Sm) TiO ₃ [ε = 81, Q = 2050], Ba (Mg _1/3 Ta _2/3 ) O ₃ [ε = 25, Q = 35000], Ba (Zn _1/3 Ta _2/3 ) O ₃ [ε = 30, Q = 14000], Ba (Zn _1/3 , Nb _2/3 ) O ₃ [ε = 41, Q = 9200], Sr (Zn _1/3 Nb _2/3 ) O ₃ [ε = 40, Q = 4000]

Among the above dielectric ceramic powders, TiO ₂ , CaTiO ₃ , SrTiO ₃ , BaO—Nd ₂ O ₃ —TiO ₂ , BaO—CaO—Nd ₂ O ₃ have a high Q value and a larger ε than the resin. —TiO ₂ , BaO—SrO—Nd ₂ O ₃ —TiO ₂ , BaO—Sm ₂ O ₃ —TiO ₂ , BaTi ₄ O ₉ , Ba ₂ Ti ₉ O ₂₀ , Ba ₂ (Ti, Sn) ₉ O ₂₀ , MgO The main component is a component of —TiO ₂ , ZnO—TiO ₂ , MgO—SiO ₂ , or Al ₂ O ₃ . The dielectric ceramic powder containing the above components as the main component may be used alone or in combination of two or more.

  The content of the dielectric ceramic powder is preferably in the range of 5 to 65% by volume, where the total of the organic insulating material and the dielectric ceramic powder is 100% by volume. An appropriate amount may be selected according to the rate and the dielectric loss tangent. If the added amount of the dielectric ceramic powder is less than 5% by volume, it tends to be difficult to increase the dielectric constant by the dielectric ceramic powder, and if it exceeds 65% by volume, the fluidity of the resin composition is lowered. The generation of voids and the adhesion of the dielectric layer to the conductive metal may decrease, and the conductive metal may peel from the dielectric layer due to long-term use, which may change the performance of the electronic component.

  The average particle size of the dielectric ceramic powder is preferably in the range of 0.01 to 100 μm, and more preferably in the range of 0.2 to 20 μm. If the average particle size is less than 0.01 μm, the viscosity of the varnish may increase and the fluidity of the resin composition may decrease, and the adhesive performance may not be expressed. If the average particle size exceeds 100 μm, the dielectric ceramic powder will precipitate during prepreg production. There is a fear.

  The surface treatment agent increases the adhesion between the dielectric ceramic powder and the organic insulating material, increases the substrate strength, and reduces the water absorption.

  Examples of such surface treatment agents include chlorosilane coupling agents, alkoxysilane coupling agents, organofunctional silane coupling agents, silazane silane coupling agents, titanate coupling agents, and aluminum couplings. Agents and the like. The surface treatment agent to be used may be used alone or in combination of two or more depending on the required properties.

  In printed wiring boards and electronic components, since heat resistance such as reflow is required, the surface treatment agent is preferably an organofunctional silane coupling agent or an alkoxysilane coupling agent.

  What is necessary is just to select the addition amount of a surface treating agent suitably in the range of 0.1-5 weight part with respect to 100 weight part of dielectric ceramic powder. The selection of the addition amount is determined by the particle size and shape of the dielectric ceramic powder to be used and the type of the surface treatment agent to be added. Examples of the surface treatment method include a dry method, a wet method, a spray method, an integral blend method, and the like, and may be selected as necessary.

  The dielectric layer may further include a cloth made of reinforcing fibers. If sufficient strength cannot be obtained due to the configuration of the printed wiring board and electronic component, the mechanical strength of the dielectric layer is enhanced by the cloth made of reinforcing fibers, and the printed wiring board and electronic component are sufficiently prevented from being damaged or deformed. Is done.

  The material of the reinforcing fiber is preferably any of E glass, D glass, NE glass, H glass, T glass, or aramid fiber. Among these, NE glass has a low dielectric loss tangent, H glass has a high dielectric constant, and E glass can be balanced with cost. Therefore, it may be properly used according to the required characteristics.

  The thickness of the cloth is preferably 20 to 300 μm, and may be properly used depending on the required thickness and characteristics.

  Specific examples of the cloth include 101 (thickness of about 20 μm), 106 (thickness of about 30 μm), 1080 (thickness of about 50 μm), 2116 (thickness of about 100 μm), 7628 (thickness of about 200 μm), and the like. .

  In addition, the surface of the cloth may be subjected to treatment such as opening and closing as necessary, and further, the cloth surface may be subjected to a surface treatment with a coupling agent or the like in order to increase the adhesion with the resin. .

  Next, the conductive element portion will be described.

  The conductive element portion is provided on at least one of the insulating layer and the dielectric layer. The insulating layer is provided with at least a wiring made of a metal conductor, and the insulating layer and the dielectric layer have at least one conductive element portion.

  The conductive element portion constitutes a capacitor element, an inductor element, or a resonator element. In the dielectric layer, the number of the conductive element portions is not limited to one, and there may be a plurality. By providing a plurality of or a plurality of types of conductive element portions on the dielectric layer, various functions can be imparted to the printed wiring board and the electronic component. Specifically, the conductive element portion is composed of a metal conductor formed on the insulating layer and the dielectric layer.

  Examples of the metal conductor include copper, nickel, chromium, gold, silver, tin, nickel-chromium alloy, etc., but copper is preferable because it is inexpensive and easily available. The thickness of the metal conductor is preferably 1 to 70 μm. The method for producing the metal conductor may be any of electrolysis, rolling, sputtering, and vapor deposition, and may be appropriately selected depending on the required thickness and characteristics.

  In the present invention, in order to obtain a prepreg as a basis for a printed wiring board and an electronic component, an epoxy resin, polyester (A), a curing accelerator, a flame retardant, and a dielectric ceramic depending on the purpose are used. A paste obtained by kneading a resin composition containing powder or magnetic powder in a solvent to form a slurry may be applied and dried. Examples of the solvent used in this case include volatile solvents such as tetrahydrofuran, toluene, xylene, methyl ethyl ketone, cyclohexanone, dimethylacetamide, and dioxolane. Such a solvent is used to liquefy an epoxy resin, polyester or the like and adjust the viscosity of the paste. The kneading can be performed by a known method such as a ball mill or a stirrer.

  The following two methods are mentioned as a method for producing the prepreg and the substrate.

(Method 1)
After impregnating and applying the slurry paste to the cloth, it is dried to obtain a cloth-containing prepreg. The thickness of the paste applied at this time is preferably 5 to 50 μm on one side with respect to the cloth. If the thickness is less than 5 μm, it tends to be difficult to ensure fluidity as a prepreg. If the thickness exceeds 50 μm, dripping of the paste tends to occur, and variations in thickness, adhesion weight, etc. tend to increase. . The drying conditions may be determined in a timely manner depending on the solvent to be used and the thickness to be applied, but may be selected from a range of about 50 to 150 ° C. for about 1 to 60 minutes. Step drying divided into stages may be performed.

  In order to obtain a board | substrate, it is common to heat-press using a high temperature vacuum press, and what is necessary is just to make temperature and a heating time into 0.5 to 20 hours between 150-250 degreeC. The decompression is performed as necessary, but is preferably performed at 4000 Pa (30 Torr) or less. In this case, when it is desired to attach a single-sided or double-sided metal foil, the metal foil may be placed on the top and bottom of the prepreg during high-temperature vacuum pressing and heated and pressed.

(Method 2)
The slurry paste is applied to a metal foil or a film such as PET, PI, PPS, or LCP using any one of known methods such as a doctor blade control method, a spray method, a curtain coating method, a spin coating method, and a screen printing method. What is necessary is just to apply suitably according to the required thickness, precision, and material supply form (for example, supply by a roll or supply by a sheet).

  The thickness of the paste applied at this time may be within the range of 5 to 100 μm after drying. More specifically, when a filler such as a dielectric ceramic powder is contained, the maximum particle size of the filler is 2 The thickness may be double or more. If the maximum particle size of the filler is less than twice the maximum particle size, there is a risk of problems in the coatability and smoothness of the paste during coating, and the insulation of the cured product. If the thickness exceeds 100 μm, the remaining solvent There is a tendency that it is difficult to determine the drying conditions for removing water.

  However, in this case, a thin paste may be overcoated. The drying conditions may be determined in a timely manner depending on the material composition, the desired thickness, and the solvent used, but may be dried at a temperature of about 50 to 150 ° C. for a time of about 1 to 60 minutes, and the temperature is adjusted as necessary. You may perform step drying which changes in several steps.

  Semi-cured adhesive sheet obtained in this way (if a metal foil is required on the top and bottom, a semi-cured adhesive sheet coated on the metal foil; if a metal foil is not required on the top and bottom, on a film such as PET, PI, PPS, LCP Two coated semi-cured adhesive sheets) are used, and a high-temperature vacuum press is performed with a cloth in between. If there is a concern about the impregnation and filling properties in the cloth, the cloth may be impregnated with a paste having a low solid content concentration and dried in advance. The high temperature vacuum press may be performed at a temperature of 150 to 250 ° C. for a time of 0.5 to 20 hours. Further, step cure may be performed as necessary. What is necessary is just to perform a pressure between 1.5-6.0MPa, and pressure reduction is performed as needed, but it is preferable to carry out at 4000 Pa (30 Torr) or less.

  Examples of the substrate as described above include a double-sided patterning substrate and a multilayer substrate.

  The printed wiring board and electronic component of the present invention can be obtained by combining an element configuration pattern with the prepreg, the substrate with copper foil, the laminated substrate and the like as described above.

  The printed wiring board and the electronic component of the present invention include a wiring pattern, a capacitor (capacitor) circuit, a coil (inductor) circuit, a filter, and other circuits as described above, as well as amplification elements and functional elements other than these. Combined antenna circuit, RF circuit (RF amplification stage), VCO (voltage controlled oscillation circuit) circuit, high frequency electronic circuit such as power amplifier (power amplification stage) circuit, superposition circuit used for optical pickup, etc. A combined circuit may be used.

  Next, the printed wiring board and electronic component of the present invention will be described more specifically.

(First embodiment)
FIG. 1 is a perspective view showing an inductor according to a first embodiment of the electronic component of the present invention, and FIG. 2 is a cross-sectional view showing the inductor according to the first embodiment of the electronic component of the present invention.

  As shown in FIGS. 1 and 2, the inductor 10 includes a laminate formed by laminating the constituent layers 10 a to 10 e, internal conductors 13 a to 13 d provided in the constituent layers 10 b to 10 e, and the internal conductors 13 a to 13 d. And via hole 14 for connection. Further, the internal conductor 13 and the via hole 14 constitute a coil pattern (conductive element portion).

  Each of the constituent layers 10a to 10e is composed of the insulating layer or the dielectric layer. The via hole 14 can be formed by drilling, laser processing, etching, or the like.

  Further, terminal electrodes 12 are respectively provided on opposite side surfaces of the laminate, and both end portions of the coil pattern are connected to the respective terminal electrodes 12. Note that land patterns 11 are provided at both ends of the terminal electrode 12.

  The terminal electrode 12 has a structure in which a through-via cylinder is divided in half. The reason why the terminal electrode 12 has such a structure is that when a plurality of elements are formed on the collective laminated substrate and finally cut for each element, the terminal electrode 12 is cut from the center of the through via by dicing, V-cut, or the like. It is.

  When the inductor 10 is used as a high-frequency chip inductor, it is necessary to reduce the distributed capacitance as much as possible. Therefore, the relative dielectric constant of each of the constituent layers 10a to 10e is preferably 2.6 to 3.5. In addition, when the inductor 10 is an inductor constituting a resonance circuit, there is a case where a distributed capacitance is positively used. In such applications, it is preferable that the relative dielectric constant of each of the constituent layers 10a to 10e is 5 to 40. .

  In the inductor 10, even if it is used under a high humidity condition, the change in relative permittivity with time can be sufficiently suppressed. For this reason, the reliability of the inductor 10 in a high humidity environment is increased. Further, it is possible to reduce the size of the electronic component and to omit the attachment of the capacitive element to the circuit. Further, in these inductors 10, it is necessary to suppress material loss as much as possible. Therefore, by setting the dielectric loss tangent (tan δ) of each of the constituent layers 10 a to 10 e to 0.0025 to 0.0075, material loss is extremely small. An inductor having a high Q value can be obtained. The constituent layers 10a to 10e may be the same or different, and an optimal combination may be selected.

  An equivalent circuit of the electronic component in FIG. 1 is shown in FIG. As shown in FIG. 10A, in the equivalent circuit, the inductor 10 is shown as an electronic component (inductor) having a coil 31.

(Second Embodiment)
FIG. 3 is a perspective view showing an inductor according to a second embodiment of the electronic component of the present invention, and FIG. 4 is a cross-sectional view showing the inductor according to the second embodiment of the electronic component.

  The electronic component of the present embodiment is different from the electronic component of the first embodiment in that the coil pattern is wound in the horizontal direction, that is, in the direction connecting the terminal electrodes 12 facing each other. Other components are the same as those in the first embodiment. In FIGS. 3 and 4, the same components are denoted by the same reference numerals and description thereof is omitted.

(Third embodiment)
FIG. 5 is a perspective view showing an inductor which is a third embodiment of the electronic component of the present invention, and FIG. 6 is a cross-sectional view showing the inductor which is the third embodiment of the electronic component of the present invention.

  The electronic component of this embodiment is different from the electronic component of the first embodiment in that internal conductors 13 formed in a spiral shape on the upper and lower surfaces are connected by via holes 14. Other components are the same as those in the first embodiment. In FIGS. 5 and 6, the same components are denoted by the same reference numerals, and description thereof is omitted.

(Fourth embodiment)
FIG. 7 is a perspective view showing an inductor which is a fourth embodiment of the electronic component of the present invention, and FIG. 8 is a cross-sectional view showing the inductor which is the fourth embodiment of the electronic component of the present invention.

  The electronic component of the present embodiment is different from the electronic component of the first embodiment in that the pattern shape of the internal conductor 13 connecting the terminal electrodes 12 provided on both sides of the multilayer body is a meander shape. Other components are the same as those in the first embodiment. In FIGS. 7 and 8, the same components are denoted by the same reference numerals and description thereof is omitted.

(Fifth embodiment)
FIG. 9 is a perspective view showing an inductor according to a fifth embodiment of the electronic component of the present invention.

  The electronic component of the present embodiment is different from the electronic component of the first embodiment in which one coil pattern is provided on the laminate, in that four coil patterns are provided on the laminate. With such a configuration, when the electronic component is arranged on a circuit board or the like, space can be saved as compared with the case where four electronic components having one coil pattern are used.

  FIG. 10B is an equivalent circuit diagram of the inductor of this embodiment. As shown in FIG. 10B, the inductor of the present embodiment is shown as four coils 31a to 31d connected in the equivalent circuit.

(Sixth embodiment)
FIG. 11 is a perspective view showing a capacitor (capacitor) according to a sixth embodiment of the electronic component of the present invention. FIG. 12 is a cross-sectional view showing a capacitor (capacitor) according to the sixth embodiment of the electronic component of the present invention. It is.

  As shown in FIGS. 11 and 12, the capacitor 20 includes a laminated body in which the constituent layers 20 a to 20 g are laminated, an internal conductor 23 formed on the constituent layers 20 b to 20 g, and both sides of the laminated body. And a terminal electrode 22 to be provided. The adjacent internal conductors 23 are connected to different terminal electrodes 22, respectively. Further, land patterns 21 are provided at both ends of the terminal electrode 22. A conductive element portion is constituted by the internal conductor 23 provided in the multilayer body. Each of the constituent layers 20a to 20g is composed of the insulating layer or the dielectric layer.

  In addition, each of the constituent layers 20a to 20g has a relative dielectric constant of 2.6 to 40 and preferably a dielectric loss tangent of 0.0025 to 0.0075 from the viewpoint of diversity and accuracy of the obtained capacitance. Since the relative permittivity of the capacitor 20 is increased even in a high frequency range, the area of the internal conductor 23 can be reduced, and the capacitor 20 can be downsized. Further, even when the capacitor 20 is used under high humidity conditions, the change in relative permittivity with time can be sufficiently suppressed. For this reason, the reliability of the capacitor 20 in a high humidity environment is increased. In addition, by setting the dielectric loss tangent (tan δ) to 0.0075 to 0.025, a capacitor with extremely small material loss can be obtained. The constituent layers 20a to 20g may be the same or different, and an optimal combination may be selected.

  FIG. 14A is an equivalent circuit diagram of the capacitor of the present embodiment. As shown in FIG. 14A, an electronic circuit (capacitor) having a capacitor 32 is shown in the equivalent circuit.

(Seventh embodiment)
FIG. 13 is a perspective view showing a capacitor according to a seventh embodiment of the electronic component of the present invention.

  In the electronic component of this embodiment, one conductive element part constituting the capacitor element is provided in the multilayer body in that four conductive element parts constituting the capacitor element are provided in the multilayer body in an array. This is different from the capacitor of the sixth embodiment. Further, terminal electrodes 22 and land patterns 21 are provided according to the number of capacitor elements. Furthermore, when capacitors are formed in an array, various capacitors may be formed with high accuracy. For this reason, it can be said that the range of the said dielectric constant and a dielectric loss tangent is preferable.

  Other components are the same as those in the sixth embodiment. In FIG. 13, the same components are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 14B is an equivalent circuit diagram of the capacitor of the present embodiment. As shown in FIG. 14B, the equivalent circuit shows an electronic component (capacitor) in which four capacitors 32a to 32d are connected.

(Eighth embodiment)
FIGS. 15-18 has shown the balun transformer which is 8th Embodiment of the electronic component of this invention. 15 is a perspective view, FIG. 16 is a sectional view, FIG. 17 is an exploded plan view of each component layer, and FIG. 18 is an equivalent circuit diagram.

  As shown in FIGS. 15 to 17, the balun transformer 40 includes a laminated body in which the constituent layers 40 a to 40 o are laminated, an internal GND conductor 45 disposed above and below and in the middle of the laminated body, and the internal GND conductor 45. And an inner conductor 43 formed on the substrate. The internal conductor 43 is a spiral conductor having a length of λg / 4, and is connected by a via hole 44 or the like so as to constitute coupling lines 53a to 53d shown in the equivalent circuit of FIG.

  The constituent layers 40a to 40o of the balun transformer 40 preferably have a relative dielectric constant of 2.6 to 40 and a dielectric loss tangent (tan δ) of 0.0075 to 0.025. As the constituent layers 40a to 40o, The insulating layer or the dielectric layer is used. Each constituent layer may be the same or different, and an optimal combination may be selected.

  According to this balun transformer 40, the change with time of the relative dielectric constant can be sufficiently suppressed even when used under high humidity conditions. For this reason, the reliability of the balun transformer 40 in a high humidity environment is increased.

(Ninth embodiment)
19 to 22 show a multilayer filter which is a ninth embodiment of the electronic component of the present invention. 19 is a perspective view, FIG. 20 is an exploded perspective view, FIG. 21 is an equivalent circuit diagram, and FIG. 22 is a transmission characteristic diagram.

  The multilayer filter of this embodiment is configured to have a two-pole type transfer characteristic. As shown in FIGS. 19-21, the multilayer filter 60 is provided with the laminated body on which the structural layers 60a-60e were laminated | stacked. Here, the constituent layer 60b is an upper constituent layer group, and the constituent layer 60d is a lower constituent layer group. A pair of strip lines 68 are formed on the substantially central component layer 60c of the multilayer body, and a pair of capacitor conductors 67 are formed on the lower component layer group 60d adjacent thereto. A GND conductor 65 is formed on the surface of each of the constituent layers 60b and 60e, and the strip line 68 and the capacitor conductor 67 are sandwiched between the GND conductors 65. Each of the strip line 68, the capacitor conductor 67, and the GND conductor 65 is connected to an end electrode (external terminal) 62 formed on the end face of the multilayer body. A GND pattern 66 is formed on both sides of the end electrode 62, and the GND pattern 66 is connected to the GND conductor 65.

  The strip line 68 is strip lines 74a and 74b having a length of λg / 4 shown in the equivalent circuit diagram of FIG. 21 or less, and the capacitor conductor 67 constitutes an input / output coupling capacitance Ci. The strip lines 74a and 74b are coupled by a coupling capacitance Cm and a coupling coefficient M. Since the multilayer filter 60 is configured to form such an equivalent circuit, it has a two-pole transfer characteristic as shown in FIG.

  The constituent layers 60a to 60e of the multilayer filter 60 can obtain desired transfer characteristics in a band of several hundred MHz to several GHz by setting the relative dielectric constant to 2.6 to 40. Further, since it is desirable to suppress the material loss of the stripline resonator as much as possible, the dielectric loss tangent (tan δ) is preferably set to 0.0025 to 0.0075. As the constituent layers 60a to 60e, the insulating layer or the dielectric layer is used. Each constituent layer may be the same or different, and an optimal combination may be selected.

  According to the multilayer filter 60, the change with time of the relative dielectric constant can be sufficiently suppressed even when used in a high humidity condition. For this reason, the reliability of the multilayer filter 60 in a high humidity environment is increased.

(10th Embodiment)
23 to 26 show a multilayer filter which is the tenth embodiment of the electronic component of the present invention. 23 is a perspective view, FIG. 24 is an exploded perspective view, FIG. 25 is an equivalent circuit diagram, and FIG. 26 is a transmission characteristic diagram.

  The multilayer filter of this embodiment is configured to have a four-pole type transfer characteristic. As shown in FIGS. 23 to 25, the multilayer filter 60 is the ninth embodiment in which two strip lines 68 are formed in the constituent layer 60 c in that four strip lines 68 are formed in the constituent layer 60 c. It is different from the multilayer filter of the form.

  In the multilayer filter of the present embodiment, the strip line 68 is a strip line 74c, 74d, 74e, 74f having a length of λg / 4 or less shown in the equivalent circuit diagram of FIG. 74c and 74d, strip lines 74d and 74e, and strip lines 74e and 74f are coupled by a coupling capacitor Cm and a coupling coefficient M, respectively. Since the multilayer filter 60 is configured to form such an equivalent circuit, it has a four-pole transfer characteristic as shown in FIG.

  The other components are the same as those in the ninth embodiment. In FIGS. 23 and 24, the same components are denoted by the same reference numerals, and description thereof is omitted.

(Eleventh embodiment)
27 to 31 show a coupler which is an eleventh embodiment of the electronic component of the present invention. 27 is a perspective view, FIG. 28 is a sectional view, FIG. 29 is an exploded perspective view of each component layer, FIG. 30 is an internal connection diagram, and FIG. 31 is an equivalent circuit diagram.

  As shown in FIGS. 27 to 31, the coupler 110 includes a laminated body in which the constituent layers 110 a to 110 c are laminated, an internal GND conductor 115 formed on the upper and lower surfaces of the constituent layer 110 b of the laminated body, and the internal GND conductor 115. And two coil patterns forming a transformer. Each coil pattern includes a plurality of internal conductors 113 and via holes 114 connecting the internal conductors 113, and has a spiral shape. Moreover, as shown in FIG. 30, the end part of each formed coil pattern and the internal GND conductor 115 are each connected to the terminal electrode 112 formed in the side surface of the laminated body. Note that land patterns 111 are formed on both ends of the terminal electrode 112.

  Thus, in the coupler 110, as shown in the equivalent circuit diagram of FIG. 31, two coils 125a and 125b are coupled.

  The constituent layers 110a to 110c of the coupler 110 preferably have a relative dielectric constant as small as possible when attempting to realize a wide band. On the other hand, when considering miniaturization, the relative permittivity should be as large as possible. Therefore, a material having a relative dielectric constant suitable for the application, required performance, specifications, and the like may be used as the material constituting the constituent layers 110a to 110c. Usually, by setting the relative dielectric constants of the constituent layers 110a to 110c to 2.6 to 40, desired transfer characteristics can be obtained in a band of several hundred MHz to several GHz. In order to increase the Q value of the internal inductor, the dielectric loss tangent (tan δ) is preferably set to 0.0025 to 0.0075. Thereby, material loss is extremely reduced, an inductor having a high Q value can be formed, and a high-performance coupler can be obtained. The dielectric layers are used as the constituent layers 110a to 110c. Each constituent layer may be the same or different, and an optimal combination may be selected.

  According to this coupler 110, the change with time of the relative permittivity can be sufficiently suppressed even when used under high humidity conditions. For this reason, the reliability of the coupler 110 in a high humidity environment is increased.

(Twelfth embodiment)
32 to 34 are views showing an antenna which is a twelfth embodiment of the electronic component of the present invention. FIG. 32 is a perspective view, FIG. 33 (a) is a plan view, and (b) is a side sectional view. , (C) is a front sectional view, and FIG. 34 is an exploded perspective view of each constituent layer.

  As shown in FIGS. 32 to 34, the antenna 130 includes a long laminate formed by stacking the constituent layers 130a to 130c, and the internal conductors 133 formed on the constituent layer 130b and the constituent layer 130c, respectively. And terminal electrodes 132 provided at both ends of the long laminate.

  The inner conductor 133 constitutes an antenna pattern. In the present embodiment, the inner conductor 133 is configured as a reactance element having a length of about λg / 4 with respect to the used frequency, and the antenna pattern is formed in a meander shape.

  Further, both end portions of the inner conductor 133 are connected to the respective terminal electrodes 132. When attempting to realize a wide band, it is preferable that the relative dielectric constants of the constituent layers 130a to 130c of the antenna 130 be as small as possible. On the other hand, when considering miniaturization, the relative permittivity should be as large as possible. Therefore, a material having a relative dielectric constant suitable for the application, required performance, specifications, etc. may be used as the material constituting the constituent layers 130a to 130c. In general, the relative dielectric constant of the constituent layers 130a to 130c is 2.6 to 40, and the dielectric loss tangent is preferably 0.0075 to 0.025. A body layer is used. As a result, the frequency range is widened and can be formed with high accuracy. In addition, it is necessary to suppress material loss as much as possible. For this reason, by setting the dielectric loss tangent (tan δ) to 0.0025 to 0.0075, an antenna with extremely small material loss can be obtained. Each constituent layer may be the same or different, and an optimal combination may be selected.

  According to the antenna 130, the change in the relative permittivity with time can be sufficiently suppressed even when used under high humidity conditions. For this reason, the reliability of the antenna 130 in a high humidity environment is increased.

(13th Embodiment)
FIG. 35 is a perspective view of an antenna according to a thirteenth embodiment of the electronic component of the present invention, and FIG. 36 is an exploded perspective view of the antenna according to the thirteenth embodiment of the electronic component of the present invention.

  As shown in FIGS. 35 and 36, the antenna 140 includes a laminate formed by stacking the constituent layers 140a to 140c, and internal conductors 143a and 143b formed on the constituent layer 140b and the constituent layer 140c, respectively. . The upper and lower inner conductors 143a and 143b are connected by a via hole 144 to form a helical antenna pattern (inductance element). Note that terminal electrodes are provided at both ends of the multilayer body, respectively, as in the twelfth embodiment, and both ends of the antenna pattern are connected to the respective terminal electrodes.

(14th Embodiment)
FIG. 37 is a perspective view showing a patch antenna that is a fourteenth embodiment of an electronic component of the present invention, and FIG. 38 is a cross-sectional view showing a patch antenna that is a fourteenth embodiment of the electronic component of the present invention.

  As shown in FIGS. 37 and 38, the patch antenna 150 of the present embodiment is configured with a constituent layer 150a, a flat patch conductor 159 formed on the surface of the constituent layer 150a, and the patch conductor 159. As described above, the GND conductor 155 is formed on the bottom surface of the constituent layer 150a. Here, the patch conductor 159 constitutes an antenna pattern. The patch conductor 159 is connected to a power supply through conductor 154 through a power supply portion 153. A gap 156 is provided between the patch conductor 159 and the GND conductor 155 so that the through conductor 154 is not connected to the GND conductor 155. For this reason, power is supplied from the lower part of the GND conductor 155 through the through conductor 154.

  When attempting to realize a wide band, it is preferable that the relative dielectric constant of the constituent layer 150a of the patch antenna 150 is as low as possible. On the other hand, when considering miniaturization, the relative dielectric constant should be as high as possible. Therefore, as the constituent layer 150a, a material having a specific dielectric constant suitable for the purpose, required performance, specifications, and the like may be used. In general, the relative dielectric constant of the constituent layer 150a is 2.6 to 40, and the dielectric loss tangent is preferably 0.0075 to 0.025. The constituent layer 150a includes the above insulating layer or dielectric layer. Used. As a result, the frequency range is widened and can be formed with high accuracy. Further, by setting the dielectric loss tangent (tan δ) to 0.0025 to 0.0075, it is possible to provide an antenna with extremely low material loss and high radiation efficiency.

  Further, in the frequency band of several hundred MHz or less, the magnetic material can obtain the same wavelength shortening effect as the dielectric material, and can further increase the inductance value of the radiating element. Further, by combining the frequency peaks of the Q value, a high Q value can be obtained even at a relatively low frequency. For this reason, when the patch antenna 150 is used for a radio device of several tens to several hundreds of MHz, the magnetic permeability is preferably 3 to 20, and a magnetic layer containing magnetic powder is used as the constituent layer 150a. It is preferable to use it. Thereby, it is possible to realize high performance and downsizing in a frequency band of several hundred MHz or less. Each constituent layer may be the same or different, and an optimal combination may be selected.

  According to the patch antenna 150, the change with time of the relative dielectric constant can be sufficiently suppressed even when used under conditions. For this reason, the reliability of the patch antenna 150 in a high humidity environment is increased.

(Fifteenth embodiment)
FIG. 39 is a perspective view showing a patch antenna that is a fifteenth embodiment of an electronic component of the present invention, and FIG. 40 is a cross-sectional view showing a patch antenna that is a fifteenth embodiment of the electronic component of the present invention.

  As shown in FIGS. 39 and 40, the patch antenna 160 includes a constituent layer 160a, a patch conductor (antenna pattern) 169 formed on the surface of the constituent layer 160a, and a constituent layer so as to face the patch conductor 169. And a GND conductor 165 formed on the bottom surface of 160a. In addition, a feeding conductor 161 for feeding is arranged on the side surface of the constituent layer 160a in the vicinity of the patch conductor 169 so as not to contact with the patch conductor 169, and feeding is performed from the feeding terminal 162 to the feeding conductor 161. . The power supply terminal 162 is made of copper, gold, palladium, platinum, aluminum, or the like, and can be formed using a processing method such as plating, termination, printing, sputtering, or vapor deposition. Other components are the same as those in the fourteenth embodiment, and a description thereof will be omitted.

(Sixteenth embodiment)
41 is a perspective view showing a multilayer patch antenna according to a sixteenth embodiment of the electronic component of the present invention, and FIG. 42 is a cross section showing the multilayer patch antenna according to the sixteenth embodiment of the electronic component of the present invention. FIG.

  As shown in FIG. 41, the patch antenna 170 according to the present embodiment includes a laminate formed by laminating the constituent layers 150a and 150b, and patch conductors 159a and 159e formed on the constituent layers 150a and 150b, respectively. And a GND conductor 155 formed on the bottom surface of the constituent layer 150b so as to face the patch conductors 159a and 159e. Further, a through conductor 154 for feeding is connected to the patch conductor 159a through a feeding portion 153a. The through conductor 154 is not connected to the GND conductor 155 and the patch conductor 159e, and is connected between the GND conductor 155 and the patch conductor 159e. A gap 156 is provided. For this reason, power is supplied to the patch conductor 159a from the lower part of the GND conductor 155 through the through conductor 154. At this time, the patch conductor 159e is fed by a capacitance formed by capacitive coupling with the patch conductor 159a and a gap with the through conductor 154. Other components are the same as those in the fourteenth embodiment, and the same components are denoted by the same reference numerals and description thereof is omitted.

(17th Embodiment)
FIG. 43 is a perspective view showing a multiple patch antenna according to a seventeenth embodiment of the electronic component of the present invention, and FIG. 44 shows a multiple patch antenna according to the seventeenth embodiment of the electronic component of the present invention. FIG.

  The patch antenna 180 of this embodiment is a sixteenth embodiment in which only one conductive element portion is provided in the laminate, in that the four conductive element portions constituting the antenna are provided in a lattice shape in the laminate. It is different from the patch antenna of the embodiment. That is, as shown in FIGS. 43 and 44, the patch antenna 180 includes a laminate formed by laminating the constituent layers 150a and 150b, and patch conductors 159a, 159b, 159c and 159d formed on the constituent layer 150a, It has patch conductors 159e, 159f, 159g, and 159h formed on the constituent layer 150b, and a GND conductor 155 formed on the bottom surface of the constituent layer 150b so as to face the patch conductors 159a and 159e. Other components are the same as those in the sixteenth embodiment, and the same components are denoted by the same reference numerals and description thereof is omitted.

  As described above, by arranging a plurality of conductive element portions in a lattice on one laminate, it is possible to reduce the size of the patch antenna and the number of components.

(Eighteenth embodiment)
45 to 47 show a VCO (Voltage Controlled Oscillator) which is an eighteenth embodiment of the electronic component of the present invention. 45 is a perspective view, FIG. 46 is a sectional view, and FIG. 47 is an equivalent circuit diagram.

  As shown in FIGS. 45 to 47, the VCO 210 includes a laminated body in which the constituent layers 210 a to 210 g are laminated, and an electric element 261 such as a capacitor, an inductor, a semiconductor element, and a resistor formed and arranged on the laminated body, Conductive patterns formed on the constituent layers 210a to 210d and conductive patterns 262, 263, and 264 respectively formed on the constituent layers 210e to 210g. The VCO 210 is configured to form an equivalent circuit as shown in FIG. 47, and the conductor pattern 263 is a strip line. In addition to the strip line, the VCO 210 includes a capacitor, a signal line, a semiconductor element, a power supply line, and the like. For this reason, it is effective to form the constituent layers with a material suitable for each function.

  More specifically, a strip line is formed on the surface of the constituent layer 210g by a conductor pattern 263 that is an internal conductor, and a conductor pattern 262 as a GND conductor and a conductor pattern 266 as a terminal conductor are formed on the back surface. ing. A conductor pattern 264 as a capacitor conductor is formed on the surface of the constituent layer 210e, and a wiring inductor conductor 265 is formed on the surface of the constituent layer 210b. Further, the internal conductors formed in the respective constituent layers are connected by via holes 214, and the mounted electronic element 261 is mounted on the surface to form a VCO as shown in the equivalent circuit of FIG.

  For example, in the VCO 210 of the present embodiment, it is preferable to use an insulating layer or a dielectric layer having a dielectric loss tangent of 0.0025 to 0.0075 as the constituent layers 210f and 210g constituting the resonator, and the constituent constituting the capacitor. For the layers 210c to 210e, it is preferable to use a dielectric layer having a dielectric loss tangent of 0.0075 to 0.025 and a relative dielectric constant of 5 to 40. It is preferable to use an insulating layer or dielectric layer having a dielectric loss tangent of 0.0025 to 0.0075 and a relative dielectric constant of 2.6 to 3.5 for the constituent layers 210a and 210b constituting the wiring and the inductor.

  With such a configuration, it is possible to obtain a dielectric constant, a Q value, and a dielectric loss tangent suitable for each function, so that high performance, small size, and thinning can be achieved. According to the VCO 210, a change in the relative permittivity with time can be sufficiently suppressed even when used under high humidity conditions. For this reason, the reliability of the VCO 210 in a high humidity environment is increased.

(Nineteenth embodiment)
48 to 50 show a power amplifier (power amplifier) which is a nineteenth embodiment of the electronic component of the present invention. 48 is an exploded plan view of each constituent layer, FIG. 49 is a cross-sectional view, and FIG. 50 is an equivalent circuit diagram.

  As shown in FIGS. 48 to 50, the power amplifier 300 includes a laminated body in which the constituent layers 300a to 300e are laminated, and an electric element 361 such as a capacitor, an inductor, a semiconductor, and a resistor disposed on the laminated body. The conductive layers 313 and 315 are formed in the constituent layers 300a to 300e and on the upper and lower surfaces thereof. Since this power amplifier 300 is constituted by an equivalent circuit as shown in FIG. 50, it has strip lines L11 to L17, capacitors C11 to C20, signal lines, power lines to semiconductors, and the like. For this reason, it is effective to form a constituent layer with a material suitable for each function.

  More specifically, a conductor pattern 313 as an internal conductor, a conductor pattern 315 as a GND conductor, and the like are formed on the surface of these constituent layers 300a to 300e. Each internal conductor is connected by a via hole 314, and a mounted electric element 361 is mounted on the surface of the multilayer body to form a power amplifier 300 as shown in the equivalent circuit of FIG.

  In the power amplifier 300 of this embodiment, an insulating layer or a dielectric layer having a dielectric loss tangent of 0.0075 to 0.025 and a relative dielectric constant of 2.6 to 40 is used for the constituent layers 300d and 300e constituting the strip line. It is preferable. As the constituent layers 300a to 300c constituting the capacitor, it is preferable to use an insulating layer or a dielectric layer having a dielectric loss tangent of 0.0075 to 0.025 and a relative dielectric constant of 5 to 40.

  With this configuration, the dielectric constant, Q value, and dielectric loss tangent suitable for each function can be obtained, and high performance, small size, and thinning can be achieved. According to the power amplifier 300, the change with time of the relative permittivity can be sufficiently suppressed even when used under high humidity conditions. For this reason, the reliability of the power amplifier 300 in a high humidity environment is increased.

(20th embodiment)
51 to 53 show a superposition module used for an optical pickup or the like, which is a twentieth embodiment of the electronic component of the present invention. Here, FIG. 51 is an exploded plan view of each constituent layer, FIG. 52 is a sectional view, and FIG. 53 is an equivalent circuit diagram.

  As shown in FIGS. 51 to 53, the superposition module 400 includes a stacked body in which the constituent layers 400a to 400k are stacked, and electrical elements 461 such as capacitors, inductors, semiconductors, and registers formed and arranged on the stacked body. The conductive layers 413, 415 and the like are formed in the constituent layers 400a to 400k and on the upper and lower surfaces thereof. Since this superimposing module 400 is configured by an equivalent circuit as shown in FIG. 53, it has inductors L21 and L23, capacitors C21 to C27, signal lines, power supply lines to semiconductors, and the like. For this reason, it is effective to form a constituent layer with a material suitable for each function.

  More specifically, a conductor pattern 413 as an internal conductor, a conductor pattern 415 as a GND conductor, and the like are formed on the surfaces of these constituent layers 400a to 400k. Further, the internal conductors are connected to each other by a via hole 414, and a mounted electric element 461 is mounted on the surface to form a superposition module 400 as shown in the equivalent circuit of FIG.

  In the superposition module 400 of this embodiment, a dielectric layer having a dielectric loss tangent of 0.0075 to 0.025 and a relative dielectric constant of 10 to 40 is used for the constituent layers 400d to 400i constituting the capacitor. preferable. As the constituent layers 400a to 400c and 400j to 400k constituting the inductor, it is preferable to use an insulating layer or a dielectric layer having a dielectric loss tangent of 0.0025 to 0.0075 and a relative dielectric constant of 2.6 to 3.5.

  With this configuration, the dielectric constant, Q value, and dielectric loss tangent suitable for each function can be obtained, and high performance, small size, and thinning can be achieved. According to the superposition module 400, the change with time in relative permittivity can be sufficiently suppressed even when used under high humidity conditions. For this reason, the reliability of the superposition module 400 in a high humidity environment is increased.

(21st Embodiment)
54 to 57 show an RF module which is the twenty-first embodiment of the electronic component of the invention. 54 is a perspective view, FIG. 55 is a perspective view with the exterior member removed, FIG. 56 is an exploded perspective view of each component layer, and FIG. 57 is a cross-sectional view.

  As shown in FIGS. 54 to 57, the RF module 500 includes a laminated body in which the constituent layers 500a to 500i are laminated, and an electric element 561 such as a capacitor, an inductor, a semiconductor, and a resistor disposed on the laminated body, Conductive patterns 513, 515, and 572 formed in the constituent layers 500a to 500i and on the upper and lower surfaces thereof, and an antenna pattern 573 are included. As described above, the RF module 500 includes an inductor, a capacitor, a signal line, a power supply line to a semiconductor, and the like. For this reason, it is effective to form a constituent layer with a material suitable for each function.

  In the RF module 500 of this embodiment, the antenna configuration, the stripline configuration, and the constituent layers 500a to 500d and 500g as wiring layers have a dielectric loss tangent of 0.0025 to 0.0075 and a relative dielectric constant of 2.6 to 3. It is preferable to use an insulating layer or dielectric layer of .5. For the constituent layers 500e and 500f as the capacitor constituent layers, it is preferable to use a dielectric layer having a dielectric loss tangent of 0.0075 to 0.025 and a relative dielectric constant of 10 to 40. For the constituent layers 500h and 500i as the power supply line layers, it is preferable to use magnetic layers having magnetic permeability of 3 to 20 and containing magnetic powder.

  On the surface of these constituent layers 500a to 500i, a conductor pattern 513 as an internal conductor, a conductor pattern 515 as a GND conductor, an antenna pattern 573 as an antenna conductor, and the like are formed. Also, the respective internal conductors are connected to each other by via holes 514, and a mounted electric element 561 is mounted on the surface of the multilayer body, so that the RF module 500 is formed.

  With this configuration, the dielectric constant, Q value, and dielectric loss tangent suitable for each function can be obtained, and high performance, small size, and thinning can be achieved. According to the RF module 500, even if the RF module 500 is used under a high humidity condition, the change in relative permittivity with time can be sufficiently suppressed. For this reason, the reliability of the RF module 500 in a high humidity environment is increased.

(Twenty-second embodiment)
58 and 59 show a resonator as the twenty-second embodiment of the electronic component of the invention. 58 is a perspective view, and FIG. 59 is a cross-sectional view.

  As shown in FIGS. 58 and 59, the resonator 600 includes a base material 610 and a cylindrical coaxial conductor 641 that penetrates the base material 610.

  In the resonator 600, the surface GND conductor 647 and the end conductor 682 are formed on the surface of the base material 610 in which a cylindrical through-hole is formed by molding by plating, etching, printing, sputtering, vapor deposition, or the like. Then, the coaxial conductor 641 is formed on the inner wall surface of the base material 610 so that the surface GND conductor 647 and the end conductor 682 are connected, and the resonator HOT terminal 681 is formed so as to be connected to the coaxial conductor 641. . The surface GND conductor 647, the end conductor 682, the coaxial conductor 641, and the resonator HOT terminal 681 are formed of copper, gold, palladium, platinum, aluminum, or the like. Here, the coaxial conductor 641 is a coaxial line having a certain characteristic impedance, and a surface GND conductor 647 is formed on the base material 610 so as to surround the coaxial conductor 641.

  The base material 610 of this resonator can obtain desired resonance characteristics in a band of several hundred MHz to several GHz by setting the relative dielectric constant to 2.6 to 40. Further, it is desirable to suppress the material loss of the resonator as much as possible, and the dielectric loss tangent (tan δ) is preferably set to 0.0025 to 0.0075. As the base material 610, the insulating layer or the dielectric layer is used. According to the resonator 600, even if the resonator 600 is used under a high humidity condition, the change in relative permittivity with time can be sufficiently suppressed. For this reason, the reliability of the resonator 600 in a high humidity environment is increased.

(23rd Embodiment)
60 and 61 show a strip resonator which is a twenty-third embodiment of the electronic component of the present invention. 60 is a perspective view, and FIG. 61 is a cross-sectional view.

  As shown in FIGS. 60 and 61, the strip resonator 700 includes a laminated body in which the constituent layers 710a to 710d are stacked, a rectangular strip conductor 784 formed on the constituent layer 710c, the constituent layer 710b, and the constituent layers. A rectangular GND conductor 783 formed so as to sandwich the strip conductor 784 is provided on 710d. Further, a resonator HOT terminal 781 and a GND terminal 782 are provided on both sides of the laminate, respectively, and both ends of the strip conductor 784 are connected to the resonator HOT terminal 781 and the GND terminal 782, respectively. The strip resonator 700 may be manufactured in the same manner as the inductor of the first embodiment.

  The constituent layers 710a to 710d of the strip resonator 700 can obtain desired resonance characteristics in a band of several hundred MHz to several GHz by setting the relative dielectric constant to 2.6 to 40. Further, it is desirable to suppress the material loss of the resonator as much as possible, and the dielectric loss tangent (tan δ) is preferably set to 0.0025 to 0.0075. As the constituent layers 710a to 710d, the insulating layer or the dielectric layer is used.

(24th Embodiment)
FIG. 62 is a perspective view showing a resonator as the twenty-fourth embodiment of the electronic component of the invention.

  As shown in FIG. 62, the resonator 800 includes a base material 810, a cylindrical coaxial conductor 841 that passes through the base material 810, and a coaxial that passes through the base material 810 and is provided in parallel with the coaxial conductor 841. A type conductor 842. In the base material 810, an end electrode 882 is formed at one end of the coaxial conductor 842, and a connection electrode 885 is formed at the other end. One end of the coaxial conductor 841 is connected to the coaxial conductor 842 via the connection electrode 885, and a resonator HOT terminal 881 is formed at the other end. Here, the end electrode 882 and the resonator HOT terminal 881 are electrically insulated. A surface GND conductor 847 is formed so as to surround the base material 810. The surface GND conductor 847 is connected to the end electrode 882, but is electrically insulated from the resonator HOT terminal 881. Accordingly, the coaxial conductors 841 and 842 function as a coaxial line having a certain characteristic impedance.

  The base material 810 of the resonator 800 can obtain desired resonance characteristics in a band of several hundred MHz to several GHz by setting the relative dielectric constant to 2.6 to 40. Further, it is desirable to suppress the material loss of the resonator 800 as much as possible, and the dielectric loss tangent (tan δ) is preferably set to 0.0025 to 0.0075. As such a base material 810, the insulating layer or the dielectric layer is used.

(25th Embodiment)
FIG. 63 is a perspective view showing a strip resonator according to a twenty-fifth embodiment of the electronic component of the present invention.

  As shown in FIG. 63, the strip resonator 850 includes a laminated body formed by laminating a plurality of constituent layers 810, a U-shaped strip conductor 884 formed on the constituent layer 810, and the strip conductor 884 as constituent layers. And a rectangular GND conductor 883 arranged so as to be sandwiched from above and below via 810. Further, a resonator HOT terminal 881 and a GND terminal 882 are arranged in parallel on both sides of the multilayer body, and both ends of the strip conductor 884 are connected to the resonator HOT terminal 881 and the GND terminal 882, respectively. The manufacturing method of the strip resonator 850 is the same as that of the inductor of the first embodiment.

  The constituent layer 810 of the strip resonator 850 can obtain desired resonance characteristics in the band of several hundred MHz to several GHz by setting the relative dielectric constant to 2.6 to 40. Further, it is desirable to suppress the material loss of the strip resonator 850 as much as possible, and the dielectric loss tangent (tan δ) is preferably set to 0.0025 to 0.0075. As such a constituent layer 810, the insulating layer or the dielectric layer is preferably used.

  FIG. 64 shows an equivalent circuit diagram of the resonators of the twenty-second to twenty-fifth embodiments. As shown in FIG. 64, a resonator HOT terminal 981 is connected to one end of resonators 984 and 941 constituted by a coaxial line or a strip line, and a GND terminal 982 is connected to the other end of the resonators 984 and 941. ing.

(26th Embodiment)
FIG. 65 is a block diagram showing a twenty-sixth embodiment of the electronic component of the present invention, and shows an example in which the electronic component of the present invention is used for a portable terminal device.

  In the mobile terminal device 1000 shown in FIG. 65, the transmission signal transmitted from the baseband unit 1010 is mixed with the RF signal from the hybrid circuit 1021 by the mixer 1001. The hybrid circuit 1021 is connected to a voltage control transmission circuit (VCO) 1020, which forms a synthesizer circuit together with a phase lock loop circuit (PLL) 1019 so that an RF signal having a predetermined frequency is supplied. .

  The transmission signal subjected to RF modulation by the mixer 1001 is amplified by a power amplifier 1003 through a band pass filter (BPF) 1002. A part of the output of the power amplifier 1003 is taken out from the coupler 1004, adjusted to a predetermined level by the attenuator 1005, and then input to the power amplifier 1003 again to adjust the gain of the power amplifier 1003 to be constant. Is done. The transmission signal transmitted from the coupler 1004 is input to the duplexer 1008 via the isolator 1006 for preventing backflow and the low pass filter (LPF) 1007, and transmitted from the antenna 1009 connected thereto.

  On the other hand, the received signal input to the antenna 1009 is input from the duplexer 1008 to the amplifier 1011 and amplified to a predetermined level. The reception signal output from the amplifier 1011 is input to the mixer 1013 through the band pass filter (BPF) 1012. An RF signal is input to the mixer 1013 from the hybrid circuit 1021 via the band pass filter (BPF) 1022, and the RF signal component is removed and demodulated. The reception signal output from the mixer 1013 is amplified by the amplifier 1015 through the SAW filter 1014 and then input to the mixer 1016. A local transmission signal having a predetermined frequency is input to the mixer 1016 from a local transmission circuit 1018. The received signal is converted into a desired frequency, amplified to a predetermined level by an amplifier 1017, and then transmitted to the baseband unit 1010. The

  The portable terminal 1000 includes an antenna front end module (see the broken line in FIG. 65) 1200 including an antenna 1009, a duplexer 1008, and a low-pass filter 1007, and an isolator power amplifier including an isolator 1006, a coupler 1004, an attenuator 1005, and a power amplifier 1003. As the module (see the broken line in FIG. 65) 1100 and the like, the antenna and the power amplifier described above can be used, and thus a hybrid module can be configured. Moreover, as already described in the twenty-first embodiment, it is possible to configure an RF unit including components other than these as described in the twenty-first embodiment, and the BPF, VCO, and the like in FIG. 65 are also included in the ninth to eleventh and eighteenth embodiments. The VCO shown can be used.

  When the electronic component according to the present embodiment is mounted on the mobile terminal device as described above, the mobile terminal 1000 can be downsized by downsizing the electronic component. Moreover, since the electronic component of this embodiment is excellent in bending strength, the electronic component can be sufficiently prevented from being damaged or deformed when the electronic component is attached. Furthermore, since the electronic component of this embodiment sufficiently prevents changes in dielectric characteristics over time even when used at high humidity, the performance of the portable terminal 1000 can be maintained over a long period of time even when used at high humidity. Can do.

(27th Embodiment)
66 to 68 show a manufacturing process of the printed wiring board according to the twenty-seventh embodiment of the present invention. First, a sheet with a double-sided copper foil in which copper foil 1102 is attached to both upper and lower surfaces of the composite material 1101 shown in FIG. 66 (a) is prepared, and a resist film 1103 is placed on the copper foil 1102 of this sheet (FIG. 66). (B)) Further, a mask 1104 is disposed, exposed (FIG. 66 (c)), developed (FIG. 66 (d)) and etched (FIG. 66 (e)), and then the resist is peeled off (FIG. 66 (f)). )), A double-sided patterning substrate is formed. Next, as shown in FIG. 66 (g), three prepregs 1105 and two double-sided patterning substrates are alternately stacked to form five layers, which are then heated and molded. Subsequently, for example, a through through hole 1106 is formed by NC processing (FIG. 66 (h)), and desmear electroless plating is applied to the formed through through hole 1106 to form an electroless plated film 1107 (FIG. 66 (i)). )). Next, after electrolytic plating (FIG. 67 (j)) and polishing (FIG. 67 (k)), a resist is disposed (FIG. 67 (l)), and a mask 1108 is disposed for exposure (FIG. 67). (M)), development (FIG. 67 (n)), etching (FIG. 67 (o)), and then the resist is removed (FIG. 68 (p)). Subsequently, a printed wiring board is formed by disposing a resist (FIG. 68 (q)) and performing nickel plating and gold plating (FIG. 68 (r)). The insulating layer or the dielectric layer is used as the composite material 1101 and the prepreg 1105 of the printed wiring board formed as described above.

(Twenty-eighth embodiment)
69 to 71 show a manufacturing process of a printed wiring board according to the twenty-eighth embodiment of the present invention. Similarly to the twenty-seventh embodiment, a sheet with a double-sided copper foil in which copper foil 1202 is attached to both the upper and lower surfaces of the composite material 1201 shown in FIG. 69A is prepared, and a resist film 1203 is formed on the copper foil 1202 of this sheet. (FIG. 69 (b)), and further, a mask 1204 is arranged and exposed (FIG. 69 (c)), developed (FIG. 69 (d)), and etched (FIG. 69 (e)), and then the resist is peeled off. Then (FIG. 69 (f)), a double-sided patterning substrate is formed. Next, as shown in FIG. 69 (g), a semi-cured sheet (RCC) 1205 is stacked and pressurized and heated so as to sandwich the double-sided patterning substrate. Subsequently, after resist, exposure, development, etching, and resist removal (FIG. 69 (h)), laser processing is performed to form a through hole (FIG. 69 (i)). Next, after applying desmear electroless plating to the through hole to form an electroless plating film (FIG. 69 (j)), electroplating (FIG. 70 (k)) and polishing (FIG. 70 (l)) The semi-cured sheets (RCC) are stacked and heated under pressure so as to sandwich them (FIG. 70 (m)). Subsequently, after resist, exposure, development, etching, and resist removal (FIG. 70 (n)), desmear electroless plating, electrolytic plating, and polishing (FIG. 70 (o)) are performed, and further, resist, exposure, Development, etching, and resist removal are performed (FIG. 70 (p)). Then, a printed wiring board is formed by disposing a resist (FIG. 71 (q)) and performing nickel plating and gold plating (FIG. 71 (r)). The insulating layer or the dielectric layer is used as the composite material 1201 and RCC 1205 of the printed wiring board formed as described above.

  The present invention is not limited to the embodiment described above. For example, the printed wiring board and the electronic component of the present invention include a coil core, a toroidal core, a disk capacitor, a through capacitor, a clamp filter, a common mode filter, an EMC filter, and a power supply filter, in addition to the circuit and the electronic component described in the above embodiment. , Pulse transformer deflection coil, choke coil, DC-DC converter, delay line, radio wave absorbing sheet, thin wave absorber electromagnetic shield, diplexer, duplexer, antenna switch circuit, antenna front end circuit, iterator / power amplifier circuit, PLL circuit, Front-end circuit, tuner circuit unit, directional coupler, bull balanced mixer (DBM), power combiner, power distributor, toner sensor, current sensor, actuator sounder (piezoelectric sound generator), microphone, receiver Bas, buzzer, PTC thermistor, temperature fuse, may be a ferrite stone and the like.

  The present invention will be described more specifically with reference to the following examples, but the present invention is not limited to these examples.

<Synthesis Example 1>
Into a reaction vessel, 1000 ml of water and 20 g of sodium hydroxide were placed, and in a nitrogen stream, the amounts of aromatic monohydroxy compound and aromatic polyhydroxy compound of the amount shown in the column of Synthesis Example 1 in Table 1 were charged, and Ferdler The mixture was stirred for 1 hour at 300 rpm with a blade. Next, a solution prepared by dissolving the acid halide of the aromatic polyvalent carboxylic acid in an amount shown in the column of Synthesis Example 1 in Table 1 in 1000 ml of methylene chloride was dropped into a reaction vessel maintained at 30 ° C. over 15 seconds. Stirring was continued for 4 hours. The resulting mixture is allowed to stand and remove to remove the aqueous phase, and the remaining methylene chloride phase is washed with a 0.5% strength aqueous sodium hydroxide solution and the aqueous phase is removed three times. Washing with ionic water and removal of the aqueous phase were repeated three times. After the washed methylene chloride phase was concentrated to 400 ml, 1000 ml of heptane was added dropwise over 15 seconds, and the precipitate was washed with methanol, filtered and dried to obtain polyester (A1).

<Synthesis Examples 2-3>
In the synthesis example 1, instead of the aromatic monohydroxy compound and the aromatic polyhydroxy compound in the amount shown in the synthesis example 1 column of Table 1, the fragrance in the amount shown in the synthesis examples 2 and 3 column of Table 1 Polyesters (A2) to (A3) were obtained in the same manner as in Synthesis Example 1 except that an aromatic monohydroxy compound and an aromatic polyvalent hydroxy compound were used.

<Synthesis Example 4>
1000 ml of water and 20 g of sodium hydroxide are placed in a reaction vessel, and an aromatic monohydroxy compound in the amount shown in the column of Synthesis Example 4 in Table 1 is charged in a nitrogen stream, and 1 at 300 revolutions per minute by a Faddler blade. Stir for hours. Next, a solution prepared by dissolving an acid halide of an aromatic polyvalent carboxylic acid in an amount shown in the column of Synthesis Example 4 in Table 1 in 1000 ml of methylene chloride was dropped into a reaction vessel maintained at 30 ° C. over 15 seconds. Stirring was continued for 4 hours. The resulting mixture is allowed to stand and remove to remove the aqueous phase, and the remaining methylene chloride phase is washed with a 0.5% strength aqueous sodium hydroxide solution and the aqueous phase is removed three times. Washing with ionic water and removal of the aqueous phase were repeated three times. After the methylene chloride phase after washing was concentrated to 400 ml, 1000 ml of heptane was added dropwise over 15 seconds, and the precipitate was washed with methanol, filtered and dried to obtain ester (B1).

<Synthesis Example 5>
Into a reaction vessel, 1000 ml of water and 20 g of sodium hydroxide were placed, and in a nitrogen stream, the amounts of aromatic monohydroxy compound and aromatic polyhydroxy compound of the amount shown in the column of Synthesis Example 1 in Table 1 were charged, and Ferdler The mixture was stirred for 1 hour at 300 rpm with a blade. Next, a solution prepared by dissolving an acid halide of an aromatic polyvalent carboxylic acid in an amount shown in the column of Synthesis Example 5 in Table 1 in 1000 ml of methylene chloride was dropped into a reaction vessel maintained at 30 ° C. over 15 seconds. Stirring was continued for 4 hours. The resulting mixture is allowed to stand and remove to remove the aqueous phase, and the remaining methylene chloride phase is washed with a 0.5% strength aqueous sodium hydroxide solution and the aqueous phase is removed three times. Washing with ionic water and removal of the aqueous phase were repeated three times. After the methylene chloride phase after washing was concentrated to 400 ml, 1000 ml of heptane was added dropwise over 15 seconds, and the precipitate was washed with methanol, filtered and dried to obtain polyester (A4).

<Synthesis Example 6>
Instead of the aromatic polyvalent hydroxy compound and the aromatic monocarboxylic acid in the amount shown in the column of Synthesis Example 5 in Table 1, the amount of the aromatic monocarboxylic acid in the column of Synthesis Example 6 in Table 1 was used instead of the aromatic monocarboxylic acid. A polyester (A5) was obtained in the same manner as in Synthesis Example 5 except that a carboxyl compound and an aromatic monocarboxylic acid were used.

<Synthesis Example 7>
Into a reaction vessel, 400 ml of tetrahydrofuran was placed, in a nitrogen stream, 11 g of triethylamine and 5.1 g of resorcinol were dissolved, and a solution prepared by dissolving 5.1 g of isophthalic acid chloride in 100 ml of tetrahydrofuran was added dropwise over 30 minutes while cooling with ice. After stirring for 4 hours, a solution prepared by dissolving 19.9 g of p-acetoxybenzoic acid chloride in 100 ml of tetrahydrofuran was added dropwise. After completion of dropping, the solution was poured into a 5% strength aqueous sodium carbonate solution, and the precipitate was filtered with suction, washed with water and methanol, dried under reduced pressure, and polyester (H1) represented by the following formula (23) ( The number average molecular weight 2900) was obtained.

（２３）

(23)

<Synthesis Example 8>
1000 ml of water and 20 g of sodium hydroxide were placed in a reaction vessel, and 45.7 g of bisphenol A and 1.2 g of tetrabutylammonium bromide were dissolved in a nitrogen stream. To a reaction vessel kept at 30 ° C., 1000 ml of a methylene chloride solution in which 32.5 g of isophthalic acid chloride and 8.1 g of terephthalic acid chloride were dissolved was dropped in 30 seconds. After stirring for 1 hour, the mixture was allowed to stand for liquid separation, and the aqueous phase was removed. The remaining methylene chloride phase was washed with a 0.5% strength aqueous sodium hydroxide solution and the aqueous phase was removed three times. Further, washing with deionized water and removal of the aqueous phase were repeated three times. After the methylene chloride phase after washing was concentrated to 400 ml, 1000 ml of heptane was added dropwise over 15 seconds, and then the precipitate was washed with methanol, filtered and dried to obtain a polyester represented by the following formula (24) ( H2) (number average molecular weight 8600) was obtained.

（２４）

(24)

<Synthesis Example 9>
A reaction vessel was charged with a solution of 152 g of trimethylhydroquinone in a mixed solvent of 500 g of toluene and 200 g of ethylene glycol monoethyl ether, and 4.6 g of p-toluenesulfonic acid was added to the solution, and 64 g of benzaldehyde was added dropwise. It stirred at 120 degreeC for 15 hours, distilling a water | moisture content. Next, the precipitated crystals were cooled and filtered, and washed repeatedly with water until the filtrate became neutral to obtain dihydroxybenzopyran represented by the following formula (25).

（２５）

(25)

<Synthesis Example 10>
A reaction vessel was charged with 187 g of dihydroxybenzopyran represented by the above formula (25), 463 g of epichlorohydrin, 53 g of n-butanol, and 2.3 g of tetraethylbenzylammonium chloride, dissolved in a nitrogen stream, and co-resisted at a temperature of 65 ° C. After reducing the pressure to boiling, 82 g of a 49% aqueous sodium hydroxide solution was added dropwise over 5 hours and stirred for 30 minutes. Unreacted epichlorohydrin was distilled off under reduced pressure, and then 550 g of methyl isobutyl ketone and 55 g of n-butanol were added to the resulting solution. 15 g of 10% aqueous sodium hydroxide solution was added and reacted at 80 ° C. for 2 hours. The reaction product was washed with water to obtain a benzopyran type epoxy resin represented by the following formula (26).

（２６）

(26)

The aromatic polyvalent hydroxy compounds shown in Table 1 each represent the following.
DHDBP: Dihydroxybenzopyran (in formula (13), Y is a methylene group substituted with a phenyl group, n and m are both 3, and the aromatic represented by formula (25) obtained in Synthesis Example 9 Polyvalent hydroxy compound, hydroxy group equivalent 187 g / eq).
DCPDDP: Dicyclopentadienyl diphenol “DPP-6085” manufactured by Nippon Petroleum Corporation (aromatic dihydroxy compound in which the average value of k is 0.16 in formula (12), hydroxy group equivalent 165 g / eq).
DHDN: dihydroxy dinaphthalene (aromatic dihydroxy compound represented by the formula (14). Hydroxy group equivalent 143 g / eq) manufactured by Tokyo Chemical Industry Co., Ltd.

<Examples 1 to 5, 14 to 17>
Using polyesters A1 to A5 and ester B1 obtained in Synthesis Examples 1 to 6 as curing agents, these curing agents and epoxy resins, curing accelerators, organic solvents (solvents), flame retardants, and styrene elastomers or butadiene as necessary The system polymer was mixed at 25 ° C. with the composition shown in Table 2 to prepare a varnish.
<Examples 6 to 13 and 18 to 24>
According to the composition shown in Table 2, using polyesters A1 to A5 and ester B1 obtained in Synthesis Examples 1 to 6 as curing agents, these curing agents and epoxy resins, curing accelerators, solvents, and optionally flame retardants or styrene The system elastomer was mixed at 25 ° C. to dissolve the resin, and then the coupling agent and dielectric powder were added and dispersed to prepare a varnish.

  The prepared varnish was coated and dried on a PET film with a known doctor blade coating machine to prepare a composite dielectric semi-cured sheet having a thickness of 50 μm. 20 sheets of the obtained composite dielectric sheets were superposed and pressure-pressed in vacuum at 150 ° C. and 4 MPa for 1 hour, and then thermally cured in a vacuum dryer at 190 ° C. for 10 hours to obtain a cured epoxy resin product. Obtained.

<Comparative Examples 1 and 7>
In Examples 1 and 14, varnishes were prepared in exactly the same manner as in Examples except that the flame retardant was omitted.

<Comparative Examples 2-5>
Polyesters H1 and H2 obtained in Synthesis Examples 7-8, adipic acid di (nitrophenyl) ester, and methyltetrahydrophthalic anhydride were used as curing agents to represent epoxy resins, curing agents, curing accelerators, and organic solvents. The varnish was prepared by mixing with the composition shown in 3.

<Comparative Examples 6 and 8>
In accordance with the composition shown in Table 3, Synthesis Examples 1 and 5, using the obtained polyesters A1 and A4 as curing agents, these curing agents and epoxy resins, curing accelerators, solvents, and flame retardants are mixed at 25 ° C. to dissolve the resins. Then, a coupling material and dielectric powder were added and dispersed to prepare a varnish.

  The prepared varnish was coated and dried on a PET film with a known doctor blade coating machine to prepare a composite dielectric semi-cured sheet having a thickness of 50 μm. 20 sheets of the obtained composite dielectric sheets were superposed and pressure-pressed in vacuum at 150 ° C. and 4 MPa for 1 hour, and then thermally cured in a vacuum dryer at 190 ° C. for 10 hours to obtain a cured epoxy resin product. Obtained.

  The epoxy resins, curing accelerators, flame retardants, styrene elastomers, and butadiene polymers shown in Tables 2 and 3 respectively represent the following. The values in the columns of epoxy resin, curing agent, curing accelerator, solvent, dielectric powder, silane coupling agent, flame retardant, styrene elastomer, butadiene polymer, and polymerization initiator in Tables 2 and 3 are Represents mass (g).

EPICLON HP-7200H: a dicyclopentadiene novolac type epoxy resin (epoxy equivalent 280 g / eq) manufactured by Dainippon Ink and Chemicals, Inc.
Benzopyran-type epoxy resin: The benzopyran-type epoxy resin represented by the formula (26) obtained in Synthesis Example 10 (epoxy equivalent: 265 g / eq).
DMAP: 4-dimethylaminopyridine.
SAYTEX 8010: Ethane-1,2-bis (pentabromophenyl) manufactured by Albemarle Corporation.
KRATON G 1701: Clayton polymer styrene-ethylene-propylene diblock copolymer.
BF-1000: partially epoxidized 1,2-polybutadiene (oxirane oxygen = 8%) manufactured by Asahi Denka Kogyo Co., Ltd.

  Using the varnishes obtained in Examples 1 to 24 and Comparative Examples 1 to 8, the semi-cured sheets (A) and semi-cured sheets (B) of Examples 1 to 24 and Comparative Examples 1 to 8 were obtained by the following method. , Prepreg sheet (C), cured sheet (Da), cured sheet with double-sided copper foil (Db), cured sheet with glass cloth (E), cured sheet with glass cloth with double-sided copper foil (Fa), A glass cloth-containing cured sheet (Fb) with double-sided copper foil was produced.

[Semi-cured sheet (A), Semi-cured sheet (B)]
The varnish obtained above was coated with a horizontal coating machine (manufactured by Hirano Techseed Co., Ltd.) by controlling the gap with a doctor blade.
A polyethylene terephthalate sheet (thickness 50 μm) or 18 μm electrolytic copper foil (Nikko Materials JTC foil) is used for the support, the gap is 100 to 150 μm, the speed is 0.3 m / min, and the drying is hot air at 120 ° C./5 minutes. It performed by drying and wound up with the roll to roll. This is cut into a size of 100 × 100 mm to obtain a semi-cured sheet A with a single-sided PET support (Examples 1 to 24) and a semi-cured sheet B with a single-sided copper foil (Examples 1 to 24) having an insulating layer thickness of 50 μm. It was. For Comparative Examples 1 to 8, a semi-cured sheet A with a PET support on one side and a semi-cured sheet B with a copper foil on one side were prepared in the same procedure.

[Prepreg-like sheet (C)]
The varnish obtained above was impregnated on a glass cloth (1080 type, E glass, manufactured by Asahi Schwer) using an impregnation coating apparatus (manufactured by Ichikin Engineering Co., Ltd.). The coating speed was 0.3 m / min, the gap was 300 μm, the drying conditions were 80 ° C./5 minutes + 120 ° C./5 minutes, and the film was wound up by a roll to roll. Furthermore, it cut | judged to 100x100 mm, and obtained the prepreg sheet C which concerns on Examples 1-24 and Comparative Examples 1-8 of thickness 100 micrometers.

[Hardened material sheet (Da)]
The semi-cured sheets A according to Examples 1 to 24 and Comparative Examples 1 to 8 were pasted on a hot plate heated to 100 ° C., and the support removal was repeated 16 times to obtain a thick semi-cured sheet having a thickness of 0.8 mm. Furthermore, using a high temperature vacuum press (KVHC type, manufactured by Kitagawa Seiki Co., Ltd.), keeping at 4 ° C. → 130 ° C./60 minutes → 4 ° C./min→190° C./3 hours, pressure 1 MPa Went. The thickness of the obtained cured product sheet (Da) is 0.7 mm.

[Curing sheet with double-sided copper foil (Db)]
The semi-cured sheets (B) with copper foil according to Examples 1 to 24 and Comparative Examples 1 to 8 are stacked together with the insulating layer (resin layer), and a high-temperature vacuum press (KVHC type, manufactured by Kitagawa Seiki Co., Ltd.). 4) /min.→130° C./60 min. Keep → 4 ° C./min.→190° C./3 hr. Under high pressure of 2 MPa. The thickness of the obtained cured sheet with double-sided copper foil (Db) was 0.1 mm.

[Hardened glass cloth sheet (E)]
Eight prepreg-like sheets (C) according to Examples 1 to 24 and Comparative Examples 1 to 8 were stacked, and using a high-temperature vacuum press (KVHC type, manufactured by Kitagawa Seiki Co., Ltd.), 4 ° C./min→130° C./60. High temperature vacuum pressing was performed under the conditions of minute keeping → 4 ° C./min→190° C./3 hours and pressure of 1 MPa. The thickness of the obtained glass cloth-containing cured product sheet (E) was 0.7 mm.

[Hardened glass cloth with double-sided copper foil sheet (Fa)]
18 μ-thick electrolytic copper foil (manufactured by Nikko Materials Co., Ltd., JTC foil) is superimposed on the upper and lower surfaces of the prepreg sheets (C) according to Examples 1 to 24 and Comparative Examples 1 to 8, and a high temperature vacuum press (KVHC type). 4 hours / minute → 130 ° C./60 minutes keep → 4 ° C./minute→190° C./3 hours under a pressure of 2 MPa. The thickness of the obtained glass cloth-containing cured sheet (Fa) with double-sided copper foil was 0.1 mm.

[Hardened glass cloth with double-sided copper foil sheet (Fb)]
A glass cloth (1080 type, E glass, manufactured by Asahi Schwer) was sandwiched between the semi-cured sheets (B) with copper foil according to Examples 1 to 24 and Comparative Examples 1 to 8, and a high-temperature vacuum press (KVHC type, Kitagawa Seiki Co., Ltd.) was used, and high-temperature vacuum pressing was performed under the conditions of 4 ° C./min→130° C./60 min keep → 4 ° C./min→190° C./3 hours and pressure 2 MPa. The thickness of the obtained glass cloth-containing cured sheet (Fb) with double-sided copper foil was 0.1 mm.

  Evaluation of semi-cured sheet, prepreg sheet, cured sheet, glass cloth-containing cured sheet, double-sided copper foil-cured cured sheet, double-sided copper foil-coated glass cloth-cured cured sheet produced by the above method is as follows. went. The results are shown in Table 4.

(Measurement of dielectric properties)
Hardened material sheet (Da) and glass cloth-cured cured material sheet (E) are cured by epoxy resin after being dried in a room at 23 ° C. and 50% humidity for 24 hours by the perturbation method, which is the original TDK measurement method. The dielectric constant and Q value (reciprocal of dielectric loss tangent) at 2 GHz of the cured epoxy resin after a moisture absorption test by a pressure cooker test at 121 ° C. for 2 hours were measured.
The rate of change of dielectric constant is the rate of change of dielectric constant (%) calculated by the following formula = (dielectric constant after moisture absorption−initial dielectric constant) / (initial dielectric constant) × 100

(Copper foil peeling (peel strength) test)
About the hardened | cured material sheet (Db) with a double-sided copper foil, and a glass cloth containing hardened | cured material sheet (Fa), (Fb) with a double-sided copper foil, according to JISC6481, the foil of width 10mm is perpendicular | vertical at the speed of 50 mm / min. The strength when peeled off was measured.

(Measurement of glass transition temperature (Tg))
About the hardened | cured material sheet | seat (Da) and the glass cloth containing hardened | cured material sheet | seat (E), the temperature of the peak value of tan-delta in 1 Hz was measured as a glass transition temperature with the viscoelasticity spectrometer "DMS200" by Seiko Electronics Industry Co., Ltd.

(UL-94 flame resistance test)
Regarding the cured product sheet (Da) and the glass cloth-containing cured product sheet (E), a vertical combustion test based on the UL-94 standard was evaluated as “good”, and a rejected product was evaluated as “poor”.

(Solder heat resistance test)
About the hardened | cured material sheet | seat (Da) and the glass cloth containing hardened | cured material sheet | seat (E), the state of the epoxy resin hardened | cured material immersed for 120 second in a 300 degreeC solder bath was evaluated visually by the method based on JIS-C-6481. . When there was no blistering or cracking by visual inspection, the circle was marked with ○, and when blistering or cracking occurred, x was marked.

  As is apparent from the results shown in Table 4, the various sheets of Examples 1 to 24 produced using the cured epoxy resin of the present invention have a low dielectric loss tangent, high heat resistance, and high volume resistivity (insulating properties). As well as excellent flame retardancy. Furthermore, the various sheets of Examples 2 to 4, 7 to 13, 15 to 16, and 19 to 24 manufactured using epoxy resin cured products to which a styrene-based or polybutadiene-based polymer is added as a flexibility imparting material, The flexibility in the cured state (B stage) is good, and the handling property, crack resistance and the like are improved. As described above, it is possible to provide a printed wiring board and an electronic component that are made of a material having a low dielectric loss tangent, a high glass transition temperature, and high flame retardancy.

  As described above, in the printed wiring board and electronic component of the present invention, the aromatic polyvalent carboxylic acid residue and the aromatic polyvalent hydroxy compound residue having an aryloxycarbonyl group or an arylcarbonyloxy group at the molecular chain terminal are obtained. By using the polyester (A) composed of a group as a curing agent for the epoxy resin composition, a highly polar hydroxy group is not generated at the time of curing, and an epoxy resin cured product having a low dielectric loss tangent can be obtained. Can be obtained. The cured product does not liberate a low molecular weight carboxylic acid that increases the dielectric loss tangent by hydrolysis accompanying moisture absorption, and exhibits a low dielectric loss tangent even under high humidity conditions.

  In addition, since the polyester chain (A) is used as a curing agent for the epoxy resin, since the ester chain having a reactive activity with respect to the epoxy group is also present in the molecular chain, the crosslinking density of the cured epoxy resin is increased, and the glass transition A printed wiring board and an electronic component having a high temperature and excellent heat resistance can be obtained.

  Furthermore, by adding a curing accelerator, the curing rate of the cured epoxy resin can be accelerated to improve productivity. By adding a flame retardant, it is possible to impart flame retardancy required for electrical insulating material applications. By adding an organic solvent, it is possible to impart coating properties and impregnation properties necessary for the production of materials for printed wiring boards and electronic components.

Particularly, when the aromatic polyvalent hydroxy compound residue is a group represented by the formulas (1) to (4) and having a bulky aromatic ring or alicyclic structure in the molecule, the resulting polyester (A) The polyester (A) is excellent in solubility in an organic solvent, and the varnish is adjusted when the epoxy resin composition containing the polyester (A) is dissolved in the solvent. In this case, a small amount of solvent may be used.
Moreover, the polyester (A) obtained from the aromatic polyvalent carboxylic acid represented by the general formulas (5) to (7) as the aromatic polyvalent carboxylic acid exhibits excellent solubility in various solvents. Moreover, the epoxy resin hardened | cured material which shows low dielectric loss tangent is obtained from the epoxy resin composition which used the polyester (A) using the aromatic monohydroxy compound represented by General formula (8)-(10) as a hardening | curing agent. It is done.

  A cured epoxy resin using a brominated aromatic flame retardant as the flame retardant is less likely to have an adverse effect on electrical characteristics such as dielectric loss tangent and dielectric constant, and is suitable for applications such as electrical insulation materials.

  Epoxy resin cured product to which at least one of styrene elastomer and polybutadiene polymer is added as a flexibility-imparting material is excellent in handling property in a semi-cured state, and the resin falls off when cracking or cutting (powder falling) Etc. can be suppressed.

  Since the printed wiring board and the electronic component of the present invention are manufactured using the epoxy resin cured product, the printed wiring board and the electronic component have low dielectric loss tangent, high heat resistance, and flame retardancy, and are particularly dielectric even in a high humidity environment. The rate is difficult to change. As a result, it is possible to obtain a printed circuit board and an electronic component whose characteristic change is small under high humidity conditions.

It is a see-through perspective view showing an inductor which is a first embodiment of an electronic component of the present invention. It is sectional drawing which shows the inductor which is 1st Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the inductor which is 2nd Embodiment of the electronic component of this invention. It is sectional drawing which shows the inductor which is 2nd Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the inductor which is 3rd Embodiment of the electronic component of this invention. It is sectional drawing which shows the inductor which is 3rd Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the inductor which is 4th Embodiment of the electronic component of this invention. It is sectional drawing which shows the inductor which is 4th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the inductor which is 5th Embodiment of the electronic component of this invention. (A) is an equivalent circuit diagram which shows the inductor which is 1st Embodiment of the electronic component of this invention, (b) is an equivalent circuit diagram which shows the inductor which is 5th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the capacitor which is 6th Embodiment of the electronic component of this invention. It is sectional drawing which shows the capacitor which is 6th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the capacitor which is 7th Embodiment of the electronic component of this invention. (A) is an equivalent circuit diagram which shows the capacitor which is 6th Embodiment of the electronic component of this invention, (b) is an equivalent circuit diagram which shows the capacitor which is 7th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the balun transformer which is 8th Embodiment of the electronic component of this invention. It is sectional drawing which shows the balun transformer which is 8th Embodiment of the electronic component of this invention. It is a decomposition | disassembly top view of each structure layer of the balun transformer which is 8th Embodiment of the electronic component of this invention. It is an equivalent circuit diagram which shows the balun transformer which is 8th Embodiment of the electronic component of this invention. It is a perspective view which shows the multilayer filter which is 9th Embodiment of the electronic component of this invention. It is a disassembled perspective view which shows the multilayer filter which is 9th Embodiment of the electronic component of this invention. It is an equivalent circuit diagram which shows the multilayer filter which is 9th Embodiment of the electronic component of this invention. It is a graph which shows the transfer characteristic of the multilayer filter which is 9th Embodiment of the electronic component of this invention. It is a perspective view which shows the multilayer filter which is 10th Embodiment of the electronic component of this invention. It is a disassembled perspective view which shows the multilayer filter which is 10th Embodiment of the electronic component of this invention. It is an equivalent circuit diagram which shows the multilayer filter which is 10th Embodiment of the electronic component of this invention. It is a graph which shows the transfer characteristic of the multilayer filter which is 10th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the coupler which is 11th Embodiment of the electronic component of this invention. It is sectional drawing which shows the coupler which is 11th Embodiment of the electronic component of this invention. It is a disassembled perspective view of each component layer of the coupler which is 11th Embodiment of the electronic component of this invention. It is an internal connection figure of the coupler which is 11th Embodiment of the electronic component of this invention. It is an equivalent circuit schematic of the coupler which is 11th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the antenna which is 12th Embodiment of the electronic component of this invention. It is a figure which shows the antenna which is 12th Embodiment of the electronic component of this invention, (a) is a top view, (b) is side sectional drawing, (c) is front sectional drawing. It is a disassembled perspective view of each structure layer of the antenna which is 12th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the antenna which is 13th Embodiment of the electronic component of this invention. It is a disassembled perspective view which shows the antenna which is 13th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the patch antenna which is 14th Embodiment of the electronic component of this invention. It is sectional drawing which shows the patch antenna which is 14th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the patch antenna which is 15th Embodiment of the electronic component of this invention. It is sectional drawing which shows the patch antenna which is 15th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the patch antenna which is 16th Embodiment of the electronic component of this invention. It is sectional drawing which shows the patch antenna which is 16th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the patch antenna which is 17th Embodiment of the electronic component of this invention. It is sectional drawing which shows the patch antenna which is 17th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows VCO which is 18th Embodiment of the electronic component of this invention. It is sectional drawing which shows VCO which is 18th Embodiment of the electronic component of this invention. It is an equivalent circuit diagram which shows VCO which is 18th Embodiment of the electronic component of this invention. It is an exploded plan view of each component layer of a power amplifier which is a nineteenth embodiment of the electronic component of the present invention. It is sectional drawing which shows the power amplifier which is 19th Embodiment of the electronic component of this invention. It is an equivalent circuit diagram which shows the power amplifier which is 19th Embodiment of the electronic component of this invention. It is a decomposition | disassembly top view of each structure layer of the superimposition module which is 20th Embodiment of the electronic component of this invention. It is sectional drawing which shows the superimposition module which is 20th Embodiment of the electronic component of this invention. It is an equivalent circuit diagram which shows the superimposition module which is 20th Embodiment of the electronic component of this invention. It is a perspective view which shows RF module which is 21st Embodiment of the electronic component of this invention. FIG. 55 is a perspective view of the RF module with the exterior member of FIG. 54 removed. It is a disassembled perspective view of each structure layer of RF module which is 21st Embodiment of the electronic component of this invention. It is sectional drawing which shows the RF module which is 21st Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the resonator which is 22nd Embodiment of the electronic component of this invention. It is sectional drawing which shows the resonator which is 22nd Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the strip resonator which is 23rd Embodiment of the electronic component of this invention. It is sectional drawing which shows the strip resonator which is 23rd Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the resonator which is 24th Embodiment of the electronic component of this invention. It is a see-through | perspective perspective view which shows the strip resonator which is 25th Embodiment of the electronic component of this invention. It is an equivalent circuit schematic of the resonator which is 22nd-25th embodiment of the electronic component of this invention. It is a block block diagram which shows the high frequency part of the portable terminal device which is 26th Embodiment of the electronic component of this invention. It is a figure which shows the manufacturing process of the printed wiring board which is 27th Embodiment of this invention. It is a figure which shows the manufacturing process of the printed wiring board which is 27th Embodiment of this invention. It is a figure which shows the manufacturing process of the printed wiring board which is 27th Embodiment of this invention. It is a figure which shows the manufacturing process of the printed wiring board which is 28th Embodiment of this invention. It is a figure which shows the manufacturing process of the printed wiring board which is 28th Embodiment of this invention. It is a figure which shows the manufacturing process of the printed wiring board which is 28th Embodiment of this invention.

Explanation of symbols

10 Inductors (electronic components)
10a-10e Constituent layer (insulating layer or dielectric layer)
13 Inner conductor (conductive element)
14 Via hole (conductive element part)
20 capacitors (electronic components)
20a-20g Constituent layer (insulating layer or dielectric layer)
23 Inner conductor (conductive element)
40 balun transformer (electronic parts)
40a-40o Constituent layer (insulating layer or dielectric layer)
43 Inner conductor (conductive element)
45 GND conductor (conductive element part)
60 Multilayer filter (electronic parts)
110 Coupler (electronic component)
130, 140 Antenna (electronic component)
150, 160, 170 Patch antenna (electronic component)
140a-140c Constituent layer (insulating layer or dielectric layer)
143a, 143b Inner conductor (conductive element part)
144 Via hole (conductive element part)
150a Component layer (insulating layer or dielectric layer)
155 GND conductor (conductive element part)
159 Patch conductor (conductive element part)
159a, 159e Patch conductor (conductive element part)
160 Patch antenna (electronic component)
160a ... Constituent layer (insulating layer or dielectric layer)
165... GND conductor (conductive element portion)
169 ... Patch conductor (conductive element portion)

Claims (24)

  Polyester comprising an aromatic polyvalent carboxylic acid residue and an aromatic polyvalent hydroxy compound residue having an aryloxycarbonyl group or an arylcarbonyloxy group at the molecular chain end, an epoxy resin, a curing accelerator, and a flame retardant A printed wiring board comprising: a resin layer made of a resin composition containing: The aromatic polyvalent hydroxy compound residue is at least one group selected from the group consisting of groups represented by the following formulas (1) to (4),
The aromatic polyvalent carboxylic acid residue is at least one group selected from the group consisting of groups represented by the following formulas (5) to (7),
The aryloxycarbonyl group or an aryl group in the arylcarbonyloxy group is at least one aryl group selected from the group consisting of groups represented by the following formulas (8) to (10). Item 4. A printed wiring board according to item 1.

(1)

(In formula (1), k is 0 or 1.)

(2)

(In formula (2), Y represents an oxygen atom, a methylene group, a methylene group substituted with an alkyl group having 1 to 4 carbon atoms, a methylene group substituted with a phenyl group, a methylene group substituted with a naphthyl group, or a biphenyl group. Represents a methylene group substituted with a 9-fluorenyl group, a methylene group substituted with a phenyl group, a naphthyl group, or a biphenyl group with an alkyl group having 1 to 4 carbon atoms. n and m each represents an integer of 1 to 3)

(3)

(4)

(5)

(6)

(7)

(In the formula, A, B, D, E, and G are substituents, and each represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom. A, e, and g each represent B and d each represent an integer of 0 to _3. X represents a single bond, —S—, —O—, —CO—, —CH ₂ —, —C (CH ₃ ) _2. -, or -SO ₂ - represents a).

(8)

(9)

(10)

(In the formula, P, Q, R, T, and U are substituents and each represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a nitro group, or a halogen atom. P, r Is an integer of 0-5, q, t is an integer of 0-4, u is an integer of 0-3, Z is a single bond, —O—, —CO—, —CH ₂ —, —C (CH ₃ ) _2- or -SO _2- .   The printed wiring board according to claim 1, further comprising at least one conductive element portion provided on the resin layer and constituting a capacitor element or an inductor element.   The printed wiring board according to any one of claims 1 to 3, wherein the flame retardant is a brominated aromatic flame retardant.   5. The printed wiring board according to claim 1, wherein the flame retardant is ethane-1,2-bis (bentabromophenyl). 6.   6. The printed wiring board according to claim 1, wherein the resin composition contains at least one of a styrene elastomer and a polybutadiene polymer.   The resin layer containing the resin composition and a dielectric ceramic powder having a relative dielectric constant larger than that of the resin composition is provided in at least one layer. Printed wiring board as described in 1.   The dielectric ceramic powder is a metal oxide containing at least one metal selected from the group consisting of magnesium, silicon, aluminum, titanium, zinc, calcium, strontium, zirconium, barium, tin, neodymium, bismuth, lithium, samarium and tantalum. The printed wiring board according to claim 7, wherein the printed wiring board is a metal oxide powder having a relative dielectric constant of 3.7 to 10,000 and a Q value of 200 to 100,000.   9. The printed wiring according to claim 7, wherein the dielectric ceramic powder is contained in an amount of 5 to 65% by volume when the total of the dielectric ceramic powder and the resin composition is 100% by volume. Board.   The printed wiring board according to claim 1, wherein the resin layer further includes a magnetic powder dispersed in the resin composition.   The printed wiring board according to claim 1, wherein the resin layer further includes a cloth made of reinforcing fibers.   The reinforcing fibers include E glass glass cloth, D glass glass cloth, NE glass glass cloth, H glass glass cloth, T glass glass cloth, aramid porous film, polyamide porous film, and poly-4. The printed wiring board according to claim 11, wherein the printed wiring board is at least one selected from the group consisting of porous films of fluoroethylene.   Polyester comprising an aromatic polyvalent carboxylic acid residue and an aromatic polyvalent hydroxy compound residue having an aryloxycarbonyl group or an arylcarbonyloxy group at the molecular chain end, an epoxy resin, a curing accelerator, and a flame retardant An electronic component comprising a resin layer made of a resin composition containing: The aromatic polyvalent hydroxy compound residue is at least one group selected from the group consisting of groups represented by the following formulas (1) to (4),
The aromatic polyvalent carboxylic acid residue is at least one group selected from the group consisting of groups represented by the following formulas (5) to (7),
The aryloxycarbonyl group or an aryl group in the arylcarbonyloxy group is at least one aryl group selected from the group consisting of groups represented by the following formulas (8) to (10). Item 14. The electronic component according to Item 13.

(1)

(In formula (1), k is 0 or 1.)

(2)

(In formula (2), Y represents an oxygen atom, a methylene group, a methylene group substituted with an alkyl group having 1 to 4 carbon atoms, a methylene group substituted with a phenyl group, a methylene group substituted with a naphthyl group, or a biphenyl group. Represents a methylene group substituted with a 9-fluorenyl group, a methylene group substituted with a phenyl group, a naphthyl group, or a biphenyl group with an alkyl group having 1 to 4 carbon atoms. n and m each represents an integer of 1 to 3)

(3)

(4)

(5)

(6)

(7)

(In the formula, A, B, D, E, and G are substituents, and each represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom. A, e, and g each represent B and d each represent an integer of 0 to _3. X represents a single bond, —S—, —O—, —CO—, —CH ₂ —, —C (CH ₃ ) _2. -, or -SO ₂ - represents a).

(8)

(9)

(10)

(In the formula, P, Q, R, T, and U are substituents and each represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a nitro group, or a halogen atom. P, r Is an integer of 0-5, q, t is an integer of 0-4, u is an integer of 0-3, Z is a single bond, —O—, —CO—, —CH ₂ —, —C (CH ₃ ) _2- or -SO _2- .   The electronic component according to claim 13, further comprising at least one conductive element portion provided on the resin layer and constituting a capacitor element or an inductor element.   The electronic component according to claim 13, wherein the flame retardant is a brominated aromatic flame retardant.   The electronic component according to claim 13, wherein the flame retardant is ethane-1,2-bis (bentabromophenyl).   The electronic component according to claim 13, wherein the resin composition contains at least one of a styrene elastomer and a polybutadiene polymer.   The resin layer containing the resin composition and a dielectric ceramic powder having a relative dielectric constant larger than that of the resin composition is provided in at least one layer. Electronic components described in   The dielectric ceramic powder is a metal oxide containing at least one metal selected from the group consisting of magnesium, silicon, aluminum, titanium, zinc, calcium, strontium, zirconium, barium, tin, neodymium, bismuth, lithium, samarium and tantalum. The electronic component according to claim 19, wherein the electronic component is a metal oxide powder having a dielectric constant of 3.7 to 10,000 and a Q value of 200 to 100,000.   The electronic component according to claim 19 or 20, wherein the dielectric ceramic powder is contained in an amount of 5 to 65% by volume when the total of the dielectric ceramic powder and the resin composition is 100% by volume. .   The electronic component according to any one of claims 13 to 21, wherein the resin layer further includes a magnetic powder dispersed in the resin composition.   The electronic component according to any one of claims 13 to 22, wherein the resin layer further includes a cloth made of reinforcing fibers.   The reinforcing fibers include E glass glass cloth, D glass glass cloth, NE glass glass cloth, H glass glass cloth, T glass glass cloth, aramid porous film, polyamide porous film, and poly-4. 24. The electronic component according to claim 23, wherein the electronic component is at least one selected from the group consisting of a porous film of ethylene fluoride.

Images