JP2006054106A - Lighting device and lighting fixture - Google Patents

Lighting device and lighting fixture Download PDF

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Publication number
JP2006054106A
JP2006054106A JP2004234769A JP2004234769A JP2006054106A JP 2006054106 A JP2006054106 A JP 2006054106A JP 2004234769 A JP2004234769 A JP 2004234769A JP 2004234769 A JP2004234769 A JP 2004234769A JP 2006054106 A JP2006054106 A JP 2006054106A
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Prior art keywords
tray
filler
lighting device
connector
lighting
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JP2004234769A
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JP4438560B2 (en
Inventor
Kenichi Kobari
憲一 小針
Seiji Oka
成治 岡
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Priority to JP2004234769A priority Critical patent/JP4438560B2/en
Priority to TW094125544A priority patent/TW200609713A/en
Priority to CNB200510090211XA priority patent/CN100559072C/en
Priority to KR1020050073400A priority patent/KR100657092B1/en
Priority to US11/201,199 priority patent/US7360927B2/en
Publication of JP2006054106A publication Critical patent/JP2006054106A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/023Power supplies in a casing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/04Provision of filling media
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact and low-cost lighting device with waterproof performance. <P>SOLUTION: The lighting device is provided with a circuit module 21, a tray 41, a connector cap 43, a filling material 55 and an outer-shell case 11. The module 21 is provided with an electrically insulating circuit board 22, various kinds of electric components 26 loaded on the board to constitute a lighting circuit, and a wire connector 24 connected to the lighting circuit and loaded on the board 22. The tray 41 houses the module 21. The connector cap 43 is equipped with a closing part maintaining a closed state until the wire is inserted and fitted into the connector 24. The filling material 55 has waterproof and electric insulating properties and filled in the tray 41 burying the module 21 as a whole. The outer-shell case 11 houses a waterproof assembly 31 consisting of the tray 41, the module 21 and the filling material 55 almost filling its inside and makes the cap 43 expose. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、蛍光ランプ等の放電灯を備える照明器具、及び放電灯を点灯させる点灯装置に関する。   The present invention relates to a lighting fixture including a discharge lamp such as a fluorescent lamp, and a lighting device for lighting the discharge lamp.

屋外や高湿度環境下に設置される照明器具では、この器具が備える放電灯を点灯させる点灯装置も高湿度に晒されることがあるため、点灯装置には防水性能が求められる。   In a lighting fixture installed outdoors or in a high humidity environment, a lighting device for lighting a discharge lamp included in the fixture may be exposed to high humidity, and thus the lighting device is required to be waterproof.

従来、こうした防水性能を得るために、断面において継ぎ目がない一体成形品からなる筒状ケース内にインバータ点灯装置を収容するとともに、筒状ケースの両端開口部を側板で閉じて、これら筒状ケースと側板とで外郭となる防水ケースを形成し、この防水ケースでインバータ点灯装置に対する防水を図った技術が知られている(例えば特許文献1参照。)。
特開2003−7122号公報(段落0004、0005、0008−0019、図1−図14、図17、図19)
Conventionally, in order to obtain such waterproof performance, the inverter lighting device is housed in a cylindrical case made of an integrally molded product having a seamless cross section, and both ends of the cylindrical case are closed with side plates, and these cylindrical cases are There is known a technique in which a waterproof case serving as an outer shell is formed by the side plate and the inverter lighting device is waterproofed with this waterproof case (see, for example, Patent Document 1).
Japanese Patent Laying-Open No. 2003-7212 (paragraphs 0004, 0005, 0008-0019, FIGS. 1 to 14, 17, and 19)

特許文献1の技術では、インバータ点灯装置自体がその外郭をなすケースを有して組立てられており、こうした点灯装置を防水ケースに収容しているので、点灯装置全体の外郭をなす防水ケースが大形である。又、インバータ点灯装置の組立ての他に、この装置を筒状ケースに収容する手間、及びこの後に防水ケースを組立てる手間が必要であるため、組立ての工数が多い。したがって、既述のように大形な防水ケースを用いること自体でのコスト増加に加えて組立て上のコストも多く掛かるので、コスト高である。   In the technique of Patent Document 1, the inverter lighting device itself is assembled with a case that forms an outer case thereof. Since such a lighting device is accommodated in a waterproof case, the waterproof case that forms the outer case of the entire lighting device is large. It is a shape. Further, in addition to the assembly of the inverter lighting device, the labor for housing the device in the cylindrical case and the labor for assembling the waterproof case are required, which requires many man-hours for assembly. Therefore, as described above, in addition to an increase in cost due to the use of a large waterproof case itself, a large cost is required for assembling, so that the cost is high.

本発明の目的は、防水性能を有するとともに小形でかつ安価な点灯装置及びこれを備えた照明器具を提供することにある。   An object of the present invention is to provide a small and inexpensive lighting device that has waterproof performance and a lighting fixture including the same.

前記課題を解決するために、請求項1の発明に係る点灯装置は、回路基板、この基板に搭載されて点灯回路をなす各種の電気部品、及び前記点灯回路に接続して前記回路基板に搭載された電線コネクタを備えた回路モジュールと;前記電線コネクタに被嵌され、この電線コネクタへの電線の接続時にこの電線で押し破られて前記電線の挿入を許す閉鎖部で閉じられた通孔予定部を有したコネクタキャップと;前記回路モジュールを収容したトレーと;防水性及び電気絶縁性を有し、前記回路モジュール全体を埋めて前記トレーに充填された充填材と;前記トレー、回路モジュール、及び充填材からなる防水アセンブリを収容するとともに、前記コネクタキャップを露出させる外郭ケースと;を具備したことを特徴としている。   In order to solve the above-mentioned problem, a lighting device according to the invention of claim 1 is mounted on a circuit board, various electric components mounted on the board to form a lighting circuit, and connected to the lighting circuit on the circuit board. A circuit module provided with an electric wire connector; and a through-hole that is fitted in the electric wire connector and is closed by a closing portion that is pushed through the electric wire when the electric wire is connected to the electric wire connector and allows the electric wire to be inserted. A connector cap having a portion; a tray containing the circuit module; a waterproof material and an electrical insulating material, a filling material filling the entire circuit module and filling the tray; the tray, the circuit module, And an outer case for housing the waterproof assembly made of the filler and exposing the connector cap.

本発明において、トレーは例えばトレー本体とコネクタキャップとを一体的に成形してもよいし、トレーとコネクタキャップとは別体であってもよい。トレーとコネクタキャップとが別体である場合、コネクタキャップはトレーから外れた位置に設けることが可能である。コネクタキャップは合成樹脂又はゴムなどで作ることができる。EPDM等のゴムでトレーを作る場合には、トレー本体とコネクタキャップとは一体成型可能である。合成樹脂でトレー本体を作る場合には、コネクタキャップをEPDM等のゴム製とすればよい。トレーを作る合成樹脂には、材料コストが安価でかつ充填材の加熱硬化処理の温度に耐える耐熱性を有する樹脂例えばPET樹脂を好適に用いることができる。本発明において、充填材には、合成樹脂例えばシリコン樹脂、ウレタン樹脂、エポキシ樹脂、不飽和ポリエステル樹脂等を用いることができ、好適には材料コストが安価なウレタン樹脂を用いることができ、より高い放熱性も得るためにはシリコン樹脂や不飽和ポリエステル樹脂などを用いるとよい。本発明において、外郭ケースをなす収容ベース及びカバーは、合成樹脂でも作れるが、外部への放熱性能を得るためにアルミニューム合金などの熱伝導性が良好な金属製とするとよい。本発明において、回路基板の半田付け面にはチップ部品などの電気部品が面実装されていてもよい。   In the present invention, for example, the tray may be formed integrally with the tray body and the connector cap, or the tray and the connector cap may be separate. When the tray and the connector cap are separate, the connector cap can be provided at a position away from the tray. The connector cap can be made of synthetic resin or rubber. When the tray is made of rubber such as EPDM, the tray body and the connector cap can be integrally formed. When the tray body is made of synthetic resin, the connector cap may be made of rubber such as EPDM. As the synthetic resin for forming the tray, a resin having a low material cost and having a heat resistance that can withstand the temperature of the heat-curing treatment of the filler, such as a PET resin, can be suitably used. In the present invention, a synthetic resin such as a silicon resin, a urethane resin, an epoxy resin, an unsaturated polyester resin, or the like can be used as the filler, and a urethane resin with a low material cost can be preferably used. In order to obtain heat dissipation, it is preferable to use silicon resin, unsaturated polyester resin, or the like. In the present invention, the housing base and the cover forming the outer case can be made of a synthetic resin, but in order to obtain heat radiation performance to the outside, it is preferable that the housing base and the cover are made of a metal having good thermal conductivity such as an aluminum alloy. In the present invention, an electrical component such as a chip component may be surface-mounted on the soldering surface of the circuit board.

又、本発明の点灯装置は、ランプを平常時点灯させるものであっても、停電などの非常時に点灯させるものであってもよい。又、本発明において、外郭ケースは防水アセンブリを満杯状態に収容することが、小型化を促進し、かつ、防水アセンブリから外郭ケースへの放熱を良くする上で好ましい。ここに満杯状態とは、防水アセンブリがその各面を外郭ケースの各面に熱伝導的に接した状態に外郭ケースに収容されている状態が好適であるが、例えば少なくとも防水アセンブリの一部、好ましくは回路基板の半田付け面を覆った充填材の半田カバー層を熱伝導的に外郭ケースに接触させて、その他の部分を外郭ケースから少し離した収容形態も含んでいる。   Further, the lighting device of the present invention may be one that lights a lamp in a normal state or one that lights in an emergency such as a power failure. In the present invention, it is preferable that the outer case fully accommodates the waterproof assembly in order to promote downsizing and improve heat dissipation from the waterproof assembly to the outer case. Here, the full state is preferably a state in which the waterproof assembly is housed in the outer case in a state where each surface of the waterproof assembly is in thermal contact with each surface of the outer case, for example, at least a part of the waterproof assembly, Preferably, a housing form is also included in which a solder cover layer of a filler covering the soldering surface of the circuit board is brought into contact with the outer case in a heat conductive manner, and other portions are slightly separated from the outer case.

請求項1の発明では、外郭ケースと略同じ大きさのトレーを備え、このトレーに収容した回路モジュール全体をトレーに充填した電気絶縁性でかつ防水性の充填材に埋設したので、この充填材によって回路モジュールの回路基板及び電気部品等を防水できる。コネクタキャップの通孔予定部は電線が挿入されるまでは閉鎖部によって閉じられているので、トレーに充填された充填材が、コネクタキャップによって電線コネクタに侵入することがない。そして、既述のように外郭ケースに収容されたトレーとこれに充填された充填材を用いて回路モジュールの防水を実現したので、殊更大きい外郭ケースを要しないとともに、こうした外郭ケース内での防水構成により、外郭ケースを収容する防水ケースを要しないで高湿度環境に耐える防水性能を得ることができる。   In the first aspect of the invention, since the tray having the same size as the outer case is provided, and the entire circuit module accommodated in the tray is embedded in an electrically insulating and waterproof filler filled in the tray, the filler The circuit board of the circuit module and the electrical parts can be waterproofed. Since the through hole scheduled portion of the connector cap is closed by the closing portion until the electric wire is inserted, the filler filled in the tray does not enter the electric wire connector by the connector cap. As described above, the circuit module is waterproofed by using the tray accommodated in the outer case and the filling material filled in the tray, so that a particularly large outer case is not required, and the waterproofing in the outer case is not required. According to the configuration, a waterproof performance that can withstand a high humidity environment can be obtained without requiring a waterproof case for housing the outer case.

又、本発明の好ましい形態である請求項2の発明は、前記充填材が、フィラーが混入された合成樹脂であることを特徴としている。ここにフィラーとしては、無機物のフィラー、又は金属化合物としての水酸化アルミニュームのフィラーを好適に例示できる。このフィラーの混入割合は、要求される放熱特性に適合させて設定される。   The invention according to claim 2, which is a preferred embodiment of the present invention, is characterized in that the filler is a synthetic resin mixed with a filler. As the filler, an inorganic filler or an aluminum hydroxide filler as a metal compound can be preferably exemplified. The mixing ratio of the filler is set according to the required heat dissipation characteristics.

この請求項2では、充填材に混入されたフィラーにより、充填材に優れた放熱性を与えることができる。したがって、発熱を伴う電気部品の熱を外郭ケースに充填材を通じて速やかに伝達して、充填材内の電気部品の温度過昇を抑制できる。   According to the second aspect, the filler mixed in the filler can impart excellent heat dissipation to the filler. Therefore, the heat of the electrical component that generates heat can be quickly transmitted to the outer case through the filler, and the temperature rise of the electrical component in the filler can be suppressed.

請求項3の発明は、器具本体と;この器具本体に取付けられたランプソケットと;このソケットに取り外し可能に支持された放電灯と;前記器具本体に取付けられて前記放電灯を点灯させる請求項1又は2に記載の点灯装置と;を具備したことを特徴としている。   The invention of claim 3 comprises: an instrument main body; a lamp socket attached to the instrument main body; a discharge lamp removably supported by the socket; and attached to the instrument main body to light the discharge lamp. The lighting device according to 1 or 2 is provided.

この発明の照明器具が備えた点灯装置は、請求項1又は2に記載のものであるので、防水性能を有するとともに小形でかつ安価な点灯装置を備えた照明器具を提供できる。   Since the lighting device provided in the lighting fixture of the present invention is the one described in claim 1 or 2, it is possible to provide a lighting fixture having a waterproof and performance and a small and inexpensive lighting device.

請求項1の発明によれば、外郭ケースに収容される大きさのトレーに充填した充填材内に回路モジュール全体を埋設して、外郭ケース内部で防水を実現したので、外郭ケースを大きくする必要がないとともに外郭ケースを収容する防水ケースを要しないで、高湿度環境に耐える防水性能を得ることができる。このため、所定の防水性能を有するとともに小形でかつ安価な点灯装置を提供できる。   According to the first aspect of the present invention, since the entire circuit module is embedded in the filling material filled in the tray of a size accommodated in the outer case and waterproofing is realized inside the outer case, it is necessary to enlarge the outer case. In addition, there is no need for a waterproof case for housing the outer case, and a waterproof performance that can withstand a high humidity environment can be obtained. For this reason, it is possible to provide a small and inexpensive lighting device having a predetermined waterproof performance.

請求項2の発明によれば、フィラーにより充填材に与えられた放熱性によって、充填材内の発熱を伴う電気部品の熱を速やかに外郭ケースに放出させてこの電気部品の温度過昇を抑制可能な点灯装置を提供できる。   According to the second aspect of the present invention, due to the heat dissipating property imparted to the filler by the filler, the heat of the electrical component accompanied by heat generation in the filler is quickly released to the outer case, thereby suppressing the overheating of the electrical component. A possible lighting device can be provided.

請求項3の発明によれば、請求項1又は2に記載の防水性能を有するとともに小形でかつ安価な点灯装置を備えた照明器具を提供できる。   According to the invention of claim 3, it is possible to provide a lighting fixture having the waterproof performance of claim 1 or 2 and having a small and inexpensive lighting device.

図1〜図11を参照して本発明の一実施形態を説明する。   An embodiment of the present invention will be described with reference to FIGS.

図1中符号1で示す照明器具は、屋外灯、又はトンネル内に設置されるトンネル灯、或いは駅舎の軒下灯等として、好ましい防水性を備えて使用される。この照明器具1は、器具本体2と、ランプソケット3と、放電灯例えば直管型の蛍光ランプ4と、電子安定器として機能する防水型の点灯装置5とを備えている。   The luminaire denoted by reference numeral 1 in FIG. 1 is used with a favorable waterproof property as an outdoor lamp, a tunnel lamp installed in a tunnel, an eaves lamp of a station building, or the like. The lighting fixture 1 includes a fixture body 2, a lamp socket 3, a discharge lamp, for example, a straight fluorescent lamp 4, and a waterproof lighting device 5 that functions as an electronic ballast.

図1に例示された器具本体2は、金属製であって直方体形状をなし、その長手方向両端部にランプソケット3がたとえば下向きに突設されている。蛍光ランプ4はランプソケット3に取外し可能に支持されている。蛍光ランプ4を点灯させる点灯装置5は器具本体2に内蔵されている。この点灯装置5は、以下のように構成されている。   The appliance main body 2 illustrated in FIG. 1 is made of metal and has a rectangular parallelepiped shape, and lamp sockets 3 are projected downward at both ends in the longitudinal direction, for example. The fluorescent lamp 4 is detachably supported by the lamp socket 3. A lighting device 5 for lighting the fluorescent lamp 4 is built in the instrument body 2. The lighting device 5 is configured as follows.

図2〜図4に示すように点灯装置5は、外郭ケース11と、回路モジュール21と、トレー41と、充填材55とを具備している。   As shown in FIGS. 2 to 4, the lighting device 5 includes an outer case 11, a circuit module 21, a tray 41, and a filler 55.

外郭ケース11は、収容ベース12と、これに連結されたカバー15とを有している。収容ベース12及びカバー15は、金属製例えば放熱性に優れたアルミニューム合金製とすることが好ましいが、材料コストが安い鉄製とすることも可能である。収容ベース12及びカバー15との連結は、例えば図示しないが収容ベース12とカバー15との一方に形成されて内側に起こされた切起し片を、他方に形成された孔や切欠き等の受け部に引っ掛けことなどにより行われている。   The outer case 11 has an accommodation base 12 and a cover 15 connected thereto. The housing base 12 and the cover 15 are preferably made of a metal, for example, an aluminum alloy having excellent heat dissipation, but can also be made of iron with a low material cost. The housing base 12 and the cover 15 are connected to each other by, for example, a cut-and-raised piece formed on one of the housing base 12 and the cover 15 and raised on the inside, and a hole or a notch formed on the other. This is done by hooking on the receiving part.

図2及び図3に示すように収容ベース12は、ベース壁12aと、この幅方向両縁から夫々直角状に折り曲げられた側壁12bとを有して、横断面コ字形の樋状をなしている。この収容ベース12の全長は後述する回路基板22より長い。ベース壁12aの長手方向両端部には夫々孔又は切欠きからなる固定部13が夫々形成されている。これらの固定部13を通るねじ等の固定部品により、ベース壁12aを器具本体2の金属部分に接触させて、点灯装置5が器具本体2に取付けられている。したがって、収容ベース12は器具本体2への伝熱面として機能している。   As shown in FIGS. 2 and 3, the storage base 12 has a base wall 12a and side walls 12b bent at right angles from both edges in the width direction, and has a bowl shape with a U-shaped cross section. Yes. The overall length of the housing base 12 is longer than the circuit board 22 described later. Fixing portions 13 each having a hole or a notch are formed at both ends in the longitudinal direction of the base wall 12a. The lighting device 5 is attached to the appliance main body 2 such that the base wall 12 a is brought into contact with the metal portion of the appliance main body 2 by a fixing component such as a screw passing through the fixing portions 13. Therefore, the accommodation base 12 functions as a heat transfer surface to the instrument body 2.

図2〜図4に示すようにカバー15は、例えば幅方向両側に夫々斜めに曲げられた部位を有したカバー主壁15aと、この両側縁から夫々折り曲げられた側壁15bと、カバー主壁15aの長手方向両端から夫々直角状に折り曲げられた端壁15cとを有して形成されている。端壁15cはカバー主壁15a及び端壁15cが作る樋状の長手方向両端を閉じるように設けられている。このカバー15は固定部13を露出させる程度に収容ベース12よりも短く形成されている。カバー15は、その側壁15bを収容ベース12の側壁12bの内面に直接重ねるとともに、これらの側壁12b、15bが連結されている。重ね合わされた側壁12b、15bを通じて収容ベース12とカバー15とは熱伝導可能である。   As shown in FIGS. 2 to 4, the cover 15 includes, for example, a cover main wall 15a having portions bent obliquely on both sides in the width direction, a side wall 15b bent from each side edge, and a cover main wall 15a. And end walls 15c bent at right angles from both ends in the longitudinal direction. The end wall 15c is provided so as to close both ends of the bowl-shaped longitudinal direction formed by the cover main wall 15a and the end wall 15c. The cover 15 is formed to be shorter than the housing base 12 to the extent that the fixing portion 13 is exposed. The cover 15 directly overlaps the side wall 15b with the inner surface of the side wall 12b of the storage base 12, and the side walls 12b and 15b are connected. The housing base 12 and the cover 15 can conduct heat through the stacked side walls 12b and 15b.

カバー15の長手方向一端部及び他端部には四角形状の孔16,17が個別に開けられている。一方の孔16は後述の入力側のコネクタキャップ43を露出させるために設けられ、他方の孔17は後述の出力側のコネクタキャップ44を露出させるために設けられている。   Square holes 16 and 17 are individually opened at one end and the other end of the cover 15 in the longitudinal direction. One hole 16 is provided to expose an input-side connector cap 43 described later, and the other hole 17 is provided to expose an output-side connector cap 44 described later.

蛍光ランプ4を点灯させるための回路モジュール21は、電気絶縁性の回路基板22と、点灯回路23(図7参照)と、入力用の電線コネクタ24と、出力用の電線コネクタ25とを備えている。   The circuit module 21 for lighting the fluorescent lamp 4 includes an electrically insulating circuit board 22, a lighting circuit 23 (see FIG. 7), an input wire connector 24, and an output wire connector 25. Yes.

回路基板22はカバー15内に収まる大きさの長四角形状をなし、その一面は部品取り付け面22aとして利用され、回路パターンが印刷された他面は半田付け面22bとして利用されている。半田付け面22bの表面は絶縁性のレジスト層(図示しない)で覆われている。   The circuit board 22 has a long rectangular shape that fits within the cover 15, and one surface thereof is used as the component mounting surface 22 a, and the other surface on which the circuit pattern is printed is used as the soldering surface 22 b. The surface of the soldering surface 22b is covered with an insulating resist layer (not shown).

図4及び図8等に示すように点灯回路23は、パワートランジスタ等の半導体、抵抗、コンデンサ、コイル、トランス、ダイオード、その他の各種のチップ部品等の電気部品26を組み合わせて例えばインバータ回路部を含んで構成されている。なお、図8中符号26aは電気部品26の一つである発熱を伴うパワートランジスタを示し、符号26bは電気部品26の一つである電解コンデンサを示している。又、符号27はパワートランジスタ26aに熱的に接続された放熱板を示している。放熱板27は、部品取付け面22aに対して直角となるように回路基板22の一側縁に沿って起立されているとともに、回路基板22の幅の外側に多少はみ出ている。図10に示すように前記電解コンデンサ26bは、その先端面に露出する防爆弁28を有している。防爆弁28は電解コンデンサ26bの内圧が異常に上昇した場合に破壊するものである。   As shown in FIG. 4 and FIG. 8, the lighting circuit 23 includes, for example, an inverter circuit unit by combining a semiconductor such as a power transistor, an electric component 26 such as a resistor, a capacitor, a coil, a transformer, a diode, and other various chip components. It is configured to include. In FIG. 8, reference numeral 26 a indicates a power transistor with heat generation, which is one of the electrical components 26, and reference numeral 26 b indicates an electrolytic capacitor, which is one of the electrical components 26. Reference numeral 27 denotes a heat sink thermally connected to the power transistor 26a. The heat radiating plate 27 is erected along one side edge of the circuit board 22 so as to be perpendicular to the component mounting surface 22 a and slightly protrudes outside the width of the circuit board 22. As shown in FIG. 10, the electrolytic capacitor 26b has an explosion-proof valve 28 exposed at the front end surface thereof. The explosion-proof valve 28 is broken when the internal pressure of the electrolytic capacitor 26b rises abnormally.

点灯回路23は回路基板22の長手方向両端部を除いた中間部両面に亘って形成されていて、その内の殆どの電気部品は部品取付け面22aに実装されている。電気部品26はチップ部品等の面実装部品の他に、フロー半田処理により回路基板22に搭載される複数の電気部品を含んでいる。これらの電気部品は、ピン状の端子29を有しており、この端子29を回路基板22に貫通させてフロー半田層に通すことにより、回路パターンの各ランドに個別に半田付けされて回路基板22に取付けられている。   The lighting circuit 23 is formed on both surfaces of the intermediate portion excluding both ends in the longitudinal direction of the circuit board 22, and most of the electric components are mounted on the component mounting surface 22a. The electrical component 26 includes a plurality of electrical components mounted on the circuit board 22 by flow soldering in addition to the surface mounting components such as chip components. These electrical components have pin-shaped terminals 29. By passing the terminals 29 through the circuit board 22 and through the flow solder layer, the circuit boards are individually soldered to the lands of the circuit pattern. 22 is attached.

図8に示すように入力用(高圧側)の電線コネクタ24は回路基板22の長手方向一端部に半田付けされ、出力用(低圧側)の電線コネクタ25は回路基板22の長手方向他端部に半田付けされている。これらの電線コネクタ24,25もピン状の端子30を有しており、端子29を有した電気部品とともにフロー半田処理により回路基板22に搭載されている。電線コネクタ24には図示しない電源側の絶縁被覆電線(図示しない)の芯線が差し込み接続される。電線コネクタ25には器具内配線用の絶縁被覆電線(図示しない)の芯線が差し込み接続される。   As shown in FIG. 8, the input (high voltage side) wire connector 24 is soldered to one end in the longitudinal direction of the circuit board 22, and the output (low voltage side) wire connector 25 is connected to the other end in the longitudinal direction of the circuit board 22. It is soldered to. These electric wire connectors 24 and 25 also have pin-shaped terminals 30 and are mounted on the circuit board 22 by flow soldering together with electrical components having terminals 29. A core wire of a power supply-side insulation-coated electric wire (not shown) is inserted and connected to the electric wire connector 24. A core wire of an insulation coated electric wire (not shown) for wiring in the instrument is inserted and connected to the electric wire connector 25.

トレー41は充填材55を充填するための充填容器として機能するものである。図3及び図6〜図8等に示すようにトレー41は、カバー15より僅かに小さく、カバー15の内面に接するようにこの内面形状に沿って収容されるトレー本体42と、複数例えば一対のコネクタキャップ43,44とを有している。   The tray 41 functions as a filling container for filling the filling material 55. As shown in FIGS. 3 and 6 to 8, the tray 41 is slightly smaller than the cover 15, and a plurality of, for example, a pair of tray bodies 42 are accommodated along the inner surface shape so as to contact the inner surface of the cover 15. Connector caps 43 and 44 are provided.

トレー本体42は、好ましくは耐熱性を有する廉価な電気絶縁材、例えばPET樹脂製のフィルム状成形品である。トレー本体42は、その長手方向両端部にキャップ接続部42aを有している。これらキャップ接続部42a間のトレー本体42の深さは、キャップ接続部42aでのトレー本体42の深さより深く、この深い部位はカバー15の内面に接触する大きさに形成されている。なお、図6〜図8中符号42bはトレー本体42の側板を示しており、又、符号42cは前記深い部位から左右のキャップ接続部42aに亘って連続するトレー本体42の開口縁を示している。   The tray main body 42 is preferably an inexpensive electrical insulating material having heat resistance, for example, a film-like molded product made of PET resin. The tray main body 42 has cap connection portions 42a at both ends in the longitudinal direction. The depth of the tray main body 42 between the cap connecting portions 42 a is deeper than the depth of the tray main body 42 at the cap connecting portion 42 a, and this deep portion is formed to contact the inner surface of the cover 15. 6-8, the code | symbol 42b has shown the side plate of the tray main body 42, and the code | symbol 42c has shown the opening edge of the tray main body 42 which continues from the said deep site | part to the right-and-left cap connection part 42a. Yes.

図7に示すようにトレー本体42には、側板42bの内面に突出してトレー本体42の深さ厚み方向(上下方向)に沿って延びる支持凸部45が複数形成されている。更に、トレー本体42の深い部位には複数の上げ底部46〜52が一体に形成されている。これらの上げ底部46〜52は、回路モジュール21の電気部品26の配設密度が低い領域とチップ部品等の高さが低い電気部品が集まって配設された領域などに対応して設けられている。   As shown in FIG. 7, the tray body 42 is formed with a plurality of support protrusions 45 that protrude from the inner surface of the side plate 42 b and extend along the depth-thickness direction (vertical direction) of the tray body 42. Further, a plurality of raised bottom portions 46 to 52 are integrally formed at a deep portion of the tray main body 42. These raised bottom portions 46 to 52 are provided corresponding to a region where the arrangement density of the electrical components 26 of the circuit module 21 is low and a region where electrical components such as chip components are gathered and arranged. Yes.

コネクタキャップ43,44は例えばゴム製である。一方のコネクタキャップ43は、その弾性変形により入力用の電線コネクタ24に密に被嵌可能に形成されていて、一方のキャップ接続部42aにこれを液密に貫通して取付けられている。他方のコネクタキャップ44は、その弾性変形により出力用の電線コネクタ25に密に被嵌可能に形成されていて、他方のキャップ接続部42aにこれを液密に貫通して取付けられている。トレー本体42内に位置したコネクタキャップ43,44の開放端面43a,44aの高さ位置は、支持凸部45の高さ位置と略同じである。又、これらの高さ位置よりも上げ底部46〜52の底面の高さ位置は低い。   The connector caps 43 and 44 are made of rubber, for example. One connector cap 43 is formed so as to be tightly fitted to the input electric wire connector 24 by its elastic deformation, and is attached to one cap connecting portion 42a so as to penetrate liquid tightly. The other connector cap 44 is formed so as to be tightly fitted to the output electric wire connector 25 by its elastic deformation, and is attached to the other cap connecting portion 42a so as to penetrate liquid tightly. The height positions of the open end faces 43a, 44a of the connector caps 43, 44 located in the tray main body 42 are substantially the same as the height positions of the support convex portions 45. Further, the height positions of the bottom surfaces of the raised bottom portions 46 to 52 are lower than these height positions.

コネクタキャップ43,44は、電源側又は器具内配線用の絶縁被覆電線の端末部が挿入される電線差込部53を夫々複数有している。この電線差込部53は、図9で代表して示すようにキャップ外面に臨んだ閉鎖部53aにより閉じられた通孔予定部53bを有し、この通孔予定部53bの内面には複数の環状突起53cが設けられている。閉鎖部53aは薄肉である。前記電線の端末部にむき出された芯線及び端末部は閉鎖部53aを押し破って通孔予定部53bに挿入でき、この挿入に伴い電線端末部の外周に各環状突起53cが夫々密接されて液密が図られている。電線差込部53に挿入された電線端末部の芯線は電線コネクタ24又は25に挿入されて、これらコネクタが有した図示しない速結端子に接続されるようになっている。   Each of the connector caps 43 and 44 has a plurality of electric wire insertion portions 53 into which end portions of insulating coated electric wires for power supply or in-apparatus wiring are inserted. The wire insertion portion 53 has a through hole planned portion 53b closed by a closing portion 53a facing the outer surface of the cap as shown in FIG. 9, and a plurality of holes are provided on the inner surface of the through hole planned portion 53b. An annular protrusion 53c is provided. The closing part 53a is thin. The core wire and the terminal portion exposed at the terminal portion of the electric wire can be inserted into the through-hole planned portion 53b by breaking through the closing portion 53a, and each annular protrusion 53c is brought into close contact with the outer periphery of the electric wire terminal portion along with this insertion. Liquid-tightness is achieved. The core wire of the electric wire terminal part inserted in the electric wire insertion part 53 is inserted in the electric wire connector 24 or 25, and is connected to the quick connection terminal which these connectors have (not shown).

前記回路モジュール21は、その部品取付け面22aをトレー41の内部に臨ませてトレー41に収容されている。収容された回路モジュール21の回路基板22の長手方向両端部は、夫々コネクタキャップ43,44の開放端面43a,44aに載って支持され、回路基板22の長手方向両端部間の中間部は、複数の支持凸部45に載って支持される。更に、この収容の際、電線コネクタ24にはコネクタキャップ43が被嵌されるとともに、電線コネクタ25にはコネクタキャップ44が被嵌される。これらの被嵌によりトレー41に対して回路モジュール21が位置決めされる。   The circuit module 21 is housed in the tray 41 with its component mounting surface 22a facing the inside of the tray 41. The longitudinal ends of the circuit board 22 of the circuit module 21 accommodated are supported on the open end faces 43a, 44a of the connector caps 43, 44, respectively, and there are a plurality of intermediate portions between the longitudinal ends of the circuit board 22. Are supported by the support convex portion 45 of the. Further, during this accommodation, a connector cap 43 is fitted on the electric wire connector 24, and a connector cap 44 is fitted on the electric wire connector 25. With these fittings, the circuit module 21 is positioned with respect to the tray 41.

こうしてトレー41に収容された回路モジュール21の電気部品26の端子29、及び電線コネクタ24,25の端子30の先端は、夫々上を向いて突出している。しかし、各端子29,30の高さ位置は、トレー41の開口縁42cの上端より低い位置にある。又、図3及び図4に例示されるように各電気部品26の先端(図3及び図4では下端)は、いずれもトレー本体42の内面から離れている。更に、回路モジュール21の電気部品26の配設密度が低い領域とチップ部品等の高さが低い電気部品が集まって配設された領域とには、トレー本体42の上げ底部46〜52が夫々対向している。   In this way, the terminals 29 of the electrical components 26 of the circuit module 21 accommodated in the tray 41 and the tips of the terminals 30 of the electric wire connectors 24 and 25 protrude upward. However, the height positions of the terminals 29 and 30 are lower than the upper end of the opening edge 42 c of the tray 41. Further, as illustrated in FIGS. 3 and 4, the tips (lower ends in FIGS. 3 and 4) of each electrical component 26 are all separated from the inner surface of the tray main body 42. Further, the raised bottom portions 46 to 52 of the tray main body 42 are respectively provided in a region where the arrangement density of the electrical components 26 of the circuit module 21 is low and a region where electrical components such as chip components are gathered. Opposite.

前記充填材55は、電気絶縁性及び防水性を有する合成樹脂であって、本実施形態では放熱性を高めるために酸化アルミニュームのフィラー(図示しない)が混入されたウレタン樹脂を用いている。充填材55は、トレー41に収容された回路モジュール21全体を埋設してトレー41に充填されている。この充填は、回路モジュール21が納められたトレー41をカバー15の内側に嵌合させた状態で実施され、未硬化の充填材はトレー41の開口縁42cと回路基板22の間の隙間から注入される。又、トレー41をカバー15内に嵌合させることにより、コネクタキャップ43,44は夫々対向した孔16,17に露出されて、外部からの電線の挿入が可能となる。   The filler 55 is a synthetic resin having electrical insulation and waterproofing, and in this embodiment, a urethane resin mixed with aluminum oxide filler (not shown) is used in order to improve heat dissipation. The filling material 55 is filled in the tray 41 by embedding the entire circuit module 21 accommodated in the tray 41. This filling is performed in a state where the tray 41 in which the circuit module 21 is housed is fitted inside the cover 15, and the uncured filling material is injected from the gap between the opening edge 42 c of the tray 41 and the circuit board 22. Is done. Further, by fitting the tray 41 into the cover 15, the connector caps 43 and 44 are exposed in the opposed holes 16 and 17, respectively, and an external electric wire can be inserted.

図3及び図4中符号55aは回路基板22の半田付け面22bを覆った充填材55の半田カバー層を示しており、この半田カバー層55a内には各端子29,30が埋設されている。半田カバー層55aの表面の高さは例えばトレー41の開口縁42cの上端と同じ高さに位置している。つまり、図5に示すように充填材55はその半田カバー層55aの表面がトレー41の開口縁42cの上端と同面となるようにトレー41に満たされた状態に充填されている。なお、半田カバー層55aの表面の高さはトレー41の開口縁42cの上端より低くすることもできる。   3 and 4, reference numeral 55a indicates a solder cover layer of the filler 55 that covers the soldering surface 22b of the circuit board 22, and the terminals 29 and 30 are embedded in the solder cover layer 55a. . The height of the surface of the solder cover layer 55a is located at the same height as the upper end of the opening edge 42c of the tray 41, for example. That is, as shown in FIG. 5, the filler 55 is filled in a state where the tray 41 is filled so that the surface of the solder cover layer 55 a is flush with the upper end of the opening edge 42 c of the tray 41. The height of the surface of the solder cover layer 55a can be made lower than the upper end of the opening edge 42c of the tray 41.

充填材55と、トレー41と、回路モジュール21とは、充填材55の防水性能によって回路モジュール21に対する防水性を担保する防水アセンブリ31を構成している。   The filler 55, the tray 41, and the circuit module 21 constitute a waterproof assembly 31 that guarantees waterproofness for the circuit module 21 by the waterproof performance of the filler 55.

トレー41が上げ底部46〜52を有した構成によって、上げ底部がないトレーを用いた構成に比較して充填材55の使用量を少なくできる。これにより、充填作業時間の短縮とともに、点灯装置5のコスト低減を図ることが可能である。   With the configuration in which the tray 41 has the raised bottom portions 46 to 52, the amount of the filler 55 used can be reduced as compared with the configuration using the tray without the raised bottom portion. Thereby, it is possible to shorten the filling operation time and reduce the cost of the lighting device 5.

充填材55をトレー41に充填した後に防水アセンブリ31を加熱硬化炉に通すことによって、充填材55は硬化される。この加熱処理で与えられる熱に対してPET製のトレー41は十分な耐熱性を発揮できる。   The filling material 55 is cured by passing the waterproof assembly 31 through a heat-curing furnace after filling the tray 41 with the filling material 55. The tray 41 made of PET can exhibit sufficient heat resistance against the heat given by this heat treatment.

この硬化後の充填材55の硬度は、電解コンデンサ26bの防爆弁28が動作可能な硬度とすることが望ましい。この硬度としてJIS A硬度 50を例示できる。こうした硬度の充填材55を用いることによって、図11(A)のように充填材55に全体が埋設された電解コンデンサ26bの防爆弁28が破壊された場合、図11(B)に示すように電解コンデンサ26bの防爆弁28を覆っていた部分55bが、盛り上がるように容易に撓んで、防爆弁28の破壊に伴う応力を緩和し吸収できる。このため、防爆弁28の周囲の充填材55の影響で、防爆弁28の破壊に伴い応力が急激に増大して、防爆弁28を覆っていた部分55bが吹き飛んで、他に悪影響を与えることを抑制できる。   The hardness of the cured filler 55 is desirably set to a hardness that allows the explosion-proof valve 28 of the electrolytic capacitor 26b to operate. JIS A hardness 50 can be illustrated as this hardness. When the filler 55 having such hardness is used and the explosion-proof valve 28 of the electrolytic capacitor 26b entirely embedded in the filler 55 is broken as shown in FIG. 11A, as shown in FIG. 11B. The portion 55b of the electrolytic capacitor 26b that covers the explosion-proof valve 28 is easily bent so as to rise, and the stress accompanying the destruction of the explosion-proof valve 28 can be relaxed and absorbed. For this reason, due to the influence of the filler 55 around the explosion-proof valve 28, the stress suddenly increases with the destruction of the explosion-proof valve 28, and the portion 55b covering the explosion-proof valve 28 is blown off, which has other adverse effects. Can be suppressed.

前記防水アセンブリ31は既述のようにカバー15に納めた状態で充填材55を充填して組立てられる。そして、防水アセンブリ31のトレー41の外面はカバー15の内面に接触するように収容され、言い換えれば、トレー41はカバー15に対して満杯状態に収容されている。これにより、防水アセンブリ31からカバー15への熱伝導が可能となっている。特に、発熱量が多いパワートランジスタ26aに接続されて回路基板22からはみ出している放熱板27は、トレー41の一方の側板42bをカバー15の一方の側壁15bに強く押し付けて密接状態となるので、この放熱板27からカバー15への熱伝導は確実である。   As described above, the waterproof assembly 31 is assembled by being filled with the filler 55 in a state of being accommodated in the cover 15. The outer surface of the tray 41 of the waterproof assembly 31 is accommodated so as to contact the inner surface of the cover 15, in other words, the tray 41 is accommodated with respect to the cover 15 in a full state. Thereby, heat conduction from the waterproof assembly 31 to the cover 15 is possible. In particular, the heat sink 27 that is connected to the power transistor 26 a that generates a large amount of heat and protrudes from the circuit board 22 is pressed tightly against the one side plate 42 b of the tray 41 against the one side wall 15 b of the cover 15. The heat conduction from the radiator plate 27 to the cover 15 is reliable.

以上のように防水アセンブリ31が収容されたカバー15には収容ベース12が被され、これら収容ベース12とカバー15とは連結されて、外郭ケース11を構成する。この組立て状態で、充填材55の半田カバー層55aは収容ベース12のベース壁12aで覆われ、かつ、これらのベース壁12aと半田カバー層55aとは図3及び図4に示すように密に面接触する。この接触にも拘わらず、半田カバー層55aは電気絶縁性であるので、収容ベース12と回路モジュール21との間の電気絶縁を図るシート部材を要しない。前記面接触に基づく広い接触面積の確保により、防水アセンブリ31の熱を収容ベース12に円滑に伝導させることができる。なお、ベース壁12aと半田カバー層55aの間に隙間が生じる場合には、この隙間に相当する厚みを有した良熱伝導性のシート状伝熱部材を、ベース壁12aと半田カバー層55aの間に挟設して、円滑な熱伝導を図ることも可能である。   As described above, the cover 15 in which the waterproof assembly 31 is accommodated is covered with the accommodation base 12, and the accommodation base 12 and the cover 15 are connected to constitute the outer case 11. In this assembled state, the solder cover layer 55a of the filler 55 is covered with the base wall 12a of the receiving base 12, and the base wall 12a and the solder cover layer 55a are closely packed as shown in FIGS. Surface contact. In spite of this contact, since the solder cover layer 55a is electrically insulating, a sheet member for achieving electrical insulation between the housing base 12 and the circuit module 21 is not required. By securing a wide contact area based on the surface contact, the heat of the waterproof assembly 31 can be smoothly conducted to the housing base 12. When a gap is generated between the base wall 12a and the solder cover layer 55a, a sheet-like heat transfer member having a thickness corresponding to the gap is connected to the base wall 12a and the solder cover layer 55a. It is also possible to interpose between them to achieve smooth heat conduction.

又、外郭ケース11の収容ベース12とカバー15の夫々には排水部が設けられている。つまり、図2〜図4に示すように収容ベース12のベース壁12aには孔からなる複数の排水部14が開けられているとともに、カバー15のカバー主壁15aにも孔からなる複数の排水部18が開けられている。このため、湿気などが外郭ケース11とトレー41及び半田カバー層55a等との間に結露した場合に、排水部14,18を通して外郭ケース11の外部に排水できる。したがって、点灯装置5の電気絶縁性能を向上できる。又、外郭ケース11を鉄で作る場合には、この外郭ケース11に錆が発生することを抑制する上でも有効である。   Further, a drainage portion is provided in each of the accommodation base 12 and the cover 15 of the outer case 11. That is, as shown in FIGS. 2 to 4, the base wall 12 a of the housing base 12 has a plurality of drainage portions 14 made of holes, and the cover main wall 15 a of the cover 15 has a plurality of drainages made of holes. Part 18 is opened. Therefore, when moisture or the like is condensed between the outer case 11 and the tray 41 and the solder cover layer 55a, the water can be drained to the outside of the outer case 11 through the drainage portions 14 and 18. Therefore, the electrical insulation performance of the lighting device 5 can be improved. Further, when the outer case 11 is made of iron, it is effective in suppressing the rust from being generated in the outer case 11.

以上の構成の点灯装置5では、外郭ケース11のカバー15と略同じ大きさのトレー41を備え、このトレー41に収容した回路モジュール21全体をトレー41に充填した充填材55に埋設している。そして、トレー41に充填された充填材55は、トレー41のコネクタキャップ43,44によって回路モジュール21の電線コネクタ24,25に侵入することがない。つまり、コネクタキャップ43,44の通孔予定部53bは電線が挿入されるまでは薄肉の閉鎖部53aによって閉じられているので、トレー41に充填された充填材45が、コネクタキャップ43,44を通って電線コネクタ24,25に侵入することがない。   In the lighting device 5 having the above configuration, the tray 41 having substantially the same size as the cover 15 of the outer case 11 is provided, and the entire circuit module 21 accommodated in the tray 41 is embedded in the filler 55 filled in the tray 41. . The filling material 55 filled in the tray 41 does not enter the wire connectors 24 and 25 of the circuit module 21 by the connector caps 43 and 44 of the tray 41. That is, the through-hole scheduled portion 53b of the connector cap 43, 44 is closed by the thin closing portion 53a until the electric wire is inserted, so the filler 45 filled in the tray 41 causes the connector cap 43, 44 to The wire connectors 24 and 25 do not enter through.

充填材55は、電気絶縁性でかつ防水性を有しているので、この充填材55によって回路モジュール21の回路基板22、電気部品26、及び半田付け面22b等を防水できる。そして、トレー41はカバー15内に満杯状態に収容される大きさであり、このトレー41を用いて外郭ケース11の内部で既述の防水を実現した構成を備えているので、防水の構成を原因として外郭ケース11が大きくなることがない。これにより、既存の製造設備で作られる外郭ケースを用いることも可能である。これとともに、こうした外郭ケース11内での防水構成により、外郭ケース11を収容する大形な防水ケースを要しないで、高湿度環境に耐える防水性能を得ることができる。   Since the filler 55 is electrically insulating and waterproof, the filler 55 can waterproof the circuit board 22, the electrical component 26, the soldering surface 22b, and the like of the circuit module 21. The tray 41 is sized to be accommodated in the cover 15 in a full state. Since the tray 41 is used to provide the waterproof structure described above in the outer case 11, the waterproof structure is provided. As a cause, the outer case 11 does not become large. Thereby, it is also possible to use an outer case made of existing manufacturing equipment. At the same time, such a waterproof configuration in the outer case 11 does not require a large waterproof case for housing the outer case 11, and can provide waterproof performance that can withstand a high humidity environment.

このため、点灯装置5を小形に構成できる。しかも、この点灯装置5の組立ての他に、この装置5を防水ケースに収容する手間、及びこの後に防水ケースを組立てる手間が不要であるので、容易に組立てることができる。以上のように防水ケースを用いること自体でのコスト増加をなくすことができることに加えて、組立てコスト上のコスト低減できるので、点灯装置5ひいてはこの装置5を備える照明器具1を低コスト化できる。   For this reason, the lighting device 5 can be configured in a small size. Moreover, in addition to assembling the lighting device 5, there is no need for the trouble of housing the device 5 in the waterproof case and the trouble of assembling the waterproof case thereafter, so that the lighting device 5 can be easily assembled. As described above, since it is possible to eliminate the cost increase due to the use of the waterproof case itself, the cost for assembling can be reduced, so that the lighting device 5 and thus the lighting fixture 1 including the device 5 can be reduced in cost.

更に、前記点灯装置5の充填材55は防水性能だけではなく放熱性能も備えているので、パワートランジスタ26aその他発熱を伴う電気部品の熱を、充填材55に通して外郭ケース11に伝導できる。この場合、充填材55の容量が大であるとともに、この充填材55から外郭ケース11への熱伝導面積も大きいので、優れた放熱特性を得ることができる。特に、金属フィラーを混入した充填材55の採用により、より放熱特性を向上できる。   Furthermore, since the filling material 55 of the lighting device 5 has not only waterproof performance but also heat radiation performance, the heat of the power transistor 26a and other electrical components that generate heat can be conducted to the outer case 11 through the filling material 55. In this case, since the capacity of the filler 55 is large and the heat conduction area from the filler 55 to the outer case 11 is large, excellent heat dissipation characteristics can be obtained. In particular, the use of the filler 55 mixed with a metal filler can further improve the heat dissipation characteristics.

又、既述のように充填材55が回路モジュール21全体を埋設しているので、充填材55によって確実な防塵ができる。これにより、塵が多い場所で使用される点灯装置5ひいてはこの装置5を備える照明器具1としても好適に使用できる。   Moreover, since the filler 55 embeds the entire circuit module 21 as described above, the dust can be reliably prevented by the filler 55. Thereby, it can use suitably also as the lighting fixture 1 provided with the lighting device 5 used by this place with much dust and this device 5 by this.

本発明の一実施形態に係る照明器具を示す斜視図。The perspective view which shows the lighting fixture which concerns on one Embodiment of this invention. 図1の照明器具が備える本発明の一実施形態に係る点灯装置を示す斜視図。The perspective view which shows the lighting device which concerns on one Embodiment of this invention with which the lighting fixture of FIG. 1 is provided. 図2中F3−F3線に沿う断面図。Sectional drawing which follows the F3-F3 line | wire in FIG. 図2中F4−F4線に沿う断面図。Sectional drawing which follows the F4-F4 line | wire in FIG. 図2の点灯装置の防水アセンブリを裏側から見て示す斜視図。The perspective view which shows the waterproof assembly of the lighting device of FIG. 2 as seen from the back side. 図5の防水アセンブリが備えるトレーを表側から見て示す斜視図。The perspective view which shows the tray with which the waterproof assembly of FIG. 5 is provided seeing from the front side. 図6のトレーとこれに収容される回路モジュールとを分離した状態で裏側から見て示す斜視図。The perspective view shown from the back side in the state which isolate | separated the tray of FIG. 6, and the circuit module accommodated in this. 図6のトレーとこれに収容される回路モジュールとを分離した状態で表側から見て示す斜視図。The perspective view shown from the front side in the state which isolate | separated the tray of FIG. 6, and the circuit module accommodated in this. 図6のトレーが有したコネクタキャップを示す断面図。Sectional drawing which shows the connector cap which the tray of FIG. 6 had. 図8に示した回路モジュールに搭載される防爆弁付きの電気部品を示す斜視図。The perspective view which shows the electrical component with an explosion-proof valve mounted in the circuit module shown in FIG. (A)は図10の電気部品が充填材に埋設された状態を示す断面図。(B)は充填材に埋設された図10の電気部品の防爆弁が動作した状態を示す断面図。(A) is sectional drawing which shows the state by which the electrical component of FIG. 10 was embed | buried under the filler. (B) is sectional drawing which shows the state which the explosion-proof valve of the electrical component of FIG. 10 embed | buried under the filler operated.

符号の説明Explanation of symbols

1…照明器具、2…器具本体、3…ランプソケット、4…蛍光ランプ、5…点灯装置、11…外郭ケース、12…収容ベース、15…カバー、16,17…孔、21…回路モジュール、22…回路基板、22a…部品取付け面、22b…半田付け面、23…点灯回路、24,25…電線コネクタ、26…電気部品、29,30…端子、31…防水アセンブリ、41…トレー、42…トレー本体、42a…キャップ接続部、53…電線差込部、53a…閉鎖部、53b…通孔予定部、55…充填材、55a…半田カバー層   DESCRIPTION OF SYMBOLS 1 ... Lighting fixture, 2 ... Appliance main body, 3 ... Lamp socket, 4 ... Fluorescent lamp, 5 ... Lighting device, 11 ... Outer case, 12 ... Housing base, 15 ... Cover, 16, 17 ... Hole, 21 ... Circuit module, DESCRIPTION OF SYMBOLS 22 ... Circuit board, 22a ... Component mounting surface, 22b ... Soldering surface, 23 ... Lighting circuit, 24, 25 ... Electric wire connector, 26 ... Electrical component, 29, 30 ... Terminal, 31 ... Waterproof assembly, 41 ... Tray, 42 ... Tray body, 42a ... Cap connection part, 53 ... Wire insertion part, 53a ... Closed part, 53b ... Scheduled through hole part, 55 ... Filler, 55a ... Solder cover layer

Claims (3)

回路基板、この基板に搭載されて点灯回路をなす各種の電気部品、及び前記点灯回路に接続して前記回路基板に搭載された電線コネクタを備えた回路モジュールと;
前記電線コネクタに被嵌され、この電線コネクタへの電線の接続時にこの電線で押し破られて前記電線の挿入を許す閉鎖部で閉じられた通孔予定部を有したコネクタキャップと;
前記回路モジュールを収容したトレーと;
防水性及び電気絶縁性を有し、前記回路モジュール全体を埋めて前記トレーに充填された充填材と;
前記トレー、回路モジュール、及び充填材からなる防水アセンブリを収容するとともに、前記コネクタキャップを露出させる外郭ケースと;
を具備したことを特徴とする点灯装置。
A circuit board, various electrical components mounted on the board to form a lighting circuit, and a circuit module provided with a wire connector connected to the lighting circuit and mounted on the circuit board;
A connector cap having a through-hole scheduled portion that is fitted on the electric wire connector and is closed by a closing portion that is pushed by the electric wire when the electric wire is connected to the electric wire connector and allows the electric wire to be inserted;
A tray containing the circuit module;
A filler having waterproofness and electrical insulation, filling the entire circuit module and filling the tray;
An outer case for housing the waterproof assembly including the tray, the circuit module, and the filler, and exposing the connector cap;
A lighting device comprising:
前記充填材が、フィラーが混入された合成樹脂であることを特徴とする請求項1に記載の点灯装置。   The lighting device according to claim 1, wherein the filler is a synthetic resin mixed with a filler. 器具本体と;
この器具本体に取付けられたランプソケットと;
このソケットに取り外し可能に支持された放電灯と;
前記器具本体に取付けられて前記放電灯を点灯させる請求項1又は2に記載の点灯装置と;
を具備したことを特徴とする照明器具。
An instrument body;
A lamp socket attached to the appliance body;
A discharge lamp removably supported in the socket;
The lighting device according to claim 1 or 2, wherein the lighting device is attached to the appliance main body to light the discharge lamp;
The lighting fixture characterized by comprising.
JP2004234769A 2004-08-11 2004-08-11 Lighting device and lighting apparatus Expired - Fee Related JP4438560B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004234769A JP4438560B2 (en) 2004-08-11 2004-08-11 Lighting device and lighting apparatus
TW094125544A TW200609713A (en) 2004-08-11 2005-07-28 Electronic apparatus and a lighting device thereof
CNB200510090211XA CN100559072C (en) 2004-08-11 2005-08-10 E-machine and ignition device
KR1020050073400A KR100657092B1 (en) 2004-08-11 2005-08-10 Electronic Apparatus and Lighting Device
US11/201,199 US7360927B2 (en) 2004-08-11 2005-08-11 Electronic apparatus and lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004234769A JP4438560B2 (en) 2004-08-11 2004-08-11 Lighting device and lighting apparatus

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166331A (en) * 2006-12-27 2008-07-17 Lecip Corp Electronic apparatus and its manufacturing method
US20190392993A1 (en) * 2018-06-21 2019-12-26 Alpine Electronics, Inc. Electronic unit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166331A (en) * 2006-12-27 2008-07-17 Lecip Corp Electronic apparatus and its manufacturing method
US20190392993A1 (en) * 2018-06-21 2019-12-26 Alpine Electronics, Inc. Electronic unit
EP3588522A2 (en) 2018-06-21 2020-01-01 Alpine Electronics, Inc. Coated electronic unit comprising an electrolyte capacitor with a explosion proof valve
US10957490B2 (en) 2018-06-21 2021-03-23 Alpine Electronics, Inc. Electronic unit

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