JP2006053159A - In-vehicle electric wave type radar installation and its manufacturing method - Google Patents

In-vehicle electric wave type radar installation and its manufacturing method Download PDF

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JP2006053159A
JP2006053159A JP2005301589A JP2005301589A JP2006053159A JP 2006053159 A JP2006053159 A JP 2006053159A JP 2005301589 A JP2005301589 A JP 2005301589A JP 2005301589 A JP2005301589 A JP 2005301589A JP 2006053159 A JP2006053159 A JP 2006053159A
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circuit board
internal circuit
signal processing
transmission
transmission line
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Mitsushige Suzuki
光茂 鈴木
Kazuro Takano
和朗 高野
Takahito Fukute
隆仁 福手
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Hitachi Ltd
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<P>PROBLEM TO BE SOLVED: To provide an in-vehicle electric wave type radar installation which can freely be installed, while magnetically-shielding the transmission line connecting between an external connector and an internal circuit both provided on an outer case, without the external connector being controlled by any position of the internal circuit. <P>SOLUTION: In this radar installation, the outer case 60 comprises its own main body 61 and a shielding layer 62 coating its internal surface. The transmission line 73 from the internal circuit extends to its desired position along the shielding layer 62 of the outer case 60 on periphery side of this shielding layer 62, where the external connector 70 is installed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、例えば、レーダ装置やカーナビゲーション装置等、車両に搭載され、外部との間で信号を受送信する車載用信号処理装置に関する。   The present invention relates to an in-vehicle signal processing device that is mounted on a vehicle, such as a radar device or a car navigation device, and receives and transmits signals to / from the outside.

ミリ波帯域の電波を用いた電波式レーダ装置は、雨、霧等が存在する悪天候下でも電波ビームの減衰量が小さく、車載用として必要とする最大検知距離を確保できるため、前方車との車間距離や相対速度を計測するセンサとして商品化されつつある。このような車載用レーダ装置は、外部へ電磁ノイズが漏れるのを防ぐため、外部からの電磁ノイズの侵入を防ぐために、各種磁気シールドを施すことが考えられている。   Radio wave radar devices using millimeter-wave band radio waves have low attenuation of radio wave beams even under bad weather conditions such as rain and fog, and can secure the maximum detection distance required for in-vehicle use. It is being commercialized as a sensor that measures inter-vehicle distance and relative speed. In order to prevent electromagnetic noise from leaking to the outside, such an in-vehicle radar device is considered to be provided with various magnetic shields in order to prevent electromagnetic noise from entering from the outside.

例えば、特開平7−66746号公報に記載の装置では、外筐体の内面と内部回路との間に、導電材で形成された直筒を配し、その中に信号線等を設けることで、内部回路と外筐体内面との間の空間内の遮断周波数を高めると共に、信号線等から発生する電磁ノイズを遮蔽するものである。   For example, in the device described in JP-A-7-66746, by arranging a straight tube made of a conductive material between the inner surface of the outer casing and the internal circuit, and providing a signal line or the like therein, It increases the cutoff frequency in the space between the internal circuit and the inner surface of the outer casing, and shields electromagnetic noise generated from signal lines and the like.

しかしながら、従来技術では、仮に、信号線が外筐体に設けられた外部接続コネクタと内部回路とを接続するものである場合、導電材で形成された直筒でこの信号線を覆っているため、外筐体上であって内部回路から最短距離の位置にコネクタを設ける必要があり、コネクタの設置に位置的な制約を受けてしまうという問題点がある。このような制約は、サイズや配置に関して、極めて厳しい制約を受ける車載用装置にとって、好ましいことではない。例えば、車両のある凹部に車載用装置を設置しようとするときに、車載用装置のある箇所に外部接続コネクタを設けると、このコネクタに外部接続ケーブルを接続できないという問題や、この外部接続ケーブルが仮に接続できたとしても、このケーブルが邪魔になって凹部に車載用装置を設置できないという問題が起こり得る。また、仮に、適当な長さの筒を適宜屈曲させて、これを磁気シールド用の直筒の換わりに使用すれば、コネクタを自由な位置に設けられることになるが、この場合には、外筐体内に、比較的長く且つ屈曲した筒の配置スペースを確保する必要が生じて、装置全体の大型化を招いてしまう。   However, in the prior art, if the signal line connects the external connection connector provided in the outer housing and the internal circuit, the signal line is covered with a straight tube formed of a conductive material. There is a problem that it is necessary to provide a connector on the outer casing at the shortest distance from the internal circuit, and there is a problem that the installation of the connector is subject to positional restrictions. Such a restriction is not preferable for a vehicle-mounted device that is subjected to extremely severe restrictions regarding size and arrangement. For example, when an in-vehicle device is to be installed in a concave portion of a vehicle, if an external connection connector is provided at a location of the in-vehicle device, an external connection cable cannot be connected to this connector, or this external connection cable Even if the connection can be made, there is a problem that the in-vehicle apparatus cannot be installed in the recess due to this cable being in the way. In addition, if a tube having an appropriate length is bent appropriately and used instead of a straight tube for magnetic shielding, the connector can be provided at a free position. It is necessary to secure a relatively long and bent tube arrangement space in the body, leading to an increase in the size of the entire apparatus.

また、以上の従来技術では、直筒の内部回路側の端部開口から、信号線から発した電磁ノイズが漏れ、十分な磁気シールを行うことができないという問題点もある。   Further, the above-described prior art also has a problem that electromagnetic noise emitted from the signal line leaks from the end opening on the internal circuit side of the straight cylinder, and sufficient magnetic sealing cannot be performed.

そこで、本出願に係る発明は、このような従来の問題点に着目し、外筐体に設けられる外部接続部と内部回路とを接続する伝送線を磁気シールドしつつ、装置を大型化させることなく、外部接続部を自由な位置に設置することができる車載用信号処理装置を提供することを第1の目的とする。   Therefore, the invention according to the present application pays attention to such a conventional problem, and enlarges the apparatus while magnetically shielding the transmission line connecting the external connection portion provided in the outer casing and the internal circuit. The first object is to provide an in-vehicle signal processing device in which an external connection portion can be installed at a free position.

さらに、本出願に係る発明は、十分な磁気シールドを行うことができる車載用信号処理装置を提供することを第2の目的とする。   Furthermore, a second object of the present invention is to provide an in-vehicle signal processing device capable of performing sufficient magnetic shielding.

前記目的を達成するための第1の目的を達成するための車載用信号処理装置は、
車両に搭載され、信号及び/又は電力を含む伝送対象を外部との間で受信及び/又は送信する車載用信号処理装置において、
前記伝送対象が入力する、及び/又は前記伝送対象を出力する内部回路と、
前記内部回路を覆い、内周側に導電性を有するシールド層が施されている外筐体と、
前記外部との間で前記伝送対象を送受信するため、前記外筐体に取り付けられ且つ該外筐体の外側に臨んでいる外部接続部と、
前記内部回路と前記外部接続部とを電気的に接続する伝送線と、
を備え、
前記伝送線は、前記外部接続部を基点として、前記外筐体の外周面と前記シールド層との間を、該外筐体の内周面が広がっている方向又は該外筐体の外周面が広がっている方向に伸びてから、該シールド層を貫通して、前記内部回路に接続されている、ことを特徴とするものである。
An in-vehicle signal processing device for achieving the first object for achieving the object is as follows:
In an in-vehicle signal processing apparatus that is mounted on a vehicle and receives and / or transmits a transmission target including a signal and / or electric power with the outside,
An internal circuit for inputting the transmission target and / or outputting the transmission target;
An outer housing that covers the internal circuit and is provided with a conductive shield layer on the inner periphery side;
In order to send and receive the transmission object to and from the outside, an external connection part attached to the outer case and facing the outside of the outer case,
A transmission line for electrically connecting the internal circuit and the external connection part;
With
The transmission line has a direction in which the inner peripheral surface of the outer casing spreads between the outer peripheral surface of the outer casing and the shield layer, or the outer peripheral surface of the outer casing, starting from the external connection portion. After extending in the spreading direction, the shield layer is penetrated and connected to the internal circuit.

また、前記第2の目的を達成するための車載用信号処理装置は、
車両に搭載され、信号及び/又は電力を含む伝送対象を外部との間で受信及び/又は送信する車載用信号処理装置において、
前記伝送対象が入力する、及び/又は前記伝送対象を出力する内部回路を有する内部回路基板と、
前記内部回路基板を支える基板支持台と、
前記内部回路基板及び前記基板支持台を覆い、内周側に導電性を有するシールド層が施されている外筐体と、
前記外部との間で前記伝送対象を送受信するため、前記シールド層を外周側から内周側へ貫通して、前記内部回路と電気的に接続されている伝送線と、
を備え、
前記基板支持台は、前記伝送線による前記シールド層の貫通位置と前記内部回路基板との間の該伝送線の外周を覆い、且つ導電材で形成された筒状のシールド部を有し、
前記内部回路基板は、前記筒状のシールド部に接触して、前記筒状のシールド部の端部開口を塞ぎ、
前記内部回路基板は、導電層と前記伝送線を通ってきたノイズを除去するノイズ除去手段とを有し、該ノイズ除去手段は、前記シールド層からの前記伝送線が前記導電層を貫通する直前又は直後の位置に設けられている、ことを特徴とするものである。
An in-vehicle signal processing device for achieving the second object is as follows:
In an in-vehicle signal processing apparatus that is mounted on a vehicle and receives and / or transmits a transmission target including a signal and / or electric power with the outside,
An internal circuit board having an internal circuit for inputting and / or outputting the transmission object;
A board support for supporting the internal circuit board;
An outer casing that covers the internal circuit board and the board support, and is provided with a conductive shield layer on the inner periphery;
In order to send and receive the transmission object to and from the outside, a transmission line that penetrates the shield layer from the outer peripheral side to the inner peripheral side and is electrically connected to the internal circuit,
With
The substrate support has a cylindrical shield portion that covers an outer periphery of the transmission line between the penetration position of the shield layer by the transmission line and the internal circuit board, and is formed of a conductive material,
The internal circuit board is in contact with the cylindrical shield portion and closes an end opening of the cylindrical shield portion;
The internal circuit board has a conductive layer and noise removing means for removing noise that has passed through the transmission line, and the noise removing means is immediately before the transmission line from the shield layer penetrates the conductive layer. Or it is provided in the position immediately after.

本願に係る発明によれば、外部接続部から内部回路までの信号線を、外筐体のシールド層の外周側に沿わせて、目的の位置まで導いているので、外部接続部は内部回路の位置に規制されることなく、自由な位置に設けることができる。   According to the invention according to the present application, the signal line from the external connection portion to the internal circuit is guided to the target position along the outer peripheral side of the shield layer of the outer casing. It can be provided at any position without being restricted by the position.

また、本願に係る他の発明によれば、外筐体のシールド層から内部回路までの間の伝送線を、内部回路が設けられている基板の導電層と外部筐体のシールド層と基板支持台のシールド部で覆うと共に、基板の導電層の直前又は直後にノイズ除去手段を設けたので、この伝送線にノイズがのっていても、このノイズにより内部回路を含めた各種回路への影響を効率よく且つ確実に抑えることができる。   According to another invention of the present application, the transmission line from the shield layer of the outer casing to the internal circuit is connected to the conductive layer of the substrate on which the internal circuit is provided, the shield layer of the outer casing, and the substrate support. In addition to covering with the shield part of the base and providing noise removal means immediately before or after the conductive layer of the substrate, even if noise is on this transmission line, this noise affects various circuits including internal circuits Can be efficiently and reliably suppressed.

以下、本発明に係る車載用信号処理装置の実施形態について、図面を用いて説明する。   Hereinafter, an embodiment of an in-vehicle signal processing device according to the present invention will be described with reference to the drawings.

本実施形態の車載用信号処理装置は、図8に示すように、車載用レーダ装置1で、自車両2の前端部に取り付けて、先行車等の物体5までの相対距離や相対速度や方位角度等を計測するものである。   As shown in FIG. 8, the in-vehicle signal processing apparatus according to the present embodiment is an in-vehicle radar apparatus 1 that is attached to the front end portion of the host vehicle 2 and has a relative distance, relative speed, and direction to an object 5 such as a preceding vehicle. An angle is measured.

この車載用レーダ装置1は、図1に示すように、送信アンテナ11と、二つの受信アンテナ12a,12bと、各アンテナ11,12a,12bの電波放射側を覆うレドーム65と、送信アンテナ11に送信信号を与えると共に受信アンテナ12a,12bからの受信信号を受け付ける高周波回路21と、受信信号に基づいて各種演算処理を行う信号処理回路41と、高周波回路21と信号処理回路41との間のインタフェース回路21と、角速度センサ55と、伝送線中のノイズを除去するフィルタ回路(ノイズ除去手段)54と、これらの各回路等に電力を供給する電源回路51と、各回路等を覆う外筐体60と、外部接続コネクタ(外部接続部)70と、を備えている。   As shown in FIG. 1, the in-vehicle radar device 1 includes a transmission antenna 11, two reception antennas 12 a and 12 b, a radome 65 that covers the radio wave radiation side of each of the antennas 11, 12 a and 12 b, and a transmission antenna 11. A high-frequency circuit 21 that gives transmission signals and receives reception signals from the reception antennas 12a and 12b, a signal processing circuit 41 that performs various arithmetic processes based on the reception signals, and an interface between the high-frequency circuit 21 and the signal processing circuit 41 Circuit 21, angular velocity sensor 55, filter circuit (noise removing means) 54 for removing noise in the transmission line, power supply circuit 51 for supplying power to each of these circuits, etc., and outer casing covering each circuit 60 and an external connection connector (external connection portion) 70.

高周波回路21は、信号処理回路41からの互いに異なる周波数f1,f2の2種類の変調信号に基づいて、2種類の送信信号f1,f2を時差を付けて出力する発信器25と、この送信信号f1,f2を増幅して送信アンテナ11等に送る送信側アンプ26a,26bと、各受信アンテナ12a,12bからの受信信号を増幅する受信側アンプ27a,27bと、各受信側アンプ27a,27bの出力に送信側アンプ26bの出力をミキシングするミキサ28a,28bと、各ミキサ28a,28bからの信号の和信号及び差信号を生成する和・差信号生成回路29と、を有している。   The high-frequency circuit 21 includes a transmitter 25 that outputs two types of transmission signals f1 and f2 with a time difference based on two types of modulation signals having different frequencies f1 and f2 from the signal processing circuit 41, and the transmission signal. The transmission side amplifiers 26a and 26b that amplify f1 and f2 and send them to the transmission antenna 11 and the like, the reception side amplifiers 27a and 27b that amplify the reception signals from the reception antennas 12a and 12b, and the reception side amplifiers 27a and 27b. Mixers 28a and 28b that mix the output of the transmission-side amplifier 26b and outputs a sum / difference signal generation circuit 29 that generates a sum signal and a difference signal of the signals from the mixers 28a and 28b.

信号処理回路41は、高周波回路21からインタフェース回路31を介して入力した和信号(sum)及び差信号(diff)、さらに角速度センサ48からの角速度信号をアナログ信号からディジタル信号に変換するA/D変換器44と、ディジタル信号に変換された和信号及び差信号等にFFT(Fast Fourier Transform)処理を施すFFT回路45と、FFT回路45からの信号に基づいて物体までの距離や相対速度や方位角度を求める計測演算部46と、高周波回路21に送る変調信号f1,f2を生成する変調器47と、を有している。   The signal processing circuit 41 converts the sum signal (sum) and difference signal (diff) input from the high-frequency circuit 21 via the interface circuit 31, and further converts the angular velocity signal from the angular velocity sensor 48 from an analog signal to a digital signal. A converter 44, an FFT circuit 45 that performs FFT (Fast Fourier Transform) processing on the sum signal and difference signal converted into digital signals, and the distance, relative speed, and direction to the object based on the signal from the FFT circuit 45 A measurement calculation unit 46 for obtaining an angle and a modulator 47 for generating modulation signals f1 and f2 to be sent to the high frequency circuit 21 are provided.

ここで、本実施形態における車載用レーダ装置による距離計測等の原理について簡単に説明する。   Here, the principle of distance measurement and the like by the in-vehicle radar device in this embodiment will be briefly described.

発信器25は、変調器47からの変調信号に基づいて、二つの周波数f1,f2の信号を時間的に切換ながら、送信側アンプ26aを介して送信アンテナ11に送る。送信アンテナ11は、発信器25からの2種類の送信信号f1,f2に対応した2種類の高周波電波信号を出力する。自車両の前方物体5からの反射波は、各受信アンテナ12a,12bで受信され、各受信アンテナ12a,12bからの受信信号がミキサ28a,28bを介して和・差信号生成回路29に入力する。この和・差信号生成回路29は、二つの受信信号の和信号(sum)及び差信号(diff)を求めて、これをインタフェース回路31を介して信号処理回路41へ送る。和信号(sum)及び差信号(diff)は、信号処理回路41のA/D変換器44でディジタル信号に変換された後、FFT回路45で、周波数軸上で解析され、図9の下段に示すような周波数スペクトラムに変換される。計測演算部46では、例えば、和信号の周波数スペクトラムで、信号強度が最大となる位置の周波数から物体(ターゲット)の相対速度を求める。さらに、和信号の周波数スペクトラムで、送信周波数のそれぞれに対応するピーク信号を検出して、図9の上段に示すように、そのピーク信号の位相差から相対距離を求める。また、和信号と差信号との比率から、物体の方位角度を求める。   Based on the modulation signal from the modulator 47, the transmitter 25 sends the signals of the two frequencies f1 and f2 to the transmission antenna 11 via the transmission side amplifier 26a while temporally switching the signals. The transmission antenna 11 outputs two types of high-frequency radio signals corresponding to the two types of transmission signals f1 and f2 from the transmitter 25. The reflected waves from the front object 5 of the host vehicle are received by the receiving antennas 12a and 12b, and the received signals from the receiving antennas 12a and 12b are input to the sum / difference signal generation circuit 29 via the mixers 28a and 28b. . The sum / difference signal generation circuit 29 obtains the sum signal (sum) and difference signal (diff) of the two received signals and sends them to the signal processing circuit 41 via the interface circuit 31. The sum signal (sum) and difference signal (diff) are converted into digital signals by the A / D converter 44 of the signal processing circuit 41, and then analyzed on the frequency axis by the FFT circuit 45. It is converted into a frequency spectrum as shown. In the measurement calculation unit 46, for example, the relative speed of the object (target) is obtained from the frequency at the position where the signal intensity is maximum in the frequency spectrum of the sum signal. Further, a peak signal corresponding to each transmission frequency is detected from the frequency spectrum of the sum signal, and the relative distance is obtained from the phase difference between the peak signals as shown in the upper part of FIG. Further, the azimuth angle of the object is obtained from the ratio between the sum signal and the difference signal.

計測演算部46で求められた物体の相対距離等は、フィルタ回路54、伝送線73を構成する信号線73b、外部接続コネクタ70及び外部接続ケーブル85等を介して、車両制御装置や警報発生装置等の外部装置86に送られる。また、これらの外部装置86からは、動作開始指令や自車両速度等が、外部接続ケーブル85、外部接続コネクタ70、伝送線73を構成する信号線73b、フィルタ回路54等を介して、計測演算部46に入力する。また、車両電源87からの電力は、外部接続ケーブル85、外部接続コネクタ70、伝送線73を構成する電源線73a、フィルタ回路54を介して、電源回路51に入力する。   The relative distance or the like of the object obtained by the measurement calculation unit 46 is transmitted to the vehicle control device or the alarm generation device via the filter circuit 54, the signal line 73b constituting the transmission line 73, the external connection connector 70, the external connection cable 85, and the like. Or the like to the external device 86. Also, from these external devices 86, the operation start command, the own vehicle speed, etc. are measured and calculated via the external connection cable 85, the external connection connector 70, the signal line 73b constituting the transmission line 73, the filter circuit 54, and the like. Input to the unit 46. The electric power from the vehicle power supply 87 is input to the power supply circuit 51 via the external connection cable 85, the external connection connector 70, the power supply line 73 a constituting the transmission line 73, and the filter circuit 54.

外筐体60は、図2及び図3に示すように、ほぼ直方体形状で、一つの面に相当する箇所が開口69しており、そこから対抗面の方向に凹み、この凹んだ空間が収納室63を形成している。この外筐体60は、絶縁性を有する樹脂で形成されている外筐体本体61と、その内周面の全体に施されている導電性のシールド層62と、を有して構成されている。この外筐体60の外周壁の外周面には、外部接続コネクタ70が設けられ、外筐体60の底壁64の内周面には、内部回路接続コネクタ75が設けられ、外筐体60の底壁64には、呼吸弁吸気90が設けられている。外部接続コネクタ70のコネクタピン71と内部回路接続コネクタ75のコネクタピン76とは、伝送線73で接続されている。この伝送線73は、外部接続コネクタ70のコネクタピン71から、外筐体本体61の外周壁内を通り、さらに、外筐体本体61の底壁64を通って、内部回路接続コネクタ75のコネクタピン76に接続されている。なお、ここでは、外筐体本体61を絶縁性の樹脂で形成したが、これは、主として、伝送線73とシールド層62との間の絶縁を確保するためであるから、絶縁性を有する被覆材で伝送線73を覆う場合には、外筐体本体61は導線材で形成してもよい。したがって、外筐体60の全体を導電性を有する金属で形成し、その中に、被覆材で覆われた伝送線73を通すようにしてもよい。また、伝送線73は、外筐体本体61の外周面に沿って設けても、外筐体本体61の内周面に沿って設けてもよく、要は、施工性のよいルートに設けるとよい。   As shown in FIGS. 2 and 3, the outer casing 60 has a substantially rectangular parallelepiped shape, and a portion corresponding to one surface has an opening 69, which is recessed in the direction of the opposing surface, and this recessed space is stored. A chamber 63 is formed. The outer casing 60 includes an outer casing main body 61 formed of an insulating resin and a conductive shield layer 62 applied to the entire inner peripheral surface. Yes. An external connection connector 70 is provided on the outer peripheral surface of the outer peripheral wall of the outer casing 60, and an internal circuit connection connector 75 is provided on the inner peripheral surface of the bottom wall 64 of the outer casing 60. The bottom wall 64 is provided with a breathing valve intake 90. The connector pin 71 of the external connection connector 70 and the connector pin 76 of the internal circuit connection connector 75 are connected by a transmission line 73. The transmission line 73 passes from the connector pin 71 of the external connection connector 70 through the outer peripheral wall of the outer casing main body 61 and further through the bottom wall 64 of the outer casing main body 61 to the connector of the internal circuit connection connector 75. Connected to pin 76. Here, the outer casing main body 61 is formed of an insulating resin, but this is mainly for ensuring insulation between the transmission line 73 and the shield layer 62, and therefore has an insulating coating. When covering the transmission line 73 with a material, the outer casing main body 61 may be formed of a conductive wire material. Therefore, the entire outer casing 60 may be formed of a conductive metal, and the transmission line 73 covered with the covering material may be passed through the outer casing 60. Further, the transmission line 73 may be provided along the outer peripheral surface of the outer casing main body 61 or may be provided along the inner peripheral surface of the outer casing main body 61. Good.

呼吸弁90は、図7に示すように、貫通孔が形成されている弁本体91と、貫通孔内への塵や埃の侵入を抑えるために複数の微小通気孔が形成されている弁蓋92と、貫通孔の中間辺りに設けられている防水呼吸膜93と、を有して構成されている。防水呼吸膜93は、水分子よりも微細な多数の通気孔が形成されている膜、つまり空気を通すが水を通さない膜である。このため、外筐体60の内外圧力差が生じることはない。   As shown in FIG. 7, the breathing valve 90 includes a valve main body 91 in which a through hole is formed, and a valve lid in which a plurality of minute vent holes are formed in order to suppress dust and dust from entering the through hole. 92 and a waterproof breathing membrane 93 provided around the middle of the through hole. The waterproof breathing membrane 93 is a membrane in which a large number of air holes finer than water molecules are formed, that is, a membrane that allows air to pass but does not allow water to pass. For this reason, the internal-external pressure difference of the outer housing | casing 60 does not arise.

以上で説明した外筐体60の収納室63内に、図2〜図4に示すように、インタフェース基板30、信号処理回路基板40、電源回路基板50、これらの基板30,40,50を支える基板支持台80が収納されている。各基板30,40,50は、いずれも、導電材で形成されたGND電位層32,42,52と、このGND電位層32,42,52を両側から挟み込む二枚の絶縁層33a,33b,43a,43b,53a,53bと、絶縁層絶縁層33a,33b,43a,43b,53a,53b上に形成されている各種回路と、を有して構成されている。基板支持台80は、導電性を有する金属で形成され、外筐体60の底壁64の内周面上に置かれる支持プレート部81と、支持プレート部81のほぼ四隅に形成されている基板連結ロッド82,82,…と、支持プレート部81のほぼ中央に形成されている筒状のシールド部83と、を有している。支持プレート部81のほぼ中央は貫通しており、この貫通孔の内縁に沿って筒状のシールド部83が形成されている。各基板30,40,50には、基板連結ロッド82,82,…が貫通しており、基板相互間にスペーサ85が配されている。   As shown in FIGS. 2 to 4, the interface board 30, the signal processing circuit board 40, the power supply circuit board 50, and these boards 30, 40, 50 are supported in the storage chamber 63 of the outer casing 60 described above. A substrate support base 80 is accommodated. Each of the substrates 30, 40, 50 has a GND potential layer 32, 42, 52 made of a conductive material, and two insulating layers 33 a, 33 b, sandwiching the GND potential layers 32, 42, 52 from both sides, 43a, 43b, 53a, 53b and various circuits formed on the insulating layers 33a, 33b, 43a, 43b, 53a, 53b. The substrate support base 80 is formed of a conductive metal, and a support plate portion 81 placed on the inner peripheral surface of the bottom wall 64 of the outer housing 60 and a substrate formed at substantially four corners of the support plate portion 81. , And a cylindrical shield part 83 formed substantially at the center of the support plate part 81. A substantially central portion of the support plate portion 81 penetrates, and a cylindrical shield portion 83 is formed along the inner edge of the through hole. The substrate connecting rods 82, 82,... Pass through each of the substrates 30, 40, 50, and a spacer 85 is disposed between the substrates.

インタフェース基板30の絶縁層33a,33bには、前述したインタフェース回路31が形成され、信号処理回路基板40の絶縁層43a,43bには、信号処理回路41が形成され、電源回路基板50の絶縁層53a,53bには、電源回路51及びフィルタ回路54が形成されていと共に角速度センサ55が設けられている。フィルタ回路54は、図5に示すように、電源回路基板50の二枚の絶縁層53a,53bのうち、外筐体60の底壁64に対して遠い側の絶縁層53a上に形成されている。このフィルタ回路54からは、この絶縁層53a及びGND層52、さらにもう一方の絶縁層53bを貫通した伝送ピン78が設けられている。   The interface circuit 31 described above is formed on the insulating layers 33 a and 33 b of the interface substrate 30, the signal processing circuit 41 is formed on the insulating layers 43 a and 43 b of the signal processing circuit substrate 40, and the insulating layer of the power supply circuit substrate 50 is formed. In 53a and 53b, a power supply circuit 51 and a filter circuit 54 are formed, and an angular velocity sensor 55 is provided. As shown in FIG. 5, the filter circuit 54 is formed on the insulating layer 53 a far from the bottom wall 64 of the outer casing 60, of the two insulating layers 53 a and 53 b of the power circuit board 50. Yes. The filter circuit 54 is provided with a transmission pin 78 penetrating through the insulating layer 53a, the GND layer 52, and the other insulating layer 53b.

電源回路基板50、信号処理回路基板40及びインタフェース基板30が取り付けられた基板支持台80は、前述したように、外筐体60の収納室63内に収められる。この過程で、図4及び図5に示すように、外筐体60の内部回路接続コネクタ75のコネクタピン76に、電源回路基板50の伝送ピン78が、中継コネクタ77を介して接続される。この結果、外部接続コネクタ70のコネクタピン71と電源回路基板50の伝送ピン78とは、伝送線73、内部回路接続コネクタ75のコネクタピン76及び中継コネクタ77を介して接続される。このように、本実施形態では、回路基板50にコネクタとしての伝送ピン78を設け、外筐体60に内部回路接続コネクタ75を設けたので、回路基板50を外筐体60内に収める際に、簡単に、外筐体60を通ってきた伝送線73と回路基板50とを電気的に接続することができる。さらに、回路基板50にコネクタとしての伝送ピン78を設けたので、この回路基板50を外筐体60内に収納せずとも、この回路基板50を含む各回路の動作試験を間単に行うことができる。   The board support 80 to which the power circuit board 50, the signal processing circuit board 40, and the interface board 30 are attached is housed in the housing chamber 63 of the outer housing 60 as described above. In this process, as shown in FIGS. 4 and 5, the transmission pin 78 of the power circuit board 50 is connected to the connector pin 76 of the internal circuit connection connector 75 of the outer casing 60 via the relay connector 77. As a result, the connector pin 71 of the external connection connector 70 and the transmission pin 78 of the power supply circuit board 50 are connected via the transmission line 73, the connector pin 76 of the internal circuit connection connector 75, and the relay connector 77. As described above, in this embodiment, the transmission pins 78 as the connectors are provided on the circuit board 50 and the internal circuit connection connector 75 is provided on the outer casing 60, so that the circuit board 50 is accommodated in the outer casing 60. The transmission line 73 that has passed through the outer casing 60 and the circuit board 50 can be electrically connected easily. Further, since the circuit board 50 is provided with the transmission pin 78 as a connector, the operation test of each circuit including the circuit board 50 can be easily performed without storing the circuit board 50 in the outer casing 60. it can.

また、本実施形態では、外筐体60のシールド層62と電源回路基板50のGND層52との間に位置する伝送線、つまり、内部回路接続コネクタ75のコネクタピン76、中継コネクタ77、及び電源回路基板50の伝送ピン78の先端部は、その外周側が基板支持台80の筒状のシールド部83に覆われ、両端側がそれぞれ外筐体60のシールド層62、電源回路基板50のGND層52に覆われる。また、外部接続コネクタ70と内部回路接続コネクタ75との間の伝送線73は、前述したように、外筐体60のシールド層62の外周側に位置している。つまり、本実施形態では、外部接続コネクタ70と電源回路基板50とを接続する伝送線73,76,77,78は、全ての部分で、外筐体60のシールド層62や基板支持台80のシールド部83等により、各種回路との間を電磁気的に仕切られる。さらに、内部回路接続コネクタ75から電源回路基板50に伸びている伝送線76,77,78は、電源回路基板50のGND層52を貫通した直後に設けられているフィルタ回路54に接続される。したがって、外部接続コネクタ70から電源回路基板50までの間の伝送線から電磁ノイズが発生したとしても、この電磁ノイズは、外筐体のシールド層62や筒状のシールド部83等の導電体で遮蔽される上に、電源回路基板50のGND層52を伝送線が出た直後にフィルタ回路54が設けられているので、各種回路51,41,31に対する電磁ノイズの影響を抑えることができる。なお、ここでは、電源回路基板50のGND層52とシールド部83とは、両者の間に絶縁層53bが介在しているため、導電材相互間に隙間が存在するものの、この隙間、具体的には、絶縁層53bの厚さ分の隙間は、伝送線を通っている信号の波長の半分未満であるため、この隙間から電磁ノイズが漏れ出ることはない。また、本実施形態では、伝送線が電源回路基板50のGND層52を貫通した直後の位置にフィルタ回路54を設けたが、GND層52を貫通する直前の位置にフィルタ回路54を設けても同様の効果を得ることができる。ここで、GND層52を貫通した直後の位置、または貫通する直前の位置とは、GND層52とフィルタ回路54との間に、他の処理回路を存在させることなく、GND層52からの距離をできる限り短くした位置のことである。   In this embodiment, the transmission line located between the shield layer 62 of the outer casing 60 and the GND layer 52 of the power circuit board 50, that is, the connector pin 76 of the internal circuit connector 75, the relay connector 77, and The front end portion of the transmission pin 78 of the power supply circuit board 50 is covered with a cylindrical shield portion 83 of the board support base 80, and both end sides thereof are the shield layer 62 of the outer casing 60 and the GND layer of the power supply circuit board 50, respectively. 52. Further, the transmission line 73 between the external connection connector 70 and the internal circuit connection connector 75 is located on the outer peripheral side of the shield layer 62 of the outer casing 60 as described above. That is, in this embodiment, the transmission lines 73, 76, 77, 78 that connect the external connection connector 70 and the power supply circuit board 50 are at all portions of the shield layer 62 of the outer casing 60 and the board support base 80. Various circuits are electromagnetically partitioned by the shield portion 83 and the like. Further, the transmission lines 76, 77, 78 extending from the internal circuit connector 75 to the power circuit board 50 are connected to the filter circuit 54 provided immediately after passing through the GND layer 52 of the power circuit board 50. Therefore, even if electromagnetic noise is generated from the transmission line from the external connector 70 to the power supply circuit board 50, the electromagnetic noise is generated by a conductor such as the shield layer 62 of the outer casing or the cylindrical shield portion 83. In addition to being shielded, the filter circuit 54 is provided immediately after the transmission line goes out of the GND layer 52 of the power supply circuit board 50, so that the influence of electromagnetic noise on the various circuits 51, 41, and 31 can be suppressed. Here, since the insulating layer 53b is interposed between the GND layer 52 and the shield portion 83 of the power supply circuit board 50, there is a gap between the conductive materials. In addition, since the gap corresponding to the thickness of the insulating layer 53b is less than half the wavelength of the signal passing through the transmission line, electromagnetic noise does not leak from this gap. In the present embodiment, the filter circuit 54 is provided at a position immediately after the transmission line passes through the GND layer 52 of the power supply circuit board 50. However, the filter circuit 54 may be provided at a position immediately before passing through the GND layer 52. Similar effects can be obtained. Here, the position immediately after penetrating the GND layer 52 or the position immediately before penetrating is the distance from the GND layer 52 without any other processing circuit between the GND layer 52 and the filter circuit 54. It is a position that is made as short as possible.

また、本実施形態では、外筐体60のシールド層62の外周側を這わせる伝送線73の長さやそのルートを調整することで、外筐体60の任意の位置に外部接続コネクタ70を設けることができる。しかも、伝送線73は、シールド層62の外周側の外筐体本体61内を通っているので、外筐体60の収納室63がこの伝送線73により狭められることがなく、外筐体内60の収納室63を有効利用することができる。   Further, in the present embodiment, the external connection connector 70 is provided at an arbitrary position of the outer casing 60 by adjusting the length of the transmission line 73 and the route of the transmission line 73 that stretches the outer peripheral side of the shield layer 62 of the outer casing 60. be able to. In addition, since the transmission line 73 passes through the outer casing body 61 on the outer peripheral side of the shield layer 62, the storage chamber 63 of the outer casing 60 is not narrowed by the transmission line 73, and the inner casing 60. The storage chamber 63 can be used effectively.

外筐体60の開口69は、図7に示すように、アンテナ支持台23により塞がれる。このアンテナ支持台23は、収納室が形成されている支持台本体24aと、支持台本体24aの開口を塞ぐ蓋24bとを有して構成されている。支持台本体24a及び蓋24bは、いずれも導電性を有する金属で形成されている。支持台本体24aの収納室内には、高周波回路基板20が設けられている。この高周波回路基板20は、絶縁層22と、この絶縁層22上に形成されている前述の高周波回路21とを有している。この高周波回路21とインタフェース回路30や電源回路50等の他の回路とは、高周波回路21から伸びている貫通式コネクタピン79で電気的に接続されている。支持台本体24aの収納室の底壁に相当する部分の外周面には、送受信アンテナ11,12a,12bが設けられている。この送受信アンテナ11,12a,12bは、レドーム65により覆われる。このレドーム65は、Oリング68を介して、固定用プレート66及びネジ67により外筐体60に連結される。なお、このレドーム65は、電波透過時の電波減衰率が極めて小さい樹脂で形成されている。また、ここでは、アンテナ支持台23の全ての導電性を有する金属で形成したが、例えば、絶縁性を有する樹脂で基本的な形状を形成し、その外周を導電性を有する金属等で覆うようにしてもよい。   The opening 69 of the outer casing 60 is closed by the antenna support base 23 as shown in FIG. The antenna support base 23 includes a support base body 24a in which a storage chamber is formed, and a lid 24b that closes an opening of the support base body 24a. Both the support base body 24a and the lid 24b are made of a conductive metal. A high frequency circuit board 20 is provided in the storage chamber of the support base body 24a. The high-frequency circuit board 20 includes an insulating layer 22 and the above-described high-frequency circuit 21 formed on the insulating layer 22. The high-frequency circuit 21 and other circuits such as the interface circuit 30 and the power supply circuit 50 are electrically connected by through-type connector pins 79 extending from the high-frequency circuit 21. Transmitting and receiving antennas 11, 12a, 12b are provided on the outer peripheral surface of the portion corresponding to the bottom wall of the storage chamber of the support base body 24a. The transmitting / receiving antennas 11, 12 a and 12 b are covered with a radome 65. The radome 65 is connected to the outer housing 60 by a fixing plate 66 and screws 67 via an O-ring 68. The radome 65 is made of a resin that has a very small radio wave attenuation rate when radio waves are transmitted. Here, the antenna support base 23 is made of all conductive metal. However, for example, a basic shape is formed of an insulating resin, and the outer periphery thereof is covered with conductive metal or the like. It may be.

図4に示すように、導電性を有するアンテナ支持台23、インタフェース回路基板30のGND層32、信号処理回路基板40のGND層42、電源回路基板50のGND層52は、いずれも、導電性を有する外筐体60のシールド層62と、電気的に接続されている。具体的には、アンテナ支持台23は、図7に示すように、外筐体60の開口69の縁部のシールド層62と直接接することで、シールド層62と電気的に接続されている。また、インタフェース回路基板30のGND層32、信号処理回路基板40のGND層42、電源回路基板50のGND層52は、図4及び図6に示すように、基板支持台80の基板連結ロッド82に接し、この基板連結ロッド82が形成されている基板支持台80の支持プレート部81が外筐体60のシールド層62と接触することで、このシールド層62と電気的に接続されている。したがって、各回路基板30,40,50のGND層32,42,52は、いずれも同電位(GND電位)に成る。   As shown in FIG. 4, the conductive antenna support 23, the GND layer 32 of the interface circuit board 30, the GND layer 42 of the signal processing circuit board 40, and the GND layer 52 of the power circuit board 50 are all conductive. Is electrically connected to the shield layer 62 of the outer casing 60 having Specifically, as shown in FIG. 7, the antenna support base 23 is electrically connected to the shield layer 62 by directly contacting the shield layer 62 at the edge of the opening 69 of the outer housing 60. The GND layer 32 of the interface circuit board 30, the GND layer 42 of the signal processing circuit board 40, and the GND layer 52 of the power circuit board 50 are connected to the board connecting rod 82 of the board support base 80 as shown in FIGS. 4 and 6. In contact with the shield layer 62, the support plate portion 81 of the substrate support base 80 on which the substrate connecting rod 82 is formed contacts the shield layer 62 of the outer casing 60, thereby being electrically connected to the shield layer 62. Accordingly, the GND layers 32, 42, 52 of the circuit boards 30, 40, 50 all have the same potential (GND potential).

高周波の電波を発信する送信アンテナ11及び高周波の電波を受信する受信アンテナ12a,12bは、導電性を有するアンテナ支持台23で、他の回路21,31,41,51と電磁気的に遮断されているため、各回路に対して、これらのアンテナによる磁気的な影響を回避することができる。また、高周波回路21は、前述したように、導電性を有するアンテナ支持台23に覆われ、インタフェース回路基板30のGND層32とアンテナ支持台23との間の回路は、インタフェース回路基板30のGND層32とアンテナ支持台23と外筐体60のシールド層62とにより覆われ、インタフェース回路基板30のGND層32と信号処理回路基板40のGND層42との間の回路は、インタフェース回路基板30のGND層32と信号処理回路基板40のGND層42と外筐体60のシールド層62とにより覆われ、信号処理回路基板40のGND層42と電源回路基板50のGND層52との間の回路は、信号処理回路基板40のGND層42と電源回路基板50のGND層52と外筐体60のシールド層62とにより覆われているので、回路相互間での磁気的な影響を極めて効率よく且つ効果的に抑えることができる。   The transmitting antenna 11 for transmitting high-frequency radio waves and the receiving antennas 12a and 12b for receiving high-frequency radio waves are electromagnetically cut off from other circuits 21, 31, 41, 51 by an antenna support base 23 having conductivity. Therefore, the magnetic influence by these antennas can be avoided for each circuit. Further, as described above, the high frequency circuit 21 is covered with the antenna support base 23 having conductivity, and the circuit between the GND layer 32 of the interface circuit board 30 and the antenna support base 23 is connected to the GND of the interface circuit board 30. The circuit between the GND layer 32 of the interface circuit board 30 and the GND layer 42 of the signal processing circuit board 40 is covered with the layer 32, the antenna support base 23, and the shield layer 62 of the outer casing 60. The GND layer 32 of the signal processing circuit board 40, the GND layer 42 of the signal processing circuit board 40, and the shield layer 62 of the outer housing 60, and between the GND layer 42 of the signal processing circuit board 40 and the GND layer 52 of the power supply circuit board 50. The circuit is covered with a GND layer 42 of the signal processing circuit board 40, a GND layer 52 of the power circuit board 50, and a shield layer 62 of the outer casing 60. Runode, it is possible to suppress the magnetic influence between the circuit mutually very efficiently and effectively.

なお、以上の実施形態では、信号線と電源線を含めたものを伝送線として扱って、これを磁気シールドしているが、本発明はこれに限定されるものではなく、信号線のみ、また電源線のみを本実施形態と同様に、磁気シールドしてもよい。   In the above embodiment, the signal line and the power line including the power line are handled as the transmission line and this is magnetically shielded. However, the present invention is not limited to this, only the signal line, Only the power supply line may be magnetically shielded as in the present embodiment.

また、以上の実施形態では、外部接続部が外部接続コネクタである場合の例であるが、この外部接続コネクタを設けず、外部接続ケーブルを外部接続部として直接外筐体に設けた場合にも、このケーブルからの伝送線を本実施形態と同様に、磁気シールドするとよい。   In the above embodiment, the external connection portion is an example of an external connection connector. However, this external connection connector is not provided, and the external connection cable is provided as an external connection portion directly on the outer housing. The transmission line from this cable may be magnetically shielded as in this embodiment.

また、以上の実施形態は、本発明を車載用レーダ装置に適用したものであるが、本発明はこれに限定されるものではなく、信号や電力等の伝送対象を扱う車載装置であれば、いかなるものに、本発明を適用してもよく、例えば、カーナビゲーション装置、ETC(Electronic Toll Collection)装置等に適用してもよい。   Moreover, although the above embodiment applies this invention to a vehicle-mounted radar apparatus, this invention is not limited to this, If it is a vehicle-mounted apparatus which handles transmission objects, such as a signal and electric power, The present invention may be applied to any device, for example, a car navigation device, an ETC (Electronic Toll Collection) device, or the like.

本発明に係る一実施形態における車載用レーダ装置の回路ブロック図である。1 is a circuit block diagram of an in-vehicle radar device according to an embodiment of the present invention. 本発明に係る一実施形態における車載用レーダ装置の分解断面図である。1 is an exploded cross-sectional view of an in-vehicle radar device according to an embodiment of the present invention. 本発明に係る一実施形態における車載用レーダ装置の分解斜視図である。It is a disassembled perspective view of the vehicle-mounted radar apparatus in one Embodiment which concerns on this invention. 本発明に係る一実施形態における車載用レーダ装置の導電材相互の接続を示す説明図である。It is explanatory drawing which shows the connection of the electrically-conductive materials of the vehicle-mounted radar apparatus in one Embodiment which concerns on this invention. 本発明に係る一実施形態における電源回路基板と伝送線との接続を示す説明図である。It is explanatory drawing which shows the connection of the power circuit board and transmission line in one Embodiment which concerns on this invention. 本発明に係る一実施形態における電源回路基板及び基板支持台を外筐体内に収納した際の断面図である。It is sectional drawing at the time of accommodating the power supply circuit board and board | substrate support stand in one Embodiment which concerns on this invention in an outer housing | casing. 本発明に係る一実施形態における車載用レーダ装置の断面図(内部の回路を省略)である。It is sectional drawing (an internal circuit is abbreviate | omitted) of the vehicle-mounted radar apparatus in one Embodiment which concerns on this invention. 本発明に係る一実施形態における車載用レーダ装置の取付け位置を示す説明図である。It is explanatory drawing which shows the attachment position of the vehicle-mounted radar apparatus in one Embodiment which concerns on this invention. 本発明に係る一実施形態における車載用レーダ装置による距離計測及び速度計測の原理を示す説明図である。It is explanatory drawing which shows the principle of the distance measurement and speed measurement by the vehicle-mounted radar apparatus in one Embodiment which concerns on this invention.

符号の説明Explanation of symbols

1…車載用レーダ装置、2…自車両、5…物体、11…送信アンテナ、12a,12b…受信アンテナ、20…高周波回路基板、21…高周波回路、22,33a,33b,43a,43b,53a,53b…絶縁層、30…インタフェース回路基板、31…インタフェース回路、32,42,52…GND層(基板の導電層)、40…信号処理回路基板、41…信号処理回路、50…電源回路基板(内部回路基板)、51…電源回路、54…フィルタ回路(ノイズ除去手段)、60…外筐体、61…外筐体本体、62…シールド層、70…外部接続コネクタ(外部接続部)、73…伝送線、75…内部回路コネクタ、77…中継コネクタ、80…基板支持台、83…シールド部、85…外部接続ケーブル。
DESCRIPTION OF SYMBOLS 1 ... Vehicle-mounted radar apparatus, 2 ... Own vehicle, 5 ... Object, 11 ... Transmission antenna, 12a, 12b ... Reception antenna, 20 ... High frequency circuit board, 21 ... High frequency circuit, 22, 33a, 33b, 43a, 43b, 53a , 53b ... insulating layer, 30 ... interface circuit board, 31 ... interface circuit, 32, 42, 52 ... GND layer (conductive layer of the board), 40 ... signal processing circuit board, 41 ... signal processing circuit, 50 ... power circuit board (Internal circuit board), 51 ... power supply circuit, 54 ... filter circuit (noise removing means), 60 ... outer casing, 61 ... outer casing main body, 62 ... shield layer, 70 ... external connection connector (external connection section), 73 ... Transmission line, 75 ... Internal circuit connector, 77 ... Relay connector, 80 ... Board support, 83 ... Shield part, 85 ... External connection cable.

Claims (9)

車両に搭載され、信号及び/又は電力を含む伝送対象を外部との間で受信及び/又は送信する車載用信号処理装置において、
前記伝送対象が入力する、及び/又は前記伝送対象を出力する内部回路と、
前記内部回路を覆い、内周側に導電性を有するシールド層が施されている外筐体と、
前記外部との間で前記伝送対象を送受信するため、前記外筐体に取り付けられ且つ該外筐体の外側に臨んでいる外部接続部と、
前記内部回路と前記外部接続部とを電気的に接続する伝送線と、
を備え、
前記伝送線は、前記外部接続部を基点として、前記外筐体の外周面と前記シールド層との間を、該外筐体の内周面が広がっている方向又は該外筐体の外周面が広がっている方向に伸びてから、該シールド層を貫通して、前記内部回路に接続されている、
ことを特徴とする車載用信号処理装置。
In an in-vehicle signal processing apparatus that is mounted on a vehicle and receives and / or transmits a transmission target including a signal and / or electric power with the outside,
An internal circuit for inputting the transmission target and / or outputting the transmission target;
An outer housing that covers the internal circuit and is provided with a conductive shield layer on the inner periphery side;
In order to send and receive the transmission object to and from the outside, an external connection part attached to the outer case and facing the outside of the outer case,
A transmission line for electrically connecting the internal circuit and the external connection part;
With
The transmission line has a direction in which the inner peripheral surface of the outer casing spreads between the outer peripheral surface of the outer casing and the shield layer, or the outer peripheral surface of the outer casing, starting from the external connection portion. Is extended in the direction in which it extends, penetrates through the shield layer, and is connected to the internal circuit,
An in-vehicle signal processing device characterized by the above.
請求項1に記載の車載用信号処理装置において、
前記内部回路を有する内部回路基板と、
前記外筐体内に配され、前記内部回路基板を支える基板支持台と、
を備え、
前記基板支持台は、前記伝送線による前記シールド層の貫通位置と前記内部回路基板との間の該伝送線の外周を覆い、且つ導電材で形成された筒状のシールド部を有し、
前記内部回路基板は、前記筒状のシールド部に接触して、前記筒状のシールド部の端部開口を塞ぎ、
前記内部回路基板は、導電層と前記伝送線を通ってきたノイズを除去するノイズ除去手段とを有し、該ノイズ除去手段は、前記シールド層からの前記伝送線が前記導電層を貫通する直前又は直後の位置に設けられている、
ことを特徴とする車載用信号処理装置。
The in-vehicle signal processing device according to claim 1,
An internal circuit board having the internal circuit;
A board support that is arranged in the outer casing and supports the internal circuit board;
With
The substrate support has a cylindrical shield portion that covers an outer periphery of the transmission line between the penetration position of the shield layer by the transmission line and the internal circuit board, and is formed of a conductive material,
The internal circuit board is in contact with the cylindrical shield portion and closes an end opening of the cylindrical shield portion;
The internal circuit board has a conductive layer and noise removing means for removing noise that has passed through the transmission line, and the noise removing means is immediately before the transmission line from the shield layer penetrates the conductive layer. Or provided immediately after,
An in-vehicle signal processing device characterized by the above.
車両に搭載され、信号及び/又は電力を含む伝送対象を外部との間で受信及び/又は送信する車載用信号処理装置において、
前記伝送対象が入力する、及び/又は前記伝送対象を出力する内部回路を有する内部回路基板と、
前記内部回路基板を支える基板支持台と、
前記内部回路基板及び前記基板支持台を覆い、内周側に導電性を有するシールド層が施されている外筐体と、
前記外部との間で前記伝送対象を送受信するため、前記シールド層を外周側から内周側へ貫通して、前記内部回路と電気的に接続されている伝送線と、
を備え、
前記基板支持台は、前記伝送線による前記シールド層の貫通位置と前記内部回路基板との間の該伝送線の外周を覆い、且つ導電材で形成された筒状のシールド部を有し、
前記内部回路基板は、前記筒状のシールド部に接触して、前記筒状のシールド部の端部開口を塞ぎ、
前記内部回路基板は、導電層と前記伝送線を通ってきたノイズを除去するノイズ除去手段とを有し、該ノイズ除去手段は、前記シールド層からの前記伝送線が前記導電層を貫通する直前又は直後の位置に設けられている、
ことを特徴とする車載用信号処理装置。
In an in-vehicle signal processing apparatus that is mounted on a vehicle and receives and / or transmits a transmission target including a signal and / or electric power with the outside,
An internal circuit board having an internal circuit for inputting and / or outputting the transmission object;
A board support for supporting the internal circuit board;
An outer casing that covers the internal circuit board and the board support, and is provided with a conductive shield layer on the inner periphery;
In order to send and receive the transmission object to and from the outside, a transmission line that penetrates the shield layer from the outer peripheral side to the inner peripheral side and is electrically connected to the internal circuit,
With
The substrate support has a cylindrical shield portion that covers an outer periphery of the transmission line between the penetration position of the shield layer by the transmission line and the internal circuit board, and is formed of a conductive material,
The internal circuit board is in contact with the cylindrical shield portion and closes an end opening of the cylindrical shield portion;
The internal circuit board has a conductive layer and noise removing means for removing noise that has passed through the transmission line, and the noise removing means is immediately before the transmission line from the shield layer penetrates the conductive layer. Or provided immediately after,
An in-vehicle signal processing device characterized by the above.
請求項2及び3のいずれか一項に記載の車載用信号処理装置において、
前記内部回路基板の前記導電層は、前記内部回路のグランド層を成し、前記外筐体の前記シールド層と電気的に接続されている、
ことを特徴とする車載用信号処理装置。
The in-vehicle signal processing device according to any one of claims 2 and 3,
The conductive layer of the internal circuit board forms a ground layer of the internal circuit and is electrically connected to the shield layer of the outer casing.
An in-vehicle signal processing device characterized by the above.
請求項2から4のいずれか一項に記載の車載用信号処理装置において、
前記内部回路基板の前記導電層と、前記基板支持台の前記シールド部とは、隙間なく接触しているか、又は、隙間があっても、使用する信号の波長の半分未満の長さである、
ことを特徴とする車載用信号処理装置。
The in-vehicle signal processing device according to any one of claims 2 to 4,
The conductive layer of the internal circuit board and the shield part of the substrate support are in contact with no gap, or even if there is a gap, the length is less than half the wavelength of the signal to be used.
An in-vehicle signal processing device characterized by the above.
請求項2から5のいずれか一項に記載の車載用信号処理装置において、
前記筒状のシールド部内には、伝送線相互を接続するコネクタが少なくとも1つ設けられている、
ことを特徴とする車載用信号処理装置。
In the vehicle signal processing apparatus according to any one of claims 2 to 5,
In the cylindrical shield portion, at least one connector for connecting transmission lines to each other is provided.
An in-vehicle signal processing device characterized by the above.
請求項2から6のいずれか一項に記載の車載用信号処理装置において、
前記外筐体には、外周側から内周側へ貫通した貫通部分が形成され、
塵や埃の浸入を阻む大きさの多数の孔が形成されている塵浸入抑止手段と、水分子の浸入を阻む大きさの多数の微小孔が形成されている水浸入抑止手段と、を備えた呼吸弁が、前記貫通部分に設けられている、
ことを特徴とする車載用信号処理装置。
The in-vehicle signal processing device according to any one of claims 2 to 6,
The outer casing is formed with a penetrating portion penetrating from the outer peripheral side to the inner peripheral side,
Dust intrusion deterring means in which a large number of holes are formed to prevent dust and dust from entering, and water intrusion deterring means in which a large number of minute holes are formed to prevent water molecules from entering. A breathing valve is provided in the penetrating portion,
An in-vehicle signal processing device characterized by the above.
請求項2から7のいずれか一項に記載の車載用信号処理装置と、
電波を発する送信アンテナと、
電波を受信する受信アンテナと、
前記送信アンテナに送信信号を送り、前記受信アンテナから受信信号を受信する高周波回路と、
前記高周波回路との間で信号又は電力を送信及び/又は受信する高周波関連回路を有する高周波関連回路基板と、
前記高周波回路を覆い、前記送信アンテナ及び前記受信アンテナを外周面に搭載し、前記高周波関連回路基板と該高周波回路と該送信アンテナ及び該受信アンテナとをそれぞれ電磁気的に遮蔽すべく、導電性材を有して形成されているアンテナ支持台と、
を備えていることを特徴とする車載用レーダ装置。
The in-vehicle signal processing device according to any one of claims 2 to 7,
A transmitting antenna that emits radio waves,
A receiving antenna for receiving radio waves,
A high-frequency circuit that transmits a transmission signal to the transmission antenna and receives a reception signal from the reception antenna;
A high frequency related circuit board having a high frequency related circuit for transmitting and / or receiving a signal or power to and from the high frequency circuit;
Covering the high-frequency circuit, mounting the transmission antenna and the reception antenna on the outer peripheral surface, and electrically conductive material to electromagnetically shield the high-frequency related circuit board, the high-frequency circuit, the transmission antenna and the reception antenna, respectively. An antenna support formed with
An on-vehicle radar device comprising:
請求項8に記載の車載用レーダ装置において、
前記高周波関連回路基板は、前記内部回路基板としての回路基板と他の回路基板とを有し、
前記他の回路基板は、グランド層としての導電層を有し、
前記内部回路基板の導電層と前記他の回路基板の導電層との間に存在する回路は、該内部回路基板の導電層と該他の回路の導電層と前記外筐体の前記シールド層とにより覆われ、
前記他の回路基板の導電層と前記アンテナ支持台との間に存在する回路は、該他の回路基板の導電層と該アンテナ支持台と前記外筐体の前記シールド層とにより覆われ、
前記アンテナ支持台の前記導電性材と前記他の回路基板の導電層と前記内部回路基板の導電層とは、電気的に接続されている、
ことを特徴とする車載用レーダ装置。
The in-vehicle radar device according to claim 8,
The high-frequency related circuit board has a circuit board as the internal circuit board and another circuit board,
The other circuit board has a conductive layer as a ground layer,
The circuit existing between the conductive layer of the internal circuit board and the conductive layer of the other circuit board includes a conductive layer of the internal circuit board, a conductive layer of the other circuit, and the shield layer of the outer casing. Covered by
The circuit existing between the conductive layer of the other circuit board and the antenna support base is covered with the conductive layer of the other circuit board, the antenna support base, and the shield layer of the outer casing,
The conductive material of the antenna support base, the conductive layer of the other circuit board, and the conductive layer of the internal circuit board are electrically connected.
An on-vehicle radar device.
JP2005301589A 2005-10-17 2005-10-17 In-vehicle electric wave type radar installation and its manufacturing method Pending JP2006053159A (en)

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KR101750113B1 (en) 2015-06-12 2017-06-22 주식회사 만도 Radar apparatus for vehicles

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