JPH0570002U - Microwave converter - Google Patents
Microwave converterInfo
- Publication number
- JPH0570002U JPH0570002U JP994892U JP994892U JPH0570002U JP H0570002 U JPH0570002 U JP H0570002U JP 994892 U JP994892 U JP 994892U JP 994892 U JP994892 U JP 994892U JP H0570002 U JPH0570002 U JP H0570002U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- primary radiator
- circuit boards
- signal
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Waveguide Connection Structure (AREA)
- Noise Elimination (AREA)
Abstract
(57)【要約】
【目的】 コストを抑えて小型化が可能なマイクロ波コ
ンバータを提供すること。
【構成】 回路基板１２、１３の非部品実装面に設けら
れた接地導体１２ａ，１３ａが対向接触するように組み
合わせて、導波管よりなる一次放射器１１に形成された
凹部110 に挿入配置して固定する。また、接地導体１２
ａ，１３ａを一次放射器１１に導通接続する。さらに、
凹部110 の開口をシールド板１４にて覆う。
【効果】 回路基板１２，１３の間は、接地導体１２
ａ，１３ａにより遮蔽されるので、回路基板１２、１３
の遮蔽構造を簡略化することができ、形状を小型にする
ことができると共に、コストを低減することができる。
さらに、組立作業の手間を省くことができる。
(57) [Abstract] [Purpose] To provide a microwave converter that can be miniaturized at low cost. [Structure] The ground conductors 12a and 13a provided on the non-component mounting surfaces of the circuit boards 12 and 13 are combined so as to face each other, and the ground conductors 12a and 13a are inserted and arranged in a recess 110 formed in a primary radiator 11 made of a waveguide. To fix. In addition, the ground conductor 12
a and 13a are electrically connected to the primary radiator 11. further,
The shield plate 14 covers the opening of the recess 110. [Effect] The ground conductor 12 is provided between the circuit boards 12 and 13.
a, 13a so that the circuit boards 12, 13 are shielded.
The shielding structure can be simplified, the shape can be reduced, and the cost can be reduced.
Furthermore, the labor of assembly work can be saved.
Description
【０００１】[0001]
本考案は、衛星放送等の受信用に用いるマイクロ波コンバ−タの改良に関する ものである。 The present invention relates to an improvement of a microwave converter used for receiving satellite broadcasting and the like.
【０００２】[0002]
近年、衛生放送の受信が盛んに行われるようになり、受信用アンテナに設けら れるマイクロ波コンバ−タが重要な装置として知られている。図２はこの種の従 来のマイクロ波コンバ−タの一例を示す分解斜視図である。 図において、１は導波管よりなる一次放射器で、略直方体形状の外形を有し、 電磁波を入射する開口端の周囲には固定用のフランジ１ａが形成されている。ま た、一次放射器１の上面及び両側面のそれぞれには、回路基板を収納する凹部１ ｂ〜１ｄが形成され、各凹部１ｂ〜１ｄ内には、信号処理回路が形成された回路 基板２〜４が固定されている。これらの回路基板２〜４は、信号処理回路が一次 放射器１から絶縁された状態で固定され、回路基板２には高周波増幅回路及びミ キサ回路が形成され、回路基板３には局部発振回路が、また回路基板４には中間 周波増幅回路がそれぞれ形成されている。 In recent years, reception of sanitary broadcasting has become popular, and a microwave converter provided in a receiving antenna is known as an important device. FIG. 2 is an exploded perspective view showing an example of a conventional microwave converter of this type. In the figure, reference numeral 1 denotes a primary radiator composed of a waveguide, and has a substantially rectangular parallelepiped outer shape, and a fixing flange 1a is formed around the opening end where electromagnetic waves are incident. Moreover, recesses 1b to 1d for accommodating a circuit board are formed on the upper surface and both side surfaces of the primary radiator 1, and a circuit board 2 on which a signal processing circuit is formed is formed in each of the recesses 1b to 1d. ~ 4 is fixed. These circuit boards 2 to 4 are fixed in a state where the signal processing circuit is insulated from the primary radiator 1, a high frequency amplifier circuit and a mixer circuit are formed on the circuit board 2, and a local oscillation circuit is formed on the circuit board 3. However, an intermediate frequency amplifier circuit is formed on the circuit board 4, respectively.
【０００３】 また、一次放射器１及び回路基板２〜４は、一端が開口された直方体形状のシ −ルドケ−ス５の中に挿入され、シ−ルドケ−ス５の開口部５ａの周囲に一次放 射器１のフランジ１ａがねじにより固定される。これにより各凹部１ｂ〜１ｄの 開口はシールドケース５によって覆われ、各凹部１ｂ〜１ｄ内の回路基板２〜４ が遮蔽される。The primary radiator 1 and the circuit boards 2 to 4 are inserted into a rectangular parallelepiped shield case 5 having an opening at one end, and are surrounded by an opening 5 a of the shield case 5. The flange 1a of the primary radiator 1 is fixed with a screw. As a result, the openings of the recesses 1b to 1d are covered by the shield case 5, and the circuit boards 2 to 4 in the recesses 1b to 1d are shielded.
【０００４】 前述の構成よりなるマイクロ波コンバ−タによれば、一次放射器１によって受 信されたマイクロ波はプロ−ブピン６を介して高周波増幅回路に入力される。高 周波増幅回路に入力されたマイクロ波信号は増幅された後、ミキサ回路に入力さ れ、ミキサ回路において局部発振回路から出力される信号と混合されて、中間周 波数の信号に変換される。この中間周波信号は中間周波増幅回路で増幅された後 、一次放射器１の後端部に設けられたコネクタ（図示せず）を介して図示せぬチ ュ−ナ等の外部装置に出力される。これにより、衛星放送の信号は、伝送及び信 号処理を行い易い周波数の信号に変換される。According to the microwave converter configured as described above, the microwave received by the primary radiator 1 is input to the high frequency amplifier circuit via the probe pin 6. The microwave signal input to the high-frequency amplifier circuit is amplified, then input to the mixer circuit, mixed with the signal output from the local oscillation circuit in the mixer circuit, and converted into an intermediate frequency signal. This intermediate frequency signal is amplified by an intermediate frequency amplifier circuit and then output to an external device such as a tuner (not shown) via a connector (not shown) provided at the rear end of the primary radiator 1. It As a result, the satellite broadcast signal is converted into a signal of a frequency that facilitates transmission and signal processing.
【０００５】[0005]
しかしながら、前述した従来例においては、装置の小型化を図るために各回路 を分断し、複数枚の回路基板とし、これら複数枚の回路基板のそれぞれを一次放 射器１の凹部１ｂ〜１ｄ内に配置し、遮蔽しているので、一次放射器１の構造が 複雑となり、コストが増加してしまうという問題点があった。 However, in the above-mentioned conventional example, in order to miniaturize the device, each circuit is divided into a plurality of circuit boards, and each of the plurality of circuit boards is placed in the recesses 1b to 1d of the primary radiator 1. Since the first radiator 1 is arranged in the above position and is shielded, the structure of the primary radiator 1 is complicated and the cost is increased.
【０００６】 本考案の目的は上記の問題点に鑑み、コストを抑えて小型化が可能なマイクロ 波コンバータを提供することにある。In view of the above problems, it is an object of the present invention to provide a microwave converter that can be reduced in size and cost.
【０００７】[0007]
本考案は上記の目的を達成するために、導波管よりなる一次放射器を備え、非 部品実装面が接地導体により形成され、信号処理回路を構成する複数枚の回路基 板のそれぞれを遮蔽し、前記一次放射器の外面に沿って配設してなるマイクロ波 コンバ−タにおいて、少なくとも２枚の前記回路基板の非部品実装面を対向させ て配置したマイクロ波コンバ−タを提案する。 In order to achieve the above object, the present invention is provided with a primary radiator composed of a waveguide, and a non-component mounting surface is formed by a ground conductor, and shields each of a plurality of circuit boards that constitute a signal processing circuit. Then, in the microwave converter arranged along the outer surface of the primary radiator, there is proposed a microwave converter in which at least two non-component mounting surfaces of the circuit boards are arranged to face each other.
【０００８】[0008]
本考案によれば、少なくとも２枚の回路基板の非部品実装面が対向して配置さ れ、これらの回路基板は、例えば一次放射器を構成する金属によって遮蔽される 。また、前記対向して配置された回路基板の間は、前記非部品実装面に形成され た接地導体により遮蔽される。 According to the present invention, the non-component mounting surfaces of at least two circuit boards are arranged to face each other, and these circuit boards are shielded by, for example, the metal forming the primary radiator. In addition, a space between the circuit boards arranged opposite to each other is shielded by a ground conductor formed on the non-component mounting surface.
【０００９】[0009]
以下、図面に基づいて本考案の実施例を説明する。 図１は本考案の第１の実施例を示す分解斜視図、図３は第１の実施例の正面断 面図である。図において、１１は導波管よりなる一次放射器で、略直方体形状の 外形を有し、その前面には電磁波を入射する開口１１ａが形成され、上面には所 定深さの矩形状の凹部110 が形成されている。この凹部110 には回路基板１２， １３が挿入配置され、凹部110 の内周に形成された段部111 にネジ止め等によっ て固定されている。ここで、回路基板１２には高周波増幅回路、ミキサ回路及び 局部発振回路が形成され、回路基板１３には中間周波増幅回路がそれぞれ形成さ れている。また、これらの回路基板１２，１３の非部品実装面には全面に接地導 体１２ａ，１３ａが設けられ、回路基板１２，１３は接地導体１２ａ，１３ａが 対向接触した状態に組み合わされて凹部110 内に収納されている。図においては 回路基板１２の接地導体１２ａが上面となり、回路基板１３の接地導体１３ａが 下面となっている。さらに、各回路基板１２，１３の接地導体１２ａ，１３ａは 一次放射器１１に導通接続されている。 An embodiment of the present invention will be described below with reference to the drawings. 1 is an exploded perspective view showing a first embodiment of the present invention, and FIG. 3 is a front sectional view of the first embodiment. In the figure, reference numeral 11 denotes a primary radiator composed of a waveguide, which has a substantially rectangular parallelepiped outer shape, an opening 11a through which an electromagnetic wave is incident is formed on the front surface thereof, and a rectangular recess having a predetermined depth is formed on the upper surface thereof. 110 are formed. The circuit boards 12 and 13 are inserted and arranged in the recess 110, and are fixed to the step 111 formed on the inner periphery of the recess 110 by screwing or the like. Here, a high-frequency amplifier circuit, a mixer circuit, and a local oscillator circuit are formed on the circuit board 12, and an intermediate-frequency amplifier circuit is formed on the circuit board 13. Ground conductors 12a and 13a are provided on the entire non-component mounting surfaces of the circuit boards 12 and 13, and the circuit boards 12 and 13 are combined in a state where the ground conductors 12a and 13a are in contact with each other to form a recess 110. It is stored inside. In the figure, the ground conductor 12a of the circuit board 12 is the upper surface, and the ground conductor 13a of the circuit board 13 is the lower surface. Further, the ground conductors 12a and 13a of the circuit boards 12 and 13 are conductively connected to the primary radiator 11.
【００１０】 一方、凹部110 の上面はシールド板１４によって覆われ、シールド板１４はネ ジ等によって一次放射器１１に固定され、シールド板１４と一次放射器１１との 間にはパッキン（図示せず）等が介在され防滴構造とされている。On the other hand, the upper surface of the recess 110 is covered with a shield plate 14, the shield plate 14 is fixed to the primary radiator 11 with a screw or the like, and a packing (not shown) is provided between the shield plate 14 and the primary radiator 11. It is a drip-proof structure.
【００１１】 また、一次放射器１１の上面にはプロ−ブピン１５が突出され、高周波増幅回 路のフロントエンドに接続されている。さらに、一次放射器１１の背面にはコネ クタ１６ａが設けられた背面板１６が装着されており、コネクタ１６ａを介して 、中間周波増幅回路からの出力信号が外部装置に出力できるようになっている。A probe pin 15 is projected on the upper surface of the primary radiator 11 and is connected to the front end of the high frequency amplification circuit. Further, a rear plate 16 provided with a connector 16a is mounted on the rear surface of the primary radiator 11 so that the output signal from the intermediate frequency amplifier circuit can be output to an external device via the connector 16a. There is.
【００１２】 前述の構成よりなるマイクロ波コンバ−タによれば、一次放射器１１によって 受信されたマイクロ波はプロ−ブピン１５を介して高周波増幅回路に入力される 。高周波増幅回路に入力されたマイクロ波信号は増幅された後、ミキサ回路に入 力され、ミキサ回路において局部発振回路から出力される信号と混合されて、中 間周波数の信号に変換される。この中間周波信号は中間周波増幅回路で増幅され た後、コネクタ１６ａを介して図示せぬチュ−ナ等の外部装置に出力される。こ れにより、衛星放送の信号は、伝送及び信号処理を行い易い周波数の信号に変換 される。According to the microwave converter configured as described above, the microwave received by the primary radiator 11 is input to the high frequency amplifier circuit via the probe pin 15. The microwave signal input to the high-frequency amplifier circuit is amplified, then input to the mixer circuit, mixed with the signal output from the local oscillation circuit in the mixer circuit, and converted into a signal of intermediate frequency. The intermediate frequency signal is amplified by the intermediate frequency amplifier circuit and then output to an external device such as a tuner (not shown) via the connector 16a. As a result, the satellite broadcast signal is converted into a signal of a frequency that facilitates transmission and signal processing.
【００１３】 また、前述したマイクロ波コンバ−タの構造によれば、２枚の回路基板１２， １３の接地導体１２ａ，１３ａが設けられた非部品実装面を対向接触させて組み 合わせて凹部110 内に挿入配置しているので、従来に比べて一次放射器１１の金 型構造が簡略化され、コストを低減することができると共に、組み付け作業の手 間を省くことができる。さらに、２枚の回路基板１２，１３間は接地導体１２ａ ，１３ａによって遮蔽されるので、処理信号周波数の異なる信号処理回路間、即 ち回路基板１２，１３間での電磁波を介しての信号の回り込み等を防止すること ができる。さらにまた、回路基板１２，１３を一次放射器１１の周囲に配置して いるので、全体の形状を小型に形成することができる。Further, according to the structure of the microwave converter described above, the recesses 110 are formed by bringing the non-component mounting surfaces of the two circuit boards 12 and 13 provided with the ground conductors 12a and 13a into contact with each other so as to face each other. Since the primary radiator 11 is inserted and arranged in the inside, the mold structure of the primary radiator 11 is simplified, the cost can be reduced, and the assembling work can be omitted. Further, the two circuit boards 12 and 13 are shielded by the ground conductors 12a and 13a, so that the signal is transmitted between the signal processing circuits having different processing signal frequencies or the electromagnetic waves between the circuit boards 12 and 13 immediately. It is possible to prevent wraparound. Furthermore, since the circuit boards 12 and 13 are arranged around the primary radiator 11, the overall shape can be made small.
【００１４】 次に、本考案の第２の実施例を説明する。 図４は第２の実施例を示す分解斜視図、図５は第２の実施例の側面断面図であ る。図において、２１は導波管よりなる一次放射器で、略直方体形状の外形を有 し、その前面２１ａに電磁波を入射する開口（図示せず）が形成されると共に、 上面後部及び背面にはそれぞれ所定深さの矩形状の凹部210,220 が形成され、凹 部210 の後端部と凹部220 の上部は所定面積の開口230 によって連通されている 。Next, a second embodiment of the present invention will be described. FIG. 4 is an exploded perspective view showing the second embodiment, and FIG. 5 is a side sectional view of the second embodiment. In the figure, reference numeral 21 denotes a primary radiator composed of a waveguide, which has a substantially rectangular parallelepiped outer shape, an opening (not shown) for incident electromagnetic waves is formed on the front surface 21a thereof, and the upper surface rear portion and the rear surface are formed. Rectangular recesses 210 and 220 each having a predetermined depth are formed, and the rear end of the recess 210 and the upper portion of the recess 220 are connected by an opening 230 having a predetermined area.
【００１５】 凹部210 には、回路基板２２が、また凹部220 には回路基板２３，２４がそれ ぞれ挿入配置され、各凹部210,220 の内周に形成された段部211,221 にネジ止め 等によって固定されている。ここで、回路基板２２には高周波増幅回路が形成さ れ、回路基板２３にはミキサ回路及び局部発振回路が、また回路基板２４には中 間周波増幅回路がそれぞれ形成されている。また、これらの回路基板２２，２３ ，２４の非部品実装面には全面に接地導体２２ａ，２３ａ，２４ａが設けられ、 回路基板２３，２４は、第１の実施例と同様に接地導体２３ａ，２４ａが対向接 触した状態に組み合わされて凹部220 内に収納されている。さらに、各回路基板 ２２，２３，２４の接地導体２２ａ，２３ａ，２４ａは一次放射器２１に導通接 続されている。また、回路基板２２に形成された高周波増幅回路及びミキサ回路 と回路基板２４に形成された中間周波増幅回路との間は開口230 を介して電気的 に接続され、接続線の周囲には図示せぬ誘電体が充填されている。The circuit board 22 is inserted into the recess 210, and the circuit boards 23 and 24 are inserted into the recess 220, respectively, and fixed to the step portions 211 and 221 formed on the inner circumference of the recesses 210 and 220 by screwing or the like. Has been done. Here, a high frequency amplifier circuit is formed on the circuit board 22, a mixer circuit and a local oscillator circuit are formed on the circuit board 23, and an intermediate frequency amplifier circuit is formed on the circuit board 24. Further, ground conductors 22a, 23a, 24a are provided on the entire non-component mounting surfaces of these circuit boards 22, 23, 24, and the circuit boards 23, 24 are similar to the first embodiment. 24a are combined in a state of being in contact with each other and housed in the recess 220. Further, the ground conductors 22a, 23a, 24a of the circuit boards 22, 23, 24 are electrically connected to the primary radiator 21. Further, the high frequency amplifier circuit and the mixer circuit formed on the circuit board 22 and the intermediate frequency amplifier circuit formed on the circuit board 24 are electrically connected to each other through the opening 230, and are not shown around the connection line. Filled with dielectric material.
【００１６】 また、一次放射器２１の後部上面にはプロ−ブピン２５が突出され、高周波増 幅回路のフロントエンドに接続されている。さらに、一次放射器２１の後部上面 から背面にかけて、コネクタ２６ａが設けられた略Ｌ字形状のシールド板２６が 装着されており、コネクタ２６ａを介して、中間周波増幅回路からの出力信号が 外部装置に出力できるようになっている。さらに、シールド板２６と一次放射器 ２１との間にはパッキン（図示せず）等が介在され防滴構造とされている。A probe pin 25 projects from the upper surface of the rear portion of the primary radiator 21 and is connected to the front end of the high frequency amplification circuit. Further, a substantially L-shaped shield plate 26 provided with a connector 26a is mounted from the rear upper surface to the rear surface of the primary radiator 21, and the output signal from the intermediate frequency amplifier circuit is transmitted via the connector 26a to an external device. Can be output to. Further, a packing (not shown) or the like is interposed between the shield plate 26 and the primary radiator 21 to form a drip-proof structure.
【００１７】 前述の構成よりなるマイクロ波コンバ−タによれば、一次放射器２によって受 信されたマイクロ波はプロ−ブピン２５を介して高周波増幅回路に入力される。 高周波増幅回路に入力されたマイクロ波信号は増幅された後、ミキサ回路に入力 され、ミキサ回路において局部発振回路から出力される信号と混合されて、中間 周波数の信号に変換される。この中間周波信号は中間周波増幅回路で増幅された 後、コネクタを介して図示せぬチュ−ナ等の外部装置に出力される。これにより 、衛星放送の信号は、伝送及び信号処理を行い易い周波数の信号に変換される。According to the microwave converter having the above-mentioned configuration, the microwave received by the primary radiator 2 is input to the high frequency amplifier circuit via the probe pin 25. The microwave signal input to the high-frequency amplifier circuit is amplified, then input to the mixer circuit, mixed with the signal output from the local oscillator circuit in the mixer circuit, and converted into an intermediate frequency signal. This intermediate frequency signal is amplified by an intermediate frequency amplifier circuit and then output to an external device such as a tuner (not shown) via a connector. As a result, the satellite broadcast signal is converted into a signal having a frequency that facilitates transmission and signal processing.
【００１８】 また、前述したマイクロ波コンバ−タの構造によれば、２枚の回路基板２３， ２４の接地導体２３ａ，２４ａが設けられた非部品実装面を対向接触させて組み 合わせて凹部220 内に挿入配置しているので、従来に比べて一次放射器２１の金 型構造が簡略化され、コストを低減することができると共に、組み付け作業の手 間を省くことができる。さらに、２枚の回路基板２３，２４間は接地導体２３ａ ，２４ａによって遮蔽されるので、処理信号周波数の異なる信号処理回路間、即 ち回路基板２３，２４間での電磁波を介しての信号の回り込み等を防止すること ができる。さらにまた、回路基板２２〜２４を一次放射器１１の周囲に配置して いるので、全体の形状を小型に形成することができる。Further, according to the structure of the microwave converter described above, the recesses 220 are formed by combining the non-component mounting surfaces of the two circuit boards 23 and 24 provided with the ground conductors 23a and 24a so as to face each other. Since the primary radiator 21 is inserted and arranged in the inside, the die structure of the primary radiator 21 can be simplified, the cost can be reduced, and the assembling work can be omitted. Further, the two circuit boards 23 and 24 are shielded by the grounding conductors 23a and 24a, so that the signal is transmitted between the signal processing circuits having different processing signal frequencies and the electromagnetic waves between the circuit boards 23 and 24 immediately. It is possible to prevent wraparound. Furthermore, since the circuit boards 22 to 24 are arranged around the primary radiator 11, the overall shape can be made small.
【００１９】 尚、前述した各部の形状は一例であり、これに限定されないことは言うまでも ないことである。例えば、一次放射器として略円筒状のものを用いてもほぼ同様 に構成することができ、同様の効果を得ることができる。Needless to say, the shapes of the above-mentioned parts are merely examples, and the present invention is not limited to these. For example, even if a substantially cylindrical primary radiator is used, the primary radiator can have substantially the same configuration and the same effect can be obtained.
【００２０】 また、各回路基板における信号処理回路の組み合わせにおいても、本実施例に 限定されることはない。Further, the combination of signal processing circuits on each circuit board is not limited to this embodiment.
【００２１】[0021]
以上説明したように本考案によれば、少なくとも２枚の回路基板の非部品実装 面が対向して配置され、これらの回路基板は、例えば一次放射器を構成する金属 によって遮蔽されると共に、前記対向して配置された回路基板の間は、前記非部 品実装面に形成された接地導体により遮蔽されるので、前記回路基板の遮蔽構造 を簡略化することができ、形状を小型にすることができると共に、コストを低減 することができる。さらに、組立作業の手間を省くことができるという優れた効 果を奏するものである。 As described above, according to the present invention, the non-component mounting surfaces of at least two circuit boards are arranged to face each other, and these circuit boards are shielded by, for example, the metal forming the primary radiator, and Since the grounding conductor formed on the non-component mounting surface shields between the circuit boards arranged facing each other, the shielding structure of the circuit board can be simplified and the shape can be made small. The cost can be reduced as well. Further, it has an excellent effect that the labor of assembling work can be saved.
【図１】本考案の第１の実施例を示す分解斜視図FIG. 1 is an exploded perspective view showing a first embodiment of the present invention.
【図２】従来例を示す分解斜視図FIG. 2 is an exploded perspective view showing a conventional example.
【図３】本考案の第１の実施例の正面断面図FIG. 3 is a front sectional view of the first embodiment of the present invention.
【図４】本考案の第２の実施例を示す分解斜視図FIG. 4 is an exploded perspective view showing a second embodiment of the present invention.
【図５】本考案の第２の実施例の側面断面図FIG. 5 is a side sectional view of a second embodiment of the present invention.
１１，２１…一次放射器、110,210,221 …凹部、111,21
1,221 …段部、１２，１３，２２，２３，２４…回路基
板、１２ａ，１３ａ，２２ａ，２３ａ，２４ａ…接地導
体、１４…シールド板、１５，２５…プローブピン、１
６…背面板、１６ａ，２６ａ…コネクタ、２６…シール
ド板。11, 21 ... Primary radiator, 110, 210, 221 ... Recessed portion, 111, 21
1,221 ... Step portion, 12, 13, 22, 23, 24 ... Circuit board, 12a, 13a, 22a, 23a, 24a ... Ground conductor, 14 ... Shield plate, 15, 25 ... Probe pin, 1
6 ... Rear plate, 16a, 26a ... Connector, 26 ... Shield plate.
Claims (1)
品実装面が接地導体により形成され、信号処理回路を構
成する複数枚の回路基板のそれぞれを遮蔽し、前記一次
放射器の外面に沿って配設してなるマイクロ波コンバ−
タにおいて、 少なくとも２枚の前記回路基板の非部品実装面を対向さ
せて配置した、 ことを特徴とするマイクロ波コンバ−タ。1. A primary radiator comprising a waveguide, a non-component mounting surface of which is formed of a ground conductor to shield each of a plurality of circuit boards constituting a signal processing circuit, and an outer surface of the primary radiator. Microwave converter arranged along the
In the microwave converter, at least two non-component mounting surfaces of the circuit boards are arranged to face each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP994892U JPH0570002U (en) | 1992-02-28 | 1992-02-28 | Microwave converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP994892U JPH0570002U (en) | 1992-02-28 | 1992-02-28 | Microwave converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0570002U true JPH0570002U (en) | 1993-09-21 |
Family
ID=11734209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP994892U Withdrawn JPH0570002U (en) | 1992-02-28 | 1992-02-28 | Microwave converter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0570002U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006053159A (en) * | 2005-10-17 | 2006-02-23 | Hitachi Ltd | In-vehicle electric wave type radar installation and its manufacturing method |
| JP2006094547A (en) * | 2005-10-17 | 2006-04-06 | Hitachi Ltd | Vehicle-mounted signal processing apparatus and vehicle-mounted radar installation |
-
1992
- 1992-02-28 JP JP994892U patent/JPH0570002U/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006053159A (en) * | 2005-10-17 | 2006-02-23 | Hitachi Ltd | In-vehicle electric wave type radar installation and its manufacturing method |
| JP2006094547A (en) * | 2005-10-17 | 2006-04-06 | Hitachi Ltd | Vehicle-mounted signal processing apparatus and vehicle-mounted radar installation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19960606 |