JP2006041296A5 - - Google Patents

Claims (5)

  A base member formed by coating a thin metal plate with an insulating material to form a ceramic film, a conductive pattern electrode formed on the ceramic film, an electronic device mounted on the base member and connected to the conductive pattern electrode, and A lid member that seals the electronic device by disposing the electronic device on the base member, and the metal thin plate is selected from a metal material having a thermal expansion coefficient substantially the same as the thermal expansion coefficient of the electronic device; A thin metal package in which a peripheral portion of the lid member is integrally joined to the periphery of the base member and hermetically sealed.   The lid member has a frame-like protrusion at the peripheral part, and is joined to the peripheral part of the base member by interposition of sealing metallization to form a cavity space, and the electronic device is accommodated in the cavity space. The thin metal package according to claim 1, wherein:   2. The electronic device according to claim 1, wherein the electronic device is sandwiched between the base member and the lid member, and is hermetically sealed by bonding with a low melting point sealing member disposed in a peripheral portion of each member. Thin metal package as described.   4. The thin metal package according to claim 1, wherein the metal thin plate is a stainless steel (SUS) material having a thermal expansion coefficient of 15 to 18 ppm / ° C., and the electronic device is a crystal piece. 5. The thin film according to claim 4, wherein the ceramic film is formed using at least one selected from an insulating material group consisting of Al ₂ O ₃ , SiO ₂ , SiC, TiO ₂ , TiC, and forsterite. Metal package.