JP2006032415A - Mount structure and network structure of solid-state electrolytic capacitor on printed circuit board - Google Patents

Mount structure and network structure of solid-state electrolytic capacitor on printed circuit board Download PDF

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JP2006032415A
JP2006032415A JP2004204812A JP2004204812A JP2006032415A JP 2006032415 A JP2006032415 A JP 2006032415A JP 2004204812 A JP2004204812 A JP 2004204812A JP 2004204812 A JP2004204812 A JP 2004204812A JP 2006032415 A JP2006032415 A JP 2006032415A
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hole
wiring board
chip body
printed wiring
capacitor element
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JP4502732B2 (en
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Takeshi Sawano
健 澤野
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Rohm Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide the mount structure of a solid-state electrolytic capacitor on a printed circuit board 5 by means of a reduced space so as to attain downsizing and weight reduction. <P>SOLUTION: In the mount structure of the solid-state electrolytic capacitor onto the printed circuit board, a capacitor element 1 comprises a chip 2 made of valve action metallic powder, an anode rod 3 projected from one end face of the chip, and a cathode film 4 formed on the surface of the chip. A thickness T0 in a direction at a right angle to the axial line of the anode rod is made almost equal to or less than a plate thickness T of the printed circuit board, a cutout hole 10 is cut in the printed circuit board 5 in a way that through-holes 8, 9 provided to be electrically conductive to a pair of wiring patterns 6, 7 on the surface of the printed circuit board 5 are exposed in the cutout hole 10, and the capacitor element is loaded into the cutout hole so that the anode rod and the cathode film are electrically connected to the through-holes. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、タンタル等の弁作用金属を使用した固体電解コンデンサを、プリント配線基板に対して実装する場合における構造と、前記固体電解コンデンサの複数個をプリント配線基板に実装して成るネットワーク構造とに関するものである。   The present invention provides a structure in which a solid electrolytic capacitor using a valve action metal such as tantalum is mounted on a printed wiring board, and a network structure in which a plurality of the solid electrolytic capacitors are mounted on the printed wiring board. It is about.

従来、この種の固体電解コンデンサには、例えば、特許文献１に記載されているように、そのコンデンサ素子に対する陽極リード端子及び陰極リード端子を、前記コンデンサ素子を密封するパッケージ体の左右両端面から突出したのち、前記パッケージ体の下面側に折り曲げて、この折り曲げた部分を、プリント配線基板に対して半田付けするように構成したものと、例えば、特許文献２に記載されているように、コンデンサ素子を密封するパッケージ体の下面又は左右両端面に、前記コンデンサ素子に対する陽極側端子電極膜と、陰極側端子電極膜とを形成して、これら両端電極膜を、プリント配線基板に対して半田付けするように構成したものとがある。
特開平５−３２６３４１号公報 特開平６−２６０３７３号公報 Conventionally, in this type of solid electrolytic capacitor, for example, as described in Patent Document 1, an anode lead terminal and a cathode lead terminal for the capacitor element are provided from both left and right end surfaces of a package body that seals the capacitor element. After projecting, it is bent to the lower surface side of the package body, and the bent portion is soldered to the printed wiring board. For example, as disclosed in Patent Document 2, An anode-side terminal electrode film and a cathode-side terminal electrode film for the capacitor element are formed on the lower surface or both left and right end surfaces of the package body that seals the element, and these both-end electrode films are soldered to the printed wiring board. There is something that is configured to do.
JP-A-5-326341 JP-A-6-260373

しかし、これらの固体電解コンデンサは、いずれも、プリント配線基板に対して半田付けにて実装したときにおいて、前記プリント配線基板の表面から、少なくとも、そのパッケージ体の高さ寸法だけ突出した形態になるから、大型化及び重量のアップを招来するという問題があった。   However, when these solid electrolytic capacitors are all mounted on the printed wiring board by soldering, the solid electrolytic capacitors protrude from the surface of the printed wiring board by at least the height dimension of the package body. Therefore, there has been a problem of increasing the size and weight.

本発明は、この問題を解消できるようにした固体電解コンデンサのプリント配線基板への実装構造を提供することを技術的課題とするものである。   It is a technical object of the present invention to provide a structure for mounting a solid electrolytic capacitor on a printed wiring board that can solve this problem.

これに加えて、本発明は、前記固体電解コンデンサの複数個をプリント配線基板に互いに電気的に接続した状態で実装して成るネットワーク構造を提供することを技術的課題とするものである。   In addition, an object of the present invention is to provide a network structure in which a plurality of the solid electrolytic capacitors are mounted in a state of being electrically connected to a printed wiring board.

この技術的課題を達成するため本発明の実装構造は、請求項１に記載したように、
「弁作用金属粉末によるチップ体及びこのチップ体の一端面から突出する陽極棒並びに前記チップ体の表面に形成した陰極膜にて構成されるコンデンサ素子と、表面に少なくとも一対の配線パターンを形成して成るプリント配線基板とから成り、前記コンデンサ素子におけるチップ体を、その一端面から突出する陽極棒の軸線と直角方向の厚さ寸法を前記プリント配線基板における板厚さと略等しくするかこの板厚さ以下に薄くした扁平な形状にする一方、前記プリント配線基板には、抜き孔を、前記一対の配線パターンの各々に電気的に導通するように設けたスルーホールが当該抜き孔内に露出するように穿設し、この抜き孔内に、前記コンデンサ素子を、その陽極棒及び陰極膜が前記各スルーホールに電気的に接続するように装填する。」
ことを特徴としている。 In order to achieve this technical problem, the mounting structure of the present invention is as described in claim 1.
“At least a pair of wiring patterns is formed on the surface of a capacitor element composed of a chip body made of valve metal powder, an anode rod protruding from one end surface of the chip body, and a cathode film formed on the surface of the chip body. The chip body of the capacitor element is made to have a thickness dimension in a direction perpendicular to the axis of the anode rod protruding from one end surface thereof, or substantially equal to the plate thickness of the printed wiring board. On the other hand, the printed wiring board has a through hole in which a through hole provided so as to be electrically connected to each of the pair of wiring patterns is exposed. The capacitor element is loaded in the hole so that the anode rod and the cathode membrane are electrically connected to the through holes.
It is characterized by that.

また、本発明の実装構造は、請求項２に記載したように、
「弁作用金属粉末によるチップ体及びこのチップ体の一端面から突出する陽極棒並びに前記チップ体の表面に形成した陰極膜にて構成されるコンデンサ素子と、表面に少なくとも一対の配線パターンを形成して成るプリント配線基板とから成り、前記コンデンサ素子におけるチップ体を、その一端面から突出する陽極棒の軸線と直角方向の厚さ寸法を前記プリント配線基板における板厚さと略等しくするかこの板厚さ以下に薄くした扁平な形状にする一方、前記プリント配線基板には、当該プリント配線基板の側面から入り込むように構成した抜き孔を、前記一対の配線パターンのうち一方の配線パターンに電気的に導通するように設けたスルーホールが当該抜き孔内に露出するように穿設し、この抜き孔内に、前記コンデンサ素子を、その陽極棒又は陰極膜が前記スルーホールに電気的に接続するように装填し、更に、前記プリント配線基板の側面に、前記一対の配線パターンのうち他方の配線パターンと前記コンデンサ素子における陰極膜又は陽極棒とを電気的に接続する導体膜を形成する。」
ことを特徴としている。 The mounting structure of the present invention is as described in claim 2.
“At least a pair of wiring patterns is formed on the surface of a capacitor element composed of a chip body made of valve metal powder, an anode rod protruding from one end surface of the chip body, and a cathode film formed on the surface of the chip body. The chip body of the capacitor element is made to have a thickness dimension in a direction perpendicular to the axis of the anode rod protruding from one end surface thereof, or substantially equal to the plate thickness of the printed wiring board. On the other hand, the printed wiring board has a hole formed so as to enter from the side surface of the printed wiring board. A through hole provided so as to be conductive is formed so as to be exposed in the hole, and the capacitor element is inserted into the hole. A pole rod or a cathode film is loaded so as to be electrically connected to the through hole, and the other wiring pattern of the pair of wiring patterns and the cathode film or anode in the capacitor element are further provided on the side surface of the printed wiring board. A conductor film is formed to electrically connect the rod. "
It is characterized by that.

そして、本発明のネットワーク構造は、請求項３に記載したように、
「弁作用金属粉末によるチップ体及びこのチップ体の一端面から突出する陽極棒並びに前記チップ体の表面に形成した陰極膜にて構成されるコンデンサ素子の複数個と、表面に少なくとも一対の配線パターンを形成して成るプリント配線基板とから成り、前記各コンデンサ素子におけるチップ体を、その一端面から突出する陽極棒の軸線と直角方向の厚さ寸法を前記プリント配線基板における板厚さと略等しくするかこの板厚さ以下に薄くした扁平な形状にする一方、前記プリント配線基板に、前記コンデンサ素子と同数個の抜き孔を、前記一対の配線パターンの各々に電気的に導通するように設けたスルーホールが当該抜き孔内に露出するように穿設し、この各抜き孔内に、前記各コンデンサ素子を、その陽極棒及び陰極膜が前記各スルーホールに電気的に接続するように装填する。」
ことを特徴としている。 And the network structure of this invention is as described in Claim 3,
“A plurality of capacitor elements composed of a chip body made of valve-acting metal powder, an anode rod protruding from one end face of the chip body, and a cathode film formed on the surface of the chip body, and at least a pair of wiring patterns on the surface The chip body of each capacitor element is made to have a thickness dimension in a direction perpendicular to the axis of the anode rod protruding from one end face thereof substantially equal to the plate thickness of the printed wiring board. The printed circuit board is provided with the same number of holes as the capacitor elements so as to be electrically connected to each of the pair of wiring patterns. A through hole is formed so as to be exposed in the through hole. In each of the through holes, the capacitor elements are disposed, and the anode rod and the cathode film are formed in the through holes. Loaded so as to be electrically connected to Lumpur. "
It is characterized by that.

また、本発明のネットワーク構造は、請求項４に記載したように、
「弁作用金属粉末によるチップ体及びこのチップ体の一端面から突出する陽極棒並びに前記チップ体の表面に形成した陰極膜にて構成されるコンデンサ素子の複数個と、表面に少なくとも一対の配線パターンを形成して成るプリント配線基板とから成り、前記各コンデンサ素子におけるチップ体を、その一端面から突出する陽極棒の軸線と直角方向の厚さ寸法を前記プリント配線基板における板厚さと略等しくするかこの板厚さ以下に薄くした扁平な形状にする一方、前記プリント配線基板に、前記コンデンサ素子と同数個の抜き孔を、前記一対の配線パターンのうち一方の配線パターンに電気的に導通するように設けたスルーホールが当該抜き孔内に露出するように穿設し、この各抜き孔内に、前記各コンデンサ素子を、その陽極棒又は陰極膜が前記スルーホールに電気的に接続するように装填し、更に、前記プリント配線基板における側面に、前記一対の配線パターンのうち他方の配線パターンと前記各コンデンサ素子における陰極膜又は陽極棒とを電気的に接続する導体膜を形成する。」
ことを特徴としている。 The network structure of the present invention is as described in claim 4.
“A plurality of capacitor elements composed of a chip body made of valve-acting metal powder, an anode rod protruding from one end face of the chip body, and a cathode film formed on the surface of the chip body, and at least a pair of wiring patterns on the surface The chip body of each capacitor element is made to have a thickness dimension in a direction perpendicular to the axis of the anode rod protruding from one end face thereof substantially equal to the plate thickness of the printed wiring board. While the flat shape is made thinner than this plate thickness, the same number of holes as the capacitor elements are electrically connected to one of the pair of wiring patterns in the printed wiring board. The through holes provided in this way are drilled so as to be exposed in the holes, and the capacitor elements are inserted into the holes or the anode rods or the shadows. The film is loaded so as to be electrically connected to the through hole, and the other wiring pattern of the pair of wiring patterns and the cathode film or the anode rod of each capacitor element are provided on the side surface of the printed wiring board. Form a conductive film that is electrically connected. "
It is characterized by that.

前記したように、前記コンデンサ素子におけるチップ体を、その一端面から突出する陽極棒の軸線と直角方向の厚さ寸法を前記プリント配線基板における板厚さと略等しくするかこの板厚さ以下に薄くした扁平な形状にし、このコンデンサ素子を、する一方、前記プリント配線基板に穿設した抜き孔、又は当該プリント配線基板の側面から入り込むように穿設した抜き孔内に装填したことにより、固体電解コンデンサにおけるコンデンサ素子を、プリント配線基板に対して、当該プリント配線基板における板厚さ内に埋設するようにして実装でき、従って、前記プリント配線基板の表裏両面から突出しないように実装できるから、この分だけ小型化を図ることができるとともに、軽量化を図ることができる。   As described above, the thickness of the chip body of the capacitor element in the direction perpendicular to the axis of the anode rod protruding from one end surface thereof is made substantially equal to or less than the plate thickness of the printed wiring board. The capacitor element is formed into a flat shape, and on the other hand, it is loaded into a hole formed in the printed wiring board or a hole formed so as to enter from the side surface of the printed wiring board. The capacitor element in the capacitor can be mounted on the printed wiring board so as to be embedded within the thickness of the printed wiring board, and thus can be mounted so as not to protrude from the front and back surfaces of the printed wiring board. It is possible to reduce the size as much as possible, and to reduce the weight.

一方、前記コンデンサ素子における陽極棒及び陰極膜のうちいずれか一方と、プリント配線基板の表面における配線パターンとの電気的接続を、前記プリント配線基板に設けたスルーホールにより行うものであることにより、その電気的接続が、スペースの増大を招来することなく、至極簡単に且つ確実にできる。   On the other hand, by making an electrical connection between any one of the anode rod and the cathode film in the capacitor element and the wiring pattern on the surface of the printed wiring board through a through hole provided in the printed wiring board, The electrical connection can be made very simply and reliably without incurring an increase in space.

この場合、請求項２に記載した構成にすることにより、コンデンサ素子における陽極棒及び陰極膜の両方をプリント配線基板の表面における配線パターンに対して電気的に接続することを、プリント配線基板に設けたスルーホールによって、スペースの増大を招来することなく、至極簡単に且つ確実にできる。   In this case, according to the configuration described in claim 2, it is provided on the printed wiring board that both the anode rod and the cathode film in the capacitor element are electrically connected to the wiring pattern on the surface of the printed wiring board. The through-holes can be made very easily and reliably without incurring an increase in space.

また、請求項３に記載した構成にすることにより、コンデンサ素子における陽極棒及び陰極膜の両方をプリント配線基板の表面における配線パターンに対して電気的に接続することを、プリント配線基板に設けたスルーホール及びプリント配線基板の側面に形成した導体膜によって、同様に、スペースの増大を招来することなく、至極簡単に且つ確実にできる。   According to the configuration described in claim 3, the printed wiring board is provided such that both the anode rod and the cathode film in the capacitor element are electrically connected to the wiring pattern on the surface of the printed wiring board. Similarly, the conductor film formed on the through-hole and the side surface of the printed wiring board can be extremely easily and reliably without causing an increase in space.

そして、請求項４の記載によると、一枚のプリント配線基板に対して複数個のコンデンサ素子を備えたネットワーク構造を、前記プリント配線基板の表裏両面から前記各コンデンサ素子が突出しない形態、つまり、小型・軽量の形態にして提供することができる。   And according to the description of claim 4, the network structure provided with a plurality of capacitor elements for one printed wiring board, the form in which each capacitor element does not protrude from the front and back surfaces of the printed wiring board, It can be provided in a small and lightweight form.

以下、本発明の実施の形態を図面について説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１〜図６は、第１の実施の形態を示す。   1 to 6 show a first embodiment.

この第１の実施の形態において、コンデンサ素子１は、タンタル等の弁作用金属粉末を多孔質に固めて焼結して成るチップ体２と、このチップ体２における一端面２′から突出する陽極棒４と、前記チップ体２における表面に形成した陰極膜４とによって構成されている。   In the first embodiment, the capacitor element 1 includes a chip body 2 formed by solidifying and sintering a valve action metal powder such as tantalum and the like, and an anode protruding from one end face 2 ′ of the chip body 2. The rod 4 is constituted by a cathode film 4 formed on the surface of the chip body 2.

また、この第１の実施の形態において、プリント配線基板５は、適宜厚さＴにしたガラスエポキシ樹脂製（心材となるガラス繊維をエポキシ樹脂にて固めて成る）であり、その表面には、金属製による一対の配線パターン６，７が形成され、更に、このプリント配線基板５には、前記両配線パターン６，７の各々に電気的に導通するスルーホール８，９が設けられている。   Further, in the first embodiment, the printed wiring board 5 is made of a glass epoxy resin having an appropriate thickness T (glass fiber as a core material is solidified with an epoxy resin), and on the surface thereof, A pair of wiring patterns 6 and 7 made of metal are formed, and the printed wiring board 5 is provided with through holes 8 and 9 which are electrically connected to the wiring patterns 6 and 7, respectively.

前記コンデンサ素子１を、そのチップ体２のうちその一端面２′から突出する陽極棒３の軸線と直角方向の厚さ寸法Ｔ０を前記プリント配線基板５における板厚さＴと略等しくするかこの板厚さＴ以下に薄くすることによって、扁平な矩形体形状にする。   Whether the capacitor element 1 has a thickness dimension T0 in a direction perpendicular to the axis of the anode rod 3 projecting from one end face 2 'of the chip body 2 substantially equal to the plate thickness T of the printed wiring board 5. By making the plate thickness T or less, a flat rectangular body is formed.

一方、前記プリント配線基板５には、前記コンデンサ素子１が嵌めることができる矩形の抜き孔１０を穿設する。   On the other hand, the printed wiring board 5 is provided with a rectangular hole 10 into which the capacitor element 1 can be fitted.

この抜き孔１０の穿設に際しては、この抜き孔１０内に、前記両スルーホール８，９が露出するように構成する。   When the hole 10 is formed, both the through holes 8 and 9 are exposed in the hole 10.

そして、前記プリント配線基板５における抜き孔１０内に、前記コンデンサ素子１を挿入し、このコンデンサ素子１をプリント配線基板５に対して、当該コンデンサ素子1 の外周面と抜き孔１０の内周面との間に充填した接着剤又は樹脂剤により固着する。   The capacitor element 1 is inserted into the hole 10 in the printed circuit board 5, and the capacitor element 1 is connected to the printed circuit board 5 with respect to the outer peripheral surface of the capacitor element 1 and the inner peripheral surface of the hole 10. It adheres with the adhesive agent or resin agent with which it was filled.

前記コンデンサ素子１のプリント配線基板５における抜き孔１０への固着に際しては、当該コンデンサ素子１における陽極棒３を、前記抜き孔１０内に露出する両スルーホール８，９のうち一方のスルーホール８に対して、導電性ペースト又は半田付け等により電気的に接続する一方、当該コンデンサ素子１における陰極膜４を、他方のスルーホール９に対して、導電性ペースト又は半田付け等により電気的に接続する。   When the capacitor element 1 is fixed to the hole 10 in the printed wiring board 5, the anode rod 3 in the capacitor element 1 is exposed to one of the through holes 8, 9 exposed in the hole 10. In contrast, the cathode film 4 in the capacitor element 1 is electrically connected to the other through-hole 9 by conductive paste or soldering or the like. To do.

なお、前記プリント配線基板５における表裏両面は、絶縁材による被覆コート層１１，１２が、前記配線パターン６，７を覆うように形成されており、この被覆コート層１１，１２にて、前記コンデンサ素子１における表裏両面を同時に被覆するように構成したり、或いは、前記コンデンサ素子１における表裏両面を、前記被覆コート層１１，１２とは別に絶縁コートで被覆するように構成しても良い。   Note that the front and back surfaces of the printed wiring board 5 are formed so that the coating layers 11 and 12 made of an insulating material cover the wiring patterns 6 and 7, and the capacitor layers 11 and 12 form the capacitor. The front and back surfaces of the element 1 may be covered simultaneously, or the front and back surfaces of the capacitor element 1 may be covered with an insulating coat separately from the coating coat layers 11 and 12.

このように構成することにより、固体電解コンデンサにおけるコンデンサ素子１を、プリント配線基板５に対して、当該プリント配線基板５における板厚さＴ内に埋設するようにして実装することができる。   With this configuration, the capacitor element 1 in the solid electrolytic capacitor can be mounted on the printed wiring board 5 so as to be embedded in the plate thickness T of the printed wiring board 5.

次に、図７、図８及び図９は、第２の実施の形態を示す。   Next, FIGS. 7, 8 and 9 show a second embodiment.

この第２の実施の形態は、上面に一対の配線パターン６ａ，７ａを形成したプリント配線基板５ａに、抜き孔１０ａを、前記プリント配線基板５ａにおける側面５ａ′から入り込む溝型の形態にし、且つ、当該抜き孔１０ａ内に一方の配線パターン６ａにおけるスルーホール８ａを露出するようにして穿設し、この抜き孔１０ａ内に、前記したように扁平状に構成したコンデンサ素子１を挿入して、このコンデンサ素子１をプリント配線基板５ａに対して、当該コンデンサ素子1 の外周面と抜き孔１０ａの内周面との間に充填した接着剤又は樹脂剤により固着するとともに、このコンデンサ素子１における陽極棒３を、前記抜き孔１０ａ内に露出するスルーホール８ａに対して、導電性ペースト又は半田付け等により電気的に接続する一方、前記プリント配線基板５ａにおける側面５ａ′に、導体膜１３を形成することにより、この導体膜１３によって、前記コンデンサ層１における陰極膜４を、前記プリント配線基板５ａの表面における他方の配線パターン７ａに電気的に接続するように構成したものである。   In the second embodiment, the printed wiring board 5a having a pair of wiring patterns 6a and 7a formed on the upper surface is formed into a groove-type configuration in which the punch hole 10a enters from the side surface 5a 'of the printed wiring board 5a, and The through hole 8a in one wiring pattern 6a is exposed in the hole 10a, and the capacitor element 1 having a flat shape as described above is inserted into the hole 10a. The capacitor element 1 is fixed to the printed wiring board 5a with an adhesive or a resin agent filled between the outer peripheral surface of the capacitor element 1 and the inner peripheral surface of the punch hole 10a. While electrically connecting the rod 3 to the through hole 8a exposed in the punch hole 10a by conductive paste or soldering, By forming the conductor film 13 on the side surface 5a 'of the printed wiring board 5a, the conductor film 13 causes the cathode film 4 in the capacitor layer 1 to be formed on the other wiring pattern 7a on the surface of the printed wiring board 5a. It is configured to be electrically connected.

このように構成することによっても、前記第１の実施の形態と同様に、固体電解コンデンサにおけるコンデンサ素子１を、プリント配線基板５ａに対して、当該プリント配線基板５ａにおける板厚さＴ内に埋設するようにして実装することができる。   Also with this configuration, as in the first embodiment, the capacitor element 1 in the solid electrolytic capacitor is embedded in the thickness T of the printed wiring board 5a with respect to the printed wiring board 5a. Can be implemented in this way.

この第２の実施の形態の場合においても、そのプリント配線基板５ａの表裏両面には、絶縁材による被覆コート層１１ａ，１２ａが形成されているほか、前記導体膜１３も、絶縁材によるコート層で被覆されている。   Also in the case of the second embodiment, coating layers 11a and 12a made of an insulating material are formed on both front and back surfaces of the printed wiring board 5a, and the conductor film 13 is also a coating layer made of an insulating material. It is covered with.

なお、この第２の実施の形態においては、前記コンデンサ素子１における陰極膜４を、抜き孔１０ａ内に露出するスルーホール８ａに対して電気的に接続する一方、前記コンデンサ素子１における陽極棒３を、前記プリント配線基板５ａの側面５ａ′に形成した導体膜１３を介して他方の配線パターン７ａに電気的に接続するように構成することもできる。   In the second embodiment, the cathode film 4 in the capacitor element 1 is electrically connected to the through hole 8a exposed in the hole 10a, while the anode rod 3 in the capacitor element 1 is connected. Can be electrically connected to the other wiring pattern 7a via the conductor film 13 formed on the side surface 5a 'of the printed wiring board 5a.

次に、図１０，図１１及び図１２は、第３の実施の形態を示す。   Next, FIGS. 10, 11 and 12 show a third embodiment.

この第３の実施の形態は、表面に一対の配線パターン６ｂ，７ｂを形成して成る一枚のプリント配線基板５ｂに、複数個の抜き孔１０ｂを、当該各抜き孔１０ｂ内に前記両配線パターン６ｂ，７ｂにおけるスルーホール８ｂ，９ｂの各々が露出するように穿設し、この各抜き孔１０ｂ内の各々に、前記したように、扁平状に構成したコンデンサ素子１を挿入して、この各コンデンサ素子１をプリント配線基板５ｂに対して、当該各コンデンサ素子1 の外周面と各抜き孔１０ｂの内周面との間に充填した接着剤又は樹脂剤により固着するとともに、各コンデンサ素子１における陽極棒３を、前記抜き孔１０ｂ内に露出する両スルーホール８ｂ，９ｂのうち一方のスルーホール８ｂに対して、導電性ペースト又は半田付け等により電気的に接続する一方、各コンデンサ素子１における陰極膜４を、他方のスルーホール９ｂに対して、導電性ペースト又は半田付け等により電気的に接続するという構成にしたものである。   In the third embodiment, a single printed wiring board 5b having a pair of wiring patterns 6b and 7b formed on the surface has a plurality of punched holes 10b, and the both wirings are formed in each of the punched holes 10b. The through holes 8b and 9b in the patterns 6b and 7b are formed so as to be exposed, and the capacitor element 1 configured in a flat shape as described above is inserted into each of the through holes 10b. Each capacitor element 1 is fixed to the printed circuit board 5b with an adhesive or a resin agent filled between the outer peripheral surface of each capacitor element 1 and the inner peripheral surface of each punch hole 10b. The anode rod 3 is electrically connected to one of the through holes 8b, 9b exposed in the punch hole 10b by conductive paste or soldering. On the other hand, the cathode layer 4 of the capacitor elements 1, with respect to the other through-hole 9b, is obtained by the configuration in which electrically connected by a conductive paste or soldering.

これにより、一つのプリント配線基板５ｂに、複数個のコンデンサ素子１を備えて形態のネットワーク構造にすることができる。   As a result, a network structure can be obtained in which a plurality of capacitor elements 1 are provided on one printed wiring board 5b.

この第３の実施の形態の場合においても、そのプリント配線基板５ｂの表裏両面には、絶縁材による被覆コート層１１ｂ，１２ｂが形成されている。また、この第３の実施の形態における変形例としては、例えば、図１３（Ａ）及び（Ｂ）に示すような回路のネットワーク構造にすることができる。   Also in the case of the third embodiment, coating coat layers 11b and 12b made of an insulating material are formed on both front and back surfaces of the printed wiring board 5b. As a modification of the third embodiment, for example, a circuit network structure as shown in FIGS. 13A and 13B can be used.

そして、図１４及び図１５は、第４の実施の形態を示す。   14 and 15 show a fourth embodiment.

この第４の実施の形態は、表面に一対の配線パターン６ｃ，７ｃを形成して成る一枚のプリント配線基板５ｃに、複数個の抜き孔１０ｃを、前記プリント配線基板５ｃにおける側面５ｃ′から入り込む溝型の形態にし、且つ、当該抜き孔１０ｃ内に一方の配線パターン６ｃにおけるスルーホール８ｃを露出するようにして穿設し、この各抜き孔１０ｃ内の各々に、前記したように扁平状に構成したコンデンサ素子１を挿入して、このコンデンサ素子１をプリント配線基板５ｃに対して、当該コンデンサ素子１の外周面と抜き孔１０ｃの内周面との間に充填した接着剤又は樹脂剤により固着するとともに、このコンデンサ素子１における陽極棒３を、前記抜き孔１０ｃ内に露出するスルーホール８ｃに対して、導電性ペースト又は半田付け等により電気的に接続する一方、前記プリント配線基板５ｃにおける側面５ｃ′に、導体膜１３ｃを形成することにより、この導体膜１３ｃによって、前記コンデンサ層１における陰極膜４を、前記プリント配線基板５ｃの表面における他方の配線パターン７ｃに電気的に接続するように構成したものである。   In the fourth embodiment, a plurality of punched holes 10c are formed in a single printed wiring board 5c formed by forming a pair of wiring patterns 6c and 7c on the surface from the side surface 5c 'of the printed wiring board 5c. A groove shape is formed, and a through hole 8c in one wiring pattern 6c is exposed in the hole 10c, and each of the holes 10c has a flat shape as described above. The capacitor element 1 configured as described above is inserted, and the capacitor element 1 is filled into the printed wiring board 5c between the outer peripheral surface of the capacitor element 1 and the inner peripheral surface of the punch hole 10c. The anode rod 3 in the capacitor element 1 is attached to the through hole 8c exposed in the punch hole 10c by a conductive paste or soldering. On the other hand, the conductor film 13c is formed on the side surface 5c 'of the printed wiring board 5c, so that the cathode film 4 in the capacitor layer 1 is formed on the printed wiring board 5c by the conductor film 13c. It is configured to be electrically connected to the other wiring pattern 7c on the surface.

これにより、一つのプリント配線基板５ｂに、複数個のコンデンサ素子１を備えて形態のネットワーク構造にすることができる。   As a result, a network structure can be obtained in which a plurality of capacitor elements 1 are provided on one printed wiring board 5b.

この第４の実施の形態の場合においても、そのプリント配線基板５ｃの表裏両面には、絶縁材による被覆コート層１１ｃ，１２ｃが形成されているほか、前記導体膜１３ｃも、絶縁材によるコート層で被覆されている。   Also in the case of the fourth embodiment, coating coat layers 11c and 12c made of an insulating material are formed on both front and back surfaces of the printed wiring board 5c, and the conductor film 13c is also coated with an insulating material. It is covered with.

第１の実施の形態を示す斜視図である。It is a perspective view which shows 1st Embodiment. 図１のII−II視拡大断面図である。FIG. 2 is an enlarged sectional view taken along line II-II in FIG. 1. 前記第１の実施の形態においてプリント配線基板を示す斜視図である。It is a perspective view which shows a printed wiring board in the said 1st Embodiment. 図３のIV−IV視拡大断面図である。FIG. 4 is an enlarged sectional view taken along line IV-IV in FIG. 3. 前記第１の実施の形態において分解した状態を示す斜視図である。It is a perspective view which shows the state decomposed | disassembled in the said 1st Embodiment. 図５のVI−VI視拡大断面図である。FIG. 6 is an enlarged sectional view taken along line VI-VI in FIG. 5. 第２の実施の形態を示す斜視図である。It is a perspective view which shows 2nd Embodiment. 図７のVIII−VIII視拡大断面図である。FIG. 8 is an enlarged sectional view taken along line VIII-VIII in FIG. 7. 前記第２の実施の形態において分解した状態を示す斜視図である。It is a perspective view which shows the state decomposed | disassembled in the said 2nd Embodiment. 第３の実施の形態を示す平面図である。It is a top view which shows 3rd Embodiment. 図１０のXI−XI視拡大断面図である。It is the XI-XI view expanded sectional view of FIG. 前記第３の実施の形態の等価回路図である。It is an equivalent circuit diagram of the third embodiment. 前記第３の実施の形態における変形例を示す平面図である。It is a top view which shows the modification in the said 3rd Embodiment. 第４の実施の形態を示す平面図である。It is a top view which shows 4th Embodiment. 図１４のXV−XV視拡大断面図である。FIG. 15 is an XV-XV enlarged sectional view of FIG. 14.

符号の説明Explanation of symbols

１ コンデンサ素子
２ チップ体
３ 陽極棒
４ 陰極膜
５，５ａ，５ｂ，５ｃ プリント配線基板
６，６ａ，６ｂ，６ｃ 一方の配線パターン
７，７ａ，７ｂ，７ｃ 他方の配線パターン
８，８ａ，８ｂ，８ｃ 一方の配線パターンにおけるスルーホール
９，９ａ，９ｂ，９ｃ 他方の配線パターンにおけるスルーホール
１０，１０ａ，１０ｂ，１０ｃ 抜き孔
１３，１３ｃ 導体膜 DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Chip body 3 Anode rod 4 Cathode film 5, 5a, 5b, 5c Printed wiring board 6, 6a, 6b, 6c One wiring pattern 7, 7a, 7b, 7c The other wiring pattern 8, 8a, 8b, 8c Through hole in one wiring pattern 9, 9a, 9b, 9c Through hole in the other wiring pattern 10, 10a, 10b, 10c Open hole 13, 13c Conductor film

Claims (4)

弁作用金属粉末によるチップ体及びこのチップ体の一端面から突出する陽極棒並びに前記チップ体の表面に形成した陰極膜にて構成されるコンデンサ素子と、表面に少なくとも一対の配線パターンを形成して成るプリント配線基板とから成り、前記コンデンサ素子におけるチップ体を、その一端面から突出する陽極棒の軸線と直角方向の厚さ寸法を前記プリント配線基板における板厚さと略等しくするかこの板厚さ以下に薄くした扁平な形状にする一方、前記プリント配線基板には、抜き孔を、前記一対の配線パターンの各々に電気的に導通するように設けたスルーホールが当該抜き孔内に露出するように穿設し、この抜き孔内に、前記コンデンサ素子を、その陽極棒及び陰極膜が前記各スルーホールに電気的に接続するように装填することを特徴とする固体電解コンデンサにおけるプリント配線基板に対する実装構造。   A capacitor element composed of a chip body made of a valve metal powder, an anode rod protruding from one end surface of the chip body, and a cathode film formed on the surface of the chip body, and at least a pair of wiring patterns formed on the surface The chip body of the capacitor element is made to have a thickness dimension in a direction perpendicular to the axis of the anode bar projecting from one end face thereof, or the thickness of the chip body in the printed circuit board is substantially equal to the thickness of the printed wiring board. The printed wiring board has a thin hole and a through hole provided in the printed wiring board so as to be electrically connected to each of the pair of wiring patterns so as to be exposed in the hole. The capacitor element is loaded into the hole so that the anode rod and the cathode membrane are electrically connected to the through holes. Mounting structure for printed circuit board in the solid electrolytic capacitor according to claim. 弁作用金属粉末によるチップ体及びこのチップ体の一端面から突出する陽極棒並びに前記チップ体の表面に形成した陰極膜にて構成されるコンデンサ素子と、表面に少なくとも一対の配線パターンを形成して成るプリント配線基板とから成り、前記コンデンサ素子におけるチップ体を、その一端面から突出する陽極棒の軸線と直角方向の厚さ寸法を前記プリント配線基板における板厚さと略等しくするかこの板厚さ以下に薄くした扁平な形状にする一方、前記プリント配線基板には、当該プリント配線基板の側面から入り込むように構成した抜き孔を、前記一対の配線パターンのうち一方の配線パターンに電気的に導通するように設けたスルーホールが当該抜き孔内に露出するように穿設し、この抜き孔内に、前記コンデンサ素子を、その陽極棒又は陰極膜が前記スルーホールに電気的に接続するように装填し、更に、前記プリント配線基板の側面に、前記一対の配線パターンのうち他方の配線パターンと前記コンデンサ素子における陰極膜又は陽極棒とを電気的に接続する導体膜を形成することを特徴とする固体電解コンデンサにおけるプリント配線基板に対する実装構造。   A capacitor element composed of a chip body made of a valve metal powder, an anode rod protruding from one end surface of the chip body, and a cathode film formed on the surface of the chip body, and at least a pair of wiring patterns formed on the surface The chip body of the capacitor element is made to have a thickness dimension in a direction perpendicular to the axis of the anode bar projecting from one end face thereof, or the thickness of the chip body in the printed circuit board is substantially equal to the thickness of the printed wiring board. The printed wiring board is electrically connected to one wiring pattern of the pair of wiring patterns, while a flattened shape is formed below, and the printed wiring board is configured to enter from the side surface of the printed wiring board. A through hole is formed so as to be exposed in the hole, and the capacitor element is placed in the hole in the positive hole. A rod or cathode film is loaded so as to be electrically connected to the through hole, and the other wiring pattern of the pair of wiring patterns and the cathode film or anode rod in the capacitor element are further provided on the side surface of the printed wiring board. A mounting structure for a printed wiring board in a solid electrolytic capacitor, characterized in that a conductive film is formed to electrically connect the two. 弁作用金属粉末によるチップ体及びこのチップ体の一端面から突出する陽極棒並びに前記チップ体の表面に形成した陰極膜にて構成されるコンデンサ素子の複数個と、表面に少なくとも一対の配線パターンを形成して成るプリント配線基板とから成り、前記各コンデンサ素子におけるチップ体を、その一端面から突出する陽極棒の軸線と直角方向の厚さ寸法を前記プリント配線基板における板厚さと略等しくするかこの板厚さ以下に薄くした扁平な形状にする一方、前記プリント配線基板に、前記コンデンサ素子と同数個の抜き孔を、前記一対の配線パターンの各々に電気的に導通するように設けたスルーホールが当該抜き孔内に露出するように穿設し、この各抜き孔内に、前記各コンデンサ素子を、その陽極棒及び陰極膜が前記各スルーホールに電気的に接続するように装填することを特徴とする固体電解コンデンサにおけるプリント配線基板に対する実装構造。   A plurality of capacitor elements composed of a chip body made of valve action metal powder, an anode rod protruding from one end face of the chip body, and a cathode film formed on the surface of the chip body, and at least a pair of wiring patterns on the surface Whether the thickness of the chip body of each capacitor element in the direction perpendicular to the axis of the anode rod protruding from one end surface thereof is substantially equal to the plate thickness of the printed wiring board. While the flat shape is made thinner than this plate thickness, the printed wiring board is provided with the same number of holes as the capacitor elements so as to be electrically connected to each of the pair of wiring patterns. A hole is formed so as to be exposed in the corresponding hole, and each capacitor element, its anode rod and cathode film are connected to each through hole in each hole. Mounting structure for printed circuit board in the solid electrolytic capacitor, characterized in that loading so as to be electrically connected to Le. 弁作用金属粉末によるチップ体及びこのチップ体の一端面から突出する陽極棒並びに前記チップ体の表面に形成した陰極膜にて構成されるコンデンサ素子の複数個と、表面に少なくとも一対の配線パターンを形成して成るプリント配線基板とから成り、前記各コンデンサ素子におけるチップ体を、その一端面から突出する陽極棒の軸線と直角方向の厚さ寸法を前記プリント配線基板における板厚さと略等しくするかこの板厚さ以下に薄くした扁平な形状にする一方、前記プリント配線基板に、前記コンデンサ素子と同数個の抜き孔を、前記一対の配線パターンのうち一方の配線パターンに電気的に導通するように設けたスルーホールが当該抜き孔内に露出するように穿設し、この各抜き孔内に、前記各コンデンサ素子を、その陽極棒又は陰極膜が前記スルーホールに電気的に接続するように装填し、更に、前記プリント配線基板における側面に、前記一対の配線パターンのうち他方の配線パターンと前記各コンデンサ素子における陰極膜又は陽極棒とを電気的に接続する導体膜を形成することを特徴とする固体電解コンデンサにおけるネットワーク構造。   A plurality of capacitor elements composed of a chip body made of valve action metal powder, an anode rod protruding from one end face of the chip body, and a cathode film formed on the surface of the chip body, and at least a pair of wiring patterns on the surface Whether the thickness of the chip body of each capacitor element in the direction perpendicular to the axis of the anode rod protruding from one end surface thereof is substantially equal to the plate thickness of the printed wiring board. While making the flat shape thinned below this plate thickness, the same number of holes as the capacitor element are electrically connected to one of the pair of wiring patterns in the printed wiring board. A through hole provided in the hole is exposed so as to be exposed in the hole, and each capacitor element is connected to the anode bar or cathode in each hole. Is electrically connected to the through hole, and the other wiring pattern of the pair of wiring patterns and the cathode film or anode rod of each capacitor element are electrically connected to the side surface of the printed wiring board. A network structure in a solid electrolytic capacitor, characterized by forming a conductive film to be connected electrically.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7677629B2 (en) 2005-07-14 2010-03-16 Toyota Boshoku Kabushiki Kaisha Movement device for vehicle seat
US8199462B2 (en) * 2008-09-08 2012-06-12 Avx Corporation Solid electrolytic capacitor for embedding into a circuit board
CN114899011A (en) * 2022-05-05 2022-08-12 肇庆绿宝石电子科技股份有限公司 High-voltage laminated capacitor and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02232986A (en) * 1989-03-07 1990-09-14 Sony Corp Board and manufacture thereof
JPH06326440A (en) * 1993-05-17 1994-11-25 Hitachi Ltd Wiring board, electronic device with built-in wiring board, and manufacture of electronic device
JP2001052961A (en) * 1999-06-01 2001-02-23 Rohm Co Ltd Structure of packaged solid electrolytic capacitor and manufacture thereof
JP2003272958A (en) * 2002-03-18 2003-09-26 Matsushita Electric Ind Co Ltd Solid electrolytic capacitor electrode member and solid electrolytic capacitor using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02232986A (en) * 1989-03-07 1990-09-14 Sony Corp Board and manufacture thereof
JPH06326440A (en) * 1993-05-17 1994-11-25 Hitachi Ltd Wiring board, electronic device with built-in wiring board, and manufacture of electronic device
JP2001052961A (en) * 1999-06-01 2001-02-23 Rohm Co Ltd Structure of packaged solid electrolytic capacitor and manufacture thereof
JP2003272958A (en) * 2002-03-18 2003-09-26 Matsushita Electric Ind Co Ltd Solid electrolytic capacitor electrode member and solid electrolytic capacitor using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7677629B2 (en) 2005-07-14 2010-03-16 Toyota Boshoku Kabushiki Kaisha Movement device for vehicle seat
US8199462B2 (en) * 2008-09-08 2012-06-12 Avx Corporation Solid electrolytic capacitor for embedding into a circuit board
CN114899011A (en) * 2022-05-05 2022-08-12 肇庆绿宝石电子科技股份有限公司 High-voltage laminated capacitor and preparation method thereof

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