JP2006029943A - Semiconductor checking socket equipped with pressing mechanism - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a checking socket provided with a pressing mechanism capable of uniformly giving a large pressure reaching over 40kg/socket to a semiconductor device to be checked with a simple mechanism during checking of semiconductor. <P>SOLUTION: The semiconductor checking socket has a socket body having a recess containing semiconductor to be checked and a socket lid body positioning on the semiconductor to be checked during checking. Above the edge of the socket body, an insertion control member is provided and the insertion member which is made movable in horizontal direction and a tapered shape at the tip end cross section is pushed in a gap formed between the edge of the socket lid body and the insertion control member. The semiconductor to be checked is made capable of pressing to the bottom direction with a large press force. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a socket used for inspection of a high current / multipolar semiconductor. More specifically, in the inspection of a high-current, multi-polar semiconductor, in order to ensure stable conduction between the terminal of the semiconductor to be inspected and the electrode of the inspection circuit, the semiconductor to be inspected accommodated in the socket is pressed downward. The present invention relates to a semiconductor inspection socket having a novel pressing mechanism. Note that “semiconductor” in the present invention means a broad concept including a semiconductor device, a semiconductor package, and the like represented by a semiconductor integrated circuit (IC).

In inspecting the electrical characteristics of a semiconductor such as a semiconductor integrated circuit (IC), a socket having a recess for accommodating a semiconductor integrated circuit (IC) to be inspected is often used. At the time of inspection, in order to achieve a good contact state directly from the upper part of the semiconductor integrated circuit (IC) with the electrode of the inspection circuit disposed on the bottom surface of the recess of the socket body or via the contact sheet disposed on the bottom surface. The pressing from the upper side is mainly performed by the weight of the socket lid.

As a pressing means other than the self-weight, a socket lid is provided with a spring and pressed downward (see, for example, Patent Document 1), a part of the socket lid is screwed, and the portion is turned to rotate the screw. A device that is pressed downward by force (see, for example, Patent Document 2) is known.
By the way, recent semiconductors have a high arrangement density of terminals, and those having many terminals exceeding several hundreds often cannot maintain a good contact state unless pressed with a considerable force. In particular, depending on the configuration of the semiconductor to be inspected and the type of contact sheet used at the time of inspection, it is necessary to press the entire socket with a force exceeding 40 kg / socket.
However, it has been difficult for a conventional socket lid provided with a pressing mechanism to achieve stable pressing with such a large pressure.
In order to apply a high pressing force, it is conceivable to apply a mechanical load from the top of the socket lid with a robot arm or the like. However, the size of the semiconductor to be inspected is about several centimeters square and mechanically from above. It is not practical to apply a large load.
Japanese Patent Laid-Open No. 10-22024 JP 11-102763 A

  An object of the present invention is to provide an inspection socket having a pressing mechanism that can uniformly apply a large pressing force of 40 kg / socket or more to a semiconductor to be inspected with a simple mechanism when inspecting a high-current / multipolar semiconductor. Is to provide.

  The socket for semiconductor inspection of the present invention achieves the object of the present invention, and has a socket main body having a recess for accommodating a semiconductor to be inspected and a socket lid positioned on the semiconductor to be inspected at the time of inspection. In the socket for semiconductor inspection, an insertion control member is provided above the peripheral edge of the socket body, and the insertion member that is movable in the horizontal direction and has a tapered tip section is inserted into the peripheral edge of the socket lid and the insertion control. It is a socket for semiconductor inspection characterized by having a pressing mechanism that pushes down the socket lid by pushing it into a gap formed between the members, and by adopting such a pressing mechanism, A simple mechanism applies a large force to the semiconductor to be inspected in a narrow place so that it can be pressed toward the bottom of the socket.

  In a preferred embodiment of the present invention, the insertion control member is configured by a roller installed above the peripheral edge of the socket body via a support member standing on the peripheral edge of the socket body. . By using the insertion control member as a roller, the insertion member having a tapered tip cross-section can be easily pushed into the space formed between the roller and the socket lid peripheral portion, and the socket can be pushed by the pushing. The lid can be smoothly pushed downward.

  It is preferable that the roller is a roller having a horizontal axis that connects a pair of adjacent tip portions among the support members erected on the socket body as an axis. The length of the roller is preferably substantially the same as the length of one side of the semiconductor to be inspected or larger than the length of one side.

  Moreover, in this invention, a large diameter part (expansion trunk | drum) can be provided in the vicinity of the front-end | tip of the rod-shaped body standingly arranged in the peripheral part of the said socket main body, and this can also be used as the said insertion control member. In this case, a guide pin (also referred to as a slide pin) penetrating the socket body and the socket cover body can be applied as a rod-like body standing on the peripheral edge of the socket body. Another rod-like body may be erected. Thus, when a large diameter portion is provided near the tip of each rod-like body and this is used as an insertion control member, the lower end cross section of the large diameter portion is rounded to reduce friction with the upper surface of the insertion member. Is preferred.

  In the present invention, the fitting member that moves in the horizontal direction is a plate-like body having a tapered section at the tip, that is, a plate-like body having a portion where the thickness of the tip portion is the smallest and the thickness increases as the distance from the tip portion increases. Is preferred. If necessary, the plate-like body is provided with a notch in a portion corresponding to the position of the support member or guide pin in the insertion control member, and the plate-like body is not affected by the position of the support member or guide pin. It is preferable that the tip of the body is sufficiently pushed into the space. As the fitting member, a plurality of rod-like bodies having a tapered tip cross-section can be used in parallel instead of the plate-like body. Thus, when the rod-like bodies having a tapered tip cross section are arranged in parallel and used as the fitting member, it is appropriate to dispose the rod-like body at a position other than the support member and the guide pin.

In the present invention, it is desirable to further include means for horizontally moving the insertion member toward a gap between a peripheral portion of the socket lid and the insertion control member and pushing the insertion member into the space. Any means may be used as long as it has a function of extruding the tapered plate-like body toward the space, and the form and structure thereof are not limited.
Further, the inspection socket having the pressing mechanism of the present invention, when measuring by placing an anisotropic conductive sheet between the semiconductor to be inspected, which requires a large pressing force, and the bottom surface of the recess of the socket body, Particularly preferably employed.

  According to the present invention, a semiconductor inspection socket having a pressing mechanism capable of uniformly applying a large pressing force reaching 40 to 80 kg or more per socket to a semiconductor to be inspected with a simple mechanism during semiconductor inspection. Is provided. And since the socket provided with this press mechanism is a simple mechanism, the whole apparatus can be made compact and manufacturing cost can be reduced.

  In particular, when an anisotropic conductive sheet is arranged as a contact sheet for the purpose of improving the contact / conductivity between the semiconductor terminal side surface and the socket bottom surface, it may be difficult to make sufficient contact with the conventional pressing means. However, since the sufficient contact is realized in the socket of the present invention, a stable inspection can be performed.

Hereinafter, examples of preferred embodiments of the present invention will be described with reference to the drawings.
1 and 2 exemplify an embodiment of the present invention. FIG. 1 is a simplified cross-sectional view of a semiconductor test socket according to the present invention, and FIG. The state after the device is accommodated and before the socket lid is placed on the socket body is shown. (B) uses the pressing mechanism to press the semiconductor device under test downward (toward the bottom of the socket body). It shows the state. FIG. 2 is a plan view showing the state of the socket main body and the pressing mechanism associated therewith before placing the socket lid on the socket main body in the inspection socket shown in FIG.

In FIG. 1A and FIG. 2, reference numeral 1 denotes a socket body, and a concave portion 11 that houses a semiconductor device to be inspected (DUT) 2 is provided on the upper portion of the socket body 1. Contacts or electrodes (not shown) necessary for the inspection are disposed on the bottom surface of the recess 11, and these can be electrically connected to a tester (not shown) through the substrate 5. A reinforcing plate 6 is attached under the substrate 5 to support the substrate 5 and reinforce the whole. Further, the socket body 1 is provided with a plurality of guide pins (slide pins) 14, and these sockets 3 are placed through the through holes 33 of the socket lid 3 to place the socket lid 1 and the socket lid 1. 3 has a predetermined positional relationship.
At the four corners of the peripheral edge of the socket body 1, roller posts 13 each comprising a rod-like body are erected, and the two roller posts 13 located on both sides of the semiconductor device 2 to be inspected are located near the tip of each other. 16 are connected. Rollers 15a and 15b as insertion control members are attached to the horizontal rods 16 so as to be rotatable about the horizontal rods 16 as rotation axes. Each of the rollers 15a and 15b is a long roller extending in the axial direction as shown in FIG. 2 (plan view), and each roller shaft is substantially parallel to the end of the recess 11 in which the semiconductor device to be inspected is accommodated. Is provided.

  On the other hand, 3 in FIG. 1A and FIG. 2 is a socket lid, and its central portion 31 protrudes downward so that it can be loosely fitted in the recess 11 of the socket body 1, and the central portion 31 is a semiconductor device to be inspected. It is located on top of 2. The right and left sides of the peripheral edge of the socket lid 3 have ears 32 that do not fit into the recess 11, and these ears 32 are thinner than the central part 31. The socket lid 3 is provided with a through hole 33 through which the guide pin 14 passes.

  The socket according to the present invention is further fitted on both sides of the socket body 1 in gap-like spaces Sa and Sb formed between the rollers 15a and 15b and the ear portion 32 of the socket lid 3, respectively. A total of two insertion members 4 (one pair on the left and right) are formed of a plate-like body whose tip section is tapered (tapered). These fitting members 4 are moved horizontally as indicated by arrows in the direction of the center of the socket body 1 from both sides by appropriate moving means (not shown) so that the tapered tips enter the spaces Sa and Sb. ing.

In order to inspect a BGA type semiconductor device using the socket of the present invention shown in FIGS. 1A and 2, first, the semiconductor device 2 to be inspected is placed on the socket body 1 with the surface having terminals facing down. It is accommodated in the recess 11. At this time, if necessary, an anisotropic conductive sheet (not shown) may be installed as a contact sheet on the bottom surface of the concave portion of the socket body 1 in advance. Next, the socket lid 3 is placed so that the protruding portion of the central portion 31 is positioned on the semiconductor device 2 to be inspected so as to cover the concave portion 11 of the socket body 1. At this time, the ear 32 of the socket lid 3 does not enter the recess 11 of the socket body 1 and overlaps the peripheral edge of the socket body. Then, in the gap-like spaces Sa and Sb formed between the rollers 15a and 15b and the ear portion 32 of the socket lid body 3, the insertion members 4 each made of a plate-like member having a tapered tip section are tapered. When inserted from the horizontal direction (left and right in the figure) and pushed toward the center, the wedge effect gradually increases the distance between the ear 32 of the socket lid 3 and the rollers 15a and 15b, and accordingly the socket lid. 3 is pressed downward with a strong force.
That is, in the present invention, as shown in FIG. 1B, the socket lid 3 is gradually pushed downward uniformly by such an operation, and as a result, the semiconductor device 2 to be inspected is also pushed downward uniformly. . Accordingly, the semiconductor device 2 to be inspected located under the socket lid 2 is also pressed downward, and as a result, the electrical connection between the terminals of the semiconductor device to be inspected and the electrodes of the inspection circuit is established. .

  The socket body 1, the socket lid 3, and the fitting member 4 made of a plate-like body having a tapered tip end section are all made of metal. In general, the fitting member 4 is preferably made of a metal having a lower hardness than other members. The fitting member 4 may be attached to the socket body 1 as a part of the socket body 1, or may be configured as a separate member independent of the socket body 1 and installed on or near the socket body 1 when used. .

FIG. 3 shows another embodiment of the present invention, in which a large-diameter portion 14a is provided in the vicinity of the tip portion of a guide pin (slide pin) 14 erected on the socket body 1, and this is used as an insertion control member. It is.
That is, in this embodiment, the large-diameter portion 14 a is provided at the distal end portion of the guide pin 14 and is formed between the lower end of the large-diameter portion 14 a and the surface of the ear portion 32 formed at the peripheral edge portion of the socket lid 3. The insertion member 4 made of a plate-like body having a tapered tip section may be pushed into the space. In this embodiment, the lower end of the large-diameter portion 14a of the guide pin 14 may be rounded to facilitate the insertion of the insertion member 4.
The large-diameter portion 14a at the distal end portion of the guide pin 14 may be integrally formed as a part of the guide pin 14, and if necessary, a large-diameter portion forming member is externally fitted to the distal end portion of the guide pin 14 and rotated. It can also be formed.

In the embodiment shown in FIGS. 1 to 3, a plate-like body having a tapered tip section is used as the fitting member 4, but a plurality of rod-shaped bodies having a tapered tip section are arranged in parallel. May be configured. Further, a cooling head (not shown) may be provided inside the socket lid 3.
In FIG. 1 to FIG. 3, the terminals of the semiconductor device, the electrode pads on the bottom of the socket body, and the wiring are omitted, but it goes without saying that they are installed as usual. In the illustrated embodiment, the fitting members 4 are provided on both sides of the semiconductor device 2 to be inspected, but may be provided in four directions surrounding the semiconductor device 2 to be inspected.

  Since the socket of the present invention has various advantages as described above, it is particularly effective when applied to a case where a large pressing force is required when inspecting a high current / multipolar semiconductor device.

It is simplified sectional drawing of a socket provided with the press mechanism which concerns on one Embodiment of this invention, Comprising: (a) is the stage in which a socket lid body is not mounted immediately after accommodating a to-be-inspected semiconductor device in a socket main body. FIG. 4B is a diagram showing a state in which the semiconductor device to be inspected accommodated in the socket body is pressed downward by using the pressing mechanism. FIG. 2 is a plan view showing a state before placing a socket lid in the socket shown in FIG. 1. It is the simplified sectional view of the socket which shows other embodiments of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Socket body 11 Recessed part 13 of socket body Roller support | pillar 14 Guide pin (slide pin)
14a Large diameter portions 15a and 15b of guide pins (slide pins) Roller 16 Horizontal scissors that serve as a roller shaft 2 Semiconductor device to be inspected (DUT)
DESCRIPTION OF SYMBOLS 3 Socket cover body 31 Center part of socket cover body 32 Ear part of socket cover body 33 Through-hole 4 of socket cover body Insertion member 5 which consists of plate-shaped body which has taper at front-end | tip 6 Reinforcement board

Claims (10)

  In a semiconductor inspection socket having a socket body having a recess for accommodating a semiconductor device to be inspected and a socket lid positioned on the semiconductor device to be inspected at the time of inspection, a fitting control member is provided above the peripheral edge of the socket body In addition, the socket lid body is moved downward by pushing a fitting member that is movable in the horizontal direction and has a tapered tip section into a gap formed between the peripheral edge portion of the socket lid body and the fitting control member. A socket for semiconductor inspection, comprising a pressing mechanism for pressing down to a semiconductor.   The socket for semiconductor inspection according to claim 1, wherein the insertion control member is a roller installed above the peripheral edge of the socket body through a support member standing on the peripheral edge of the socket body.   The socket for semiconductor inspection according to claim 2, wherein the roller is a roller having a horizontal axis that connects a pair of adjacent tip portions of the support member as an axis.   The length of the said roller is substantially the same as the length of the one side of a semiconductor device to be inspected, or larger than the length of one side, The socket for semiconductor inspection in any one of Claims 3-4 characterized by the above-mentioned.   The socket for semiconductor inspection according to claim 1, wherein the insertion control member is a large-diameter portion provided in the vicinity of a tip end of a rod-like body erected on a peripheral portion of the socket body.   6. The semiconductor inspection socket according to claim 5, wherein the rod-like body erected on the peripheral edge of the socket body is a guide pin that penetrates the socket body and the socket lid body.   The semiconductor inspection socket according to claim 1, wherein the fitting member that moves in a horizontal direction is a plate-like body having a tapered section at the tip.   Furthermore, the said insertion member is equipped with a means to move horizontally toward the clearance gap between the peripheral part of the said socket cover body, and the said insertion member latching | locking part, and pushes it in any one of Claims 1-8 characterized by the above-mentioned. The semiconductor inspection socket according to claim 1.   The semiconductor inspection socket according to claim 1, wherein a cooling means is built in the socket lid.   The semiconductor inspection socket according to claim 1, wherein an anisotropic conductive sheet is disposed between the semiconductor to be inspected and the bottom surface of the concave portion of the socket body.

Images