JP2006026884A - Method for manufacturing adhesion sheet and punching die - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an adhesion sheet and a punching die used for the method for manufacturing the adhesion sheet capable of sufficiently preventing the generation of burr at an adhesive layer by a simple constitution. <P>SOLUTION: The punching die 1 provided with an upper blade 4 and a lower blade 2 opposed to each other and formed such that sharpness of the lower blade 2 is more dully than sharpness of the upper blade 4 is used. The adhesion sheet 5 in which a resin layer 21, an adhesive layer 22 and a mold releasing layer 23 are successively laminated is placed on the lower blade 4, i.e., a fixed blade and a through hole 25 is formed on the adhesion sheet 5 by advancing the lower blade 4, i.e., a movable blade. According to this method, the through hole 25 can be formed on the adhesion sheet 5 while certainly preventing generation of the burr on the adhesive layer 22. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an adhesive sheet manufacturing method and a punching die, and more particularly to an adhesive sheet manufacturing method for manufacturing an adhesive sheet by punching, and a punching die used in the adhesive sheet manufacturing method.

The insulating cover layer of the printed circuit board is usually an insulating layer made of a resin film, an adhesive layer made of an adhesive laminated on the insulating layer, and a release film made of a release film laminated on the adhesive layer. The adhesive sheet including the layer is formed by punching the adhesive sheet and then peeling the release layer from the adhesive layer and sticking the adhesive layer to the conductor pattern.
For punching such an adhesive sheet, a punching die having an upper blade made of a movable blade and a lower blade made of a fixed blade is used.

However, when the upper blade is moved relative to the lower blade so as to penetrate the adhesive sheet, the adhesive layer is subjected to shear stress and is stretched in the moving direction together with the moving upper blade due to its viscosity. Thus, it becomes a burr on the cut surface. Such burrs contaminate the printed circuit board and cause harmful effects on electronic components mounted on the printed circuit board.
Therefore, as a method for preventing the occurrence of such burrs, for example, a cutting blade is provided at the front edge of the cutting punch, and when punching, the adhesive is separated with the cutting blade, and the burrs are separated. It has been proposed to prevent the occurrence of (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 5-200448

However, the above proposal requires a special configuration such as projecting a cutting blade on the cutting punch, resulting in an increase in cost. Further, even with a cutting blade, the adhesive layer is still slightly stretched in the moving direction of the moving cutting blade, so that it is insufficient to effectively prevent the generation of burrs.
An object of the present invention is to provide an adhesive sheet manufacturing method capable of sufficiently preventing the occurrence of burrs in an adhesive layer with a simple configuration, and a punching die used for the adhesive sheet manufacturing method. Is to provide.

  In order to achieve the above object, an adhesive sheet manufacturing method of the present invention includes an adhesive sheet in which a resin layer, an adhesive layer, and a release layer are sequentially laminated, and a first blade and a second blade that face each other. A method for producing an adhesive sheet, comprising a step of punching with a punching die, wherein in the punching die, the sharpness of the second blade is formed slower than the sharpness of the first blade. It is a feature.

  In this method, an adhesive sheet is interposed between the first blade and the second blade, and either one of the first blade and the second blade is moved relative to the other blade to strike the adhesive sheet. If it comes off, the adhesive sheet is punched by the first blade and the second blade while the adhesive sheet is fixed on the second blade that is duller than the first blade. Thus, if the adhesive sheet is punched while being fixed by the second blade, it is possible to reduce the stretching of the adhesive layer. Therefore, the generation of burrs in the adhesive layer can be effectively prevented.

Further, this method can eliminate the need for a special configuration such as projecting a cutting blade. Therefore, the cost can be reduced with a simple configuration.
In this method, the first blade is a movable blade, the second blade is a fixed blade, the adhesive sheet is placed on the second blade, and the first blade is attached to the adhesive sheet. It is preferable that a hole is formed in the adhesive sheet by moving toward the second blade so as to penetrate the adhesive sheet.

If it does in this way, a penetration hole will be formed in an adhesive sheet by mounting an adhesive sheet on the 2nd blade which is a fixed blade, and moving the 1st blade which is a movable blade. Therefore, a through-hole can be formed in the adhesive sheet while reliably preventing the occurrence of burrs in the adhesive layer.
Further, in this method, the punching die includes a sandwiching member that sandwiches the adhesive sheet with the second blade and is formed with an insertion portion through which the first blade is movably inserted. It is preferable that an interval between the outer peripheral surface of the first blade and the inner peripheral surface of the insertion portion is 0.5 to 7 μm.

In this way, the outer peripheral surface of the first blade and the insertion portion when the first blade inserted through the insertion portion can move while the adhesive sheet can be stably fixed by the second blade and the clamping member. It is possible to prevent contact with the inner peripheral surface of the adhesive sheet, and it is possible to punch the adhesive sheet well.
Moreover, the manufacturing method of the adhesive sheet of the present invention includes an adhesive sheet in which a resin layer, an adhesive layer, and a release layer are sequentially laminated, by a punching die including a first blade and a second blade facing each other. A manufacturing method of an adhesive sheet comprising a punching process, wherein the first blade is a movable blade, the second blade is a fixed blade, and the adhesive sheet is placed on the second blade, The first blade is moved toward the second blade so as to penetrate the adhesive sheet, the first blade contacts the adhesive sheet, and the adhesive sheet is pressed toward the second blade. Thus, before any one layer of the resin layer and the release layer is punched out in the whole thickness direction by the second blade, the first blade moves the other layer and the adhesive layer. , Characterized by punching all over the thickness direction To have.

If punched out in this way, the other layer and the adhesive layer can be punched out by the first blade while one layer is supported by the second blade. Therefore, generation | occurrence | production of the burr | flash of an adhesive bond layer can be prevented reliably.
In addition, this method is preferably used when the resin layer is an insulating layer of a printed circuit board.

The punching die of the present invention is a punching die provided with a first blade and a second blade facing each other, and the sharpness of the second blade is formed to be duller than the sharpness of the first blade. It is characterized by having.
In such a punching die, when the adhesive sheet is punched, the adhesive sheet can be punched by the first blade and the second blade while fixing the adhesive sheet on the second blade. Therefore, with a simple configuration that only makes the sharpness of the second blade duller than the sharpness of the first blade, it is possible to reduce the stretch of the adhesive layer during punching, and to generate burrs in the adhesive layer. It can be effectively prevented.

In the punching die of the present invention, the first blade is a movable blade, the second blade is a fixed blade, an adhesive sheet is sandwiched between the second blade, and the first blade is movable. It is preferable that a clamping member is formed in which an insertion portion that is freely inserted is formed, and an interval between the outer peripheral surface of the first blade and the inner peripheral surface of the insertion portion is 0.5 to 7 μm.
In such a punching die, the outer peripheral surface of the first blade when the first blade inserted through the insertion portion is movable while the adhesive sheet can be stably fixed by the second blade and the clamping member. And the contact with the inner peripheral surface of the insertion portion can be prevented, and the adhesive sheet can be punched well.

  According to the manufacturing method and punching die of the adhesive sheet of the present invention, it is possible to effectively prevent burrs of the adhesive layer during punching with a simple configuration.

FIG. 1 is a main part configuration diagram showing an embodiment of a punching die according to the present invention.
In FIG. 1, this punching die 1 is used for forming a through hole in an adhesive sheet 5. The punching die 1 includes a lower blade (die) 2 as a second blade, a stripper plate (pressing plate) 3 as a clamping member, and an upper blade (punch) 4 as a first blade.
The lower blade 2 is a fixed blade, and includes a mounting table 7 whose upper surface 6 on which the adhesive sheet 5 is mounted has a flat plate shape. The mounting table 7 is fixed in position, and is formed with a lower slit forming portion 8 in which a lower slit having a rectangular cross section through which the upper blade 4 is movably inserted is formed. The width W of the lower slit formed in the lower slit forming portion 8 is set to 0.1 to 100 mm, preferably 0.5 to 50 mm.

  Moreover, in this lower blade 2, the edge part with the lower slit formation part 8 in the upper surface 6 is formed as the blade part 9, and the sharpness of this blade part 9 is the blade part 16 of the upper blade 4 mentioned later. It is formed duller than the sharpness. The “cutness” means the degree of cutting (cutting), and here, it means that the blade portion 9 of the lower blade 2 is formed more difficult to cut than the blade portion 16 of the upper blade 4. is doing.

The sharpness of the blade portion 9 only needs to be relatively dull with respect to the sharpness of the blade portion 16 of the upper blade 4. To form such a dullness, there is no particular limitation. For example, the blade portion 9 is rounded. An appropriate method is used such as forming, forming an inclined surface, or forming the coating layer 10 on the blade portion 9.
For example, in order to form roundness in the blade part 9, for example, the edge part with the lower slit formation part 8 in the upper surface 6 is blasted by sandblasting, diamond blasting, or the like.

  The round shape is not particularly limited. For example, when the curvature radius of the blade portion 16 of the upper blade 4 (R1: see FIG. 2A) is 0, the curvature radius of the blade portion 9 of the lower blade 2 ( R2: Refer to FIG. 2A) is preferably 0.01 to 0.1 mm. If the curvature radius of the blade portion 9 of the lower blade 2 exceeds 0.1 mm, the cut surface 24 (see FIG. 3C) of the adhesive sheet 5 may be deformed. When the curvature radius of the blade portion 16 of the upper blade 4 is not 0, the curvature radius of the blade portion 9 of the lower blade 2 is 1 with respect to the curvature radius of the blade portion 16 of the upper blade 4. .1 to 5.0 is preferable. When the curvature radius of the blade portion 9 of the lower blade 2 exceeds 5.0 mm, the cut surface 24 of the adhesive sheet 5 may be deformed. Further, even when the curvature radius of the blade portion 16 of the upper blade 4 is not 0, it is preferable that the curvature radius of the blade portion 9 of the lower blade 2 is 0.01 to 0.1 mm.

For example, in order to form an inclined surface on the blade portion 9, for example, the edge portion of the upper surface 6 with the lower slit forming portion 8 is polished into a taper shape and chamfered.
Although the shape of the inclined surface is not particularly limited, for example, the angle (θ of the inclined surface of the blade portion 16 of the lower blade 2)
: See FIG. 2 (b)) is preferably 0.5 to 20 °. Further, for example, when the length of the inclined surface of the blade portion 16 of the upper blade 4 (C1: see FIG. 2A) is 0, the length of the inclined surface of the blade portion 9 of the lower blade 2 (C2). : See FIG. 2 (a)) is preferably 0.01 to 0.1 mm. If the length of the inclined surface of the blade portion 9 of the lower blade 2 exceeds 0.1 mm, the cut surface 24 of the adhesive sheet 5 may be deformed. In addition, when the length of the inclined surface of the blade portion 16 of the upper blade 4 is not 0, the length of the inclined surface of the blade portion 9 of the lower blade 2 is the length of the inclined surface of the blade portion 16 of the upper blade 4. On the other hand, the ratio is preferably 1.1 to 5.0. If the length of the inclined surface of the blade portion 9 of the lower blade 2 exceeds 5.0 mm, the cut surface 24 of the adhesive sheet 5 may be deformed. Even when the length of the inclined surface of the blade portion 16 of the upper blade 4 is not 0, the length of the inclined surface of the blade portion 9 of the lower blade 2 is preferably 0.01 to 0.1 mm. is there.

For example, in order to form the covering layer 10 on the blade portion 9, the lower slit forming portion is formed on the upper surface 6 of the mounting table 7 with the covering layer 10 made of a resin sheet, a metal film, or the like, as necessary, via the adhesive layer 11. After sticking so as to cover 8, punching is performed with the upper blade 4. Then, the coating layer 10 formed with roundness is laminated on the blade portion 9 of the lower blade 2 (see FIG. 2C).
As the resin sheet, for example, a resin film made of polyolefin resin, vinyl chloride resin, vinyl acetate resin, nylon resin, fluorine resin, acrylic resin, synthetic rubber, polyethylene terephthalate resin, or the like is used. Moreover, as a metal film, metal foil which consists of stainless steel, aluminum, copper etc. is used, for example.

The thickness of the coating layer 10 is preferably, for example, 5 to 200 μm as the total thickness including the adhesive layer 11. If it exceeds 200 μm, the cut surface 24 of the adhesive sheet 5 may be deformed.
As shown in FIG. 1, the stripper plate 3 is disposed above the lower blade 2 so as to face the lower blade 2 at a predetermined interval. The stripper plate 3 includes a presser block 13 having a flat bottom surface 12 for pressing the top surface of the adhesive sheet 5. The presser block 13 is formed with an upper slit forming portion 14 as an insertion portion in which an upper slit having a rectangular cross section through which the upper blade 4 is movably inserted is formed. The upper slit forming portion 14 is disposed to face the lower slit forming portion 8 in the vertical direction, and the upper slit width of the upper slit forming portion 14 is the same as the width of the lower slit of the lower slit forming portion 8. Yes.

The stripper plate 3 is provided so as to be slidable in the vertical direction with respect to the fixed lower blade 2 so that the adhesive sheet 5 can be sandwiched between the lower blade 2.
The upper blade 4 is a movable blade and has a rectangular cross section extending in the vertical direction. The width of the upper blade 4 is the width of the lower slit formed in the lower slit forming portion 8 and the width of the upper slit formed in the upper slit forming portion 14. Slightly narrower than W, more specifically, the interval (clearance) between the outer peripheral surface of the upper blade 4 and the inner peripheral surfaces of the lower slit forming portion 8 and the upper slit forming portion 14 is 0.5 to 7 μm. Is formed. When the distance between the outer peripheral surface of the upper blade 4 and the inner peripheral surfaces of the lower slit forming portion 8 and the upper slit forming portion 14 is less than 0.5 μm, the upper blade 4, the lower slit forming portion 8 and the upper slit forming portion 14 are separated. May come into contact. Moreover, when the space | interval of the outer peripheral surface of the upper blade 4 and the inner peripheral surface of the lower slit formation part 8 and the upper slit formation part 14 exceeds 7 micrometers, when the adhesive sheet 5 is punched, when the adhesive sheet 5 loosens There is.

  And the edge part of the lower surface 15 in this upper blade 4 is formed as the blade part 16, and the sharpness of this blade part 16 is formed sharper than the sharpness of the blade part 9 of the above-mentioned lower blade 2. Yes. In order to make the sharpness of the blade portion 16 of the upper blade 4 sharper than the sharpness of the blade portion 9 of the lower blade 2, as described above, the sharpness of the blade portion 9 of the lower blade 2 is changed to the blade portion 16 of the upper blade 4. Is relatively dull. That is, the sharpness of the blade portion 16 of the upper blade 4 is sharpened to a normal sharpness as the punching die 1.

The upper blade 4 is disposed in the upper slit in the upper slit forming portion 14 and is provided so as to advance and retreat from the upper slit in the upper slit forming portion 14 toward the lower slit in the lower slit forming portion 8. ing.
Next, an embodiment of a method for producing an adhesive sheet of the present invention will be described with respect to a method for carrying out using the punching die 1 described above.

The adhesive sheet 5 used in this method is not particularly limited. For example, the adhesive sheet 5 is used to form an insulating layer of a printed circuit board, and a resin layer 21, an adhesive layer 22, and a release layer 23 are sequentially laminated. .
The resin layer 21 is not particularly limited, and has well-known electrical insulation and flexibility and is generally used as an insulation layer of a printed circuit board. For example, polyimide resin, acrylic resin, polyether nitrile It consists of resin films such as resin, polyether sulfone resin, polyester resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. Moreover, the thickness of the resin layer 21 is 15-30 micrometers, for example.

Moreover, the well-known thing normally used as the adhesive bond layer 22 as an adhesive bond layer of a wiring circuit board is used. For example, an adhesive such as an epoxy adhesive, a polyimide adhesive, or an acrylic adhesive is applied. Moreover, the thickness of the adhesive bond layer 22 is 10-20 micrometers, for example.
As the release layer 23, a known layer that is usually used as a separator is used. For example, the surface of a film such as a polyethylene terephthalate film or paper is made by performing a release treatment such as a silicone treatment. Moreover, the thickness of the release layer 23 is 10-100 micrometers, for example.

Such an adhesive sheet 5 forms the adhesive layer 22 by applying the above-described adhesive on the surface of the resin layer 21, and the release layer 23 is adhered to the surface of the adhesive layer 22. Is formed.
In this method, first, as shown in FIG. 1A, the above-described adhesive sheet 5 is placed on the mounting table 7 of the lower blade 2 while the upper blade 4 is retracted into the upper slit forming portion 14. Is placed between the lower surface 12 of the presser block 13 of the stripper plate 3 and the upper surface 6 of the mounting table 7 of the lower blade 2. The adhesive sheet 5 is sandwiched. In FIG. 1A, the release layer 23 is placed so as to be in contact with the upper surface 6 of the mounting table 7, but the reverse, that is, the resin layer 21 is in contact with the upper surface 6 of the mounting table 7. It may be mounted as follows. However, if the release layer 23 is placed so as to be in contact with the upper surface 6 of the placement table 7, the upper blade 4 sequentially penetrates the resin layer 21, the adhesive layer 22 and the release layer 23. The adhesion of the adhesive layer 22 to the cut surface 24 can be reduced.

Next, the upper blade 4 in the upper slit forming portion 14 is advanced toward the lower slit forming portion 8 in the lower blade 2 so as to penetrate the adhesive sheet 5.
When the blade portion 16 of the upper blade 4 comes into contact with the resin layer 21 of the adhesive sheet 5, the release layer 23 of the adhesive sheet 5 faces the blade portion 9 of the lower blade 2 as shown in FIG. Pressed.
Here, for example, when the cutting edge 16 of the upper blade 4 is sharp like the cutting edge 9 of the lower blade 2, the release layer 23 of the adhesive sheet 5 is the lower blade as shown in FIG. It is cut by two blade portions 9. Then, since the adhesive sheet 5 is cut downward (escapes) by the amount of cutting, the adhesive layer 22 is subjected to shear stress received from the blade portion 16 of the upper blade 4 as shown in FIG. As shown in FIG. 3, the upper blade 4 is stretched in the advancing direction (downward) due to its viscosity. As a result, as shown in FIG. 4C, the adhesive layer 22 becomes a burr 26 on the cut surface 24 of the adhesive sheet 5 after being punched out by the upper blade 4.

  However, in this punching die 1, the sharpness of the blade portion 9 of the lower blade 2 is formed to be duller than the sharpness of the blade portion 16 of the upper blade 4. Therefore, as shown in FIG. 3A, the blade portion 16 of the upper blade 4 comes into contact with the resin layer 21 of the adhesive sheet 5, and the release layer 23 of the adhesive sheet 5 contacts the blade portion 9 of the lower blade 2. Even when pressed, the release layer 23 of the adhesive sheet 5 is reduced from being cut by the blade portion 9 of the lower blade 2 as described above, so that the upper surface 6 of the mounting table 7 of the lower blade 2 is used. As shown in FIG. 3B, the adhesive sheet 5 is smoothly punched out by the blade portion 16 of the upper blade 4 and the blade portion 9 of the lower blade 2 while being fixed in a state closer to the horizontal direction. Thus, the through hole 25 is formed in the adhesive sheet 5.

  That is, when punched in this way, the blade portion 16 of the upper blade 4 comes into contact with the adhesive sheet 5 and the adhesive sheet 5 is pressed toward the upper surface 6 of the mounting table 7 of the lower blade 2. In the mold 1, before the release layer 23 is punched over the entire thickness direction by the blade portion 9 of the lower blade 2, the blade portion 16 of the upper blade 4 removes the resin layer 21 and the adhesive layer 22 in all the thickness directions. 3 (see FIG. 3A), the resin layer 21 and the adhesive layer are formed by the blade portion 16 of the upper blade 4 while the release layer 23 is supported by the upper surface 6 of the mounting table 7 of the lower blade 2. 22 can be punched out. Therefore, generation | occurrence | production of the burr | flash 26 of the adhesive bond layer 22 can be prevented reliably.

And according to such a method, generation | occurrence | production of the burr | flash 26 of the adhesive bond layer 22 is effective by the simple structure which makes the sharpness of the blade part 9 of the lower blade 2 duller than the sharpness of the blade part 16 of the upper blade 4. The cost can be reduced by eliminating the need for a special configuration such as projecting a cutting blade.
In this method, at least before the release layer 23 is punched by 50% in the thickness direction by the blade portion 9 of the lower blade 2, the blade portion 16 of the upper blade 4 has the resin layer 21 and the adhesive layer 22. It is preferable to punch out all over the thickness direction.

And this method is used suitably in order to process the insulating layer of a printed circuit board. In particular, a process of attaching a cover insulating layer made of the resin layer 21 to which the adhesive layer 22 is applied, to the base insulating layer so as to cover the conductor pattern via the adhesive layer 22 after the hole is processed in advance. Is preferably used in a method for manufacturing a printed circuit board including
In the above description, the upper blade 4 is a movable blade and the lower blade 2 is a fixed blade. However, in the method for manufacturing an adhesive sheet of the present invention, the upper blade 4 is a fixed blade and the lower blade 2 is a movable blade. Also good.

  In the above description, the upper blade 4 is the first blade and the lower blade 2 is the second blade. However, in the method for manufacturing an adhesive sheet of the present invention, the upper blade 4 is the second blade, and the lower blade 2 is the second blade. It is good also as a 1st blade.

Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. However, the present invention is not limited to the examples and comparative examples.
Production of Adhesive Sheet A 40 μm thick release film (polyethylene terephthalate film whose surface is treated with silicone), a 15 μm thick adhesive layer (epoxy adhesive layer), and a 25 μm thick polyimide film are sequentially laminated to form a wiring circuit. An adhesive sheet used as an insulating cover layer for the substrate was produced.

Example 1
The adhesive sheet obtained by the above was mounted on the upper surface of the mounting table of the lower blade so as to straddle the lower slit forming portion using a punching die configured under the following conditions. Then, the mounted adhesive sheet was clamped between the lower surface of the presser block of the stripper plate and the upper surface of the mounting table of the lower blade. Next, the upper blade in the upper slit forming portion was advanced toward the lower slit forming portion of the lower blade so as to penetrate the adhesive sheet, and the adhesive sheet was punched to form a through hole in the adhesive sheet.

When the cut surface of the through hole was observed with an electron microscope, it was confirmed that the adhesive layer had no burrs.
(Configuration of the punching die: A mode in which the cutting edge of the lower blade is rounded)
Upper blade edge: No treatment (curvature radius R = 0mm)
Lower blade edge: Diamond blasting (curvature radius R = 0.015 mm)
Shape of upper slit and lower slit (in plan view): Distance between outer peripheral surface of rectangular upper blade of 5 mm × 30 mm and inner peripheral surfaces of upper slit forming portion and lower slit forming portion: 3 μm
Example 2
The adhesive sheet was punched out in the same manner as in Example 1 except that a punching die configured under the following conditions was used, and a through hole was formed in the adhesive sheet.

When the cut surface of the through hole was observed with an electron microscope, it was confirmed that the adhesive layer had no burrs.
(Configuration of punching die: A mode in which an inclined surface is formed on the blade portion of the lower blade)
Blade portion of upper blade: No treatment (length of inclined surface C = 0 mm)
Lower blade edge: taper treatment by polishing (angle of inclined surface 2 °, length C = 0.5 mm)
Shape of upper slit and lower slit (in plan view): Distance between outer peripheral surface of rectangular upper blade of 5 mm × 30 mm and inner peripheral surfaces of upper slit forming portion and lower slit forming portion: 3 μm
Example 3
The adhesive sheet was punched out in the same manner as in Example 1 except that a punching die configured under the following conditions was used, and a through hole was formed in the adhesive sheet.

When the cut surface of the through hole was observed with an electron microscope, it was confirmed that the adhesive layer had no burrs.
(Configuration of punching die: A mode in which a coating layer is formed on the blade portion of the lower blade)
Upper blade edge: No treatment (no coating layer)
Lower blade part: A vinyl chloride resin sheet is stuck to the lower blade part via an adhesive layer (total thickness of sheet and adhesive layer 100 μm), and then punched with an upper blade. Slit shape (plan view): Distance between the outer peripheral surface of a rectangular upper blade of 5 mm × 30 mm and the inner peripheral surfaces of the upper slit forming portion and the lower slit forming portion: 3 μm
Comparative Example 1
The adhesive sheet was punched out in the same manner as in Example 1 except that a punching die configured under the following conditions was used, and a through hole was formed in the adhesive sheet.

When the cut surface of the through hole was observed with an electron microscope, it was confirmed that the adhesive layer had burrs.
(Configuration of the punching die: an aspect in which the blade portion of the upper blade and the blade portion of the lower blade have the same sharpness)
Blade portion of upper blade: No treatment (curvature radius R = 0 mm, inclined surface length C = 0 mm)
Lower blade part: No treatment (curvature radius R = 0 mm, inclined surface length C = 0 mm)
Shape of upper slit and lower slit (plan view): Distance between outer peripheral surface of rectangular upper blade of 5 mm × 30 mm and inner peripheral surface of upper slit forming portion and lower slit forming portion: 12 μm

It is a principal part block diagram which shows one Embodiment of the punching die of this invention, Comprising: (a) is the state before punching of an adhesive sheet, (b) shows the state after punching of an adhesive sheet. It is a principal part block diagram which shows the lower blade of the punching die shown in FIG. 1, Comprising: (a) is the aspect which forms roundness in a blade part, (b) is the aspect which forms an inclined surface in a blade part, (C) shows the aspect which forms a coating layer in a blade part. It is explanatory drawing which shows the state which punches an adhesive sheet with the punching die shown in FIG. 1, Comprising: (a) is the state in the middle of punching, (b) is the state of the cut surface (side cross section) after punching, (C) shows the state of the cut surface (positive cross section) after punching. It is explanatory drawing which shows the state which punches an adhesive sheet with the punching die which the blade part of an upper blade and the blade part of a lower blade are the same sharpness, Comprising: (a) is the state in the middle of punching, (b) The state of the cut surface (side cross section) after punching, (c) shows the state of the cut surface (normal cross section) after punching.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Punching die 2 Lower blade 4 Upper blade 5 Adhesive sheet 21 Resin layer 22 Adhesive layer 23 Release layer

Claims (7)

A method for producing an adhesive sheet comprising a step of punching an adhesive sheet in which a resin layer, an adhesive layer and a release layer are sequentially laminated with a punching die having a first blade and a second blade facing each other. And
In the punching die, the sharpness of the second blade is formed to be duller than the sharpness of the first blade. The first blade is a movable blade, and the second blade is a fixed blade;
The adhesive sheet is placed on the second blade, and the first blade is moved toward the second blade so as to penetrate the adhesive sheet to form a hole in the adhesive sheet. The manufacturing method of the adhesive sheet of Claim 1 characterized by the above-mentioned.   The punching die includes a sandwiching member that sandwiches the adhesive sheet with the second blade and is formed with an insertion portion through which the first blade is movably inserted. The outer periphery of the first blade The method for manufacturing an adhesive sheet according to claim 2, wherein a distance between the surface and the inner peripheral surface of the insertion portion is 0.5 to 7 µm. A method for producing an adhesive sheet comprising a step of punching an adhesive sheet in which a resin layer, an adhesive layer and a release layer are sequentially laminated with a punching die having a first blade and a second blade facing each other. And
The first blade is a movable blade, and the second blade is a fixed blade;
Placing the adhesive sheet on the second blade, and moving the first blade toward the second blade so as to penetrate the adhesive sheet;
When the first blade comes into contact with the adhesive sheet and the adhesive sheet is pressed toward the second blade, one of the resin layer and the release layer is formed by the second blade. Before being punched across the thickness direction,
The method for producing an adhesive sheet, wherein the first blade punches out the other layer and the adhesive layer all over the thickness direction.   The method for manufacturing an adhesive sheet according to claim 1, wherein the resin layer is an insulating layer of a printed circuit board. A punching die comprising a first blade and a second blade facing each other,
A punching die, wherein the sharpness of the second blade is formed to be duller than the sharpness of the first blade. The first blade is a movable blade, and the second blade is a fixed blade;
A sandwiching member is formed in which an adhesive sheet is sandwiched between the second blade and an insertion portion through which the first blade is movably inserted is formed.
The punching die according to claim 6, wherein an interval between an outer peripheral surface of the first blade and an inner peripheral surface of the insertion portion is 0.5 to 7 µm.

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