JP2006018371A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card equipped with a substrate, an external terminal arranged at one side of the substrate and an IC module arranged on the opposite side face of the external terminal of the substrate, and equipped with an IC chip for performing contact type data communication through the external terminal with an external data reading device, and to provide an IC card for improving the strength of a card substrate and the IC module by improving the shape of the bottom face of the IC module in a manufacturing process, the recess shape of the spot facing of the card substrate and the bonding method of the interface, and for preventing the occurrence of any failure by preventing such breakdown as the invalidity of the use of the IC chip when a physical load is imposed due to the external force of the IC card. <P>SOLUTION: An IC module is buried in the recess of a card substrate so that an IC chip can be arranged inside and an external terminal can be arranged on a card external surface, wherein an elastic sheet is arranged between at least the IC chip of the recess and the card substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC card in which an IC chip is mounted on a card substrate on which a recess for mounting an IC module is formed, in which the IC chip mounted on the IC module is protected from external force and the strength is improved.

  The structure of the conventional IC card (1) will be described. The structure is composed of a card base (2) having a recess (24) and an IC module (3) accommodated in the recess. The card substrate (2) has a laminated structure in which a plurality of surface oversheets, core sheets, backside oversheets, and the like are adhered in order from the front surface. The IC module (3) has an IC chip (31) mounted on the lower surface of the substrate (30), a terminal portion (33) formed on the upper surface of the substrate (30), a terminal portion (33), and the IC chip (31). After forming the wiring circuit through the conductive connection part (32) such as wire bonding, the IC chip and the conductive connection part are formed from the resin sealing part (34) covered with an insulating resin, or the resin sealing is performed. The IC chip and / or the solder conductive connection part (32a) is formed from a bare one (hereinafter referred to as a bare chip) (not shown, see FIGS. 1 and 2).

Next, a method for manufacturing the IC card (1) will be described. The manufacturing method was as follows. First, in the card substrate (2), a core sheet such as non-crystalline thermoplastic PET-G resin was collated, and a core sheet was produced by laminating. Next, after the front oversheet and the back oversheet are temporarily bonded together, a sheet is prepared by secondary laminating by heating and pressing under the conditions of 125 to 145 ° C., press pressure of 15 to 35 kg / cm ² , and 10 to 30 minutes. To do. Next, a card base material (2) is produced by punching the sheet into a predetermined shape using a punching die. Next, it carves out into the predetermined position on the surface of a card | curd base material using an engraving machine, and a recessed part (24) is formed.

  Next, an IC module (3) is produced. After mounting the IC chip (31) on the substrate (30), it is connected to the terminal portion (33) formed on the back side of the substrate by wire bonding through the through hole formed in the substrate (30), or the substrate (30) After connecting the IC chip and the terminal portion (33) by connection with a terminal for soldering or the like formed on the substrate surface by solder connection or the like through a via conduction path passing through (30), the IC chip and the conductive connection surface A bare chip embedded portion (34a) is formed without resin sealing portion (34) or resin sealing. In addition, the shape of the resin sealing part (34) or the embedding part (34a) is formed from the convex part (35).

  In the next step, the resin sealing part (34) of the IC module (3) or the convex part (35) of the embedded part (34a) is inserted into the concave part (24) to complete the IC card (1).

  In recent years, an IC card (1) having an IC module has been used in many fields due to its convenience. In particular, it is spreading as an information recording medium. On the other hand, various proposals for improving the physical strength of the IC card itself have been made. For example, the strength of the card base material (2) and its layer structure surface are improved or the strength of the IC module material and its layer structure surface is improved. However, the IC module has a problem that its physical strength is weak and it is easily damaged when an external force is applied.

In order to solve the above problem, a method of using a filler or the like in the gap at the interface between the concave portion of the card base and the convex portion of the bottom surface of the IC module has been proposed. In this method, there is a problem that the process becomes complicated, for example, the degree of sealing in the gap does not increase. Furthermore, it has been carried out to improve the strength of the card base such as devising the structure of the IC module and improving its strength or devising the countersink shape, but it is still insufficient (Patent Document 1). reference).

The known literature is described below.
JP 11-34555 A

  The object of the present invention is to improve the strength of the card base and the IC module by improving the shape of the bottom of the IC module in the manufacturing process, the concave shape of the countersink of the card base, and the bonding method at the interface. The purpose of the present invention is to provide an IC card in which failure or failure does not occur, such as preventing the IC chip from being unusable when the IC card is physically loaded by an external force.

  According to a first aspect of the present invention, there is provided a substrate, an external terminal provided on one side of the substrate, and an external data read / write through the external terminal provided on a surface opposite to the external terminal of the substrate. In an IC card including an IC module having an IC chip that performs contact-type data communication with an apparatus, the IC module is arranged in the concave portion of the card base, with the IC chip inside and the external terminal arranged on the outer surface of the card. And an elastic sheet is disposed between at least the IC chip and the card substrate in the recess.

  In the invention according to claim 2 of the present invention, a rubber elastic resin liquid or gas having a shock absorbing property is sealed in a hollow rubber elastic resin film container in a gap between the IC module and the card substrate in the recess, 2. The IC card according to claim 1, wherein a shock-absorbing sealing portion having shock-absorbing properties is formed by inserting a sealed rubber elastic resin film container into the gap.

  The invention according to claim 3 of the present invention is characterized in that the shape of the concave portion is the same as the shape of the elastic sheet portion of the IC module or the surface portion on the side of the shock absorbing sealing portion. Or it is an IC card of 2.

  According to the IC card of claim 1, the elastic resin sheet portion having shock absorption is formed on the inner surface portion of the concave portion of the card base and / or the surface portion on the resin sealing portion side of the IC module, and the card. By mounting the concave portion of the base material and the surface portion on the resin sealing portion side of the IC module through the adhesive layer, the durability under external pressure such as impact is improved, and therefore the IC module and the IC chip are destroyed. There is an effect of reducing failures.

  According to the IC card of the second aspect, a rubber elastic resin liquid or gas having a shock absorbing property is sealed in a hollow elastic film container in the gap formed between the IC module and the concave portion of the card base. By forming the impact-absorbing sealing portion by confining it in the gap, durability under an external pressure such as impact is improved, so that there is an effect that failure due to destruction of the IC module and the IC chip can be reduced.

  According to the IC card of claim 3, the external pressure applied to the IC chip of the IC module is dispersed by making the shape of the concave portion of the card substrate the same as the shape of the surface portion of the convex portion of the IC module. Therefore, the damage of the IC chip and the conductive connection portion is reduced, so that the failure due to the destruction of the IC module and the IC chip can be reduced.

  Hereinafter, embodiments of the present invention will be described in detail.

  FIG. 1 is a plan view for explaining an embodiment of an IC card according to the present invention, in which a is an overall plan view, b is a partially enlarged side sectional view of an IC module, and c is a card substrate. It is side sectional drawing which mounted | wore the IC module in the recessed part.

  In the IC card (1) shown in FIG. 1a, the IC module is mounted at a predetermined position on the card base for the IC card. The cross-sectional views described below are side cross-sectional views in the vicinity of the IC module center portion (AA). A terminal portion (33) is formed on the surface of the IC module. The terminal portion is a terminal for inputting / outputting information to / from an external electronic device, and has a role of transmitting to an IC chip mounted on the back surface of the substrate of the IC module via the terminal portion.

  FIG. 1b is an enlarged side sectional view of the IC module. The IC module (3) has an IC chip (31) mounted on one surface (the back surface in the drawing) of the substrate on the substrate (30). Moreover, the terminal part (33) is formed in the other surface (surface on drawing) of a board | substrate. The IC chip is connected to the terminal portion (33) through the conductive connection portion (32) in the opening hole opened on the back surface side of the substrate to form a wiring circuit. The conduction connecting portion (32) is made of wire bonding or a via conduction path. Next, in order to protect the wiring circuit, a resin sealing portion (34) is formed on the surface of the IC chip and the conductive connection portion and covers the surface. Or it may be a bare chip without resin sealing.

  Next, in order to protect the IC module from an external force such as external impact, an elastic sheet portion (on the upper surface of the resin sealing portion (34) or the embedding portion (34a) of the IC chip on the back side of the substrate and the conductive connection portion is provided. 36) is formed. The elastic sheet portion (36) is a resin sheet composed of at least one kind having different shock absorption characteristics and different characteristics, and a plurality of kinds are combined to form a plurality of sheets.

  The rubber-elastic resin of the elastic sheet portion (36) will be described. Rubber elastic resin components include organic rubber resins such as silicone, polybutadiene and acrylic elastomer, natural rubber resins such as chlorinated rubber used in inks and insulating varnishes, hydrochloric acid rubber used in chemical resistant films, ultraviolet rays, etc. A cyclized rubber or the like to be cross-linked is used as a main agent, and an additive for adding flexibility, for example, colloidal fine particles such as silica may be added as a filler. Furthermore, in the solution, rubber-elastic 100 μm to 1000 μm spherical particles and a foaming agent such as Uniform AZ (trade name, manufactured by Otsuka Chemical Co., Ltd.) may be added. When reinforcing the strength, glass epoxy, paper phenol, BT resin, or the like used for the printed wiring board may be used.

  Next, in the method of forming the shape of the elastic sheet portion (36), a punched resin sheet is produced in a predetermined shape using a sheet punching die, and after collating, the layers are laminated. Or after laminating | stacking an elastic sheet layer, the unnecessary part of the base material of this elastic sheet layer may be scraped off using an engraving machine, and an elastic sheet layer may be formed. Alternatively, the elastic sheet layer formed by adding a diazide-based sensitizer may be irradiated with ultraviolet rays through a predetermined mask to crosslink necessary portions to form an elastic sheet layer.

  Next, a card substrate in which a recess for mounting an IC module is formed on the surface of the card substrate will be described. The shape of the recess is formed to match the outer shape of the elastic sheet portion (36) of the IC module. An elastic sheet part (36) may be formed in the inner surface part of the said recessed part.

Next, FIG. 1c is an IC card mounted on the concave portion (24) of the card substrate through an adhesive layer applied to the front portion of the elastic sheet portion (36) of the IC module (3). An adhesive layer (11) is formed on the inner surface portion of the concave portion (24) of the card base and the surface portion of the elastic sheet portion (36) of the IC module, and the concave portion and the surface portion of the IC module are interposed via the adhesive layer. It is installed. That is, the IC module is firmly attached and mounted on the card substrate with the elastic sheet portion (36) interposed therebetween.

  When a part of the elastic sheet portion (36) uses glass epoxy, paper phenol, BT resin, or the like, the IC chip and the conductive connection portion are protected inside the card base and the elastic sheet portion (36). It can be expected that the effect is not affected by the external environment. Further, there is an effect that the elastic sheet portion (36) is reinforced.

  Since the card substrate (2), the substrate (30), and the resin sealing portion (34) in the drawing are known materials such as general-purpose materials, explanations and the like are omitted.

  FIG. 2 is a plan view for explaining an embodiment of the IC card of the present invention, in which a is a substrate on which an IC chip is mounted, b is a side sectional view of a partially enlarged IC module, and c is It is a sectional side view which mounted | worn the IC module in the recessed part of the card base material.

  The IC chip (31) shown in FIG. 2a is mounted at a predetermined position on the substrate (30). Terminal portions (33) are formed on the surface of the substrate (30). The terminal portion (33) is connected to the IC chip (31) on the back surface of the substrate through a solder conductive connection portion (32a) penetrating the substrate. Note that the lower part of the drawing (the IC chip side on the back side of the substrate) was the embedded part (34a) of the IC module. The terminal part (33) is a terminal for inputting / outputting information to / from an external electronic device, and transmits the information to the IC chip (31) mounted on the back surface of the substrate via the conductive connection part (32a) of the solder. is there. The embedded portion (34a) is not formed with a resin sealing portion and is in a bare state.

  FIG. 2b is an enlarged side sectional view of the IC module. The IC module (3) has an IC chip (31) mounted on one surface (the back surface in the drawing) of the substrate on the substrate (30). Moreover, the terminal part (33) is formed in the other surface (surface on drawing) of a board | substrate. Next, in order to protect the IC module from an external force such as an external impact, an elastic sheet portion (36) is provided on the upper surface of the embedded portion (34a) including the IC chip and the solder connection portion (32a) on the back side of the substrate. Is formed. The elastic sheet portion (36) is fixed to the substrate (30) through the adhesive layer (11). Therefore, the bare chip is in a state of being sealed by the elastic sheet portion (36), and there is an effect that the influence from the outside can be regulated to the minimum. The elastic sheet portion (36) is a resin sheet composed of at least one kind having different shock absorption characteristics and different characteristics, and a plurality of kinds are combined to form a plurality of sheets. As shown in the figure, there is a gap (14) between the bare chip IC chip and the elastic sheet (36).

  Next, a card substrate in which a recess for mounting an IC module is formed on the surface of the card substrate will be described. The shape of the recess is formed to match the outer shape of the elastic sheet portion (36) of the IC module. An elastic sheet part (36) may be formed in the inner surface part of the said recessed part.

Next, FIG. 2c is an IC card mounted on the concave portion (24) of the card substrate through an adhesive layer applied to the front portion of the elastic sheet portion (36) of the IC module (3). An adhesive layer (11) is formed on the inner surface portion of the concave portion (24) of the card base and the surface portion of the elastic sheet portion (36) of the IC module, and the concave portion and the surface portion of the IC module are interposed via the adhesive layer. It is installed. That is, the IC module is firmly attached and mounted on the card substrate with the elastic sheet portion (36) interposed therebetween. In the IC module of FIG. 2, the terminal part (33) is formed on the surface of the substrate (30), and the IC chip, the gap (14), and the elastic sheet part (36) are formed on the back surface of the substrate (30). They are formed in order.

  When the external shock resistance is further strengthened, a shock absorbing sealing portion (26) having a sealed shock absorbing property may be additionally formed in the gap portion (14). The shock absorbing sealing portion (26) may be a hollow elastic film container (27) formed in advance by blow molding or the like in which a rubber elastic resin liquid or gas is sealed and the inlet is sealed. . In this IC module, a terminal portion (33) is formed on the surface of the substrate (30), and an IC chip, an impact absorbing sealing portion (26), and an elastic sheet portion (36) are formed on the back surface of the substrate (30). They are formed in that order. That is, the void portion (14) in FIG. 2 is changed to the shock absorbing sealing portion (26).

  FIG. 3 shows an IC card in which an IC module (3) is mounted in the recess (24) of the card base. There is a space between the card substrate (3) and the IC module (3), and in the gap (14), a rubber elastic resin liquid or gas having shock absorption properties is sealed and sealed in the gap. It is an IC card in which a shock absorbing sealing part (26) having absorptivity is formed. The shock absorbing sealing portion (26) may seal a predetermined volume of liquid or gas in a hollow elastic film container (27) formed by blow molding or the like in advance, for example, a rubber balloon. Alternatively, a hollow film container is produced such that the outer surface shape is the shape of the inner surface of the gap portion (14), such as blow molding, and the hollow film container is placed in the concave portion (24) of the card substrate (3), After mounting with the IC module (3), a rubber elastic resin liquid or gas pressurized to a predetermined pressure from the injection port of the hollow elastic film container (27) may be sealed and the injection port may be sealed.

  Next, another method will be described. The shock absorbing sealing portion (26) may seal a liquid or gas in a hollow elastic film container (27) formed in advance by blow molding or the like. A hollow film container is produced so that the shape of the outer surface of the hollow elastic film container (27) such as blow molding is the shape of the inner surface of the gap (14), and a predetermined rubber elastic resin liquid or gas is hollowed out. A film container sealed in an elastic film container (27) is prepared in advance. Next, the sealed film container (27) and IC module (3) were placed in the concave portion of the card base. The gap portion (14) is an IC card in which a shock absorbing sealing portion (26) having shock absorbing properties is formed.

  FIG. 4 shows an IC card in which the shape of the concave portion of the card base is the same as the shape of the surface portion on the elastic sheet portion side of the IC module. The joint surface of the concave portion (24) is formed at a uniform distance from the convex portion (35) that is the outer shape of the IC module, and when an external force is applied, the external force is received on all the joint surfaces, so that the external force is Distributed.

  In the adhesive layer (11), there are a case where the adhesive layer (11) is applied and formed on the entire surface of the adhesive surface, a case where the adhesive layer (11) is applied and formed in a lattice shape or a halftone dot shape, or a case where the adhesive layer (11) is applied and formed at one point near the center of the adhesive surface. It is preferable to appropriately form the adhesive layer (11) with an optimum application shape.

  Examples will be described below. The IC card of the present invention according to claim 1 and claim 2 was manufactured.

  The IC card of the present invention according to claim 1 was manufactured. As the card substrate (2) having a thickness of 0.75 mm and the IC module (3), those conventionally used in general are used. In addition, the IC module (3) used four types, one having a resin sealing portion, one having no resin sealing portion, wire bonding, and solder connection.

An elastic sheet portion having shock absorption was formed. Two types of materials were used: a 0.05 mm thick silicone-based elastic sheet with excellent shock absorption and a 0.05 mm thick vinyl chloride resin sheet. The order of stacking is to stack two 0.05 mm thick silicone elastic sheets with excellent shock absorption on the bottom layer and collate with 0.05 mm thick vinyl chloride resin sheet on top of each other, then each sheet Was punched into a predetermined shape using a punching die. In the punching die, the outer shape was made to match the inner surface shape of the concave portion of the card substrate, and the inner shape was made to match the outer surface shape of the convex portion of the IC module.

Next, it collated again in the order of the said lamination | stacking on the resin sealing part (34) surface of IC module (3), and each laminated | stacked through the contact bonding layer between sheets, and formed the elastic sheet part.
Next, a recess (24) is formed at a predetermined position on the surface of the card substrate.

  The card base (2) was cut out by using an engraving machine at the IC module storage position to form a concave portion inner surface portion having a depth of 0.25 mm.

  An adhesive layer is applied to the entire surface of the concave portion (24) of the card base and the convex portion (35) of the elastic sheet portion of the IC module, and the IC module (3) is connected to the card base (2 via the adhesive layer). 4 types of IC cards of Example 1 were completed. In this example, the adhesive layer used was trade name E4110 (manufactured by EPO-TEC Co., Ltd.).

  Using a total of four types of IC cards of Example 1 described above, an IC module strength evaluation test was performed.

Evaluation items and test methods will be described. The thermal shock test (according to JIS7022B-4) is allowed to stand for 10 cycles for 10 minutes each at low temperature (−30 ° C.) and high temperature (70 ° C.). In the bending test (JISX6303 compliant), the front side and the back side of the short side and the long side of the card are each turned 250 times in total 1000 times. In the twist test (JISX6303 compliant), the card is twisted 1000 times relatively in the front and back directions with the short side of the card as the center position. In the three-wheel test (ISO / IEC10373-3Appendex compliant), the card is inserted and removed while pressure (20 N / m ² ) is applied to the module portion of the card. In the tapping test (standard test method), the card is placed on a desk, the inner 20 mm portion is restrained from the short side on the opposite side of the module, the short side on the module side is lifted by 40 mm, and then released to collide the card on the desk. These are the above five items.

  As a result, both the IC card of Example 1 of the present invention and the IC card of Example 2 cleared the acceptance criteria, and no defects such as destruction and peeling occurred.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view explaining one Example of the IC card of this invention, a is a whole top view, b is a sectional side view of the partial expansion of an IC module, c is IC in the recessed part of a card base material It is side sectional drawing which mounted | wore with the module. BRIEF DESCRIPTION OF THE DRAWINGS It is a top view explaining one Example of the IC card of this invention, a is a board | substrate which mounted IC chip, b is a partial expanded sectional view of an IC module, c is a card | curd base material It is side sectional drawing which mounted | wore the IC module in the recessed part. FIG. 3 is a side cross-sectional view of the IC card of the present invention, in which a rubber-elastic resin having a shock absorption property is injected into the void portion of the concave portion of the card base, and the IC module is mounted. FIG. 3 is a side sectional view of the IC card of the present invention, in which the shape of the concave portion of the card base is the same as the shape of the surface portion on the elastic sheet portion side of the IC module, and the IC module is mounted.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... IC card 2 ... Card base material 3 ... IC module 11 ... Adhesive layer 12 ... Plate spring 13 ... Jig 14 ... Cavity part 24 ... Concave part 26 ... Shock absorption sealing part 27 ... (Hollow) elastic film container 30 ... Substrate 31 ... IC chip 32 ... conductive connection part 32a ... (solder) conductive connection part 33 ... terminal part 34 ... resin sealing part 34a ... embedding part 35 ... convex part 36 ... elastic sheet (layer) part

Claims (3)

  Contact data communication between the board, the external terminal provided on one side of the board, and the external data reader / writer provided on the surface opposite to the external terminal of the board. In an IC card including an IC module having an IC chip to be performed, the IC module is embedded in a recess of a card base so that the IC chip is disposed inside and the external terminal is disposed on an outer surface of the card. An IC card, wherein an elastic sheet is disposed at least between the IC chip and the card substrate.   A rubber elastic resin liquid or gas having a shock absorbing property is sealed in a hollow elastic film container in the gap between the IC module and the card base in the recess, and the sealed elastic film container is inserted into the gap. 2. The IC card according to claim 1, wherein a shock absorbing sealing portion having a shock absorbing property is formed.   3. The IC card according to claim 1, wherein the shape of the recess is the same as the shape of the elastic sheet portion of the IC module or the surface portion on the shock absorbing sealing portion side.

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