JP2006016610A5 - - Google Patents

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Publication number
JP2006016610A5
JP2006016610A5 JP2005160356A JP2005160356A JP2006016610A5 JP 2006016610 A5 JP2006016610 A5 JP 2006016610A5 JP 2005160356 A JP2005160356 A JP 2005160356A JP 2005160356 A JP2005160356 A JP 2005160356A JP 2006016610 A5 JP2006016610 A5 JP 2006016610A5
Authority
JP
Japan
Prior art keywords
resin
weight
group
acryloyl group
methacryloyl group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005160356A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006016610A (ja
JP4015668B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005160356A priority Critical patent/JP4015668B2/ja
Priority claimed from JP2005160356A external-priority patent/JP4015668B2/ja
Publication of JP2006016610A publication Critical patent/JP2006016610A/ja
Publication of JP2006016610A5 publication Critical patent/JP2006016610A5/ja
Application granted granted Critical
Publication of JP4015668B2 publication Critical patent/JP4015668B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005160356A 2004-05-31 2005-05-31 樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス Expired - Fee Related JP4015668B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005160356A JP4015668B2 (ja) 2004-05-31 2005-05-31 樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004162016 2004-05-31
JP2005160356A JP4015668B2 (ja) 2004-05-31 2005-05-31 樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007090758A Division JP2007291375A (ja) 2004-05-31 2007-03-30 樹脂組成物、接着フィルムおよび樹脂ワニス

Publications (3)

Publication Number Publication Date
JP2006016610A JP2006016610A (ja) 2006-01-19
JP2006016610A5 true JP2006016610A5 (OSRAM) 2007-02-01
JP4015668B2 JP4015668B2 (ja) 2007-11-28

Family

ID=35791158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005160356A Expired - Fee Related JP4015668B2 (ja) 2004-05-31 2005-05-31 樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス

Country Status (1)

Country Link
JP (1) JP4015668B2 (OSRAM)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007291375A (ja) * 2004-05-31 2007-11-08 Sumitomo Bakelite Co Ltd 樹脂組成物、接着フィルムおよび樹脂ワニス
TW200710570A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure
EP1990389A4 (en) * 2006-02-27 2010-05-26 Sumitomo Bakelite Co adhesive film
JP2007258508A (ja) * 2006-03-24 2007-10-04 Sumitomo Bakelite Co Ltd 半導体用接着剤、これを用いた半導体装置および半導体装置の製造方法
JP5005258B2 (ja) * 2006-05-23 2012-08-22 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP5213313B2 (ja) * 2006-05-23 2013-06-19 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP5344802B2 (ja) * 2007-03-30 2013-11-20 リンテック株式会社 チップ用保護膜形成用シートおよび保護膜付半導体チップ
JP4959627B2 (ja) * 2007-05-25 2012-06-27 住友ベークライト株式会社 樹脂組成物、樹脂スペーサ用フィルムおよび半導体装置
JP2009009110A (ja) * 2007-05-30 2009-01-15 Sumitomo Bakelite Co Ltd 感光性接着剤樹脂組成物、接着フィルムおよび受光装置
EP2477215A3 (en) * 2007-06-12 2013-08-14 Sumitomo Bakelite Company Limited Resin composition, embedding material, insulating layer and semiconductor device
JP4091969B1 (ja) * 2007-07-12 2008-05-28 住友ベークライト株式会社 受光装置および受光装置の製造方法
JP5137538B2 (ja) * 2007-11-28 2013-02-06 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
CN101978320A (zh) * 2008-03-18 2011-02-16 住友电木株式会社 光敏树脂组合物、用于光敏树脂隔离物的膜和半导体装置
JP5532658B2 (ja) * 2008-09-04 2014-06-25 日立化成株式会社 積層体エレメント用感光性接着剤組成物、フィルム状接着剤、接着シート、及び、積層体エレメント
JP7726028B2 (ja) * 2020-11-16 2025-08-20 住友ベークライト株式会社 樹脂組成物

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