JP2006009076A - 焼結アルミニウム部材の原料用粉末混合物 - Google Patents
焼結アルミニウム部材の原料用粉末混合物 Download PDFInfo
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- JP2006009076A JP2006009076A JP2004186112A JP2004186112A JP2006009076A JP 2006009076 A JP2006009076 A JP 2006009076A JP 2004186112 A JP2004186112 A JP 2004186112A JP 2004186112 A JP2004186112 A JP 2004186112A JP 2006009076 A JP2006009076 A JP 2006009076A
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- 239000000843 powder Substances 0.000 title claims abstract description 114
- 239000000203 mixture Substances 0.000 title claims abstract description 38
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 32
- 229910052782 aluminium Inorganic materials 0.000 title claims description 27
- 239000002994 raw material Substances 0.000 title claims description 25
- 238000005245 sintering Methods 0.000 claims abstract description 62
- 230000005496 eutectics Effects 0.000 claims abstract description 37
- 239000007791 liquid phase Substances 0.000 claims abstract description 36
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 31
- 239000000956 alloy Substances 0.000 claims abstract description 31
- 238000006243 chemical reaction Methods 0.000 claims abstract description 17
- 239000006023 eutectic alloy Substances 0.000 claims abstract description 14
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 12
- 239000011812 mixed powder Substances 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 20
- 238000000034 method Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 description 17
- 230000008018 melting Effects 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 229910000676 Si alloy Inorganic materials 0.000 description 5
- 238000000280 densification Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000011777 magnesium Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 238000010587 phase diagram Methods 0.000 description 5
- 229910000861 Mg alloy Inorganic materials 0.000 description 4
- -1 aluminum-magnesium-silicon Chemical compound 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229940126062 Compound A Drugs 0.000 description 3
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 3
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 3
- 229910002056 binary alloy Inorganic materials 0.000 description 3
- 238000013001 point bending Methods 0.000 description 3
- 229910018725 Sn—Al Inorganic materials 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- 229910019043 CoSn Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910012381 LiSn Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910019021 Mg 2 Sn Inorganic materials 0.000 description 1
- 229910002847 PtSn Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- OWXLRKWPEIAGAT-UHFFFAOYSA-N [Mg].[Cu] Chemical compound [Mg].[Cu] OWXLRKWPEIAGAT-UHFFFAOYSA-N 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
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- Powder Metallurgy (AREA)
Abstract
【課題を解決するための手段】Alを主成分とする合金粉末または混合粉末に、Snを主成分とし、Snと他の元素との間、あるいはSnと他の元素との金属間化合物との間で共晶型合金を形成する組成の共晶型合金粉末の少なくとも1種、または、共晶反応を生じてSnの共晶液相を発生する組成の偏晶型合金粉末の少なくとも1種からなる焼結助剤粉末を0.01〜0.5質量%添加する。
【選択図】図1
Description
また、このような低融点金属の液相はアルミニウム粉末またはアルミニウム合金粉末表面の酸化被膜を除去して焼結の進行を促進する作用を有する。特許文献7に記載のSnはこのような特性を有する元素で、特許文献7に記載されているようなAlと合金化して素地を強化するというもう一つの効果は実際には有しないものの焼結性改善の点で優れた効果を発揮する元素である。
本願はこの観点より、Snより低い温度で液相が発生するとともに長い間液相が維持される物質として、Snの共晶型合金およびSnの共晶反応液相が発生する偏晶型合金を用いることを骨子とする。
これは、未添加の場合でも生じる液相成分は、焼結過程でアルミニウム基地に拡散して焼結途上で消失するため、液相収縮の効果が焼結工程の一部にしか作用しないのに対し、焼結助剤粉末を添加した試料では、焼結助剤粉末による液相が焼結工程のほとんどの部分で存在することによって液相収縮の効果が焼結工程を通じてもたらされることによると考えられる。しかし、焼結助剤粉末の添加量が0.5質量%を超える試料番号06の試料では、焼結助剤粉末の添加量が多すぎてアルミニウム合金基地の粒界に焼結助剤成分が析出して強度の低下が生じることが確認された。また、試料番号04、07および08により、焼結助剤粉末の種類を替えても同様にその効果を有することが確認された。
Claims (4)
- Alを主成分とする合金粉末または混合粉末に、Snを主成分とし、Snと他の元素との間、あるいはSnと他の元素との金属間化合物との間で共晶反応線を有する組成の共晶型合金粉末の少なくとも1種からなる焼結助剤粉末を0.01〜0.5質量%添加したことを特徴とする焼結アルミニウム部材の原料用粉末混合物。
- Alを主成分とする合金粉末または混合粉末に、Snを主成分とし、Snと他の元素との間、あるいはSnと他の元素との金属間化合物との間でSnの共晶液相を発生する組成の偏晶型合金粉末の少なくとも1種からなる焼結助剤粉末を0.01〜0.5質量%添加したことを特徴とする焼結アルミニウム部材の原料用粉末混合物。
- 請求項1に記載の焼結助剤が、鉛フリーはんだであることを特徴とする焼結アルミニウム部材の原料用粉末混合物。
- Alを主成分とする合金粉末または混合粉末に、請求項1から3のいずれかに記載の焼結助剤粉末を少なくとも2種以上用いるとともに、総量として焼結助剤粉末を0.01〜0.3質量%を添加したことを特徴とする焼結アルミニウム部材の原料用粉末混合物。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010110790A (ja) * | 2008-11-06 | 2010-05-20 | Miyachi Technos Corp | ヒュージング方法 |
WO2015034579A1 (en) * | 2013-09-05 | 2015-03-12 | Henkel IP & Holding GmbH | Metal sintering film compositions |
US10000670B2 (en) | 2012-07-30 | 2018-06-19 | Henkel IP & Holding GmbH | Silver sintering compositions with fluxing or reducing agents for metal adhesion |
US11745294B2 (en) | 2015-05-08 | 2023-09-05 | Henkel Ag & Co., Kgaa | Sinterable films and pastes and methods for use thereof |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6488875B2 (ja) | 2014-05-16 | 2019-03-27 | 三菱マテリアル株式会社 | 多孔質アルミニウム焼結体及び多孔質アルミニウム焼結体の製造方法 |
JP6488876B2 (ja) * | 2014-05-16 | 2019-03-27 | 三菱マテリアル株式会社 | 多孔質アルミニウム焼結体及び多孔質アルミニウム焼結体の製造方法 |
JP6405892B2 (ja) | 2014-10-30 | 2018-10-17 | 三菱マテリアル株式会社 | 多孔質アルミニウム焼結体及び多孔質アルミニウム焼結体の製造方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010110790A (ja) * | 2008-11-06 | 2010-05-20 | Miyachi Technos Corp | ヒュージング方法 |
US10000670B2 (en) | 2012-07-30 | 2018-06-19 | Henkel IP & Holding GmbH | Silver sintering compositions with fluxing or reducing agents for metal adhesion |
WO2015034579A1 (en) * | 2013-09-05 | 2015-03-12 | Henkel IP & Holding GmbH | Metal sintering film compositions |
JP2016536467A (ja) * | 2013-09-05 | 2016-11-24 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 金属焼結フィルム組成物 |
US11745294B2 (en) | 2015-05-08 | 2023-09-05 | Henkel Ag & Co., Kgaa | Sinterable films and pastes and methods for use thereof |
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