JP2006005321A - Convex electrode and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a convex electrode wherein an inspection probe for a wiring circuit can be easily brought into contact with an original electrode so that inspection cost can be greatly reduced and wiring density in parts can be also made high, and to provide its manufacturing method. <P>SOLUTION: In the case that the effective part 13e of a mounting land 13 is made small because of a recessed part surrounded by a solder resist film 15 overlapping the periphery of the mounting land 13 of an interposer substrate 11, the recessed part of the mounting land 13 is filled with paste containing dispersed Ag ultrafine particles, and the paste is applied over the solder resist film 15 overlapping the periphery of the mounting land 13 and heated and cured to form a conductive film 25. Then, an electroless Ni plating film 27 and an electroless Au plating film 28 are formed thereon under the existence of an absorptive type Pd catalyst, thereby forming a convex electrode 29. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a convex electrode and a method for manufacturing the same, and more particularly, can facilitate inspection of a wiring circuit in an interposer substrate, a component including a wiring substrate and a wiring circuit, and can further increase the wiring density. The present invention relates to a convex electrode and a manufacturing method thereof.

Conventionally, when a component is mounted as an LGA (land grid array) on an insulating substrate, a solder resist film is formed on the periphery of the conductive land of the insulating substrate, and the level of the surface of the conductive land is the surface of the solder resist. (See, for example, Patent Document 1). The same applies to the case where the interposer board is mounted on the wiring board. The solder resist film, which is an insulating film, is formed on the periphery of the mounting land as an electrode of the interposer board. The position is lower than the surface of the resist film. FIG. 21 is a sectional view showing a process for manufacturing such an interposer substrate.
Japanese Patent Laid-Open No. 06-152114

That is, FIG. 21A shows an interposer substrate 111 having a wiring circuit composed of wiring 112, mounting land 113, and bonding land 114, and covers the portion excluding mounting land 113 and bonding land 114 with a solder resist film 115 which is an outer insulating film. It is sectional drawing which shows the state performed. In the claims and the present specification, the mounting land 113 and the junction land 114 are used as original electrodes. This is to distinguish from the convex electrode of the present invention. Moreover, the part which is not coat | covered with the soldering resist film | membrane 115 among said raw electrodes is made into the effective part of a raw electrode. Although the mounting land 113 and the bonding land 114 are electrically connected as is apparent from the connection diagram, the upper conductive portion (to which a semiconductor chip is bonded as described later) is connected. This is referred to as “junction land”, and the lower conductive portion (which is mounted on the wiring board) is referred to as “mounting land”.

FIG. 21-B shows a state in which an adsorption-type palladium (Pd) catalyst 126 is applied to the mounting land 113 and the bonding land 114, and FIG. 21-C shows a state where the adsorption land 113 and the bonding land 114 are not in the presence of the adsorption-type Pd catalyst 126. A state in which an electrolytic nickel (Ni) plating film 127 and then an electroless gold (Au) plating film 128 are formed in an overlapping manner is shown. The adsorption type Pd catalyst 126, the electroless Ni plating film 127, and the electroless Au plating film 128 are shown to be thicker than actual. Also, the overall dimensions are not shown in a proportional relationship. The same applies to the subsequent drawings. 21-D shows the semiconductor package 110 in which the semiconductor chip 31 is bonded to the bonding land 114. FIG. As seen in FIGS. 21C and 21D, a solder resist film 115 is formed on the periphery of the mounting land 113 so as to overlap with the effective portion of the mounting land 113, that is, covered with the solder resist film 115. The part without it is narrowed. Further, the mounting land 113 is on the bottom surface of the recess, and even after the electroless Ni plating film 127 and the electroless Au plating film 128 are formed on the surface of the mounting land 113, the surface of the lowermost electroless Au plating film 128 is formed. Is lower than the surface of the solder resist film 115.

FIG. 22 is a diagram showing a state in which the tip of the probe 51 is in electrical contact with the mounting land 113 for the interposer substrate 111 and the package 110, and the wiring circuit is inspected, and FIG. FIG. 22B is a diagram of the interposer substrate 111, and FIG. 22B is a diagram of the package 110 of FIG. 21-D. FIG. 22C is a partially enlarged view of the periphery of the mounting land 113 on which the interposer substrate 111 common to the interposer substrate 111 of FIG. 22A and the package 110 of FIG. 22B is plated. As shown in FIG. 23 to be described later, the mounting lands 113 are formed at a pitch of 0.5 mm, and the diameter of the portion of the mounting lands 113 where the solder resist film 115 does not overlap, that is, the portion that is a recess, is as small as 275 μm. . Correspondingly, an expensive probe 51 with a tip having a diameter of 50 μm and a sharp tip is used. Inspection requires that the tip of the probe 51 be brought into contact with the plated mounting land 113 accurately. However, since the mounting lands 113 are provided on the interposer substrate 111, contact mistakes are likely to occur, and inspection is careful. This is a time-consuming task.

The above is an inspection for the interposer substrate 111 having a pitch of the mounting lands 113 of 0.5 mm. In the near future, the pitch of the mounting lands 113 is expected to be 0.3 mm, and the inspection at that time is extremely difficult. It is possible to become. In addition, since the area of the effective portion where the solder resist film 115 of the mounting land 113 does not overlap is small, it is difficult to ensure the mounting strength when the interposer substrate 111 is mounted on the wiring substrate.

FIG. 23 is a diagram illustrating the relationship between the wiring 112 and the mounting land 113 in the interposer substrate 111. That is, FIG. 23-A is a reprint of FIG. 21-C, and FIG. 23-B is a partially enlarged view showing the wiring 112 at the center of FIG. 22-A and the mounting lands 113 on both sides thereof. As can be seen in FIG. 23-B, the mounting land 113 has a diameter of 350 μm in order to ensure a diameter of 275 μm of an effective portion of the mounting land 113. Since the mounting lands 113 are formed at a pitch of 0.5 mm, the interval between the adjacent mounting lands 113 is 150 μm. The width of the wiring 112 is 50 μm. Therefore, if the line and space is (50/50), only one wiring 112 can be laid between the adjacent mounting lands 113.

In addition, when solder bumps are formed on the mounting lands 113 made of aluminum (Al) of the interposer substrate 111, if the solder bumps are provided directly on the mounting lands 113, the lead (Pb) component of the solder penetrates into the mounting lands 113 and Al. Zn is replaced by replacing the Al in the mounting land 113 with zinc (Zn), but the degree of Zn replacement varies depending on the line type and capacitance of the internal wiring. It is difficult to keep the degree constant. Therefore, as another method, a method of providing a solder bump after forming a titanium (Ti) thin film and a copper (Cu) thin film as a barrier on the surface of the mounting land 113 is also possible. Since the formation (for example, sputtering) is required, the manufacturing cost is increased.

The present invention has been made in view of the above-described problems. It is easy to operate a component inspection probe in contact with an original electrode, can greatly reduce the inspection cost, and can increase the wiring density in the component. It is an object to provide an electrode and a method for manufacturing the electrode.

  The above problem is solved by the structure of claim 1, claim 5, claim 6, claim 8, claim 12, or claim 13. The solution means will be described as follows.

  The convex electrode according to claim 1 is a convex electrode formed by processing an original electrode of a component which is surrounded by an outer layer insulating film overlapping at a peripheral portion and becomes a bottom surface of a recess and whose effective portion is narrowed. A conductive film formed by applying and curing a paste in which ultrafine particles of silver or copper are dispersed on the effective portion of the original electrode and the outer insulating film overlapping the peripheral edge of the original electrode And an electroless nickel plating film formed in the presence of an adsorption-type palladium catalyst on the conductive film and an electroless gold plating film formed in an overlapping manner, and the surface level of the convex electrode is The projected area of the convex electrode on the principal plane of the component is the same as the surface of the outer insulating film overlapping at the peripheral edge or protruding from the surface of the outer insulating film, and the effective portion of the original electrode Larger than the area of Is shall.

  Such a convex electrode has a surface level of the convex electrode connected to the original electrode of the component equivalent to the surface of the outer insulating film overlapping the peripheral edge of the original electrode or protruded from the surface of the outer insulating film. In addition, since the projected area of the convex electrode on the main plane of the component is larger than the area of the effective portion of the original electrode, the inspection of the wiring circuit using the probe is extremely facilitated. Further, since the area of the convex electrodes is large, the diameter of the original electrodes can be reduced, the distance between the original electrodes can be increased, and the number of wirings that can be laid between the original electrodes can be increased.

The convex electrode according to claim 2 subordinate to claim 1 is formed by overlapping a thin titanium film and a thin copper film by a thin film forming method under vacuum between the effective portion of the original electrode and the conductive film. Is.
Such a convex electrode has a low conduction resistance between the effective portion of the original electrode and the conductive film due to the presence of the titanium thin film and the copper thin film.

The convex electrode according to claim 3, which is dependent on claim 1, has a manganese dioxide film formed as a primer between the effective portion of the original electrode and the conductive film.
Such a convex electrode has great adhesion between the effective portion of the original electrode and the conductive film due to the presence of the manganese dioxide film.

The convex electrode according to claim 4 that is dependent on claim 2 or claim 3, wherein the titanium thin film, the copper thin film, and the manganese dioxide film are interposed between the effective portion of the original electrode and the conductive film. It is formed by overlapping.
Such a convex electrode has a low conduction resistance between the effective portion of the original electrode and the manganese dioxide film due to the presence of the titanium thin film and the copper thin film, and the copper thin film and the conductive film due to the presence of the manganese dioxide film. Adhesiveness is great.

The convex electrode according to claim 5 is a convex electrode formed by processing an original electrode of a part which is surrounded by an outer layer insulating film overlapping at a peripheral portion and becomes a bottom surface of a recess and whose effective portion is narrowed. A titanium thin film formed by a thin film forming method under vacuum on the surface of the component on the original electrode side and a copper thin film formed in an overlapping manner; an effective portion of the original electrode on the copper thin film; and the original electrode A copper plating film formed through a plating resist film on a portion corresponding to the outer insulating film overlapping at the peripheral edge of the plating resist film, the titanium thin film under the plating resist film, and the copper thin film An electroless nickel plating film formed in the presence of an adsorptive palladium catalyst on the entire surface of the copper plating film exposed by removing the copper, and the titanium thin film under the copper plating film and the end face of the copper thin film; The surface level of the convex electrode is equivalent to the surface of the outer insulating film overlapping the peripheral edge of the original electrode or protrudes from the surface of the outer insulating film. The projected area of the convex electrode on the main plane of the component is larger than the area of the effective portion of the original electrode.

  Such a convex electrode has a surface level of the convex electrode connected to the original electrode of the component equivalent to the surface of the outer insulating film overlapping the peripheral edge of the original electrode or protruded from the surface of the outer insulating film. In addition, since the projected area of the convex electrode on the main plane of the component is larger than the area of the effective portion of the original electrode, the inspection of the wiring circuit using the probe is extremely facilitated, and the convex electrode Therefore, the number of wires existing between the original electrodes can be increased by reducing the diameter of the original electrodes and increasing the distance between the original electrodes. In addition, since the convex electrode is mainly composed of a copper plating film, existing technology and equipment can be used for its production, and it is formed of a coating film made of a paste in which ultrafine particles of silver or copper are dispersed. Compared with a convex electrode, the cost is low. Further, since the electroless (Ni / Au) plating film is formed on the entire surface of the exposed copper plating film, the convex electrode has extremely excellent corrosion resistance. In addition, since the (Ti / Cu) thin film is not completely removed because of electroless plating, a (Ni / Au) plating film is formed on the remaining (Ti / Cu) thin film, and the residual (Ti / Cu) Cu) It is easy to confirm the thin film.

The convex electrode according to claim 6 is a convex electrode formed by processing an original electrode of a part which is surrounded by an outer insulating film which is overlapped at a peripheral portion and becomes a bottom surface of a recess and whose effective portion is narrowed. A titanium thin film formed by a thin film forming method under vacuum on the surface of the component on the original electrode side and a copper thin film formed in an overlapping manner; an effective portion of the original electrode on the copper thin film; and the original electrode A copper plating film formed through a plating resist film on a portion corresponding to the outer insulating film overlapping at the peripheral edge of the electrode, and an electrolysis formed on the upper surface of the copper plating film in the presence of the plating resist film A nickel plating film and an overlying electrolytic gold plating film; a side surface of the copper plating film exposed by removing the plating resist film and the titanium thin film and the copper thin film under the plating resist film; And end surfaces of the titanium thin film and the copper thin film, and the surface level of the convex electrode is equal to the surface of the outer insulating film overlapping the peripheral edge of the original electrode or more than the surface of the outer insulating film The projected area of the convex electrode onto the main plane of the component is larger than the area of the effective portion of the original electrode.

In such a convex electrode, the surface level of the convex electrode connected to the original electrode of the part is equivalent to the surface of the outer insulating film overlapping the peripheral edge of the original electrode or protrudes from the surface of the outer insulating film. In addition, since the projected area of the convex electrode on the main plane of the component is larger than the area of the effective portion of the original electrode, the inspection of the wiring circuit using the probe is greatly facilitated, and the convex electrode Since the area is large, it is possible to increase the number of wires existing between the original electrodes by reducing the diameter of the original electrodes and increasing the distance between the original electrodes. In addition, since the convex electrode is mainly composed of a copper plating film, existing technology and equipment can be used for its production, and it is formed of a coating film made of a paste in which ultrafine particles of silver or copper are dispersed. Compared with a convex electrode, the cost is low. In this case, the convex electrode mainly composed of a copper plating film has an electrolytic (Ni / Au) plating film formed only on the upper surface of the copper plating film, so that the manufacturing process is simplified, but the corrosion resistance of the convex electrode. Slightly inferior.

The convex electrode according to claim 7, which is dependent on claim 1, claim 5, or claim 6, has a protruding height of the convex electrode in a range of 3 to 20 μm from the surface of the original electrode.
Such a convex electrode does not cause insufficient filling in the concave portion where the original electrode surface is exposed, and does not cause an excessive gap between the component and the wiring substrate when the component is mounted on the wiring substrate.

  The method for manufacturing a convex electrode according to claim 8 is a method for manufacturing a convex electrode for processing an original electrode of a part surrounded by an outer insulating film overlapping at a peripheral portion to become a bottom surface of a recess and whose effective portion is narrowed. A method in which a paste in which ultrafine particles of silver or copper are dispersed is applied to an effective portion of the original electrode and the outer insulating film overlapping at a peripheral edge of the original electrode, and then heated and cured to be conductive. Forming the film, and forming the electroless gold plating film by applying an adsorptive palladium catalyst to the conductive film to form an electroless nickel plating film, and forming the convex mold Projecting area of the convex electrode on the main plane of the component with the surface level of the electrode being equivalent to the surface of the outer layer insulating film overlapping the peripheral edge of the original electrode or protruding from the surface of the outer layer insulating film The effective part of the original electrode A method for the large than the area.

  Such a method for manufacturing a convex electrode is such that the surface level of the convex electrode connected to the original electrode of the part is equal to or more than the surface of the outer insulating film, and protrudes from the surface of the outer insulating film. Since the projected area of the convex electrode is made larger than the area of the effective portion of the original electrode, the inspection of the wiring circuit using the probe is greatly facilitated, and the area of the convex electrode is large. By reducing the diameter and increasing the distance between the original electrodes, the number of wires that can be laid between the original electrodes is increased.

The method of manufacturing a convex electrode according to claim 9, which is dependent on claim 8, includes forming a titanium thin film on an effective portion of the original electrode by a thin film forming method under vacuum before the step of forming the conductive film. In this method, a step of forming a copper thin film is inserted.
Such a method for manufacturing a convex electrode is formed by forming a titanium thin film and a copper thin film on the effective portion of the original electrode, and then forming a conductive film, thereby forming a gap between the effective portion of the original electrode and the conductive film. Reduce conduction resistance.

The method of manufacturing a convex electrode according to claim 10 that is dependent on claim 8 is a method of inserting a step of forming a manganese dioxide film as a primer in an effective portion of the original electrode before the step of forming the conductive film. It is.
In such a method for manufacturing a convex electrode, the manganese dioxide film improves the adhesion between the effective portion of the original electrode and the conductive film.

The method for manufacturing a convex electrode according to claim 11 that depends on claim 9 or claim 10 forms the titanium thin film and the copper thin film on an effective portion of the original electrode before the step of forming the conductive film. And a step of forming the manganese dioxide film in an overlapping manner.
In such a method of manufacturing a convex electrode, the titanium thin film and the copper thin film reduce the conduction resistance between the effective portion of the original electrode and the manganese dioxide film, and the manganese dioxide film improves the adhesion of the conductive film to the copper thin film. Improve.

The method for producing a convex electrode according to claim 12 is a method for producing a convex electrode for processing an original electrode of a part surrounded by an outer insulating film overlapping at a peripheral portion to become a bottom surface of a recess and whose effective portion is narrowed. A method of forming a copper thin film by forming a titanium thin film on a surface of the component on the side of the original electrode by a thin film forming method under a vacuum, and forming an effective portion of the original electrode on the copper thin film; A step of forming a copper plating film via a plating resist film on a portion corresponding to the outer insulating film overlapping the peripheral edge of the original electrode; the plating resist film and the titanium thin film under the plating resist film; Step of removing the copper thin film, and electroless nickel plating by applying an adsorption-type palladium catalyst to the whole exposed copper plating film and the titanium thin film under the copper plating film and the end face of the copper thin film And forming an electroless gold plating film on the surface, and the surface level of the convex electrode to be formed is equivalent to the surface of the outer insulating film overlapping the peripheral edge of the original electrode or the outer insulating layer. In this method, the projected area of the convex electrode on the main plane of the component is made larger than the area of the effective portion of the original electrode.

  In such a method for manufacturing a convex electrode, the level of the surface of the convex electrode connected to the original electrode of the component is equal to the level of the surface of the outer insulating film or protrudes from the surface of the outer insulating film, thereby Since the projected area of the convex electrode on the plane is made larger than the area of the effective portion of the original electrode, the inspection of the wiring circuit using the probe is greatly facilitated. Further, since the area of the convex electrode is large, it is possible to increase the number of wirings existing between the original electrodes by reducing the diameter of the original electrodes and increasing the distance between the original electrodes. In addition, since the convex electrode is mainly composed of a copper plating film, existing technology and equipment can be used for its production, and it is formed of a coating film made of a paste in which ultrafine particles of silver or copper are dispersed. Compared with a convex electrode, the cost is low. Further, since the electroless (Ni / Au) plating film is formed on the entire surface of the exposed copper plating film, the convex electrode has extremely excellent corrosion resistance. In addition, since the (Ti / Cu) thin film is not completely removed because of electroless plating, a (Ni / Au) plating film is formed on the remaining (Ti / Cu) thin film, and the residual (Ti / Cu) Cu) It is easy to confirm the thin film.

The method for producing a convex electrode according to claim 13 is a method for producing a convex electrode for processing an original electrode of a part surrounded by an outer insulating film that is overlapped at a peripheral portion to become a bottom surface of a recess and whose effective portion is narrowed. A method of forming a copper thin film by forming a titanium thin film on a surface of the component on the side of the original electrode by a thin film forming method under a vacuum, and forming an effective portion of the original electrode on the copper thin film; A step of forming a copper plating film through a plating resist film on a portion corresponding to the outer layer insulating film overlapping the peripheral edge of the original electrode, and electrolysis on the upper surface of the copper plating film in the presence of the plating resist film Forming a nickel plating film and forming an electrolytic gold plating film; and removing the titanium thin film and the copper thin film under the plating resist film and the plating resist film. Projecting area of the convex electrode on the main plane of the component with the surface level of the electrode being equivalent to the surface of the outer layer insulating film overlapping the peripheral edge of the original electrode or protruding from the surface of the outer layer insulating film Is larger than the area of the effective portion of the original electrode.

In such a method for manufacturing a convex electrode, the level of the surface of the convex electrode connected to the original electrode of the component is equal to the level of the surface of the outer insulating film or protrudes from the surface of the outer insulating film, thereby Since the projected area of the convex electrode on the plane is made larger than the area of the effective portion of the original electrode, the inspection of the wiring circuit using the probe is greatly facilitated. Further, since the area of the convex electrode is large, it is possible to increase the number of wirings existing between the original electrodes by reducing the diameter of the original electrodes and increasing the distance between the original electrodes. In addition, since the convex electrode is mainly composed of a copper plating film, existing technology and equipment can be used for its production, and it is formed of a coating film made of a paste in which ultrafine particles of silver or copper are dispersed. Compared with a convex electrode, the cost is low. In this case, the convex electrode mainly composed of the copper plating film forms an electrolytic (Ni / Au) plating film only on the upper surface of the copper plating film, so that the manufacturing process is simplified, but the corrosion resistance of the convex electrode is slightly inferior. It becomes.

The method for producing a convex electrode according to claim 14, which is dependent on claim 8, claim 12, or claim 13, wherein the protruding height of the formed convex electrode is 3 to 20 μm from the surface of the original electrode. It is a method of setting a range.
Such a method of manufacturing a convex electrode does not cause insufficient filling in the concave portion where the original electrode surface is exposed, and makes the gap between the component and the wiring substrate excessive when the component is mounted on the wiring substrate. Nor.

  According to the convex electrode of claim 1, the surface level of the convex electrode connected to the original electrode of the component is equal to or more than the surface of the outer insulating film overlapping the peripheral edge of the original electrode. Since the projected area of the convex electrode on the main plane of the component is larger than the area of the effective part of the original electrode, the tip of the probe for inspecting the wiring circuit can make multipoint contact A crown type, a contact with a wide area, or a tip having a large diameter can be used, which greatly reduces the cost of the inspection equipment and facilitates the inspection work. Also, since the area of the convex electrode is increased, the diameter of the original electrode can be reduced, thereby increasing the number of wirings laid between the original electrodes by increasing the distance between the original electrodes. The density can be increased. Therefore, it greatly contributes to the miniaturization of parts and enables a significant cost reduction of parts. Furthermore, since convex electrodes having a large diameter and a large area are used for mounting components, mounting work is facilitated and mounting reliability is improved.

According to the convex electrode of claim 2, since the Ti thin film and the Cu thin film exist between the effective portion of the original electrode and the conductive film, the conduction resistance between the effective portion of the original electrode and the conductive film is further increased. Parts with low convex electrodes are obtained.

According to the convex electrode of claim 3, since the manganese dioxide (MnO ₂ ) film exists between the effective part of the original electrode and the conductive film, the conductive film is strong against the effective part of the original electrode. A part having bonded convex electrodes is obtained.

According to the convex electrode of claim 4, since the Ti thin film, the Cu thin film, and the MnO ₂ film exist between the effective portion of the original electrode and the conductive film, the effective portion of the original electrode and the MnO ₂ film Since the MnO ₂ film is present between the Cu thin film and the conductive film, a component having a convex electrode in which the conductive film is firmly bonded to the Cu thin film is obtained.

  According to the convex electrode of claim 5, the surface level of the convex electrode connected to the original electrode of the part is equal to or more than the surface of the outer insulating film overlapping the peripheral edge of the original electrode. Since the projected area of the convex electrode on the main plane of the part is larger than the area of the effective part of the original electrode, the inspection of the wiring circuit using the probe is extremely facilitated and the convex type Since the electrode area is large, the diameter of the original electrode is reduced, the distance between the original electrodes is increased, the number of wires existing between the original electrodes can be increased, and the wiring density can be increased. It contributes greatly to cost reduction and enables significant cost reduction. In addition, since the convex electrode is mainly composed of a copper plating film, existing technology and equipment can be used for its production, and it is formed of a coating film made of a paste in which ultrafine particles of silver or copper are dispersed. Compared with a convex electrode, the cost is low. Further, since the electroless (Ni / Au) plating film is formed on the entire surface of the exposed copper plating film, the convex electrode has a very excellent corrosion resistance and gives a highly reliable part. In addition, since the (Ti / Cu) thin film is not completely removed because of electroless plating, a (Ni / Au) plating film is formed on the remaining (Ti / Cu) thin film, and the residual (Ti / Cu) Cu) It is easy to confirm the thin film.

According to the convex electrode of claim 6, the surface level of the convex electrode connected to the original electrode of the component is equal to the surface of the outer insulating film overlapping the peripheral edge of the original electrode or more than the surface of the outer insulating film. Since the projected area of the convex electrode on the main plane of the part is larger than the area of the effective part of the original electrode, the inspection of the wiring circuit using the probe is extremely facilitated and the convex type Since the electrode area is large, the diameter of the original electrode is reduced, the distance between the original electrodes is increased, the number of wires existing between the original electrodes can be increased, and the wiring density can be increased. It contributes greatly to cost reduction and enables significant cost reduction. In addition, since the convex electrode is mainly composed of a copper plating film, existing technology and equipment can be used for its production, and it is formed of a coating film made of a paste in which ultrafine particles of silver or copper are dispersed. Compared with a convex electrode, the cost is low. Further, since the electrolytic (Ni / Au) plating film is formed only on the upper surface of the Cu plating film without removing the plating resist film, the convex electrode mainly composed of the copper plating film in this case is the copper plating film. Since the electrolytic (Ni / Au) plating film is formed only on the upper surface, the manufacturing process is simplified as compared with the case where the (Ni / Au) plating film is formed on the entire surface, but the corrosion resistance of the convex electrode is slightly inferior. It will be a thing.

  According to the convex electrode of claim 7, since the protruding height of the convex electrode is in the range of 3 to 20 μm from the surface of the original electrode, it does not cause insufficient filling in the concave portion where the effective portion of the original electrode exists, In addition, when the component is mounted on the wiring board, the gap between the component and the wiring board is not excessive.

  According to the method for manufacturing a convex electrode according to claim 8, the surface level of the convex electrode connected to the original electrode of the component is equivalent to the surface of the outer insulating film overlapping the peripheral edge of the original electrode or the outer insulating film. Since the projected area of the convex electrode on the main plane of the part is larger than the area of the effective part of the original electrode, the tip of the probe for inspecting the wiring circuit is a crown type that can make multipoint contact Can be used, those that can be contacted over a wide area, and those having a large tip diameter, which can greatly reduce the cost of inspection equipment and facilitate inspection work. Further, since the area of the convex electrode is increased, the diameter of the original electrode can be reduced, and the wiring density can be increased by increasing the number of wirings laid between the original electrodes by increasing the distance between the original electrodes. As a result, it contributes greatly to miniaturization of parts and enables a significant cost reduction. Furthermore, since convex electrodes having a large diameter and a large area are used for mounting components, mounting work is facilitated and mounting reliability is improved.

  According to the method for manufacturing a convex electrode of claim 9, since the Ti thin film and the Cu thin film are formed between the effective portion of the original electrode and the conductive film, the conduction between the effective portion of the original electrode and the conductive film. A component having a convex electrode with low resistance is obtained.

According to the method for producing a convex electrode of claim 10, since the MnO ₂ film is formed as a primer between the effective portion of the original electrode and the conductive film, the conductive film is strong against the effective portion of the original electrode. A component having a convex electrode adhered to the substrate is obtained.

According to the method for manufacturing a convex electrode according to claim 11, since the Ti thin film and the Cu thin film are formed between the effective portion of the original electrode and the conductive film, and the MnO ₂ film is formed thereon, The conductive portion between the effective portion of the electrode and the MnO ₂ film has low conduction resistance due to the Ti thin film and the Cu thin film, and the MnO ₂ film exists between the Cu thin film and the conductive film, so that the conductive film is strong against the Cu thin film. A component having a convex electrode adhered to the substrate is obtained.

According to the method for manufacturing a convex electrode according to claim 12, the surface level of the convex electrode connected to the original electrode of the component is equivalent to the surface of the outer insulating film overlapping the peripheral edge portion of the original electrode or the outer insulating film. Since the projected area of the convex electrode on the main plane of the part is larger than the area of the effective part of the original electrode, the tip of the probe for inspecting the wiring circuit is a crown type that can make multipoint contact Can be used, those that can be contacted over a wide area, and those having a large tip diameter, which can greatly reduce the cost of inspection equipment and facilitate inspection work. Further, since the area of the convex electrode is increased, the diameter of the original electrode can be reduced, and the wiring density can be increased by increasing the number of wirings laid between the original electrodes by increasing the distance between the original electrodes. As a result, it contributes greatly to miniaturization of parts and enables a significant cost reduction. Furthermore, since convex electrodes having a large diameter and a large area are used for mounting components, mounting work is facilitated and mounting reliability is improved. Since the convex electrode is mainly formed of a Cu plating film, the existing technology and equipment can be used for its manufacture, and it is formed of a coating film made of a paste in which ultrafine particles of silver or copper are dispersed. Compared with a convex electrode, the cost is low. Further, since an electroless (Ni / Au) plating film is formed on the entire surface of the exposed copper plating film, the convex electrode provides a highly reliable component having extremely excellent corrosion resistance. In addition, since the (Ti / Cu) thin film is not completely removed because of electroless plating, a (Ni / Au) plating film is formed on the remaining (Ti / Cu) thin film, and the residual (Ti / Cu) Cu) It is easy to confirm the thin film.

According to the method for manufacturing a convex electrode according to claim 13, the surface level of the convex electrode connected to the original electrode of the component is equal to the surface of the outer insulating film overlapping the peripheral edge of the original electrode or the outer insulating film is Since the projected area of the convex electrode on the main plane of the part is larger than the area of the effective part of the original electrode, the tip of the probe for inspecting the wiring circuit is a crown type that can make multipoint contact Can be used, those that can be contacted over a wide area, and those having a large tip diameter, which can greatly reduce the cost of inspection equipment and facilitate inspection work. Further, since the area of the convex electrode is increased, the diameter of the original electrode can be reduced, and the wiring density can be increased by increasing the number of wirings laid between the original electrodes by increasing the distance between the original electrodes. As a result, it contributes greatly to miniaturization of parts and enables a significant cost reduction. Furthermore, since convex electrodes having a large diameter and a large area are used for mounting components, mounting work is facilitated and mounting reliability is improved. Since the convex electrode is mainly formed of a Cu plating film, the existing technology and equipment can be used for its production, and it is formed of a coating film from a paste in which ultrafine particles of silver or copper are dispersed. Low cost compared to convex electrodes. Further, since the electrolytic (Ni / Au) plating film is formed only on the upper surface of the Cu plating film without removing the plating resist film, the convex electrode mainly composed of the copper plating film in this case is the copper plating film. Since the electrolytic (Ni / Au) plating film is formed only on the upper surface, the manufacturing process is simplified compared to the case where the (Ni / Au) plating film is formed on the entire surface, but the corrosion resistance of the convex electrode is slightly inferior. It becomes.

  According to the method for producing a convex electrode according to claim 14, since the protruding height of the convex electrode to be formed is in the range of 3 to 20 μm from the surface of the original electrode, the concave portion in which the effective portion of the original electrode is exposed. The gap between the component and the wiring substrate does not become excessive when a component having a convex electrode is mounted on the wiring substrate.

As described above, the convex electrode of the present invention is surrounded by the outer insulating film in which the original electrode of the component overlaps at the peripheral portion thereof, and the effective portion, that is, the exposed portion becomes the bottom surface of the recess, and the area of the effective portion is the original. When the area is smaller than the area of the electrode, the outer layer insulating film overlapping the effective portion of the original electrode and the peripheral portion of the original electrode is processed into a convex electrode. In addition to the interposer substrate and the wiring substrate, the component referred to here includes a component having an external electrode connected to the internal wiring circuit.

  The original electrode of the part is narrowed by the outer layer insulating film overlapped at the periphery thereof, and the area of the effective portion is the bottom of the recess, so that the effective portion of the original electrode and the original electrode are filled so as to fill the recess. A paste in which ultrafine particles of Ag or copper are dispersed is applied to the outer insulating film overlapping at the periphery by printing, transferring, spraying, or other methods. Then, in order to give corrosion resistance to the conductive film formed by heat curing, an adsorption type Pd catalyst is applied to form an electroless Ni plating film and subsequently an electroless Au plating film.

An example is conceptually shown in FIG. 1A. FIG. 1A shows an effective portion 13e, that is, an exposed portion that is surrounded by an outer layer insulating film 15 in which the original electrode 13 overlaps at the peripheral edge thereof, and the effective portion 13e. The part 11 in which the area 13e is narrower than the area of the original electrode 13 is shown. FIG. 1-B shows a case where a paste in which ultrafine particles of Ag or Cu are dispersed is applied and cured on the effective portion 13e of the original electrode 13 and the outer insulating film 15 overlapping at the peripheral edge of the original electrode 13. The conductive film 25 is shown. FIG. 1C shows an electroless Ni plating film 27 and an electroless Au plating film 28 formed by applying an adsorption type Pd catalyst to the conductive film 25. The level of the surface of the convex electrode 29 obtained in this way is equivalent to the surface of the outer insulating film 15 overlapping at the peripheral edge of the original electrode 13 or protrudes from the surface of the outer insulating film 15, and The projected area of the convex electrode 29 on the main plane is larger than the area of the effective portion 13 e of the original electrode 13.

As an example of the paste in which the ultrafine particles of Ag or Cu are dispersed, the ultrafine particles having a highly conductive Ag or Cu particle diameter of 5 to 10 nm are used as a thermosetting resin as a binder. A curing agent is dispersed in a solution in an organic solvent to form a paste (see, for example, JP-A-2002-324966). By applying the paste in which ultrafine particles of Ag or Cu are dispersed in this way to the effective portion of the original electrode that is the recess and the outer insulating film that overlaps the peripheral portion thereof, the paste on the original electrode is formed. The paste is filled without leaving any voids. Then, the paste is thermally cured, so that the conductive film fills the recess on the original electrode, and is formed in a state of spreading to the outer insulating film on the outer periphery of the recess. In the above, epoxy resin, phenol resin, urethane resin, silicone resin, and other known thermosetting resins can be used as the thermosetting resin as a binder.

The paste in which ultrafine particles of Ag or Cu are dispersed can be applied to the electrode surface of the component by printing, transferring, spraying, or other known techniques. And after application, it heats and thermosets a thermosetting resin and forms a conductive film. The coating thickness at this time is preferably 7 to 10 μm in a paste state, and the thickness after curing is preferably 3 to 5 μm. That is, if the thickness after curing is less than 3 μm, it becomes difficult to fill in the recesses of the electrodes, and as the thickness after curing exceeds 5 μm, the component and the wiring substrate when the component is mounted on the wiring substrate This is because the gap between the two becomes wider. Of course, the thickness is not limited to 3 to 5 μm, and when the gap may be increased, the thickness of the conductive film after curing may be about 20 μm, for example.

In the above, the electroless Ni plating film and the electroless Au plating film are formed on the surface of the conductive film in order to prevent oxidation of the formed conductive film. Since the electrode of the interposer substrate is generally melted by the Pd catalyst with Al, when electroless Ni plating or electroless Au plating is applied, it is necessary to replace the Al electrode with Zn in advance. Since the conductive film is formed of a paste in which ultrafine particles of Ag or Cu are dispersed, Zn substitution is unnecessary.

  In the above description, the case where the conductive film is formed by directly applying the paste in which the ultrafine particles of Ag or Cu are dispersed to the effective portion which is the exposed portion of the original electrode has been described. When it is desired to lower the conduction resistance between the conductive film, a Ti thin film is formed on the surface of the effective portion of the original electrode by a thin film formation method under vacuum before forming the conductive film, and the Cu thin film is overlaid. May be formed. As a method for forming a thin film under vacuum, generally known methods such as sputtering, vacuum deposition, and chemical vapor deposition (CVD) are employed.

In addition, in order to improve the adhesion between the effective portion of the original electrode and the conductive film, a conductive film is formed after a MnO ₂ film is previously formed as a primer on the surface of the effective portion of the original electrode. May be. As the MnO ₂ film, a film obtained by applying a paste-like dispersion liquid in which fine particles of MnO ₂ are dispersed in an organic solvent and sintering MnO ₂ is used.
Further, a Ti thin film and a Cu thin film may be formed on the effective portion of the original electrode, and a manganese dioxide film may be formed on the Cu thin film, and then the conductive film may be formed. With such a configuration, it is possible to reduce the conduction resistance between the effective portion of the original electrode and the MnO ₂ film and improve the adhesion between the Cu thin film and the conductive film.

  In the above description, the case where the conductive film is formed on the effective portion that is the exposed portion of the original electrode that is the bottom surface of the recess to manufacture the convex electrode has been described. It is also possible to form a convex electrode by forming a Cu plating film on the effective portion of the electrode by electrolytic (electric) plating. That is, FIG. 2 and FIG. 3 are diagrams conceptually showing a method of forming a convex electrode by a Cu plating film. FIG. 2-A is the same as FIG. 1-A, and the effective portion 13e, which is the exposed portion of the original electrode, is surrounded by the outer insulating film 15 where the original electrode 13 of the component 11 overlaps with the peripheral edge portion. It becomes the bottom surface, and the area of the effective portion 13e is narrower than the area of the original electrode 13. 2B shows a state in which a Ti thin film 53 is formed on the entire surface of the effective portion 13e of the original electrode 13 and the outer outer insulating film 15 by a thin film forming method under vacuum. FIG. 2-C shows the state on the Ti thin film 53. FIG. 2D shows a state in which the portion corresponding to the original electrode 13 on the Cu thin film 54 is left as the opening 55h, and the plating resist film 55 is formed in the other portion.

3E shows a state in which the Cu plating film 56 is formed in the opening 55h of the plating resist film 55, FIG. 3-F shows a state in which the plating resist film 55 has been removed, and FIG. FIG. 3H shows the entire surface of the Cu plating film 56 together with the end surfaces of the lower Ti thin film 53 and the Cu thin film 54 in order to prevent the formed convex electrode 59 from being oxidized. 5 shows a convex electrode 59 obtained by applying an adsorption type Pd catalyst to form an electroless Ni plating film 57 and forming an electroless Au plating film 58 on top of each other.

The Ni plating film 57 and the Au plating film 58 may be formed by electrolytic plating after the formation of the Cu plating film 56 in the presence of the plating resist film 55. That is, FIG. 4-A is a reproduction of FIG. 2-D, and shows the formed plating resist film 55. As shown in FIG. 4-B, the Cu plating film 56 is formed by electrolytic plating (electroplating). Further, as shown in FIG. 4C, a Ni plating film 57 ′ is formed on the Cu plating film 56 by electrolytic plating, and subsequently, as shown in FIG. 5-D, an Au plating film 58 is formed by electrolytic plating. 'Overlapping and forming. Thereafter, as shown in FIG. 5F, the plating resist film 55 is removed, and the Ti sputtered film 53 and the Cu sputtered film 54 which are therebelow are removed to form a convex electrode 69.

Hereinafter, the convex electrode and the manufacturing method thereof according to the present invention will be specifically described with reference to the drawings.

  FIG. 6 and FIG. 7 are diagrams showing the process of manufacturing the convex electrode 29 of the present invention on the interposer substrate 11 step by step. 6A is a diagram showing the interposer substrate 11 on which the wiring 12, the mounting land 13, and the bonding land 14 are formed. Except for the mounting land 13 and the bonding land 14, the other portions are the solder resist film 15. The effective portion 13e of the mounting land 13 is the bottom surface of the recess. FIG. 6B shows the ultrafine particles of Ag on the effective portion 13e of the mounting land 13 of the interposer substrate 11 and on the solder resist film 15 that overlaps with the peripheral edge of the mounting land 13 (on the lower side in the figure). A dispersed paste, that is, a solution in which an epoxy resin as a binder and a curing agent are dissolved in an organic solvent, and a paste obtained by dispersing ultrafine Ag particles is applied to a wet thickness of 7 to 10 μm by a printing method. This shows a state in which a conductive film 25 having a thickness of 3 to 5 μm and a diameter of 300 μm is formed by thermosetting. Of course, this does not prevent the effective portion 13e in the recess from being set to the same level as the level of the solder resist film 15 overlapping the peripheral portion of the mounting land 13 by the conductive film 25.

FIG. 6C shows an application of the adsorption type Pd catalyst 26 to the formed conductive film 25 and the bonding land 14, followed by the electroless Ni plating film 27 having a thickness of 3 to 5 μm, as shown in FIG. An electroless Au plating film 28 having a thickness of 0.05 μm was formed thereon to form a convex electrode 29. At this time, the diameter of the convex electrode 29 was 310 μm. FIG. 7E shows a state in which the semiconductor chip 31 is bonded to the bonding land 14 of the interposer substrate 11 via a solder ball and sealed with resin to form the package 10.

  FIG. 8 shows a state in which the wiring circuit of the interposer substrate 11 of FIG. 7-D and the package 10 of FIG. 7-E is to be inspected. In these interposer substrate 11 and package 10, the mounting land which is an original electrode is shown. 13 is processed to form a convex electrode 29, and the convex electrode 29 is formed so as to overlap the solder resist film 15 at the peripheral edge of the mounting land 13. The level of the surface 29 protrudes beyond the surface of the outer peripheral insulating film 15 at the periphery, and the exposed surface of the convex electrode 29 has an area greatly enlarged from the area of the effective portion 13 e of the mounting land 13. Therefore, the conventional mounting land 13 requires the probe 51 with the tip having a tip diameter of 50 μm shown in FIG. 22, whereas the convex electrode 29 of the present embodiment has a tip with a tip diameter of 150 μm and the tip side. A probe 52 having a crown shape can be employed. In addition to the low cost of the probe 52 itself, since the allowable range of the position of the probe 52 with respect to the convex electrode 29 is large, no contact error occurs, and the cost including equipment cost and labor cost required for inspection is 30%. I was able to reduce it.

  FIG. 9 is a diagram showing the relationship between the mounting lands 13 and the wirings 12 in the interposer substrate 11. That is, FIG. 9-A is a reprint of FIG. 7-D, and FIG. 9-B is a partially enlarged view showing the wiring 12 at the center and the mounting lands 13 on both sides of FIG. 9-A. As can be seen in FIG. 9-B, the convex electrode 29 of the interposer substrate 11 can have a diameter of 310 μm, so that even if the diameter of the original electrode of the mounting land 13 is 150 μm, it functions sufficiently. Therefore, even if the formation pitch of the mounting lands 13 is 0.5 mm as in the conventional example of FIG. 23-B, 350 μm can be secured as an interval between the adjacent mounting lands 13. Three lines 12 having a line width of 50 μm can be laid with the line and space being (50/50). As a result, the required number of interposer substrates can be reduced. Even when the conventional interposer substrate 111 is mounted with a four-layer laminated substrate, the interposer substrate 11 according to this embodiment is mounted with a two-layer laminated layer. The effect of cost reduction is extremely large, for example, the purpose can be achieved with a substrate.

  10 and 11 show an example in which the convex electrode 29 is manufactured by a method different from that in the first embodiment. That is, FIG. 10-A is the interposer substrate 11 shown in FIG. 6-A. 10B shows a state in which the Ti thin film 23 is formed by sputtering on the entire surface of the mounting land 13 side of the interposer substrate 11 in FIG. 10A, and FIG. 10C shows a state in which the Cu thin film 24 is also formed by overlapping the sputtering. . FIG. 11D shows a state in which a conductive film 25 is formed by applying a paste in which ultrafine particles of Cu are dispersed on the Ti thin film 23 and the Cu thin film 24. Further, FIG. 11-E shows a state in which the conductive film 25, the Cu thin film 24, and the Ti thin film 23 in other portions are removed except for the part corresponding to the mounting land 13.

  In FIG. 11-F, the adsorption type Pd catalyst 26 is applied to the remaining conductive film 25 and the surface of the bonding land 14 to form an electroless Ni plating film 27 as shown in FIG. An Au plating film 28 is formed to make the conductive film 25 a convex electrode 39. The difference between the first embodiment and the second embodiment is that, in the second embodiment, the Ti thin film 23 and the Cu thin film 24 are formed on the mounting land 13 before the conductive film 25 is formed. This is because a Ti thin film 23 and a Cu thin film 24 exist between the film 25. As described above, with such a configuration, the mounting land 13, the conductive film 25, and the conduction resistance can be reduced.

12 and 13 are convex shapes in which an MnO ₂ film as a primer is formed in advance on the effective portion 13e exposed in the recess of the mounting land 13 in the interposer substrate 11 to improve the adhesion of the conductive film. A process for manufacturing the electrode 29c will be described. That is, FIG. 12-A is a view showing the interposer substrate 11 in which the wiring 12, the mounting land 13, and the bonding land 14 are formed, similar to the interposer substrate 11 shown in FIG. 6-A, and FIG. A paste-like dispersion liquid in which MnO ₂ fine particles are dispersed in an organic solvent is applied to the effective portion 13e of the mounting land 13 exposed in the recess 11 by a printing method and heated to evaporate the organic solvent. 4 is a view showing a state in which a film obtained by sintering fine particles of MnO ₂ is formed as a primer 31.

And in FIG. 12-C, the paste in which the ultrafine particles of Ag used in Example 1 are dispersed is applied on the primer 31 made of the MnO ₂ film by a printing method and thermally cured to a thickness of 3 to 5 μm. A state in which a conductive film 32 having a diameter of 300 μm is formed is shown. Next, FIG. 13-D applies the adsorption type Pd catalyst 36 to the formed conductive film 32 and the bonding land 14 on the opposite surface, and further, as shown in FIG. 13-E, electroless Ni having a thickness of 3 to 5 μm. A state is shown in which a conductive film 32 is formed as a convex electrode 49 by forming a plating film 37 and an electroless Au plating film 38 having a thickness of 0.05 μm thereon. At this time, the diameter of the convex electrode 49 was 310 μm.

FIGS. 14 and 15 are diagrams showing a case where a metal film that lowers the conduction resistance is first formed on the entire surface of the interposer substrate 11 on the mounting land 13 side, and then a primer is formed. That is, FIG. 14-A is a view showing the interposer substrate 11 on which the wiring 12, the mounting land 13, and the bonding land 14 similar to FIG. 6-A of the first embodiment are formed. 14B, a Ti thin film is formed on the entire surface of the interposer substrate 11 side of the interposer substrate 11 of FIG. 14A by sputtering, and then a Cu thin film is overlaid to form a (Ti / Cu) thin film 43. MnO ₂ MnO ₂ obtained by applying and heating a paste-like dispersion in which fine particles of the above are dispersed in an organic solvent A state in which the film is formed as a primer 44 is shown. FIG. 14C shows a state in which a conductive film 45 is formed by applying and curing a paste in which ultrafine particles of Cu are dispersed on the primer 44 and being cured.

Subsequently, FIG. 15D shows a portion of the mounting land 13 that substantially corresponds to the effective portion 13e of the mounting land 13 and the solder resist film 15 that overlaps with the peripheral portion of the mounting land 13, and the other portions. The conductive film 45, the primer 44, and the (Ti / Cu) thin film 43 are cut and removed. In FIG. 15E, an electroless Ni plating film 47 is formed as shown in FIG. 15-F by applying the adsorbing Pd catalyst 46 to the remaining conductive film 45 and the surface of the bonding land 14 on the opposite side. Then, the electroless Au plating film 48 is formed so as to overlap the conductive film 45 as the convex electrode 59. The difference between the first embodiment and the fourth embodiment is that, in the fourth embodiment, a (Ti / Cu) thin film 43 is formed on the effective portion 13e of the mounting land 13 before the conductive film 45 is formed. Since the MnO ₂ film is formed, the conduction resistance between the effective portion 13e of the mounting land 13 and the primer 44 is low, and the (Ti / Cu) thin film 43 and the conductive film 45 have high adhesiveness due to the primer 44. It is.

  FIGS. 16, 17, and 18 are diagrams showing a case where the convex electrode 69 is formed by Cu plating on the effective portion 13e of the mounting land 13 of the interposer substrate 11. FIG. That is, FIG. 16A shows an interposer substrate 11 similar to the interposer substrate 11 shown in FIG. 16B shows a state in which a Ti thin film 53 is formed by sputtering on the entire surface of the mounting land 13 side of the interposer substrate 11 in FIG. 16A. FIG. 16C shows a state in which a Cu thin film 54 is also formed by overlapping the sputtering method. Indicates.

  In FIG. 17D and subsequent figures, the top and bottom of the interposer substrate 11 shown in FIG. That is, FIG. 17D shows a portion corresponding to the same area as the mounting land 13 as an opening 55h in the portion above the mounting land 13 on the Cu thin film 54 of FIG. 13-F. A state in which the plating resist film 55 is formed on the portion is shown. FIG. 17E shows a state in which the Cu plating film 56 is formed to a thickness of 3 to 20 μm on the mounting land 13 where the plating resist film 55 is not formed. FIG. 17F shows a state where the plating resist film 55 is removed after the Cu plating film 56 is formed.

  18G shows a state in which the Ti thin film 53 and the Cu thin film 54 under the Cu plating film 56 are left and the Ti thin film 53 and the Cu thin film 54 under the plating resist film 55 are removed. 18-H shows the electroless electroless Pd catalyst applied to the Cu plating film 56, the end face of the Ti thin film 53, the Cu thin film 54, and the bonding land 14 on the back side, although not shown. Forming an electroless (Ni / Au) plating film 57 for rust prevention comprising a Ni plating film having a thickness of 3 to 5 μm formed by plating and an Au plating film having a thickness of 0.05 μm stacked thereon. Thus, the Cu plating film 56 is used as the convex electrode 69. According to the manufacturing method of Example 5, if the removal of the Ti thin film 53 and the Cu thin film 54 remains on the solder resist film 15 incompletely, the remaining portion is also electroless (Ni / Au). Since the plating film 57 is formed, it is easy to confirm the removal of the Ti thin film 53 and the Cu thin film 54. Further, compared to the case of Example 6 described later, the formed electroless (Ni / Au) plating film 57 has a uniform thickness.

  In Example 5, an electroless (Ni / Au) plating film 57 for imparting corrosion resistance was formed on the Cu plating film 56 after the plating resist film 55 was removed, but before the plating resist film 55 was removed, Subsequent to the formation of the Cu plating film 56, the (Ni / Au) plating film 58 may be formed by an electrolytic plating method. That is, FIG. 19-A is a reprint of FIG. 17-D of Example 5, and shows a state in which a plating resist film 55 having an opening 55 h is formed in a portion corresponding to the mounting land 13. 19B shows a state in which the Cu plating film 56 is formed by the electrolytic plating (electroplating) method in the opening 55h of the plating resist film 55, and FIG. 19C shows that the Cu plating film 56 and the bonding land 14 are electrolyzed. FIG. 20D shows a state in which the Ni plating is performed by the plating method, the Au plating is again performed, and the (Ni / Au) plating film 58 ″ is formed. FIG. 20-D shows the removal of the plating resist film 55 from the state of FIG. 20E shows a state in which the Ti thin film 53 and the Cu thin film 54 existing under the plating resist film 55 are removed to form the Cu plating film 56 as the convex electrode 79. Example 6 According to this method, as shown in FIG. 20E, the (Ni / Au) plating film 58 ″ is not formed on the side wall surface of the Cu plating film 56. Further, the (Ni / Au) plating film 58 ″ is formed in the opening 55h of the plating resist film 55, so that the thickness uniformity is inferior to that in the case of the fifth embodiment.

  As described above, the convex electrode and the manufacturing method thereof according to the present invention have been described with reference to the embodiments. However, the present invention is not limited thereto, and various modifications can be made based on the technical idea of the present invention.

  For example, in the first to fifth embodiments, the mounting land 113 of the conventional example is connected to the mounting land 13 as a substitute for the interposer substrate 111 in which a recessed portion is formed at a position lower than the surface of the solder resist film 115 at the peripheral edge. Although the interposer substrate 11 having the convex electrodes 29, 39, 49, 59, 69, or 79 is illustrated as an example, the present invention can also be applied to components having electrodes that are recessed other than the interposer substrate. .

A conductive material in which a paste in which ultrafine particles of Ag or Cu are dispersed is applied to the effective portion of the original electrode surrounded by the outer insulating film that is overlapped with the peripheral edge portion of the original electrode and serving as the bottom surface of the recess. It is a figure which shows notionally the method of setting it as a convex electrode by a film | membrane. FIG. 4 is a diagram conceptually showing a process of manufacturing a convex electrode by forming a Cu plating film on an effective portion of a bonding pad together with FIG. 3. It is a figure which shows notionally the process which manufactures a convex electrode with Cu plating film with FIG. FIG. 6 is a method for producing a convex electrode using a Cu plating film as in FIGS. 2 and 3, and FIG. 5 is a diagram showing a method in which a method for forming a corrosion-resistant Ni plating film and an Au plating film is different. It is a figure which shows another method with which FIG. 4 and a convex electrode are manufactured with Cu plating film. FIG. 8 is a view showing, in a step-by-step manner, a process for manufacturing an interposer substrate having convex electrodes according to Example 1 together with FIG. 7. FIG. 7 is a view showing, in a step-by-step manner, a process for manufacturing an interposer substrate having convex electrodes according to Example 1 together with FIG. 6. It is a figure which shows the relationship between the interposer board | substrate of Example 1, the convex electrode in the package of a semiconductor chip, and the test probe used. FIG. 3 is a diagram illustrating a relationship between mounting lands and wiring in the interposer substrate according to the first embodiment. It is a figure which shows the manufacturing process of the interposer substrate provided with the convex electrode by Example 2 step by step with FIG. FIG. 11 is a view showing step by step a manufacturing process of an interposer substrate provided with a convex electrode according to Example 2 together with FIG. 10. It is a figure which shows the manufacturing process of the interposer substrate provided with the convex electrode by Example 3 step by step with FIG. FIG. 13 is a view showing step by step a manufacturing process of an interposer substrate provided with convex electrodes according to Example 3 together with FIG. 12. It is a figure which shows the manufacturing method of the interposer board provided with the convex electrode by Example 4 along with FIG. 15 in steps. FIG. 15 is a view showing step by step a manufacturing process of an interposer substrate provided with a convex electrode according to Example 4 together with FIG. 14. FIG. 19 is a view showing step by step a manufacturing process of an interposer substrate provided with a convex electrode according to Example 5 together with FIGS. FIG. 19 is a view showing step by step a manufacturing process of an interposer substrate provided with convex electrodes according to Example 5 together with FIGS. FIG. 18 is a view showing step by step a manufacturing process of an interposer substrate provided with a convex electrode according to Example 5 together with FIGS. FIG. 21 is a view showing step by step a manufacturing process of an interposer substrate having convex electrodes according to Example 6 together with FIG. 20. FIG. 20 is a view showing step by step a manufacturing process of an interposer substrate provided with a convex electrode according to Example 6 together with FIG. 19. It is a figure which shows the manufacturing process of the interposer board provided with the mounting land of the prior art example in steps. It is a figure which shows the relationship between the mounting land of the interposer board | substrate by a prior art example, and an inspection probe. It is a figure which shows the relationship between the mounting land and wiring in the interposer board | substrate of a prior art example.

Explanation of symbols

11 ・ Interposer board, 12 ・ Wiring, 13 ・ Mounting land,
15 · Solder resist film, 23 · Ti thin film, 24 · Cu thin film,
25. Conductive film made of paste in which ultrafine particles of Ag or Cu are dispersed,
26-adsorption type Pd catalyst, 27-electroless Ni plating film,
28 ・ Electroless Au plating film,
29, 39, 49, 59, 69, 79 ・ Convex electrode,
51-a conventional prober, 52-a prober that can be used for a convex electrode,
56 ・ Cu plating film

Claims (14)

A convex electrode formed by processing a raw electrode of a component surrounded by an outer insulating film overlapping at a peripheral edge portion to become a bottom surface of a recess and whose effective portion is narrowed,
A conductive film formed by applying and heat-curing a paste in which ultrafine particles of silver or copper are dispersed on the outer layer insulating film overlapping the effective portion of the original electrode and the peripheral edge of the original electrode; An electroless nickel plating film formed in the presence of an adsorptive palladium catalyst and an electroless gold plating film formed to overlap with the conductive film,
The surface level of the convex electrode is the same as the surface of the outer layer insulating film overlapping the peripheral edge of the original electrode or protrudes from the surface of the outer layer insulating film, and the convex to the main plane of the component A projected electrode, wherein the projected area of the mold electrode is larger than the area of the effective portion of the original electrode. 2. The convex electrode according to claim 1, wherein a titanium thin film and a copper thin film are formed so as to overlap each other between an effective portion of the original electrode and the conductive film by a thin film forming method under vacuum. The convex electrode according to claim 1, wherein a manganese dioxide film is formed as a primer between an effective portion of the original electrode and the conductive film. 4. The titanium thin film, the copper thin film, and the manganese dioxide film are formed so as to overlap each other between the effective portion of the original electrode and the conductive film. The convex electrode as described. A convex electrode formed by processing a raw electrode of a component surrounded by an outer insulating film overlapping at a peripheral edge portion to become a bottom surface of a recess and whose effective portion is narrowed,
A titanium thin film formed by a thin film forming method under vacuum on the surface of the component on the original electrode side and a copper thin film formed in an overlapping manner; an effective portion of the original electrode on the copper thin film; and a peripheral portion of the original electrode A copper plating film formed via a plating resist film on a portion corresponding to the outer insulating film overlapping with
The plating resist film and the entire surface of the copper plating film exposed by removing the titanium thin film and the copper thin film under the plating resist film, and the end surfaces of the titanium thin film and the copper thin film under the copper plating film In contrast, an electroless nickel plating film formed in the presence of an adsorption-type palladium catalyst and an electroless gold plating film formed in layers,
The surface level of the convex electrode is the same as the surface of the outer layer insulating film overlapping the peripheral edge of the original electrode or protrudes from the surface of the outer layer insulating film, and the convex to the main plane of the component A projected electrode, wherein the projected area of the mold electrode is larger than the area of the effective portion of the original electrode. A convex electrode formed by processing a raw electrode of a component surrounded by an outer insulating film overlapping at a peripheral edge portion to become a bottom surface of a recess and whose effective portion is narrowed,
A titanium thin film formed by a thin film forming method under vacuum on the surface of the component on the original electrode side and a copper thin film formed in an overlapping manner; an effective portion of the original electrode on the copper thin film; and a peripheral portion of the original electrode A copper plating film formed through a plating resist film in a portion corresponding to the outer layer insulating film overlapping with each other, and an electrolytic nickel plating film formed on the upper surface of the copper plating film in the presence of the plating resist film And an electrolytic gold plating film formed in an overlapping manner, the plating resist film, the side surface of the copper plating film exposed by removing the titanium thin film and the copper thin film under the plating resist film, and the titanium thin film and the copper It has a thin film end face,
The surface level of the convex electrode is the same as the surface of the outer layer insulating film overlapping the peripheral edge of the original electrode or protrudes from the surface of the outer layer insulating film, and the convex to the main plane of the component A convex electrode, wherein the projected area of the mold electrode is larger than the area of the effective portion of the original electrode. 7. The convex electrode according to claim 1, wherein the protruding height of the convex electrode is in the range of 3 to 20 μm from the surface of the original electrode. A method of manufacturing a convex electrode that processes an original electrode of a component that is surrounded by an outer insulating film that is overlapped at a peripheral edge portion to become a bottom surface of a recess and whose effective portion is narrowed,
A step of applying a paste in which ultrafine particles of silver or copper are dispersed to the effective portion of the original electrode and the outer insulating film overlapping at the peripheral portion of the original electrode, and heating and curing to form a conductive film When,
A step of applying an adsorptive palladium catalyst to the conductive film to form an electroless nickel plating film and forming an electroless gold plating film;
The surface level of the convex electrode to be formed is the same as the surface of the outer layer insulating film overlapping the peripheral edge portion of the original electrode or protrudes from the surface of the outer layer insulating film, and the surface to the main plane of the component A method for producing a convex electrode, wherein the projected area of the convex electrode is larger than the area of the effective portion of the original electrode. 9. The step of forming a copper thin film by forming a titanium thin film on an effective portion of the original electrode by a thin film forming method under vacuum is inserted before the step of forming the conductive film. The manufacturing method of the convex electrode as described in 2. The method for producing a convex electrode according to claim 8, wherein a step of forming a manganese dioxide film as a primer is inserted into an effective portion of the original electrode before the step of forming the conductive film. Before the step of forming the conductive film, the step of forming the titanium thin film and the copper thin film on the effective portion of the original electrode and the step of forming the manganese dioxide film in an overlapping manner are inserted. The manufacturing method of the convex electrode of Claim 9 or Claim 10 to do. A method of manufacturing a convex electrode that processes an original electrode of a component that is surrounded by an outer insulating film that is overlapped at a peripheral edge portion to become a bottom surface of a recess and whose effective portion is narrowed,
Forming a copper thin film by forming a titanium thin film on the surface of the component on the side of the original electrode by a thin film forming method under vacuum; and
Forming a copper plating film via a plating resist film on a portion corresponding to the effective portion of the original electrode on the copper thin film and the outer insulating film overlapping the peripheral edge of the original electrode;
Removing the plating resist film and the titanium thin film and the copper thin film under the plating resist film;
An electroless nickel plating film is formed by applying an adsorption-type palladium catalyst to the exposed whole surface of the copper plating film and the titanium thin film under the copper plating film and an end face of the copper thin film to form an electroless gold plating film. And the process of forming
The surface level of the convex electrode to be formed is the same as the surface of the outer layer insulating film overlapping the peripheral edge portion of the original electrode or protrudes from the surface of the outer layer insulating film, and the surface to the main plane of the component A method for producing a convex electrode, wherein the projected area of the convex electrode is larger than the area of the effective portion of the original electrode. A method of manufacturing a convex electrode that processes an original electrode of a component that is surrounded by an outer insulating film that is overlapped at a peripheral edge portion to become a bottom surface of a recess and whose effective portion is narrowed,
Forming a copper thin film by forming a titanium thin film on the surface of the component on the side of the original electrode by a thin film forming method under vacuum; and
Forming a copper plating film via a plating resist film on a portion corresponding to the effective portion of the original electrode on the copper thin film and the outer insulating film overlapping the peripheral edge of the original electrode;
Forming an electrolytic gold plating film on the upper surface of the copper plating film in the presence of the plating resist film and forming an electrolytic gold plating film; and
The plating resist film and the step of removing the titanium thin film and the copper thin film under the plating resist film,
The surface level of the convex electrode to be formed is the same as the surface of the outer layer insulating film overlapping the peripheral edge portion of the original electrode or protrudes from the surface of the outer layer insulating film, and the surface to the main plane of the component A method for producing a convex electrode, wherein the projected area of the convex electrode is larger than the area of the effective portion of the original electrode. 14. The method for manufacturing a convex electrode according to claim 8, wherein the protruding height of the convex electrode is formed in a range of 3 to 20 μm from the surface of the original electrode.

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