JP2006001951A5 - - Google Patents

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Publication number
JP2006001951A5
JP2006001951A5 JP2004176393A JP2004176393A JP2006001951A5 JP 2006001951 A5 JP2006001951 A5 JP 2006001951A5 JP 2004176393 A JP2004176393 A JP 2004176393A JP 2004176393 A JP2004176393 A JP 2004176393A JP 2006001951 A5 JP2006001951 A5 JP 2006001951A5
Authority
JP
Japan
Prior art keywords
base material
pressure
sensitive adhesive
hole
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004176393A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006001951A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004176393A priority Critical patent/JP2006001951A/ja
Priority claimed from JP2004176393A external-priority patent/JP2006001951A/ja
Publication of JP2006001951A publication Critical patent/JP2006001951A/ja
Publication of JP2006001951A5 publication Critical patent/JP2006001951A5/ja
Pending legal-status Critical Current

Links

JP2004176393A 2004-06-15 2004-06-15 粘着シートおよびその製造方法 Pending JP2006001951A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004176393A JP2006001951A (ja) 2004-06-15 2004-06-15 粘着シートおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004176393A JP2006001951A (ja) 2004-06-15 2004-06-15 粘着シートおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2006001951A JP2006001951A (ja) 2006-01-05
JP2006001951A5 true JP2006001951A5 (enExample) 2006-12-07

Family

ID=35770622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004176393A Pending JP2006001951A (ja) 2004-06-15 2004-06-15 粘着シートおよびその製造方法

Country Status (1)

Country Link
JP (1) JP2006001951A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5040503B2 (ja) * 2007-07-30 2012-10-03 住友ベークライト株式会社 半導体基板加工用粘着テープおよび半導体基板加工用粘着テープの製造方法、並びに半導体装置の製造方法
CA2754511A1 (en) * 2009-03-02 2010-09-10 Lintec Corporation Pressure-sensitive adhesive sheet
US8980399B2 (en) 2010-03-04 2015-03-17 Lintec Corporation Pressure-sensitive adhesive sheet
JP5570269B2 (ja) * 2010-03-29 2014-08-13 リンテック株式会社 粘着シート
JP2012059846A (ja) * 2010-09-07 2012-03-22 Kawamura Sangyo Kk 半導体製造用粘着フィルム及びその製造方法
JP5606259B2 (ja) * 2010-10-07 2014-10-15 リンテック株式会社 粘着シート
JP2012184369A (ja) * 2011-03-08 2012-09-27 Nitto Denko Corp 粘着テープ又はシート
JPWO2024048432A1 (enExample) * 2022-08-30 2024-03-07

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