JP2005533908A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005533908A5 JP2005533908A5 JP2004524795A JP2004524795A JP2005533908A5 JP 2005533908 A5 JP2005533908 A5 JP 2005533908A5 JP 2004524795 A JP2004524795 A JP 2004524795A JP 2004524795 A JP2004524795 A JP 2004524795A JP 2005533908 A5 JP2005533908 A5 JP 2005533908A5
- Authority
- JP
- Japan
- Prior art keywords
- aramid
- weight percent
- composition according
- particulate
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 20
- 239000004760 aramid Substances 0.000 claims description 13
- 229920003235 aromatic polyamide Polymers 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000010453 quartz Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 claims description 3
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39871002P | 2002-07-25 | 2002-07-25 | |
| PCT/US2003/023225 WO2004011526A1 (en) | 2002-07-25 | 2003-07-23 | Liquid crystalline polymer compositions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005533908A JP2005533908A (ja) | 2005-11-10 |
| JP2005533908A5 true JP2005533908A5 (enExample) | 2006-07-20 |
| JP4425790B2 JP4425790B2 (ja) | 2010-03-03 |
Family
ID=31188460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004524795A Expired - Fee Related JP4425790B2 (ja) | 2002-07-25 | 2003-07-23 | 液晶ポリマー組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7128847B2 (enExample) |
| EP (1) | EP1527121B1 (enExample) |
| JP (1) | JP4425790B2 (enExample) |
| KR (1) | KR20050025991A (enExample) |
| CN (1) | CN1294207C (enExample) |
| AU (1) | AU2003256774A1 (enExample) |
| CA (1) | CA2493754A1 (enExample) |
| DE (1) | DE60305926T2 (enExample) |
| WO (1) | WO2004011526A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7744802B2 (en) * | 2004-06-25 | 2010-06-29 | Intel Corporation | Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin |
| JP2006045517A (ja) * | 2004-06-30 | 2006-02-16 | Sumitomo Chemical Co Ltd | フィルム |
| KR101148384B1 (ko) * | 2009-11-26 | 2012-05-21 | 삼성전기주식회사 | 기판 형성용 조성물, 및 이를 이용한 프리프레그 및 기판 |
| US20140004328A1 (en) * | 2012-06-27 | 2014-01-02 | Ticona Llc | Ultralow Viscosity Liquid Crystalline Polymer Composition |
| CN108882515A (zh) * | 2018-09-21 | 2018-11-23 | 维沃移动通信有限公司 | 一种信号传输器件、信号传输器件的加工方法及移动终端 |
| JP2021109891A (ja) * | 2020-01-07 | 2021-08-02 | パナソニックＩｐマネジメント株式会社 | 液晶性樹脂組成物及び成形品 |
| JP2021147476A (ja) * | 2020-03-18 | 2021-09-27 | Ｅｎｅｏｓ株式会社 | 樹脂組成物および該樹脂組成物からなる樹脂成形品 |
| CN113930084B (zh) * | 2021-09-18 | 2024-05-07 | 珠海万通特种工程塑料有限公司 | 一种液晶聚合物组合物及其应用 |
| CN118401606A (zh) | 2021-12-28 | 2024-07-26 | 住友化学株式会社 | 树脂组合物及成型体 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US525700A (en) * | 1894-09-11 | Attachment for stone-working machines | ||
| PH15509A (en) | 1974-05-10 | 1983-02-03 | Du Pont | Improvements in an relating to synthetic polyesters |
| JPH0455437A (ja) * | 1990-06-26 | 1992-02-24 | Matsushita Electric Works Ltd | 低誘電率積層板用プリプレグ |
| US5466744A (en) | 1990-11-05 | 1995-11-14 | General Electric Company | Polymerization of macrocyclic poly(alkylene dicarboxylate) oligomers |
| US5110896A (en) | 1990-12-10 | 1992-05-05 | E. I. Du Pont De Nemours And Company | Thermotropic liquid crystalline polyester compositions |
| JPH0799646B2 (ja) | 1991-05-03 | 1995-10-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 分子的多孔性エーロゲルで充填された低誘電率複合積層品 |
| US5474842A (en) * | 1991-08-20 | 1995-12-12 | Hoiness; David E. | Aramid particles as wear additives |
| US5348990A (en) | 1993-03-02 | 1994-09-20 | Hoechst Celanese Corp. | Low dielectric materials |
| ATE164175T1 (de) | 1993-05-14 | 1998-04-15 | Du Pont | Flüssigkristalline polymerzusammensetzungen |
| US5397502A (en) | 1993-06-10 | 1995-03-14 | E. I. Du Pont De Nemours And Company | Heat resistant liquid crsytalline polymers |
| US6022491A (en) * | 1996-01-05 | 2000-02-08 | E. I. Du Pont De Nemours And Company | Liquid crystalline polymer composition |
| TW515812B (en) * | 1997-04-08 | 2003-01-01 | Sumitomo Chemical Co | Composite film made from low dielectric constant resin and para-oriented aromatic polyamide |
| US6388202B1 (en) * | 1997-10-06 | 2002-05-14 | Motorola, Inc. | Multi layer printed circuit board |
| US6294618B1 (en) | 1998-04-09 | 2001-09-25 | E. I. Du Pont De Nemours And Company | Low viscosity liquid crystalline polymer compositions |
| CA2393259A1 (en) * | 2000-01-13 | 2001-07-19 | E.I. Du Pont De Nemours And Company | Liquid crystalline polymer compositions containing small particle size fillers |
-
2003
- 2003-07-10 US US10/617,117 patent/US7128847B2/en not_active Expired - Fee Related
- 2003-07-23 CN CNB038178397A patent/CN1294207C/zh not_active Expired - Lifetime
- 2003-07-23 KR KR1020057001280A patent/KR20050025991A/ko not_active Withdrawn
- 2003-07-23 EP EP03771815A patent/EP1527121B1/en not_active Expired - Lifetime
- 2003-07-23 WO PCT/US2003/023225 patent/WO2004011526A1/en not_active Ceased
- 2003-07-23 AU AU2003256774A patent/AU2003256774A1/en not_active Abandoned
- 2003-07-23 CA CA002493754A patent/CA2493754A1/en not_active Abandoned
- 2003-07-23 DE DE60305926T patent/DE60305926T2/de not_active Expired - Lifetime
- 2003-07-23 JP JP2004524795A patent/JP4425790B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6336456B2 (ja) | 多孔質の分離用物品 | |
| Qu et al. | Rational design of oil-resistant and electrically conductive fluorosilicone rubber foam nanocomposites for sensitive detectability in complex solvent environments | |
| JP2012520368A5 (enExample) | ||
| JP2005533908A5 (enExample) | ||
| JP2008508366A5 (enExample) | ||
| JP6065967B2 (ja) | ポリテトラフルオロエチレン組成物 | |
| JP2005042107A5 (enExample) | ||
| CN110776847B (zh) | 一种导电胶、原料组合物、电子元件、制备方法和应用 | |
| Wang et al. | A superhydrophobic hydrogel for self‐healing and robust strain sensor with liquid impalement resistance | |
| JP2008522949A5 (enExample) | ||
| EP2363156A3 (en) | Method of fabricating biodegradable medical devices with enhanced mechanical strength and pharmacological functions | |
| JP2006507402A5 (enExample) | ||
| WO2007016516A3 (en) | Heteropolymeric polyimide polymer compositions | |
| KR20110127212A (ko) | 기능성 성형체 및 그 제조 방법 | |
| JP2009516066A5 (enExample) | ||
| Xu et al. | Protein and Hydrophobic Association‐Regulated Hydrogels with Adhesive Adjustability in Different Materials | |
| JP2016540879A (ja) | パーフルオロポリマー材料の処理方法 | |
| Xie et al. | Ultra-stretchable conductive iono-elastomer and motion strain sensor system developed therefrom | |
| CN114072227B (zh) | 交联的粘合剂组合物 | |
| JP2011134630A (ja) | 導電性ペースト | |
| JP2009208366A (ja) | 帯電防止フィルムおよびその製造方法 | |
| EP2987832A1 (en) | Light-resistance improver | |
| JP2003176440A5 (enExample) | ||
| JP2008308682A5 (enExample) | ||
| JP2007536397A5 (enExample) |