JP2005533662A5 - - Google Patents

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Publication number
JP2005533662A5
JP2005533662A5 JP2005505593A JP2005505593A JP2005533662A5 JP 2005533662 A5 JP2005533662 A5 JP 2005533662A5 JP 2005505593 A JP2005505593 A JP 2005505593A JP 2005505593 A JP2005505593 A JP 2005505593A JP 2005533662 A5 JP2005533662 A5 JP 2005533662A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005505593A
Other languages
Japanese (ja)
Other versions
JP2005533662A (ja
Filing date
Publication date
Priority claimed from US10/267,009 external-priority patent/US6749285B2/en
Application filed filed Critical
Publication of JP2005533662A publication Critical patent/JP2005533662A/ja
Publication of JP2005533662A5 publication Critical patent/JP2005533662A5/ja
Pending legal-status Critical Current

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JP2005505593A 2002-07-25 2003-04-11 インクジェット式ノズルおよびインクジェト式ノズルで使用するための孔をレーザ孔開けする方法 Pending JP2005533662A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39863902P 2002-07-25 2002-07-25
US10/267,009 US6749285B2 (en) 2002-07-25 2002-10-08 Method of milling repeatable exit holes in ink-jet nozzles
PCT/US2003/011041 WO2004011186A1 (en) 2002-07-25 2003-04-11 Inkjet nozzle and process of laser drilling a hole for use in inkjet nozzles

Publications (2)

Publication Number Publication Date
JP2005533662A JP2005533662A (ja) 2005-11-10
JP2005533662A5 true JP2005533662A5 (zh) 2006-04-06

Family

ID=30772611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005505593A Pending JP2005533662A (ja) 2002-07-25 2003-04-11 インクジェット式ノズルおよびインクジェト式ノズルで使用するための孔をレーザ孔開けする方法

Country Status (4)

Country Link
EP (1) EP1525070A4 (zh)
JP (1) JP2005533662A (zh)
CN (1) CN1323797C (zh)
AU (1) AU2003232000A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8481887B2 (en) * 2007-05-03 2013-07-09 Electro Scientific Industries, Inc. Method for machining tapered micro holes
JP2012035306A (ja) * 2010-08-09 2012-02-23 Shibuya Kogyo Co Ltd レーザ加工方法とその装置
JP5994723B2 (ja) * 2013-05-09 2016-09-21 トヨタ自動車株式会社 レーザ穴あけ加工方法および装置
CN107598397A (zh) * 2016-08-10 2018-01-19 南京魔迪多维数码科技有限公司 切割脆性材料基板的方法
CN107187205B (zh) * 2017-06-08 2019-09-24 翁焕榕 喷嘴板及其制备方法及喷墨打印机
WO2022044245A1 (ja) 2020-08-28 2022-03-03 コニカミノルタ株式会社 ノズルプレート及びインクジェットヘッド
CN114952039A (zh) * 2021-02-20 2022-08-30 雷科股份有限公司 激光快速钻孔装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9601049D0 (en) * 1996-01-18 1996-03-20 Xaar Ltd Methods of and apparatus for forming nozzles
US5910255A (en) * 1996-11-08 1999-06-08 W. L. Gore & Associates, Inc. Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation
US5837964A (en) * 1998-01-16 1998-11-17 Chromalloy Gas Turbine Corporation Laser drilling holes in components by combined percussion and trepan drilling
US6313435B1 (en) * 1998-11-20 2001-11-06 3M Innovative Properties Company Mask orbiting for laser ablated feature formation
WO2000050198A1 (fr) * 1999-02-25 2000-08-31 Seiko Epson Corporation Procede d'usinage de pieces par faisceau laser
JP3944815B2 (ja) * 2000-12-27 2007-07-18 セイコーエプソン株式会社 インクジェット式記録装置におけるインク供給路内の洗浄制御方法
JP2002205397A (ja) * 2001-01-12 2002-07-23 Hitachi Ltd インクジェット記録装置

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