JP2005531818A - 二重素材コアによる導波管の熱的補償 - Google Patents
二重素材コアによる導波管の熱的補償 Download PDFInfo
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- JP2005531818A JP2005531818A JP2004519571A JP2004519571A JP2005531818A JP 2005531818 A JP2005531818 A JP 2005531818A JP 2004519571 A JP2004519571 A JP 2004519571A JP 2004519571 A JP2004519571 A JP 2004519571A JP 2005531818 A JP2005531818 A JP 2005531818A
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- 239000000463 material Substances 0.000 title claims description 48
- 230000009977 dual effect Effects 0.000 title description 7
- 238000005253 cladding Methods 0.000 claims abstract description 22
- 230000003287 optical effect Effects 0.000 claims description 34
- 229920000642 polymer Polymers 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000001902 propagating effect Effects 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 1
- 238000009987 spinning Methods 0.000 claims 1
- 238000000904 thermoluminescence Methods 0.000 claims 1
- 239000011162 core material Substances 0.000 description 54
- 238000010586 diagram Methods 0.000 description 20
- 239000000758 substrate Substances 0.000 description 8
- 239000012792 core layer Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 description 1
- YZYDPPZYDIRSJT-UHFFFAOYSA-K boron phosphate Chemical compound [B+3].[O-]P([O-])([O-])=O YZYDPPZYDIRSJT-UHFFFAOYSA-K 0.000 description 1
- 229910000149 boron phosphate Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Non-Reversible Transmitting Devices (AREA)
Abstract
Description
Ψは、モード光界強度;
Ψ*は、モード光界強度の共役複素数;
αは、基板の支配を受ける線形熱膨張係数;
Bは、熱光係数;
nは、実効伝播率;および
Aは、素材内で値1、素材外で0を有する1つのアパチュア関数である。サブスクリプトPCは、ポリマー・コア内を示し、GCは、Geシリカ・コア内を示し、CLは、クラッディング内を示す。
Claims (33)
- 一つの平面光波回路であって、
熱的補償をする一つの第一導波管を備え、
前記第1導波管が、
一つのクラッディングと
前記クラッディングによって実質的に閉じ込められた一つのコアと
を備え、前記コアが、前記コアを通って長手方向に走る一つの第一領域および一つの第二領域、前記第一領域が一つの負熱光定数を有し、前記第二領域が一つの正熱光定数を有し、前記第一領域が前期第二領域の一つの中心部を通って実質的に長手方向に走る、
平面光波回路。 - 前記第一領域が一つのポリマーを含む、請求項1に記載の平面光波回路。
- 前記ポリマーがシリコーン、PMMAまたはBCBを含む、請求項2に記載の平面光波回路。
- 前記第二領域がドープされたシリカを含む、請求項1に記載の平面光波回路。
- 前記第一領域が、前記第二領域の中心部を通って走る一つの囲まれたチャンネルを形成する、請求項1に記載の平面光波回路。
- 前記平面光波回路が一つの干渉計を含む、請求項1に記載の平面光波回路。
- 前記平面光波回路が一つのMach Zehnder 干渉計を含む、請求項6に記載の平面光波回路。
- 前記平面光波回路が一つのカプラーを含む、請求項1に記載の平面光波回路。
- 前記平面光波回路が一つのアレー導波管グレーティングを含む、請求項1に記載の平面光波回路。
- 熱的補償しない一つの第二導波管を更に備え、
前記第二導波管が、一つの正熱光定数を有する一つの単一素材を含む一つのコアを備える、
請求項1に記載の平面光波回路。 - 前記第一導波管がおよそ100℃の範囲に亘って熱補償している、請求項1に記載の平面光波回路。
- 前記第一導波管が10mmまで下る一つの曲げ半径を持つ、請求項11に記載の平面光波回路。
- 前記第一領域が2/3以上前記第二領域中に延びる、請求項1に記載の平面光波回路。
- 前記第二領域が一つのポリマーを含む、請求項1に記載の平面光波回路。
- 前記内部コアの幅がおよそ1ミクロン以下である、請求項1に記載の平面光波回路。
- 一つの導波管を作る方法であって、
一つの導波管の一つの第一コアを形成する段階であって、前記第一コア部分が一つの正熱光定数を有する段階と、
一つの負熱光定数を有する一つの素材で前記第一コア部分を実質的に覆うことによって一つの第二部分を形成する段階と、
前記第一コア部分と前記第二コア部分を実質的に囲む一つのクラッディングを形成する段階と
を備える、方法。 - 第2コア部分を形成する段階が、
前記第一コアを一つの第一ポリマーで覆う段階
を更に備える、請求項16に記載の方法。 - 一つのポリマーで前記第一コア部分を覆う段階が、
およそ1.45から1.6の一つの屈折率を有する一つの第一ポリマーで前記第一コア部分を被う段階
を更に備える、請求項17に記載の方法。 - 前記第一コア部分を一つの第一ポリマーで覆う段階が、
前記第一ポリマーを前記第一コア部分の周りに紡績工程を介して蓄積する段階
を更に備える、請求項17に記載の方法。 - 前記クラッディングを形成する段階が、
前記第一および第二コア部分を一つの第二ポリマーで覆う段階
を更に備える、請求項17に記載の方法。 - 前記第一および第二コア部分を一つの第二ポリマーで覆う段階が、
前記第一および第二コア部分を前記前記ポリマーのそれよりおよそ0.01から0.05小さい一つの屈折率を有する第二ポリマーで被う段階
を更に備える、請求項20に記載の方法。 - 一つの光波回路であって、
一つの電気的構成要素と、
前記電気的構成要素に接続される一つの導波管と
を備え、前記導波管が一つの光信号を伝播することができる一つのコアを有し、前記コアが一つの第一素材と一つの第二素材を含み、前記第一素材が前記第二素材の一つの中心部分を実質的に通って走り、前記第一素材が一つの正熱光定数を有し、前記第二素材が一つの負熱光定数を有する、
光波回路。 - 前記第一素材が前記コアを前記コアの一つの長さに沿って二つの部分に割る、請求項22に記載の平面光波回路。
- 前記第一素材が、前記平面光波回路の一つの一次平面に実質的に平行な一つの平面中に横たわる、請求項23に記載の平面光波回路。
- 前記第一素材が、前記平面光波回路の一つの一次平面に実質的に垂直な一つの平面中に横たわる、請求項23に記載の平面光波回路。
- 前記第一素材が一つのポリマーを含む、請求項22に記載の平面光波回路。
- 前記第二素材がドープされたシリカを含む、請求項26に記載の平面光波回路。
- 前記第二素材が一つのポリマーを含む、請求項26に記載の平面光波回路。
- 前記電気的構成要素が一つの電気/光変換器または一つの光/電気変換器である、請求項22に記載の平面光波回路。
- 前記電気的構成要素が一つの温度調整器である、請求項22に記載の平面光波回路。
- 一つの平面導波管を通して光信号をガイドする一つの方法であって、前記光信号が一つの光界を有し、前記方法が、
一つの第一材料中の前記光界の一つの第一部分をガイドする段階と、
一つの第二素材中の前記光界の一つの第二部分をガイドする段階と
を備え、前記第一素材と前記第二素材が前記平面導波管の一つのコアを含み、前記第一素材が一つの負熱光定数を有し、前記第二素材が正熱光定数を有し、前記第二素材が実質的に前記第一素材によって囲まれている、
方法。 - 前記光界の前記第一部分と前記光界の前記第二部分が実質的に同心である、請求項31に記載の方法。
- 前記光界の前記第二部分が前記光界の前記第一部分内でガイドされる、請求項31に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/190,411 US6987895B2 (en) | 2002-07-02 | 2002-07-02 | Thermal compensation of waveguides by dual material core having positive thermo-optic coefficient inner core |
PCT/US2003/017180 WO2004005988A1 (en) | 2002-07-02 | 2003-05-29 | Thermal compensation of waveguides by dual material core |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005531818A true JP2005531818A (ja) | 2005-10-20 |
JP2005531818A5 JP2005531818A5 (ja) | 2006-04-06 |
JP4221364B2 JP4221364B2 (ja) | 2009-02-12 |
Family
ID=29999877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004519571A Expired - Fee Related JP4221364B2 (ja) | 2002-07-02 | 2003-05-29 | 二重素材コアによる導波管の熱的補償 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6987895B2 (ja) |
EP (1) | EP1521986B1 (ja) |
JP (1) | JP4221364B2 (ja) |
AT (1) | ATE362123T1 (ja) |
AU (1) | AU2003240968A1 (ja) |
DE (1) | DE60313776T2 (ja) |
WO (1) | WO2004005988A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007193049A (ja) * | 2006-01-18 | 2007-08-02 | Sony Corp | 光導波路及び光モジュール |
JP4790819B2 (ja) * | 2006-10-20 | 2011-10-12 | ホアウェイ・テクノロジーズ・カンパニー・リミテッド | ハイブリッド集積された1×n個のdwdn送信機用の方法及びシステム |
US8285149B2 (en) | 2006-10-02 | 2012-10-09 | Futurewei Technologies, Inc. | Method and system for integrated DWDM transmitters |
US8285150B2 (en) | 2006-10-02 | 2012-10-09 | Futurewei Technologies, Inc. | Method and system for integrated DWDM transmitters |
Families Citing this family (14)
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US7006719B2 (en) * | 2002-03-08 | 2006-02-28 | Infinera Corporation | In-wafer testing of integrated optical components in photonic integrated circuits (PICs) |
US7194176B2 (en) * | 2002-05-29 | 2007-03-20 | Hoya Corporation | Functional optical devices and methods for producing them |
US6987895B2 (en) | 2002-07-02 | 2006-01-17 | Intel Corporation | Thermal compensation of waveguides by dual material core having positive thermo-optic coefficient inner core |
US20060140569A1 (en) * | 2004-12-28 | 2006-06-29 | Intel Corporation | Planar waveguides with air thin films used as anti-reflective layers, beam splitters and mirrors |
US8496647B2 (en) | 2007-12-18 | 2013-07-30 | Intuitive Surgical Operations, Inc. | Ribbed force sensor |
US20070003198A1 (en) * | 2005-06-29 | 2007-01-04 | Lance Gibson | Low loss optical fiber designs and methods for their manufacture |
US7406222B2 (en) * | 2006-02-16 | 2008-07-29 | Pavel Kornilovich | Composite evanescent waveguides and associated methods |
US8561473B2 (en) | 2007-12-18 | 2013-10-22 | Intuitive Surgical Operations, Inc. | Force sensor temperature compensation |
US8290325B2 (en) * | 2008-06-30 | 2012-10-16 | Intel Corporation | Waveguide photodetector device and manufacturing method thereof |
KR20140096918A (ko) * | 2013-01-29 | 2014-08-06 | 삼성전자주식회사 | 온도 무의존성 도파로 및 그 제조 방법 |
US10295739B2 (en) * | 2013-04-22 | 2019-05-21 | Cornell University | Athermal optical devices based on composite structures |
CN110927992B (zh) * | 2019-12-20 | 2023-02-28 | 武汉邮电科学研究院有限公司 | 一种光开关 |
US11372157B2 (en) | 2020-09-30 | 2022-06-28 | Nokia Solutions And Networks Oy | Integrated optical multiplexer / demultiplexer with thermal compensation |
US11480729B2 (en) | 2020-10-30 | 2022-10-25 | Nokia Solutions And Networks Oy | Thermally compensated slot waveguide |
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EP0905546A3 (en) | 1997-09-26 | 2002-06-19 | Nippon Telegraph and Telephone Corporation | Stacked thermo-optic switch, switch matrix and add-drop multiplexer having the stacked thermo-optic switch |
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US6083843A (en) * | 1997-12-16 | 2000-07-04 | Northern Telecom Limited | Method of manufacturing planar lightwave circuits |
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US6704487B2 (en) * | 2001-08-10 | 2004-03-09 | Lightwave Microsystems Corporation | Method and system for reducing dn/dt birefringence in a thermo-optic PLC device |
US6987895B2 (en) | 2002-07-02 | 2006-01-17 | Intel Corporation | Thermal compensation of waveguides by dual material core having positive thermo-optic coefficient inner core |
US20040005108A1 (en) | 2002-07-02 | 2004-01-08 | Kjetil Johannessen | Thermal compensation of waveguides by dual material core having negative thermo-optic coefficient inner core |
-
2002
- 2002-07-02 US US10/190,411 patent/US6987895B2/en not_active Expired - Fee Related
-
2003
- 2003-05-29 JP JP2004519571A patent/JP4221364B2/ja not_active Expired - Fee Related
- 2003-05-29 AU AU2003240968A patent/AU2003240968A1/en not_active Abandoned
- 2003-05-29 WO PCT/US2003/017180 patent/WO2004005988A1/en active IP Right Grant
- 2003-05-29 AT AT03731473T patent/ATE362123T1/de not_active IP Right Cessation
- 2003-05-29 DE DE60313776T patent/DE60313776T2/de not_active Expired - Lifetime
- 2003-05-29 EP EP03731473A patent/EP1521986B1/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007193049A (ja) * | 2006-01-18 | 2007-08-02 | Sony Corp | 光導波路及び光モジュール |
US8285149B2 (en) | 2006-10-02 | 2012-10-09 | Futurewei Technologies, Inc. | Method and system for integrated DWDM transmitters |
US8285150B2 (en) | 2006-10-02 | 2012-10-09 | Futurewei Technologies, Inc. | Method and system for integrated DWDM transmitters |
JP4790819B2 (ja) * | 2006-10-20 | 2011-10-12 | ホアウェイ・テクノロジーズ・カンパニー・リミテッド | ハイブリッド集積された1×n個のdwdn送信機用の方法及びシステム |
US8285151B2 (en) | 2006-10-20 | 2012-10-09 | Futurewei Technologies, Inc. | Method and system for hybrid integrated 1XN DWDM transmitter |
Also Published As
Publication number | Publication date |
---|---|
EP1521986B1 (en) | 2007-05-09 |
JP4221364B2 (ja) | 2009-02-12 |
ATE362123T1 (de) | 2007-06-15 |
DE60313776D1 (de) | 2007-06-21 |
US20040005133A1 (en) | 2004-01-08 |
US6987895B2 (en) | 2006-01-17 |
AU2003240968A1 (en) | 2004-01-23 |
EP1521986A1 (en) | 2005-04-13 |
WO2004005988A1 (en) | 2004-01-15 |
DE60313776T2 (de) | 2008-01-24 |
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