JP2005504648A - ハイブリッドmems製造方法及び新規な光memsデバイス - Google Patents

ハイブリッドmems製造方法及び新規な光memsデバイス Download PDF

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Publication number
JP2005504648A
JP2005504648A JP2003534312A JP2003534312A JP2005504648A JP 2005504648 A JP2005504648 A JP 2005504648A JP 2003534312 A JP2003534312 A JP 2003534312A JP 2003534312 A JP2003534312 A JP 2003534312A JP 2005504648 A JP2005504648 A JP 2005504648A
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JP
Japan
Prior art keywords
layer
mems
mirror
sacrificial material
electrode
Prior art date
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Pending
Application number
JP2003534312A
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English (en)
Japanese (ja)
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JP2005504648A5 (enExample
Inventor
デ・ナテール,ジェフリー・エフ
Original Assignee
ロックウェル・サイエンティフィック・ライセンシング・エルエルシー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by ロックウェル・サイエンティフィック・ライセンシング・エルエルシー filed Critical ロックウェル・サイエンティフィック・ライセンシング・エルエルシー
Publication of JP2005504648A publication Critical patent/JP2005504648A/ja
Publication of JP2005504648A5 publication Critical patent/JP2005504648A5/ja
Pending legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/351Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G02B6/3518Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0083Optical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00214Processes for the simultaneaous manufacturing of a network or an array of similar microstructural devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/04Optical MEMS
    • B81B2201/042Micromirrors, not used as optical switches
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/05Temporary protection of devices or parts of the devices during manufacturing
    • B81C2201/053Depositing a protective layers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/3564Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3584Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
JP2003534312A 2001-07-24 2002-07-17 ハイブリッドmems製造方法及び新規な光memsデバイス Pending JP2005504648A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/911,818 US6587613B2 (en) 2001-07-24 2001-07-24 Hybrid MEMS fabrication method and new optical MEMS device
PCT/US2002/022782 WO2003031321A2 (en) 2001-07-24 2002-07-17 Hybrid mems fabrication method and new optical mems device

Publications (2)

Publication Number Publication Date
JP2005504648A true JP2005504648A (ja) 2005-02-17
JP2005504648A5 JP2005504648A5 (enExample) 2005-12-02

Family

ID=25430904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003534312A Pending JP2005504648A (ja) 2001-07-24 2002-07-17 ハイブリッドmems製造方法及び新規な光memsデバイス

Country Status (4)

Country Link
US (1) US6587613B2 (enExample)
EP (1) EP1461287A2 (enExample)
JP (1) JP2005504648A (enExample)
WO (1) WO2003031321A2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0867701A1 (en) * 1997-03-28 1998-09-30 Interuniversitair Microelektronica Centrum Vzw Method of fabrication of an infrared radiation detector and more particularly an infrared sensitive bolometer
US6892003B2 (en) * 2001-04-03 2005-05-10 Sumitomo Electric Industries, Ltd. Variable dispersion compensator and optical transmission system
US7060522B2 (en) * 2001-11-07 2006-06-13 Xerox Corporation Membrane structures for micro-devices, micro-devices including same and methods for making same
US7203394B2 (en) * 2003-07-15 2007-04-10 Rosemount Aerospace Inc. Micro mirror arrays and microstructures with solderable connection sites
US7065736B1 (en) 2003-09-24 2006-06-20 Sandia Corporation System for generating two-dimensional masks from a three-dimensional model using topological analysis
US7030536B2 (en) * 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
US20060045308A1 (en) * 2004-09-02 2006-03-02 Microsoft Corporation Camera and method for watermarking film content
DE102005002967B4 (de) * 2005-01-21 2011-03-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines Bauelementes mit einem beweglichen Abschnitt
US20070018065A1 (en) * 2005-07-21 2007-01-25 Rockwell Scientific Licensing, Llc Electrically controlled tiltable microstructures
US7261430B1 (en) * 2006-02-22 2007-08-28 Teledyne Licensing, Llc Thermal and intrinsic stress compensated micromirror apparatus and method
US9586811B2 (en) * 2011-06-10 2017-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices with moving members and methods for making the same
US8623768B2 (en) * 2011-12-02 2014-01-07 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for forming MEMS devices
CN104058363B (zh) * 2013-03-22 2016-01-20 上海丽恒光微电子科技有限公司 基于mems透射光阀的显示装置及其形成方法
CN108128750B (zh) * 2017-12-14 2020-12-11 上海交通大学 一种电离式传感器的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100213026B1 (ko) * 1995-07-27 1999-08-02 윤종용 디엠디 및 그 제조공정
WO2000042231A2 (en) * 1999-01-15 2000-07-20 The Regents Of The University Of California Polycrystalline silicon germanium films for forming micro-electromechanical systems

Also Published As

Publication number Publication date
EP1461287A2 (en) 2004-09-29
US20030021523A1 (en) 2003-01-30
WO2003031321A3 (en) 2003-10-09
US6587613B2 (en) 2003-07-01
WO2003031321A2 (en) 2003-04-17

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