JP2005348272A - Common package mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a common package mounting apparatus changing a package configuration by reconfiguring a programmable device. <P>SOLUTION: This common package mounting apparatus includes: a memory packaging a plurality of programmable devices and a plurality of configuration data therein; a plurality of common packages each comprising a data selection means for selecting configuration data from the memory and data registration means for registering the selected configuration data in a programmable device; and a control package comprising a package configuration change means for changing a package configuration inside the apparatus by switching the configuration data of programmable devices mounted on the common packages. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an apparatus including a plurality of packages whose functions can be changed using a programmable device.

  In the development of an apparatus, since development with a short delivery time is required, designs that make heavy use of programmable devices are actively performed. Since most of the package functions are implemented with programmable devices, common hardware that can be changed by simply changing the configuration data of the programmable devices can be used, contributing to reduction in hardware development costs and development time. ing.

  FIG. 7 shows a configuration diagram of a conventional common package.

  Conventionally, common hardware is used, and configuration data is prepared separately in the ROM on the board for each function of the package. It was a package.

In other words, it is specified in advance by slot ID (Identification) etc. from BWB (Back Wired Board) which card is activated for which purpose when the device is activated, so configuration data stored in the corresponding ROM is saved. Individual circuits were formed in the package by registering in the programmable device. (For example, Patent Document 1)
JP 2000-165916 A (page 5, FIG. 3)

  Since a conventional apparatus uses a common package capable of mounting a plurality of functions, a plurality of configuration data are stored in advance in a ROM on a substrate and a circuit is fixed by an initialization process.

  When such a device has a redundant configuration in which the active / non-active system is switched when a failure occurs, the device configuration cannot be easily changed. Therefore, it is necessary to mount a plurality of devices in the device in advance.

  For this reason, there is a problem that the scale of the apparatus increases and the cost also increases.

  In addition, since the circuit function is fixed in the initialization process, it is necessary to prepare and evaluate all packages at the time of the device test, which increases the number of members and man-hours necessary for the evaluation.

  It is an object of the present invention to provide a common package mounting apparatus that can arbitrarily change the configuration of the apparatus package by reconfiguring programmable devices mounted on the common package.

  The common package mounting apparatus of the present invention includes a plurality of programmable devices, a memory having a plurality of configuration data mounted thereon, data selection means for selecting configuration data from the memory, and registering the selected configuration data in the programmable device. A plurality of common packages provided with data registration means for switching, and a control package provided with package configuration change means for switching configuration data of programmable devices mounted on the common package and changing the package configuration in the apparatus. .

  With this configuration, the memory that supplies the configuration data of the programmable device (flash memory card, etc.) is equipped with data for realizing multiple package functions. Enables reconfiguration to switch configuration data.

  As a result, the device configuration can be easily changed even during device operation.

  Also, a spare common package shared by a plurality of common packages, a failure notification means for notifying the control package of a failure when a failure occurs in the common package, and a control package that has received the failure notification is a spare common package This configuration includes failure recovery instruction means for selecting configuration data corresponding to the notified failure package from the memory and instructing registration to the programmable device.

  In a device that has the function of switching between active and non-operating systems when a failure occurs due to this configuration, instead of mounting multiple packages for each package on the device, by preparing a shared spare common package in multiple packages, When a failure occurs, the device configuration can be easily changed with a small package configuration, so that automatic recovery from a failure can be easily realized.

  In addition, the test configuration data pre-installed in the memory of the common package is registered in the programmable device, so that the common package is changed to the test package, and the device is tested based on the changed test package. It is the structure which has a means.

  With this configuration, when performing a device test, it is possible to easily change from a normal operation device configuration to a test device configuration.

  The test means includes a test code generation / transmission means for generating and sending a test pattern to the programmable device, and a test code reception check means for receiving and checking the test pattern. And a communication test means for performing a communication test of the interconnection.

  With this configuration, the test can be carried out with a small number of external facilities, so that the apparatus test can be carried out efficiently.

  The communication test means is also configured to perform a communication test between program devices.

  With this configuration, a common package unit test can be performed, so that the efficiency of the test can be achieved.

  According to the present invention, since a package including a memory card or the like is shared, the type of package can be reduced, and manufacturing and management costs can be reduced.

  Since reconfiguration can be performed at an arbitrary timing from the control package, a redundant configuration such as duplication can be easily realized with a small number of packages.

  In addition, since it can be easily switched to a test circuit by having a test function, it is possible to significantly reduce the shipping test at the factory and the response when a field failure occurs, thereby reducing the cost.

  FIG. 1 shows a configuration diagram of a common package mounting apparatus according to the embodiment.

  The common package mounting device 1 is a device mounted on a rack, a BTS (Base Transceiver Station), a communication-related device including an RNC (Radio Network Controller), a line device, and the like. is there.

  The common package mounting device 1 includes, for example, a function A, a function B, a function C, and a spare of the control package 2, the BWB (Back Wired Board) 3, and the common package 4.

  The control package 2 performs control for switching configuration data (hereinafter referred to as configuration data) of the common package 4 and control of the entire apparatus.

  BWB 3 is a board for backboard wiring mounted on a rack.

  The common package 4 realizes each function of the apparatus.

  The common package 4 includes a memory card 41, a configuration circuit 42, and a programmable device 43.

  The memory card 41 stores a plurality of configuration data, and the function switching can be performed by reconfiguring the programmable device at an arbitrary timing by the function switching signal and the reconfiguration trigger signal from the control package 2. Yes.

  The medium is a non-volatile memory card 41 such as a compact flash, an SD memory card, or a flash memory card.

  The configuration circuit 42 has functions such as a circuit for controlling configuration data of the common package 4 and a failure notification circuit.

  The programmable device 43 is an LSI that can be programmed. The element is a rewritable FPGA (Field Programmable Gate Array), DSP, CPU, or the like.

  FIG. 2 is an explanatory diagram of the memory layout.

  In the example of FIG. 2A, the configuration data has the same capacity for each function and is arranged from a predetermined address.

  For example, the configuration data for function A is 00000000 to 000FFFFF, the configuration data for function B is 0010000 to 001FFFFF, the configuration data for function C is 00200000 to 002FFFFF, and so on.

  The configuration circuit 42 can read the changed configuration data by changing the start address of reading the configuration data.

  By setting the capacity to 2 to the nth power, the address can be selected only for the upper address, and the circuit can be simplified.

  In the example of FIG. 2B, an index (address) of configuration data for each function is stored from a fixed address (address 0 in the figure). Although the configuration circuit is more complicated than the example of FIG. 2A, it is effective when the configuration data capacity for each function differs greatly.

  For example, the indexes of function A, function B, and function C are stored in 00000000, 00000004, and 00000008.

  In order to generate configuration data, design is performed by executing dedicated software on a personal computer or workstation on the user side and inputting a hardware description language (HDL) or a circuit diagram.

  Then, using dedicated software, the logic configuration of the system described in HDL etc. is converted into a configuration with logic gates optimized for delay or area, and further technology mapping, placement and wiring By executing, configuration data for determining the operation of the programmable device 43 is generated.

  FIG. 3 is an explanatory diagram of the failure recovery process.

  The common package mounting apparatus 1 is composed of a control package 2, a BWB 3, a function A to function C common package 4, and a spare common package 4.

  Configuration data corresponding to each function is stored in the memory card 41 of each common package 4 in advance.

  For this purpose, configuration data of necessary functions is registered in the memory card 41 in advance using a manufacturing facility.

  On the other hand, it is assumed that configuration data is not stored in the programmable device 43.

  The control package 2 stores device configuration information.

  When a failure occurs in the function A common package 4, the configuration of the apparatus is changed so that the spare common package 4 becomes the function A common package 4.

  FIG. 4 shows a flowchart of the failure recovery process.

  When the common package mounting device 1 is powered on, the control package 2 first sends a function switching signal for function A to the common package for function A according to the device configuration information.

  The configuration circuit 42 of the common package 4 for the function A selects a memory area storing the corresponding function A from the memory card 41.

  Next, a configuration trigger signal is sent from the control package 2 to the configuration circuit 42 of the common package 4.

  When receiving the configuration trigger signal, the configuration circuit 42 of the common package 4 reads the contents of the configuration data in the memory area designated by the function switching signal and writes the bit stream to the designated programmable device 43.

  Selection of the programmable device 43 can be realized by adding the designated programmable device 43 number to the configuration trigger signal. It can also be performed by an instruction of another signal from the control package 2.

  Similar processing is performed on the common package 4 of the function B and the common package 4 of the function C, thereby completing the initial processing (step S1).

  Next, the operation mode is entered, and the communication processing operation of the apparatus is entered.

  For example, it is assumed that a failure occurs in the function A common package 4 during this operation (step S2).

  The failure information is notified from the common package 4 of the function A to the control package 2 (step S3).

  When the control package 2 recognizes the failure of the common package 4 of the function A, the control package 2 sends a function selection signal of the function A to the spare common package 4 in order to switch from the common package 4 of the function A to the spare common package 4.

  When the spare common package 4 receives the function selection signal for function A, it selects the configuration data for function A in the memory card 41 (step S4).

  Next, the control package 2 sends a reconfiguration trigger signal to the spare common package 4.

  The configuration circuit 42 of the spare common package 4 sends the configuration data of the selected function A to the programmable device 43 (step S5).

  As a result, the spare common package 4 starts the operation as the function A (step S6).

  As described above, the spare package 4 can be configured in a normal signal communication state, and the configuration of the apparatus can be easily changed.

  In addition, since the same spare package 4 is sufficient even when the function B and the function C fail, the cost of the apparatus can be reduced.

  Further, simply replacing the failed common package of function A with the normal common package 4, the common package is now a spare package.

  FIG. 5 is an explanatory diagram of the test process.

  As shown in the memory layout of FIG. 5 (a), configuration data for package testing is loaded in addition to normal functions by the initial processing.

  FIG. 5 (b) shows a modified example of the test apparatus configuration.

  The original apparatus configuration has a control package 2, functions A to C, and a spare common package 4. In the common package 4, a memory 44 and a buffer 45 are added for explanation.

  For example, when testing all of the common packages 4, a function selection signal of test configuration data and a reconfiguration trigger signal are transmitted from the control package 2 to all the common packages 4. Then, the same test configuration data is registered in the programmable devices 43 of all the common packages 4. As a result, the apparatus configuration is changed to the test mode.

  Next, the control package 2 tests the common package 4 in the apparatus.

  Next, the contents of the device test will be described.

  FIG. 6 is an explanatory diagram showing details of the apparatus test.

  The test configuration data has functions such as a connection test between the programmable devices 43, a connection test between the common packages 4, an internal loopback test of the programmable device 43, and a memory check.

  Specifically, pseudo random (PN) (PN: Pseudo Random Noise) used to verify error rates and bit errors in digital wireless communications, PN code check circuit, write to internal memory / Read check circuit etc. are generated and tested.

  In addition to the PN code, the test pattern includes an increment pattern and a fixed pattern.

  Next, the test is started.

  First, a communication test is performed. A PN signal is generated by the programmable device # 1 of the package # 1 of the common package 4. Next, it is sent to the programmable device # 2.

  When the # 2 programmable device receives the PN code, it checks the PN code and determines whether it is valid.

  For example, in the case of the PN9 code, the exclusive OR of b5 and b9 is taken in the configuration from b1 to b9, and whether or not the value matches the next bit of the bitstream is normal. Check it out. If it is not normal, it is determined as an error.

  If it is normal, it itself generates a PN code and transmits it to the next programmable device # 3.

  This is repeated until all the programmable devices 43 in the common package 4 are finished.

  Next, in the case of the external communication test, the code is sent to the BWB 3 via the buffer 45.

  Then, it is received via the buffer 45 by the programmable device 43 of another common package 4.

  Among other programmable devices 43 of the common package 4, PN codes are transmitted and received, and a communication test is performed.

  As a result, by communicating the PN pattern in the signal communication path such as between the common package 4 and the programmable device 43, the communication is performed with the bit range that is actually used and the operation speed that is actually communicated. It is possible to verify whether there are data errors due to noise.

  Therefore, the test closed in one common package and the whole device test are possible.

  For example, in the test closed to one common package, the test is performed by transmitting and receiving the PN pattern by turning back at the point A of the programmable device #n of the common package #n shown in FIG.

  A circuit corresponding to this point A is generated in each programmable device of each common package 4 by test configuration data.

  For example, when there is a memory 44 associated with the programmable device 43, it is possible to detect a memory failure by writing in all areas whether there is an element failure and checking whether expected data can be read out.

  As a result, it is possible to find a manufacturing defect such as a pattern cut of the PT substrate or a solder defect, or a memory element defect.

  It is also possible to verify whether there is data corruption due to signal noise such as insufficient timing margin and crosstalk, that is, simultaneous changes in bus lines, by checking whether the access can be normally performed in the access cycle during actual operation.

  As a result, when the solder detachment, memory, device damage, etc. occur due to aging, it is possible to determine the failure point early and to determine whether the package is defective or a circuit bug. There is an advantage that can be done quickly.

  Thus, since the test can be performed without using an external measuring instrument or the like, it is possible to expect a reduction in test costs such as test equipment and test man-hours.

  Also, a method of dynamically loading configuration data from the control package 2 can be adopted. In this case, the configuration data of the common package 4 can be rewritten, and the common package is further shared.

Regarding the embodiment including the first example, the following additional notes are disclosed.
(Supplementary note 1) A plurality of programmable devices, a memory equipped with a plurality of configuration data, a data selection means for selecting configuration data from the memory, and a data registration means for registering the selected configuration data in the programmable device A common package having a plurality of common packages, and a control package having a package configuration changing means for switching configuration data of a programmable device mounted in the common package and changing a package configuration in the apparatus apparatus.
(Supplementary note 2) A spare common package shared by a plurality of common packages, a failure notification means for notifying the control package of a failure when a failure occurs in the common package, and a control package receiving the failure notification are The common package mounting device according to appendix 1, further comprising failure recovery instruction means for selecting configuration data corresponding to the notified failure package from the memory of the common package and instructing registration to the programmable device.
(Supplementary note 3) By registering the test configuration data pre-installed in the memory of the common package in the programmable device, the common package is changed to the test package, and the device is tested based on the changed test package. The common package mounting device according to appendix 1, further comprising a test means for performing the test.
(Supplementary Note 4) The test means includes a test code generation / transmission means for generating and sending a test pattern to the programmable device, and a test code reception check means for receiving and checking the test pattern. The common package mounting device according to appendix 3, further comprising a communication test means for performing a communication test of interconnections between them.
(Supplementary note 5) The common package mounting apparatus according to supplementary note 4, wherein the communication test means also performs a communication test between program devices.
(Supplementary Note 6) A configuration method of a common package mounting apparatus having a plurality of common packages on which a programmable device is mounted, the data selection step for selecting configuration data from a memory mounted on the common package, and the selected configuration A configuration method comprising: a data registration step for registering configuration data in a programmable device; and a package configuration changing step for switching configuration data of the programmable device in order to change the configuration of the apparatus.
(Appendix 7) A program for executing configuration of a common package mounting apparatus having a plurality of common packages on which a programmable device is mounted, and a data selection step for selecting configuration data from a memory mounted on the common package; A common package installation comprising: a data registration step for registering the selected configuration data in the programmable device; and a package configuration change step for switching the configuration data of the programmable device to change the configuration of the apparatus. Program to execute device configuration.

  INDUSTRIAL APPLICABILITY The present invention can be applied to an application for providing a common package mounting apparatus that can change functions using a programmable device.

Configuration diagram of the common package mounting device of the embodiment Memory layout illustration Illustration of failure recovery processing Flow chart of failure recovery processing Illustration of test process Detailed illustration of equipment test Configuration diagram of common package of conventional example

Explanation of symbols

1 Common package mounting device 2 Control package 3 BWB
4 Common Package 41 Memory Card 42 Config Circuit 43 Programmable Device 44 Memory 45 Buffer

Claims (5)

Multiple programmable devices, memory with multiple configuration data,
A plurality of common packages comprising data selection means for selecting configuration data from the memory, and data registration means for registering the selected configuration data in the programmable device;
A common package mounting apparatus comprising: a control package including a package configuration changing unit that switches configuration data of programmable devices mounted in the common package and changes a package configuration in the apparatus. A spare common package shared with multiple common packages,
A failure notification means for notifying the control package of a failure when a failure occurs in the common package;
The control package that has received the failure notification includes failure recovery instruction means for selecting configuration data corresponding to the notified failure package from the memory of the spare common package and instructing registration to the programmable device. The common package mounting device according to claim 1.   A test means for changing the common package to the test package by registering the test configuration data pre-installed in the memory of the common package in the programmable device, and testing the apparatus based on the changed test package The common package mounting device according to claim 1, further comprising: The test means is a programmable device,
Test code generation and transmission means for generating and transmitting a test pattern;
A test code reception check means for receiving and checking a test pattern;
4. The common package mounting apparatus according to claim 3, further comprising communication test means for performing a communication test of interconnections between the common packages in accordance with an instruction from the control package.   5. The common package mounting apparatus according to claim 4, wherein the communication test means also performs a communication test between program devices.

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