JP2005347540A - Terminal plate with fin, method for manufacturing the same and flexible conductor using terminal plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a terminal plate with fins with which high heat radiation can stably be obtained and a flexible conductor using the terminal plate with fins. <P>SOLUTION: The terminal plate 2 with fins are provided with a fin 1 on its external surface, 15 to 200 μm surface roughness of at least a flank 3 of the fin 1. The flexible conductor 8 has a flexible conductor material 7 connected to the terminal plate 2 with the fins. The flexible conductor has at least flanks 3 of the fins formed to proper surface roughness, so the flexible conductor 1 has superior heat radiating property, and also has its temperature rise when used for a terminal plate 2 of a flexible conductor to excellently maintain a state of connection with a flexible conductive material 7. The terminal plate 2 with the fins can speedily be manufactured by a water jet processing method with good productivity without using any postprocessing. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a finned terminal plate having an appropriate surface roughness and excellent heat dissipation, a flexible conductor using the finned terminal plate, and a method of manufacturing the finned terminal plate.

  For an electrical connection portion such as an electrical breaker that changes the distance between contacts, a device that undergoes a large temperature change, a device that vibrates, etc., a flexible material composed of a laminate of conductive thin metal plates 6 as shown in FIG. An elastic flexible conductor 10 is used in which plate-like terminal boards 9 are attached to both ends of a conductive material 7 by fastening rivets 11 (Patent Document 1). The flexible conductive material 7 may be an aggregate stranded wire of conductive metal wires. In FIG. 3, 4 is a bolt hole through which a bolt for connecting to another terminal board or the like is passed.

By the way, the flexible conductor 10 has a problem that when a large current is applied, the flexible conductor 10 generates heat to a high temperature and increases its electrical resistance, preventing a required large current from flowing.
For this reason, the terminal board has been improved by providing fins on the outer surface to increase heat dissipation and further blackening the surface to increase heat radiation.

JP 2003-92025 A

  However, in the conventional terminal board with fins, sufficient heat dissipation is not obtained, and when black is dyed, the black dye is peeled off by the thermal cooling cycle, and the heat radiation effect cannot be obtained sufficiently. There was a problem.

  Therefore, the present inventors have intensively studied the cause, and the conventional fin is processed by the wire cutting method and has a smooth surface. If this smooth surface is roughened, heat dissipation is increased. In addition, it has been found that black dyeing is difficult to peel off, and further studies have been made to complete the present invention.

  The objective of this invention is providing the manufacturing method of the terminal board with a fin in which high heat dissipation is obtained stably, the flexible conductor using the said terminal board with a fin, and the said terminal board with a fin.

  The invention according to claim 1 is the terminal plate with fins, wherein the fin has a fin on the outer surface, and the surface roughness of at least the side surfaces of the fins is 15 to 200 μm.

  A second aspect of the present invention is a flexible conductor in which the finned terminal plate according to the first aspect is connected to a flexible conductive material.

  According to a third aspect of the present invention, in the method for manufacturing a finned terminal plate having fins provided on the outer surface, the fin is provided by a water jet processing method.

  As described above, the finned terminal plate of the present invention is excellent in heat dissipation because at least the side surface of the fin is formed with an appropriate surface roughness, and when used for a terminal plate of a flexible conductor, The temperature rise is suppressed, and the connection state with the flexible conductive material is well maintained. The finned terminal board of the present invention can be manufactured quickly and with good productivity by a water jet processing method without requiring a post-process. Therefore, there is an industrially significant effect.

The invention described in claim 1 is a terminal board 2 with fins 1 as shown in FIG. 1 having a surface with an appropriate roughness and a large surface area to improve heat dissipation. Moreover, the adhesion of black dyeing is improved by setting the surface to an appropriate roughness. In FIG. 1, reference numeral 5 denotes a flexible conductive material connecting portion.
In all the drawings for carrying out the present invention, repeated description of the same reference numerals is omitted.

  In this invention, it is desirable that the entire surface of the terminal board 2 with fins 1 has a surface roughness of 15 to 200 μm. However, even if only the side surface 3 of the fin 1 has the surface roughness, the heat dissipating property is remarkably improved.

  In the present invention, the reason for prescribing the roughness of the surface of the terminal board 2 with fins 1 (such as the fin side surface 3) to 15 to 200 μm is that if less than 15 μm, the heat dissipating property is not sufficiently improved, and if exceeding 200 μm, This is because the effect is saturated and the appearance is deteriorated. The surface roughness is particularly preferably 15 to 100 μm.

  In the present invention, the method for setting the surface roughness to 15 to 200 μm can be applied by a method for roughening the surface by performing post-processing such as paper polishing after processing by a wire cut processing method, According to the method, the surface can be roughened without post-processing, and the productivity is excellent.

The water jet processing method is a method in which water containing an abrasive is cut at a location where the water is to be cut by ultra-high pressure, and the surface roughness after processing selects the particle size of the abrasive. Can be adjusted arbitrarily. The water jet processing method has advantages that the processing speed is high and the productivity is excellent as compared with the wire cut processing method.
Hereinafter, the present invention will be described in detail by examples.

A copper block having a predetermined shape was cut out by a water jet processing method, and fins were provided on the outer surface of the copper block by a water jet processing method to produce a terminal plate 2 with fins 1 having the shape shown in FIG.
Next, two terminal boards 2 are prepared, and both ends of a flexible conductive material 7 in which a large number of copper thin plates 6 are laminated are connected to each flexible conductive material connecting portion 5 as shown in FIG. Thus, the flexible conductor 8 was manufactured. The water jet processing was performed using an abrasive cutting system (manufactured by Flow Japan Co., Ltd.). The particle size of the abrasive was varied.
In FIG. 2, the flexible conductor of the present invention is also one in which the finned terminal plate of the present invention is used on one side of the flexible conductive material 7.

  A copper block having a predetermined shape was cut out by a wire cutting method, and fins were provided on the outer surface of the copper block by a water jet processing method to produce a terminal board 2 with fins having the shape shown in FIG. Next, the flexible conductor 8 was manufactured by the same method as Example 1 using this terminal plate 2 with a fin.

(Comparative Example 1)
A copper block having a predetermined shape was cut out by a wire cutting method, and fins were provided on the outer surface of the copper block by a wire cutting method to produce a terminal board (terminal plate) 2 having the shape shown in FIG. Next, a flexible conductor was manufactured by the same method as in Example 1 using the terminal board 2 with fins.

Each of the flexible conductors manufactured in Examples 1 and 2 and Comparative Example 1 was connected in series, and a predetermined current was applied. The temperature of each finned terminal plate was measured 4 hours after reaching a steady state. The temperature was measured by soldering a thermocouple to a predetermined position on the terminal board 2.
The results are shown in Table 1. Table 1 also shows the surface roughness of the fin side surface. The surface roughness was measured according to JIS B 0601 to determine the centerline average roughness.

表１から明らかなように、本発明例のフィン付き端子板のうち、全面を適度の粗度とした実施例１の端子板（Ｎｏ．１〜６）は端子板温度が９６℃以下になり、またフィン側面のみを適度の粗度とした実施例２の端子板（Ｎｏ．７）も９８℃と低い温度であった。
これは本発明例の端子板は表面粗度が大きいため、端子板表面からの対流或いは輻射による熱放散量が増大したためである。
一方、比較例１の端子板（Ｎｏ．８）は表面粗度が小さいため、熱放散量が少なく１０１℃の高温となった。

As apparent from Table 1, among the finned terminal boards of the present invention, the terminal board (Nos. 1 to 6) of Example 1 having an appropriate roughness on the entire surface had a terminal board temperature of 96 ° C. or lower. Further, the terminal board (No. 7) of Example 2 in which only the fin side surface had an appropriate roughness was also as low as 98 ° C.
This is because the terminal board of the example of the present invention has a large surface roughness, and the amount of heat dissipated by convection or radiation from the terminal board surface is increased.
On the other hand, since the terminal board (No. 8) of Comparative Example 1 had a small surface roughness, the heat dissipation amount was small and the temperature was 101 ° C.

  A flexible conductor was manufactured by the same method as in Example 1, except that the finned terminal plate manufactured in Example 1 was subjected to blackening treatment. The black dyeing treatment was performed according to the usual steps of degreasing, pickling, black dyeing and drying.

  A flexible conductor was produced by the same method as in Example 3 except that the finned terminal plate produced in Example 3 was subjected to blackening treatment. The black dyeing treatment was performed in the same manner as in Example 2.

(Comparative Example 2)
A flexible conductor was produced by the same method as in Comparative Example 1 except that the finned terminal plate produced in Comparative Example 1 was subjected to blackening treatment. The black dyeing treatment was performed in the same manner as in Example 2.

The flexible conductors manufactured in Examples 3 and 4 and Comparative Example 2 were connected in series, a predetermined current was passed, and the temperature of each finned terminal plate was measured 4 hours after reaching a steady state. The temperature was measured by soldering a thermocouple to a predetermined position on the terminal board 2.
The results are shown in Table 2. Table 2 also shows the surface roughness of the fin side surface. The surface roughness was measured according to JIS B 0601 to determine the centerline average roughness.

表２から明らかなように、全面を適度の粗度とし、かつ黒染処理を施した実施例３の端子板（Ｎｏ．９〜１４）は端子板温度が９０℃以下になった。またフィン側面のみを適度の粗度とし、かつ黒染処理を施した実施例４の端子板（Ｎｏ．１５）も８７℃と低い温度であった。これは本発明例品は表面粗度が大きいため、端子板表面からの対流或いは輻射による熱放散量が増大したためである。

As is clear from Table 2, the terminal board temperature of Example 3 (Nos. 9 to 14) in which the entire surface was moderately roughened and subjected to blackening treatment had a terminal board temperature of 90 ° C. or lower. Further, the terminal board (No. 15) of Example 4 in which only the fin side surface had an appropriate roughness and was subjected to blackening treatment also had a low temperature of 87 ° C. This is because the product according to the present invention has a large surface roughness, and the amount of heat dissipated by convection or radiation from the surface of the terminal board is increased.

  On the other hand, since the terminal board (No. 16) of the comparative example had a small surface roughness, the heat dissipation amount was reduced and the temperature was 93 ° C.

  After the test, the presence or absence of black dye peeling was examined, but no peeling was observed on the water jet processed surface. Partial peeling was observed on the wire cut surface.

  As mentioned above, although the case where the terminal board with a fin of this invention was used for the terminal board of a flexible conductor was demonstrated, the terminal board with a fin of this invention is the same even if it uses it for the other electrically-conductive member which is easy to carry out heat_generation | fever. An effect is obtained. Moreover, the same effect can be obtained when the material is not limited to copper but is applied to aluminum or steel.

  Moreover, the manufacturing method using the water jet machining method of the present invention is not limited to the manufacture of a finned terminal plate, but may be any heat transfer member that requires thermal conductivity (heat dissipation) such as a normal terminal plate. The effect is manifested when applied to manufacturing.

It is an isometric view explanatory drawing of the terminal board with a fin of this invention. It is a perspective explanatory view of a flexible conductor using the terminal board with fins of the present invention. It is a perspective explanatory view of a flexible conductor using a plate-like terminal board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Fin 2 Terminal board with fin 3 Side surface of fin 4 Bolt hole 5 Flexible conductive material connection part 6 Copper thin plate 7 Flexible conductive material 8 Flexible conductor using the terminal board with fin of this invention 9 Plate-shaped terminal board 10 Flexible conductor 11 using a plate-shaped terminal plate Rivet for attaching a plate-shaped terminal plate

Claims (3)

  A finned terminal plate having fins on the outer surface, wherein the fin has a surface roughness of 15 to 200 μm at least on the side surface of the fin.   A flexible conductor, wherein the terminal board with fins according to claim 1 is connected to a flexible conductive material.   In the manufacturing method of the terminal board with a fin by which the fin was provided in the outer surface, the said fin is provided by the water jet processing method, The manufacturing method of the terminal board with a fin characterized by the above-mentioned.

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