JP2005340284A - Heatsink - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heatsink with which mold release at the time of molding is easy and whose manufacture cost can be reduced. <P>SOLUTION: The heatsink 100 is provided with a substrate 101, a plurality of cooling fins 102 erected on the substrate 101, and a plurality of bosses 103 arranged in prescribed positions in a region where the cooling fins 102 on the substrate 101 are disposed. They are integrally molded by casting a metal material of sufficient thermal conductivity. The cooling fins 102 are arranged on the substrate 101 in parallel. A part of the cooling fins 102 adjacent to the boss 103 is removed. Height of the boss 103 is almost the same as that of the cooling fin 102. The tip of the boss 103 is a flat face wider than the area of the tip of an injector pin. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat sink, and more particularly to a heat sink structure that can be easily finished after molding and can reduce manufacturing costs.

  Heat sinks for cooling electronic components that generate heat are widely used in computers, power supplies, and the like (see Patent Document 1). In particular, recently, there has been an increasing demand for large heat sinks used for large-capacity power supplies.

The heat sink is formed by casting a metal material having high thermal conductivity. In particular, in the case of a large heat sink, a rod called an ejector pin is protruded into the mold and the object to be molded is pushed out to release the heat sink. Therefore, a flat area where the ejector pin of the heat sink can be pressed must be secured. As shown in FIG. 4, for example, in the conventional heat sink 400, the cooling fins in the region 401 are deleted, and the flat surface of the substrate 101 is exposed in this region 401.
JP-A-9-19163

  By the way, mold release by an ejector pin is performed before a to-be-molded body solidifies completely. Therefore, an ejector pin trace is formed in the pressed portion, and a “burr” is formed along the pin diameter. If a part of this burr is removed as a metal piece, various problems such as short circuit of the electronic circuit and destruction of the electronic circuit may occur. Therefore, the burr removal work is indispensable. However, since it is very difficult to remove burrs formed on the back side of the cooling fins of the heat sink (fin base), there is a problem that the manufacturing cost increases as a whole due to an increase in work time and work man-hours. .

  Accordingly, an object of the present invention is to provide a heat sink that can be easily released during molding and can reduce manufacturing costs.

  The object of the present invention includes a substrate, a plurality of cooling fins erected on the substrate, and at least one boss provided in a region where the cooling fins are provided on the substrate. It is achieved by a heat sink characterized in that

  According to the present invention, since the burr is formed on the boss when the heat sink is released, it is easy to remove the burr, and finally the manufacturing cost of the heat sink can be reduced. Further, since the surface area of the heat sink is increased by the presence of the boss, the cooling performance can be improved.

  In a preferred embodiment of the present invention, the boss has a height substantially the same as the height of the cooling fin.

  According to the present invention, the tip of the boss can be smoothed together with the tip of the cooling fin only by polishing the surface on the tip side of the cooling fin. Cost can be reduced.

  In a further preferred embodiment of the present invention, the heat sink has a plurality of the bosses, and each boss is discretely provided on the substrate.

  According to a further preferred embodiment of the present invention, it is possible to reliably perform release, particularly when the heat sink is large.

  In a further preferred embodiment of the present invention, the plurality of cooling fins are arranged in parallel, and at least a part of the cooling fins adjacent to the boss is removed.

  According to a further preferred embodiment of the present invention, the cooling fins adjacent to the boss are partially removed, and the gap between the cooling fins is consistently secured, so that the air flowing between the cooling fins is blocked by the boss. The cooling performance can be improved.

  According to the present invention, since the burr is formed on the boss when the heat sink is released, it is easy to remove the burr, and finally the manufacturing cost of the heat sink can be reduced. Further, since the surface area of the heat sink is increased by the presence of the boss, the cooling performance can be improved.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic perspective view showing the structure of a heat sink according to a preferred embodiment of the present invention. 2 is a schematic cross-sectional view along the XX direction in FIG. 1, and FIG. 3 is a schematic cross-sectional view along the YY direction in FIG.

  As shown in FIGS. 1 to 3, the heat sink 100 includes a substrate 101, a large number of cooling fins 102 erected on the substrate 101, and a region on the substrate 101 where the cooling fins 102 are provided. A plurality of bosses 103 provided at predetermined positions are integrally formed by casting a metal material having good thermal conductivity.

  The cooling fins 102 are arranged in parallel on the substrate 101, and a part of the cooling fins 102 adjacent to the boss 103 is removed. In this way, the cooling fins adjacent to the boss 103 are partially removed, and the gap between the cooling fins is consistently secured in the YY direction, so that the cooling fins flow in the YY direction. Air is not blocked by the boss. Therefore, the cooling performance of the heat sink 100 can be improved.

  The boss 103 is a substantially cylindrical trapezoidal protrusion provided at a position corresponding to an ejector pin (not shown) used when the heat sink 100 is released. Since the ejector pins are discretely arranged so that the entire substrate 101 can be pressed evenly, the bosses 103 are also provided at positions corresponding thereto.

  The tip portion of the boss 103 is a flat surface wider than the area of the tip portion of the ejector pin. For example, when the diameter of the tip of the ejector pin is 4 mm, the diameter of the tip of the boss is set to 6 mm. By doing in this way, at the time of mold release, since the ejector pin reliably strikes the flat surface of the tip portion of the boss 103, the heat sink 100 can be reliably released.

  The height of the boss 103 is substantially the same as the height of the cooling fin 102. Thereby, the efficiency of the deburring work can be improved. That is, burrs are generated on the flat surface of the tip portion of the boss 103 at the time of mold release. The tip portion can be made smooth, and the burr on the boss 103 can be easily removed. Further, since the surface area of the entire heat sink is increased by the presence of the boss 103, the cooling performance can be improved as compared with the conventional heat sink structure in which the portion pressed by the ejector pin does not protrude. Note that the height of the boss 103 is “substantially the same” as the height of the cooling fin 102 does not require strict identity but can be processed together with the cooling fin 102 and the boss 103. This means that it is sufficient if the height is uniform.

  As described above, according to the heat sink according to the present embodiment, the boss having substantially the same height as the cooling fin is provided at a predetermined position on the substrate. The tip of the boss can be smoothed together with the tip of the cooling fin only by polishing one. That is, finishing work after molding becomes easy, and the manufacturing cost can be reduced. Further, since the surface area is increased due to the presence of the boss, the cooling performance of the heat sink can be improved.

  The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the invention described in the claims, and these are also included in the present invention. Needless to say.

  For example, in the above-described embodiment, the case where a plurality of bosses (six in FIG. 1) are provided has been described. However, the present invention is not limited to this. For example, when the entire heat sink is not so large, the boss It is possible to provide only one at the center of the substrate. That is, the number of bosses may be any number, and may be determined based on the size of the heat sink substrate, the number of cooling fins, the fin interval, and the like.

  Moreover, in the said embodiment, although the shape of a boss | hub is a substantially cylindrical trapezoid shape, it is not limited to this, For example, a substantially quadrangular prism base shape may be sufficient. In other words, any protrusion may be used as long as the tip portion is a flat surface.

  Moreover, in the said embodiment, although the case where it shape | molds in the state which the boss | hub and the cooling fin couple | bonded was demonstrated, it is not limited to this, A boss exists in the independent state, A boss | hub and a cooling fin And may be molded in a separated state.

  In the above embodiment, the case where the boss 103 has almost the same height as the cooling fin 102 has been described. However, the present invention is not limited to this. For example, the boss 103 is more than the cooling fin 102. It may be high or low. In such a case, it is difficult to remove the burrs on the boss only by polishing the surface on the tip side of the cooling fin, but manually using a predetermined tool one by one. In the case of removing burrs, if bosses are provided, burrs at the time of mold release are formed on the bosses, so that burrs can be easily removed.

  The present invention can be applied to any heat sink, but is particularly effective for a large heat sink. Therefore, it can be preferably used for a heat sink of an in-vehicle DC-DC converter, for example.

FIG. 1 is a schematic perspective view showing the structure of a heat sink according to a preferred embodiment of the present invention. FIG. 2 is a cross-sectional view along the XX direction of FIG. FIG. 3 is a cross-sectional view along the YY direction of FIG. FIG. 4 is a schematic perspective view showing the structure of a conventional heat sink.

Explanation of symbols

100 Heat Sink 101 Substrate 102 Cooling Fin 103 Boss 400 Heat Sink 401 Flat Area

Claims (4)

  It has a board | substrate, several cooling fins standingly arranged on the said board | substrate, and at least 1 boss | hub provided in the area | region in which the said cooling fin is provided on the said board | substrate, It is characterized by the above-mentioned. heatsink.   The heat sink according to claim 1, wherein the boss has a height substantially equal to a height of the cooling fin.   The heat sink according to claim 1, wherein a plurality of the bosses are provided, and each boss is provided discretely on the substrate.   The heat sink according to any one of claims 1 to 3, wherein the plurality of cooling fins are arranged in parallel, and at least a part of the cooling fins adjacent to the boss is removed. .

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