M339900 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱鰭片模組的結合構造改良，係 利用各散熱鰭片摺邊部的插孔與插片可相對嵌入，藉此扣 接形成一散熱鰭片模組，使散熱籍片模組可與底座結合， 用以構成一散熱器。 【先前技術】 習知散熱器的散熱鰭片模組，其係由複數個散埶缺 以間隔相鄰的層疊排列而組成一散麟片模組，並將= 縛片模組依附結合於一金屬底座而構成一散熱器，且所述 底座亦可依需求再配置結合一個以上的熱管。通常，散熱 鰭片或底座係採鋁質或銅質金屬，為利用底座（或熱管） 接觸晶體熱源，使熱源可通過散熱籍片模組進行散熱。此 ^ ’習知散熱韓片模組，亦可在其周邊再結合—組以上的 散熱風扇，用以辅助加速散熱。 習知散熱韓片與底座大多是採用焊接而完成結合，故 組裳較複雜，或另-習知方式，則是將各散熱簿片逐片的 置入底座預設的加工溝槽，再施以加壓而緊配結合，但其 製造上也相對困難，成本亦較高。 八 【新型内容】 之主要目的’乃在於提供一種散熱韓片模組的 、口口以5又计，係使複數個散熱鰭片以相鄰扣接方式組人 有片均呈矩形片狀，於選定一側或兩對應側各： "、。卩，惟其特別是在摺邊部與鰭片本體的交界處開 M339900 設插孔，而在摺邊部與插孔的相對前端設有對應插片，於 插片上並沖設·—止凸部，因此，不但製造上更方便，且 前、後相鄰的散熱鰭片係以平行推移方式，令前、後散熱 鰭片可直接將插片推移嵌入插孔，以形成穩固的扣接組合 ，並簡化散熱鰭片模組的裝配工作，使整體組裝更迅速確 實，且省時快速。 本創作之次要目的，乃在於提供一種散熱鰭片模組的 結合構造設計，各散熱鰭片於摺邊部所設的插片，係進一 步在插片端面設有四面導角部，因此使插片可快速引導而 嵌入相對插孔，精確完成扣接組合。 本創作之又一目的，乃在於提供一種散熱鰭片模組的 結合構造設計，該散熱鰭.片模組係與一底座結合，以構成 一散熱器，或可依需求再配置結合一個以上的熱管，或亦 可在散熱鰭片模組的周邊再結合一組以上的散熱風扇，用 以輔助加速散熱。 【實施方式】 茲依附圖實施例將本創作之結構特徵及其他之作用、 目的詳細說明如下： 如第一圖至第三圖所示，本創作所為「散熱鰭片模組 的結合構造」設計，主要係由複數個散熱鰭片1以相鄰扣 接的方式組成，如第四圖所示，各散熱鰭片1均呈矩形片 狀，於選定一側或兩對應側各設有一摺邊部11、12，惟其 特別是在摺邊部11、12與鰭片本體的交界處開設插孔13， 而在摺邊部11、12與插孔13相對水平位置的前端設有一呈 6 M339900 適當延伸的對應插片14(請參閱第五、六圖所示），並於 該插片14沖設一向内翹起的卡止凸部15，以便可將前、後 相鄰的散熱鰭片1採用平行推移方式將各插片14直接嵌入 各相鄰對應的插孔13，穩固快速的完成扣接組合，進而組 成一散熱鰭片模組，並可與底座2結合，用以構成一散埶 器。 ”、、 上述的底座2，其係一具良好導熱性的金屬座體，例 如可採用鋁質或銅質金屬，即俗稱鋁底或銅底，主要係供 貼，於晶體（如CPU)的發熱部位，以將晶體的熱溫引導 至散熱韓片模組，進而通過各散熱籍片i完成散熱工作。 為了使前、後散熱鰭片i的插片14與插孔13可更快速 ^準的嵌人扣合，所述各個插片14，係進—步在端面部位 设有四面均適當削切的導角部141及142，因此令各插片Μ 可快速引導嵌人各㈣插孔13，以精確完成扣接組合。 如上所述，本創作的散熱鰭片模組，於實施睹後㈣M339900 VIII. New Description: [New Technology Field] This creation is about the improvement of the joint structure of a heat sink fin module. The sockets and the inserts of the fins of each heat sink fin can be relatively embedded. A heat sink fin module is formed to integrate the heat sink chip module with the base to form a heat sink. [Prior Art] A heat dissipating fin module of a conventional heat sink is composed of a plurality of diverging ridges and a plurality of spaced apart adjacent stacked layers to form a slab module, and the splicing module is attached to the splicing module. The metal base forms a heat sink, and the base can be further configured to combine more than one heat pipe according to requirements. Usually, the heat sink fins or the base are made of aluminum or copper metal, so that the base (or heat pipe) is used to contact the crystal heat source, so that the heat source can dissipate heat through the heat sink module. This ^ 'fabricated heat sink Korean module can also be combined with a cooling fan above the group to help accelerate heat dissipation. Conventional heat sinks and bases are mostly welded and finished. Therefore, the group skirts are more complicated, or the other-known method is to place the heat-dissipating sheets into the processing grooves preset by the base. It is tightly combined with pressurization, but it is relatively difficult to manufacture and costly. The main purpose of the [new content] is to provide a heat-dissipating Korean module with a port count of 5, which makes the plurality of heat-dissipating fins have a rectangular shape in the adjacent fastening manner. On the selected side or on the corresponding side: ",.卩, but in particular, the M339900 is provided at the junction of the flanged portion and the fin body, and the corresponding insertion piece is provided at the opposite end of the flange portion and the socket, and is punched on the insertion piece. Therefore, not only is it more convenient to manufacture, but the front and rear adjacent fins are parallel-moving, so that the front and rear fins can directly insert the insert into the jack to form a stable fastening combination. It also simplifies the assembly work of the heat sink fin module, making the overall assembly quicker and more accurate, and saving time and time. The second objective of the present invention is to provide a combination structure design of a heat dissipation fin module, and the insertion fins of the heat dissipation fins at the flange portion are further provided with four-sided guide portions on the end faces of the insertion sheets, thereby The tabs can be quickly guided and embedded in the opposite jacks to precisely complete the snap combination. Another object of the present invention is to provide a combination structure design of a heat dissipation fin module, which is combined with a base to form a heat sink, or can be combined with more than one according to requirements. The heat pipe may also be combined with a plurality of cooling fans at the periphery of the heat sink fin module to assist in accelerating heat dissipation. [Embodiment] The structural features and other functions and purposes of the present invention are described in detail below with reference to the accompanying drawings: As shown in the first to third figures, the present invention is designed as a "combination structure of heat sink fin modules". The main fins 1 are composed of a plurality of fins 1 adjacent to each other. As shown in the fourth figure, each of the fins 1 has a rectangular shape, and each of the selected sides or two corresponding sides is provided with a folded edge. The portions 11, 12 are only provided with a socket 13 at the boundary between the flange portions 11, 12 and the fin body, and a front end of the flange portion 11, 12 and the socket 13 is disposed at a front end of a horizontal position of 6 M339900. The corresponding corresponding insertion piece 14 (refer to the fifth and sixth figures), and the locking piece 15 which is inwardly lifted is punched in the insertion piece 14 so that the front and rear adjacent heat dissipation fins 1 can be The inserts 14 are directly embedded in the adjacent corresponding jacks 13 in a parallel manner, and the fastening assembly is stably and quickly completed, thereby forming a heat sink fin module, and can be combined with the base 2 to form a heat sink. Device. The above-mentioned base 2 is a metal seat body with good thermal conductivity, for example, aluminum or copper metal, which is commonly known as an aluminum bottom or a copper base, and is mainly applied to a crystal (such as a CPU). The hot part is used to guide the thermal temperature of the crystal to the heat-dissipating Korean chip module, and then the heat-dissipating work is completed by the heat-dissipating pieces i. In order to make the inserts 14 and the jacks 13 of the front and rear heat-dissipating fins i more rapid The inserts 14 are provided with guide portions 141 and 142 which are appropriately cut on all four sides in the end face portion, so that the inserts can quickly guide the embedded (four) jacks. 13, to accurately complete the fastening combination. As mentioned above, the heat sink fin module of this creation, after the implementation (four)
成一附有熱管的散熱器，關於熱 故不贅述。同理可知，該散熱器 (圖中未顯示），用以組成一 管的配置結合因屬習知，故不 當然也可在散熱鰭片模組的周邊 的散熱風扇（圖中未顯示），用 第七圖至第九圖所示， 邊再適當鎖設結合一組以上 用以辅助加速散熱。 冲設形成的卡止凸部〗5 a ’為揭不本創作中關於插片14 a 之另—貫施例，於此實施例中， 7 M339900 :主，是進—步將插片14a沖㈣位的餘料於沖壓時亦 ::广故出現一明顯的間隙孔14〇3，但沖設成型的 :15 a同樣仍是向内翹起’而前、後相鄰的散熱鰭 a亦问樣是採用平行推移方式將各插片心直接私 入各相鄰對應的插孔13a，以迅速穩固的完成扣合。同理 的^各個插片14a ’亦均可在其端面部位設有四面削切 料角部14la&142a，以方便快速引導插片心嵌入插 孔 13 a 〇A heat sink with a heat pipe is not mentioned in the heat. Similarly, the heat sink (not shown) is used to form a tube. As a matter of course, the heat sink fan (not shown) can be used in the periphery of the heat sink fin module. As shown in the seventh to ninth diagrams, a suitable combination of more than one set is used to assist in accelerating heat dissipation. The locking protrusion formed by the punching is 55 a ' is another embodiment of the insert 14 a in the present invention. In this embodiment, 7 M339900: the main is the step of punching the insert 14a (4) The remaining material in the stamping is also:: There is a clear clearance hole 14〇3, but the punching is formed: 15 a is still inwardly tilted 'the front and rear adjacent heat sink fins a It is also said that the insert cores are directly slid into the adjacent corresponding insertion holes 13a by the parallel shifting method, so as to complete the fastening quickly and stably. Similarly, each of the inserts 14a' can also be provided with four-side cutting corners 14la & 142a at its end faces for facilitating quick guiding of the insert core insertion holes 13 a 〇
如第二圖所示，上述位於散熱縛片模組的第一只散熱 1片1依其組裝上的需要，該第一只散熱續片1，只要 開設插孔13即可，而不必另設插片，因第-只散熱韓片i， 僅供相鄰的第二只散熱鰭片i嵌插結合，故可省略插片， 併此指明。 上述實施例所揭，其係本創作技術内容的例舉說明， 並非用以蚊本案的技㈣圍，舉凡涉及#效應用或基於 #前項技術手段所為之其它簡易變更或置換，均仍屬本案技 術範圍内。 • ㉟上所述’可知本創作所為「散熱n片模組的結合構 -造」設計，其手段應用與技術特徵確為新顆首創，且具有 預期功效，為此申請新型專利，敬才斤依法賜准專利，實 為德便。 ' 8 M339900 【圖式簡單說明】 第一圖為本創作的組合立體圖。 第二圖為本創作的分解立體圖。 第三圖為本創作的組合斷面圖。 第四圖為本創作中單—散熱鰭片的立體圖。 弟五圖為弟四圖的局部示意圖。 第六圖為第五圖的A — A剖面圖。 第七圖為本創作中散熱鰭片的另一實施例立體圖。 弟八圖為第七圖的局部示意圖。 弟九圖為弟八圖的B —* B剖面圖。 【主要元件符號說明】 1、Γ、1 a 散熱鰭片 11、12摺邊部 13、13 a 插孔 14、14 a 插片 15、15 a 卡止凸部 2 底座 141、142、141 a、142a 導角 3 部焊錫 140 a 間隙孔As shown in the second figure, the first heat dissipating 1 piece 1 in the heat dissipating die module is required for assembly, and the first heat dissipating film 1 can be opened as long as the jack 13 is opened. The insert, because of the first-only heat sink i, only the adjacent second heat sink fin i is inserted and inserted, so the insert can be omitted, and this is indicated. The above embodiments are illustrative of the technical content of the present invention, and are not intended to be used in the case of mosquitoes, and any other simple changes or replacements involving the #effect or based on the technical means of the preceding paragraph are still in the present case. Within the technical scope. • 35 mentioned above, 'This book is designed as the combination of “heat-dissipating n-chip modules”. Its application and technical features are the first of its kind, and it has the expected effect. For this application, a new patent is applied. It is a virtue to grant a patent in accordance with the law. ' 8 M339900 [Simple description of the diagram] The first picture is a combined perspective view of the creation. The second figure is an exploded perspective view of the creation. The third picture is a combined sectional view of the creation. The fourth picture is a perspective view of the single-heat dissipation fin in the creation. The fifth picture of the younger brother is a partial schematic diagram of the four figures of the brother. The sixth picture is the A-A cross-sectional view of the fifth figure. The seventh figure is a perspective view of another embodiment of the heat dissipation fins in the creation. The eighth picture of the younger brother is a partial schematic diagram of the seventh figure. The younger figure is the B-*B section of the eighth figure. [Description of main component symbols] 1. Γ, 1 a heat dissipation fins 11, 12 flange portions 13, 13 a sockets 14, 14 a tabs 15, 15 a locking projections 2 bases 141, 142, 141 a, 142a lead angle 3 solder 140 a clearance hole