JP2005337262A - Driving device, lens driving device and camera - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enlarge the displacement amount in the longitudinal direction of a wire made of a shape memory alloy. <P>SOLUTION: This driving device includes: a bendable wire made of a shape memory alloy; an energizing means for producing tensile force in the longitudinal direction of the wire; a bending means having a plurality of abutting parts abutting on the wire for bending the wire; and an exciting means for applying an electric current through the wire through the abutting parts, wherein the plurality of abutting parts are abutted on the wire, and the wire is displaced in the longitudinal direction by the energizing means. In the wire of the respective sections determined by the abutting parts adjacent to each other, the abutting parts to which the electric current is applied are determined so that the sections are different in amount of electric current flowing through the wire. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a driving device, and more particularly to a driving device that generates a driving force by utilizing the characteristics of a shape memory alloy.

  Conventionally, as disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-310181 (see page 2, FIG. 11) and Japanese Patent Application Laid-Open No. 5-224136 (see page 3, FIG. 3), wire shape memory A drive device using an alloy member is known. In such a drive device, when the shape memory alloy member is heated to a temperature higher than the transformation temperature, it changes to the memorized shape, and when it is cooled to a temperature lower than the transformation temperature, it changes to the original shape. We are using. Since the displacement amount of the shape memory alloy member is several percent of the total length, it is necessary to lengthen the total length of the shape memory alloy member in order to obtain a sufficient output (displacement amount) as the driving device. However, if the shape memory alloy members are arranged linearly, a large space is required.

  Therefore, in recent years, a drive device has been proposed in which a shape memory alloy member having a long overall length can be arranged in a small space by winding the shape memory alloy member around a winding member. Such driving devices are disclosed in, for example, Japanese Patent Laid-Open No. 2000-310181 (see page 6, FIG. 1), Japanese Patent Laid-Open No. 8-226376 (see page 3-5, FIG. 1), and Japanese Patent Laid-Open No. 10-148174. No. 2 (page 2-3, see FIG. 1) and Japanese Patent Application Laid-Open No. 8-77774 (see page 5, FIG. 5).

  However, as described in these documents, when the shape memory alloy member is wound around the winding member, the displacement amount of the shape memory alloy member is smaller than when the shape memory alloy member is linearly arranged. There is a problem of becoming smaller.

  The present invention has been made to solve the above-described problems, and its purpose is to suppress a decrease in the amount of displacement when compared with a drive device in which shape memory alloy members are arranged in a straight line, and a small space. It is an object of the present invention to provide a drive device that can be disposed in the space (that is, space efficiency can be improved).

The drive device according to the present invention comprises:
A bendable wire made of shape memory alloy;
Urging means for generating tension in the longitudinal direction of the wire,
A plurality of abutting portions that abut against the wire, and bending means for bending the wire;
Energization means for passing current through the wire through the contact portion;
With
The plurality of contact portions are in contact with the wire, and are configured to displace the wire in the longitudinal direction by the urging means,
In the wire rod in each section determined by the contact sections adjacent to each other, the contact section through which current flows is determined so that the section in which the amount of current flowing through the wire is different exists.

  According to the drive device of the present invention, it is possible to increase the amount of displacement in the longitudinal direction of a wire made of a shape memory alloy.

Embodiment 1 FIG.
1 and 2 are a plan view and a perspective view showing a driving apparatus 1 according to Embodiment 1 of the present invention. As shown in FIG.1 and FIG.2, the base 6 of the drive device 1 has the mounting surface 6a and the wall surface 6b substantially perpendicular | vertical to this. On the mounting surface 6a, a pin-shaped bending member 5 is erected at a position away from the wall surface 6b by a predetermined distance. One end (fixed end) of the shape memory alloy member 2 is fixed to the wall surface 6b, and the other end (movable end) is wound around the peripheral surface of the bending member 5 so that the winding angle θ is 180 degrees. It is attached to one side of the moving body 3. The winding angle of 180 degrees means that the shape memory alloy member 2 is in contact with the bending member 5 and bent 180 degrees. The elastic member 4 formed of a tension coil spring has one end fixed to the wall surface 6b and a second end attached to the other side of the movable body 3 (attached to the shape memory alloy member 2) in a state where a predetermined tension is generated and slightly stretched. It is fixed to the opposite side).

  In the driving device 1, a direct current is passed between the fixed end of the shape memory alloy member 2 and the fixed end of the elastic member 4 (the end fixed to the wall surface 6 b) using the energizing circuit 7, and the shape memory alloy The shape memory alloy member 2 is heated using heat generated by the electric resistance of the member 2 (Joule heat), and therefore, the elastic member 4 and the moving body 3 are made of a conductive material. However, the method of heating the shape memory alloy member 2 is not limited to this method. The moving body 3 may be in contact with the mounting surface 6a. In this case, the friction generated between the moving body 3 and the mounting surface 6a during the movement of the moving body 3 is caused by the tension generated in the shape memory alloy member 2. However, it should be negligible.

  Here, the bending member 5 constitutes a bending means for bending the shape memory alloy member 2. The portion of the peripheral surface of the bending member 5 that contacts the shape memory alloy member 2 constitutes a contact portion that contacts the shape memory alloy member 2 in the bending means. The base 6 constitutes a holding means for holding the bending member 5.

  In the drive device 1 configured as described above, when a predetermined direct current (for example, 100 mA) is passed through the shape memory alloy member 2 by the energization circuit 7, the shape memory alloy member 2 is heated and contracts, and the moving body 3 It moves in the direction of arrow A against the urging force of the elastic member 4. When the energization to the shape memory alloy member 2 is stopped, the temperature decreases and the length of the shape memory alloy member 2 increases to the original length, so that the moving body 3 moves in the arrow B direction by the urging force of the elastic member 4.

  FIG. 3 is a plan view showing a driving device 100 in which the shape memory alloy members 101 are linearly arranged as a comparative example to the driving device according to the present embodiment. One end of the shape memory alloy member 101 is fixed to the fixed wall 104a, and the other end is fixed to one side (right side in the figure) of the moving body 102. The other side (left side in the figure) of the moving body 102 is fixed to one end of the elastic member 103, and the other end of the elastic member 103 is fixed to the fixed wall 104b. Tension is generated in the longitudinal direction of the shape memory alloy member 101 by the urging force of the elastic member 103, and the shape memory alloy member 101 is linearly arranged without loosening. The shape memory alloy member 101 is heated by energization by the energization circuit 105. When the shape memory alloy member 101 is energized by the energization circuit 105, the shape memory alloy member 101 contracts and the moving body 102 moves in the direction indicated by the arrow A. When the energization is stopped, the moving body 102 moves in the direction indicated by the arrow B. Move to. However, in this drive device 100, since the shape memory alloy member 101 is linearly arranged, it is difficult to reduce the device size in the longitudinal direction.

  FIG. 4 shows another comparative example for the drive device according to the present embodiment, in which the shape memory alloy member 101 is wound around a cylindrical winding member 106 having a large diameter (for example, a diameter of 10 mm) by about 360 degrees. FIG. By winding the shape memory alloy member 101 around the winding member 106 by about 360 degrees, the shape memory alloy member 101 having a long overall length can be accommodated in a small space (that is, space efficiency is improved). The displacement amount of the moving body 102 becomes smaller than that of the driving device 100 shown.

Experimental results regarding the driving devices 100 and 110 of these comparative examples will be described. FIG. 5 shows an experimental method when the shape memory alloy member 101 is linearly arranged (corresponding to the driving device 100 of FIG. 3). Crimp terminals 120 are attached to both ends of a wire-shaped shape memory alloy member 101 having a wire diameter of about 60 μm and a length of 50 mm, one crimp terminal 120 is fixed to the fixing pin 121 a, and the other crimp terminal 120 is connected to the elastic member 103. Secure to one end. The other end of the elastic member 103 is fixed to the fixing pin 121b. The displacement amount of the moving body 102 (FIG. 3) is evaluated by measuring the displacement amount of the crimp terminal 120 that couples the shape memory alloy member 101 and the elastic member 103. The elastic member 103 (tensile coil spring) extends 1 mm when the shape memory alloy member 101 is not energized. The elastic member 103 generates a tension of about 49 × 10 ⁻³ N when extended by 1 mm, and further generates a tension of about 98 × 10 ⁻³ N by extending 1 mm (ie, the shape memory alloy member 2 contracts by 1 mm). It is.

  Further, as shown in FIGS. 6A and 6B, a wire-like shape is formed on a cylindrical winding member 106 having a diameter of 10 mm formed of POM (polyoxymethylene) or ABS (acrylonitrile-butadiene-styrene resin). A similar experiment was conducted with the memory alloy member 101 wound about 180 degrees. The length C from the winding member 106 of the shape memory alloy member 101 to both the crimp terminals 120 was 17.1 mm. Further, as shown in FIGS. 7A and 7B, the same experiment was performed by winding the shape memory alloy member 101 around the winding member 106 by 360 degrees. The lengths C1 and C2 from the winding member 106 of the shape memory alloy member 101 to both the crimp terminals 120 were both 9.3 mm. Further, as shown in FIGS. 8A and 8B, the same experiment was performed by winding the shape memory alloy member 101 around the winding member 106 by 450 degrees. The length C from the winding member 106 of the shape memory alloy member 101 to the crimp terminal 120 was 11 mm.

  As a result of the experiment, when the shape memory alloy member 101 was linearly arranged as shown in FIG. 5, the displacement amount of the end portion of the shape memory alloy member 101 was 1.6 mm. On the other hand, as shown in FIG. 6, in the experiment in which the shape memory alloy member 101 is wound about 180 degrees around the winding member 106 having a diameter of 10 mm, the displacement amount is the same regardless of whether the winding member 106 is POM or ABS. About 1.0 mm. Further, in the experiment in which the shape memory alloy member 101 is wound about 360 degrees as shown in FIG. 7, the displacement amount is 0.5 mm (when the winding member 106 is POM) and 1.0 mm (the winding member 106 is made of ABS). If). Further, in the experiment in which the shape memory alloy member 101 is wound about 450 degrees as shown in FIG. 8, the displacement amount is 0.3 mm (when the winding member 106 is POM) and 0.6 mm (the winding member 106 is made of ABS). If). That is, as compared with the case where the shape memory alloy member 101 is linearly arranged (FIG. 5), the displacement amount of the shape memory alloy member 101 is about 62% when the winding angle is 180 degrees and the winding angle is 360 degrees. It has been found that sometimes it is reduced to about 35% (POM) and about 61% (ABS), and to about 20% (POM) and about 36% (ABS) when the winding angle is 450 degrees.

Next, similar experimental results regarding the driving apparatus 1 according to the present embodiment (FIGS. 1 and 2) will be described. The experiment was performed in the same manner as the experiment method shown in FIG. The bending member 5 is a metal pin-shaped member having a diameter of 1 mm, and the shape memory alloy member 2 is formed in a wire shape having a wire diameter of about 60 μm and a length of 50 mm. The length of the shape memory alloy member 2 from the moving body 3 (crimp terminal) to the pin 5 is 11.8 mm when not energized. Further, the elastic member 4 normally generates a tension of about 49 × 10 ⁻³ N in a state of being extended by 1 mm, and further extends by 1 mm (that is, the shape memory alloy member 2 is contracted by 1 mm), so that the elastic member 4 is about 98 × 10 ⁻³ N. The tension of

  In the experiment using the driving apparatus 1 according to the present embodiment, the displacement amount of the end when the shape memory alloy member 2 is heated and contracted by applying a 100 mA direct current to the shape memory alloy member 2 is 1. It was 5 mm. That is, a displacement amount of about 94% is obtained with respect to the displacement amount (1.6 mm) when the shape memory alloy members are arranged linearly. That is, by bending the wire-shaped shape memory alloy member 2 with the bending member 5 (here, a metal pin having a diameter of 1 mm), a displacement amount of about 94% when the shape memory alloy member 2 is arranged in a straight line is obtained. I found out that I could do it.

  As described above, according to the driving device 1 according to the present embodiment, the shape memory alloy member 2 is bent by the bending member 5 and tension is generated in the longitudinal direction of the shape memory alloy member 2. The shape memory alloy member 2 having a long overall length can be disposed in a smaller space while suppressing a decrease in the displacement amount of the body 3, that is, space efficiency can be improved.

Embodiment 2. FIG.
FIG. 9 is a plan view showing the drive device 11 according to Embodiment 2 of the present invention. The drive device 11 is configured such that the shape memory alloy member 2 is bent at two locations by further adding a bending member 12 to the drive device 1 (FIGS. 1 and 2) of the first embodiment described above. The difference is that the base 13 is provided with two wall portions 13b and 13c. In this drive device 11, parts that are common to the drive device 1 of Embodiment 1 are given the same reference numerals.

  In the drive device 11, wall portions 13 b and 13 c are provided on both sides of the base 13. On the mounting surface 13 a of the base 13, the bending member 12 is erected on the wall portion 13 b side of the bending member 5 in addition to the bending member 5 described above. The shape memory alloy member 2 has one end (fixed end) fixed to the wall portion 13c, wound around the bending members 5 and 12 so that the winding angle is approximately 180 degrees, and the other end (movable end) is the moving body 3. Is attached.

  The bending member 12 is disposed at a position where the facing portions 2 a and 2 b of the shape memory alloy member 2 bent and turned back by the bending member 5 are substantially parallel and do not hinder the movement of the moving body 3. As a specific dimension example, in the extending direction of the facing portions 2a and 2b (moving direction of the moving body 3), the distance C2 between the moving body 3 and the bending member 5 is 12.6 mm, and the distance between the bending members 5 and 12 is C3 is 10 mm, and the distance C4 between the bent portion 12 and the wall portion 13c is 22.5 mm. The interval C1 between the bending members 5 and 12 in the direction orthogonal to the extending direction of the facing portions 2a and 2b is 5 mm.

  Here, the two bending members 5 and 12 constitute bending means for bending the shape memory alloy member 2. The portions of the outer peripheral surfaces of the bending members 5 and 12 that contact the shape memory alloy member 2 constitute contact portions that contact the shape memory alloy member 2 in the bending means. The base 13 constitutes holding means for holding the bending members 5 and 12.

  In the above configuration, the experiment described with reference to FIG. 5 in the first embodiment is performed. In this case, metallic bending pins 5 and 12 having a diameter of 1 mm are used, and other measurement conditions are the same as those described with reference to FIG. The displacement amount of the moving body 3 when a current of 100 mA was applied to the shape memory alloy member 2 by the energization circuit 7 and the shape memory alloy member 2 was heated and contracted was about 1.3 mm.

  That is, the displacement amount of the moving body 3 is about 81% with respect to the displacement amount when the shape memory alloy member 2 is linearly arranged, and the decrease in the displacement amount due to the improvement in space efficiency is suppressed. I understood.

  As described above, according to the drive device according to the present embodiment, the displacement amount of the moving body 3 is reduced by bending the shape memory alloy member 2 twice by the two pin-shaped bending members 5 and 12. Space efficiency can be improved while suppressing the above. Further, since the two bending members 5 and 12 are used, it is possible to arrange them so that both the wall portions 13b and 13c are closer to each other in FIG. 9, for example, and the space efficiency can be further improved.

Embodiment 3 FIG.
FIG. 10 is a perspective view showing a drive device 21 according to Embodiment 3 of the present invention. The drive device 21 is a portion where the number of bending members is two compared to the drive device 1 (FIGS. 1 and 2) of the first embodiment and the shape memory alloy member 22 is bent by the bending members 23 and 24 ( This is different in that a plurality of guide grooves) are formed. In this drive device 21, the same reference numerals are given to portions common to the drive device 1 of the first embodiment.

  In the driving device 21, two bending members 24 and 23 are erected on the base 6 in order from the side closer to the wall portion 6 b. Four guide grooves 23 a are formed on the outer peripheral surface of the bending member 23 at intervals in the axial direction. Three guide grooves 24 a are formed on the outer peripheral surface of the bending member 24 at intervals in the axial direction thereof. One end (fixed end) of the shape memory alloy member 22 is fixed to the wall portion 6 b, and the other end (movable end) is attached to the moving body 3. The shape memory alloy member 22 is wound around the four guide grooves 23a of the bending member 23 and the three guide grooves 24a of the bending member 24 so that the winding angle is about 180 degrees. That is, the two bending members 23 and 24 have a total of seven contact portions that contact the shape memory alloy member 22 and bend it. In the present embodiment, the bending members 23 and 24 are made of an insulating material or the like in order to avoid a short circuit of the shape memory alloy member 22.

  Here, the two bending members 23 and 24 constitute bending means for bending the shape memory alloy member 22. The portion of each guide groove 23a, 24a that contacts the shape memory alloy member 22 constitutes a contact portion that contacts the shape memory alloy member 2 in the bending means. The base 6 constitutes holding means for holding the bending members 23 and 24. The elastic member 4 constitutes a biasing means that biases the shape memory alloy member 22.

  In the above configuration, as in the case of the first embodiment, by passing a predetermined direct current (for example, 100 mA) to the shape memory alloy member 22 by the energization circuit 7 and heating the shape memory alloy member 22 to contract, The moving body 3 can be displaced.

  As described above, according to the driving device 21 according to the present embodiment, the longer shape memory alloy member 22 can be efficiently arranged, so that the space 3 can be reduced while suppressing the decrease in the displacement amount of the moving body 3. Efficiency can be further improved.

  Further, by providing the guide grooves 23a and 24a in the bending members 23 and 24, the shape memory alloy member 22 can be easily wound and the winding position of the shape memory alloy member 22 can be prevented from being shifted. Moreover, it is possible to prevent a short circuit when the shape memory alloy member 22 is energized.

Embodiment 4 FIG.
FIG. 11 is a perspective view showing a drive device 31 according to Embodiment 4 of the present invention. This drive device 31 is different from the drive device 1 (FIGS. 1 and 2) of the first embodiment in that it has four pin-shaped bending members 33, 34, 35, and 36. In the driving device 31, the same reference numerals are given to portions common to the driving device 1 of the first embodiment.

  In this driving device 31, four pin-shaped bending members 33 to 36 are erected on the mounting surface 6 a of the base 6 at positions corresponding to the four corners of a quadrangle. One end (fixed end) of the shape memory alloy member 32 is fixed to the wall portion 6b, and is wound around the four bending members 33 to 36 over about two and a half rounds so that the winding angle is 90 degrees. The other end (movable end) is attached to the movable body 3. In other words, the shape memory alloy member 32 is wound around the bending members 34 and 35 at three locations separated in the axial direction, and the bending memories 33 and 36 are wound at two locations separated in the axial direction. That is, the four bending members 33 to 36 have a total of 10 contact portions that contact the shape memory alloy member 32 and bend it. In the present embodiment, the bending members 33 to 36 are made of, for example, an insulating material in order to avoid a short circuit of the shape memory alloy member 32. In addition, the bending members 33 and 36 may be provided with guide grooves (guide grooves 23a and 24a in FIG. 10) as described in the third embodiment.

  Here, the four bending members 33 to 36 constitute bending means for bending the shape memory alloy member 32. The portions of the bending members 33 to 36 that contact the shape memory alloy member 32 constitute contact portions that contact the shape memory alloy member 32 in the bending means. The base 6 constitutes holding means for holding the bending members 33 to 36.

  In the above configuration, as in the case of the first embodiment, a predetermined direct current (for example, 100 mA) is passed through the shape memory alloy member 32 by the energization circuit 7 and the shape memory alloy member 32 is heated and contracted. The moving body 3 can be displaced.

  Here, the bending members 33 and 36 are arranged so as to be positioned at the vertices of the quadrangle, but if the contact portions that contact the shape memory alloy member 32 are arranged along the closed path, the number of the bending members And arrangement | positioning can be changed suitably. Further, in this example, the four bending members 33 to 36 are formed so as to have a total of 10 contact portions, but this can be changed as appropriate.

  As described above, according to the driving device 31 of the present embodiment, since the longer shape memory alloy material 32 can be efficiently arranged in a small space, a decrease in the displacement amount of the moving body 3 is suppressed. , Space efficiency can be improved.

Embodiment 5 FIG.
FIG. 12 is a plan view showing a drive device 41 according to Embodiment 5 of the present invention. In the drive device 41, the shape memory alloy member 42 is wound around the projecting portions 44a and 44b projecting from the corner portions of the housing 44, respectively, with respect to the drive device 1 (FIGS. 1 and 2) of the first embodiment. It is different in that it is wound to a degree. In the driving device 41, the same reference numerals are given to the portions common to the driving device 1 of the first embodiment.

  In the drive device 41, for example, a rectangular parallelepiped housing 44 is provided on the mounting surface 43 a of the base 43. Protrusions 44 a and 44 b are formed to project at two corners far from the wall 43 b of the housing 44. These projecting portions 44a and 44b project in directions substantially orthogonal to each other, and have contact surfaces (for example, cylindrical surfaces) around which the shape memory alloy member 42 is wound. The shape memory alloy member 42 is wound around the contact surfaces of the protrusions 44a and 44b so that the winding angle (corresponding to a bending angle) is 90 degrees.

  The shape memory alloy member 42 has one end (fixed end) fixed to the wall 43b of the base 43, and is wound around the protrusions 44a and 44b so that the winding angle is 90 degrees, and the other end (movable end). Is attached to the moving body 3.

  Here, the housing (structure) 44 having the two protrusions 44 a and 44 b constitutes a bending means for bending the shape memory alloy member 42. The portions of the protrusions 44a and 44b that contact the shape memory alloy member 42 constitute contact portions that contact the shape memory alloy member 42 in the bending means. The base 43 constitutes a holding means for holding the housing 44 having the bent protrusions 44a and 44b.

  In the above configuration, as in the case of the first embodiment, by passing a predetermined direct current (for example, 100 mA) to the shape memory alloy member 42 by the energization circuit 7 and heating the shape memory alloy member 42 to contract, The moving body 3 can be displaced.

  In the present embodiment, the protrusions 44a and 44b are formed to protrude at the corners of the housing 44. However, the present invention is not limited to this, and the housing 44 can be formed at an appropriate design part. . In the present embodiment, one end of the elastic member 4 and one end (fixed end) of the shape memory alloy member 42 are fixed to the wall 43b of the base 43. However, the present invention is not limited to this. It may be fixed to. Further, the winding angle of the shape memory alloy member 42 is not limited to 90 degrees.

  Further, the guide grooves 23a and 24a (FIG. 10) as described in the third embodiment may be formed in the protrusions 44a and 44b. Alternatively, as shown in FIG. 13, the shape memory alloy member 42 can be easily wound by providing a step 44 c at a position where the shape memory alloy member 42 is wound.

  As described above, according to the drive device 41 of the present embodiment, since the shape memory alloy member 42 is bent twice (90 degrees each) by the pair of protrusions 44a and 44b, a longer shape memory alloy material is used. 42 can be efficiently arranged, and since the housing 44 that forms a part of the drive device 41 can be used, the space efficiency can be further improved.

Embodiment 6 FIG.
FIG. 14 is a perspective view showing a drive device 51 according to Embodiment 6 of the present invention. This driving device 51 is different from the driving device 11 (FIG. 9) of the second embodiment in that a bending member 54 having a convex portion on the outer peripheral surface is provided. In the driving device 51, the same reference numerals are given to portions common to the driving device 11 of the second embodiment.

  As shown in FIG. 14, the mounting surface 13a of the base is provided with a substantially cylindrical bending member 54 having minute convex portions on the outer peripheral surface. The minute convex portion of the bending member 54 becomes an abutting portion 54 a that abuts on the shape memory alloy member 2. The contact portions 54a of the bending member 54 are long in the axial direction of the bending member 54 and are arranged in a large number in the circumferential direction.

  The shape memory alloy member 2 is wound so that one end (fixed end) thereof is fixed to the wall portion 13c and goes around the bending member 54, that is, the total winding angle at each contact portion 54a is 360 degrees. The other end (movable end) is fixed to one side of the moving body 3. One end of the elastic member 4 is fixed to the other side of the moving body 3, and the other end of the elastic member 4 is fixed to the wall portion 13b.

Here, the bending member 54 constitutes a bending means for bending the shape memory alloy member 2.
The contact portion 54a constitutes a contact portion (convex portion) that contacts the shape memory alloy member 2 in the bending means. The base 13 constitutes a holding means for holding the bending member 54.

  In the above configuration, as in the case of the first embodiment, by passing a predetermined direct current (for example, 100 mA) to the shape memory alloy member 2 by the energization circuit 7 and heating and contracting the shape memory alloy member 2, The moving body 3 can be displaced.

  Next, an experiment on the driving device 51 according to the present embodiment will be described. Here, similarly to the experiments shown in FIGS. 5 to 8 described above, the crimp terminals 120 and the fixing pins 121 are used and arranged as shown in FIGS. 15 to 17.

  First, as shown in FIGS. 15A and 15B, a wire-shaped shape memory alloy member 2 is approximately placed on a cylindrical bending member 54 (having a contact portion 54a) having a diameter of 10 mm formed by POM or ABS. Wrap 180 degrees. The crimp terminal 120 at one end of the shape memory alloy member 2 is fixed to the fixing pin 121, and the crimp terminal 120 at the other end is attached to another fixing pin 121 through the elastic member 4. The length C from the bending member 54 of the shape memory alloy member 2 to the crimp terminals 120 at both ends is 17.1 mm. Further, as shown in FIGS. 16A and 16B, the experiment is similarly performed by winding the shape memory alloy member 2 360 degrees around the bending member 54. The lengths C1 and C2 from the bending member 54 of the shape memory alloy member 2 to the crimp terminals 120 at both ends are both set to 9.3 mm. Further, as shown in FIGS. 17A and 17B, the shape memory alloy member 2 is wound 450 degrees around the bending member 54 and the experiment is similarly performed. The length C from the bending member 54 to the crimp terminal 120 of the shape memory alloy member 2 is 11 mm.

FIG. 18A is a perspective view showing a schematic shape of the bending member 54 used in each experiment, and FIGS. 18B to 18D show three types of bending members 54 used in each experiment. FIG. The bending member 54 is a substantially cylindrical member having a diameter D of 10 mm, and 20 contact portions 54a are formed on the peripheral surface thereof at a pitch (P) of 1.56 mm. Each contact portion 54a has an arc shape having a radius of 5 mm in cross section. The width W1 of the contact portion 54a is 1.05 mm (FIG. 18B), 0.78 mm (FIG. 18C), and 0.52 mm (FIG. 18D), respectively. Further, the groove width W2 between the adjacent contact portions 54a is 0.52 mm (FIG. 18B), 0.78 mm (FIG. 18C), and 1.05 mm (FIG. 18D), respectively. And
The other measurement conditions are the same as those in the first embodiment, and a 100 mA direct current is passed through the shape memory alloy member 2 by the energization circuit 7 to heat and contract the shape memory alloy member 2 to move the movable end. Measure the displacement. The measurement results are shown in Tables 1 and 2. Table 1 shows a case where a bending member 54 made of ABS is used, and Table 2 shows a case where a bending member 54 made of POM is used.

  FIG. 19 is a graph showing experimental results when ABS is used as the bending member 54, and corresponds to Table 1. FIG. 20 is a graph showing experimental results when POM is used as the bending member 54, and corresponds to Table 2. 19 and 20, the vertical axis represents the ratio of the measured displacement amount of the moving body 3 to the displacement amount when the shape memory alloy member 2 is linearly arranged, that is, the displacement ratio H (%). The horizontal axis represents the ratio of the width W1 of the contact portion 54a to the arrangement pitch P (1.56 mm) of the contact portion 54a, that is, the contact ratio S (%). For example, when the width W1 of the contact portion 54a is 0.52 mm (FIG. 18D), the contact ratio S is 100 × 0.52 mm / 1.56 mm = 33%. Further, in FIGS. 19 and 20, symbols a, b, and c indicate data when the winding angle of the shape memory alloy member 2 around the bending member 54 is 450 degrees, 360 degrees, and 180 degrees, respectively.

  19 and 20 (Tables 1 and 2), the displacement ratio H of the moving body 3 is 100% as the width W1 of the contact portion 54a is reduced (that is, when the shape memory alloy member 2 is linearly arranged). (Displacement amount). Further, the smaller the width W1 of the contact portion 54a, the smaller the difference in displacement due to the difference in winding angle and the material of the bending member 54 (ABS or POM). In particular, when the width W1 of the contact portion 54a is one third of the arrangement pitch P (contact ratio S is about 35%), the displacement ratio H approaches 100%, and further, the difference in winding angle and the bending member The difference in displacement due to the difference in material (ABS or POM) is almost eliminated. In the configuration of FIGS. 6 to 8 described above, the displacement amount of the moving body 3 has changed greatly due to the difference in the material of the winding member 106 and the difference in the winding angle of the shape memory alloy member 2. In the embodiment, it is possible to suppress variation in displacement due to a difference in winding angle of the shape memory alloy member 2 and a difference in material of the bending member 54. Therefore, it is possible to improve the space efficiency and simplify the configuration of the driving device, thereby improving the working efficiency during the manufacturing.

  In the present embodiment, the contact portion 54a is formed along the substantially circular outer periphery of the contact member 54 as shown in FIG. 21A. However, the present invention is not limited to this. For example, As shown in FIGS. 21B and 21C, it may be formed along a closed path (the outer periphery of a closed figure) such as a rounded substantially triangular shape or an elliptical outer periphery.

Embodiment 7 FIG.
FIG. 22 is a plan view showing a drive device 61 according to Embodiment 7 of the present invention. This drive device 61 is different from the drive device 1 of the first embodiment (FIG. 1) in that the shape memory alloy member 62 is formed in a coil spring shape. In the driving device 61, the same reference numerals are given to the portions common to the driving device 1 of the first embodiment.

  As shown in FIG. 22, the shape memory alloy member 62 is formed in a coil spring shape, and the winding angle is 180 degrees around the pin-shaped bending member 63 erected on the mounting surface 6 a of the base 6. It is wound like so. One end of the shape memory alloy member 62 is fixed to the wall portion 6 b and the other end is attached to the moving body 3.

  Here, the pin-shaped bending member 63 constitutes a bending means for bending the shape memory alloy member 62. The portion of the peripheral surface of the bending member 63 that contacts the shape memory alloy member 62 constitutes a contact portion that contacts the shape memory alloy member 62 in the bending means. The base 6 constitutes a holding means for holding the bending member 63.

  In the above configuration, as in the case of the first embodiment, a predetermined direct current (for example, 100 mA) is passed through the shape memory alloy member 62 by the energizing circuit 7 and the shape memory alloy member 62 is heated and contracted. Thus, the moving body 3 can be displaced. At this time, since the shape memory alloy member 62 has a coil spring shape, the amount of expansion / contraction of the shape memory alloy member 62 is increased, and as a result, the displacement amount of the movable body 3 can be significantly increased.

  In this embodiment, the bending member 63 has a pin shape. However, the bending member 63 is not particularly limited to the pin shape, and the shape of the bending member 63 suitable for design with respect to the coil spring-like shape memory alloy member 62 is used. You can choose.

  As described above, according to the driving device 61 according to the present embodiment, since the shape memory alloy member 62 is formed in a coil spring shape, the amount of expansion and contraction of the shape memory alloy member 62 is increased, and the displacement of the moving body 3 is increased. The amount can be increased significantly. Therefore, the space efficiency can be further improved, and the drive device 61 can be downsized.

Embodiment 8 FIG.
FIG. 23 is a perspective view showing a drive device 71 according to Embodiment 8 of the present invention. This drive device 71 is different from the drive device 1 of the first embodiment (FIGS. 1 and 2) in that a band-shaped shape memory alloy member 72 is used. In the driving device 71, the same reference numerals are given to portions common to the driving device 1 of the first embodiment.

  In the driving device 71, the shape memory alloy member 72 is formed in a band shape instead of a wire shape, and is wound around the pin-shaped bending member 5 standing on the base 6 so that the winding angle is 180 degrees. It has been. One end of the shape memory alloy member 72 is fixed to the wall 6 b and the other end is attached to the moving body 3.

  Here, the pin-shaped bending member 5 constitutes a bending means for bending the shape memory alloy member 72. The portion of the outer peripheral surface of the bending member 5 that contacts the shape memory alloy member 72 constitutes a contact portion that contacts the shape memory alloy member 72 in the bending means. The base 6 constitutes a holding means for holding the bending member 5.

  In the above configuration, the movable body 3 can be displaced by causing a predetermined direct current (for example, 100 mA) to flow through the shape memory alloy member 72 by the energizing circuit 7 and heating the shape memory alloy member 72 to contract.

  In this embodiment, the bending member 5 has a pin shape. However, the bending member 5 is not particularly limited to a pin shape, and the shape of the bending member 5 that is suitable for design with respect to the band-shaped shape memory alloy member 72 is selected. can do.

  As described above, according to the driving device 71 according to the present embodiment, the shape memory alloy member 72 is formed in a band shape in addition to the same effect as that of the first embodiment that the space efficiency can be improved. Therefore, it becomes possible to generate a greater force, and the moving body 3 can be moved with a greater force.

Embodiment 9 FIG.
24 (a) and 24 (b) are a front view and a side view showing a drive device 81 according to Embodiment 9 of the present invention. As shown in FIGS. 24A and 24B, the base 83 has a pair of opposing fixed walls 83a and 83b. Both end portions of the shape memory alloy member 2 are fixed to one fixed wall 83a. The central portion of the shape memory alloy member 2 is wound around the substantially cylindrical bending member 84 a plurality of times (2.5 rounds) so that the winding angle is about 900 degrees. This bending member 84 is obtained by providing a rotating shaft 84a on the above-described bending member 54 (FIG. 14) having a plurality of contact portions 54a on the peripheral surface, and both ends of the rotating shaft 84a are held by holding frames 85. It is held rotatably. The elastic member 4 is stretched between the central portion of the connecting portion 85a of the holding frame 85 and the fixed wall 83b of the base 83, and the shape memory alloy member 2 is maintained in a state in which it does not loosen. With the above configuration, the shape memory alloy member 2 is not loosened, and the bending member 84 is stably positioned.

Here, the bending member 84 constitutes a bending means for bending the shape memory alloy member 2.
The portion of the peripheral surface of the bending member 84 that contacts the shape memory alloy member 2 constitutes a contact portion that contacts the shape memory alloy member 2 in the bending means. The base 83 constitutes holding means for holding the bending member 84.

  In the above configuration, when the shape memory alloy member 2 is energized from the energization circuit 7, the shape memory alloy member 2 is heated and contracts, and the bending member 84 (and the holding frame 85) resists the urging force of the elastic member 4. Displacement in the direction of arrow C. When energization of the shape memory alloy member 2 is stopped, the shape memory alloy member 2 extends to its original length, and the bending member 84 (and the holding frame 85) is displaced in the direction of arrow D by the urging force of the elastic member 4. As described above, the bending member 84 or the holding frame 85 as the moving body can be displaced. Here, the moving direction of the moving body (bending member 83 or holding frame 85) indicated by arrows C and D is the direction of gravity, but the moving body 3 can move smoothly in the directions indicated by arrows C and D. If configured, it does not necessarily need to coincide with the direction of gravity. In the present embodiment, the bending member 84 is provided with a linear contact portion 54a provided on the outer peripheral surface of the substantially cylindrical member. However, the bending member 84 has been described with reference to FIG. 21 (Embodiment 6). Thus, the shape of the bending member 84 can be freely designed according to the setting conditions of the driving device 81, such as an elliptical shape or a rounded triangular shape.

  As described above, according to the driving device 81 of the present embodiment, it is possible to suppress a decrease in the displacement amount of the moving body (the bending member 84 and the holding frame 85) and to use the shape memory alloy member 2 having a long overall length. In addition, a large driving force can be obtained, and the driving device 81 can be downsized.

Embodiment 10 FIG.
FIGS. 25A and 25B are perspective views of the driving device 91 according to the tenth embodiment of the present invention as seen from different directions. This drive device 91 is provided with a pin 93 for further bending the shape memory alloy member 92 in addition to the projecting portions 44a and 44b in the housing 44 in contrast to the drive device 41 (FIGS. 12 and 13) of the fifth embodiment. It is different in point. In the driving device 91, the same reference numerals are given to the portions common to the driving device 41 of the fifth embodiment.

  As shown in FIG. 25A, the housing 44 is provided on the mounting surface 43 a of the base 43, for example. Projections 44 a and 44 b described in the fifth embodiment are formed at the corners of the housing 44. Further, as shown in FIG. 25B, a pin (projection) 93 is erected on the side surface of the housing 44.

  One end (fixed end) of the shape memory alloy member 92 is fixed to the wall 43b of the base 43, and is wound around the protrusions 44b and 44a so that the winding angle is 90 degrees. And is wound around the protrusions 44a and 44b so that the winding angle is 90 degrees. The other end (movable end) of the shape memory alloy member 92 is attached to the moving body 3.

Here, the housing 44 having the protrusions 44 a and 44 b constitutes a bending means for bending the shape memory alloy member 92. The portions that contact the shape memory alloy member 92 on the peripheral surfaces of the protrusions 44a and 44b constitute contact portions that contact the shape memory alloy member 92 in the bending means.
The pin 93 protrudes from the housing 44 and constitutes a protrusion that further bends the shape memory alloy member 92. The base 43 constitutes a holding means for holding the casing 44 having the protruding portions 44a and 44b.

  In the above configuration, the movable body 3 can be displaced by causing the current-carrying circuit 7 to pass a current through the shape memory alloy member 92 to heat and contract the shape memory alloy member 92.

  The drive device 91 according to the present embodiment includes both the pin 93 and the protrusions 44a and 44b, so that the shape memory alloy member 92 is bent five times by the pair of protrusions 44a and 44b and the pin 93. (90 degrees and 180 degrees), the shape memory alloy member 92 having a long overall length can be disposed in a small space. In addition, since a part of the housing 44 constituting the driving device 91 can be used, the space efficiency is further improved and the driving device is reduced in size while suppressing a decrease in the displacement amount of the moving body 3. Can be realized.

Embodiment 11 FIG.
FIG. 26 is a perspective view showing drive device 151 according to Embodiment 11 of the present invention. This driving device 151 is different from the driving device 41 (FIGS. 12 and 13) of the fifth embodiment in that a minute convex portion 153 is provided on the outer peripheral surface of the projecting portions 152a and 152b of the housing 152. . In the driving device 151, the same reference numerals are given to portions common to the driving device 41 of the fifth embodiment.

  In the drive device 41, the housing 152 is provided on the mounting surface 43 a of the base 43, for example. Protruding portions 152 a and 152 b that protrude in directions different from each other by approximately 90 degrees are formed at corner portions of the casing 152. Small protrusions 153 extending in the vertical direction are formed on the outer peripheral surfaces of the protrusions 152a and 152b. One end (movable end) of the shape memory alloy member 42 is fixed to the wall 43b of the base 43, and is wound so that the winding angle is 90 degrees while contacting the convex portion 153 of the protrusions 152b and 152a. The other end (fixed end) is attached to the moving body 3.

  Here, the casing 152 having the protrusions 152 a and 152 b constitutes a bending means for bending the shape memory alloy member 42. The protrusions 153 of the protrusions 152a and 152b constitute contact portions that contact the shape memory alloy member 42 in the bending means. The base 43 constitutes holding means for holding the curved body 152.

  In the above configuration, the moving body 3 can be displaced by causing the current-carrying circuit 7 to pass a current through the shape memory alloy member 42 to heat and contract the shape memory alloy member 42.

  When the shape memory alloy member 42 is bent, it is necessary to improve reliability by avoiding stress concentration due to abrupt changes and avoiding bending creases. For that purpose, it is said that the diameter when the projecting portions 152a and 152b are arcuate in cross section is preferably about 20 to 40 times the wire diameter of the shape memory alloy member 42. However, in this case, since the contact length at which the shape memory alloy member 42 contacts the protrusions 152a and 152b becomes longer, the displacement amount may be reduced as compared with the case where the shape memory alloy member 42 is arranged linearly. There is.

  On the other hand, in the present embodiment, the shape memory alloy member 42 and the protrusions 152a, 152b are formed on the protrusions 152a, 152b by forming the protrusions 153 substantially orthogonal to the winding direction of the shape memory alloy member 42. The contact length with 152b (convex portion 153) is shortened. Thereby, even if it is a case where the diameter of protrusion part 152a, 152b is enlarged, the fall of the displacement amount of the shape memory alloy member 42 can be suppressed.

FIG. 27 is a plan view showing an experimental method for confirming the effect of providing the convex portion 153. In this experiment, as shown in FIG. 27, the shape memory alloy member 2 with the crimp terminals 120 attached to both ends is wound 360 degrees around the bending member 155a, and the crimp terminal 120 at one end (movable end) is attached to the elastic member 4. The crimp terminal 120 at the end (fixed end) is attached to the fixed pin 121 (FIG. 7A). The other end of the elastic member 4 is attached to another fixing pin 121 (FIG. 7A). The two fixing pins 121 are energized by the energization circuit 105 (FIG. 7A). The length of the shape memory alloy member 2 was 50 mm, the wire diameter was 60 μm, and the length C from the bending member 155a to the fixed pin 121 on the fixed end side was about 8 mm. Further, the shape memory alloy member 2 is caused to have a tension of about 392 × 10 ⁻³ N in a normal state (non-energized state). Under such conditions, the displacement amount of the movable end of the shape memory alloy member 2 (for example, the displacement amount of the crimp terminal 120 connected to the elastic member 4) when a 140 mA direct current is passed through the shape memory alloy member 2 is measured. To do.

  The bending member 155a is formed by forming protrusions 156 having a circular arc cross section at four corners of a prismatic member having a square cross section. This protrusion 156 corresponds to the protrusions 152a and 152b of the driving device 151 (FIG. 26) according to Embodiment 11, and measures the amount of displacement when the shape of the protrusion 156 is changed variously. By doing this, it is possible to know the tendency of change in the displacement amount when each shape is adopted in the protrusions 152a and 152b (FIG. 26).

  28A to 28D are plan views showing the shapes of the bending members 155a to 155d used in this experiment. The bending members 155a to 155d are configured by POM.

  A bending member 155a shown in FIG. 28A has protrusions 156 having a radius R of 3.3 mm at the four corners of a quadrangular prism having a substantially square cross section, and the depth t is 0 between the protrusions 156. .2 mm recesses are formed. The ratio of the length at which the four protrusions 156 contact the shape memory alloy member 2 with respect to the entire circumference of the bending member 155a, that is, the contact ratio is 66%. In addition, the cross-sectional shape of each protrusion 156 was a fan shape with a central angle θ of 90 degrees. In the experiment using the bending member 155a, the displacement amount of the movable end of the shape memory alloy member 2 is 1.16 mm, and the displacement amount under the same condition when the shape memory alloy member 2 is arranged linearly (2. 1 mm) (ie, the displacement ratio) was 55.2%.

  A bending member 155b shown in FIG. 28B has protrusions 156 having a radius R of 1.6 mm at the four corners of a quadrangular prism having a substantially square cross section, and the depth t is 0 between the protrusions 156. .2 mm recesses are formed. The ratio (contact ratio) of the length at which the four protrusions 156 contact the shape memory alloy member 2 with respect to the entire circumference of the bending member 155b is 33%. In the experiment using the bending member 155b, the displacement amount of the movable end of the shape memory alloy member 2 is 1.48 mm, and the displacement with respect to the displacement amount (2.1 mm) when the shape memory alloy member 2 is linearly arranged. The ratio was 70.5%.

  The bending member 155c shown in FIG. 28 (c) is provided with two protrusions 156a of the bending member 155a of FIG. Formed. The ratio (contact ratio) of the length at which the protrusions 156a of the four protrusions 156 contact the shape memory alloy member 2 with respect to the entire circumference of the bending member 155c is 33%. In the experiment using the bending member 155c, the displacement amount of the movable end of the shape memory alloy member 2 is 1.38 mm, and the displacement ratio with respect to the case where the shape memory alloy member 2 is arranged linearly (displacement amount 2.1 mm). Was 65.7%.

  In the bending member 155d shown in FIG. 28 (d), four protrusions 156b are formed by providing each protrusion 156 of the bending member 155a in FIG. 28 (a) with four recesses having a depth t of 0.2 mm. It is a thing. The ratio (contact ratio) of the length at which the protrusions 156b of the four protrusions 156 contact the shape memory alloy member 2 is 33% with respect to the entire circumference of the bending member 155d. In the experiment using the bending member 155d, the displacement amount of the movable end of the shape memory alloy member 2 is 1.42 mm, and the displacement with respect to the displacement amount (2.1 mm) when the shape memory alloy member 2 is linearly arranged. The ratio was 67.6%.

  Table 3 and FIG. 29 show the above experimental results. In FIG. 29, the vertical axis represents the displacement ratio H (%). Symbols a, b, c, and d on the horizontal axis indicate experimental results when the bending members 155a, 155b, 155c, and 155d (FIGS. 28A to 28D) are used, respectively.

  As is clear from the experimental results shown in Table 3 and FIG. 29, it can be seen that the smaller the contact ratio of the shape memory alloy member, the larger the displacement of the movable body (the movable end of the shape memory alloy member 2). For this reason, in the driving device 151 (FIG. 26) according to the present embodiment, the protrusions 152a and 152b are formed with the protrusions 153, and the ratio of the contact portion that contacts the shape memory alloy member 42 to the entire circumference is reduced. It turns out that the displacement amount of the mobile body 3 can be enlarged by this.

  As described above, according to the drive device 151 according to the present embodiment, by forming the minute protrusions 153 on the protrusions 152a and 152b that contact the shape memory alloy member 42 and reducing the contact ratio, While increasing the amount of displacement of the movable end of the shape memory alloy member 42, it is possible to avoid stress concentration of the shape memory alloy member 42 and to suppress bending wrinkles and the like.

Embodiment 12 FIG.
FIG. 30 is a perspective view showing a drive device 161 according to Embodiment 12 of the present invention. The drive device 161 is different from the drive device 51 (FIG. 14) of the sixth embodiment in that the shape of the bending member 162 having the protruding portion 162b is formed of a polygonal column member. In the driving device 161, the same reference numerals are given to the portions common to the driving device 51 of the sixth embodiment.

  As shown in FIG. 30, the mounting surface 13a of the base 13 is provided with a bending member 162 having a plurality of protruding portions (contact portions) 162b on the peripheral surface. One end (fixed end) of the shape memory alloy member 2 is fixed to the wall 13c, and is wound around the circumferential surface of the bending member 162 so that the total winding angle at each protrusion 162b is 360 degrees. The movable end) is attached to the moving body 3.

  Here, the bending member 162 constitutes a bending means for bending the shape memory alloy member 2. The portion of the peripheral surface of the protrusion 162b that contacts the shape memory alloy member 2 constitutes a contact portion that contacts the shape memory alloy member 2 in the bending means. The base 13 constitutes a holding unit that holds the bending member 162.

  In the above-described configuration, the moving body 3 can be displaced by causing a current to flow through the shape memory alloy member 2 by the energization circuit 7 and heating the shape memory alloy member 2 to contract.

  In Embodiment 6 (FIGS. 14 to 20) described above, it is shown that the reduction in the displacement of the shape memory alloy member 2 can be suppressed by reducing the contact ratio at which the shape memory alloy member 2 contacts the bending member 54. It was. However, when the bending member 54 is made of a resin, the shape memory alloy member 2 may be easily melted by the heat generation as the contact width of the protrusion 54a (the length contacting the shape memory alloy member) becomes smaller. Therefore, when a member having a very low heat resistance such as resin is employed as the bending member 54, it is desirable to increase the contact width of one protrusion 54a while reducing the contact ratio. Based on this point, experiments conducted using bending members having various cross-sectional shapes will be described below.

FIG. 31 is a perspective view of a main part of this experimental apparatus. As shown in FIG. 31, in this experiment, similarly to the experiments shown in FIGS. 5 to 8, the crimp terminal 120 is attached to one end (fixed end) of the shape memory alloy member 2 and fixed to the fixing pin 121. A crimp terminal 120 is also attached to the other end (movable end) of the shape memory alloy member 2 and fixed to another fixing pin 121 via the elastic member 4. The shape memory alloy member 2 has a length of 50 mm and a wire diameter of 60 μm. In a non-energized state, a tension of about 392 × 10 ⁻³ N is generated in the shape memory alloy member 2. The displacement amount of the movable end of the shape memory alloy member 2 (for example, the displacement amount of the crimp terminal 120 coupled to the elastic member 4) when a 140 mA direct current is passed through the shape memory alloy member 2 is measured.

  FIGS. 32A to 32D are plan views for explaining an experiment performed using four types of bending members 162 to 165. In the experiment shown in FIG. 32A, a prism member bending member 162 having a substantially triangular cross section is used, and in the experiment shown in FIG. 32B, a prism member bending member 163 having a substantially rectangular cross section is used. In the experiment shown in FIG. 32C, a prism member bending member 164 having a substantially hexagonal cross section is used, and in the experiment shown in FIG. 32D, a cylindrical member bending member 165 having a substantially circular cross section. Is used. These bending members 162 to 165 are formed of POM. In any case, the distance C from the bending members 162 to 165 to the fixed end of the shape memory alloy member 2 is about 8 mm.

  33 to 36 are plan views showing specific cross-sectional shapes of the bending members 162 to 165 described above.

  The bending member 162 shown in FIG. 33 (a) is provided with a protrusion 162a having a radius R of 0.5 mm at each corner of a triangular prism, and the contact ratio is 10%. The interval S between the adjacent protrusions 162a is 9.4 mm. The bending member 162 shown in FIG. 33 (b) is provided with protrusions 162b having a radius R of 1.6 mm at each corner of a triangular prism, and the contact ratio is 33%. An interval S between adjacent protrusions 162b is 7.1 mm. A bending member 162 shown in FIG. 33 (c) is provided with a protrusion 162c having a radius R of 2.5 mm at each corner of a triangular prism, and the contact ratio is 50%. An interval S between adjacent protrusions 162c is 5.2 mm. The bending member 162 shown in FIG. 33 (d) is provided with a protrusion 162d having a radius R of 3.3 mm at each corner of a triangular prism, and the contact ratio is 66%. An interval S between adjacent protrusions 162d is 3.6 mm. Note that FIGS. 29 and 30 described above illustrate an example in which the bending member 162 illustrated in FIGS. 33A to 33D is used.

  Similarly, a bending member 163 shown in FIG. 34 (a) is provided with protrusions 163a having a radius R of 0.5 mm at each corner of a quadrangular prism, and the contact ratio is 10%. An interval S between adjacent protrusions 163a is 7.1 mm. A bending member 163 shown in FIG. 34 (b) is provided with protrusions 163b having a radius R of 1.6 mm at each corner of a quadrangular prism, and the contact ratio is 33%. An interval S between adjacent protrusions 163a is 5.3 mm. A bending member 163 shown in FIG. 34C has protrusions 163c having a radius R of 2.5 mm at each corner of the quadrangular prism, and the contact ratio is 50%. An interval S between adjacent protrusions 163c is 3.9 mm. A bending member 163 shown in FIG. 34 (d) has protrusions 163d having a radius R of 3.3 mm at each corner of a quadrangular prism, and the contact ratio is 66%. An interval S between adjacent projecting portions 162d is 2.7 mm.

  Similarly, the bending member 164 shown in FIG. 35 (a) is provided with protrusions 164a having a radius R of 0.5 mm at each corner of the hexagonal column, and the contact ratio is 10%. An interval S between adjacent protrusions 164a is 4.7 mm. A bending member 164 shown in FIG. 35 (b) is provided with protrusions 164b having a radius R of 1.6 mm at each corner of the hexagonal column, and the contact ratio is 33%. An interval S between adjacent protrusions 164b is 3.6 mm. The bending member 164 shown in FIG. 35 (c) is provided with protrusions 164c having a radius R of 2.5 mm at each corner of the hexagonal column, and the contact ratio is 50%. An interval S between adjacent protrusions 164c is 2.6 mm. A bending member 164 shown in FIG. 35 (d) has protrusions 164d having a radius R of 3.3 mm at each corner of the hexagonal column, and the contact ratio is 66%. An interval S between adjacent protrusions 164d is 1.8 mm.

  The bending member 165 shown in FIG. 36A is a cylinder having a diameter D of 10 mm, and the contact ratio is 100%. The bending member 165 shown in FIG. 36 (b) is provided with 20 protrusions 165b having a disposition pitch P of 1.56 mm and a width W1 of 0.52 mm along the circumference of a cylinder having a diameter D of 10 mm. The contact ratio is 33%. The groove width W2 between the adjacent protrusions 165b is 1.05 mm. The bending member 165 shown in FIG. 36 (c) is provided with 20 protrusions 165c having a disposition pitch P of 1.56 mm and a width W1 of 0.78 mm along the circumference of a cylinder having a diameter D of 10 mm. The contact ratio is 50%. The groove width W2 between the adjacent protrusions 165b is 0.78 mm. A bending member 165 shown in FIG. 36 (d) is provided with 20 protrusions 165d having a pitch P of 1.56 mm and a width W1 of 1.05 mm along the circumference of a cylinder having a diameter D of 10 mm. The contact ratio is 66%. The groove width W2 between the adjacent protrusions 165d is 0.52 mm.

  Using these bending members 162 to 165, the displacement of the movable end of the shape memory alloy member 2 was measured as shown in FIGS. 32 (a) to 32 (d). The results are shown in Table 4 and FIG. In FIG. 37, the vertical axis represents the displacement ratio H (%), and the horizontal axis represents the contact ratio S (%). In FIG. 37, symbols a, b, c, and d indicate the results of the experiment shown in FIGS. 32 (a), (b), (c), and (d), respectively.

  From Table 4 and FIG. 37, it can be seen that the displacement amount of the shape memory alloy member 2 varies depending on the contact ratio S, not the shape of the bending members 162 to 165 (triangular prism, quadrangular prism, etc.). It can also be seen that the smaller the contact ratio S, the larger the displacement. Therefore, in order to increase the amount of displacement of the shape memory alloy member 2 and increase the width of the contact portion (in order to suppress melting due to heat generation of the shape memory alloy member 2), a cross-sectional triangle with a small number of sides It will be appreciated that it is preferable to select a shaped bending member 162 (FIG. 33).

  As described above, according to the driving device 161 (FIG. 30) of the present embodiment, since the shape of the bending member is a substantially polygonal column, melting can be prevented while suppressing a decrease in the displacement amount of the moving body 3. It is possible to select the contact width of the protrusion. That is, it is possible to prevent melting of the protruding portion of the bending member, suppress a decrease in the amount of displacement of the moving body 3, and improve space efficiency. That is, the drive device can be downsized.

Embodiment 13 FIG.
FIGS. 38 and 39 are views for explaining a fixing method (caulking method) between the shape memory alloy member 202 and the crimp terminal 208 according to the thirteenth embodiment of the present invention. The crimp terminal 208 can be used to fix one end of the shape memory alloy member 202 to an elastic member (for example, the elastic member 4 shown in FIG. 1), a fixing pin, or the like.

  As shown in FIG. 38 (a), the crimp terminal 208 is constituted by a metal plate-like member, and includes a substantially rectangular base portion 208b and an annular portion 208c formed at one end in the longitudinal direction of the base portion 208b. , And caulking portions 208a formed on both sides of the base portion 208b in the short direction. One end of the shape memory alloy member 202 is positioned approximately at the center of the base portion 208b of the crimp terminal 208, and the crimp portion 208a is bent as shown in FIG. Can be fixed (caulked). Further, as shown in FIG. 38 (c), the shape memory alloy member 202 may be wound around one caulking portion 208a, and then the caulking portion 208a may be bent as shown in FIG. 38 (d).

In the present embodiment, further, as shown in FIG. 39, a current is passed between the crimp terminal 208 and the shape memory alloy member 202 by the energizing circuit 207. The energization circuit 207 is connected to an arbitrary position of the crimp terminal 208 (including a portion 202b fixed to the crimp terminal 208 of the shape memory alloy member 202) and a position 202a near the crimp terminal 208 on the shape memory alloy member 202. To do.
Here, a current (overcurrent) that causes the shape memory alloy member 202 to be heated to a temperature at which the shape stored in the shape memory alloy member 202 disappears is caused to flow through the energization circuit 207. As a result, the portion of the shape memory alloy member 202 closer to the crimp terminal 208 than the position 202a loses the shape memory.

  The effect of this Embodiment is as follows. By simply fixing the shape memory alloy member 202 to the crimping terminal 208, the shape memory alloy member 202 repeatedly expands and contracts with heating and cooling due to energization (or environmental temperature change), whereby the shape memory alloy member 202 and the caulking portion 208a. There is a possibility that the reliability at the fixed portion decreases and the shape memory alloy member 202 comes off from the caulked portion 208a or is cut. In the present embodiment, the shape memory of the portion 202b fixed to the crimp terminal 208 of the shape memory alloy member 202 is obtained by utilizing the property that the stored shape disappears when the shape memory alloy is heated above a certain temperature. By erasing, the portion 202b is prevented from expanding and contracting. As a result, the reliability of the connection between the shape memory alloy member 202 and the crimp terminal 208 is improved, and the shape memory alloy member 202 can be prevented from being disconnected or cut off from the crimp terminal 208.

Embodiment 14 FIG.
FIG. 40 is a perspective view showing a drive device 211 according to Embodiment 14 of the present invention. The drive device 211 shown in FIG. 40 includes pin-shaped bending members 215a, 215b, 215c, and 215d that are erected on the base 216 so as to be positioned at four vertices of a quadrangle. On the base 216, between the bending members 215a and 215d, fixing pins 219a and 219b are erected in order from the side closer to the bending member 215a. The wire-shaped shape memory alloy member 212 is wound around the bending members 215a, 215b, 215c, and 215d. A crimp terminal 218a is attached to one end (fixed end) of the shape memory alloy member 212, and the crimp terminal 218a is fixed to the fixing pin 219a. A crimp terminal 218 b is attached to the other end (free end) of the shape memory alloy member 212, and the crimp terminal 218 b is fixed to one end of the elastic member 214. The other end of the elastic member 214 is fixed to the fixing pin 219b.
Among the bending members 215a to 215d, the energization circuit 217 includes a bending member 215a closest to the fixed end (crimp terminal 218a) of the shape memory alloy 212 and a bending member 215d closest to the movable end (crimp terminal 218b). It is connected. Other configurations are the same as those in the first embodiment.

  Here, the bending members 215 a to 215 d constitute bending means for bending the shape memory alloy member 212. The portions that contact the shape memory alloy member 212 on the peripheral surfaces of the bending members 215a to 215d constitute contact portions that contact the shape memory alloy member 212 in the bending means. The base 216 constitutes a holding unit that holds the bending members 215a to 215d.

  In the above configuration, a current is passed through the shape memory alloy member 212 via the bending members 215a and 215b by the energization circuit 217, and the shape memory alloy member 212 is heated and contracted to thereby move the movable body (here, the crimp terminal 218b). Can be displaced. At this time, the current flows from the bending member 215a to the bending member 215d in the shape memory alloy member 212, and does not flow to the crimp terminals 218a and 218b at both ends of the shape memory alloy member 212. Therefore, the portion of the shape memory alloy member 212 fixed to the crimping portions 218c of the crimp terminals 218a and 218b does not expand and contract, and as a result, the reliability of the coupling between the crimp terminals 218a and 218b and the shape memory alloy member 212 is improved. To do.

  In order to explain the effect of the present embodiment, a comparative example shown in FIG. The drive device 211a is configured by linearly arranging shape memory alloy members 212 having crimp terminals 218a and 218b attached to both ends. One crimp terminal 218 a is attached to a fixing pin 219 a erected on the base 216, and the other crimp terminal 218 b is attached to one end of the elastic member 214. The other end of the elastic member 214 is fixed to a fixing pin 219 b erected on the base 216. A wiring portion 217a (for example, a cable) of the energization circuit 217 is connected to a fixed end (crimp terminal 218a) and a movable end (crimp terminal 218b) of the shape memory alloy member 212. When a current is passed through the shape memory alloy member 212 by the energization circuit 217, the movable body (crimp terminal 218b) is displaced.

  However, in such a driving device 211a, the crimping terminal 218b to which the wiring part 217a of the energization circuit 217 is connected moves, so that an unnecessary external force is not applied to the moving body (crimping terminal 218b) from the wiring part 217a. It is necessary to leave a space around 217a. In addition, the reliability of electrical connection between the wiring member 217a and the crimp terminal 218b by, for example, solder may be lowered.

  41B, the shape memory alloy member 212 is bent into a V shape, and the crimp terminals 218 attached to both ends thereof are fixed to the two fixing pins 219a erected on the base 216, respectively. The moving body 213 is attached to the V-shaped bent portion. The moving body 213 is fixed to one end of the elastic body 214, and the other end of the elastic body 214 is fixed to a fixing pin 219 b erected on the base 216. The energization circuit 217 is connected to the two fixing pins 219 a and supplies current to the shape memory alloy member 212 via the fixing pins 219 a and the crimp terminals 218.

  However, in such a driving device 211b, since a current flows through the crimp terminal 218, the portion fixed to the crimp terminal 218 of the shape memory alloy member 212 repeatedly expands and contracts, and the reliability of the joint portion decreases. Problems such as the shape memory alloy member 212 coming off from the crimp terminal 218 or the shape memory alloy member 212 being cut easily occur.

  On the other hand, in the driving device 211 according to the present embodiment, since the wiring part of the energization circuit 217 can be connected to the bending members 215a and 215d, the influence of the wiring part is exerted on the moving body (here, the crimp terminal 218b). Can be prevented. Therefore, it is not necessary to secure a space around the wiring portion, and the configuration of the driving device 211 can be simplified and downsized. Further, since no current flows through the crimp terminals 218a and 218b, the portion of the shape memory alloy member 212 fixed to the crimp terminals 218a and 218b does not expand and contract, and therefore the crimp terminals 218a and 218b and the shape memory alloy member 212 The reliability of coupling is improved.

Embodiment 15 FIG.
FIG. 42 is a perspective view showing the configuration of the drive device 221a according to Embodiment 15 of the present invention. In the fourteenth embodiment (FIG. 40) described above, current is supplied from the bending members 215d and 215a closest to the movable end and the fixed end of the shape memory alloy member 212, but in the present embodiment, the shape memory alloy member 222 is provided. The potential V1 is applied to the bending member 225a closest to the fixed end (crimp terminal 228a), the adjacent bending member 225b is grounded, the potential V2 is applied to the adjacent bending member 225c, and the movable end (crimp terminal 228b) is the most. The near bending member 225d is grounded. A potential V1 is applied to the pin 229a fixing the crimp terminal 228a so that no current flows through the crimp terminal 228a. Other configurations are the same as those in the fourteenth embodiment.
Here, the bending members 225 a to 225 d constitute bending means for bending the shape memory alloy member 222. The portions that contact the shape memory alloy member 222 on the peripheral surfaces of the bending members 225a to 225d constitute contact portions that contact the shape memory alloy member 222 in the bending means. The base 226 constitutes a holding unit that holds the bending members 225a to 225d.

  In the above configuration, the current flows through the section of the shape memory alloy member 222 from the bending member 225c to the bending member 225b, the section from the bending member 225c to the bending member 225d, and the section from the bending member 225a to the bending member 225b. . As a result, each section of the shape memory alloy member 222 is heated and contracts, and the movable body (here, the crimp terminal 228b) is displaced.

  That is, the current does not flow uniformly throughout the shape memory alloy member 222 but flows independently for each section. Since the resistance value of the current flowing through each section of the shape memory alloy member 222 is uniformly smaller than when the current flows uniformly, the necessary voltage is obtained even when the same current value as in the fourteenth embodiment is obtained. Can be kept small.

  Further, for example, by setting the electric potential to be applied to the bending member 225a to 0, the current flows such that the current flows only to two sides of the shape memory alloy member 222 (between the bending members 225b and 225c and between the bending members 225c and 225d). Can also be selected. In this way, only the portion of the shape memory alloy member 222 where the current flows expands and contracts, so that it is possible to select the displacement amount of the moving body (here, the crimp terminal 228b).

  In a configuration in which the amount of displacement is variable by flowing a current partially in the longitudinal direction of the shape memory alloy member, the shape memory alloy member is brought into contact with a power supply member such as a pin (here, bending members 225a to 225d) to supply power. How to do is effective. As another method, a method of attaching a lead wire for power feeding to the shape memory alloy member is conceivable, but in order to increase the number of types of displacement to be selected, a large number of lead wires must be attached. For this reason, in order to prevent the shape memory alloy member from being affected by external force, a large space for wiring the lead wires is required, and it is difficult to reduce the size of the drive device. In addition, when the reliability of soldering of the shape memory alloy member is not high, a crimp terminal or the like is used. However, when the number increases, there is a problem that a large space is required. On the other hand, as in the present embodiment, if the power is supplied by bringing the shape memory alloy member 222 into contact with the pin-shaped bending members 225a to 225d, there is no need to attach a large number of lead wires. The drive device can be reduced in size while making it possible to select the amount of displacement.

  In this embodiment, the shape memory alloy member 222 is wound about 90 degrees around the pin-shaped bending members 225a to 225d (power feeding members), but the winding angle is not limited to about 90 degrees, and the bending members 225a to 225d are also pins. It is not limited to the shape. Further, the shape memory alloy member 222 and the power supply member may be brought into contact with each other using another contact such as a spring contact to supply power. Even in this way, it is possible to achieve downsizing of the driving device.

43, even when the shape memory alloy member 222 is wound around the bending members 225a to 225d a plurality of times, the shape memory alloy member 222 in the same section (for example, between the bending members 225a and 225b) is arranged in parallel. Since the current flows, the same current supply as when the shape memory alloy member 222 is wound only once around the bending members 225a to 225d (FIG. 42) becomes possible.
In addition, since the total length of the shape memory alloy member 222 can be increased, a sufficient amount of displacement of the moving body (crimp terminal 228b) can be obtained even if the drive device 221b is downsized.

  As described above, according to the present embodiment, it is possible to keep the voltage low by flowing the current to the shape memory alloy member 222 for each section, and to select the displacement amount of the moving body. Will also be possible. In particular, in portable terminal devices such as mobile phone devices, the usable voltage is often limited to a low level. Therefore, the driving device according to this embodiment that can be driven at a low voltage and is suitable for downsizing is provided. Is very useful.

Embodiment 16 FIG.
FIG. 44 is a perspective view showing drive device 231a according to Embodiment 16 of the present invention. In the fourteenth embodiment described above, the current is made to flow uniformly over the entire length of the shape memory alloy member 212, whereas in the present embodiment, a different current is passed through the shape memory alloy member 232 for each section. I have to. This is because the shape memory alloy member 232 is subjected to a friction load with the bending member in addition to the biasing force of the elastic member 234, but the magnitude of the friction load varies depending on the position of the shape memory alloy member 232 in the longitudinal direction. Is taken into account.

  First, an experiment that is a premise of the present embodiment will be described. In the experiment shown in FIG. 45, a wire-shaped shape memory alloy member 232 is wound around a cylindrical bending member 235 having a contact ratio of 33%, and a straight portion of the shape memory alloy member 232 (a portion not wound around the bending member 235). Only through the energization circuit 237 is a current passed. The length of the energized portion of the shape memory alloy member 232 is 50 mm. One end (fixed end) of the energized portion of the shape memory alloy member 232 is fixed to the fixed pin 239a, and the displacement amount of the other end (movable end 233) of the energized portion is measured. Instead of the elastic member, a weight 234 a having a weight of 30 g is attached to the movable end of the shape memory alloy member 232 so that the load does not change due to the displacement of the shape memory alloy member 232. The bending member 235 is formed of POM and is a substantially cylindrical member having a contact ratio of 33% and a diameter of 10 mm as shown in FIG. In order to evaluate the influence of the frictional load caused by winding the shape memory alloy member 232 around the bending member 235, the shape memory alloy member 232 is placed on the cylindrical member 235 once (360 degrees), twice (720 degrees), and three weeks (1080). Degree) Wrap it up and perform each experiment. The greater the number of windings, the greater the friction load. Table 5 and FIG. 46 show the results of measuring the displacement amount R of the movable end 233 by changing the current value from 60 mA to 180 mA. In FIG. 46, the vertical axis represents the displacement amount R (mm) of the movable end 233 of the shape memory alloy member 232, and the horizontal axis represents the current I (mA) passed through the shape memory alloy member 232. Symbols a, b, and c correspond to data when the shape memory alloy member 232 is wound once (360 degrees), twice (720 degrees), and three weeks (1080 degrees), respectively.

  From Table 5 and FIG. 46, when the shape memory alloy member 232 is wound once (a), the current I has an extreme point in the vicinity of 80 mA, and the displacement amount R changes greatly even when a current of 80 mA or more flows. I understand that I don't. When the shape memory alloy member 232 is wound twice (b), it can be seen that there is an extreme point in the vicinity of the current I of 100 mA, and the displacement amount R does not change greatly even when a current of 100 mA or more is passed. When the shape memory alloy member 232 is wound three times (c), it can be seen that the current I has an extreme point in the vicinity of 160 mA, and the displacement amount R does not change greatly even when a current of 160 mA or more flows. From this result, it can be seen that by selecting an optimal current according to the frictional force, it is possible to obtain a substantially maximum amount of displacement while suppressing the power consumption of the drive device 231.

  Based on this result, the drive device 231a according to the present embodiment will be described. As shown in FIG. 44, in the driving device 231a according to the present embodiment, four bending members 235a, 235b, 235c, and 235d are arranged on the base 236 at positions that form the vertices of a quadrangle. ing. Four bending members 235e, 235f, 235g, and 235h are arranged inside the bending members 235a to 235d, and further, four bending members 235i, 235j, 235k, and 235l are arranged inside the bending members 235a to 235d. A thirteenth bending member 235 m and a fixing pin 239 b are disposed at a substantially central portion of the substrate 236.

  The wire-shaped shape memory alloy member 232 is wound around a total of 13 bending members 235 a to 235 m on the base 236. That is, the shape memory alloy member 232 makes one round of the outermost bending members 235a to 235d, then makes one round of the inner bending members 235e to 235h, and further makes one round of the inner bending members 235i to 235l. It is bent by the member 235m. A crimp terminal 239d is attached to one end (fixed end) of the shape memory alloy member 232 bent by the bending member 235m, and the crimp terminal 239d is fixed to the fixing pin 239b. A crimp terminal 239 c is attached to the other end (movable end) of the shape memory alloy member 232, and the crimp terminal 239 c is fixed to one end of the elastic member 234 in the vicinity of the outer periphery of the base 236. The other end of the elastic member 234 is fixed to a fixing pin 239 a erected on the base 236.

  The bending members 235a to 235m constitute bending means for bending the shape memory alloy member 232. The portions that contact the shape memory alloy member 232 on the peripheral surfaces of the bending members 235a to 235m constitute contact portions that contact the shape memory alloy member 232 in the bending means. The base 236 constitutes a holding unit that holds the bending members 235a to 235m.

A potential Va is applied to the bending member 235a closest to the movable end of the shape memory alloy member 232, and the bending member 235e at the position where the shape memory alloy member 232 is wound around the bending member 235a by one turn is grounded. Further, a potential Vb is applied to the bending member 235i at the position where the shape memory alloy member 232 is wound twice from the bending member 235a, and the bending member 235k at the position wound twice and a half is grounded. A potential Vc is applied to the bending member 235m closest to the fixed end of the shape memory alloy member 232.
As a result, the current Ia flows in the section from the bending member 235a to the bending member 235e of the shape memory alloy member 232, and the current Ib flows in the section from the bending member 235i to the bending member 235e. Further, the current Ic flows through the section from the bending member 235i to the bending member 235k, and the current Id flows through the section from the bending member 235m to the bending member 235k. Note that a conductive coil spring is used as the elastic member 234, and the same voltage (Va) as that of the bending member 235a is applied to the fixing pin 239a, so that no current flows through the crimp terminal 239c. Further, the same voltage (Vc) as that of the bending member 235m is applied to the fixing pin 239b so that no current flows through the crimp terminal 239d. Since no current flows through the crimp terminals 239c and 239d, the shape memory alloy member 232 does not expand and contract at the crimped portion 239e of the crimp terminals 239c and 239d as described above, and the reliability of the coupling is improved.

  In the shape memory alloy member 232, the closer to the movable end (crimp terminal 239c), the smaller the friction load during energization. Further, if the length of the section through which the current flows is long, the amount of displacement with respect to the same current is large, so that the necessary current value is small even if the friction load is the same. The section from the bending member 235e to the bending member 235i (section in which the current Ib flows) has a larger friction load than the section from the bending member 235a to the bending member 235e (section in which the current Ia flows), and the section length is slightly longer. Since it is short, the current Ib is set larger than the current Ia. With reference to the experimental result of FIG. 46, the current Ia is set to 80 mA, for example, and the current Ib is set to 100 mA, for example. The section from the bending member 235i to the bending member 235k (section in which the current Ic flows) has a larger friction load and the section length than the section from the bending member 235e to the bending member 235i (section in which the current Ib flows). Since it is short, the current Ic is set larger than the current Ib. The section from the bending member 235m to the bending member 235k (section in which the current Id flows) has a slightly larger friction load and the same section length than the section from the bending member 235i to the bending member 235k (section in which the current Ic flows). Therefore, the current Id is set larger than or substantially the same as the current Ic. The currents Ic and Id are set to 160 mA, for example, based on the experimental results of FIG.

  As described above, the maximum amount of displacement can be achieved while reducing the power consumption by changing the value of the current flowing through the shape memory alloy member 232 in consideration of the friction load according to the winding position of the shape memory alloy member 232. Can be obtained.

  44, the movable end 239c (and the elastic member 234) of the shape memory alloy member 232 is disposed on the outermost side, but the fixed end 239d is disposed on the outermost side and the movable end 239c is disposed on the outermost side. It can also be placed inside. However, if the movable end 239c is arranged on the outermost side, a large displacement can be obtained with low power consumption. This is because when the movable end 239c is arranged on the outermost side, the length of the outer peripheral portion of the shape memory alloy member 232 becomes longer, so the amount of displacement increases, and the load of the elastic member 234 and the friction load with the bending member are increased. This is because the total sum is relatively small (relative to the amount of displacement), so that a current value necessary to obtain a desired amount of displacement can be small.

  FIG. 47 is a perspective view showing another example of voltage application in the present embodiment. In the example shown in FIG. 47, the bending member 235a is grounded, and the electric potential Va is applied to the bending member 235c at the position where the shape memory alloy member 232 is wound half a turn. Similarly, the bending member 235e at the position where the shape memory alloy member 232 is wound once is grounded, and the potential Vb is applied to the bending member 235g at the position where it is wound half a turn. Further, the bending member 235i at the position where the shape memory alloy member 232 is wound twice is grounded, the potential Vc is applied to the bending member 235k at the position where the shape memory alloy member 232 is wound twice, and the bending member 235m at the position where the shape memory alloy member 232 is wound three times. Is grounded. As a result, the current Ia flows from the bending member 235c to the bending member 235a, and the current Ib flows from the bending member 235c to the bending member 235e. Further, a current Ic flows from the bending member 235g to the bending member 235e, and a current Id flows from the bending member 235g to the bending member 235i. Further, the current Ie flows from the bending member 235k to the bending member 235i, and the current If flows from the bending member 235k to the bending member 235m. Each current value can be set as Ia ≦ Ib ≦ Ic ≦ Id ≦ Ie ≦ If. For example, from the experimental results of FIG. 46, current Ia and current Ib are about 80 mA, current Ic and current Id are about 100 mA, current Ie and current If can be set to about 160 mA. In the configuration example shown in FIG. 47, either a constant voltage circuit or a constant current circuit can be selected as the power supply circuit.

  Further, instead of supplying all the currents Ia to If, a current may be selectively passed. The displacement amount of the shape memory alloy member 232 can be made variable by making it possible to select a portion through which an electric current flows (a portion that expands and contracts) and a portion that does not flow (a portion that does not expand and contract) with respect to the entire length of the shape memory alloy member 232. Can do.

  FIG. 48 is a perspective view showing drive device 231c according to the present embodiment. The energization circuit 237c includes constant current circuits 238a, 238b, and 238c. In the constant current circuit 238a, one terminal is connected to the bending member 235m, and the other terminal is connected to the bending member 235a. In the constant current circuit 238b, one terminal is connected to the bending member 235m, and the other terminal is connected to the bending member 235e. The constant current circuit 238c has one terminal connected to the bending member 235m and the other terminal connected to the bending member 235i. A current Ia + Ib + Ic flows between the bending member 235m and the bending member 235i by the constant current circuits 238a, 238b, 238c. In addition, a current Ia + Ib flows between the bending member 235i and the bending member 235e by the constant current circuits 238a and 238b. Further, a current Ia flows between the bending member 235e and the bending member 235a by the constant current circuit 238a. That is, among the shape memory alloy members 232, the most current flows between the bending member 235m and the bending member 235i, and then the most current flows between the bending member 235i and the bending member 235e, and the bending member 235e and the bending member 235e are bent. The current flowing between the member 235a is minimized. Specifically, considering the experimental result of FIG. 46, the largest current (Ia + Ib + Ic) can be set to 160 mA, the next largest current (Ia + Ib) can be set to 100 mA, and the smallest current (Ia) can be set to 80 mA. In this case, the current Ib can be set to 20 mA, and the current Ic can be set to 60 mA.

  FIG. 49 is a block diagram of the energization circuit 237c shown in FIG. As shown in FIG. 49, the total length L of the shape memory alloy member 232 (here, the length from the bending member 235a to the bending member 235m) is 15 mm, and the length between the bending members 235a and 235e of the shape memory alloy member 232 is as shown in FIG. L3, the length L2 between the bending members 235e and 235i, and the length L1 between the bending members 235i and 235m are each 5 mm, and the resistance value of the shape memory alloy member 232 is 0.5 Ω / mm. The current Ia + Ib + Ic (160 mA) flows between the bending member 235m and the bending member 235i of the shape memory alloy member 232, the current Ia + Ib (100 mA) flows between the bending member 235i and the bending member 235e, and the bending member 235e and the bending member. When a current Ia (80 mA) flows between 235a and the entire power consumption, it becomes 0.105W. In contrast, as shown in the block diagram of FIG. 50 as a comparative example, the power consumption when a constant current of 160 mA is passed over the entire length L (15 mm) of the shape memory alloy member 232 is 0.192 W. From this result, it can be seen that the power consumption can be reduced to 55% by supplying the current separately as shown in FIG.

  FIG. 51 is a circuit diagram for explaining the constant current circuits 238a to 238c shown in FIG. In the constant current circuit 238c, the resistor 238d (R0) is a current value detection resistor. When a current 238e (Ic) is passed through the resistor 238d (R0), a potential difference of Ic × R0 is generated at both ends of the resistor 238d (R0). This potential difference becomes an input voltage to the negative input terminal 238g of the operational amplifier 238f. Further, an input voltage (reference voltage) to the plus input terminal 238j of the operational amplifier 238f is set by the resistor 238h (R1) and the variable resistor 238i (VR). The operational amplifier 238f changes the potential of the G terminal 238l of the FET (field effect transistor) 238k, adjusts the current flowing from the D terminal 238m to the S terminal 238n, and changes the potential of the negative input terminal 238g of the operational amplifier 238f to the positive input terminal 238j. Operates to match the potential. As a result, the potential of the negative input terminal 238g of the operational amplifier 238f becomes constant, and the current (Ic = V / R0) 238e becomes constant regardless of the resistance value of the shape memory alloy member 232. The constant current circuits 238a and 238b operate in the same manner as the constant current circuit 238c.

  Here, the constant current circuits 238a to 238c have been described as the suction type constant current circuit, but the present invention is not limited to this, and a discharge constant current circuit may be used. In this case, a ground potential is applied to the bending member 235m closest to the fixed end of the shape memory alloy member 2, and the directions of the currents Ia, Ib, and Ic are opposite to those in FIG.

  As described above, according to the present embodiment, a large amount of displacement can be obtained with low power consumption by appropriately supplying a current corresponding to a friction load or the like to each part of the shape memory alloy member 232. Is possible.

Embodiment 17. FIG.
FIG. 52 is a perspective view showing the configuration of the drive device 241a according to Embodiment 17 of the present invention. In Embodiments 14 to 16 described above, the shape memory alloy member is wound around a plurality of pin-shaped bending members, and an electric current is passed through the shape memory alloy member through the bending members. The pin-shaped bending member is mechanically and electrically joined to the electronic circuit board.

  As shown in FIG. 52, in the driving device 241a, pin-shaped bending members 245a, 245b, 245c, and 245d are erected on an electronic circuit board 249 in a mechanically joined state. Further, among the bending members 245 a to 245 d, at least the bending members 245 a and 245 d are electrically joined to the electronic circuit board 249. In addition, fixing pins 249a and 249b are erected between the bending members 245a and 245d in order from the side closer to the bending member 245a.

  One end (fixed end) of the shape memory alloy member 242 is fixed to the fixing pin 249a via the crimp terminal 248a, and is wound around the bending members 245a, 245b, 245c, and 245d by approximately 90 degrees. The other end (movable end) of the shape memory alloy member 242 is fixed to one end of the elastic member 244 via the crimp terminal 248b, and the other end of the elastic member 244 is fixed to the fixing pin 249b. Other configurations are the same as those in the fourteenth embodiment.

  The bending members 245a to 245d constitute bending means for bending the shape memory alloy member 242. The portions that contact the shape memory alloy member 242 on the peripheral surfaces of the bending members 245a to 245d constitute contact portions that contact the shape memory alloy member 242 in the bending means. The electronic circuit board 249 constitutes a holding unit that holds the bending members 245a to 245d.

  In the above configuration, the electronic circuit board 249 causes a current to flow through the shape memory alloy member 242 via the bending members 245a and 245d, and the shape memory alloy member 242 is heated and contracted to thereby move the movable body (here, the crimp terminal 248b). ) Can be displaced.

  According to the present embodiment, since the bending members 245a to 245d are held by the electronic circuit board 249, an independent base becomes unnecessary, and as a result, the number of parts can be reduced and the size of the driving device can be reduced. It becomes easy. In particular, if this drive device 241a is applied to the above-described fourteenth to sixteenth embodiments (FIGS. 40, 42 to 44, 47 to 48), an energization circuit (for example, the energization circuit 217 in FIG. 40 or the energization circuit 237c in FIG. 48). ) Can be formed on the electronic circuit board 249, so that power can be easily supplied to the bending members 215, 225, and 235 (FIGS. 40, 42 to 44, and 47 to 48). Moreover, since the bases 216, 226, and 236 (FIGS. 40, 42 to 44, and 47 to 48) for holding these bending members can be formed on the electronic circuit board 249, the number of components can be reduced, and The drive device can be easily downsized.

  FIG. 53 is a perspective view showing another configuration example of the drive device according to the present embodiment. In the drive device 241b shown in FIG. 53, bending members 245a, 245b, 245c, and 245d are erected on a base 246. Fixing pins 249a and 249b are erected between the bending members 245a and 245d in order from the side closer to the bending member 245a. One end (fixed end) of the shape memory alloy member 242 is fixed to the fixing pin 249a via the crimp terminal 248a, and is wound around the bending members 245a, 245b, 245c, and 245d by approximately 90 degrees. The other end (movable end) of the shape memory alloy member 242 is fixed to one end of the elastic member 244 via the crimp terminal 248b, and the other end of the elastic member 244 is fixed to the fixing pin 249b.

  In the drive device 241b shown in FIG. 53, an electronic circuit board 249 is further arranged on the side opposite to the base 246 with respect to the shape memory alloy member 242. Bending members 245a to 245d are mechanically joined to the electronic circuit board 249. Here, the pin-shaped bending members 245a to 245d are fitted into the four through holes formed in the electronic circuit board 249, respectively. Of the bending members 245a to 245d, the bending members 245a and 245d necessary for energizing the shape memory alloy member 242 are electrically joined to the electronic circuit board 249. Note that all the bending members 245a to 245d may be electrically and mechanically joined to the electronic circuit board 249.

  In the drive device 241a shown in FIG. 52 described above, the bending members 245a to 245d are joined to the electronic circuit board 249. Therefore, when the driving force generated with the expansion and contraction of the shape memory alloy member 242 is relatively small, the bending member 245a to 245d can be stably held, but when the driving force is large and the load applied to the bending members 245a to 245d is large, it is difficult to stably fix the bending members 245a to 245d. It is conceivable to reduce the reliability of the. On the other hand, according to the driving device 241b shown in FIG. 53, since the bending members 245a to 245d are fixed by the base 246, the base 246 is designed according to the load applied to the bending members 245a to 245d. By doing so, stable holding becomes possible. Further, since the electronic circuit board 249 assists in holding the bending members 25a to 245d by mechanical joining between the electronic circuit board 249 and the bending members 245a to 245d, the load applied to the bending members 245a to 245d. Even if this is large, the bending member 245 can be held more stably. In addition, by providing the electronic circuit board 249 on the side opposite to the base 246 with the shape memory alloy member 242 interposed therebetween, the shape memory alloy member 242 can be prevented from falling off the bending member 245.

  In the case of the driving device 241b, strength is not required for the circuit board 249. Therefore, a sheet-like flexible board, that is, a so-called FPC (Flexible Printed Circuit) board can be used.

Embodiment 18 FIG.
FIG. 54 is a perspective view showing the configuration of the driving apparatus 251 according to Embodiment 18 of the present invention.
In Embodiments 14 to 17 described above, the shape memory alloy member is wound around the pin-shaped bending members (for example, the bending members 215a to 215d in FIG. 40), whereas in the driving device 251 according to the present embodiment, A shape memory alloy member 252 is wound around a bending member 252 formed by forming a conductive member on a structure made of a non-conductive member (for example, plastic).

  As shown in FIG. 54, the driving device 251 projects four substantially cylindrical projecting portions 255a to 255d along the four corners of, for example, a square columnar structure 255e formed of a non-conductive member such as plastic. The bending member 255 is formed. Fixing members 258b and 258a are formed on the side surface between the projecting portions 255a and 255d of the bending member 255 in order from the side closer to the projecting portion 255a. One end (fixed end) of the shape memory alloy member 252 is fixed to the fixing member 258b of the bending member 255, and is wound around the protrusions 255a, 255b, 255c, and 255d by 90 degrees. The other end (movable end) of the shape memory alloy member 252 is attached to one end of the elastic member 254 via the moving body 253, and the other end of the elastic member 254 is fixed to the fixed member 258a.

  The bending member 255 has a conductive member 259a at the protrusion 255a closest to the fixed end of the shape memory alloy member 252, and a conductive member 259b at the protrusion 255d closest to the movable end. An energization circuit 257 is connected to these conductive members 259a and 259b. By passing a current through the shape memory alloy member 252 through the conductive members 259a and 259b by the energization circuit 257, the shape memory alloy member 252 is heated, and the moving body 253 attached to the movable end thereof is displaced. In FIG. 54, the energization circuit 257 is shown separated from the bending member 255, but the energization circuit 257 can be formed on the surface of the bending member 255 to constitute a three-dimensional circuit board.

  Here, the bending member 255 having the projecting portions 255 a to 255 d constitutes a bending means for bending the shape memory alloy member 252. The portions of the peripheral surfaces of the protrusions 255a to 255d that contact the shape memory alloy member 252 constitute contact portions that contact the shape memory alloy member 252 in the bending means. The bending member 255 constitutes a holding unit that holds the protruding portions 255a to 255d.

  In the above-described configuration, the moving body 253 can be displaced by causing the current-carrying circuit 257 to pass current through the bending members 259a and 259b to the shape memory alloy member 252 and to heat and contract the shape memory alloy member 252. .

According to the present embodiment, since the shape memory alloy member 252 is wound around the contact portions 258a to 258d formed integrally with the bending member 255, the rigidity of the contact portions 258a to 258d can be improved. Therefore, even when the load applied to the contact portions 258a to 258d is large, the deformation of the contact portions 258a to 258d is suppressed, and the reliability of the electrical connection between the conductive members 259a and 259b and the energization circuit 257 is improved. be able to. In particular, even when the shape memory alloy member 252 is wound around a pin-shaped bending member (for example, FIG. 52), the strength of the mechanical connection between the energization circuit 257 and the conductive members 259a and 259b is high. High reliability of bonding.
Further, the energization circuit 257 is formed on the bending member 255 to form a three-dimensional circuit board, so that the pin-shaped bending members 245a to 245d are sandwiched between the base 246 and the electronic circuit board 249 as shown in FIG. As a result, the drive device can be reduced in size while maintaining the reliability of the electrical and mechanical joining described above.

Embodiment 19. FIG.
FIG. 55 is a perspective view showing a configuration of drive apparatus 261a according to Embodiment 19 of the present invention. In the driving device 261a shown in FIG. 55, a substantially cylindrical bending member 265a having a minute convex portion 265e on the outer peripheral surface is rotatably supported on a base 266. One end (fixed end) of the shape memory alloy member 262 is fixed to a fixing pin 269a provided on the base 266, and is wound about 180 degrees around the bending member 265a while abutting the convex portion 265e of the bending member 265a. It has been. The other end (movable end) of the shape memory alloy member 262 is attached to one end of the elastic member 264 via the moving body 263, and the other end of the elastic member 264 is a fixed pin provided on the base 266. It is fixed to 269b. The energization circuit 267 is connected to the fixing pins 269a and 269b. Other configurations are the same as those in the first embodiment.

  The bending member 265a constitutes a bending means for bending the shape memory alloy member 262. A portion of the convex portion 265e of the bending member 265a that contacts the shape memory alloy member 262 constitutes a contact portion that contacts the shape memory alloy member 262 in the bending means. The base 266 constitutes a holding unit that holds the bending member 265a.

  In the above configuration, the moving body 263 can be displaced by causing a current to flow through the shape memory alloy member 262 via the fixing pins 269a and 269b by the energizing circuit 267 and heating the shape memory alloy member 262 to contract. .

  56 (a) to 56 (c) are perspective views showing experimental devices 261b, 261c, and 261d regarding the effect of the driving device 261a. In the experimental apparatus 261b shown in FIG. 56 (a), a wire-shaped shape memory alloy member 262 is wound around a cylindrical bending member 265b having a diameter of 10 mm that does not have a convex portion and cannot be rotated. One end (fixed end) of the shape memory alloy member 262 is fixed to the fixed pin 269a, and a 50 g weight 264a is attached to the other end (movable end). A 140 mA direct current is passed by the energizing circuit 267 in a range including the portion wound around the bending member 265b of the shape memory alloy member 262, and the displacement amount of the movable end of the shape memory alloy member 262 is measured. In the experimental apparatus 261c shown in FIG. 56 (b), a cylindrical bending member 265c having a diameter of 10 mm, which does not have a convex portion, is rotatably supported on the base 266, and other conditions are shown in FIG. 56 (a). This is the same as the experimental apparatus 261b. In the experimental apparatus 261d shown in FIG. 56 (c), a bending member 265d having an outer diameter of 10 mm having a convex portion 265e is rotatably supported on a base 266, and other conditions are shown in FIG. 56 (b). This is the same as the experimental apparatus 261b. The contact ratio of the bending member 25 (the ratio of the length at which the convex portion 265e contacts the shape memory alloy member 262 to the entire circumference of the bending member 265d) is 33%. The bending members 261b, 261c, and 261d shown in FIGS. 56A to 56C are all formed of POM.

  Using the experimental apparatus shown in FIGS. 56A to 56C, the wrapping angle of the shape memory alloy member 262 is changed to 360 degrees (one turn), 450 degrees (one and a half turns), and 720 degrees (two turns). The displacement amount of the movable end of the shape memory alloy member 262 was measured. Further, in addition to the experimental apparatus 261d shown in FIG. 56 (c), the same experiment was performed when the rotation of the bending member 265d was fixed. The results are shown in Table 6 and FIG. In FIG. 57, the vertical axis represents the displacement ratio H (%), and the horizontal axis represents the winding angle θ (degrees). In FIG. 57, symbol a is data when a cylindrical bending member 265b that does not rotate (FIG. 56A) is used. The symbol b is data when a rotatable cylindrical bending member 265c (FIG. 56B) is used. Symbol c is data when a bending member (not shown) that does not rotate and has a contact ratio of 33% is used. The symbol d is data when a bending member 265d (FIG. 56 (c)) that can rotate and has a contact ratio of 33% is used.

  From FIG. 57, the displacement amount of the shape memory alloy member 262 is about 1.2 to 1 by using the rotatable bending member 265c (reference symbol b) instead of the non-rotating cylindrical bending member 265b (reference symbol a). It can be seen that it increases 5 times. Furthermore, it can be seen that when the bending member 265d (symbol d) that can rotate and has a contact ratio of 33% is used, the amount of displacement of the shape memory alloy member 262 increases by about 2.7 to 3.2 times.

  From the above results, according to the present embodiment, it is understood that the displacement amount of the moving body 263 can be increased by using the bending member 261a that is rotatable and has a convex portion on the outer peripheral surface. As drive devices for winding wire shape memory alloy members around pulleys, there are those disclosed in Japanese Patent Application Laid-Open Nos. 8-777433 and 10-148174, and a convex portion is formed on these pulleys. By reducing the contact ratio, a larger displacement amount can be obtained.

  The rotatable bending member is not limited to a cylindrical shape, and may be a polygonal column shape such as a triangular column shape as described in the twelfth embodiment, or a plurality of pins arranged along a closed path. It may be.

Embodiment 20. FIG.
FIG. 58 is a perspective view showing a configuration of drive device 271a according to Embodiment 20 of the present invention. The driving device 271a according to the present embodiment is different from the driving device 261a (FIG. 55) according to the nineteenth embodiment in that the shape memory alloy member 272 is wound around the pin 279c formed to protrude from the outer peripheral surface of the bending member 275a. Is different.

  As shown in FIG. 58, the drive device 271a has a substantially cylindrical rotatable bending member 275a having a large number of minute convex portions 275e formed on the outer peripheral surface. In addition to the convex portion 275e, a pin (projection) 279c protruding in the radial direction of the bending member 275a is provided on the outer peripheral surface of the bending member 275a. One end (fixed end) of the wire-shaped shape memory alloy member 272 is fixed to the fixing pin 279b on the base 276 via the crimp terminal 278b, and is wound around the bending member 275a, for example, 360 degrees. Further, the shape memory alloy member 272 is wound around the pin 279c, for example, 360 degrees while being wound around the bending member 275a. The other end (movable end) of the shape memory alloy member 272 is fixed to one end of the elastic member 274 via a crimp terminal 278a. The other end of the elastic member 274 is fixed to a fixed pin 279a formed on the base 276. It is fixed.

The bending member 275a constitutes bending means for bending the shape memory alloy member 272. The pin 279c protrudes from the bending member 275a and constitutes a protrusion that further bends the shape memory alloy member 272. The portion that contacts the shape memory alloy member 272 of the convex portion 275e of the bending member 275a constitutes the contact portion that contacts the shape memory alloy member 272 in the bending means. The base 276 constitutes a holding unit that holds the bending member 275a.
In the above configuration, the moving body (crimp terminal 278a) can be displaced by causing a current to flow through the shape memory alloy member 272 by the energization circuit 277 and heating and contracting the shape memory alloy member 272. Along with this, the bending member 275a also rotates. When energization of the shape memory alloy member 272 is stopped, the shape memory alloy member 272 is cooled and extended to the original length, the movable body (crimp terminal 278a) returns to the original position, and the bending member 275a also returns to the original rotational position. Return to.

  The above-described nineteenth embodiment (FIG. 55) is effective when the rotational position of the bending member 265 may be arbitrary as in a pulley, but in this embodiment, the rotational position of the bending member 275a is limited. It is effective in the case.

FIG. 59 is a perspective view showing an experimental apparatus 271b for measuring the displacement amount of the moving body in the driving apparatus 271a according to the twentieth embodiment. In the experimental apparatus 271b, a bending member 275b having a convex portion and a pin 279c on the outer peripheral surface is rotatably provided on the base 276, and the contact ratio of the bending member 275b is 33%. One end (fixed end) of the shape memory alloy member 272 is fixed to a fixing pin 279b provided on the base 276 by a crimp terminal 278b. The shape memory alloy member 272 is wound around the bending member 275b by about 360 degrees, wound around the pin 279c, and further wound around the bending member 275b by about 360 degrees. The other end (movable end) of the shape memory alloy member 272 is attached to one end of an elastic member 274 made of a coil spring by a crimp terminal 278a, and the other end of the elastic member 274 is a fixed pin 279a erected on the base 276. It is fixed to. The energization circuit 277 is connected to the fixing pins 279a and 279b, and allows a current to flow through the shape memory alloy member 272 via the fixing pins 279a and 279b. The shape memory alloy member 272 has a diameter of about 60 μm and a length of about 83 mm. In a state where the shape memory alloy member 272 is not energized, the biasing force of the elastic member 274 is about 392 × 10 ⁻³ N. The value of current flowing through the shape memory alloy member 272 by the energization circuit 277 is 140 mA. The length c of the shape memory alloy member 272 from the bending member 275b to the crimp terminal 278a is about 1.5 mm.

  The displacement amount of the crimp terminal 278a when energized by the energization circuit 277 is measured using the experimental apparatus 271b shown in FIG. In addition, the amount of displacement is also measured when the shape memory alloy member 272 is not wound around the pin 279c and when the rotation of the bending member 275b is fixed. The results are shown in Table 7 and FIG. In FIG. 60, the vertical axis represents the displacement ratio H (%). In the horizontal axis, symbol b is data when the shape memory alloy member 272 is wound around the pin 279c as shown in FIG. 59, and symbol a is data when the shape memory alloy member 272 is not wound around the pin 279c. is there. The symbol c is data when the rotation of the bending member 275b is fixed (the shape memory alloy member 272 is not wound around the pin 279c).

  From FIG. 60, it can be seen that substantially the same amount of displacement can be obtained both when the shape memory alloy member 272 is wound around the pin 279c (symbol b) and when it is not wound (symbol a). Also, it can be seen that in either case (references a and b), a larger displacement can be obtained than when the rotation of the bending member 275b is fixed (reference c). That is, the decrease in the amount of displacement caused by winding the shape memory alloy member 272 around the pin 279c (that is, fixing the shape memory alloy member 272 to the bending member 275) is negligible, and is therefore almost the same as in the nineteenth embodiment. It turns out that an effect is acquired.

  As described above, according to the present embodiment, even if the rotational position of the bending member 275a is limited (not arbitrary), the same effect as that of the nineteenth embodiment can be obtained. .

  The rotatable bending member 275a is not limited to a cylindrical shape, and may be a polygonal column shape such as a triangular column shape as described in the twelfth embodiment, and the same effect is obtained.

Embodiment 21. FIG.
FIG. 61 (a) shows a configuration example (driving device 281a and driving device 281a) when the driving devices 1, 11, 21, 31 (FIGS. FIG. A camera to which the drive device 281a is applied includes a cylindrical barrel 286a and a circuit board 289d provided on the side (rear side) opposite to the subject with respect to the barrel 286a. A lens 283e (FIG. 64A) is attached to the tip of the lens barrel 286a, and a lens 283b (FIG. 64A) held by the lens frame 283a is provided inside the lens barrel 286a. The lens frame 283a is supported by the guide shafts 283c and 283d (FIG. 64A) so as to be movable along the lens optical axis X. A part of the lens frame 283a protrudes outside through an axial groove formed in the lens barrel 286a. The circuit board 289d has a solid-state image sensor 289c (FIG. 64A) at a position where an image is formed by the lenses 283e and 283b.

  A plurality of pin-shaped bending members 285 are erected on the outer peripheral surface of the lens barrel 286a. These bending members 285 are arranged at intervals in the circumferential direction of the lens barrel 286a. The bending member 285 has a main portion protruding in the radial direction of the lens barrel 286a, and an orthogonal portion 285i protruding substantially parallel to the axial direction of the lens barrel 286a from the main portion.

  One end (fixed end) of the wire-shaped shape memory alloy member 282 is fixed to a fixing member 289b provided in the vicinity of the rear end of the lens barrel 286a, and the lens barrel 286a is substantially wound while being wound around the plurality of bending members 285. After one round, it extends in the axial direction of the lens barrel 286a. The other end (movable end) of the shape memory alloy member 282 is attached to the rear end of the lens frame 283a. One end of an elastic member 284 is fixed to the front end of the lens frame 283a, and the other end of the elastic member 284 is fixed to a fixing member 289a provided near the tip of the lens barrel 286a. An energization circuit 287 is connected to both ends of the shape memory alloy member 282.

  By applying current to the shape memory alloy member 282 by the energizing circuit 287 and heating it, the shape memory alloy member 282 contracts against the urging force of the elastic member 284, and the lens frame 283a moves backward (in the direction of arrow A). To do. By stopping energization of the shape memory alloy member 282, the shape memory alloy member 282 is cooled and extended to the original length, and the lens frame 283a moves forward (B direction in the figure) by the urging force of the elastic member 284. As a result, the lens 283b (FIG. 64A) moves in the direction of the optical axis X, and for example, a zoom operation or a focus operation is performed.

  With this configuration, the shape memory alloy member 282 having a long overall length (that is, a large displacement) can be disposed around the lens barrel 286a without increasing the length of the camera lens barrel 286a. It becomes. Further, since the shape memory alloy member 282 is wound around the pin-shaped bending member 285, the ratio of the length of the shape memory alloy member 282 that contacts the bending member 285 to the entire circumference of the lens barrel 286a (that is, the contact ratio) is reduced. can do. As a result, a decrease in the amount of displacement can be suppressed as compared with the case where the shape memory alloy member 282 is arranged linearly.

  FIG. 61B is a perspective view showing a configuration example (referred to as a driving device 281b) when the driving device 51 (FIG. 14) described in the sixth embodiment is applied to lens driving of a camera. In the driving device 281b, a large number of convex portions 285b similar to the convex portions 54a (FIG. 14) described in the sixth embodiment are formed in the circumferential direction on the outer periphery of the lens barrel 286a. For example, only one bending member 285a is formed behind the lens frame 283a. One end (fixed end) of the shape memory alloy member 282 is fixed to the fixed member 289b. The shape memory alloy member 282 is wound around the bending member 285a by about 90 degrees after contacting the convex portion 285b, and then wound around the bending member 285a. The movable end) is fixed to the lens frame 283a. In addition, each convex part 285b has a shape long in the axial direction of the lens barrel 286a here. Other configurations are the same as those of the driving device 281a shown in FIG.

  Even with this driving device 281b, the shape memory alloy member 282 having a long overall length (that is, the displacement amount of the movable end is large) can be arranged around the lens barrel 286a without increasing the length of the camera lens barrel 286a. it can. Further, since the shape memory alloy member 282 is wound around the bending member 285a and the convex portion 285b, the ratio (contact) of the length of the lens barrel 286a with which the shape memory alloy member 282 is in contact with the bending member 285a and the convex portion 285b Ratio) can be reduced. As a result, a decrease in the amount of displacement can be suppressed as compared with the case where the shape memory alloy member 282 is arranged linearly.

  FIG. 62A is a perspective view showing a configuration example (referred to as a driving device 281c) when the driving device 261a (FIG. 55) according to the eighteenth embodiment is applied to lens driving of a camera. The driving device 281c includes a cylindrical ring 285c that is rotatable in the circumferential direction on the outer peripheral surface of the lens barrel 286a. A large number of convex portions 285b described with reference to FIG. 61 (b) are formed on the outer peripheral surface of the cylindrical ring 285c at intervals in the circumferential direction. One end (fixed end) of the shape memory alloy member 282 is fixed to the fixed member 289b. The shape memory alloy member 282 is wound about 90 degrees around the bending member 285a after substantially making a round of the cylindrical ring 285c while contacting the convex portion 285b. (Movable end) is fixed to the lens frame 283a. The cylindrical ring 285c has a notch 285f so as not to interfere with the fixing member 289b when rotated. The other configuration is the same as that of the driving device 281b shown in FIG.

  According to this drive device 281c, the contact ratio is small and the cylindrical ring 285c can rotate, so that the displacement amount of the shape memory alloy member 282 can be increased as described in the eighteenth embodiment.

  FIG. 62B is a perspective view showing a configuration of a configuration example (referred to as a driving device 281d) when the driving device 271a (FIG. 58) of the nineteenth embodiment is applied to lens driving of a camera. In this driving device 281d, a pin-shaped bending member 285e is erected on the outer peripheral surface of the cylindrical ring 285d so as to be positioned substantially behind the bending member 285a erected on the outer peripheral surface of the lens barrel 286a. . The shape memory alloy member 282 is wound around the convex portion 285b and wound around the cylindrical ring 285c for about ¼ week, then wound around the bending member 285e, and further wound around the convex portion 285b so as to go around the cylindrical ring 285c. After that, it is bent about 90 degrees by the bending member 285a. Other configurations are the same as those of the driving device 281c shown in FIG.

  According to this driving device 281d, the relative positional relationship between the shape memory alloy member 282 and the cylindrical ring 285d is regulated by the pin-shaped bending member 285e provided on the cylindrical ring 285d, and therefore the shape memory alloy member 282 repeatedly expands and contracts. However, the rotational position of the cylindrical ring 285d does not shift. Therefore, the positional relationship between the fixed member 289b that fixes the fixed end of the shape memory alloy member 282 and the notch 285f of the cylindrical ring 285d can be kept constant.

  63A and 63B show a configuration example (referred to as a driving device 281e) when the driving devices 41 and 151 (FIGS. 12 and 26) according to the fifth and eleventh embodiments are applied to lens driving of a camera. It is the perspective view and front view which show. FIG. 63 (c) is a perspective view of the drive device 281e viewed from a direction different from that in FIG. 63 (a).

  As shown in FIGS. 63A and 63B, the driving device 281e includes a bending member 285g formed near the front end of the lens barrel 286a and a bending member 285f formed near the rear end of the lens barrel 286a. Have. The lens frame 283a is disposed between the bending members 285g and 285f in the axial direction of the lens barrel 286a. Further, on the outer peripheral surface of the lens barrel 286a, a bending member 285h is formed to protrude further forward of the bending member 285g. On the outer peripheral surfaces of the bending members 285g, 285f, and 285h, a large number of minute convex portions that are in contact with the shape memory alloy member 282 are formed. A fixing member 289b is provided on the outer peripheral surface of the lens barrel 286a so as to be displaced in the circumferential direction of the lens barrel 286a with respect to the lens frame 283a. A fixing member 289a is provided between the lens frame 283a and the bending member 285g. An elastic member 284 is provided between the fixing member 289a and the lens frame 283a.

  One end (fixed end) of the shape memory alloy member 282 is fixed to the fixed member 289b (FIG. 63 (c)). The shape memory alloy member 282 is guided forward substantially along the axial direction of the lens barrel 286a from the fixing member 289b, and is bent about 180 degrees by the bending member 285g in the vicinity of the front end of the lens barrel 286a. Guided almost along the rear. Further, the shape memory alloy member 282 is bent about 180 degrees by the bending member 285f in the vicinity of the rear end of the lens barrel 286a, and is guided forward substantially along the axial direction of the lens barrel 286a. The other end (movable end) of the shape memory alloy member 282 is fixed to the lens frame 283a. As shown in FIG. 63B, when the shape memory alloy member 282 is bent 180 degrees by the bending member 285g, the shape memory alloy member 282 does not contact the outer peripheral surface of the lens barrel 286a by contacting the bending member 285h. It is like that.

  According to this driving device 281e, the shape memory alloy member 282 having a long overall length (that is, the displacement amount of the movable end is large) is arranged around the lens barrel 286a without increasing the length of the lens barrel 286a of the camera. Can do. In addition, since the shape memory alloy member 282 is wound around the bending members 285h, 285g, and 285f having minute convex portions on the outer peripheral surface, it is possible to suppress a decrease in the amount of displacement.

  In the twelfth embodiment described above, when a polygonal column-shaped bending member is used, it has been described that a substantially triangular column (a cross section is approximately triangular) is preferable. However, when the bending member is not a polygonal column, the third embodiment is described. As shown, the configuration in which the shape memory alloy member is wound around the two bending members reduces the contact ratio while securing the contact length of one bending member with respect to the shape memory alloy member (this reduces the displacement amount). This is advantageous in that it can be suppressed. The driving device 281e described above is an example in which such a configuration is applied to lens driving of a camera.

  Next, in order to facilitate understanding of the effects of the drive device according to the present embodiment, a configuration example in the case where the drive device (FIG. 3) in which the shape memory alloy members are arranged linearly is used for driving the lens of the camera. explain.

  FIGS. 64A and 64B are a side sectional view showing a configuration example (referred to as a driving device 281f) when a driving device in which the shape memory alloy members 2 are linearly arranged is used for driving a camera lens. It is a perspective view. In this drive device 281f, one end (fixed end) of the shape memory alloy member 282 is fixed to a fixed member 289b provided near the rear end of the lens barrel 286a, and the other end (movable end) of the shape memory alloy member 282 is fixed. The lens frame 283a is fixed. A fixing member 289a is provided near the front end of the lens barrel 286a, and an elastic member 284 is provided between the fixing member 289a and the lens frame 283a. An energization circuit 287 is connected to both ends of the shape memory alloy member 282. However, in such a configuration, since the shape memory alloy member 282 is linearly arranged on the lens barrel 286a, the shape memory alloy member 282 having a short overall length is used in a camera having a short length in the optical axis direction of the lens barrel 286a. Can only be placed. In addition, when the length of the shape memory alloy member 282 having a short total length is arranged, the displacement amount of the shape memory alloy member 282 is about 3 to 5% with respect to the total length of the shape memory alloy member 282. There is a problem that a sufficient driving distance cannot be obtained.

  In contrast, in the driving device 281a according to the present embodiment (FIG. 61A) and the driving devices 281b to 281e according to other configuration examples (FIGS. 61B to 63C), the bending member 285 is provided. By using (or the bending members 285a to 285h), the long shape memory alloy member 282 can be wound along the outer peripheral surface of the lens barrel 286a. Therefore, even if it is a small camera, there exists an effect that the sufficient movement distance of the lens 283b can be ensured using the shape memory alloy member 282 with a long full length.

  In Embodiments 1 to 21 described above, the shape memory alloy member is heated and deformed by passing a direct current through the shape memory alloy member. However, the present invention is not limited to this. Alternatively, an alternating current may be passed. Further, the shape memory alloy may be heated by flowing a pulse current as described in JP-A-6-324740, or using a heater as described in JP-A-6-32296. The shape memory alloy member may be heated. Further, as described in JP-A-5-224136, the shape memory alloy member may be heated by applying other components. Further, for example, as described in JP 2000-318698 A, JP 5-118272 A, JP 2003-28337 A, JP 7-14376 A, and JP 8-179181 A. The shape memory alloy member may be heated by a change in environmental temperature.

  In addition, in the configuration in which the shape memory alloy member is bent by the bending member and the displacement amount is obtained by heating the shape memory alloy member, if the contact portion between the shape memory alloy member and the bending member is large, the displacement amount decrease is large. As described above, the decrease in displacement is small when the number of contact portions is small. This is presumably because, at the contact portion between the shape memory alloy member and the bending member, the heat of the shape memory alloy member is removed via the bending member, and the temperature rise of the shape memory alloy member is suppressed. Considering this point, heating the shape memory alloy member by energization is extremely effective in obtaining a large amount of displacement. Further, when the temperature rise of the bending member is slow (when the heat of the shape memory alloy member is hard to be taken away), a method of heating the shape memory alloy member using an environmental heater or an external heater is also effective. . In contrast, a configuration in which a member around which a shape memory alloy member is wound is heated and the shape memory alloy member is indirectly heated by heat transfer (for example, a configuration described in Japanese Patent Laid-Open No. 5-224136) has sufficient displacement. The amount is not available.

  In addition to reducing the contact portion between the shape memory alloy member and the bending member, the shape memory can also be obtained by using a material having low thermal conductivity for the bending member (or the contact portion that contacts the shape memory alloy member). A decrease in the amount of displacement of the alloy member can be suppressed.

  In Embodiments 1 to 21 described above, the tension coil spring is used as the elastic member for biasing the shape memory alloy member. However, the present invention is not limited to this, and the compression coil spring, the torsion coil spring, and the leaf spring are not limited thereto. Rubber, etc. can be used. The material of the elastic member is not limited to a conductive material such as metal. In addition, what is necessary is just to make it energize between both ends of a shape memory alloy member, when using materials other than electroconductivity as an elastic member and heating a shape memory alloy member by energization. Furthermore, if the shape memory alloy member can be urged without using an elastic member, various methods such as urging the moving body using gravity can be employed.

It is a top view which shows the drive device which concerns on Embodiment 1 of this invention. It is a perspective view which shows the drive device which concerns on Embodiment 1 of this invention. It is a perspective view which shows the drive device which concerns on the comparative example with respect to Embodiment 1 of this invention. It is a perspective view which shows the drive device which concerns on the other comparative example with respect to Embodiment 1 of this invention. It is a perspective view for demonstrating the experiment conducted about the drive device shown in FIG. FIG. 6A is a perspective view for explaining an experiment performed on the drive device shown in FIG. 4, and FIG. 6B is a plan view thereof. FIG. 7A is a perspective view for explaining an experiment performed on the drive device shown in FIG. 4 by changing the winding method of the shape memory alloy member, and FIG. 7B is a plan view thereof. . FIG. 8A is a perspective view for explaining an experiment performed by changing the winding method of the shape memory alloy member in the driving device shown in FIG. 4, and FIG. 8B is a plan view thereof. . It is a top view which shows the drive device which concerns on Embodiment 2 of this invention. It is a perspective view which shows the drive device which concerns on Embodiment 3 of this invention. It is a perspective view which shows the drive device which concerns on Embodiment 4 of this invention. It is a top view which shows the drive device which concerns on Embodiment 5 of this invention. It is a perspective view which shows another structural example of the drive device which concerns on Embodiment 5 of this invention. It is a perspective view which shows the drive device which concerns on Embodiment 6 of this invention. FIG. 15 (a) is a perspective view for explaining an experiment on the driving apparatus according to Embodiment 6 of the present invention, and FIG. 15 (b) is a plan view thereof. FIG. 16 (a) is a perspective view for explaining an experiment performed by changing the winding angle of the shape memory alloy member in the driving apparatus according to Embodiment 6 of the present invention, and FIG. FIG. FIG. 17 (a) is a perspective view for explaining an experiment performed by further changing the winding angle of the shape memory alloy member in the driving apparatus according to Embodiment 6 of the present invention, and FIG. Is a plan view thereof. FIG. 18A is a perspective view for explaining the shape of the bending member according to the sixth embodiment of the present invention. FIGS. 18B, 18C, and 18D are specific views of the bending member. It is a top view which shows a shape. It is a graph which shows the relationship between a contact ratio and a displacement ratio, and corresponds to Table 1. 3 is a graph showing a relationship between a contact ratio and a displacement ratio, and corresponds to Table 2. FIG. 21A is a plan view showing the shape of the bending member in the sixth embodiment of the present invention, and FIGS. 21B and 21C are plan views showing other configuration examples of the bending member. . It is a top view which shows the drive device which concerns on Embodiment 7 of this invention. It is a perspective view which shows the drive device which concerns on Embodiment 8 of this invention. FIG. 24 (a) is a front view showing a driving apparatus according to Embodiment 9 of the present invention, and FIG. 24 (b) is a side view thereof. FIG. 25 (a) is a perspective view showing a driving apparatus according to Embodiment 10 of the present invention, and FIG. 25 (b) is a perspective view seen from a different direction. It is a perspective view which shows the drive device based on Embodiment 11 of this invention. It is a top view for demonstrating the experiment conducted about the drive device which concerns on Embodiment 11 of this invention. 28 (a), (b), (c) and (d) are plan views showing winding members used in the experiment shown in FIG. It is a graph which shows the experimental result done about the drive device which concerns on Embodiment 11 of this invention. It is a perspective view which shows the drive device based on Embodiment 12 of this invention. It is a perspective view for demonstrating the experiment conducted about the drive device which concerns on Embodiment 12 of this invention. 32 (a), (b), (c) and (d) are plan views for explaining experiments conducted using bending members having different cross-sectional shapes, respectively. 33 (a), (b), (c) and (d) are plan views showing four types of bending members each having a substantially triangular prism shape. FIGS. 34 (a), (b), (c) and (d) are plan views showing four types of bending members each having a substantially quadrangular prism shape. FIGS. 35 (a), (b), (c) and (d) are plan views showing four types of bending members each having a substantially hexagonal column shape. 36 (a), (b), (c) and (d) are plan views showing four types of substantially cylindrical bending members, respectively. 5 is a graph showing a relationship between a contact ratio and a displacement ratio, and corresponds to Table 4. FIGS. 38 (a) and 38 (b) are diagrams for explaining the steps of the method for fixing the shape memory alloy member and the crimp terminal according to Embodiment 13 of the present invention, and FIGS. 38 (c) and 38 (d). () Is a figure for demonstrating the example of another process. It is a figure for demonstrating the process following the process shown in FIG.38 (b) or (d). It is a perspective view which shows the drive device based on Embodiment 14 of this invention. FIG. 41A is a perspective view showing a drive device as a comparative example with respect to the fourteenth embodiment, and FIG. 41B is a perspective view showing a configuration example of a drive device as another comparative example. It is a perspective view which shows the drive device based on Embodiment 15 of this invention. It is a perspective view which shows the other structural example of the drive device which concerns on Embodiment 15 of this invention. It is a perspective view which shows the drive device based on Embodiment 16 of this invention. It is a perspective view for demonstrating the experiment conducted about the drive device which concerns on Embodiment 16 of this invention. 46 is a graph showing the results of the experiment shown in FIG. 45 and corresponds to Table 5. FIG. It is a perspective view which shows the other structural example of the drive device which concerns on Embodiment 16 of this invention. It is a perspective view which shows the drive device based on Embodiment 16 of this invention. It is a block diagram of the electricity supply circuit of the drive device concerning Embodiment 16 of this invention. It is a comparative example with respect to Embodiment 16 of this invention, Comprising: It is a block diagram of the electricity supply circuit in the case of supplying an electric current uniformly to a shape memory alloy member. FIG. 50 is a circuit diagram of the energization circuit shown in FIG. 49. It is a perspective view which shows the drive device based on Embodiment 17 of this invention. It is a perspective view which shows the other structural example of the drive device which concerns on Embodiment 17 of this invention. It is a perspective view which shows the drive device based on Embodiment 18 of this invention. It is a perspective view which shows the drive device based on Embodiment 19 of this invention. 56 (a), 56 (b), and 56 (c) are perspective views respectively showing the configurations of three types of experimental devices that conduct experiments related to the drive device according to Embodiment 19 of the present invention. FIG. 57 is a graph showing an experimental result by the experimental apparatus shown in FIG. 56 and corresponds to Table 6. FIG. It is a perspective view which shows the drive device based on Embodiment 20 of this invention. It is a perspective view which shows the experimental apparatus which performs the experiment about the drive device based on Embodiment 20 of this invention. FIG. 60 is a graph showing a result of an experiment by the experimental apparatus shown in FIG. 59 and corresponds to Table 7. FIG. FIG. 61 (a) is a perspective view showing a drive apparatus according to Embodiment 21 of the present invention, and FIG. 61 (b) shows another configuration example of the drive apparatus according to Embodiment 21 of the present invention. It is a perspective view. FIG. 62 (a) is a perspective view showing another configuration example of the driving apparatus according to Embodiment 21 of the present invention, and FIG. 62 (b) further shows the driving apparatus according to Embodiment 21 of the present invention. It is a perspective view which shows the other structural example. FIG. 63 (a) is a perspective view showing still another configuration example of the drive device according to Embodiment 21 of the present invention, FIG. 63 (b) is a front view thereof, and FIG. 63 (c) is from another direction. FIG. 64 (a) and 64 (b) are cross-sectional views and perspective views showing a configuration example when a conventional driving device is applied to lens driving of a camera, as a comparative example with respect to Embodiment 21 of the present invention. .

Explanation of symbols

202 shape memory alloy member, 202a position near the crimp terminal on the shape memory alloy member, 202b portion fixed to the crimp terminal of the shape memory alloy member, 208 crimp terminal, 208a caulking part, 208b base part, 208c annular part, 207 energization circuit.

Claims (5)

A bendable wire made of shape memory alloy;
Urging means for generating tension in the longitudinal direction of the wire,
A plurality of abutting portions that abut against the wire, and bending means for bending the wire;
Energization means for passing current through the wire through the contact portion;
With
The plurality of contact portions are in contact with the wire, and are configured to displace the wire in the longitudinal direction by the urging means,
The drive device according to claim 1, wherein the abutting portion for supplying a current is determined so that there is a section in which the amount of current flowing through the wire is different in each of the wires defined by the abutting portions adjacent to each other. The driving device according to claim 1, wherein the amount of the current is determined based on a frictional force between the wire and the contact portion. The driving device according to claim 1, wherein one end of the bending means is electrically connected to the electronic circuit board. A lens,
A lens frame for holding the lens;
A lens barrel that houses the lens frame;
The drive device according to any one of claims 1 to 3,
With
A lens driving device characterized in that the lens frame and one end of the wire rod are locked. A camera comprising the lens driving device according to claim 4.

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