JP2005333000A - Transfer device of chip component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer device of chip components in which chip components pasted to near the boundary of a transfer case and an alignment pallet are excluded, and also in which it is possible to prevent the chip components from being pasted, to enhance a transfer efficiency and to prevent the chip components from being engaged. <P>SOLUTION: An air nozzle 30 for spraying an air in the vicinity of boundary part between an inside of a frame 23 of a transfer case 20 and an alignment pallet 40 is provided, whereby a chip component C is not made close to the boundary part during the transfer, and pasting of the chip component C is prevented. For this reason, the chip components C not used for the transfer are reduced and a charging rate of the chip components is enhanced. Also, the chip components are prevented from being pasted in the vicinity of the boundary part, thereby solving a malfunction of spill-out of the chip components C when a transfer case 20 is opened, or the engagement of the chip components C with the alignment pallet 40 when the transfer case 20 is closed next. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a transfer device used for filling chip parts such as chip capacitors and chip resistors into each alignment hole of an alignment pallet one by one.
More specifically, the present invention relates to a transfer device used when a chip component is inserted into a holding hole of a holding plate or attached to an adhesive surface of the holding plate.

2. Description of the Related Art Conventionally, a holding plate that elastically holds a chip component when an electrode is simultaneously applied to end portions of a large number of chip components has been used. This holding plate forms a large number of through holes in a thin flat plate portion formed at the center of a hard substrate, and embeds a rubber-like elastic body in a recess formed by the flat plate portion, and also has a through hole in the elastic body. A holding hole penetrating the part is formed. In order to hold chip components one by one in the holding holes of such a holding plate, a plate called an alignment pallet or guide plate having a large number of alignment holes is placed on the holding plate, and chip components are placed in these alignment holes. The method of pushing the chip parts one by one and then pushing the chip parts into the holding holes with a press pin is employed. The holding plate holding the chip component applies the electrode to one end of the chip component by pressing the chip component downward and pressing it onto an application plate on which the electrode paste is applied to a certain thickness.

As a device for transferring chip parts to an alignment pallet as described above, Patent Document 1 discloses a stage on which a holding plate and an alignment pallet are stacked and placed, and a transfer case supported rotatably on the stage. A transfer device provided is known. The transfer case has a chip box and an opening, and with the opening closed by the alignment pallet, the chip parts thrown into the chip box are evenly distributed on the alignment pallet by applying a swing or vibration to the stage. In addition, by sucking from below the alignment holes, the chip parts are transferred into the alignment holes. Thereafter, the unfilled chip components are collected in the chip box by raising the stage substantially vertically.
JP-A-5-226201

Although the said transfer apparatus is applied to the holding plate with a holding hole, like patent document 2, hold | maintain a chip component on the surface of the holding plate which consists of a hard board which affixed adhesive rubber on the surface. It can also be applied to cases.
JP-A-4-291712

By the way, with the miniaturization of electronic devices, chip components are required to be further miniaturized. For example, ultra-small chip components having an outer dimension of 0.35 × 0.18 × 0.18 mm have been developed. In the case of such a small chip component, since the weight is light, a phenomenon occurs in which it adheres to the inner surface of the transfer case or the alignment pallet due to slight dirt or static electricity. In particular, chip parts stuck near the boundary between the transfer case and the alignment pallet will not be transferred to the alignment hole of the alignment pallet, which will not only reduce the transfer efficiency, but will also stick when the transfer case is opened from the alignment pallet. This causes a problem that the chip parts are spilled off or are caught between the transfer case and the alignment pallet.

Accordingly, an object of the present invention is to eliminate the chip component stuck near the boundary between the transfer case and the alignment pallet, prevent sticking of the chip component, and improve transfer efficiency and prevent chip component biting. It is to provide a transfer device for chip parts.

In order to achieve the above object, the present invention provides a chip box that can accommodate a large number of chip parts on one end side in a device for transferring chip parts into each of the alignment holes of an alignment pallet having a large number of alignment holes, and a chip box. A transfer case having an opening that is closed by the alignment pallet on the lower surface except the chip box, a frame that surrounds the periphery of the opening except the chip box side, a stage on which the alignment pallet can be placed, and the stage Oscillates and introduces the chip parts scattered on the alignment pallet into each alignment hole, and blows air near the boundary between the inside of the frame and the alignment pallet to attach the chip parts. Provided is a chip component transfer device comprising an air blowing means for preventing.

First, a large number of chip parts are put into the chip box of the transfer case. Next, the alignment pallet is set on the stage, the transfer case is placed on the alignment pallet, and the opening is closed with the alignment pallet. Next, when the stage is swung, a large number of chip parts accommodated in the chip box spread all over the alignment pallet as the rocking, and are filled in the alignment holes.
When the filling is completed, the swinging is stopped, and excess chip parts accumulated on the alignment pallet are collected in the chip box. At this time, it is desirable to tilt the alignment pallet by a predetermined angle so that even the chip parts filled in the alignment holes do not fall. Although the tilt angle is arbitrary, for example, the alignment pallet may be tilted to an angle that is nearly vertical. Next, by opening the transfer case and removing the alignment pallet from the opening, the alignment pallet in which each alignment hole is filled with one chip part is taken out.

When the chip component is a small component, when the chip component is filled in each alignment hole of the alignment pallet as described above, the chip component is likely to stick to the vicinity of the boundary between the frame portion inner surface of the transfer case and the alignment pallet. The stuck chip component is not transferred into the alignment hole, which causes a decrease in transfer efficiency. Therefore, during the transfer operation, air is blown by the air blowing means near the boundary between the inside of the transfer case frame and the alignment pallet, so that the chip component does not come close to the boundary and prevents the chip component from sticking. To do. As a result, the filling rate of chip parts is improved, and sticking of chip parts to the vicinity of the boundary is prevented, so that chip parts spill when the transfer case is opened, and then the transfer case is closed It is possible to eliminate the problem that the chip parts are caught between the alignment pallets.

As in claim 2, the frame portion of the transfer case is configured to contact the upper surface of the outer peripheral portion excluding the chip box side of the alignment pallet, the bottom surface of the chip box is configured at one end side of the transfer case, It is preferable to provide a bottom plate portion that can come into contact with the side surface of one side and whose upper surface is flush with the upper surface of the alignment pallet.
As described above, the lower surface of the frame portion is in contact with the upper surface of the alignment pallet, so that the gap can be eliminated and the chip component can be prevented from being caught. In addition, the side surface of the bottom plate of the transfer case abuts the side surface of the alignment pallet and the top surface is flush with the top surface of the alignment pallet. Therefore, when chip parts are spread from the chip box onto the alignment pallet, When collecting the remaining chip parts in the chip box, there is no step between the transfer case and the alignment pallet, and the chip parts can move smoothly.

According to a third aspect of the present invention, air holes may be formed on the lower surface of the frame portion, and air discharge means connected to the air holes via an air passage may be provided.
In this case, by blowing air from the contact surface between the frame portion and the alignment pallet, it is possible to prevent sticking of the chip component during the transfer that causes the chip component to be caught. Moreover, by blowing out air when the transfer case is opened, the chip component can be prevented from being drawn to the lower side of the frame portion, and the chip component can be prevented from being caught.

As in claim 4, an air hole is formed in the lower surface of the frame portion, an air suction means connected to the air hole via an air passage is provided, and a means for detecting the air pressure at the time of suction of the air passage is provided. Is good.
When a chip part is caught between the frame part of the transfer case and the alignment pallet, a gap is generated. Occur. Therefore, in claim 4, when a gap is generated between the frame part of the transfer case and the alignment pallet, this is detected as air suction leakage, thereby detecting a biting failure. In this case, even when a small-sized chip part is caught, it can be detected reliably, so it can be detected more easily than when it is visually detected, preventing the chip part from spilling from the gap during transfer. it can.

As in claim 5, the transfer case is attached to the stage so as to be movable up and down so as to operate in a direction perpendicular to the upper surface of the alignment pallet, and the lifting means for pressing the frame portion against the upper surface of the outer periphery of the alignment pallet; It is good to provide the holding means pressed against the side surface of the bottom plate part of the transfer case.
In the case of the transfer device of Patent Document 1, the transfer case is rotatably attached to the stage, and the transfer case is rotated so that the opening is closed by the alignment pallet placed on the stage. There were variations in thickness, and a gap was sometimes generated between the frame of the transfer case and the alignment pallet. In addition, it is difficult to bring the transfer case and the alignment pallet into close contact with each other on the side surface on the chip box side, and a gap may also occur in this portion. For this reason, there is a possibility that the chip part is caught in these gaps during the transfer.
Therefore, in claim 5, the transfer case is attached to the stage so as to be movable up and down so as to operate in a direction perpendicular to the surface of the alignment pallet, and the lower surface of the frame is in close contact with the upper surface of the alignment pallet. That is, the alignment pallet is held between the transfer case and the stage. Therefore, even if the alignment pallet has a variation in thickness, no gap is generated between the frame portion of the transfer case and the alignment pallet. Moreover, since the side surface of the alignment pallet is pressed against the bottom plate portion on the chip box side, the transfer case and the alignment pallet can be brought into close contact with the side surface on the chip box side. Therefore, it is possible to prevent the chip parts from being caught in the gap during the transfer and the operation of collecting the chip parts into the chip box, and stable continuous automatic transfer becomes possible.

The upper surface of the alignment pallet is preferably a rough surface.
When the chip component is a micro component, the chip component may stick to the upper surface of the alignment pallet due to static electricity or dirt, and sticking may not be resolved even if it is swung. On the other hand, if the upper surface of the alignment pallet is a rough surface, the contact area between the alignment pallet and the chip component is reduced, and sticking due to static electricity or dirt is suppressed.

As described above, according to the present invention, air blowing means for preventing sticking of chip parts by blowing air near the boundary between the frame case inside and the alignment pallet of the transfer case is provided. It is possible to prevent the chip component from sticking to the vicinity of the boundary portion and to prevent the chip component from sticking. For this reason, chip parts that are not used for transfer are reduced, the filling rate of the chip parts is improved, and sticking of the chip parts to the vicinity of the boundary is prevented, so that chip parts spill out when the transfer case is opened. Or the next time the transfer case is closed, it is possible to eliminate the problem that the chip part bites into the alignment pallet.

Embodiments of the present invention will be described below with reference to examples.

1 to 9 show an example of a transfer apparatus according to the present invention.
This transfer device includes a stage 1 on which the alignment pallet 40 can be placed, and a transfer case 20 for transferring the chip component C into the alignment hole 41 of the alignment pallet 40. One end of the lower surface of the stage 1 is swingably supported by a leg 3 standing on the base 2 via a support shaft 4, and the other end of the lower surface of the stage 1 is rocked via a link 5. Connected to the moving cylinder 6. By reciprocating the swing cylinder 6, the stage 1 can be swung up and down by a predetermined angle.

An elevating cylinder 7 for elevating the transfer case 20 is mounted on the lower surface of the stage 1. The elevating cylinder 7 is composed of, for example, an air cylinder. The piston rod 8 of the elevating cylinder 7 passes through the stage 1 and is connected to a guide block 9 fixed to the outer surface of the transfer case 20. Two guide shafts 10 extending downward are projected from the guide block 9, and these guide shafts 10 slidably penetrate the stage 1. Therefore, the transfer case 20 can be moved up and down with respect to the stage 1 by driving the lifting cylinder 7. A pair of holding cylinders 11 such as air cylinders are provided at one end of the upper surface of the stage 1. A rotatable locking tool 13 is provided at the tip of the piston rod 12 of the holding cylinder 11, and the holding cylinder 11 is operated with the locking tool 13 locked to the rear end surface of the alignment pallet 40. Thus, the alignment pallet 40 placed on the stage 1 can be operated horizontally in the direction of the chip box of the transfer case 20.
Note that guide portions for guiding both side portions of the alignment pallet 40 may be appropriately provided on the upper surface of the stage 1.

A concave air chamber 14 that is larger than the arrangement region of the alignment holes 41 of the alignment pallet 40 placed on the upper surface of the stage 1 and smaller than the outer shape of the alignment pallet 40 is formed at the center of the upper surface of the stage 1. Yes. When the alignment pallet 40 is placed at the normal position of the stage 1, the alignment hole 41 corresponds to the air chamber 14. The air chamber 14 is connected to a vacuum source 16 such as a vacuum pump via an air pipe 15, and a negative suction pressure can be applied to each alignment hole 41. An on-off valve 17 is provided in the middle of the air pipe 15.
In this embodiment, when the alignment pallet 40 is placed at a normal position of the stage 1, one end portion (chip box side end portion) of the alignment pallet 40 is designed to protrude from the stage 1.

5 and 6, the transfer case 20 has a chip box 21 that can accommodate a large number of chip parts on one end side, and has an opening 22 that is closed by an alignment pallet on the lower surface except for the chip box 21. doing. A frame portion 23 is provided to surround three sides of the opening 22 except for the chip box 21 side, and a bottom plate portion 24 constituting the bottom surface of the chip box 21 is provided on the other side. The upper surface of the bottom plate portion 24 is formed at the same height as the lower surface of the frame portion 23, and the lower surface of the bottom plate portion 24 is formed lower than the lower surface of the frame portion 23 by the thickness of the bottom plate portion 24.
In this example, the upper surface of the frame portion 23 is open, but a top plate portion that closes the upper surface of the frame portion 23 may be provided.

An oblong air hole 25 extending along the frame part 23 is formed on the lower surface of the frame part 23 of the transfer case 20, and the air hole 25 is connected to an air pipe 26 connected to the upper surface of the frame part 23. It is connected. As shown in FIG. 7, the air pipe 26 is connected to the vacuum source 16 and the pressure air source 28 via the switching valve 27, and the air hole 25 is selected as the vacuum source 16 or the pressure air source 28 by switching the switching valve 27. Can be connected together. A pressure sensor 29 is provided in the middle of the air pipe 26 that connects the switching valve 27 and the air hole 25. When the air hole 25 and the vacuum source 16 are connected, the pressure of the air pipe 26 is detected. It is possible to detect the biting of the chip component C described later.

As shown in FIGS. 7 and 8, air nozzles 30 for blowing air to the boundary between the inner side of the frame 23 and the alignment pallet 40 are attached to the inner surface of each frame 23 of the transfer case 20. Yes. The air nozzle 30 of this embodiment is composed of a wide-mouth nozzle extending in the length direction along the inner surface of the frame portion 23, and can prevent the chip component C from sticking over the entire length of the frame portion 23. Of course, a plurality of nozzles may be used in place of the wide-mouthed air nozzle 30. The air nozzle 30 is connected to the pressurized air source 28 via an air pipe 31, and an open / close valve 32 is provided in the middle of the air pipe 31.

The blowing direction of the air nozzle 30 may be the direction of the contact portion between the frame portion 23 and the alignment pallet 40, but the air nozzle 30 is such that air flows downward along the inner surface of the frame portion 23 as shown in FIG. You may set the direction. In this case, since the air that has flowed downward along the inner surface of the frame portion 23 flows toward the center of the upper surface of the alignment pallet 40, the chip component C adhering to the inner surface of the frame portion 23 is efficiently removed. In addition, the chip component C can be brought to the center of the alignment pallet 40 in which the alignment holes 41 are formed, and the filling rate can be improved.
1 and 2, the air nozzle 30 is omitted, and in FIG. 8, the air pipe 26 is omitted.

FIG. 9 shows an example of an alignment pallet 40 used in the present invention. The alignment pallet 40 is formed by regularly forming a large number of bottomed alignment holes 41 on a hard plate. The alignment hole 41 has a size that allows the chip component C to be inserted vertically. A mortar-shaped taper 42 is formed at the upper end of the alignment hole 41, and the cross-sectional area of the chip component C is formed at the bottom of the alignment hole 41. A small ventilation hole 43 is formed. The depth D of the alignment hole 41 is shallower than the length H of the chip part C. Therefore, when the chip part C is transferred into the alignment hole 41, a part of the chip part C protrudes from the alignment hole 41.
The upper surface of the alignment pallet 40 is preferably a rough surface such as a satin finish in order to prevent minute chip parts from sticking due to static electricity or dirt.
When the alignment pallet 40 is placed at a regular position on the stage 1, the vent hole 43 communicates with the air chamber 14 of the stage 1.

In this embodiment, the end surface of the chip component C protruding from the upper surface of the alignment pallet 40 is held by pressing the holding plate shown in Patent Document 2 upside down on the upper surface of the alignment pallet 40 into which the chip component C is transferred. After sticking to the adhesive surface of the plate, the chip component C is transferred onto the surface of the holding plate by separating the holding plate from the alignment pallet 40.
Thereafter, the chip component C held on the surface of the holding plate is coated with an electrode by pressing one end face thereof against an electrode paste or the like. Since the electrode forming method is as described in Patent Document 2, description thereof is omitted here.

Here, the operation of the transfer device having the above configuration will be described.
First, the elevating cylinder 7 is raised and the transfer case 20 is separated from the stage 1. In this state, the unfilled alignment pallet 40 is inserted onto the stage 1 from the side opposite to the chip box 21 side of the transfer case 20. At this time, it is preferable to open the locking tool 13 of the holding cylinder 11 outward so as not to obstruct the insertion of the alignment pallet 40.

After inserting the alignment pallet 40 onto the stage 1, the elevating cylinder 7 is lowered, and the transfer case 20 is lowered to a position that is substantially in contact with the upper surface of the alignment pallet 40. Then, the locking tool 13 is locked to the rear end surface of the alignment pallet 40 and the holding cylinder 11 is operated to press the front end surface of the alignment pallet 40 to a position where it abuts against the side surface of the bottom plate portion 24 of the transfer case 20. At the same time, the elevating cylinder 7 is further lowered, and the lower surface of the frame portion 23 of the transfer case 20 is pressed against the upper surface of the alignment pallet 40. As a result, the opening 22 of the transfer case 20 is closed by the alignment pallet 40, and the stage 1 and the alignment pallet 40 are in close contact with each other, so that there is almost no air leakage.

After the transfer case 20 is pressed against the upper surface of the alignment pallet 40, the air hole 25 is connected to the vacuum source 16 by the switching valve 27, and whether or not the chip part C is caught between the frame portion 23 and the alignment pallet 40. Is detected by the pressure sensor 29. When the chip part C is caught, a gap is generated between the lower surface of the frame portion 23 and the upper surface of the alignment pallet 40, and the negative pressure of the air pipe 26 does not increase. Easy to detect. In that case, the transfer case 20 is raised and the bitten chip part C is removed.

After the preparatory work as described above is completed, the stage 1 is swung up and down by reciprocating the rocking cylinder 6, and the chip components C accommodated in the chip box 21 are evenly distributed on the alignment pallet 40. At the same time, the on-off valve 17 is opened to connect the air chamber 14 to the vacuum source 16, and the chip component C is sucked into the alignment hole 41 of the alignment pallet 40. Thereby, the chip component C is efficiently transferred into the alignment hole 41.

Simultaneously with the transfer operation as described above, the on-off valve 32 is opened to connect the air nozzle 30 to the compressed air source 28, and air is injected near the boundary between the inner surface of the frame portion 23 and the upper surface of the alignment pallet 40, The sticking of the part C is prevented. This prevents the chip component C from approaching the boundary between the inner surface of the frame portion 23 and the upper surface of the alignment pallet 40, reduces the number of useless chip components C that do not contribute to the transfer, and increases the transfer efficiency. improves.

Further, during the transfer operation, the switching valve 27 is switched to connect the air hole 25 to the compressed air source 28, and air is discharged from the contact surface between the frame portion 23 of the transfer case 20 and the alignment pallet 40, so that the chip being transferred is transferred. The sticking of the part C may be prevented.

After performing the transfer operation for a predetermined time, the swing cylinder 6 is raised to the maximum, and the transfer case 20, the alignment pallet 40, and the stage 1 are integrally tilted so that the chip box 21 side is on the lower side. The excess chip component C remaining in the chip is collected into the chip box 21. The inclination angle needs to be an angle that allows the excessive chip component C on the alignment pallet 40 to easily roll down to the chip box 21. When the alignment pallet 40 is tilted, the upper surface of the alignment pallet 40 is roughened like a satin finish, so that the chip component C is prevented from sticking. During this time, it is preferable that air is continuously sucked from the alignment holes 41 and air is continuously ejected from the air nozzle 30.

Thereafter, the swing cylinder 6 is operated to return the stage 1 to the horizontal position. And the raising / lowering cylinder 7 and the holding | maintenance cylinder 11 are operated, and the pressing force to the alignment pallet 40 by the transfer case 20 is released. When the transfer case 20 is raised, the air hole 25 opened on the lower surface of the frame portion 23 of the transfer case 20 is connected to the compressed air source 28 by the switching valve 27, and the air is discharged from the air hole 25. It is possible to prevent the chip component C from being pulled under the frame portion 23 as the temperature rises.
After the transfer case 20 is raised, the transfer operation is completed by pulling out the filled alignment pallet 40 remaining on the stage 1.

The present invention is not limited to the above embodiments, and can be modified without departing from the spirit of the present invention.
For example, although the example in which the bottom plate portion 24 of the transfer case 20 is not in contact with the upper surface of the stage 1 has been described in the above embodiment, the bottom plate portion 24 may be in contact with the upper surface of the stage 1. In this case, the bottom plate portion 24 needs to be equal to or less than the thickness of the alignment pallet 40.
In the above embodiment, the alignment hole 41 of the alignment pallet 40 is an example of a bottomed hole, but it may be a hole penetrating vertically. In this case, a holding plate may be disposed on the lower side of the alignment pallet 40 and the bottom surface of the chip component C transferred to the alignment hole 41 may be supported by the holding plate.
In the above embodiment, the concave air chamber 14 is formed on the upper surface of the stage 1, and the suction negative pressure is applied to the alignment holes 41 of the alignment pallet 40 through this air chamber. A recess may be formed in a region including all the alignment holes 41 on the bottom surface of the alignment pallet 40, and a negative suction pressure may be applied via the recess.
The holding plate is not limited to that shown in Patent Document 2, and a holding plate having a conventionally known holding hole can also be used.
Instead of the elevating cylinder 7 and the holding cylinder 11, a known linear motion mechanism such as a motor and a ball screw mechanism can be used.
In order to transfer the chip parts in the transfer case 20 into the alignment holes 41 of the alignment pallet 40, the stage 1, the transfer case 20 and the alignment pallet 40 are swung together and a negative suction pressure is applied from below. In addition, the efficiency of filling the chip parts C into the alignment holes 41 may be increased by giving fine vibrations to the alignment pallet 40. In this case, for example, a vibration device (vibrator) may be attached to the stage 1.

It is a perspective view at the time of insertion of the alignment pallet of an example of the transfer apparatus concerning this invention. It is a perspective view after the alignment pallet insertion of an example of the transfer apparatus concerning this invention. It is a side view at the time of insertion of the alignment pallet of the transfer apparatus shown in FIG. It is a side view after alignment pallet insertion of the transfer apparatus shown in FIG. It is sectional drawing of a transfer case. It is a bottom view of a transfer case. It is an air piping figure of the transfer apparatus concerning this invention. It is a perspective view of the transfer apparatus provided with the air nozzle. It is sectional drawing of an example of the alignment pallet concerning this invention.

Explanation of symbols

1 Stage 6 Oscillating cylinder 7 Elevating cylinder (elevating means)
11 Holding cylinder (holding means)
14 Air chamber 16 Vacuum source 20 Transfer case 21 Chip box 22 Opening portion 23 Frame portion 24 Bottom plate portion 25 Air hole 28 Air pressure source 29 Pressure sensor 30 Air nozzle (air blowing means)
40 Alignment palette 41 Alignment hole C Chip parts

Claims (6)

In an apparatus for transferring a chip component into each alignment hole of an alignment pallet having a large number of alignment holes,
A transfer case having a chip box capable of accommodating a large number of chip components on one end side, an opening closed by the alignment pallet on a lower surface portion excluding the chip box, and a frame portion surrounding the periphery of the opening portion excluding the chip box side; ,
A stage capable of placing the alignment pallet on the upper surface;
Rocking means for rocking the stage and introducing the chip components scattered on the alignment pallet into the alignment holes;
A chip component transfer apparatus, comprising: air blowing means that blows air near a boundary portion between the inside of the frame portion and the alignment pallet to prevent sticking of the chip component. The frame portion of the transfer case is configured to contact the upper surface of the outer peripheral portion excluding the chip box side of the alignment pallet,
One end side of the transfer case is provided with a bottom plate portion that constitutes the bottom surface of the chip box, the side surface of which can be in contact with the side surface of one side of the alignment pallet, and the upper surface is flush with the upper surface of the alignment pallet. The chip part transfer device according to claim 1, wherein An air hole is formed on the lower surface of the frame part,
3. The chip part transfer device according to claim 2, wherein air discharge means connected to the air hole via an air passage is provided. An air hole is formed on the lower surface of the frame part,
Air suction means connected to the air hole via an air passage is provided,
3. The chip part transfer device according to claim 2, further comprising means for detecting an air pressure during suction of the air passage. The transfer case is movably attached to the stage so as to operate in a direction perpendicular to the upper surface of the alignment pallet, and elevating means for pressing the frame portion against the upper surface of the outer periphery of the alignment pallet;
3. The chip component transfer apparatus according to claim 2, further comprising holding means for pressing a side surface of the alignment pallet against a side surface of a bottom plate portion of the transfer case. 6. The chip part transfer device according to claim 1, wherein the top surface of the alignment pallet is formed as a rough surface.

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