JPH0432426A - Substrate charging device - Google Patents

Abstract

PURPOSE:To transfer substrates one by one by pressing the substrate by a front suction pad of suction pads which actuate separately at the front and the back, jetting air from side surfaces to separate the substrate from the others, pressing the substrate by the back suction pad and a center pressor cylinder, and transferring it with both ends sucked by both suction pads. CONSTITUTION:A substrate transfer part 2 is composed of two suction means 7, 8 provided at the front and back to the transfer direction, and a substrate pressor cylinder 9 positioned between them. A table lifter having substrates 10 mounted on it is moved up to put the upper surface of the substrate 10 at a constant position, where it is stopped. The back sucking means 7 is moved down to press the upper surface back part of the substrate 10. Compressed air is then blown from both side surfaces of the substrate 10 by a nozzle for facilitating separation of the substrate 10 from the others. The front sucking means 8 and the pressor cylinder 9 are then moved down to get in contact with the substrate 10 and be stopped, the substrate 10 is sucked by both sucking means 7, 8 and moved up simultaneously, and the cylinder 9 is also moved up after a predetermined time. Only one substrate 10 is thus curved to be separated securely.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a board loading device for transferring and loading loaded boards in a printed wiring board manufacturing process.

[Conventional technology]

In the printed wiring board manufacturing process, when boards are loaded into a container-type manufacturing device for polishing, etching, etc., the boards are picked up one by one using multiple suction pads and then transferred. The method of putting it in is generally used.

[Problem to be solved by the invention]

The above-mentioned method has a problem in that as the thickness of the substrate becomes thinner, adsorption of two substrates becomes more likely to occur. The present invention has a mechanism that prevents two substrates from being sucked together, and a mechanism that detects even if two substrates are sucked before inputting them into the manufacturing equipment and prevents the two substrates from being loaded into the manufacturing equipment. It provides a substrate loading device.

[Means to solve the problem]

As shown in FIG. 1, the substrate loading device of the present invention includes a loaded substrate elevating section 1 that holds loaded substrates at a predetermined height, and a substrate suction transfer section 2 that grips and holds the loaded substrates and transfers them. ,as well as,
It consists of a substrate transport conveyor 3 that sends the transferred substrates to the manufacturing equipment, and a weight measuring section 4 that supports the substrate transport conveyor 3 and measures its weight.

The loaded substrate elevating unit 1 is a table lifter, and as shown in Fig. 2, a sensor 5 is placed on the top of the table to detect the difference in the loaded amount of substrates, or when the loaded height decreases due to suction transfer. The top surface of the loaded board is set to always be at a constant height.

Further, there is an air nozzle 6 on the side surface of the substrate loading section, which blows compressed air from the side surface immediately before suctioning the substrates to facilitate separation of the substrates and prevent two sheets from being suctioned.

The substrate suction transfer unit 2 is composed of two adsorbers 7 and 8, front and back, and a substrate holding cylinder 9 located between 7 and 8, with respect to the transfer and loading direction, and air cylinders 7 and 8° 9 are provided. The cylinder operates a predetermined stroke up and down. 7.8
The pad at the tip is connected to a vacuum pump, and the substrate can be attracted and held by operating the vacuum pump.

Further, the substrate suction and transfer section 2 has a drive device on its upper part, and moves on the above-mentioned stacked substrate elevating section 1 and on the substrate transport conveyor 3, which will be described later.

The substrate conveyor conveyor 3 is a drive conveyor that conveys the substrate transferred by the substrate suction transfer section 2 to the manufacturing device connected to the rear of the input device.

Further, the entire substrate transport conveyor 3 rests on a weight measuring section 4, and the weight of the substrate transferred onto the substrate transport conveyor 3 is measured by the substrate suction transfer section 2.

At this time, by setting an arbitrary weight value, it has the function of generating an alarm or stopping the equipment for those that exceed the set price to prevent the introduction of two boards into the manufacturing equipment.

[Effect]

In this apparatus, first, the table lifter of the stacked substrate lifting section 1 rises, and when the sensor 5 detects the top surface of the loaded substrates, the table lifter stops. Next, the substrate suction transfer unit 2 moves onto the table lifter and stops.

Next, the substrate rear suction unit 7 descends and presses the rear portion of the upper surface of the substrate with a pad. Compressed air is then blown for an arbitrary period of time from air nozzles 6 on both sides of the substrate.

By blowing air between the stacked substrates, the substrates can be easily separated.

Next, the substrate front suction device 8 and the holding cylinder 9 descend simultaneously, come into contact with the substrate, and stop. At this point, the vacuum pump is operated and the tip pad of 7.8 attracts the substrate.

Then, the substrate suction device 7.8 is simultaneously raised, and the holding cylinder 9 starts to be raised after an arbitrary time delay.

At this time, the substrate suction device 7.8 rises first and the holding cylinder 9 rises afterwards, so the substrate bends around the holding cylinder 9 as a fulcrum, and the air blowing described above is performed in conjunction with the movement of the substrate. separation becomes more reliable.

After the substrate suction units 7, 8 and the holding cylinder 9 move up by a predetermined stroke, the substrate suction transfer unit 2 moves to above the substrate conveyor 3 and stops while holding the substrate by suction.

Then, the substrate suction devices 7 and 8 descend while adsorbing the substrates, and the vacuum pump is stopped on the substrate conveyor conveyor 3, the suction is released, and the substrates are transferred to the conveyor 3.

The conveyor 3 is on the weight measuring section 4, but at this time,
Measure the weight of the board, that is, the increase in resin on conveyor 3,
If the value exceeds the preset value,
An alarm is issued or the equipment is stopped; if the limit is not exceeded, the conveyor 3 is driven and the conveyor 3 is sent to the manufacturing device connected to the rear of the device.

Thereafter, this input cycle is repeated.

〔Effect of the invention〕

According to the present invention, it has become possible to reliably load substrates one by one into manufacturing equipment for polishing, etching, etc.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an embodiment of the present invention, FIG. 2 is a perspective view showing a loading board elevating section which is a part of an embodiment of the present invention, and FIG. 3(a) is a schematic diagram showing an embodiment of the present invention. FIG. 3(b) is a perspective view showing a substrate suction/movement loading section 1a which is a part of the embodiment, and a side view showing the substrate suction/movement loading section which is a part of an embodiment of the present invention. Explanation of symbols: Loaded substrate elevating section, substrate transport conveyor, weight measurement section, sensor, rear part of the substrate, 1 loading device, front part of the substrate, suction device holding cylinder〇, substrate 6゜Substrate adsorption movement loading section, air nozzle

Claims (1)

[Claims] 1. During the manufacturing process of printed wiring boards, air is injected when the board is picked up by the independently operated front and rear suction pads in the loading device that picks up and transfers the board from the loaded state using the suction pad. It has a nozzle on the side of the substrate loading section, a holding cylinder on the suction transfer section that presses the center of the substrate from above when the substrate is lifted up, and a weight measurement function on the substrate transfer conveyor section after transfer. A board loading device that prevents loading of two boards.