JP2005328396A - Method for manufacturing electronic component, and method for manufacturing non-reciprocal circuit element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a high reliability electronic component, by removing insulation defects due to a trimming groove formed by a laser, and to provide a method for manufacturing a non-reciprocal circuit element. <P>SOLUTION: In the method for manufacturing the electronic component, electrodes 225, 226 formed on the surface of one laminated substrate 220 are soldered to electrodes 215, 216 formed on the surface of the other laminated substrate 210, in which capacitive electrodes 211, 212 are built. At first, the capacitive electrode 211 is trimmed by a laser from the surface of the laminated substrate 210. Then a resin film 235 is formed on the surface of the laminated substrate 210, including the trimming groove 217 formed by laser trimming, and solder paste 230 is applied to positions corresponding to the electrodes 215, 216. When the resin film 235 is in a half-cured state, the solder paste 230 reaches at the electrodes 215, 216 through the resin film 235. Then the laminated substrate 220 is superimposed on the laminated substrate 210, and the solder paste 230 is melted and cured and the electrodes 215, 225, 216, 226 are soldered. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electronic component incorporating a capacitive electrode and a method for manufacturing a non-reciprocal circuit device.

  Conventionally, non-reciprocal circuit elements such as circulators and isolators have a characteristic of transmitting power only in a predetermined specific direction and not transmitting in the reverse direction. Utilizing this characteristic, for example, an isolator is used in a transmission circuit unit of a mobile communication device such as an automobile phone or a mobile phone.

  As this type of nonreciprocal circuit device, for example, Patent Document 1 discloses a device in which a laminated substrate having a built-in capacitive electrode and a center electrode assembly are connected by soldering. In the multilayer substrate described in Patent Document 1, trimming is performed by irradiating a laser beam from the surface of the multilayer substrate in order to adjust the capacitance of the matching capacitor. However, this trimming method causes the following problems.

  That is, FIG. 14 shows a schematic configuration of the multilayer substrate 300. The multilayer substrate 300 has a pair of capacitive electrodes 311 and 312 built in a dielectric ceramic multilayer body, and the capacitive electrode 311 is trimmed by irradiating a laser beam from the surface of the multilayer substrate 300. Reference numeral 315 indicates a trimming groove.

  The basic problem is that when the connection electrode of the center electrode assembly is soldered to the connection electrode (not shown) formed on the multilayer substrate 300, the solder or conductive impurities enter the trimming groove 315 and solder. The attachment portion and the capacitor electrode may be short-circuited.

In addition, as electronic components become smaller, thinner, or have higher capacities, the gap between the capacitive electrodes 311 and 312 becomes narrower, making it difficult to control the depth of laser trimming. The lower capacitive electrode 312 is also trimmed (see FIGS. 14B and 14C). In this case, as shown in FIG. 14C, Ag, which is an electrode component, extends in a whisker shape from the upper capacitor electrode 311 along the trimming groove 315, and the whisker extension 311a is formed in the lower capacitor electrode by migration or the like. Contact with 312 causes dielectric breakdown. When such dielectric breakdown occurs, not only the laminated substrate 300 itself but also the nonreciprocal circuit element becomes a defective product.
JP 2003-309402 A

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component manufacturing method and a non-reciprocal circuit device manufacturing method that eliminates an insulation failure caused by a trimming groove by a laser and has high reliability.

In order to achieve the above object, the first invention provides:
(A) Manufacture of an electronic component in which the connection electrode formed on the surface of the second component is soldered to the connection electrode formed on the surface of the first component of the laminated type including at least a pair of opposing capacitive electrodes In the method
(B) a trimming step of performing laser trimming on the capacitor electrode from the surface of the first component;
(C) Resin film / solder paste in which a resin film is formed on the surface of the first component including a trimming groove formed by laser trimming, and a solder paste is provided at a position corresponding to the connection electrode of the first component Application process;
(D) Solder that melts and cures the solder paste in a state where the second component is stacked on the first component, and connects the connection electrode of the first component and the connection electrode of the second component Attaching process,
It is provided with.

In addition, the second invention,
(E) a multilayer substrate including at least a pair of opposing capacitive electrodes; a permanent magnet; and a central electrode assembly including a ferrite to which a DC magnetic field is applied by the permanent magnet and a plurality of central electrodes. In the manufacturing method of the non-reciprocal circuit element, the connection electrode formed on the surface of the central electrode assembly is soldered to the connection electrode formed on the surface of
(F) a trimming step of performing laser trimming on the capacitor electrode from the surface of the multilayer substrate;
(G) a resin film / solder paste application step of forming a resin film including a trimming groove formed by laser trimming on the surface of the multilayer substrate and providing a solder paste at a position corresponding to the connection electrode of the multilayer substrate;
(H) In a state where the central electrode assembly is overlaid on the multilayer substrate, the soldering paste is melted and cured to connect the connection electrode of the multilayer substrate and the connection electrode of the central electrode assembly;
It is provided with.

  In the electronic component manufacturing method and the non-reciprocal circuit device manufacturing method according to the first and second inventions, even if the trimming groove by laser trimming reaches the capacitor electrode in the lower layer, the trimming groove is made of a resin film. Filling / sealing prevents solder and conductive impurities from entering the trimming groove, eliminates the possibility of short-circuiting between the soldered portion and the capacitor electrode, and improves reliability.

  Further, as described above, since the trimming groove is sealed by filling the resin film, the migration of the stretched portion generated along the trimming groove at the time of trimming is suppressed, and the dielectric breakdown occurs between the upper and lower capacitor electrodes. And reliability is improved.

  In the manufacturing method according to the first and second inventions, the resin film / solder paste application step includes a semi-cured resin film including a trimming groove formed by laser trimming on the surface of the first component or the laminated substrate. The solder paste may be applied to a position on the resin film corresponding to the connection electrode of the first component or the laminated substrate.

  If it is semi-cured, that is, if it is a thermosetting resin, the solvent component is kept dry, and if a solder paste is applied onto the semi-cured resin film, the part in contact with the flux in the solder The resin is melted again, and the solder paste passes through the resin and reaches the connection electrode. Then, when the solder paste is melted and cured by passing a reflow, for example, in a state where the second component or the center electrode assembly is overlaid on the first component or the laminated substrate, the first component or The connection electrode of the multilayer substrate and the connection electrode of the second component or the center electrode assembly are soldered.

  Alternatively, the resin film / solder paste application step includes applying a solder paste on the connection electrodes of the first component or the multilayer substrate and including a trimming groove formed by laser trimming on the surface of the first component or the multilayer substrate. A resin film may be formed. In this case, solder paste is directly applied on the connection electrode, and then a resin film is formed and the trimming groove is sealed with resin.

  The resin film may be a thermosetting resin, a UV curable resin, or a mixture of both, preferably a mixture of a thermosetting epoxy resin and a thermosetting phenol resin. do it.

  Embodiments of a method for manufacturing an electronic component and a method for manufacturing a nonreciprocal circuit device according to the present invention will be described below with reference to the accompanying drawings.

(See the first embodiment, FIG. 1)
In the first embodiment, as shown in FIG. 1D, a multilayer substrate (first component) 210 incorporating a capacitor element C, a multilayer substrate (second component) 220 incorporating an inductance element L, This is a method for manufacturing the LC composite electronic component 200.

  The multilayer substrate 210 includes a pair of capacitor electrodes 211 and 212 built in a dielectric ceramic multilayer body. The connection electrodes 215 and 216 formed on the surface of the multilayer substrate 210 are connected to the capacitor electrodes 211 and 211 via via holes (not shown). 212 is electrically connected. The capacitor electrodes 211 and 212 are usually made of Ag, but other conductive metals such as Au may be used.

  The other multilayer substrate 220 has an inductance element L built in an insulating ceramic multilayer body, and the connection electrodes 225 and 226 formed on the surface of the multilayer substrate 220 are electrically connected to the inductance element L via via holes (not shown). It is connected to the.

  The connection electrodes 215, 225, 216, 226 are electrically connected by solder 230, respectively. A resin film 235 is formed between the laminated substrates 210 and 220, and the resin film 235 is also filled in the trimming groove 217 for the capacitor electrode 211.

  The trimming groove 217 is a trace of trimming by irradiating the surface of the multilayer substrate 210 with a laser beam in order to adjust the capacitance of the capacitor electrodes 211 and 212. The trimming groove 217 not only cuts the upper capacitor electrode 211 but also lower layers. The capacitor electrode 212 is reached.

  Here, a method for manufacturing the LC composite electronic component 200 will be described. In addition, since the process of manufacturing each laminated substrate 210 and 220 is known, the process after that is demonstrated.

  First, laser trimming is performed on the capacitor electrode 211 from the surface of the multilayer substrate 210. This laser trimming is as described with reference to FIG. 14, and the trimming groove 217 reaches not only the upper capacitor electrode 211 but also the lower capacitor electrode 212.

  Next, as illustrated in FIG. 1A, a thermoplastic resin is applied to the surface of the multilayer substrate 210 including the trimming grooves 217 to form a resin film 235. Thus, the trimming groove 217 is sealed with resin. This thermoplastic resin is temporarily cured (semi-cured), and the solder paste 230 is applied to the position corresponding to the connection electrodes 215 and 216 on the resin film 235 in the temporarily cured state.

  The resin film 235 is applied by a screen printing method or a dispenser application method. As the thermosetting resin, a mixture of a thermosetting epoxy resin and a thermosetting phenol resin can be suitably used. However, it is not limited to this material. The temporary curing means a semi-cured state in which the solvent component of the thermoplastic resin is dried. For example, if it is the said mixed resin, a semi-hardened state will be obtained by heating at 100-150 degreeC for 3 to 10 minutes.

  The solder paste 230 applied on the resin film 235 in a semi-cured state again melts the resin in the part where the flux in the solder is in contact, passes through the resin, and reaches the connection electrodes 215 and 216 (FIG. 1 (B)).

  In addition, in order to obtain a multilayer substrate 210 equivalent to that shown in FIG. 1B, first, as shown in FIG. 1A ′, the solder paste 230 is formed on the connection electrodes 215 and 216 of the multilayer substrate 210. After that, the resin film 235 including the trimming groove 217 may be formed on the surface of the multilayer substrate 210. In this case, the solder paste 230 is directly applied onto the connection electrodes 215 and 216, and then the resin film 235 is formed and the trimming groove 217 is sealed with resin.

  Next, as shown in FIG. 1C, the laminated substrate 220 is overlaid on the laminated substrate 210, and for example, the solder paste 230 is melted by passing through a reflow furnace and then cured, thereby connecting electrodes. 215, 225, 216, 226 are electrically connected.

  In the first embodiment, even if the trimming groove 217 by laser trimming reaches the capacitor electrode 212 in the lower layer, the trimming groove 217 is filled / sealed with the resin film 235. The trimming groove 217 does not enter, and the possibility that the soldered portion and the capacitor electrodes 211 and 212 are short-circuited is eliminated, and the reliability is improved.

  Further, as described above, since the trimming groove 217 is sealed by filling the resin film 235, the migration of the stretched portion generated along the trimming groove 217 during trimming is suppressed, and the upper and lower capacitor electrodes 211, Reliability is improved without causing dielectric breakdown between 212.

Note that the resin film 235 may use a UV curable resin or a resin in which a thermosetting resin and a UV curable resin are mixed instead of the above-described thermosetting resin. For example, when an acrylate resin is used as the UV curable resin, it can be temporarily cured under the condition of an integrated light quantity of 1000 mJ / cm ² or less.

(Refer 2nd Example and FIGS. 2-12)
The second embodiment is a method for manufacturing a non-reciprocal circuit element, and FIG. 2 shows a state where the non-reciprocal circuit element 1 is disassembled.

  The nonreciprocal circuit device 1 is configured as a lumped constant type isolator, and as shown in FIG. 2, generally, a metal case composed of a metal upper case 4 and a metal lower case 8, a permanent magnet 9, and ferrite 20 and a center electrode assembly 13 including center electrodes 21, 22 and 23, and a laminated substrate 30.

  The metal upper case 4 has a substantially box shape and includes an upper portion 4a and four side portions 4b. The metal lower case 8 includes left and right side portions 8b and a bottom portion 8a. In order to form a magnetic circuit, the metal upper case 4 and the metal lower case 8 are made of, for example, a material made of a ferromagnetic material such as soft iron, and Ag or Cu is plated on the surface thereof.

  In the center electrode assembly 13, three center electrodes 21, 22, and 23 are arranged on the upper surface of the rectangular microwave ferrite 20 so as to intersect with each other at approximately 120 degrees with an insulating layer (not shown) interposed therebetween. ing. Here, the center electrodes 21, 22, and 23 are configured by two lines. The center electrodes 21, 22, 23 may be wound around the ferrite 20 using copper foil, or may be formed by printing a silver paste on or inside the ferrite 20. However, since the positional accuracy of the center electrodes 21, 22, and 23 is higher when printed, the connection with the laminated substrate 30 is more stable. In particular, when the connection is made with the small center electrode connection electrodes P1, P2, and P3 (described later), it is better to form the center electrodes 21, 22, and 23 by printing to improve reliability and workability.

  As shown in FIG. 3, the multilayer substrate 30 includes a dielectric sheet 41 provided with center electrode connection electrodes P1, P2, and P3, a ground connection electrode 31, and via holes 18, hot capacitor electrodes 71a, 72a, 73a, Dielectric sheet 42 provided with circuit electrode 17 and resistor 75 on the surface, dielectric sheet 44 provided with hot-side capacitor electrodes 71b, 72b and 73b on the surface, and dielectric provided with ground electrode 74 on the surface. It consists of body sheets 43, 45 and the like. A ground electrode for soldering to the lower case 8 is also formed on the back surface of the dielectric sheet 45.

  The electrodes P1 to P3, 17, 31, 71a to 73a, 71b to 73b, and 74 are formed on the dielectric sheets 41 to 45 by a method such as pattern printing. As a material for the electrodes P1, P2, P3, etc., Ag, Cu, Ag—Pd, etc., which has a low resistivity and can be fired simultaneously with the dielectric sheets 41 to 45, are used. It is preferable that the electrode appearing outside and soldered is plated. Specifically, the surfaces of the electrodes P1, P2, P3 and the electrodes 14, 15, 16 described below are Au plated with Ni plating as a base. Ni plating increases the adhesion strength of Ag and Au plating of these electrodes. Au plating improves solder wettability and has high electrical conductivity, so that the isolator 1 can have low loss.

The thickness of the electrodes P1, P2, P3, etc. is about 2 to 20 μm. The material of the dielectric sheets 41 to 45 is mainly composed of Al ₂ O ₃ , and is composed of SiO ₂ , SrO, CaO, PbO, Na ₂ O, K ₂ O, MgO, BaO, CeO ₂ , B ₂ O ₃ . It is a low temperature sintered dielectric material containing one kind or plural kinds as subcomponents. The sheet thickness of the dielectric sheets 41 to 45 is about 10 to 200 μm.

  The resistor 75 is formed on the surface of the dielectric sheet 42 by a method such as pattern printing. As the material of the resistor 75, cermet, ruthenium or the like is used. The resistor 75 alone constitutes a termination resistor R. Note that the terminating resistor R may be omitted, and in this case, a circulator is configured.

  The via hole 18 is formed by forming a via hole hole in the dielectric sheets 41, 42, and 43 in advance by laser processing, punching process, or the like, and then filling the via hole hole with a conductive paste.

  Capacitor electrodes 71a, 71b, 72a, 72b, 73a, 73b constitute matching capacitors C1, C2, C3 facing the ground electrode 74 with the dielectric sheets 42, 43, 44 interposed therebetween, respectively. These matching capacitors C 1, C 2, C 3 and termination resistor R together with the electrodes P 1, P 2, P 3, 17, 31 and the via hole 18 constitute an electric circuit inside the multilayer substrate 30.

  The above dielectric sheets 41 to 45 are laminated, and further, a plurality of dummy dielectric sheets 47 having electrodes not previously formed on the surface are laminated below them, and then integrally fired, as shown in FIG. Such a laminated substrate 30 is obtained.

  An input terminal electrode 14, an output terminal electrode 15, and a ground terminal electrode 16 are provided at both ends of the multilayer substrate 30, respectively. The input terminal electrode 14 is electrically connected to the capacitor electrodes 71a and 71b, and the output terminal electrode 15 is electrically connected to the capacitor electrodes 72a and 72b. The ground terminal electrodes 16 are electrically connected to the circuit electrode 17 and the ground electrode 74, respectively. These terminal electrodes 14, 15, and 16 are formed by applying a conductive paste such as Ag, Ag-Pd, or Cu and then baking or dry plating. Moreover, it is good also as the electrodes 14, 15, 16 by forming a via hole in the side surface of each sheet | seat.

  The laminated substrate 30 is normally manufactured in a mother board state (see FIGS. 7 and 8), and is laminated from the mother board 100 to a desired size by folding along the half-cut grooves 101 formed on the mother board 100 at a predetermined pitch. A substrate 30 is obtained. Alternatively, the laminated substrate 30 having a desired size may be cut out from the mother board 100 by cutting the mother board 100 with a dicer or a laser.

  The multilayer substrate 30 obtained in this way has matching capacitors C1, C2, C3 and a terminating resistor R inside. Trimming of the matching capacitors C1, C2, C3 is performed before connecting the matching capacitors C1, C2, C3 and the center electrodes 21, 22, 23. Further, the termination resistor R is also trimmed as necessary.

  That is, the multilayer substrate 30 is trimmed with a laser together with the surface layer dielectrics in the capacitor electrodes 71a, 72a, 73a inside (second layer) in a single state. For trimming, for example, a YAG fundamental wave, second harmonic wave, or third harmonic laser is used. The reason for using a laser is that a fast and accurate processing can be obtained. The trimming may be efficiently performed on the laminated substrate 30 in the mother board state.

  Here, laser trimming will be described. Laser trimming is performed on the capacitor electrodes 71a, 72a, 73a, and the mask 50 shown in FIG. 5 is used. The mask 50 covers the center electrode connection electrodes P 1, P 2, P 3 and the terminal electrode 31 provided on the surface of the laminated substrate 30, and has other portions as openings 51. A mask 50 is placed on the surface of the multilayer substrate 30 in the state shown in FIG. Trimming marks are shown as trimming grooves 80 and 81.

  In laser trimming, the trimming depth gradually increases from the start of trimming (laser scanning). Therefore, in order to completely cut the electrode, the trimming start position is set slightly away from the end of the electrode. There is a need to. Specifically, a position away from the end of the electrode by 50 μm is preferable. This numerical value varies depending on the scanning speed of the laser, the thickness of the dielectric sheet and the electrode, and the like.

  The conditions for laser trimming are as follows, and the values in parentheses are specific numerical values in experiments conducted by the present inventors.

Laser: Double wave of YAG laser using laser diode as light source Output: 1.5-2.5W (2.0W)
Oscillation frequency: 2 to 4 KHz (3 KHz)
Scanning speed: 30 to 60 mm / s (50 mm / s)
Number of scans: 4-10 times (7 times)
Distance between mask and electrode: (0.1mm)
Scanning start position: A position away from the electrode edge (50 μm)

  In the second embodiment, since laser trimming is performed using the mask 50 covering the electrodes P1, P2, P3, 31, the scattered matter generated by laser irradiation does not adhere to these electrodes, and the center The problem of poor soldering with the electrodes 21, 22, 23 is eliminated.

  That is, when trimming is performed without using the mask 50, scattered matter adheres to the electrodes P1, P2, P3, and 31 as indicated by hatching in FIG. However, the use of the mask 50 prevents the scattered matter from adhering to the electrodes P1, P2, P3, and 31 as indicated by hatching in FIG.

  Note that the scattered matter adheres to the surface of the multilayer substrate 30 and corresponds to the opening 51 of the mask 50 (see the oblique lines in FIG. 6B). However, since it does not adhere to the electrodes P1, P2, P3, and 31 at all, the reliability does not deteriorate even if the deposit is not removed from the surface of the laminated substrate 30 by washing or air blowing.

  As the material of the mask 50, stainless steel, brass, copper, iron or the like can be used. Moreover, resin may be used as described later. In particular, the stainless steel mask 50 is excellent in wear resistance, has no problems of oxidation and rust, and is easy to maintain.

  In the second embodiment, the trimming capacitor electrodes 71a, 72a, 73a are provided inside the multilayer substrate 30, so that the capacitor electrode area that can be trimmed is increased, the capacitance adjustment range is expanded, and the multilayer substrate is expanded. The good product rate of 30 can be improved.

  In the second embodiment, the multilayer substrate 30 corresponds to the multilayer substrate 210 of the first embodiment, and the center electrode assembly 13 corresponds to the multilayer substrate 220. 1 is formed on the surface of the multilayer substrate 30 including the trimming grooves 80, and the solder paste 230 shown in FIG. 1 is formed on the connection electrodes P1, P2, P3, and 31. Applied. Here too, either the process shown in FIGS. 1A and 1B or the process shown in FIG. 1A 'can be employed. In a state where the center electrode assembly 13 is stacked on the multilayer substrate 210, the solder paste 230 is melted and cured to solder the connection electrodes P1, P2, P3, 31 and the connection electrodes of the center electrode assembly 13 together. . Such a connection method is the same as that of the first embodiment, and the operation and effects thereof are as described in the first embodiment.

  It should be noted that the soldering of the center electrodes 21, 22, 23 and the connection electrodes P1, P2, P3, 31 may be efficiently performed on the laminated substrate 30 in the mother board state.

  Furthermore, in the second embodiment, since the distance between the connection electrodes P1, P2, P3, 31 can be increased, the size of the center electrode assembly 13 can be increased. Accordingly, since the inductance formed by the center electrodes 21, 22, and 23 is increased, the pass band width of the isolator 1 can be widened, and the electrical characteristics can be improved.

  Further, since the capacitor electrodes 71a, 72a, 73a located in the outermost layer are used as the trimming capacitor electrodes, the thickness of the dielectric layer to be removed at the time of trimming can be minimized. Furthermore, since the number of electrodes that obstruct trimming is reduced (in the case of the second embodiment, only the connection electrodes P1, P2, P3, and 31), the capacitor electrode area that can be trimmed is widened, and the capacitance adjustment range is widened. it can.

  Furthermore, since the trimming capacitor electrodes 71a, 72a and 73a are rectangular, the electrode width is constant, so that a substantially proportional relationship is established between the position of the trimming groove 80 and the obtained capacitance value. , Capacitance adjustment work becomes easy.

  Further, the trimming capacitor electrodes 71a, 72a, 73a overlap only with the center electrode connection electrodes P1, P2, P3 in the stacking direction of the dielectric sheets 41-45. Thus, other electrodes that hinder trimming can be prevented from overlapping with the trimming capacitor electrodes 71a, 72a, 73a. In addition, if the trimming capacitor electrodes 71a, 72a, 73a overlap the ground connection electrode 31, a capacitance is formed at that portion, so that there is a problem that trimming accuracy is deteriorated.

  Further, in FIG. 4, the multilayer substrate 30 is provided with hot-side capacitor electrodes 73a and 73b of the matching capacitor C3 on one side and hot-side capacitor electrodes 71a and 71b of the matching capacitor C1 on the right end on the other side. The hot-side capacitor electrodes 72a and 72b of the matching capacitor C2 are provided at the left end of the other side. In other words, the hot-side capacitor electrodes 73a and 73b of the termination resistor-side matching capacitor C3 are arranged on the side of the multilayer substrate 30 where the termination resistor R is arranged, and the hot-side capacitor electrodes 71a and 73a of the input-side matching capacitor C1 are arranged. 71b is disposed on the input side of the multilayer substrate 30, and the hot side capacitor electrodes 72a and 72b of the output side matching capacitor C2 are disposed on the output side of the multilayer substrate 30. As a result, it is possible to obtain matching capacitors C1, C2, and C3 in which trimming adjustment is easy and the area of the multilayer substrate 30 is effectively used.

  In general, an isolator used in a mobile communication device often has a larger capacitance of the resistance matching capacitor C3 than the capacitance of the input / output matching capacitors C1 and C2. Therefore, in order to ensure the capacitance of the resistance-side matching capacitor C3, the area of the hot-side capacitor electrodes 73a and 73b of the matching capacitor C3 is the total area of the hot-side capacitor electrodes of the matching capacitors C1, C2, and C3. It is preferable to set it to be 1/3 or more of.

  Further, the termination resistance R is also built in the multilayer substrate 30, and the resistance value of the termination resistance R can be adjusted by trimming together with the dielectric on the surface layer in the same manner as the matching capacitors C1, C2, and C3. . Since the resistance value increases when the width of the resistor 75 becomes narrow even at one place, the resistor 75 is cut halfway in the width direction. Since the termination resistor R is built in the laminated substrate 30, there is no fear that Ni plating or the like is applied to the surface of the resistor 75 when Ni plating or Au plating is applied to the surfaces of the electrodes P1, P2, P3, etc. The resistance value of the termination resistor R does not decrease. As shown in FIG. 5, in the second embodiment, three trimming grooves 80 for dividing the trimming capacitor electrodes 71a, 72a, 73a and one trimming groove 81 for cutting the resistor 75 are provided. It is formed on the laminated substrate 30.

  The above components are assembled as follows. That is, as shown in FIG. 2, the permanent magnet 9 is fixed to the ceiling of the metal upper case 4 with an adhesive. On the laminated substrate 30, the center electrode assembly 13 is connected to center electrode connection electrodes P 1, P 2, each of which has one end of each of the center electrodes 21, 22, 23 of the center electrode assembly 13 formed on the surface of the laminated substrate 30. Mounting is performed by soldering to P3 by the method shown in FIG. 1 and soldering the other end of each of the center electrodes 21, 22, 23 to the ground connection electrode 31. Since the connection electrodes P1, P2, P3, and 31 have a small area, the center electrode assembly 13 can be positioned by a self-alignment effect when the solder is melted.

  The laminated substrate 30 is placed on the bottom portion 8a of the metal lower case 8, and an electrode provided on the back surface of the sheet 47 is connected and fixed to the bottom portion 8a by solder, so that the ground terminal electrode 16 is electrically connected to the bottom portion 8a. Connected to. Thereby, since sufficient earthing can be taken, the electrical characteristics of the isolator 1 can be improved.

  Then, the side part 8b of the metal lower case 8 and the side part 4b of the metal upper case 4 are joined by solder or the like to form a metal case, which also functions as a yoke. That is, the metal case forms a magnetic path that surrounds the permanent magnet 9, the center electrode assembly 13, and the laminated substrate 30. The permanent magnet 9 applies a DC magnetic field to the ferrite 20.

  FIG. 9 is an electrical equivalent circuit diagram of the isolator 1. The matching capacitor C3 and the terminating resistor R are connected in parallel between the center electrode connection electrode P3 and the ground terminal electrode 16.

(Other examples of trimming, see FIGS. 10 to 12)
FIG. 10 shows a method of using a mask 55 provided with a probe 58 for measuring the capacitance of the capacitors C1, C2, and C3 when performing laser trimming on the capacitor electrodes 71a, 72a, and 73a. Note that the configuration of the laminated substrate 30 is the same as that of the second embodiment, and the reference numerals in FIG. 10 indicate the same members as those of the second embodiment, and redundant description is omitted.

  Similar to the mask 50 shown in the second embodiment, the mask 55 covers the electrodes P1, P2, P3, and 31 of the multilayer substrate 30 and has other portions as openings 56. Is applied to trim the capacitor electrodes 71a, 72a, 73a and the terminating resistor R as necessary. The probe 58 is attached to the lower surface of the mask 55 so as to protrude from a hole 57 formed at a position corresponding to the electrodes P1, P2, P3, 31 (see FIG. 11). The shape of each probe 58 is as shown in FIG. 12, and can be taken in and out of the holding cylinder 59 by a spring mechanism (not shown).

  In this trimming example, the initial capacitances of the capacitors C1, C2, and C3 of the multilayer substrate 30 are measured before laser trimming. That is, the laminated substrate 30 is fixed, the mask 55 is lowered and placed on the laminated substrate 30, the probe 58 is lowered and its tip is brought into contact with the electrodes P 1, P 2, P 3, 31, and the capacitors C 1, C 2, C 3 Measure capacity.

  Next, the probe 58 is raised and separated from the electrodes P1, P2, P3, 31 and the trimming position determined based on the measured initial capacitance is irradiated with a laser to trim the capacitor electrodes 71a, 72a, 73a. . Thereafter, the probe 58 is lowered again to measure the trimmed capacitor capacity.

  The above steps (initial capacitance measurement, laser trimming, and capacitance measurement after trimming) are performed in a short time using an automatic machine, thereby achieving a reduction in the cost of nonreciprocal circuit elements. Of course, the effect of laser trimming using the mask 55 is the same as in the second embodiment.

  By the way, when measuring a capacitor capacity with a probe, the mask 55 is preferably made of resin. Since no ground current flows during the capacitance measurement, it is possible to measure a stable capacitance with a small measurement error, and an irreversible circuit element with a small variation in frequency characteristics can be obtained. In addition, the resin is excellent in processability and dimensional stability, and can be processed thinly and finely, and is optimal for manufacturing a multilayer substrate of a non-reciprocal circuit element having a reduced size. In this sense, the mask 50 shown in the second embodiment may be made of resin.

(Communication device, FIG. 13)
Here, a mobile phone will be described as an example of a communication device using the non-reciprocal circuit element. FIG. 13 shows an electric circuit of the RF part of the mobile phone 320. 322 is an antenna element, 323 is a duplexer, 331 is a transmission side isolator, 332 is a transmission side amplifier, 333 is a band pass filter for transmission side stages, and 334 is transmission. The side mixer 335 is a reception side amplifier, 336 is a reception side interstage band pass filter, 337 is a reception side mixer, 338 is a voltage controlled oscillator (VCO), and 339 is a local band pass filter.

  Here, the non-reciprocal circuit element 1 (lumped constant type isolator) shown as the second embodiment can be used as the transmission-side isolator 331. By mounting these isolators, a mobile phone with improved electrical characteristics and high reliability can be realized.

(Other examples)
In addition, the manufacturing method which concerns on this invention is not limited to the said Example, It can change variously within the range of the summary.

  For example, the capacitor formed inside the multilayer substrate is not limited to the matching capacitor, and may be a capacitor for forming a low-pass filter, a trap circuit, or the like. In addition to the isolator, the nonreciprocal circuit device according to the present invention may be a circulator or a nonreciprocal circuit device with a built-in coupler.

It is explanatory drawing which shows 1st Example of the manufacturing method which concerns on this invention. It is a disassembled perspective view which shows the nonreciprocal circuit device obtained with the manufacturing method which concerns on this invention. FIG. 3 is an exploded perspective view of the multilayer substrate illustrated in FIG. 2. It is a top view which shows the various electrodes formed in the said laminated substrate. It is a top view which shows the state which mounted the mask on the said laminated substrate and performed the laser trimming. (A) is a plan view showing the state of attachment of scattered objects when laser trimming is performed without using a mask, and (B) is a plan view showing the state of attachment of scattered objects when laser trimming is performed using a mask. It is. It is a top view which shows the motherboard state of a laminated substrate. It is a top view which shows the state which mounted components on the laminated substrate shown in FIG. FIG. 3 is an electrical equivalent circuit diagram of the non-reciprocal circuit device illustrated in FIG. 2. It is a perspective view which shows the mask and laminated substrate which attached the probe. It is a reverse view of the mask shown in FIG. FIG. 11 is an elevational view of the probe shown in FIG. 10. It is an electric circuit block diagram of the communication apparatus provided with the said nonreciprocal circuit element. 1A and 1B show a conventional laminated substrate subjected to laser trimming, in which FIG. 1A is a plan view, FIG. 1B is a cross-sectional view taken along line BB, and FIG.

Explanation of symbols

1 ... Non-reciprocal circuit element (lumped constant type isolator)
DESCRIPTION OF SYMBOLS 9 ... Permanent magnet 13 ... Center electrode assembly 20 ... Ferrite 21-23 ... Center electrode 30 ... Multilayer substrate 71a-73a, 71b-73b ... Capacitor electrode 80, 81 ... Trimming groove P1-P3, 31 ... Connection electrode 210 ... Multilayer Substrate (first component)
211, 212 ... Capacitor electrodes 215, 216 ... Connection electrodes 217 ... Trimming grooves 220 ... Multilayer substrate (second component)
225, 226 ... Connection electrode 235 ... Resin film

Claims (8)

In the method of manufacturing an electronic component, the connection electrode formed on the surface of the second component is soldered to the connection electrode formed on the surface of the first component of the laminated type including at least one pair of opposing capacitive electrodes.
A trimming step of performing laser trimming on the capacitor electrode from the surface of the first component;
A resin film / solder paste application step of forming a resin film including a trimming groove formed by laser trimming on the surface of the first component and providing a solder paste at a position corresponding to the connection electrode of the first component; ,
A soldering step of melting and curing the solder paste in a state where the second component is overlaid on the first component and connecting the connection electrode of the first component and the connection electrode of the second component; ,
A method for manufacturing an electronic component, comprising:   In the resin film / solder paste application step, a semi-cured resin film including a trimming groove formed by laser trimming is formed on the surface of the first component, and the first component is formed on the resin film. 2. The method of manufacturing an electronic component according to claim 1, wherein a solder paste is applied to a position corresponding to the connection electrode.   In the resin film / solder paste application step, a solder paste is applied on the connection electrode of the first component, and a resin film is formed on the surface of the first component including a trimming groove formed by laser trimming. The manufacturing method of the electronic component of Claim 1 characterized by these.   The method of manufacturing an electronic component according to claim 1, wherein the resin film uses a thermosetting resin, a UV curable resin, or a resin in which both are mixed. A laminated substrate including at least a pair of opposing capacitive electrodes; a permanent magnet; and a central electrode assembly comprising a ferrite to which a DC magnetic field is applied by the permanent magnet and a plurality of central electrodes; and on the surface of the laminated substrate. In the manufacturing method of the non-reciprocal circuit device, the connection electrode formed on the surface of the center electrode assembly is soldered to the formed connection electrode.
A trimming step of performing laser trimming on the capacitor electrode from the surface of the multilayer substrate;
A resin film / solder paste application step of forming a resin film including a trimming groove formed by laser trimming on the surface of the multilayer substrate and providing a solder paste at a position corresponding to the connection electrode of the multilayer substrate;
A soldering step in which the solder paste is melted and cured in a state where the central electrode assembly is stacked on the multilayer substrate, and the connection electrode of the multilayer substrate and the connection electrode of the central electrode assembly are connected;
A method for manufacturing a non-reciprocal circuit device, comprising:   In the resin film / solder paste application step, a semi-cured resin film including a trimming groove formed by laser trimming is formed on the surface of the multilayer substrate, and the resin film / solder paste application step is applied to the connection electrode of the multilayer substrate on the resin film. 6. The method for producing a nonreciprocal circuit device according to claim 5, wherein a solder paste is applied to a corresponding position.   The resin film / solder paste application step is characterized in that a solder paste is applied on a connection electrode of a laminated substrate, and a resin film is formed on the surface of the laminated substrate including a trimming groove formed by laser trimming. The manufacturing method of the nonreciprocal circuit device according to claim 5.   The nonreciprocal circuit device manufacturing method according to claim 5, wherein the resin film uses a thermosetting resin, a UV curable resin, or a resin in which both are mixed.

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