JP2005327882A - Semiconductor device and package therefor and their manufacturing method and camera - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for a semiconductor device for easily recognizing the tilt of a package by image recognition processing, and for sufficiently securing the tilt precision of the semiconductor element, when a semiconductor element is mounted on a semiconductor element mounting part in the package and a semiconductor device and a camera for improving the mounting precision by using this. <P>SOLUTION: A target mark 1b is configured in the mostouter peripheral part or mostouter peripheral neighborhood of the package 2 with a difference between its color tone or brightness/darkness and that of the package 2, and the periphery is surrounded by wall faces for protection. This target mark 1b is formed on the mounting face of a semiconductor element mounted in the package 2 or a plane corresponding to its neighboring face. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a package for a semiconductor device, a semiconductor device, a manufacturing method thereof, and a camera for mounting a semiconductor element such as a solid-state imaging element in a laminated structure of sintered ceramics.

  2. Description of the Related Art Conventionally, a package for a semiconductor device for mounting a semiconductor element such as a solid-state image sensor in a package body is often used for a digital camera, for example. As this type of semiconductor device package, there are a general-purpose type and a semiconductor device package for the purpose of miniaturization and thinning, and one of the latter is a sintered ceramic laminated type LCC package. In particular, when using a solid-state imaging device, mounting accuracy is strongly demanded. For this reason, it has been studied to increase the image recognizability and the position regulation level at the time of mounting.

  In the prior art (see, for example, Patent Document 1), the top surface of the package is color-coded with a color different from the side surface of the package, and the burr shape generated on the side surface of the package is removed at the stage of image recognition. is there. This is because image recognition binarization takes a color tone difference portion of a subject with a solid-state imaging device, but the burr and package are recognized as the same color and integrated, and the burr size is added, so both are identified by color coding. .

The conventional semiconductor device package as described above will be described below with reference to the drawings.
FIG. 7 is a structural explanatory view showing a configuration example of a conventional LCC package for a semiconductor device described in Patent Document 1. In FIG. In this LCC package for a semiconductor device, as shown in FIGS. 7A, 7B, 7C, and 7D, a container-like package body 2 in which a plurality of inner leads 1 and outer leads 1a are arranged is A semiconductor element and a wire (both not shown) are joined to a predetermined position in the center of the inner chamber of the package body 2. The package body 2 is formed by laminating and sintering a ceramic sheet material having a predetermined shape, and FIG. 7 shows a case of three layers. As shown in FIG. 7D, in the lead terminal structure, the inner lead 1 formed on the upper surface of the intermediate layer 2b, the bottom surface of the lowermost layer 2C, and the outer leads 1a formed on both side surfaces are electrically connected. .

The top surface 3 of the uppermost layer 2a of the package body 2 is a surface that seals a lid (not shown) or the like for airtightness, and the outer peripheral end face is often used for image recognition during mounting. . Here, the top surface 3 of the uppermost layer 2a has a configuration in which the upper surface 3 is color-coded with a color 31 different from the side surface of the package and the both are identified. As a result, the burr 4 on the side surface of the package can be distinguished from the original outer shape of the package by the image recognition process at the time of mounting.
Japanese Patent Laid-Open No. 10-321741

  However, the conventional sintered ceramic as described above is a structure having a defect that is easily warped and easily chipped. In the conventional configuration, the outline of the outline conforming to the original standard of the package is recognized and the mounting accuracy in the two-dimensional direction is recognized. Although improvement can be achieved, there is a problem that image recognition and mounting accuracy improvement with respect to the inclination in the three-dimensional direction are not practically suitable. In particular, in mounting a solid-state imaging device that requires optical characteristics, it is essential to improve the mounting accuracy of the tilt.

  The first problem is suitable for detection of tilt due to package warpage because the outermost contour (corner) has a large amount of fluctuation, but the uppermost corner position is likely to be chipped, which causes image recognition errors (binarization judgment). A malfunction or a focus shift).

  The second problem is that the top surface of the uppermost layer is poorly sealed due to the warpage of the package, so it is often flattened by polishing for the purpose of sealing quality assurance. After the polishing process is completed, problems such as complicated process increase and cost increase occur.

  The present invention solves the above-mentioned conventional problems, makes it difficult to be affected by chipping of the package body, enables clear and clear focus image recognition on the package body, and recognizes the inclination of the package body as an image. Provided are a package for a semiconductor device which can be easily recognized by processing and can improve the tilt accuracy of a semiconductor element relatively easily, and a method for manufacturing the same.

In addition, when the conventional semiconductor device package is applied industrially, there are the following problems.
In a camera using a semiconductor device mounted with a solid-state image pickup device of a representative example that requires high accuracy, a lens block (the lens block is the heart of a camera using a solid-state image pickup device and will be described only with a lens block hereinafter). To secure the optical characteristics (optical axis misalignment causes deterioration in characteristics due to uneven sensitivity, shading, etc.) It becomes important.

  In general, the lens block is aligned with respect to the package body of the semiconductor device as a reference, and is effective for setting the plane (two-dimensional) direction. However, the tilt (three-dimensional) direction separately requires complicated means such as inspection of the surface of the semiconductor element (solid-state imaging device) by laser reflection.

  The present invention solves the above-described conventional problems, and provides a semiconductor device, a method of manufacturing the same, and a camera that can easily realize high-precision mounting using a package for a semiconductor device.

  In order to solve the above-described problems, a package for a semiconductor device according to claim 1 of the present invention includes a mounting portion for a semiconductor element formed in a multilayer structure made of sintered ceramic, and the mounting on the uppermost layer of the multilayer structure. A package for a semiconductor device in which an opening is formed following the opening, and a plurality of lead terminals electrically connected to the semiconductor element are provided on an inner periphery of the opening. A target mark for detecting the position or inclination of the laminated structure is selectively disposed near a planar outer corner of the layer to be removed or in the vicinity of the outermost periphery, and the target mark has an opening in the uppermost layer of the laminated structure. It is characterized by being arranged so as to be directly viewable from the main surface side.

  The semiconductor device package according to claim 2 of the present invention is the semiconductor device package according to claim 1, wherein the target mark is formed with a difference in color tone or brightness from the package body. It is characterized by having a configuration.

  The package for a semiconductor device according to claim 3 of the present invention is the package for a semiconductor device according to claim 1, wherein the target mark is at least a predetermined area of the entire surface or geometrically. It is characterized by having a configuration formed by a pattern.

  The package for a semiconductor device according to claim 4 of the present invention is the package for a semiconductor device according to claim 1, wherein the target mark includes at least a mounting portion formation surface of a semiconductor element installed in the package body. It is characterized in that it is configured to be selectively arranged on the same surface.

  The package for a semiconductor device according to claim 5 of the present invention is the package for a semiconductor device according to claim 1, wherein the target mark has a recess at least inside the outer shape of the package body. It is characterized by having a structure formed on a surface surrounded by the periphery.

  Moreover, the package for a semiconductor device according to claim 6 of the present invention is the package for a semiconductor device according to claim 5, wherein the recess has at least three or more opposing locations in the vicinity of the planar outer shape or the outer periphery of the package body. It is characterized by having the structure formed in the above.

  A semiconductor device package according to claim 7 of the present invention is the semiconductor device package according to any one of claims 1 to 6, wherein the target mark is printed on at least the package body. The present invention is characterized in that a film is selectively formed with a metallized layer formed by a firing process.

  Moreover, the package for semiconductor devices according to claim 8 of the present invention is the package for semiconductor devices according to any one of claims 1 to 6, wherein the target mark is a marking paint on at least the package body. The composition is characterized in that the agent is selectively applied and formed.

  According to a ninth aspect of the present invention, there is provided a method for manufacturing a package for a semiconductor device, wherein a mounting portion of a semiconductor element is formed in a laminated structure made of sintered ceramic, and an opening following the mounting portion is formed in the uppermost layer of the laminated structure. Forming a plurality of lead terminals electrically connected to the semiconductor element on an inner peripheral portion of the opening, the method including the uppermost layer of the stacked structure A target mark for detecting the position or inclination of the laminated structure is selectively disposed in the planar outer corner of the layer or in the vicinity of the outermost periphery, and the target mark is arranged in a main layer having an opening in the uppermost layer of the laminated structure. It is characterized in that it is arranged so that it can be viewed directly from the surface side.

  The semiconductor device package manufacturing method according to claim 10 of the present invention is the semiconductor device package manufacturing method according to claim 9, wherein the target mark is at least different in color tone or brightness from the package body. It is characterized in that it is a method of forming with a thickness.

  The semiconductor device package manufacturing method according to claim 11 of the present invention is the semiconductor device package manufacturing method according to claim 9, wherein the target mark is at least a predetermined formation position and the entire surface region thereof. Or a method of forming a geometric pattern.

  A semiconductor device package manufacturing method according to claim 12 of the present invention is the semiconductor device package manufacturing method according to claim 9, wherein the target mark is at least provided in the package body. The mounting portion forming surface is selectively disposed on the same surface.

  The semiconductor device package manufacturing method according to claim 13 of the present invention is the semiconductor device package manufacturing method according to claim 9, wherein the target mark is recessed at least inside the outer shape of the package body. The method is characterized in that it is formed on a surface surrounded by the depression.

  Further, the manufacturing method of a package for a semiconductor device according to claim 14 of the present invention is the method for manufacturing a package for semiconductor device according to claim 13, wherein the recess is at least in a planar outer shape or in the vicinity of the outer periphery of the package body. The method is characterized in that it is formed at three or more locations facing each other.

  Moreover, the manufacturing method of the package for semiconductor devices of Claim 15 of this invention is a manufacturing method of the package for semiconductor devices in any one of Claims 9-14, Comprising: The said target mark is at least said said mark The method is characterized in that a film is selectively formed on the package body with a metallized layer by printing and baking processing.

  Moreover, the manufacturing method of the package for semiconductor devices of Claim 16 of this invention is a manufacturing method of the package for semiconductor devices in any one of Claims 9-14, Comprising: The said target mark is at least said said mark The present invention is characterized in that a marking coating agent is selectively applied to the package body.

As described above, the inclination due to the warpage of the package body can be reliably and accurately detected without error by using the image recognition processing for the target mark.
A semiconductor device according to claim 17 of the present invention is an inclination mode detected by the target mark at a predetermined position of a semiconductor element mounting portion in the package for semiconductor device according to any one of claims 1 to 8. The semiconductor element is mounted, and the semiconductor element and the plurality of lead terminals are connected by a conductive wire, and the opening of the uppermost layer of the stacked structure is closed. It is characterized by.

  A semiconductor device manufacturing method according to an eighteenth aspect of the present invention is a method for manufacturing a semiconductor element package in a semiconductor device package manufactured by the method for manufacturing a semiconductor device package according to any one of the ninth to sixteenth aspects. The semiconductor device is mounted at a predetermined position so as to depend on an inclination mode detected by the target mark, and the semiconductor device and the plurality of lead terminals are connected by a conductive wire, and then the stacked structure The method is characterized by closing the opening of the uppermost body layer.

  A camera according to a nineteenth aspect of the present invention uses the semiconductor device according to the seventeenth aspect, wherein the semiconductor element is a solid-state imaging element, and a lens unit including an external light condensing lens is used with reference to the optical axis. In a state where the solid-state imaging device is aligned, a target mark arrangement surface in the semiconductor device package is joined to a normal position of the lens unit.

  As described above, by using the effective characteristics of the package for a semiconductor device, it is possible to improve the mounting accuracy of the semiconductor element and to manufacture it relatively easily and practically.

As described above, according to the present invention, the inclination due to the warpage of the package body can be reliably and accurately detected without error by using the image recognition processing for the target mark.
As described above, the mounting accuracy of the semiconductor element can be improved, and the manufacture of a package for a semiconductor device that is relatively simple and excellent in practicality can be realized.

Further, by utilizing the effective characteristics of the semiconductor device package described above, it is possible to improve the mounting accuracy of the semiconductor element and to make it relatively easy and practical to manufacture.
As described above, the package for the semiconductor device and the lens block of the camera can be fixed with their optical axes easily aligned, and optical characteristics such as sensitivity unevenness and shading can be further stabilized.

Hereinafter, a semiconductor device package, a semiconductor device, a manufacturing method thereof, and a camera according to an embodiment of the present invention will be specifically described with reference to the drawings.
(Embodiment 1)
A semiconductor device package, a semiconductor device, a manufacturing method thereof, and a camera according to Embodiment 1 of the present invention will be described.

  1A and 1B are explanatory views of the structure of the package for a semiconductor device according to the first embodiment. FIG. 1A is a plan view, FIG. 1B is a side view, and FIG. FIG. 1 and FIG. 1 (d) are cross-sectional views along AA ′.

  The semiconductor device package according to the first embodiment has a configuration in which a target having a color tone difference is formed at the outermost corner position of the conventional semiconductor device package so as to coincide with the area provided as the mounting reference position. That is, as shown in FIG. 1, a container-like package body 2 in which a plurality of inner leads 1 and outer leads 1a are arranged has a semiconductor element and a wire (both not shown) in the center of the inner chamber of the package body 2. It is to be joined to the position. The package body 2 is formed by laminating and sintering three ceramic sheet materials having a predetermined shape, and the package basic structure is the same as that of the conventional example.

  This semiconductor device package is characterized in that targets 1b are provided at four locations of the outermost corner of the package body 2, and more specifically, a laminated structure of ceramic sheets shown in FIGS. 1 (b) and 1 (c). The uppermost layer 2a and the intermediate layer 2b are cut off at the corners while leaving an area required for sealing, and the lowermost layer 2C is cut out in the same manner as described above, but the outline of the substantially square corner, preferably within the outline. Cut at the area. After the lamination, the region has a hollow structure facing the corner cut portion as shown in FIG. 1, and the target mark 1b is formed.

  The semiconductor device package uses a ceramic sheet of about 0.3 mm thickness of a main component alumina (Al2O3), and a metallized film of the main component tungsten (W) is formed in a predetermined lead terminal pattern shape with a thickness of several tens of μm. After printing, a lamination sintering process is performed. Thereafter, the surface of the metallized film is subjected to a plating process (base: nickel, coating: gold) having a thickness of several μm. During these printings, the target mark 1b was also formed in the same pattern with a predetermined pattern.

  A package of a laminated structure of this kind of sintered ceramic has a tendency that the package surface is easy to tilt because the package warpage is large. For example, FIG. 2 shows a package body 2 which is an example of a warpage model (warping includes tile-curved, warped, valley warped, and a combination thereof). When set on a mounting equipment standard stage 11, a package surface reference line 12 is set. Tilts. In this case, since the mounted semiconductor element (not shown) depends on the surface of the equipment standard stage 11, an inclination defect occurs with respect to the package surface reference line 12.

  On the other hand, if it is mounted on the package body 2 of the package for a semiconductor device of the present embodiment, the target mark 1b is binarized and recognized by the image recognition unit attached to the mounting equipment to perform the focus processing. At this time, among the four positions, the predetermined three positions (because the surface inclination information is known at three measurement points) are recognized, the focus variation is determined by the threshold value, and the inclination deviation is built in the equipment. Adjustment and regulation are performed by an inclination correction mechanism (not shown).

  As a result, the predetermined three positions of the target mark 1b and the inclination of the semiconductor element surface are the same. At this time, the measurement may be performed by a laser method in addition to the image reading method. Since the target mark 1b is located at the outermost corner of the package body 2, the variation in the warp amount (including the tilt amount) is most likely to appear and is optimal for detection. At this time, the target mark 1b is gold, has a color tone difference from the brown color of the package body 2, has good binarization recognition, and has no recognition error.

  Further, since the target mark 1b is provided at a low position inward of each corner, it is guarded around and it is difficult for a recognition error due to chipping or the like to occur. The other is that the formation surface of the target mark 1b is the same laminated sheet as the mounting surface of the semiconductor element, so that there is an advantage that the accuracy of tilt information can be improved.

Next, the semiconductor device according to the first embodiment will be described.
3A and 3B are explanatory views of the structure of the semiconductor device according to the first embodiment. FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view taken along line AA ′. The semiconductor device according to the first embodiment uses the above-described package for a semiconductor device, and a semiconductor element 5 (in the embodiment, a solid-state imaging element) is mounted on the mounting portion at the center of the uppermost main surface of the stacked structure of the package body 2. Are fixed through an epoxy resin-based fixing agent 5a. From a predetermined position of the semiconductor element 5, a plurality of φ25 μm gold wires 6 are joined to predetermined positions of the inner lead 1 to ensure conductivity.

  On the main surface of the uppermost layer 2a of the package body 2, a lid 7 made of a glass plate having a thickness of about 0.5 mm is sealed with an epoxy resin adhesive 7a. As a result, the semiconductor device manufactured with such a structure can make the inclination of the semiconductor element surface the same as the predetermined three positions of the target mark 1b as described with reference to FIG.

Next, the camera of the first embodiment will be described.
FIG. 4 is an explanatory diagram of the structure of the lens block at the heart of the camera according to the first embodiment. FIG. 4A is a sectional view taken along the line BB ′ of FIG. FIG. 4B is a bottom view. As shown in FIG. 4, the main part of the camera of the present embodiment includes a lens block 8, an optical lens 9 fixed to the upper part of the central through hole, and a support part 8 a (package body 2 fixed to the lower part of the through hole). Part to be made up of. As shown in FIG. 4 (a), the support portion 8a is provided with a support portion of the package body 2, i.e., the target mark 1b forming surface, which is closely contacted to a predetermined position in the plane direction (→ in the figure) and is side-faced. It is fixed with fixing material.

  Thus, the lens block 8 constructed and assembled has the distance between the optical lens 9 and the package body 2 (including the solid-state imaging device) and the center position matching as designed, and the features of the present embodiment. By matching the inclinations of the target mark 1b and the surface of the semiconductor element 5 (or solid-state image sensor), the optical axes of the optical lens 9 and the solid-state image sensor are matched, so that the incident light 10 is received by the solid-state image sensor. Can be controlled and received as designed.

As a result, optical characteristics such as uneven sensitivity and shading can be stabilized by easily matching and fixing the optical axes of the two.
For reference, the conventional structure is shown in FIG. The difference in the conventional structure is that the support portion 8 is aligned with the surface of the package body 2 and then adjusted to a predetermined position in the plane direction, but the inclination of the surface of the semiconductor element 5 (or solid-state imaging element) is not adjusted. Therefore, it is necessary to fix the package body 2 separately while performing the tilt inspection.
(Embodiment 2)
A semiconductor device package, a semiconductor device, a manufacturing method thereof, and a camera according to a second embodiment of the present invention will be described.

  6A and 6B are explanatory views of the structure of the semiconductor device package according to the second embodiment. FIG. 6A is a plan view, FIG. 6B is a side view, and FIG. 6C is a side surface on the outer lead forming side. FIG. 6D is a cross-sectional view taken along the line AA ′.

  The semiconductor device package of the present embodiment is characterized in that the formation position of the target mark 1b is different from that of the first embodiment. That is, in the first embodiment, the formation position of the target mark 1b is the lowermost layer 2C which is the same surface as the semiconductor element, whereas in the present embodiment, this position is the intermediate layer 2b which is the same surface as the formation of the inner lead 1. Consists of the structure.

  The feature of the above-described configuration is that the inner lead 1 and the target mark 1b are on the same surface, so that the formation of the metallized film can be integrated only by renewing the printing plate. (Strictly speaking, it may be slightly different from the semiconductor element mounting surface in terms of accuracy, but it is basically regarded as equivalent).

  Next, as a feature of the semiconductor device and the camera using the above package for a semiconductor device, the structure in which the position of the support portion 8 matches the formation position of the target mark 1b with respect to the first embodiment due to the configuration. It is a point.

Therefore, the same effect as in the first embodiment can be obtained.
As described above, the description has been given in each embodiment, but the formation of the target mark is not limited to the description, and for example, it can be carried out equally even if it is formed by application of a coating material for a mark or a vapor deposition film. An effect is obtained. Further, it is obvious that the target mark only needs to have a color tone difference with the package body.

  Moreover, although the formation position of the target mark is described as a corner, even if it is formed with a recess structure with the same notch on the outermost side opposite to each other (at least three in the example of a substantially quadrilateral, it is necessary to determine the inclination) It is clear that it is useful for tilt detection, and an effect according to each embodiment can be obtained.

  In addition, the shape of the target mark is described in the case where the cut portion is used over the entire surface. However, for example, even if the cut portion is formed in a pattern such as an L shape or a cross shape, image recognition is possible. It is clear that anything is fine.

  The semiconductor device package, the semiconductor device, the manufacturing method thereof, and the camera of the present invention can improve the mounting accuracy of the semiconductor element, and realize the manufacture of the semiconductor device package that is relatively simple and excellent in practicality. In addition, the semiconductor device package and the camera lens block can be fixed with their optical axes easily aligned, and optical characteristics such as uneven sensitivity and shading can be further stabilized. Thus, it can be applied to a digital camera or the like in which a semiconductor element is mounted or a solid-state imaging element is incorporated as a semiconductor element.

Structure explanatory drawing of the package for semiconductor devices of Embodiment 1 of this invention Explanatory drawing of the curvature of the package body in the package for semiconductor devices of Embodiment 1 Structure explanatory drawing of the semiconductor device of the first embodiment Structure explanatory diagram of the lens block in the camera of the first embodiment Explanation of lens block structure in a conventional camera Structure explanatory drawing of the package for semiconductor devices of Embodiment 2 of this invention Structure explanatory diagram of conventional package for semiconductor device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inner lead 1a Outer lead 1b Target mark 2 Package body 2a Top layer 2b Middle layer 2c Bottom layer 3 Upper surface 31 Color 4 Burr 5 Semiconductor element (or solid-state image sensor)
5a Fixing agent 6 Wire 7 Lid 7a Adhesive 8 Lens block 8a Supporting part 9 Lens 10 Incident light 11 Equipment regulation stage 12 Package surface reference line

Claims (19)

  A mounting portion of the semiconductor element is formed in the laminated structure of the sintered ceramic, and an opening portion is formed in the uppermost layer of the laminated structure, the opening portion following the mounting portion, and the semiconductor element is electrically connected to the inner peripheral portion of the opening portion. Package for a semiconductor device provided with a plurality of lead terminals to be connected to each other, for detecting the position or inclination of the laminated structure in the planar outer corner or the outermost periphery of the layer excluding the uppermost layer of the laminated structure The target mark is selectively disposed, and the target mark is disposed in a state in which the target mark can be directly viewed from the main surface side having the opening in the uppermost layer of the stacked structure.   2. The package for a semiconductor device according to claim 1, wherein the target mark is formed so as to have at least a difference in color tone or brightness from the package body.   2. The package for a semiconductor device according to claim 1, wherein the target mark is formed as a whole area or a geometric pattern at least at a predetermined formation position.   2. The package for a semiconductor device according to claim 1, wherein the target mark is selectively disposed on at least the same surface as a mounting portion forming surface of a semiconductor element installed in the package body.   2. The package for a semiconductor device according to claim 1, wherein the target mark has a dent at least inside the outer shape of the package body and is formed on a surface surrounded by the dent.   6. The package for a semiconductor device according to claim 5, wherein the recesses are formed at least at three or more opposing locations in the vicinity of the planar outer shape or the outer periphery of the package body.   The package for a semiconductor device according to claim 1, wherein the target mark is selectively formed on at least the package body with a metallized layer formed by printing and baking processing.   The package for a semiconductor device according to claim 1, wherein the target mark is formed by selectively applying a marking coating agent to at least the package body.   A mounting portion of the semiconductor element is formed in the laminated structure of the sintered ceramic, and an opening portion is formed in the uppermost layer of the laminated structure, the opening portion following the mounting portion, and the semiconductor element is electrically connected to the inner peripheral portion of the opening portion. A method of manufacturing a package for a semiconductor device provided with a plurality of lead terminals connected to each other, wherein the position of the stacked structure or the vicinity of the planar outer corner of the layer excluding the uppermost layer of the stacked structure or near the outermost periphery A package for a semiconductor device, wherein a target mark for tilt detection is selectively disposed, and the target mark is disposed in a state in which the target mark can be directly viewed from a main surface side having an opening in the uppermost layer of the stacked structure. Manufacturing method.   10. The method of manufacturing a package for a semiconductor device according to claim 9, wherein the target mark is formed so as to have a difference in color tone or brightness from the package body.   10. The method for manufacturing a package for a semiconductor device according to claim 9, wherein the target mark is formed as an entire area or a geometric pattern at least at a predetermined formation position.   10. The method for manufacturing a package for a semiconductor device according to claim 9, wherein the target mark is selectively disposed on at least the same surface as a mounting portion forming surface of a semiconductor element installed in the package body.   10. The method of manufacturing a package for a semiconductor device according to claim 9, wherein the target mark is formed in a surface at least inside the outer shape of the package body and surrounded by the recess.   14. The method for manufacturing a package for a semiconductor device according to claim 13, wherein the recesses are formed at least at three or more opposing locations in the vicinity of the planar outer shape or the outer periphery of the package body.   15. The semiconductor device package according to claim 9, wherein the target mark is selectively formed on at least the package body with a metallized layer by printing and baking processing. Method.   15. The method for manufacturing a package for a semiconductor device according to claim 9, wherein the target mark is formed by selectively applying a marking coating agent to at least the package body.   The semiconductor element is mounted at a predetermined position of the semiconductor element mounting portion in the semiconductor device package according to any one of claims 1 to 8 so as to depend on an inclination mode detected by the target mark, A semiconductor device comprising: a semiconductor element and a plurality of lead terminals connected by a conductive wire; and an opening of the uppermost layer of the laminated structure is closed.   17. The semiconductor device package manufactured by the method for manufacturing a semiconductor device package according to claim 9, wherein the predetermined position of the semiconductor element mounting portion depends on an inclination mode detected by the target mark. And mounting the semiconductor element, connecting the semiconductor element and the plurality of lead terminals with a conductive wire, and then closing the opening of the uppermost layer of the stacked structure. Production method.   18. The semiconductor device according to claim 17, wherein the semiconductor element is a solid-state imaging element, and the semiconductor element is aligned with a lens unit including an external light condensing lens with respect to the optical axis. A camera configured such that a target mark arrangement surface in an apparatus package is bonded to a normal position of the lens unit.

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