JP2005317613A5 - - Google Patents
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- Publication number
- JP2005317613A5 JP2005317613A5 JP2004131045A JP2004131045A JP2005317613A5 JP 2005317613 A5 JP2005317613 A5 JP 2005317613A5 JP 2004131045 A JP2004131045 A JP 2004131045A JP 2004131045 A JP2004131045 A JP 2004131045A JP 2005317613 A5 JP2005317613 A5 JP 2005317613A5
- Authority
- JP
- Japan
- Prior art keywords
- blended
- examples
- dimethylformaldehyde
- monochlorobenzene
- mibk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004131045A JP2005317613A (ja) | 2004-04-27 | 2004-04-27 | 半導体装置用接着剤シートおよびそれを用いた半導体装置用部品ならびに半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004131045A JP2005317613A (ja) | 2004-04-27 | 2004-04-27 | 半導体装置用接着剤シートおよびそれを用いた半導体装置用部品ならびに半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011201348A Division JP2012044193A (ja) | 2011-09-15 | 2011-09-15 | 半導体装置用接着剤シートおよびそれを用いた半導体装置用部品ならびに半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005317613A JP2005317613A (ja) | 2005-11-10 |
| JP2005317613A5 true JP2005317613A5 (enExample) | 2007-05-31 |
Family
ID=35444744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004131045A Pending JP2005317613A (ja) | 2004-04-27 | 2004-04-27 | 半導体装置用接着剤シートおよびそれを用いた半導体装置用部品ならびに半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005317613A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BRPI0916046A2 (pt) * | 2008-11-06 | 2015-11-10 | Dow Global Technologies Llc | estrutura em multicamada e módulo de dispositivo eletrônico |
| JP5950572B2 (ja) * | 2011-12-28 | 2016-07-13 | ニチバン株式会社 | 打ち抜き・絞り加工用表面保護粘着シート |
| CN104302723A (zh) * | 2012-05-30 | 2015-01-21 | 东丽株式会社 | 带有凸块电极的半导体器件制造用粘合剂片材及半导体器件的制造方法 |
| JP2017088759A (ja) * | 2015-11-11 | 2017-05-25 | リンテック株式会社 | 接着シート |
| JP7687358B2 (ja) * | 2023-03-02 | 2025-06-03 | 味の素株式会社 | 回路基板の製造方法及び樹脂シート |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003183606A (ja) * | 2001-12-20 | 2003-07-03 | Tomoegawa Paper Co Ltd | フレキシブル回路基板用接着テープおよびその製造方法 |
| JP2004022567A (ja) * | 2002-06-12 | 2004-01-22 | Toray Ind Inc | 半導体用接着剤シートおよびそれを用いた半導体集積回路接続用基板、半導体装置 |
-
2004
- 2004-04-27 JP JP2004131045A patent/JP2005317613A/ja active Pending
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