JP2005311054A - Multilayer flexible circuit board and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method that can effectively prevent adhesive interlayer insulating resin from flowing out to a hole for the post processes of a buildup type multilayer circuit board and to a cable section and is satisfactory in productivity, and to provide the buildup-type multilayer circuit board having satisfactory productivity. <P>SOLUTION: For the method for manufacturing a multilayer board composed by laminating copper foil 1 onto a circuit member via the adhesive interlayer insulating resin layer 3, in the method for manufacturing the multilayer flexible circuit board, a dam 2 prevents flowout of the adhesive interlayer insulating resin layer caused by softening of the adhesive interlayer insulating resin layer, and is formed on the side of the copper foil. The adhesive interlayer insulating resin layer whose unwanted portion is eliminated, in advance, is aligned for temporarily putting on the surface of the dam on the copper foil for laminating to the circuit member. At time, the dam 13 may be formed on the circuit member. The buildup-type multilayer flexible circuit board is used for the manufacturing methods and has the dam 2 for preventing the flowout, caused by the softening of the adhesive interlayer insulating resin layer 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a multilayer flexible circuit board and a manufacturing method thereof, and more particularly to a multilayer flexible circuit board having a flexible cable portion and a manufacturing method of a build-up type multilayer flexible circuit board.

  In recent years, downsizing and higher functionality of electronic devices have been increasingly promoted, and for this reason, there is an increasing demand for higher density of circuit boards. In view of this, the circuit board is made to be a multi-layer circuit board from one side to both sides or three or more layers to increase the density of the circuit board.

  As part of this, a separate flexible wiring board that connects between multilayer flexible circuit boards and hard circuit boards on which various electronic components are mounted via connectors, etc., and a flexible cable unit that integrates a flexible flat cable. A multilayer flexible circuit board is developed, and is widely spread mainly in small electronic devices such as mobile phones.

  A typical structure of a multilayer flexible circuit board consists of a double-sided or single-sided flexible wiring board as an inner layer, a flexible or hard base circuit board as an outer layer, and a through-hole connection by plating or the like to provide 4 to 8 layers. It is a multi-layer flexible circuit board of a degree. In order to achieve high-density mounting, a build-up type multilayer flexible circuit board having a multilayer flexible circuit board as a core substrate and having about one or two build-up layers on both sides or one side has been put into practical use.

  In Patent Document 1, in order to prevent the adhesive from flowing out to a cavity for mounting a component by soldering through a through hole or a retaining hole for passing a power supply pin, a thermosetting type is used. A method of thermally curing the periphery of the opening with a laser, a hot knife, a heated jig, or the like before the lamination press and a method of forming a wall with a resist on the substrate are described. However, this method requires complicated steps and jigs and has a problem in productivity.

  Patent Document 2 describes a method in which large and small circular dams are provided in the inner layer of a multilayer flexible circuit board for the purpose of preventing outflow due to softening of an adhesive interlayer insulating resin layer and preventing the generation of air voids. However, since this method has a cover on the cable portion, it cannot be applied to the end face where the cable portion is pulled out from the rigid board.

In this case, in order to provide the flexible cable portion in the multilayer flexible circuit board, as described in Patent Documents 1 and 2, the outer layer circuit board that is not a flexible cable portion is punched out. We perform so-called window opening processing by processing or router processing. For this purpose, it is necessary to remove the non-adhesive portion that becomes the flexible cable portion of the adhesive interlayer insulating resin layer by punching in advance using a punching die.
Japanese Patent No. 2631287 Japanese Patent No. 3427011 Japanese Patent Laid-Open No. 2002-141664 JP-A-9-293966

  Here, problems in manufacturing a build-up type multilayer flexible circuit board will be described. Patent Documents 3 and 4 describe that an adhesive interlayer insulating resin between layers flows out to the peripheral edge of the substrate due to heat and pressure during lamination pressing. When the adhesive interlayer insulation resin flows out to the peripheral edge of the board, holes required in the subsequent process are blocked, and in the case of a build-up type multilayer flexible circuit board, it flows out to the cable part, which is an outflow prohibition area. ing.

  First, in Patent Document 3, a thermosetting resin is used as the adhesive interlayer insulating resin, and a portion corresponding to the outflow prohibited region is thermally cured in advance using a laser, a hot knife, a heated jig, or the like before the lamination press. A method is described. For example, this corresponds to the end face where the cable portion is pulled out from the rigid board. However, this method requires complicated steps and jigs and has a problem in productivity.

  Next, Patent Document 4 describes a method in which large and small circular dams are provided on the inner layer of a multilayer flexible circuit board for the purpose of preventing the adhesive interlayer insulating resin layer from flowing out and preventing the generation of air voids. However, in this method, since the cable portion has a cover, it is problematic in that it cannot be applied to the end face where the cable portion is pulled out from the rigid board.

  The present invention has been made in consideration of the above-mentioned points, and can effectively prevent outflow of the adhesive interlayer insulating resin layer to the post-process hole and cable part of the build-up type multilayer flexible circuit board. Furthermore, it is an object of the present invention to provide a manufacturing method with high productivity and a build-up type multilayer circuit board with high productivity.

  In order to achieve the above object, the present invention provides the following manufacturing method and circuit board.

  First, in a first aspect of the present invention, in a method for manufacturing a multilayer substrate in which a copper foil is laminated on a circuit member via an adhesive interlayer insulating resin layer, the adhesive interlayer insulating resin layer is softened on one side of the copper foil. A dam for preventing outflow is formed, an adhesive interlayer insulating resin layer from which unnecessary portions have been removed in advance is aligned, temporarily attached to the surface having the dam on the copper foil, and laminated on a circuit member A method for producing a multilayer flexible circuit board.

  Next, according to a second aspect of the present invention, there is provided a multilayer substrate manufacturing method in which a copper foil is laminated on a circuit member via an adhesive interlayer insulating resin layer. A dam to be prevented is formed, an adhesive interlayer insulating resin layer from which unnecessary portions have been removed in advance is aligned, temporarily attached on the copper foil, and this is laminated on the surface of the circuit member having the dam. A method for manufacturing a multilayer flexible circuit board.

  Furthermore, the third invention is a build-up type multilayer flexible circuit board having a large number of conductive layers and adhesive interlayer insulating resin layers, and a peripheral edge of the build-up layer formed by laminating a copper foil on the adhesive interlayer insulating resin layer A build-up type multilayer flexible circuit board and an inner layer board thereof having a dam standing on the copper foil and preventing outflow due to softening of the adhesive interlayer insulating resin layer.

  Due to these features, the present invention has the following effects.

  According to the present invention, a dam that prevents the adhesive interlayer insulating resin layer from flowing out on one side of the copper foil is formed, and the adhesive interlayer insulating resin layer from which unnecessary portions have been removed in advance is aligned to form a dam on the copper foil. Since it is manufactured by temporarily attaching it to the surface with the layer and laminating it on the circuit member, it prevents the outflow due to the softening of the adhesive interlayer insulation resin to the holes and cables in the post-process of the build-up type multilayer flexible circuit board. While preventing, dust generation from the end surface of the adhesive interlayer insulating resin layer can be prevented. For this reason, it becomes possible to provide a build-up type multilayer flexible circuit board inexpensively and stably, which has been difficult with the conventional method.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a process diagram showing a manufacturing method of a build-up type multilayer flexible circuit board according to a first embodiment of the present invention. In this step, first, as shown in FIG. 1A, a non-conductive paste is printed on the copper foil 1, thereby providing a dam 2 that prevents the adhesive interlayer insulating resin layer 3 from flowing out due to softening.

  A dam can also be formed by the electrodeposition method, and in this case, a resist layer for forming the electrodeposition dam is required separately. As the electrodeposition material, electrodeposited polyimide is preferable. The height of the dam may be higher or lower than the thickness of the adhesive interlayer insulating resin layer 3. Preferably, the height is half to twice the thickness of the adhesive interlayer insulating resin layer 3. If necessary, in order to improve the adhesion between the copper foil 1 and the adhesive interlayer insulating resin layer 3, a roughening treatment or the like can be performed on the surface of the copper foil.

  Next, as shown in FIG. 1 (2), an adhesive interlayer insulating resin layer 3 punched with a die or the like is positioned and temporarily attached to the copper foil surface on which the dam 2 is erected. As the adhesive interlayer insulating resin layer 3, for example, an epoxy prepreg in which a glass fiber is impregnated with an epoxy resin can be applied. In this case, the size of the adhesive interlayer insulating resin layer 3 is determined by temporarily attaching the adhesive interlayer insulating resin layer 3 to the inner side of the dam 2 in consideration of the outflow amount of the adhesive interlayer insulating resin layer 3 and the positioning accuracy of the temporary attachment. 4.

  Subsequently, as shown in FIG. 1 (3), an inner layer circuit board 8 having a cover 6 on the circuit pattern 5 and a portion of which is a cable portion 7 is formed in advance in a separate process and prepared. Thereafter, as shown in FIG. 1 (4), the build-up layer 4 of FIG. 1 (2) is attached to the adhesive interlayer insulating resin layer 3 on the inner circuit board 8 having the cable portion 7 of FIG. Laminate through.

  Next, as shown in FIG. 2 (5), a conduction hole 9 for connecting the inner layer circuit to the outer layer circuit is formed by laser processing or the like. Subsequently, as shown in FIG. 2 (6), after conducting the conductive treatment on the conduction hole 9, a plated metal layer surface 10 including a via hole is formed by electroplating.

  Thereafter, as shown in FIG. 2 (7), the circuit pattern 11 is formed on the plated metal layer surface 10 by using an etching method based on a normal photofabrication method. Thereafter, the build-up type multilayer flexible circuit board 12 is obtained by subjecting the substrate surface to surface treatment such as formation of a photo solder resist layer, solder plating, nickel plating, gold plating or the like as necessary, and performing external processing.

  2 (7) is also a cross-sectional view showing the structure of the multilayer flexible circuit board according to the present invention, and a dam 2 is erected on the copper foil 1 of the buildup layer 4 of the buildup type multilayer flexible circuit board 12. FIG. It has the structure to do. The dam 2 can prevent outflow to the peripheral edge of the substrate and suppress dust generation from the cut surface of the adhesive interlayer insulating resin layer 3.

  FIG. 2 is a process diagram showing a method for manufacturing a buildup type multilayer flexible circuit board according to a second embodiment of the present invention. In this step, first, as shown in FIG. 3A, an inner layer circuit board 8 having a cover 6 on a circuit pattern 5 and a part of which is a cable portion 7 is formed in advance in a separate step and prepared. To do.

  Next, as shown in FIG. 3 (2), a dam 13 for preventing the adhesive interlayer insulating resin layer 3 from flowing out is provided on the cover 6 of the inner circuit board shown in FIG. 3 (1) by printing.

  The dam 13 can also be formed by the electrodeposition method, and in that case, a resist layer and a seed layer for forming the electrodeposition dam are separately required. As the electrodeposition material, electrodeposited polyimide is preferable.

  The height of the dam 13 may be higher or lower than the thickness of the adhesive interlayer insulating resin layer 3. Preferably, the height is half to twice the thickness of the adhesive interlayer insulating resin layer 3.

  Subsequently, as shown in FIG. 3 (3), the adhesive interlayer insulating resin layer 3 punched and processed with a mold or the like is aligned with the copper foil 1 and temporarily attached to form a buildup layer 14. As the adhesive interlayer insulating resin layer 3, for example, an epoxy prepreg in which a glass fiber is impregnated with an epoxy resin can be applied. The size of the adhesive interlayer insulating resin layer 3 at this time is temporarily attached to a position on the inner side of the dam 13 in consideration of the outflow amount due to softening of the adhesive interlayer insulating resin layer 3 and the positioning accuracy of the temporary attachment. To do.

  Thereafter, as shown in FIG. 3 (4), the build-up layer 14 of FIG. 3 (2) is attached to the inner layer substrate 8 having the cable portion 7 and the dam 13 of FIG. Laminate through layer 3.

  Next, as shown in FIG. 4 (5), a conduction hole 9 for connecting the inner layer circuit to the outer layer circuit is formed by laser processing or the like. Next, as shown in FIG. 4 (6), after conducting the conductive treatment on the conduction hole 9, the plated metal layer surface 10 including the via hole is formed by electroplating. Next, as shown in FIG. 4 (7), a circuit pattern 11 is formed on the plated metal layer surface 10 by using an etching method based on a normal photofabrication method.

  Subsequently, a build-up type multilayer flexible circuit board 15 is obtained by subjecting the substrate surface to surface treatment such as formation of a photo solder resist layer, solder plating, nickel plating, and gold plating as necessary, and performing external processing.

  4 (7) is a cross-sectional view showing the structure of the multilayer flexible circuit board according to the present invention, in which the dam 13 is erected from the cover 6 of the inner circuit board of the build-up type multilayer flexible circuit board 15. FIG. have. The dam 13 can prevent outflow to the peripheral edge of the substrate, and can suppress dust generation from the cut surface of the adhesive interlayer insulating resin layer 3.

FIG. 3 is a process chart showing steps (1) to (4) in the first embodiment of the present invention. FIG. 5 is a process chart showing steps (5) to (7) in the first embodiment of the present invention. Process drawing which shows process (1) thru | or (4) in 2nd Example of this invention. Process drawing which shows process (5) thru | or (7) in 2nd Example of this invention.

Explanation of symbols

1 copper foil layer, 2 dam, 3 adhesive interlayer insulation resin layer, 4 buildup layer,
5 circuit pattern, 6 cover, 7 circuit board cable part, 8 inner circuit board,
9 conduction hole, 10 plated metal layer, 11 circuit pattern,
12 Build-up type multilayer flexible circuit board, 13 dam,
14 Build-up layer, 15 Build-up type multilayer flexible circuit board.

Claims (5)

In the manufacturing method of the multilayer substrate formed by laminating the copper foil through the adhesive interlayer insulating resin layer on the circuit member,
Forming a dam that prevents the adhesive interlayer insulating resin layer from flowing out on one side of the copper foil,
Align the adhesive interlayer insulation resin layer from which unnecessary portions have been removed in advance and temporarily attach it to the surface of the copper foil dam,
This is laminated | stacked on the said circuit member. The manufacturing method of the multilayer flexible circuit board characterized by the above-mentioned. In the manufacturing method of the multilayer substrate formed by laminating the copper foil through the adhesive interlayer insulating resin layer on the circuit member,
Forming a dam on the surface of the circuit member to prevent outflow due to softening of the adhesive interlayer insulating resin layer,
The adhesive interlayer insulating resin layer from which unnecessary portions have been removed in advance is aligned and temporarily attached to the copper foil,
A method for producing a multilayer flexible circuit board, comprising: laminating on a surface of the circuit member having the dam. In the manufacturing method of the multilayer flexible circuit board according to claim 1 or 2,
The method for producing a multilayer flexible circuit board, wherein the dam is formed on at least one of the copper foil and the circuit member by at least one of printing and electrodeposition. In a build-up type multilayer flexible circuit board having a large number of conductive layers and adhesive interlayer insulating resin layers,
In the peripheral part of the build-up layer formed by laminating a copper foil on the adhesive interlayer insulating resin layer, a dam is provided to prevent the outflow due to the softening of the adhesive interlayer insulating resin layer standing on the copper foil. Build-up type multilayer flexible circuit board. In an inner layer substrate for constituting a build-up type multilayer flexible circuit board having a large number of conductive layers and adhesive interlayer insulating resin layers,
A plurality of circuit forming units;
An inner layer substrate for a build-up type multilayer flexible circuit board, comprising a dam provided on an outer peripheral portion of the multilayer flexible circuit board in the circuit forming portion to prevent outflow due to softening of the adhesive interlayer insulating resin layer.

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