JP2005310446A - Manufacturing method of plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a PDP hardly causing failure covering a phosphor layer when an electrode is formed on a top part of a barrier rib. <P>SOLUTION: In this manufacturing method of a plasma display panel, a front substrate 90 and a back substrate 91 are installed oppositely to each other by interposing a discharge space therebetween; a plurality of barrier ribs 106 are formed in parallel with one another on a surface facing to the front substrate 90 of the back substrate 91; and a plurality of discharge cells are arranged along the barrier ribs 106. The manufacturing method includes: a transfer step for transferring a guide electrode precursor 202 formed on a surface of a support film 201 to top parts 106a of the barrier ribs 106; and a heating step for heating the guide electrode precursor 202 transferred to the top parts 106a of the barrier ribs 106 to form guide electrodes 108. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plasma display panel (hereinafter referred to as “PDP”), and more particularly to a technique for improving the yield when electrodes are formed on the tops of partition walls.

In recent years, plasma display panels (hereinafter referred to as “PDP”) in display devices used in computers and televisions have attracted attention as display devices that are large, thin, and lightweight.
FIG. 8 is a schematic diagram of a general AC type (AC type) PDP 1000.
The PDP 1000 includes a front plate 1090 and a back plate 1091 that are disposed with their main surfaces facing each other.

The front plate 1090 includes a front glass substrate 1101, display electrodes 1102, a dielectric layer 1123, and a protective layer 1114.
The front glass substrate 1101 is a glass substrate serving as a base of the front plate 1090, and display electrodes 1102 and 1103 including transparent electrodes and bus electrodes are formed on the front glass substrate 1101.

The surface of the front glass substrate 1101 on which the display electrodes 1102 and 1103 are formed is covered with a dielectric layer 1123 and further covered with a protective layer 1114.
The back plate 1091 is a fluorescent light formed on the wall surface of the back glass substrate 1051, the address electrode 1107, the dielectric layer 1123, the partition 1106, and the gap between adjacent partitions 1106 (hereinafter referred to as “partition groove”). A body layer 1115.

The front plate 1090 and the back plate 1091 are overlapped and sealed with a sealing material (not shown) to form a discharge space inside.
A discharge gas is sealed in the discharge space.
The vicinity of a region where a pair of adjacent display electrodes 1102 and 1103 and one address electrode 1107 intersect three-dimensionally across the discharge space is a cell that contributes to image display.

In one cell, two electrodes forming a pair, that is, a display electrode 1102 and a display electrode 1103 are arranged in parallel.
In the discharge space, the phosphor layer 1115 is irradiated with ultraviolet rays generated by the sustain discharge, whereby the ultraviolet rays are converted into visible light, the cells are turned on, and an image is displayed.
By the way, the place where the front plate 1090 and the back plate 1091 are closest to each other is in the vicinity of the top portion 1106a of the partition wall 1106 (hereinafter referred to as “gap portion”).

Although it is desirable that there is no gap in the gap portion, in practice, a gap of about 10 μm at maximum may occur due to a manufacturing error or the like, and an error called so-called crosstalk occurs between the gap and an adjacent cell. Discharge may occur.
In recent years, techniques for preventing the occurrence of such crosstalk have been developed. For example, an electrode is disposed on a discharge path when crosstalk occurs to provide a potential barrier to prevent crosstalk. There is PDP. (For example, Patent Document 1)
In the PDP of Patent Document 1, a fourth electrode is provided between adjacent display electrodes belonging to different cells in parallel with the display electrode, and crosstalk that occurs in a direction perpendicular to the longitudinal direction of the display electrode is generated. It is preventing.

Taking the above-mentioned known technique as a hint, a fourth electrode is formed on the surface of the front plate 1090 facing the top 1106a of the partition wall 1106, that is, the protective layer 1114, and crosstalk that proceeds in the longitudinal direction of the display electrode, that is, It is conceivable to prevent the occurrence of crosstalk using the gap portion as a discharge path.
Thus, by forming the fourth electrode on the front plate, crosstalk that proceeds in the longitudinal direction of the display electrode can be prevented. However, when the front plate and the back plate are combined, the fourth electrode on the front plate is used. If the arrangement position of the electrode and the arrangement position of the partition wall on the back plate do not match, the position of the fourth electrode may enter the cell, impeding the transmission of the emitted light and reducing the light emission efficiency. is there.

Therefore, it is conceivable to dispose the fourth electrode 1108 on the top 1106a of the partition wall 1106 on the back plate to eliminate the influence of the combination error so as not to cause the above-described decrease in light emission efficiency.
JP 2001-34228 A

  In the case where the fourth electrode is formed on the top portion 1106a of the partition wall 1106, after the phosphor layer 1115 is formed on the side surface portion of the partition wall 1106, screen printing, a dispenser, or the like is used as shown in FIG. Generally, paste or ink (hereinafter referred to as “conductive material”) containing a conductive material such as Ag particles as a base material is applied to the top of the partition wall and fired. Was found to occur.

  That is, the width of the partition wall 1106 is usually as narrow as about 40 μm, and the applied conductive material 1108a hangs down from the top 1106a of the partition wall 1106 and is formed on the side surface or the bottom surface of the partition wall 1106 as shown in FIG. The phosphor layer 1115 may be covered. As described above, when the conductive material 1108a covers the surface of the phosphor layer 1115, the conductive material 1108a usually contains a light-shielding metal, and thus the luminous efficiency of the phosphor layer 1115 is reduced. Become.

  The present invention has been made to solve such a problem, and when an electrode is formed on the top of a partition wall, it is difficult to cause a defect that the electrode covers the phosphor layer, and a method for manufacturing a PDP is provided. Objective.

In order to achieve the above object, a method of manufacturing a plasma display panel according to the present invention is characterized by the following.
(1) A first substrate and a second substrate are opposed to each other with a discharge space interposed therebetween, and a plurality of barrier ribs are juxtaposed on a surface of the second substrate facing the first substrate, along the barrier ribs. A method of manufacturing a plasma display panel in which a plurality of discharge cells are provided, a transfer step of transferring a transfer layer containing a conductive material formed on the surface of a transfer material holder to the top of the partition, and a transfer Heating the transfer layer to form a conductor layer.
(2) In the method of manufacturing a plasma display panel according to (1), an application step of applying a phosphor to at least a side surface of the partition before the transfer step, and a phosphor applied to the side of the partition A step portion forming step of forming a step portion on the phosphor by removing or deforming a part of the phosphor.
(3) In the method for manufacturing a plasma display panel according to (2), in the step forming step, an adhesive elastic body is pressed against the top of the partition and the periphery thereof, and the fluorescence applied to the side of the partition A part of the body is attached to the surface.
(4) In the method for manufacturing a plasma display panel according to (2), in the stepped portion forming step, an elastic body is pressed against the top of the partition and the periphery thereof, and a part of the phosphor applied to the side surface of the partition Deform.
(5) In the method for producing a plasma display panel according to (3) or (4), the elastic body is a cylindrical or cylindrical rotatable roller, and while pressing the roller against the top of the partition wall, The step is formed by moving.
(6) In the method for manufacturing a plasma display panel according to (2), in the step forming step, the roller having a protrusion provided on the surface thereof is pressed against the top of the partition while rotating, and is applied to the side of the partition. Part of the applied phosphor is scraped off.
(7) In the method for manufacturing a plasma display panel according to (6), the protrusion is raised on the roller surface.

In general, a transfer layer transferred by transfer printing is less fluid than ink or paste used in a dispenser, a screen printing method, or the like.
With the configuration (1), the transfer layer containing a conductive material that is difficult to flow is transferred to the top of the partition wall, and thus the transfer layer is unlikely to sag from the top of the partition wall.
That is, it is difficult for the conductor layer formed on the top of the partition wall, that is, the electrode to cover the phosphor layer.

  According to the configuration of (2), since the side surface of the phosphor has a stepped portion, the transfer layer including the transferred conductive material after the barrier ribs and the phosphor layer are formed on the second substrate should be fluid. Even if it hangs down from the top of the partition wall to the side surface of the partition wall along the partition wall surface, the sag is suppressed by the step part, so that it is more than the step part of the phosphor layer. In the lower region, the phosphor layer surface is prevented from being covered with the material.

By the way, in the side part of the partition wall above the step part, there may be a case where no phosphor layer is present or a case where the phosphor layer is slightly left. Has a deterrent effect.
According to the configuration of (3), since the surface of the elastic body has adhesiveness, when the elastic body is pressed against the phosphor, a part of the phosphor is peeled off, and the step portion is Will be formed.

According to the configuration of (4), the step portion is formed by deforming a part of the phosphor. Therefore, generation of waste is avoided, and it is necessary to provide a post-processing step such as removal of waste. Absent.
According to the configuration (5), a step is easily formed on the phosphor by moving the roller against the top of the partition wall.

According to the configuration (6), the roller is rotated and moved while being pressed against the top of the partition wall, whereby a step portion is easily formed on the phosphor.
With the configuration (7), the raised hairs scrape the phosphor, so that the stepped portion is efficiently formed.

(Embodiment 1)
(Constitution)
Embodiment 1 of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic diagram of PDP 100 according to Embodiment 1 of the present invention.
The PDP 100 is composed of a front plate 90 and a back plate 91 that are disposed with their main surfaces facing each other.

In the figure, the z direction corresponds to the thickness direction of the PDP, and the xy plane corresponds to a plane parallel to the PDP surface.
The front plate 90 includes a front glass substrate 101, display electrodes 102 and 103, a dielectric layer 113, and a protective layer 114.
The front glass substrate 101 is a glass substrate serving as a base of the front plate 90, and display electrodes 102 and 103 are formed on the front glass substrate 101.

Each of the display electrodes 102 and 103 is formed by laminating a bus electrode made of a conductive material containing Ag on a transparent electrode in which a plurality of conductive metal oxides such as ITO, SnO ₂ , or ZnO are formed in a row.
Here, when attention is paid to one cell, the two display electrodes 102 and 103 cross the inside of the cell.

The dielectric layer 113 is a layer made of a dielectric material that covers the entire surface of the front glass substrate 101 on which the display electrodes 102 and 103 are formed. Generally, lead-based low-melting glass is used, but bismuth is used. Alternatively, a low melting point glass or a laminate of a lead low melting point glass and a bismuth low melting point glass may be used.
The protective layer 114 is a thin film made of magnesium oxide (MgO) and covers the entire surface of the dielectric layer 113.

The back plate 91 includes a back glass substrate 105, an address electrode 107, a dielectric layer 123, a partition wall 106, a phosphor layer 115, and a guide electrode 108 as an example of a conductor layer.
Incidentally, the guide electrode 108 corresponds to the fourth electrode described above.
The rear glass substrate 105 is a glass substrate serving as a base of the rear plate 91, and address electrodes 107 are formed on the rear glass substrate 105.

The address electrode 107 is a metal electrode (for example, a silver electrode or a Cr—Cu—Cr electrode), and a conductive material containing Ag is arranged in a row on one side of the back glass substrate 105 with the y direction as a longitudinal direction. A plurality of them are formed.
The dielectric layer 123 is a layer made of a dielectric material so as to cover the entire surface of the rear glass substrate 105 on the side on which the address electrodes 107 are formed, and is generally made of lead-based low-melting glass. However, it may be formed of a bismuth-based low-melting glass or a laminate of lead-based low-melting glass and bismuth-based low-melting glass.

On the dielectric layer 123, the partition wall 106 is formed in accordance with the interval between the adjacent address electrodes 107.
The partition 106 is a member made of an insulating material, and is formed in stripes between the adjacent address electrodes 107 in parallel with the address electrodes 107.
The partition wall 106 is formed by screen printing using a photomask or a sandblast method.

The phosphor layer 115 is formed between adjacent barrier ribs 106, that is, on the wall surface of the barrier rib groove, and emits visible light when irradiated with ultraviolet rays. On the wall surface of the partition groove and the dielectric layer 123, a phosphor layer 115 corresponding to any of RGB is formed.
More specifically, the phosphor layer 115 includes three types that emit light having different wavelengths of red, green, and blue by the discharged ultraviolet rays, and red, green, and blue fluorescent lights are formed on the inner wall of the partition wall groove. It is applied repeatedly in the order of the body.

As materials of the red, green, and blue light emitting phosphor layers 115, phosphors such as (Y, Gd) BO ₃ : Eu, Zn ₂ SiO ₄ : Mn, and BaMg ₂ Al ₁₄ O ₂₄ : Eu are used. It is done.
The front plate 90 and the back plate 91 are joined together by sealing the periphery of the back plate 91 with a sealing material in a stacked state, and a discharge space is formed inside.

In the discharge space, a discharge gas (filled gas) made of a rare gas component such as He, Xe, or Ne is sealed at a pressure of about 500 to 600 Torr (66.5 to 79.8 kPa).
A region in which a pair of adjacent display electrodes 102 and 103 and one address electrode 107 cross three-dimensionally across the discharge space is a cell contributing to image display.
After a voltage is applied between the X electrode and the address electrode 107 of the cell to be lit and an address discharge is performed, a sustain discharge is generated by applying a pulse voltage to a pair of two adjacent display electrodes 102 and 103. Made.

Ultraviolet light (wavelength of about 147 nm) generated by the sustain discharge strikes the phosphor layer 115 to be converted into visible light, and the cell is turned on to display an image.
The guide electrode 108 is a conductive film body having a thickness of about 3 μm to 5 μm formed by, for example, a mixture of Ag particles and glass frit. The guide electrode 108 is formed on the top portion 106 a of the partition wall 106 by a manufacturing method described later, that is, transfer. Is formed.

A constant voltage is applied to the guide electrode 108, and the electric field formed in the vicinity of the guide electrode 108 becomes a potential barrier on the crosstalk discharge path, and the occurrence of crosstalk is suppressed.
Further, instead of applying a constant voltage to the guide electrode 108, it may be grounded.

Even when the guide electrode 108 is grounded in this manner, the display electrodes in adjacent cells are isolated from each other in terms of potential, so that the occurrence of crosstalk is suppressed.
(Production method)
The manufacturing method of PDP 100 according to the first embodiment is characterized by a guide electrode forming method.

Hereinafter, a method for forming the guide electrode will be described.
For convenience of explanation, the address electrode 107 and the phosphor are already formed on the rear glass substrate 105 using, for example, a known technique described in the document “Plasma Display Manufacturing Technology (Published by Press Journal, Inc.)”. It is assumed that the layer 115, the dielectric layer 123, and the partition 106 are formed, and in particular, the partition 106 is in a state after firing.
1. Transfer film forming step After the silver paste is applied on the support film 201 so as to have a uniform thickness, it is dried, and the cover film 203 having flexibility is covered from above, and the dried silver paste (hereinafter referred to as the above-mentioned silver paste) The transfer film 200 is formed by sandwiching the “guide electrode precursor layer”).

Incidentally, the cover film 203 is for preventing the guide electrode precursor layer from being excessively dried and damaged, and is unnecessary when these factors are removed by another method.
Also, this guide electrode precursor layer has almost no fluidity, and even if it has fluidity, it is far less fluid than ink and paste used in dispensers, screen printing methods, etc. Has properties.

When the silver paste is applied to the support film 201, a coating method using a roller coater, a coating method using a blade coater such as a doctor blade, a coating method using a curtain coater, or the like can be used.
Here, the said silver paste is a mixture of silver powder, an organic binder, an organic solvent, and glass frit.

The organic binder is a mixture of a resin and a solvent. Examples of the resin component include ethyl cellulose and acrylic resin. Examples of the solvent component include n-butyl acetate, BCA, and terpineol. It is done.
The composition of the glass frit includes PbO—B ₂ O ₃ —SiO ₂ , ZnO—B ₂ O ₃ —SiO ₂ , PbO—B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ , PbO—ZnO— Examples thereof include B ₂ O ₃ —SiO ₂ system, Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ system, and the like.

The material of the support film 201 is preferably a flexible resin, and examples thereof include polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, and polyvinyl chloride. The thickness of the support film 201 is, for example, 20 to 100 μm. is there.
Examples of the material of the cover film 203 include, for example, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, and polyvinyl chloride whose surface has been subjected to a release treatment, and the thickness thereof is, for example, 20 to 100 μm.
2. Crimping process As shown in FIG. 2A, the cover film 203 is peeled off from the transfer film 200, and the guide electrode precursor 202 is overlaid on the top portion 106a of the partition wall 106, and as shown in FIG. The guide electrode precursor 202 is thermocompression-bonded onto the top part 106a of the partition wall 106 by pressing with the heating roller 210 from the film 201 (for example, the surface temperature of the heating roller 210 is 60 to 120 ° C., and the roller pressure is 98.1 kPa). ~ 490.3 kPa).

Instead of the heating roller 210, a heated flat plate may be pressed against the support film 201.
2. Support Film Peeling Step As shown in FIG. 2C, the support film 201 in a state in which the guide electrode precursor 202 is partially thermocompressed is pulled upward, so that the part where the thermocompression bonding is performed is performed. The guide electrode precursor 202a is peeled off from the support film 201 and remains on the top 106a of the partition wall 106.

As a result, the guide electrode precursor 202 is transferred to the top part 106 a of the partition wall 106.
3. Firing Step The back plate 91 to which the guide electrode precursor 202 has been transferred is placed in a firing furnace and fired.
In the firing furnace, the substrate is left for several minutes to several tens of minutes at a temperature equal to or higher than the softening point of the glass component contained in the guide electrode precursor 202, and then the temperature is lowered. Thereby, the organic binder in the guide electrode precursor 202 is vaporized, and the guide electrode 108 is formed by softening the glass component.

As described above, according to the first embodiment, the guide electrode precursor layer having poor fluidity is thermocompression bonded to the top of the partition wall, and then fired to fix the shape, that is, the guide electrode is formed. In the formation process, the guide electrode precursor layer is unlikely to sag.
(Embodiment 2)
(Constitution)
A second embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a schematic diagram of PDP 300 in the second embodiment of the present invention.
PDP 300 is different from back plate 91 in the configuration of back plate 291 corresponding to back plate 91 of PDP 100 in the first embodiment.
More specifically, only the shape of the phosphor layer and the guide electrode of the back plate 291 is different from the PDP 100.

Hereinafter, differences from the PDP 100 will be described.
The phosphor layer 315 is formed in a partition groove constituted by adjacent partitions, and in the formation range, in the vicinity of the top of the partition 106 in the region formed on the side surface of the partition 106, A step portion 315c is formed.
As shown in FIG. 4, the step portion 315c has a surface substantially parallel to the rear glass substrate 105 (hereinafter referred to as “step portion plane 315d”), and extends from the rear glass substrate 105 to the step portion plane 315d. The distance from the back glass substrate 105 to the top of the partition wall 106 is short. That is, the height of the step plane 315 d is lower than the height of the top of the partition wall 106.

The stepped plane 315d is not necessarily flat in micro units, and the stepped plane 315d may be slightly inclined.
By the way, by providing the step 315c, the surface area of the phosphor layer is slightly smaller than in the conventional case, but the area where the surface area is reduced is a part that does not contribute much to light emission, so the reduction in light emission efficiency is reduced. It is in a negligible range.

The guide electrode 108 is a conductive material having a thickness of about 3 μm to 5 μm, which suppresses the occurrence of crosstalk having a discharge path between the top portion 106a of the partition wall 106 and the surface of the front plate 90 facing the top portion 106a. In principle, the film body is formed at the top portion 106a of the partition wall 106, but there may be a dripping portion 108a partially formed from the top portion 106a to the step portion 315c.
(Production method)
The method for manufacturing PDP 300 in the present embodiment is different from the method for manufacturing PDP 100 in Embodiment 1 only in the method for forming phosphor layer 301.

Hereinafter, differences from the conventional method for manufacturing the PDP 100 will be described.
For convenience of explanation, it is assumed that the address electrode 107, the dielectric layer 123, and the partition 106 are already formed on the rear glass substrate 105, and in particular, the partition 106 is in a state after firing. .
1. Phosphor application process The phosphor inks or phosphor pastes of R, G, and B colors are sequentially applied to the grooves between adjacent barrier ribs by a conventional method such as a screen printing method or a method using a dispenser.
2. Phosphor firing step The back glass substrate 105 is heated to about 500 ° C., thereby firing the phosphor ink or phosphor paste to remove the resin component as a binder in the phosphor ink, thereby removing the phosphor layer. 315 is formed.
3. Step of forming phosphor layer step portion As shown in FIG. 5, by rotating a roller 200 having a stickiness on the surface of a cylindrical elastic body having a diameter of about 5 cm against the top portion 106a of the partition wall 106, the partition wall 106 is moved. Part of the phosphor layer 315 formed in the vicinity of the top portion 106a of the 106 adheres to the roller surface and is peeled to form a step portion 315c.

At this time, the larger the pressing force, the larger the value of the sinking amount Ht of the surface of the roller 200, so that the phosphor layer 315 is peeled deeper, and the position of the stepped portion plane 315d of the stepped portion 315c is It moves to the rear glass substrate 105 side, that is, the lower side.
More specifically, by adjusting the sinking amount Ht to about 0.2 mm, a stepped portion plane 315d of the stepped portion 315c is formed at a position about 20 μm lower than the top portion 106a of the partition wall. The height Hp is lower than the height H _B of the top portion 106a of the partition wall 106.

Examples of the material of the roller 200 include butyl-based synthetic rubber and silicone rubber. However, the material is not limited to this, and any material may be used as long as it has moderate elasticity and excellent adhesive properties.
The roller 200 may be formed by arranging a material or sheet having adhesiveness on the surface thereof on the surface of a cylindrical body having an elastic body.
4). Transfer Film Forming Process A transfer film 200 in which the guide electrode precursor 202 is sandwiched between the support film 201 and the cover film 203 is formed by the same process as the transfer film forming process described in the first embodiment.
5). Crimping step As shown in FIG. 6A, the cover film 203 is peeled off from the transfer film 200, the guide electrode precursor 202 is overlaid on the top 106a of the partition wall 106, and the support as shown in FIG. The guide electrode precursor 202 is thermocompression-bonded onto the top part 106a of the partition wall 106 by pressing with the heating roller 210 from the film 201 (for example, the surface temperature of the heating roller 210 is 60 to 120 ° C., and the roller pressure is 98.1 kPa). ~ 490.3 kPa).
6). Support Film Peeling Step As shown in FIG. 6 (c), the guide electrode precursor in the thermocompression-bonded part is pulled up by lifting the support film 201 in a state where the guide electrode precursor 202 is partially thermocompression-bonded. The body 202a is peeled off from the support film 201 and remains on the top part 106a of the partition wall 106.

As a result, the guide electrode precursor 202 is transferred to the top part 106 a of the partition wall 106.
At this time, even if a portion of the guide electrode precursor 202 (hereinafter referred to as a “sagging portion 202 c”) hangs down from the top portion 106 a of the partition wall 106, there is a phosphor at the destination where it hangs down. Since there is a step 315c of the layer 315 and it falls on the step plane 315d that is substantially parallel to the top 106a of the partition wall 106, the drooping is prevented, so that the drooping portion 202c is not formed below the step 315c.
7). Firing Step The back plate 291 onto which the guide electrode precursor 202 has been transferred is placed in a firing furnace and fired.

In the firing furnace, the substrate is left for several minutes to several tens of minutes at a temperature equal to or higher than the softening point of the glass component contained in the guide electrode precursor 202, and then the temperature is lowered.
Thereby, the organic binder in the guide electrode precursor 202 is vaporized, and the guide electrode 108 is formed by softening the glass component.
(Purpose of providing a step on the phosphor layer)
In the PDP 300 according to the second embodiment, as in the first embodiment, the guide electrode precursor layer is not simply transferred to the top 106a of the partition wall 106 and baked, but the phosphor layer 315 is prior to the transfer. Since the step portion 315c is provided in the portion formed on the side surface portion of the partition wall 106, when the guide electrode precursor 202 is transferred to the top portion 106a of the partition wall 106, the conductive material is transferred from the top portion 106a to the side surface portion. Even if it drips down, the conductive material that drips and the stepped portion plane 315d of the stepped portion 315c come into contact with each other to prevent the dripping, and the stepped portion 315c hangs down to the rear glass substrate 105, that is, the lower side. This makes it difficult to improve the yield when the guide electrode 108 is formed.

Incidentally, there are a case where the entire phosphor layer 315 is removed above the step portion of the phosphor layer 315 and a case where the phosphor layer is slightly left on the side surface of the partition wall 106.
(About the step height in the phosphor layer step formation process)
The inventors investigated the height of the step 315c when the sinking amount Ht of the roller 200 was changed in the phosphor layer step forming step.

More specifically, when the pressing force of the roller 200 is adjusted and the sinking amount Ht is set to about 0.1 mm, the area of the stepped portion plane 315d of the stepped portion 315c is about 0.2 mm. Although it is smaller than the case of adjusting the height, it has been found that the barrier rib is formed at substantially the same height as the top portion 106a of the partition wall.
As a result, the area of the top portion 106a of the partition wall is larger than that when not pressed by a roller, so that the conductive material transferred to the top portion 106a of the partition wall 106 tends not to hang down on the side surface portion of the partition wall.

In addition, when the position of the stepped portion plane 315d of the stepped portion 315c in the phosphor layer 315 is set to a low position where the distance from the top portion 106a of the partition wall 106 exceeds 30 μm, it has been confirmed that the luminous efficiency tends to decrease significantly. .
From the above, it is desirable that the stepped portion plane 315d of the stepped portion 315c in the phosphor layer 315 is provided at a low position of 0 μm to 30 μm downward from the top portion 106a of the partition wall 106, that is, toward the rear glass substrate 105 side.

However, such a shape can be obtained by setting various conditions by pressing with a roller.
The condition setting includes, for example, a phosphor material, an adhesive force on the surface of the rubber roller, a rubber elastic coefficient, a sinking amount, and the like.
(Modification)
In the phosphor layer step forming step in the second embodiment, the roller 200 having elasticity and having adhesiveness on the surface is pressed against the phosphor layer, so that a part of the phosphor layer 315 is peeled off. Although the portion 315c is formed, the roller is not limited to this. For example, as shown in FIG. 7, the roller 220 having the elastic raised portions 222 on the surface of the cylindrical main body portion 221 is rotated. While moving in the same direction as the partition arrangement direction, that is, in the direction in which the same kind of phosphor layer is formed, in contact with the top 106a of the partition 106, the vicinity of the top 106a of the partition 106 is The phosphor layer 315 may be scraped off by the raised hairs 222 (hereinafter referred to as “rubbing”) to form the stepped portion 315c.

Examples of the material of the raising 222 include rayon fibers planted on a cloth base.
In this case, since the dust of the phosphor layer 315 rubbed by the raised brush 222 falls between the adjacent barrier ribs 106, a removal process for removing the fallen dust is necessary. Since the type of the separated phosphor layer and the type of the phosphor layer into which the peeled phosphor layer falls coincide with each other by moving along the direction in which it is formed, However, color mixture does not occur, and the removal step may not be provided.

In addition, after removing the rubbing of the phosphor layer 315 generated by the rubbing after the rubbing, the moving direction of the roller 220 may be basically any direction. For example, The rollers 220 may be moved in the diagonal direction of the cross-shaped partition walls.
The distance from the top 106a of the partition wall 106a to the step plane 315d of the step 315c formed on the phosphor layer 315 or the width is at least the thickness of the rubbing cloth when the material of the partition wall 106, the phosphor layer 315 and the raising 222 is the same. It is determined by setting the diameter of the roller 220 including the thickness, the rotational speed, the sinking amount, the number of times of roller application, and the moving direction.

  For example, when there is a phosphor layer 315 formed on the side surface of the partition wall 106 having a top portion 106a having a height of about 120 μm and a width of about 25 μm, a rubbing cloth in which a rayon fiber having a length of about 1 mm is implanted is a roller 220 having a diameter of about 10 cm. When the roller rotation speed is 50 rotations / minute, the sinking amount from the fiber tip is about 0.1 mm, and the roller is reciprocated once in the arrangement direction of the partition wall 106 of the back plate 91, the top portion 106a of the partition wall 106 is obtained. A substantially flat step portion plane 315d having a width of 10 to 20 μm and a width of 10 to 15 μm was formed further downward.

The rubbing conditions are set under optimum conditions for forming the stepped portion plane 315d in the phosphor layer, and the above conditions are merely an example.
(Embodiment 3)
The PDP in the third embodiment is structurally the same as the PDP 100 in the second embodiment, and the manufacturing method is also (2. phosphor firing step) and (3. phosphor layer step forming step). This is the same as the manufacturing method of the PDP 300 in the second embodiment except that the order is changed and there is a slight difference in the implementation contents in the phosphor layer step forming step.

Hereinafter, the phosphor layer step forming step and the phosphor firing step in the third embodiment will be described.
1. Phosphor layer step forming step This phosphor layer step forming step is performed between a phosphor coating step in which a phosphor paste is applied between adjacent barrier ribs 106 and a phosphor firing step. .

More specifically, a portion formed in the vicinity of the top portion 106 a of the partition wall 106 in the phosphor layer 315 before firing by moving an elastic rotatable roller while pressing it against the top portion 106 a of the partition wall 106. Is deformed by pushing downward to form a step 315c.
For this reason, the surface of the roller does not particularly require adhesiveness, and conversely, peelability is required.
2. Phosphor firing step The back glass substrate 105 is heated to about 500 ° C., thereby firing the phosphor paste on which the step portion is formed and removing the resin component as a binder in the phosphor ink to remove the phosphor. Layer 315 is formed.

In the first, second, and third embodiments described above, the case where the guide electrode is formed on the top portion 106a of the partition wall 106 having a structure in which the partition walls are arranged in a stripe shape is described. Even a PDP that is disposed and has a guide electrode formed on the top thereof can be handled by the manufacturing methods described in the first, second, and third embodiments.
In the first, second, and third embodiments, the formation position of the guide electrode 108 is the top portion 106a of the partition wall 106. However, this is merely an example. For example, the front plate 90, the guide electrode 108, In order to further improve the electrical insulation, it is conceivable that a partition wall is further formed on the guide electrode 108 formed on the top portion 106a of the partition wall 106. In such a case, as a result, the guide electrode becomes a partition wall. It will be located in the middle of the height direction.

  Needless to say, even when the guide electrode is located in the middle of the height direction of the partition wall, the PDP manufacturing methods described in the first to third embodiments can be applied.

  The present invention is applicable to display devices used for televisions, computer monitors, and the like.

It is the schematic of PDP in this Embodiment 1. FIG. It is a figure explaining the formation method of the guide electrode in this Embodiment 1. FIG. It is a figure explaining the fluorescent substance layer formation method in this Embodiment 2. FIG. It is a figure explaining the shape of the fluorescent substance layer in this Embodiment 2, and a guide electrode. It is a figure explaining the fluorescent substance layer step part formation process in this Embodiment 2. FIG. It is a figure explaining the formation method of the guide electrode in this Embodiment 2. FIG. It is a figure explaining the modification of the fluorescent substance layer step part formation process in this Embodiment 2. FIG. It is the schematic of a general alternating current type (AC type) PDP. It is a figure explaining the general method of forming an electrode in the partition top part. It is a figure explaining the problem in the case of forming an electrode in a partition top part.

Explanation of symbols

90 Front plate 91 Back plate 100 PDP
DESCRIPTION OF SYMBOLS 101 Front glass substrate 102 Display electrode 105 Rear glass substrate 106 Partition 106a Top part 107 Address electrode 108 Guide electrode 108a Sag part 113 Dielectric layer 114 Protective layer 115 Phosphor layer 123 Dielectric layer 200 Roller 200 Transfer film 201 Support film 202 Guide Electrode precursor 202a Guide electrode precursor 202c Dripping portion 203 Cover film 210 Heating roller 220 Roller 221 Body portion 222 Brushed 291 Back plate 300 PDP
301 phosphor layer 315 phosphor layer 315c step portion 315d step portion plane

Claims (7)

A first substrate and a second substrate are opposed to each other across a discharge space, and a plurality of barrier ribs are arranged in parallel on a surface of the second substrate facing the first substrate, and a plurality of barrier ribs are provided along the barrier ribs. A method of manufacturing a plasma display panel in which the discharge cells are provided,
A transfer step for transferring a transfer layer containing a conductive material formed on the surface of the transfer holder to the top of the partition;
And a heating step of heating the transferred transfer layer to form a conductor layer. Before the transfer step,
An application step of applying a phosphor to at least a side surface of the partition;
2. A step portion forming step of forming a step portion on the phosphor by removing or deforming a part of the phosphor applied to a side surface portion of the partition wall. Of manufacturing a plasma display panel.   In the step forming step, an adhesive elastic body is pressed against the top of the partition and the periphery thereof, and a part of the phosphor applied to the side surface of the partition is attached to the surface. Item 3. A method for manufacturing a plasma display panel according to Item 2. 3. The plasma display according to claim 2, wherein, in the step forming step, an elastic body is pressed against a top portion of the partition wall and the periphery thereof to deform a part of the phosphor applied to a side surface portion of the partition wall. Panel manufacturing method. The elastic body is a cylindrical or cylindrical rotatable roller, and the step is formed by moving the elastic body while pressing the roller against the top of the partition wall. 5. A method for producing a plasma display panel according to 4. In the step forming step, the roller having a protrusion provided on the surface thereof is pressed against the top of the partition wall while rotating, and a part of the phosphor applied to the side surface of the partition wall is scraped off. The manufacturing method of the plasma display panel of Claim 2. The method of manufacturing a plasma display panel according to claim 6, wherein the protrusion is a raised portion provided on the surface of the roller.

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