JP2005303311A - Ceramic electronic component and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent an external terminal electrode from fracturing when an aggregate electronic component in which a conductor for a terminal to be used as the external terminal electrode is installed in advance is divided to obtain a ceramic electronic component. <P>SOLUTION: By forming longitudinal through-holes 48 with reference to a raw ceramic molding 47, in which a plurality of conductors 45 for terminals to be used as external terminal electrodes are installed, a part in each of the conductors 45 for the terminals is exposed on the inside of the through holes 48. After the ceramic molding 47 is fired to be obtained a ceramic sinter, by dividing along cutting grooves 51 passing the through holes 48, the ceramic electronic component is taken out. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a ceramic electronic component and a method for manufacturing the same, and more particularly, to an improvement in an external terminal electrode forming mode and a forming method for a ceramic electronic component.

  FIG. 15 is a perspective view showing the appearance of a conventional ceramic electronic component 1 that is of interest to the present invention (see, for example, Patent Document 1).

  The ceramic electronic component 1 constitutes an electronic component such as a capacitor, an inductor, a resonator, or a circuit board, and includes a ceramic electronic component body 2 having a laminated structure or a single layer structure.

  The electronic component body 2 has first and second main surfaces 3 and 4 that face each other and four side surfaces 5, 6, 7, and 8 that connect the first and second main surfaces 3 and 4. It has a rectangular parallelepiped shape. A plurality of external terminal electrodes 9 are provided side by side on at least one side surface of the electronic component body 2, for example, each of the side surfaces 5 and 7. These external terminal electrodes 9 are formed on the inner peripheral surface of the concave portion 10 having a semicircular cross section, for example, provided on the side surfaces 5 and 7.

  Such a ceramic electronic component 1 is manufactured as follows.

  First, as shown in FIG. 16, a raw ceramic molded body 11 is produced. When the ceramic electronic component body 2 has a laminated structure, a plurality of ceramic green sheets are laminated when the ceramic molded body 11 is produced. This ceramic molded body 11 is intended to take out a plurality of ceramic electronic components 1 from here.

  Next, as shown in FIG. 16, the ceramic molded body 11 is provided with a plurality of through holes 12. Each position of these through holes 12 corresponds to a position where each of the external terminal electrodes 9 is provided.

  Next, as shown in FIG. 16, a cutting groove 15 is formed on one main surface 13 or both main surfaces 13 and 14 of the ceramic molded body 11. In FIG. 18, the state in which the cutting groove 15 is formed on both the main surfaces 13 and 14 is well shown. The cutting groove 15 is used to facilitate break along the boundary line between the plurality of ceramic electronic components 1 when the plurality of ceramic electronic components 1 are to be taken out in a later process. It is formed with a depth of about 1/3 to 1/6 of the thickness of the molded body 11.

  Next, the ceramic molded body 11 is fired, whereby a ceramic sintered body 16 whose part is shown in a sectional view in FIG. 17 is obtained.

  Next, as shown in FIG. 17, a terminal conductor 18 to be the external terminal electrode 9 is formed on the inner peripheral surface of the through hole 12 by applying a conductive paste 17. For the formation of the terminal conductor 18, for example, screen printing is applied. That is, the ceramic sintered body 16 is placed on the screen 22 with the hole 20 and the through hole 12 being aligned on the base 21 having the hole 20 subjected to vacuum suction as indicated by an arrow 19. By operating the squeegee 23 along, the conductive paste 17 is applied on the inner peripheral surface of the through hole 12.

  In the screen printing process described above, the conductive paste 17 is applied with a predetermined pattern on the main surface 13 of the ceramic sintered body 16 as necessary, thereby forming a conductor film for wiring.

  Next, the terminal conductor 18 and the wiring conductor film formed by the conductive paste 17 are fired.

  When the ceramic molded body 11 has a laminated structure, the process shown in FIG. 17 is performed in the state of the raw ceramic molded body 11, and the terminal conductor 18 and the other wiring conductors are arranged. The conductive paste 17 to be formed may be fired at the same time as the ceramic molded body 11 is fired.

  Next, the surface of the terminal conductor 18 is plated with nickel / gold, nickel / tin, nickel / solder or the like as necessary.

  Next, a mounting component is mounted on the main surface 13 of the ceramic sintered body 16 as necessary.

  The cut groove 15 is formed after the step shown in FIG. 17 before firing, after the plating step, or after mounting the mounted component.

  In this way, as shown in part in FIG. 18, the ceramic sintered body 16 in which the terminal conductor 18 is formed on the inner peripheral surface of the through hole 12 is obtained.

  Next, the ceramic sintered body 16 is broken along the cut grooves 15, whereby a plurality of ceramic electronic components 1 are taken out. FIG. 19 is an enlarged perspective view of a part of the ceramic electronic component 1 taken out. In FIG. 19, the recess 10 given by the division of the through hole 12 is shown, and the external terminal electrode 9 given by the division of the terminal conductor 18 is shown.

  When the ceramic sintered body 16 is broken as described above, since the terminal conductor 18 is divided with a tensile stress, the external terminal electrode 9 is exposed by this division as shown in FIG. A dividing section 24 is provided.

  However, the above-described ceramic electronic component 1 or a manufacturing method thereof has a problem to be solved.

  First, since the dividing surface 24 provided to the external terminal electrode 9 is not covered with the plating film, oxidation or the like is liable to occur, so that the solderability is deteriorated. Soldering may be hindered.

  Further, when breaking the ceramic sintered body 16, since the terminal conductor 18 formed on the inner peripheral surface of the through hole 12 is divided so as to be torn off, it is not necessarily divided at the center. In an extreme case, a defect occurs on one side, resulting in a disconnection failure, or a fatal failure such that a portion of the terminal conductor 18 is missing together with a portion of the ceramic sintered body 16. Sometimes.

  In order to solve the above-mentioned problem, it is effective to reduce the thickness of the terminal conductor 18 and the thickness of the plating film formed thereon, but if the thickness is reduced in this way, it may lead to disconnection failure. .

  On the other hand, if the external terminal electrode 9 is formed after the ceramic sintered body 16 is broken, the above-mentioned problem is solved, but in this case, the problem of a decrease in productivity is caused.

  Further, in order to solve the problem of the defect in the external terminal electrode 9 at the time of the break, the terminal conductor 18 is not filled with the through-hole 12 as shown in FIG. It must be formed in the state of Therefore, the diameter of the through hole 12 cannot be made so small. As a result, downsizing of the ceramic electronic component 1 is hindered.

  Further, as shown in FIG. 17, when forming the terminal conductor 18, the terminal conductor 18 is made hollow as described above while preventing the peripheral portion of the hole 20 of the base 21 from being soiled by the conductive paste 17. Therefore, it is necessary to perform screen printing while applying vacuum suction through the hole 20 having a diameter larger than that of the through hole 12. For this reason, the main conductor extension 18 extending to the main surfaces 13 and 14 is necessarily formed on the formed terminal conductor 18. However, the presence of the main surface extension part 25 prevents the arrangement interval of the external terminal electrodes 9 from being reduced, and as a result, prevents the ceramic electronic component 1 from being downsized.

  Further, at least the characteristics of the ceramic electronic component 1 must be measured before shipping. However, the ceramic electronic component 1 is not after the break because, in the stage of the ceramic sintered body 16 before the break, the terminal conductor 18 that becomes the external terminal electrode 9 is formed across the adjacent ceramic electronic components 1. And the characteristic of the ceramic electronic component 1 here cannot be measured. Therefore, such characteristics cannot be measured efficiently.

In addition, when the ceramic electronic component 1 is a circuit board, another electronic component may be mounted on the main surface 3 or 4 of the electronic component main body 2. In this case, it is efficient to mount the electronic component on the ceramic sintered body 16 in the state of the collective electronic component. However, as described above, since it is impossible to measure the characteristics at the stage of the collective electronic component, the electronic component is also mounted on the ceramic electronic component 1 which is a defective product. Costly parts may be wasted, which is disadvantageous in terms of cost.
JP-A-8-37251 (paragraph 0003, FIG. 7)

  Accordingly, an object of the present invention is to provide a method for manufacturing a ceramic electronic component and a ceramic electronic component obtained by this manufacturing method, which can solve the above-described problems.

  In order to solve the above-described technical problem, a method for manufacturing a ceramic electronic component according to the present invention is provided in the first aspect such that a plurality of terminal conductors serving as external terminal electrodes extend in at least part of the thickness direction. Between the first and second main surfaces of the ceramic molded body facing each other so as to be along a line in which a plurality of terminal conductors of the ceramic molded body are arranged, The step of exposing each part of the plurality of terminal conductors on the inner surface of one through-hole by forming a long through-hole penetrating, and firing the ceramic molded body, A step of obtaining a bonded body, and dividing the ceramic sintered body along a dividing line passing through the through hole, thereby providing a plurality of outer portions provided with a part of the terminal conductor exposed on the inner surface of the through hole. The terminal electrodes are arranged side by side in a notch formed by splitting of the through-hole, is characterized by comprising a step of taking out the ceramic electronic component.

  When the ceramic electronic component to be manufactured as described above has a laminated structure, a ceramic provided with a plurality of terminal conductors penetrating in the thickness direction in the step of producing a ceramic molded body A step of laminating a plurality of ceramic green sheets including green sheets is performed.

  In the case described above, in the step of producing the ceramic molded body, a step of forming a conductor film for wiring and a via-hole conductor on the ceramic green sheet may be performed.

  According to a second aspect of the method for manufacturing a ceramic electronic component according to the present invention, in the second aspect, a step of producing a raw ceramic molded body and a longitudinal direction penetrating between the first and second main surfaces of the ceramic molded body facing each other are provided. The step of forming a through hole, the step of obtaining a sintered ceramic body by firing the ceramic molded body, and the ceramic molded body or the ceramic sintered body aligned on the inner surface of the through hole A plurality of external terminal electrodes formed on the inner surface of the through hole are formed by dividing the ceramic sintered body along a dividing line passing through the through hole. And a step of taking out the ceramic electronic component provided side by side in the notch formed by dividing the hole.

  As described above, when the ceramic electronic component to be manufactured has a laminated structure, a step of laminating a plurality of ceramic green sheets is performed in the step of producing the ceramic molded body.

  In the case described above, in the step of producing the ceramic molded body, a step of forming a conductor film for wiring and a via-hole conductor on the ceramic green sheet may be performed.

  In any of the first and second aspects described above, preferably, the ceramic sintered body is configured such that a plurality of ceramic electronic components can be taken out by dividing the ceramic sintered body along a dividing line. The step of dividing the ceramic sintered body is a step of dividing the collective electronic component. In particular, in the case of the first aspect, in the step of forming the through hole, the through hole is formed so as to divide the through conductor.

  In the preferred embodiment described above, it is preferable that a step of measuring characteristics of each ceramic electronic component in the state of the collective electronic component is performed before the step of dividing the collective electronic component.

  In the method for manufacturing a ceramic electronic component according to the present invention, a step of plating the surface of the external terminal electrode may be further performed before the step of dividing the ceramic sintered body.

  The present invention is also directed to a ceramic electronic component obtained by the manufacturing method as described above.

  According to the method for manufacturing a ceramic electronic component according to the present invention, a notch penetrating from the first main surface to the second main surface is provided on at least one side surface of the ceramic electronic component main body. A ceramic electronic component in which a plurality of external terminal electrodes are provided side by side can be manufactured.

  In the manufacturing method according to the first aspect of the present invention, a step of producing a raw ceramic molded body in which a plurality of terminal conductors to be external terminal electrodes are provided so as to extend in at least part of the thickness direction; By forming a long through-hole penetrating between the first and second main faces of the ceramic molded body facing each other so as to follow a line in which the plurality of terminal conductors of the body are arranged, A step of exposing each part of the conductor on the inner surface of one through hole, a step of obtaining a sintered ceramic body by sintering the ceramic molded body, A plurality of external terminal electrodes provided with a part of the terminal conductor exposed on the inner surface of the through hole are arranged in parallel in the notches formed by the division of the through hole. It is provided, since a step of taking out the ceramic electronic component is performed, it is possible the following effects can be attained.

  First, when the ceramic sintered body is divided, the defect that the external terminal electrode is lost or peeled off does not occur, and improvement in the quality of the obtained ceramic electronic component can be expected.

  Further, the diameter and arrangement pitch of the terminal conductors for providing the external terminal electrodes can be reduced, and the external terminal electrodes are formed so as not to form the main surface extension extending on the main surface of the electronic component main body. Therefore, the external terminal electrodes can be distributed at a high density, so that the ceramic electronic component obtained can be miniaturized and the wiring density can be increased.

  In addition, when a plating film is formed on the external terminal electrode, the plating film can be maintained as it is even after the ceramic sintered body is divided. We do not encounter the problem of deterioration of stickiness.

  In addition, when the ceramic sintered body is a collective electronic component that can take out a plurality of ceramic electronic components by dividing the ceramic sintered body, even if it is a stage before the division, Since the external terminal electrode is in an electrically independent state from external terminal electrodes for other ceramic electronic components, the characteristics of each ceramic electronic component can be measured in the state of the collective electronic component. Therefore, it is possible to efficiently carry out such a characteristic measurement process, and it is possible to prevent a subsequent useless process from being performed on defective products.

  In the manufacturing method according to the second aspect of the present invention, a step of producing a raw ceramic molded body and a step of forming a longitudinal through-hole penetrating between the first and second main surfaces of the ceramic molded body facing each other. A step of obtaining a sintered ceramic body by firing the ceramic molded body, and a plurality of external terminals so as to be aligned on the inner surface of the through hole with respect to the ceramic molded body or the ceramic sintered body. A plurality of external terminal electrodes formed on the inner surface of the through hole are formed by dividing the through hole by dividing the ceramic sintered body along the dividing line passing through the through hole and forming the electrode. And a step of taking out the ceramic electronic component provided side by side in the notch.

  Therefore, the diameter and arrangement pitch of the external terminal electrodes can be reduced compared to the manufacturing method according to the first aspect described above, but substantially the same as the manufacturing method according to the first aspect described above. The effect of.

  Further, according to the manufacturing method of the first aspect, it is easy to provide the external terminal electrode so as not to penetrate from the first main surface to the second main surface of the ceramic electronic component main body. By forming the external terminal electrode in such a manner, the height of the solder fillet applied here can be controlled, and therefore, when this ceramic electronic component is used in a high frequency circuit, its characteristics are stabilized. Can do.

  FIG. 1 is a perspective view showing an appearance of a ceramic electronic component 31 manufactured by a manufacturing method according to an embodiment of the present invention.

  The ceramic electronic component 31 includes a ceramic electronic component main body 32. The electronic component body 32 has first and second main surfaces 33 and 34 facing each other and four side surfaces 35, 36, 37, and 38 that connect the first and second main surfaces 33 and 34. doing.

  Further, at least one side surface of the electronic component main body 32, for example, each of the side surfaces 35 and 36, is provided with a notch 39 penetrating from the first main surface 33 to the second main surface 34. Inside, a plurality of external terminal electrodes 40 are provided side by side.

  In this embodiment, the external terminal electrode 40 is provided so as to penetrate from the first main surface 33 to the second main surface 34. In addition, a plurality of recesses 41 are provided in the notch 39, and the external terminal electrode 40 described above is provided so as to fill the recesses 41.

  In addition, on the first main surface 33 of the electronic component main body 32, several external conductor films 42 are formed. These external conductor films 42 are electrically connected to specific external terminal electrodes 40. Although not shown, the mounted component is mounted on the main surface 33 while being electrically connected to the external conductor film 42, and the main surface 33 is covered with a cap so as to cover the mounted component. There is.

  Although not shown, an external conductor film may be formed on the second main surface 34 of the electronic component main body 32.

  Further, it is preferable that the entire exposed surface of the external conductor film 40 is covered with a plating film.

  In order to manufacture such a ceramic electronic component 31, steps described below with reference to FIGS. 2 to 4 are performed. In addition, the manufacturing method of the ceramic electronic component 31 demonstrated below is a thing in case the electronic component main body 32 has a laminated structure.

  First, as shown in FIG. 2A, a ceramic green sheet 43 is prepared. A plurality of penetrating through holes 44 are arranged in a predetermined position on the ceramic green sheet 43. In this embodiment, the through hole 44 has a rectangular cross-sectional shape.

  Next, as shown in FIG. 2 (2), each through-hole 44 is filled with a conductive paste, whereby the terminal conductor 45 is provided so as to penetrate in the thickness direction of the ceramic green sheet 43.

  Next, as shown in FIG. 2 (3), a conductive film 46 for wiring is formed on the ceramic green sheet 43 with a predetermined pattern by, for example, screen printing a conductive paste. The conductor film 46 may be the aforementioned external conductor film 42 or an internal conductor film depending on the position when the ceramic green sheets 43 are laminated.

  Note that the formation of the conductor film 46 may be performed simultaneously with the process of filling the conductive holes 46 with the conductive paste into the through holes 44 for forming the terminal conductors 45.

  Although not shown in FIG. 2, via hole conductors for wiring may be formed on the ceramic green sheet 43. The formation of the through hole for forming the via-hole conductor is performed simultaneously with the step of forming the through hole 44 shown in FIG. 2 (1), and the filling of the conductive paste into the through hole is performed in FIG. It may be carried out simultaneously with the filling of the conductive paste into the through holes 44 shown in FIG.

  Next, a plurality of ceramic green sheets including the ceramic green sheet 43 shown in FIG. 2 (3) are stacked and then pressed in the stacking direction. Thereby, a raw ceramic molded body 47 as shown in FIG. In the ceramic molded body 47, a plurality of terminal conductors 45 are provided so as to extend in at least a part of the thickness direction. In this embodiment, the terminal conductor 45 is provided so as to penetrate the thickness direction of the ceramic molded body 47.

  Next, as shown in FIG. 3B, a long through hole 48 is formed along a line in which the plurality of terminal conductors 45 of the ceramic molded body 47 are arranged. The through hole 48 passes between the first and second main surfaces 49 and 50 of the ceramic molded body 47 facing each other.

  Further, as shown in an enlarged view in FIG. 5, each of the plurality of terminal conductors 45 is divided by the formation of such a through hole 48, and each of the plurality of divided terminal conductors 45 is It is in the state exposed on the inner surface of one through-hole 48. Each of the divided portions of the terminal conductor 45 provides an external terminal electrode 40.

  Next, as shown in FIG. 3B, the cutting groove 51 is formed on one main surface 49 or both main surfaces 49 and 50 of the ceramic molded body 47. The cutting groove 51 is formed along a dividing line that is divided in a subsequent dividing step, and the specific cutting groove 51 extends to a position passing through the long through hole 48. The cutting groove 51 is formed with a depth of about 1/3 to 1/6 of the thickness of the ceramic molded body 47, for example.

  Next, the ceramic molded body 47 is fired, whereby a ceramic sintered body 52 as shown in FIG. 4 is obtained. At this time, the conductive paste constituting the terminal conductor 45 that gives the external terminal electrode 40 is also sintered. The ceramic sintered body 52 has substantially the same appearance as the ceramic molded body 47 except that shrinkage due to firing occurs.

  Next, plating of nickel / gold, nickel / tin, nickel / solder or the like is performed on the surface of the external terminal electrode 40 given by the division of the terminal conductor 45. In this plating step, the surface of the outer conductor film 42 formed on the outer surface of the ceramic sintered body 52 may also be plated.

  When the above steps are completed, the ceramic electronic component 31 to be obtained is configured in each region defined by the cutting groove 51 along the dividing line in the ceramic sintered body 52, and these ceramic electronic components 31 are mutually connected. It is in an electrically independent state from the others. Accordingly, the characteristics of the individual ceramic electronic components 31 can be measured using the external terminal electrode 40 given by the division of the terminal conductor 45 as a terminal.

  As described above, after the characteristics are measured, other electronic components are mounted on the ceramic electronic component 31 determined to be non-defective as necessary, and a cap is put thereon.

  Next, in order to take out the plurality of ceramic electronic components 31, the ceramic sintered body 52 is broken along the cut grooves 51.

  Thus, the ceramic electronic component 31 in the state shown in FIG. 1 is obtained. In the ceramic electronic component 31, the plurality of external terminal electrodes 40 are provided with a part of the terminal conductor 45 exposed on the inner surface of the through hole 48, and the notch 39 is formed in the through hole 48. A plurality of external terminal electrodes 40 are provided side by side in the cutout 39.

  With respect to the embodiment described above, several modifications as described below are possible.

  In the embodiment described above, as shown in FIG. 5, the external conductor film 42 for providing the external terminal electrode 40 is provided in the through hole 44 having a rectangular cross section. However, as shown in FIG. The terminal conductor 45 to be provided may be provided in the through hole 44 having a circular cross section. Further, the through holes 44 may have other cross-sectional shapes.

  In FIG. 6, elements corresponding to the elements shown in FIG.

  In the above-described embodiment, the terminal conductor 45 is formed so as to fill the through hole 44. However, as shown in FIG. 7, the terminal conductor 45 has a through hole 44 while leaving a hollow portion at the center. It may be formed along the inner peripheral surface. In FIG. 7, elements corresponding to the elements shown in FIG. 5 are given the same reference numerals, and redundant description is omitted.

  Although the second main surface 34 side of the electronic component main body 32 is not shown in FIG. 1, the external terminal electrode 40 extends to the second main surface 34 of the electronic component main body 32 as shown in FIG. 8. 53 may be provided.

  The extension 53 widens the solder application area when the external terminal electrode 40 is to be soldered to a conductive land on a wiring board (not shown), so that the bonding force between the ceramic electronic component 31 and the wiring board is increased. Act to enhance.

  Such an extension 53 can be formed by screen printing a conductive paste at the stage of the ceramic molded body 47 or the ceramic sintered body 52. The extension 53 may be provided on the first main surface 33 side of the electronic component main body 32.

  In FIG. 8, elements corresponding to those shown in FIG. 1 and the like are denoted by the same reference numerals, and redundant description is omitted.

  Further, in the above-described embodiment, the cutout 39 is provided in each of the side surfaces 35 and 37 of the electronic component main body 32. However, as shown in FIG. Notches 39 may be provided one by one. Furthermore, the number of notches 39 can be arbitrarily changed.

  In FIG. 9, illustration of the outer conductor film 42 is omitted, but in FIG. 9, elements corresponding to those shown in FIG.

  In the embodiment described above, the external terminal electrode 40 is provided so as to penetrate from the first main surface 33 to the second main surface 34 of the electronic component main body 32, but FIG. 10, FIG. 11, and FIG. 12, the external terminal electrode 40 may be provided so as not to penetrate from the first main surface 33 to the second main surface 34.

  In FIG. 10, the external terminal electrode 40 is provided so as not to reach the first main surface 33.

  In FIG. 11, the external terminal electrode 40 is provided so as not to reach both the first and second main surfaces 33 and 34.

  In FIG. 12, the external terminal electrode 40 is provided so as not to reach the first main surface 33 and is divided into two parts in the thickness direction of the electronic component main body 32.

  In order to form the external terminal electrode 40 in such a manner as shown in FIGS. 10 to 12, the terminal conductor 45 as shown in FIG. 2 is provided in the laminating process for obtaining the ceramic molded body 47. The ceramic green sheets 43 and the ceramic green sheets not provided with such terminal conductors may be mixed and laminated.

  Since the external terminal electrode 40 shown in FIGS. 10 to 12 is formed so as not to reach the first main surface 33 of the electronic component main body 32, the electronic component is mounted on the first main surface 33. The area that can be mounted can be expanded. Further, when these ceramic electronic components 31 are mounted on a wiring board using solder, a solder fillet is formed so as to cover the external terminal electrode 40, and the height of the solder fillet can be controlled. When the ceramic electronic component 31 is used in a high frequency circuit, the solder fillet acts as an inductance component. Therefore, such control of the height of the solder fillet can contribute to the reduction of the inductance component and the variation thereof.

  In particular, according to the external terminal electrode 40 provided as shown in FIG. 11, it is provided so as not to reach the second main surface 34 of the electronic component main body 32. Therefore, the ceramic electronic component 31 is mounted. An undesired short circuit with the conductive land on the wiring board can be prevented more reliably.

  Further, in particular, according to the external terminal electrode 40 shown in FIG. 12, the portion located on the second main surface 34 side is used for soldering with the wiring board, while the portion located on the first main surface 33 side. The portion to be used can be used, for example, for solder joining with a cap mounted so as to cover the first main surface 33.

  In the above-described embodiment, the cutting groove 51 is formed at the stage of the unfired ceramic molded body 47. However, the process of forming the cutting groove 51 can be arbitrarily changed, for example, after sintering. The cutting groove 51 may be formed at the stage of the ceramic sintered body 52. In this case, for forming the cutting groove 51, for example, a scriber including a laser or a diamond blade can be applied.

  In the ceramic electronic component 31 shown in FIG. 1, the notch 39 and the external terminal electrode 40 are provided only on the side surfaces 35 and 37, but may be further provided on the side surfaces 36 and / or 38. Moreover, the notch 39 and the external terminal electrode 40 may be provided only in any one of the side surfaces 35-38.

  In the embodiment described above, the electronic component main body 32 has a laminated structure. However, the manufacturing method described above can be applied even to a ceramic electronic component including an electronic component main body having a single-layer structure. . In this case, the manufacturing method described with reference to FIGS. 3 and 4 may be applied to a ceramic molded body having a configuration substantially similar to that of the ceramic green sheet 43 shown in FIG.

  Further, in the embodiment described above, in order to manufacture the ceramic electronic component 31, the ceramic sintered body 52 as a collective electronic component is produced, and a plurality of ceramic electronic components 31 are taken out by dividing the ceramic sintered body 52. A ceramic sintered body for obtaining only one ceramic electronic component is produced, and the peripheral part of the ceramic sintered body is divided by dividing along a dividing line passing through a longitudinal through hole provided in the ceramic sintered body. As a result, only one ceramic electronic component may be taken out. In this case, the long through hole does not need to be formed so as to divide the terminal conductor, and it is sufficient if the long through hole is formed so that a part of the terminal conductor is exposed on the inner surface of the through hole. .

  In the above-described embodiment, the external terminal electrode 40 is formed from the terminal conductor 45 provided in advance in the ceramic molded body 47. However, as described below, the external terminal electrode forming method is changed. May be.

  That is, as shown in FIG. 13, a raw ceramic molded body 61 is produced in a state where no terminal conductor is provided, and the raw ceramic molded body 61 penetrates between the first and second main surfaces facing each other. A longitudinal through-hole 62 is formed. A part of the inner conductor film 63 formed inside the ceramic molded body 61 is exposed on the inner surface of the through hole 62.

  In producing the ceramic molded body 61 described above, a plurality of ceramic green sheets are laminated, and specific ones of these ceramic green sheets include a conductor film for wiring and a via-hole conductor as necessary. Is formed. The inner conductor film 63 shown in FIG. 13 is a part of the conductor film for this wiring.

  Next, as shown in FIG. 14, a cutting groove 64 is formed on the first and / or second main surface along a line passing through the through hole 62 in the ceramic molded body 61.

  In addition, a plurality of external terminal electrodes 65 are formed so as to be arranged on the inner surface of the through hole 62 after or before the formation of the cutting groove 64 described above. The external terminal electrode 65 is formed so as to be electrically connected to the internal conductor film 63. A conductive paste is used to form the external terminal electrode 65, and this conductive paste is applied by screen printing or a dispenser.

  Next, the raw ceramic molded body 61 is fired, thereby obtaining a sintered ceramic sintered body. At this time, the conductive paste forming the external terminal electrode 65 is also sintered.

  Next, the surface of the external terminal electrode 65 is plated with nickel / gold, nickel / tin, nickel / solder, or the like.

  Next, the ceramic sintered body is broken along the cutting grooves 64, whereby a plurality of ceramic electronic components are taken out. In this ceramic electronic component, the plurality of external terminal electrodes 65 formed on the inner surface of the through hole 62 are arranged side by side in the notch formed by dividing the through hole 62.

  In the manufacturing method described above, the external terminal electrode 65 may be formed on the sintered ceramic sintered body. In this case, it is necessary to perform a separate baking process on the external terminal electrode 65.

  The manufacturing method described above is applied to the manufacture of a ceramic electronic component having an electronic component main body having a laminated structure. Therefore, when the ceramic molded body 61 is manufactured, a plurality of ceramic green sheets are stacked. The present invention can also be applied to the manufacture of ceramic electronic components including an electronic component body having a single-layer structure. In this case, in order to obtain the ceramic molded body 61, the process of laminating the ceramic green sheets is unnecessary.

  Also in this embodiment, characteristics of individual ceramic electronic components can be measured at the stage of the ceramic sintered body in the state of the collective electronic component.

It is a perspective view which shows the external appearance of the ceramic electronic component 31 manufactured by the manufacturing method by one Embodiment of this invention. FIG. 3 is a perspective view sequentially illustrating steps performed on a ceramic green sheet 43 prepared for manufacturing the ceramic electronic component 31 shown in FIG. 1. It is a perspective view which shows sequentially the process implemented with respect to the ceramic molded body 47 obtained by laminating | stacking several ceramic green sheets containing the ceramic green sheet 43 shown in FIG. It is a perspective view which shows the ceramic sintered compact 52 obtained by baking the ceramic molded object 47 shown in FIG.3 (2). FIG. 4 is an enlarged plan view showing a part of a ceramic molded body 47 shown in FIG. FIG. 6 is a diagram illustrating a portion corresponding to the portion illustrated in FIG. 5, and illustrates a modification of the terminal conductor 45. FIG. 6 is an enlarged plan view showing a part corresponding to a part of the part shown in FIG. 5, and shows another modification of the terminal conductor 45. FIG. 6 is a bottom view showing a modified example of the ceramic electronic component 31. FIG. 11 is a plan view showing another modification of the ceramic electronic component 31. FIG. 10 is a front view showing still another modification of the ceramic electronic component 31. FIG. 10 is a front view showing still another modification of the ceramic electronic component 31. FIG. 10 is a front view showing still another modification of the ceramic electronic component 31. It is a perspective view which shows a part of ceramic molded object 61 for demonstrating other embodiment regarding the manufacturing method of a ceramic electronic component. It is a perspective view which shows the state which formed the external terminal electrode 65 in the ceramic molded body 61 shown in FIG. It is a perspective view which shows the external appearance of the conventional ceramic electronic component 1 interesting for this invention. It is a perspective view which shows the ceramic molded object 11 produced in order to manufacture the ceramic electronic component 1 shown in FIG. FIG. 17 is a cross-sectional view schematically showing a process of forming a terminal conductor 18 on a ceramic sintered body 16 obtained by firing the ceramic molded body 11 shown in FIG. 16. It is a perspective view which shows a part of ceramic sintered compact 16 in which the conductor 18 for terminals shown in FIG. 17 was formed. It is a perspective view which shows a part of ceramic electronic component 1 obtained by dividing | segmenting the ceramic sintered compact 16 shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 31 Ceramic electronic component 32 Ceramic electronic component main body 33 1st main surface of an electronic component main body 34 2nd main surface of an electronic component main body 35-38 Side surface of an electronic component main body 39 Notch 40,65 External terminal electrode 41 Recessed part 42 External Conductor film 43 Ceramic green sheet 44 Through-hole 45 Terminal conductor 46 Conductor film 47, 61 Ceramic molded body 48, 62 Longitudinal through-hole 49 First main surface of ceramic molded body or ceramic sintered body 50 Ceramic molded body or ceramic Second main surface of sintered body 51, 64 Cutting groove (parting line)
52 Ceramic sintered body 53 Extension 63 Internal conductor film

Claims (12)

A step of producing a raw ceramic molded body provided such that a plurality of terminal conductors serving as external terminal electrodes extend in at least part of the thickness direction;
By forming a longitudinal through-hole penetrating between the first and second main surfaces facing each other of the ceramic molded body so as to follow a line in which the plurality of terminal conductors of the ceramic molded body are arranged. Exposing a part of each of the plurality of terminal conductors on the inner surface of one through hole;
A step of obtaining a sintered ceramic body after sintering by firing the ceramic molded body;
A plurality of external terminal electrodes provided with a part of the terminal conductor exposed on the inner surface of the through hole by dividing the ceramic sintered body along a dividing line passing through the through hole, And a step of taking out the ceramic electronic component provided side by side in the notch formed by dividing the through hole.   The step of producing the ceramic molded body includes a step of laminating a plurality of ceramic green sheets including a ceramic green sheet provided so that the plurality of terminal conductors penetrate in the thickness direction. Manufacturing method of ceramic electronic components.   The method for producing a ceramic electronic component according to claim 2, wherein the step of producing the ceramic molded body includes a step of forming a conductor film and a via-hole conductor for wiring on the ceramic green sheet.   The ceramic sintered body is a collective electronic component that can be taken out by dividing the ceramic sintered body along the dividing line, and the step of dividing the ceramic sintered body includes the steps of: The ceramic electronic component according to any one of claims 1 to 3, wherein the through hole is formed so as to divide the through conductor in the step of dividing the collective electronic component, and in the step of forming the through hole. Production method.   The method for manufacturing a ceramic electronic component according to claim 4, further comprising a step of measuring characteristics of each ceramic electronic component in a state of the collective electronic component before the step of dividing the collective electronic component.   6. The method for manufacturing a ceramic electronic component according to claim 1, further comprising a step of plating the surface of the external terminal electrode before the step of dividing the ceramic sintered body. Producing a raw ceramic molded body;
Forming a longitudinal through-hole penetrating between the first and second main surfaces facing each other of the ceramic molded body;
A step of obtaining a sintered ceramic body after sintering by firing the ceramic molded body;
Forming a plurality of external terminal electrodes so as to line up on the inner surface of the through hole with respect to the ceramic molded body or the ceramic sintered body;
By dividing the ceramic sintered body along a dividing line passing through the through hole, a plurality of external terminal electrodes formed on the inner surface of the through hole are formed into notches formed by dividing the through hole. And a step of taking out the ceramic electronic component provided side by side in the inside.   The method for producing a ceramic electronic component according to claim 7, wherein the step of producing the ceramic molded body includes a step of laminating a plurality of ceramic green sheets.   The method for producing a ceramic electronic component according to claim 8, wherein the step of producing the ceramic molded body includes a step of forming a conductor film and a via-hole conductor for wiring on the ceramic green sheet.   The ceramic sintered body is a collective electronic component that can be taken out by dividing the ceramic sintered body along the dividing line, and the step of dividing the ceramic sintered body includes: The method for manufacturing a ceramic electronic component according to any one of claims 7 to 9, which is a step of dividing the collective electronic component.   The method for manufacturing a ceramic electronic component according to claim 10, further comprising a step of measuring characteristics of each ceramic electronic component in a state of the collective electronic component before the step of dividing the collective electronic component.   A ceramic electronic component obtained by the manufacturing method according to claim 1.

Images