JP2005302943A5 - - Google Patents

Claims (5)

A wiring board that does not have a core board and connects a semiconductor chip,
A laminate in which two or more dielectric layers and two or more conductor layers are alternately laminated so that the first main surface and the second main surface are formed of a dielectric layer;
A plurality of metal terminal pads formed on the first main surface and the second main surface;
A reinforcing frame that reinforces the laminate and ensures flatness;
The semiconductor chip and the reinforcing frame are disposed on the first main surface,
At least a part of the metal terminal pad is electrically connected to an internal conductor layer located in the multilayer body through a via,
The metal terminal pad and the semiconductor chip are flip-chip connected via a solder connection portion,
A wiring substrate, wherein the dielectric layer has a Young's modulus of 0.01 GPa to 0.3 GPa.   The wiring board according to claim 1, wherein the thermal expansion coefficient of all the conductor layers is 15 ppm / ° C. or more and 25 ppm / ° C. or less.   The wiring density of the conductor layer closest to the first main surface is 50% to 90%, and the wiring density of the conductor layer closest to the second main surface is 50% to 90%. Or the wiring board of Claim 2.   A method of manufacturing a wiring board in which dielectric layers and conductor layers are alternately laminated,
  A process of preparing a support base;
  A step of preparing a metal foil adhesion body including metal foils that are in close contact with each other and separable;
  Placing the metal foil adhesion body on top of the support base;
  The dielectric layer disposed on the support base via the metal foil adhesion body and having a Young's modulus of 0.01 GPa or more and 0.3 GPa or less, a via conductor provided in the dielectric layer, and the dielectric Forming a laminate including the conductor layer disposed on the body layer and connected to the metal foil adhesion body via the via conductor;
  Separating the metal foil contained in the metal foil adhesion body at the interface, and separating the region on the metal foil adhesion body in the laminate from the support base in a state where the metal foil is attached;
  Adhering a reinforcing frame to the laminate;
  A method for manufacturing a wiring board, comprising:   The method for manufacturing a wiring board according to claim 4, further comprising:
  A method for manufacturing a wiring board, comprising: removing a peripheral portion of the laminate to expose an end portion of the metal foil adhesion body.