JP2005296425A - Game board, decorative member of game board, board face substrate of game board, and method of manufacture of game board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide adhesion means of adhesion means of a decorative member and a board face substrate in manufacturing a game board capable of using the conventional known decorative member and the board face substrate as it is, suitable for current continuous production line of the game board, used in easy and simple manner, dispensing with cumbersome washing operation in an adhesion process, excellent in stable adhesion strength, having adhering property without change over time, without fear of environment problem in use, and capable of enhancing the yield of product. <P>SOLUTION: The game board has the board face substrate and the decorative member adhered to the board face substrate. In this game board, the face board substrate and the decorative member are adhered with a resin capable of being moistened and adhering again. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a game board used for a pinball game machine such as a pachinko machine and other game machines, a decorative member attached to a board substrate of the game board, a board board of the game board, and a method for manufacturing the game board.

  In recent years, the pachinko game board is the most popular game machine in the market, and many model changes are made throughout the year to introduce new players. In the new model, orders are concentrated in a short period of time due to competition for customer acquisition at the amusement hall, and at the same time, repeat orders after the peak have become small-volume production with the conventional model, At the same time, since it is necessary to carry out an immediate delivery system, game machine manufacturers have a consistent Kanban production system from the introduction of parts to production shipment, and on the production site, decorative materials with different pattern designs prepared for each model. The game board is manufactured from the process of adhering to a board substrate such as a wooden plywood, and thereafter, integrated line production is performed in which drilling, nailing, winning devices, etc. are attached.

  As a typical example in a conventional pachinko game board, after applying a pattern and white back coat printing on the back surface of a transparent resin sheet having a thickness of about 100 to 250 μm, the thickness of the backing material is about 100 to 150 μm. A decorative member in which a paper base material is bonded to a printing surface has been proposed (Patent Document 1), or after a pattern is efficiently printed on a white paper base material, a transparent resin sheet is provided on the surface side of the printing surface. A decorative member (Patent Document 2) and the like to which is attached is proposed.

  As another example, a decorative member in which a resin-impregnated paper with a pattern is lined with a phenolic resin-impregnated paper (Patent Document 3), or a decorative member that is integrated by heating and pressurizing and the backing material is a fiber nonwoven fabric (patent) Document 4) has also been proposed, and in these game boards, a paper base material or the like used as a backing material for a decorative member is adhered to a board substrate made of wood plywood having a thickness of about 20 mm obtained by laminating and adhering wood. is there. And as for these adhesion | attachment means, as for all, the decorative member and the board | substrate surface apply | coated the liquid adhesive of vinyl acetate type | system | group to the adhesive surface, and were integrated.

  As another example of the means for adhering the decorative member and the board substrate, after applying a pressure-sensitive adhesive or a hot-melt adhesive on the printing surface of the transparent film on which the pattern is printed or the board substrate, pressing and sticking An example of an integrated game board (Patent Document 5) has also been proposed, which proposes an adhesive means of a different system from that used by applying a conventional liquid adhesive.

JP-A-4-44782 Japanese Utility Model Publication No. 62-908 Japanese Utility Model Publication No. 56-51893 JP 2000-70451 A Japanese Utility Model Publication No.57-19175

  In the production of game boards, the bonding process between the decorative member and the board substrate must be equipment suitable for line production, must have a stable and excellent adhesive force, and no deformation of the board after bonding. Then, most of the bonding process in the game board production line is provided with a backing material such as a paper base material on the bonding surface of the decorative member with the board substrate, and wooden veneer with excellent warp deformation and excellent nail pulling strength. In general, the board substrate is attached with a vinyl acetate adhesive, and a stable adhesive force can be secured.

  These adhesives are emulsion adhesives made of vinyl acetate resin, and can be applied and processed efficiently and uniformly on an adhesive surface of approximately 500 mm square shape. Done. Compared with other adhesive applicators, a roll coater is preferably used because a uniform adhesive can be applied in a short time just by passing the member between the rolls, and then the decorative member is overlapped, and approximately 40 When heated and pressurized at a temperature of about -80 ° C, it was possible to bond and integrate in a short time, which was optimal for a consistent production line.

  However, the problem of the application work by these roll coaters is that the adhesive is naturally cured during the work, so continuous supply and continuous use of the adhesive is the principle, and it cannot be stopped after the start of the application work. . Therefore, when the line is stopped during breaks or troubles, it is necessary to clean the roll coater each time.In addition, it is necessary to adjust the operation before starting the line. In comparison, the line could not be stopped and started freely, and it was a work process that was particularly problematic in terms of the consistency of work forms.

  Also, the cleaning operation at the time of stopping is to clean the adhesive on the surface of the coater roll with a spatula, etc., and then to clean thoroughly with water or warm water, a cured film of the adhesive will be formed on the surface of the roll. At this time, the cleaning operation is a troublesome operation that requires time and labor, such as causing variations in the amount of adhesive applied and causing problems in the adhesion of the decorative member.

  Furthermore, as a problem of cleaning work, the emulsion type adhesive can be washed with water, but if the washing water is allowed to flow into the sewer as it is, it may cause pollution problems and environmental problems. There was also a problem that the cost burden including these maintenance aspects increased.

  Further, in these coating devices, a part of the adhesive staying in the adhesive is hardened as time passes, and is easily changed to a semi-cured gelled product. Or the cured product of the adhesive that has turned to the opposite surface of the adherend contaminates the pressure press plate and dents the product surface.

  Further, the adhesion with the pressure-sensitive adhesive as described in Patent Document 5 causes peeling such as lifting due to expansion and contraction of the printing film due to temperature change or the like, and the durability of the adhesive strength is not preferable. And the use of the hot-melt adhesive described in Patent Document 5 causes deformation such as warping in the game board after bonding because the bonding temperature is as high as 80 to 140 ° C., which is practically adopted. It was an impossible proposal.

  As described above, with respect to the adhesion between the decorative member and the board substrate in the production of the game board, it is used by directly applying to these members using a liquid adhesive such as vinyl acetate which has been conventionally used. Has a number of problems, and the development of a completely new bonding means to solve these problems has been awaited.

  An object of the present invention is that a conventionally known decorative member and board substrate can be applied as they are in the means for adhering a decorative member and board substrate in the manufacture of a game board, and is also suitable for an integrated production line of current game boards. It is simple and easy to use, does not require cumbersome cleaning work in the bonding process, has excellent adhesive strength, has adhesive performance that does not change with time, and has environmental problems during use. It is an object of the present invention to provide a completely new bonding means that makes it possible to improve the product yield without worrying about the above.

  According to the present invention, the above-described problem is solved by the following means.

  A first aspect of the present invention is a game board including a board substrate and a decorative member bonded to the board substrate, wherein a resin that can be rewet bonded is used for the bonding.

  A second invention is the game board according to the first invention, characterized in that the resin which can be rewet-adhered is in the form of a film.

  A third invention is the game board according to the first invention or the second invention, characterized in that the resin which can be rewet and bonded is a water-soluble resin which can be dissolved by rewet.

  In a fourth aspect of the invention, the resin is any one of a sodium polyacrylate, polyacrylamide, polyethyleneimine, polyethylene oxide, polyvinylpyrrolidone, water-modified polyamide, polyvinyl alcohol, and polymethylvinyl ether resin. Alternatively, it is a game board according to any one of the first to third inventions, characterized in that it is a mixture containing any of them or a modifying compound.

  According to a fifth aspect of the present invention, there is provided a decorative member for a game board, wherein a resin layer capable of rewetting and bonding is formed on a surface on the board substrate side of the decorative member bonded to the board substrate of the game board.

  According to a sixth aspect of the present invention, there is provided a board substrate for a game board, wherein a resin layer capable of re-wetting and bonding is formed on a face of the decorative member in the board substrate to which the decorative member of the game board is bonded.

  A seventh invention is a method of manufacturing a game board comprising a board substrate and a decorative member bonded to the board substrate, and includes a board-side substrate side surface of the decorative member and a decorative member-side surface of the board substrate. Forming a resin layer that can be rewet-adhered on at least one of them, a surface of the resin layer that can be rewet-adhered, a surface on the decorative member side of the panel substrate, and a surface of the decorative member on the panel substrate side A process of wetting at least one surface of the board and a process of superposing and pressurizing the board substrate and the decorative board.

  According to an eighth aspect of the present invention, a resin layer that can be re-wet-bonded is formed on the adhesive surface of the decorative member with the board substrate and / or the adhesive surface of the decorative substrate with the decorative member. 1 is a game board according to the first aspect of the present invention, wherein the adhesive is integrated by wetting.

  According to the present invention, a conventionally known decorative member and a board substrate can be applied as they are in the means for bonding a decorative member and a board substrate in the manufacture of a game board, and is also suitable for an integrated production line of a current game board. It is simple and easy to use, does not require cumbersome cleaning work in the bonding process, has excellent adhesive strength, has adhesive performance that does not change with time, and has environmental problems during use. It is possible to provide a completely new bonding means that makes it possible to improve the product yield without worrying about the above.

  The best mode for carrying out the present invention will be described in detail below.

  In the game board according to the embodiment of the present invention, a resin layer capable of re-wetting adhesion is interposed between the decorative member, which is a component of the game board, and the board substrate, and the re-moisture adhesion between the decorative member and the board substrate. Adhesion and integration are achieved only by wetting the adhesive surface of any of the possible resin layers with water or warm water. Specifically, the adhesive surface of the decorative member, the adhesive surface of the board substrate, and the adhesive surface of the resin layer that can be rewet bonded are wetted, or the adhesive surface of the decorative member and the adhesive surface of the board substrate are wetted. Or wet the adhesive surface of the decorative member and the adhesive surface on the board side of the resin layer that can be rewet bonded, or wet the adhesive surface on the decorative member side of the adhesive layer of the board surface substrate and the resin layer that can be rewet adhesive As a result, the decorative member is bonded to the board substrate.

  According to the game board according to the embodiment of the present invention, it is possible to use any of publicly known decorative members and board substrates, and the conventional adhesive application work in the production of the game board can be used. Since it is abolished, the game board can be manufactured by a simple and easy bonding operation as compared with the conventional bonding method.

  In addition, according to the game board according to the embodiment of the present invention, it is possible to bond and integrate the decorative member and the board substrate by so-called water bonding by the interposition of the resin layer that can be rewet and bonded. In addition to eliminating the troublesome work of applying adhesive, it can be replaced with simple water or hot water, eliminating the troublesome cleaning work that is indispensable for the handling of adhesives and environmental pollution. Such problems can be solved.

  Then, according to the game board according to the embodiment of the present invention, for example, if a resin layer that can be rewet bonded to the adhesive surface of the decorative member and / or the adhesive surface of the board substrate is formed in advance, Adhesion integration is achieved by simply moistening the surface of at least one of the decorative member and the board substrate or at least one of the decorative member and the board substrate not forming the resin layer with water or warm water. In addition, the existing integrated production line equipment can be adapted as it is with almost no change, and the production line can be stopped and restarted, improving work efficiency and improving product yield. Can also contribute.

  In the decorative member for game boards according to the embodiment of the present invention, it is preferable to form a resin layer that can be re-wet-bonded on the adhesive surface of the decorative member with the board substrate. Since, without using a conventional adhesive, at least one of the bonding surfaces of the adhesive member and the board substrate can be bonded to a conventionally known board substrate simply by wetting with water or warm water. The decorative member can be wet-bonded and can solve the problems in production of the conventional game board using the adhesive.

  Moreover, it is preferable to form a resin layer that can be rewet-adhered on the adhesive surface of the board substrate with the decorative member on the board substrate for the game board according to the embodiment of the present invention. In this case, a conventionally known decorative member can be bonded by simply moistening at least one bonding surface of the board substrate and the decorative member with water or warm water without applying and using a conventional adhesive. Therefore, the board substrate can be wet-bonded and can solve the problems associated with the production of a conventional game board using an adhesive.

  In addition, the conventionally known decorative member and board substrate can be used as the decorative member and board substrate that can be used in the embodiment of the present invention, and is not particularly limited. Conventionally known decorative members are also used for the decorative material and / or the surface material of the board substrate for forming the resin layer that can be rewet-adhered, or the surface material of the decorative member and / or the board substrate when it becomes an adherend. Any material can be preferably used as long as it is a material that forms the adhesive surface of the board substrate.

  Examples of these adhesive surface materials are paper substrates, nonwoven fabric substrates, woven fabric substrates, synthetic resin substrates such as phenolic resins and melamine resins, and further used for conventional decorative members such as printed coatings. In addition to known backing materials, known adhesive surface materials used for conventional board substrates such as wood, plywood, wooden plywood, laminated board, artificial wood, synthetic wood, medium fiberboard, etc. are preferably applicable and more hydrophilic. A surface material having the above properties is more preferable.

  The rewet-adhesive resin in the embodiment of the present invention is particularly preferably a water-soluble resin, and is not particularly limited as long as it is a water-soluble resin. Since water-soluble resin can be re-dissolved by wetting, the resin on the surface part that has been dissolved by wetting easily penetrates and embeds in the uneven part or porous part of the adhesion surface of the adherend together with moisture, and so on. Since it solidifies with evaporation and diffusion of the resin to obtain a strong adhesive force and a stable adhesive performance without change with time, it can be a resin capable of re-wetting adhesion. As water-soluble resins that enable these, water-soluble synthetic resins, water-soluble semi-synthetic resins, water-soluble natural resins, and mixtures or compounds of these can be preferably applied.

  Examples of water-soluble synthetic resins include sodium polyacrylate, polyacrylamide, polyethyleneimine, polyethylene oxide, polyvinylpyrrolidone, water-modified polyamide, polyvinyl alcohol, and polymethylvinyl ether. In addition to being applicable, mixtures or modified compounds containing any of these are also preferred, and any of them can be preferably applied if they are water-soluble.

  As a preferable example, for example, in the case of a polyvinyl alcohol resin, a partially saponified polyvinyl alcohol having a saponification degree of about 71 to 94% can be preferably used. If the saponification degree is too low, it is difficult to dissolve in water. However, if the degree of saponification is too high, the water resistance is improved, but the melting temperature becomes high, causing problems in handling. More preferably, it is preferably about 84 to 92% partially saponified polyvinyl alcohol in order to dissolve well in water, have excellent film-forming properties and water resistance, and be soluble by rewetting with water or warm water.

  Examples of the modified compound include, for example, copolymerized modified products of resins such as higher vinyl carboxylates, higher alkyl vinyl ethers, acrylamides, allyl alcohols, and polyvinyl alcohol resins, carboxyl group-modified polyvinyl alcohol resins, and ethers. Modified polyvinyl alcohol resins such as modified, esterified, and acetalized modified polyvinyl alcohol resins, and the like, can be preferably applied.

  Examples of water-soluble semi-synthetic resins that can be preferably applied include cellulose resins such as carboxymethylcellulose, methylcellulose, and hydroxyethylcellulose, and starch-based processed resins such as oxidized starch, modified starch, and dextrin. In addition, a mixture or a modifying compound containing any of these can also be preferably applied.

  Examples of water-soluble natural resins include starches such as sweet potato, corn starch, potato, wheat and tapioca, and natural rubbers such as tragacanth gum and gum arabic, as well as seafood such as sodium alginate, funari and gelatin. Natural water-soluble resins such as those of animal species such as casein, glue, gelatin and the like can also be preferably applied, and mixtures or modified compounds containing any of these can also be preferably applied.

  In addition, any of the above water-soluble synthetic resins, semi-synthetic resins, natural resins, and the like, which are appropriately selected and mixed, can be preferably applied as long as they are water-soluble. Among these, a water-soluble synthetic resin is preferable from the viewpoints of being well soluble in water, excellent film-forming properties, low hygroscopicity, less affected by humidity change, excellent chemical resistance, and excellent adhesive performance. Applicable. And when forming the resin layer which can be re-wet-bonded using the aqueous solution by these resins, for example, in the case of partially saponified polyvinyl alcohol, an aqueous solution having a concentration of about 2 to 30% can be preferably used. These values are appropriately determined in consideration of the processing viscosity characteristics and the film thickness.

  Also, for the purpose of viscosity adjustment to ensure a certain film (layer) thickness, inorganic fillers such as calcium carbonate, talc and silica, or inorganic salts such as boric acid and borax are mixed as thickeners. Furthermore, it is also preferable to mix glycerin, glycols, petriol, ethanolamine, anionic nonionic surfactants, etc. as a plasticizer. It is also preferable to add and utilize these because the formation of a resin layer such as film formation is facilitated. In addition, by incorporating a conductive substance such as conductive carbon, an effect of preventing static electricity in the game board can be expected.

  Regarding the method of forming a resin layer that can be re-moistened on the adhesive surface of the decorative member or the board substrate, the powder of these resins is directly applied to the adhesive surface of the decorative member or the board substrate by powder coating such as electrostatic coating. Alternatively, if these water-soluble resins are dissolved in water, warm water, or an aqueous solution containing a solvent and used in the form of a liquid aqueous solution, a known liquid coating film or coating means can be applied and easily applied. It is possible to form a resin layer that can be re-wet-bonded. For example, these resin aqueous solutions may be applied with a known coating technology means such as a roll coater, spray coater, flow coater, brush coating, or by a known printing technology means such as silk printing or gravure printing. Alternatively, a film can be formed directly on the surface of the adhesive surface of the board substrate, and a resin layer that can be easily re-moistened when dried is formed.

  Further, as another example, these resins are once continuously formed into a film shape, and the resin film is indirectly re-humidified by re-sticking the resin film to the adhesive surface of the decorative member or the board substrate. An adhesive resin layer can be formed. This indirect and secondary method of forming a resin layer can be applied to a secondary decorative member or board substrate as long as a continuous lot of rewet-adhesive resin film can be produced efficiently. Compared with the direct resin layer formation described above, the operation is simple and easy in that the work can be easily performed when necessary, for example, by wetting with water or warm water. It is possible to form a film in the attaching operation, which is more preferable.

  Examples of methods for forming these rewet-adhesive resins in the form of films include known melt extrusion film methods, inflation film methods and the like similar to the method of forming thermoplastic resins generally performed from pellets of these resins. An extrusion film forming method can be preferably applied. Further, as other methods, it is also possible to form a film by casting from an aqueous solution of these resins or an aqueous solution containing a solvent, for example, a casting method in which a film is cast on an endless belt and then dried, A known liquid film forming method such as a drying drum method in which a film is cast on a rotating drying drum or a roll coating method in which a roll coating is applied to a belt or a drum and dried is preferably applied.

  The film-like rewet-adhesive resin film thus obtained is preferably wound up in a roll shape, and can be dissolved, for example, by rewet with water or hot water. It becomes wet and can be easily attached. For example, the film or member surface can be wetted by a known coat wet means such as a roll coater or a spray coater, and then can be applied efficiently and continuously by appropriate pressurization or heating / pressurization.

  In addition, when these film-like rewet-adhesive resin films are used after being wetted, they can be used with water, warm water or an aqueous solution containing a solvent, etc. It may be attached by being wetted with an aqueous solution or an aqueous solution containing a solvent. Or you may stick by heating and pressurization, without performing wet. Furthermore, other adhesives or other film-like adhesives may be used in combination and attached by means such as heating and pressing. Adoption of such means as wetting, heating, pressurizing, and a combination of adhesives is preferably carried out by selecting an optimal method as appropriate depending on the properties, performance, etc. of the resin film that can be rewet bonded.

  In the embodiment of the present invention, as an application example in the case of using these film-like rewet-adhesive resin films, these resin films are not attached in advance to the adhesive surface of the decorative member or the board substrate. Adhesion is achieved by interposing the rewet-adhesive resin film between the decorative member and the board substrate, and moistening the adhesive surface of the decorative member, the board substrate, and the rewet-adhesive resin film. It can also be a game board that is integrated, that is, indirectly bonded indirectly.

  Furthermore, as another application example of a resin film that can be re-wet-bonded, a decorative member is formed by heating and pressing, for example, as a backing material of a decorative member of Patent Document 4, or a transparent surface material Resin that can be rewet-adhered in the embodiment of the present invention, for example, as a backing material for a decorative member that integrates paper on which a pattern is printed with a transparent film-like adhesive member by heating and pressing. By integrating the film at the same time as the forming of the decorative member that is molded by heating and pressing, it is possible to obtain a decorative member having a resin layer that can be re-wet-bonded, and providing an excellent production efficiency. it can.

  Furthermore, as an application example of a resin film that can be wet-adhered, the film can be used as an adhesive film that can be wet-adhered. For example, it can be used to attach a backing material as an additional element to a conventional decorative member. The wet-adhesive adhesive film can be used. For example, when a conductive paper into which conductive carbon is further inserted is attached to the adhesive surface side of a known decorative member, the wet adhesive can be used. It can be applied as an adhesive film, for example, these can be integrated by wet adhesion using an adhesive film.

  Regarding the thickness of the resin layer that can be rewet-adhered to be formed on the decorative member or the board substrate, regardless of the direct film formation or the indirect film formation described above, it is determined appropriately depending on the type and shape of the adherent member. Although not limited, it is preferable that the film thickness is about 10 to 200 μm, more preferably 20 in order to make the adhesive force in the final adhesion to the subsequent decorative member or board substrate strong and stable. It is preferable to set the film thickness to about 100 μm. If the film thickness is too thin, it will not be completely buried in the unevenness of the bonding surface, resulting in variations in adhesive force, and if it is too thick, film formation will be difficult, the adherend will be warped, and it will be uneconomical and undesirable. It will be a thing.

  In the game board manufacturing method according to the embodiment of the present invention, a resin layer that can be rewet-adhered as described above is provided on the adhesion surface of the decorative member to the board substrate and / or the adhesive surface of the board substrate to the decorative member. After forming, wet at least one adhesive surface of the decorative member and the board substrate or at least one of the decorative member and the board substrate not formed with the resin layer with water or warm water, and then overlap each other. Since it can be bonded and integrated by means such as combining and pressing, it can be integrated with simple water or warm water without using conventional adhesives, so the conventional production line is almost changed. Without this, the game board can be easily and easily manufactured.

In the manufacturing method according to the embodiment of the present invention, the water or the surface of the decorative member and / or the board substrate on which the resin layer capable of rewetting adhesion is formed and the decorative member or the board substrate to be bonded to the decorative member and / or the board substrate. There is no particular limitation on the method of wetting warm water, and any known wetting means can be applied. For example, a roll coater or a spray coater can be preferably used. If a spray coater is used, spray coating can be performed without contacting the surface on which the resin layer is formed, and a roll coater is applied on the surface where the resin layer is not formed. it can. In addition, the amount of water for re-dissolving these rewet-adherable resins to obtain a preferable adhesion is preferably about ²⁰ to 200 g / m ^{2, and the} amount of moisture is appropriately determined depending on the type of adherend and the water absorption rate. To be determined.

  And after wetting, before adhering, it can superimpose adhesive surfaces as soon as possible, and can obtain sufficient adhesive force by pressurization or heating / pressurization under a conventionally known condition. The heating temperature is approximately 20 to 80 ° C., and the applied pressure is approximately 0.1 to 2 MPa. These temperatures, pressures, and times are not limited, and optimum conditions are determined by trials in the production line.

  Hereinafter, the embodiment of the present invention described above will be described in more detail with reference to examples using the drawings. Needless to say, the present invention is not limited to these examples.

FIG. 1 shows a game board 10 according to a first embodiment of the present invention, and shows a state in which a wet-bondable decorative member 7 and a board substrate 8 are bonded and integrated by wetting.
The wet-adhesive decorative member 7 used in FIG. 1 is shown in FIG. 3, and a wet-adhesive resin film is obtained by wetting the adhesive surface side of the decorative member 5 shown in FIG. 6 shows a state where 6 is bonded and integrated.

  The decorative member 5 shown in FIG. 4 has a transparent surface material 1 made of a transparent triacetyl cellulose resin film, each adjusted to a size of 460 × 530 mm, and a pattern 4 printed on the coated surface side of one-side coated paper. The white printed paper 3 is bonded and integrated with the transparent film-like adhesive member 2 by heating and pressing, and is formed to a thickness of 400 μm so that the pattern 4 can be visually recognized through the transparent surface material 1 on the surface. In addition, a decorative member conventionally used in a pachinko game board is shown.

The wet-bondable decorative member 7 shown in FIG. 3 is applied to the back side of the printing paper 3 of the decorative member 5 uniformly with water having a water content of approximately 90 g / m ² using a roll coater. The decorative member is formed by passing through two upper and lower roll pressurization devices (not shown) while being superposed on the wet-bondable resin film 6 and bonding and integrating them by pressurization.

  Also, the resin film 6 that can be re-moistened is known from a 20% aqueous solution of a partially saponified polyvinyl alcohol resin having a saponification degree of 88%, which is a polyvinyl alcohol-based water-soluble synthetic resin as a resin that can be re-moistened. It is a continuous film formed and dried by a casting method, and is a resin film having a thickness of 40 μm and capable of re-wetting adhesion.

  Here, the decorative member 7 capable of being wet-adhered is a 20% strength aqueous solution of a partially saponified polyvinyl alcohol resin similar to that used for the resin film 6 capable of being wet-adhered again. Since it is possible to easily form a coating film on the surface with a roll coater, a damp adhesive member 7 similar to that shown in FIG. 3 can be obtained by drying after forming the coating film. May be.

  The wet-bondable decorative member 7 obtained in this way was a decorative member free from defects such as warping, maintaining the same form as the original decorative member 5, having a beautiful pattern as viewed from the surface. Furthermore, since the rewet-adhesive resin film 6 that is lined is a film made of a rewet-adhesive resin, the resin film 6 of the decorative member 5 exhibits good adhesion.

In the game board 10 of FIG. 1, a bonding method between the wet-bondable decorative member 7 thus obtained and a board substrate 8 made of veneer plywood having the same outer dimensions of 460 × 530 mm and a thickness of 20 mm to which wood is laminated and bonded. With respect to the surface of the board substrate 8, the surface of the bonding surface side with the decorative member 7 is uniformly coated with water having a water content of approximately 90 g / m ² by a roll coater, and then these bonding surfaces are immediately overlapped with each other. It is a game board that is put into a board-type heating / pressurizing press apparatus (not shown) and press-pressed for 1 minute under the conditions of a heating temperature of 60 ° C. and a surface pressure of 1.4 MPa.

  The game board 10 integrally molded in this way has no deformation such as warpage, no abnormal parts such as dents on the surface of the decorative member, maintains the beauty of the original decorative member 5, and further the decorative member 5 The resin layer that can be rewet-adhered and formed on the adhesive surface is made of a resin that can be rewet-adhered when wet, and thus exhibits good adhesion to the board substrate 8 that has been conventionally used.

  FIG. 2 shows a state of forming the game board 11 according to the second embodiment of the present invention. Unlike the first embodiment, the game board 11 is different in that a resin layer that can be rewet bonded is formed on the side of the board surface 8 that is to be bonded to the decorative member 5, and the material, resin composition, dimensions, etc. Is exactly the same as in the first embodiment.

  In FIG. 2, the wet-bondable board substrate 9 provided on the bonding surface side of the board substrate 8 is applied to the wettable resin film 6 used in the first embodiment in the same manner as in the first embodiment. A game board 11 is shown in which the decorative member 5 used in Example 1 is bonded and integrated by wetting.

The board substrate 9 that can be wet-bonded is bonded to the surface of the board substrate 8 that has been wet-coated and wetted by approximately 90 g / m ^{2 with} a roll coater by roll pressurization in the same manner as in Example 1. Since it is a resin that can be re-wet-bonded, it has good adhesion and is a board substrate that can be wet-bonded excellently without deformation such as warping.
Further, the resin layer that can be rewet-adhered to be formed on the board substrate 8 may be a film formed with the same aqueous solution as used for the resin film 6 that can be rewet-adhered.

The game board 11 is about 90 g of the adhesive surface of the board substrate 9 that can be wet-bonded by a spray coater with respect to the method of bonding the board substrate 9 that can be wet-bonded thus obtained and the decorative member 5 used in Example 1. After spraying water uniformly with a water amount of / m ² , these adhesive surfaces are immediately overlapped and put into a flat plate type heating / pressing press apparatus (not shown), heating temperature 60 ° C., It is a game board by press press for 1 minute under the condition of a surface pressure of 1.4 MPa.

  The game board 11 bonded and integrated in this way has no deformation such as warpage, no abnormal parts such as dents on the surface of the decorative member, and maintains the beauty of the original decorative member 5. The rewet-adhesive resin layer formed on the adhesive surface is made of rewet-adhesive resin, and thus exhibits good adhesion to the conventionally used decorative member 5.

[Comparative example]
In order to compare the performance of the game board according to the embodiment of the present invention and the game board of the conventional example, a game board (not shown) as a comparative example was created.
The game board of the comparative example, on the bonding surface of the board substrate 8 used in the examples, known polyvinyl acetate which has been conventionally used an emulsion type adhesive, of substantially 80 g / m ² using a roll coater After uniformly applying the coating amount, the surface of the printing paper 3 of the decorative member 5 is overlapped with this, and similarly to the embodiment, it is put into a flat plate type heating / pressing press apparatus, It was created by press pressing for 1 minute under the condition of a surface pressure of 1.4 MPa.

[Performance comparison]
When the game board 10 and the game board 11 according to the embodiment were put into a constant temperature and humidity tester having a temperature of 60 ° C. and a humidity of 90% for 100 hours and then taken out and observed, There were no abnormal spots on the game board, such as blistering, floating, peeling, etc.
Furthermore, for the three persons after the completion of this test, a five-cycle thermal cycle test at a temperature of −10 to + 60 ° C. was carried out and observed with a thermal tester. There were no abnormalities such as floating or peeling.
Next, a nail driving test in which 10 nails having a diameter of 1.9 mm were driven from the surface of the game board to a depth of 10 mm was performed on the three game boards that had completed these tests. None of the nails were found to have abnormalities such as blistering, floating, peeling, etc.

  As a result, all of the gaming boards according to the embodiments of the present invention, which are bonded and integrated by wetting through a resin layer that can be re-moistened, are used for pachinko gaming machines without being inferior to conventional gaming boards. It had the performance of a game board that can be.

  The present invention is suitable for pinball game machines such as pachinko machines, but it goes without saying that the present invention can be applied to all game machines.

It is sectional drawing which shows the mode of shaping | molding of the game board 10 which concerns on Example 1 of this invention. It is sectional drawing which shows the mode of shaping | molding of the game board 11 which concerns on Example 2 of this invention. It is sectional drawing which shows a mode that the decorative member 5 is adhere | attached on the decorative member 7 which can be wet-bonded. 3 is a partially enlarged cross-sectional view illustrating a decorative member 5. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transparent surface material 2 Film-like adhesive member 3 Printing paper 4 Picture pattern 5 Cosmetic member 6 Resin film which can be rewet-adhered 7 Wet-adhesive decorative member 8 Board substrate 9 Wet-bondable board substrate 10 Game board
11 Game board

Claims (7)

  A game board comprising a board substrate and a decorative member bonded to the board substrate, wherein a resin that can be rewet bonded is used for the bonding.   The game board according to claim 1, wherein the rewet-adhesive resin is in the form of a film.   3. The game board according to claim 1, wherein the rewet-adhesive resin is a water-soluble resin that can be dissolved by rewet.   The resin is one of sodium acrylate, polyacrylamide, polyethyleneimine, polyethylene oxide, polyvinyl pyrrolidone, water-modified polyamide, polyvinyl alcohol, polymethyl vinyl ether, or a mixture containing any of them. The game board according to claim 1, wherein the game board is a modified compound.   A decorative member for a game board, wherein a resin layer capable of re-wetting and bonding is formed on a surface on the board substrate side of the decorative member to be bonded to the board substrate of the game board.   A board substrate for a game board, wherein a resin layer capable of re-wetting and bonding is formed on a face on the side of the decorative member in the board board to which the decorative member of the game board is bonded. In a game board manufacturing method comprising a board substrate and a decorative member bonded to the board substrate,
Forming a rewet-adhesive resin layer on at least one of the face on the board surface side of the decorative member and the face on the decorative member side of the board surface substrate;
Wetting at least one of the surface of the resin layer that can be rewet-adhered, the decorative member side surface of the panel substrate, and the decorative substrate side surface of the decorative member;
A step of superposing and pressurizing the board substrate and the decorative substrate;
A game board manufacturing method characterized by comprising: