JP2005294490A - Method and device for arraying and loading conductive ball - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a device for arraying and loading a conductive ball, in which a defective attraction is difficult to occur and which can array the conductive ball efficiently. <P>SOLUTION: The conductive balls B in a vessel are attracted and arrayed on an array plate 19, and loaded collectively to an electrode for a wafer W, on which the balls B must be loaded. When the conductive balls B are loaded on the electrode, a spacer 20 is abutted against the periphery of the array plate 19. Either one or both of the contamination of the array plate 19 or an unbalanced load to the conductive balls B are prevented by the spacer 20. The spacer 20 is abutted against a part or the whole of the periphery of the array plate 19. A defective ball loading is prevented, and the conductive balls can be arrayed properly and efficiently. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a conductive ball suction mounting method and an array mounting device, and in particular, a plurality of fine balls are collectively held on a ball array plate on which a plurality of ball suction holes are formed, and a wafer, a printed circuit board, The present invention relates to a method and an apparatus for collectively mounting on an electrode of an electronic component such as a semiconductor chip.

  Recently, a bump forming technique using a minute metal ball for electrical connection of a semiconductor chip has been used. By using the bump forming technology, it is possible to obtain a number of merits such as a reduction in size of the package and an increase in the number of pins. A bump forming technique using such a fine metal ball is described in Patent Document 1, for example.

  In the bump forming method proposed in Patent Document 1, suction holes are formed at all positions corresponding to the bump forming positions on the semiconductor chip in order to suck and hold the metal ball group for at least one semiconductor chip. A ball array plate is used. Then, after the fine metal balls are attracted and held on the ball array plate, the ball array plate is transported to the joining stage and mounted on the bump forming position.

  Accordingly, in this case, the sphericity and particle size accuracy are high, and minute conductive balls formed uniformly can be collectively mounted at the bump forming position. As a result, uniform bumps with little variation can be formed easily and efficiently.

  However, performing the arrangement for each semiconductor chip increases the number of repetitive operations and has a large demerit in terms of cost and time. For this reason, balls are arranged on all the electrodes corresponding to a plurality of chips on the wafer before cutting the wafer into individual chips, that is, before the dicing process.

JP 7-153765 A

  However, when balls are arranged collectively on all the electrodes on the wafer on which a plurality of semiconductor chips are formed, the number of electrodes reaches about several hundred thousand. When the balls are adsorbed under reduced pressure on the array plate, the array plate may be deformed by the negative pressure and the horizontal plane may not be secured, or the horizontal plane may not be secured due to mechanical accuracy. If the chip arrangement on the wafer or substrate is asymmetrical, the balls may not uniformly contact a large number of electrodes even if the suction head that sucks the balls is held horizontally and lowered to the wafer side. As a result, the outer periphery of the array plate comes into contact with the outer periphery of the wafer, the surface of the array plate is contaminated, such as dirt on the wafer surface, coating material or flux, etc. It becomes. In addition, an overload is locally applied to the ball (uneven load) or contact failure occurs, resulting in poor ball mounting.

  In view of such circumstances, the present invention is a conductive ball that is difficult to cause a suction failure when the conductive balls are sucked and arranged on the ball arrangement plate and can be efficiently arranged. An object is to provide an array mounting method and an array mounting apparatus.

  In the conductive ball array mounting method according to the present invention, the conductive balls are sucked and arranged on the array plate, and then the conductive balls are collectively mounted on the electrodes of the mounting object on which the balls are to be mounted. In the ball array mounting method, when mounting the conductive balls on the electrodes, a spacer is brought into contact with a peripheral portion of the array plate, and the spacer causes any contamination of the array plate and a bias load on the balls. One or both of them are prevented.

  Further, in the conductive ball array mounting method of the present invention, the spacer is in contact with part or all of the peripheral edge of the array plate.

  Further, in the conductive ball array mounting method of the present invention, the spacer is indirectly or directly inserted between the mounting object and the array plate to define a height direction distance between the mounting object and the array plate. It is characterized by doing.

  In the conductive ball array mounting device of the present invention, the conductive balls in the container are sucked and arrayed on the array plate, and then the conductive balls are collectively placed on the electrodes of the mounting object on which the balls are to be mounted. A ball array mounting device to be mounted, comprising: a spacer that contacts a peripheral edge of the array plate when the conductive ball is mounted on the electrode, and the spacer causes contamination of the array plate and the spacer One or both of the uneven loads on the balls are prevented.

  In the conductive ball array mounting device of the present invention, the spacer is in contact with a part or all of the peripheral edge of the array plate.

  In the conductive ball array mounting device according to the present invention, the spacer may be arranged near the mounting object on a stage on which the mounting object is mounted.

  In the conductive ball array mounting device according to the present invention, the spacer is disposed on a peripheral portion of the mounting object.

  Further, in the conductive ball array mounting method of the present invention, the spacer is made of an elastic body and is deformed when the ball is mounted.

  The conductive ball array mounting device of the present invention is characterized in that the spacer is made of an elastic body and is deformed when the ball is mounted.

  According to the present invention, when the conductive ball is mounted on the electrode, the spacer is in contact with the peripheral portion of the array plate. This spacer is arranged on the side of the mounting target on the stage on which the mounting target is placed, or on the peripheral edge of the mounting target. By contacting a part or all of the upper part, direct contact between the wafer and the array plate is prevented, and contamination of the array plate is prevented. Further, it is possible to absorb the unbalanced load on the conductive balls, thereby preventing ball adsorption failure and mounting failure, and arranging the conductive balls appropriately and efficiently.

Hereinafter, preferred embodiments of a method and apparatus for mounting and arranging conductive balls according to the present invention will be described with reference to the drawings.
First, an outline of a bump forming process system using conductive balls according to the method or apparatus of the present invention will be described. As shown in FIG. 1, first, a wafer or substrate on which conductive balls are to be mounted is inspected, and the surface and the like are cleaned as necessary. Electrodes on which bumps are to be formed are formed on the surface of the cleaned wafer or the like by sputtering, plating, or the like.

  Next, a flux is applied on the electrode, and a conductive ball is mounted thereon. Ball mounting defects (excess balls, missing balls, etc.) are inspected and repaired as necessary. By this repair, a yield of about 100% is obtained, and further, washing is performed after reflow. The state after cleaning is inspected again, and repairs are performed as necessary. Through such a process, bumps are formed on a substrate such as a wafer or a substrate.

  FIG. 2 shows a schematic configuration of the device of the present invention. In this embodiment, the semiconductor substrate or wafer W moves while being fixed on the wafer stage 10 along the wafer conveyance path in the direction perpendicular to the paper surface (X direction), and waits at the ball array mounting portion. It should be noted that a flux application process for applying a flux to the electrodes of the wafer W is set in advance before the ball arraying process. In this flux application process, for example, a flux is applied to the electrode of the wafer W on the wafer stage 10 by a transfer head having transfer pins corresponding to the electrodes of the wafer W.

  Here, in the embodiment of the present invention, for example, a wafer having a size of 4 inches or more is particularly targeted. According to this wafer W, it is possible to obtain a plurality of semiconductor chips C (individual square portions) to be formed as shown in FIG. A plurality of conductive balls are mounted. Although the conductive balls are shown in a simplified manner in FIG. 4, there are hundreds of thousands of conductive balls used in the entire semiconductor chip C. In the present invention, a very large amount of conductive balls are thus collectively mounted on the wafer W.

  As shown in FIG. 2, a guide or guide rail 11 is installed along a direction (Y direction) orthogonal to the wafer transfer path, and a ball mounting head 12 movable in the YZ direction is supported on the guide rail 11. Is done. As will be described later, the ball mounting head 12 sucks and arranges the conductive balls B on the ball arrangement plate. Then, the conductive balls B are collectively mounted on the electrode portions of the semiconductor chip C formed on the wafer W.

  A ball supply device 13 is arranged on one end side of the guide rail 11 so as to be positioned below the ball mounting head 12. The ball supply device 13 includes a ball container (ball tray) 14 that stores a considerable amount of conductive balls B, and a vibrator that vibrates the ball tray 14 and jumps the conductive balls B in the ball tray 14. Yes. The ball supply method may be by jumping the conductive ball B as in the present embodiment, or may be blown up or blown by a gas flow.

  In FIG. 2, the ball replenishing device is simplified, but an optical sensor is provided so that the conductive balls B in the ball tray 14 do not decrease more than a certain level. According to this optical sensor, light is blocked if the jumping conductive ball B is a considerable amount or more, but when the density of the conductive ball decreases and light is transmitted, the optical sensor receives the transmitted light. To do. Accordingly, a considerable amount of the conductive ball B is automatically replenished from the conductive ball replenishing device.

  Between the ball supply device 13 and the ball mounting stage 10, a poorly arranged ball removing mechanism 16 and an alignment inspection camera 17 are arranged. The ball removing mechanism 16 removes misaligned balls in the ball mounting head 12 by suction or gas blowing. When vibration is applied to the mounting head 12 during removal, the mounting head 12 can be removed more effectively. In this case, the vibration frequency is preferably about several Hz to 1 GHz. In addition, the array inspection camera 17 inspects a ball array defect in the ball mounting head 12.

  The ball mounting head 12 reciprocates between the ball supply device 13 and the ball mounting stage 10, but has a suction mechanism 18 connected to a negative pressure or vacuum source as shown in FIG. Thus, a large number of conductive balls B are arranged by suction. The ball array plate 19 has suction holes 19 a corresponding to the electrode portions of the plurality of semiconductor chips C on the wafer W. Then, by the suction mechanism 18, the conductive balls B jumping in the ball tray 14 can be sucked one by one in each suction hole 19 a.

  Here, the chip arrangement on the wafer W or the substrate may be asymmetric. That is, in the example shown in FIG. 4, the semiconductor chips C are arranged symmetrically with respect to the X axis or Y axis on the wafer W. However, not only in this case, the semiconductor chips C may be arranged asymmetrically with respect to the X axis or Y axis. Including.

  Now, as shown in FIG. 5 in the present invention, it has a spacer 20 that comes into contact with the peripheral edge of the ball array plate 19 when the conductive ball B is mounted on the electrode. The spacer 20 is disposed on the stage 10 in the vicinity of the wafer W so as to contact the peripheral edge of the ball array plate 19, that is, the region where the conductive balls B are not arrayed. In this case, it may be in contact with part or all of the peripheral edge of the ball array plate 19.

  In the specific configuration of the spacer 20, for example, a spacer having a ring shape and having a predetermined elasticity and rigidity made of synthetic resin, metal, or the like, and heat resistance is preferable. The spacer 20 is configured, for example, by sticking a heat-resistant tape, O-ring, silicon rubber or the like to the surface of the stage 10. The initial thickness (height H) of the spacer 20 is determined by the load value and the material of the spacer, but if it is an elastic body such as rubber, the thickness of the wafer W, the electrode thickness, and the conductive ball B If the metal is set to be larger than the total diameter and has high rigidity, it may be set lower by several to several tens of micrometers. For example, the hardness in the case of an elastic body is preferably 60 to 100 (JIS Hs).

An arrangement operation in which the ball mounting head 12 sucks the balls and mounts the conductive balls B on the wafer W in the above configuration will be described.
In the ball supply device 13, the conductive balls B in the ball tray 14 are jumped by a shaker. As shown by the dotted line in FIG. 2, the ball mounting head 12 is lowered to a predetermined height of the ball tray 14, and the jumping conductive ball B is adsorbed.

  Next, after attracting the conductive ball B, the ball mounting head 12 moves up and moves to the ball mounting stage 10 along the guide rail 11. At this time, the defective ball is removed. Thereafter, the array inspection camera 17 moves in the X direction to inspect the ball adsorption state over the entire array surface of the ball array plate 19. If the inspection result is good, the stage moves to the ball mounting stage 10. In addition, if an alignment defect is found during this inspection, the defect removal is performed by returning to the position of the ball removal mechanism 16.

  At the time of this defect removal, the removed position is stored by a removal position storage device (not shown), and feedback is performed so that the ball tray 14 comes to the defect removal position on the ball array plate 19 to perform re-adsorption. It can also be.

  Next, the ball mounting head 12 is aligned with the wafer W waiting on the ball mounting stage 10. Then, by lowering the ball mounting head 12, the conductive balls B attracted to the ball array plate 19 are mounted on the electrode portion of the wafer W coated with the flux.

  The ball mounting head 12 is configured such that the mounting load when contacting the wafer W can be controlled according to the number and material of the conductive balls, the spacer thickness, the material type, and the like. As a result, the conductive ball B can be brought into contact with the wafer W with an optimum load, and the conductive ball B can always be mounted appropriately and smoothly.

  When the conductive balls B are mounted on the electrodes as described above, the spacers 20 are disposed on the peripheral edge of the ball array plate 19. Here, if the horizontal plane of the ball array plate 19 is not secured due to the mechanical accuracy of the apparatus, or the chip array on the wafer W or the substrate is asymmetric, the suction head 12 that sucks the conductive balls B as it is. Even if the wafer is held horizontally and lowered to the wafer W side, the conductive balls B may not be in uniform contact with a large number of electrodes, that is, may come into contact with each other (see the dotted line in FIG. 5). According to the present invention, the spacer 20 is first brought into contact with the vicinity of such a piece contact portion, and the posture of the ball array plate 19 is corrected while absorbing the overload of the portion, whereby the bias load on the conductive ball B is corrected. To absorb. As a result, defective ball mounting can be prevented and the conductive balls B can be arranged appropriately and efficiently.

  As described above, the spacer 20 may be in contact with part or all of the peripheral edge of the ball array plate 19. For example, as shown in FIG. 6, a ring-shaped member is divided in the circumferential direction. A plurality of small pieces 20a may be arranged in a ring shape. In this case, the number or arrangement pitch of each small piece 20a can be appropriately set as necessary.

Next, a second embodiment of the conductive ball array mounting method and apparatus according to the present invention will be described.
FIG. 7 shows a second embodiment. In the second embodiment, the spacer 20 is disposed on the peripheral edge of the wafer W, that is, in a portion where no electrode is provided. In this case, it may be in contact with part or all of the peripheral edge of the ball array plate 19.

  In the specific configuration of the spacer 20, for example, a spacer having a ring shape and having a predetermined elasticity and rigidity made of synthetic resin, metal, or the like, and heat resistance is preferable. The initial thickness (height H) of the spacer 20 is determined by the load value and the material of the spacer. For example, in the case of an elastic body, the spacer 20 is set to be larger than the sum of the electrode thickness and the diameter of the conductive ball B. . Also in this example, as shown in FIG. 6, a ring-shaped object may be divided in the circumferential direction, and a plurality of small pieces 20a may be arranged in a ring shape. In this case, the number or arrangement pitch of each small piece 20a can be appropriately set as necessary.

  Here, when the conductive balls B are adsorbed to the array plate 19 under reduced pressure, if the ball array plate 19 is deformed by the negative pressure (see the solid line in FIG. 7) and a horizontal plane is not secured, the conductive balls B are left as they are. Even when the sucked suction head 12 is held horizontally and lowered to the wafer W side, the conductive balls B may not uniformly contact a large number of electrodes. In the second embodiment, the spacer 20 is first brought into contact with the vicinity of the peripheral edge of the ball array plate 19 to correct the horizontal plane of the ball array plate 19 while absorbing the overload of the portion. Absorbs unbalanced loads. As a result, defective ball mounting can be prevented and the conductive balls B can be arranged appropriately and efficiently.

Next, a third embodiment of the conductive ball array mounting method and apparatus according to the present invention will be described.
8 and 9 show an example in which a spacer 20 having rubber elasticity is used. The height H of the spacer 20 before mounting the ball is larger than the value obtained by adding the wafer thickness and the ball diameter, but when the ball is mounted, the spacer 20 is deformed by a load and becomes an appropriate height H ′. In this example, when the conductive ball B is mounted on the electrode, the spacer 20 is in contact with the peripheral edge of the ball array plate 19. At this time, the spacer 20 absorbs the uneven load due to the deformation of the ball array plate 19 due to the negative pressure when the conductive balls B are attracted as described in the second embodiment. Therefore, also in this embodiment, it is possible to prevent defective ball mounting and to arrange the conductive balls B appropriately and efficiently. In this case, since the spacer 20 has elasticity, when the horizontal plane of the ball array plate 19 is corrected, the spacer 20 is balanced while making an effective contribution to an appropriate ball array.

  Further, although not shown in the present embodiment, when the ball is mounted (strictly, after the conductive ball B contacts the electrode of the wafer W), the inside of the suction head 12 is switched from negative pressure to positive pressure, The conductive ball B can be easily separated from the suction hole 19a. In this case, if the inside of the suction head 12 is set to a positive pressure, if there is no spacer 20, the peripheral portion of the ball array plate 19 without the conductive ball B as a contact partner is lowered (on the stage 10 side) by the positive pressure. ) Bends or deforms. That is, since the conductive ball B is sandwiched between the peripheral portion of the ball array plate 19 and the wafer W and supported by them, the ball arrangement plate 19 is not deflected and displaced. Then, if the peripheral edge of the ball array plate 19 is left as it is, it is displaced downward from the main body of the suction head 12, resulting in contact with the wafer W surface.

  On the other hand, by using the spacer 20, the peripheral edge portion of the ball array plate 19 is supported by the spacer 20 at the time of positive pressure in the suction head 12. Accordingly, it is possible to prevent the peripheral edge of the ball array plate 19 from being displaced from the main body of the suction head 12 and coming into contact with the surface of the wafer W, thereby contaminating the wafer W with a flux or a coating material. it can. As described above, in the present embodiment, the conductive balls B can be arranged appropriately and efficiently, and contamination of the ball arrangement plate 19 can be effectively prevented.

  In the above case, the amount of downward displacement of the ball array plate 19 from the suction head 12 depends on the material and thickness h of the ball array plate 19 itself, the outermost conductive balls B mounted on the wafer W, and the spacer 20. It depends on the positional relationship between For example, since the mounting position of the conductive ball B is determined by the electrode arrangement on the wafer W, when the outermost ball mounting position is located away from the edge of the wafer W, the mounting position of the spacer 20 is The distance from the outer peripheral ball mounting position increases, and even if the spacer 20 is inserted as it is, the ball array plate 19 itself may bend and come into contact with the surface of the wafer W to be contaminated. This is likely to occur when the thickness h of the ball array plate 19 is thin or a soft material. About these points, the present inventors discovered that there exists the following relationship.

In a state where a load is applied to the conductive balls B and the spacers 20 when the balls are mounted, the ball array plate 19 is fixedly supported by the conductive balls B and the spacers 20 on the outermost periphery on the wafer W. Considering the case where the suction head 12 is set to a positive pressure in this state is replaced with a plate bending model that receives a material mechanical vertical load, the following equation is established.
ω _max = αβ (pa ⁴ / Eh ³ ) (1)
Where, ω _max : maximum deflection (displacement), α and β; constant, p: uniform vertical load (positive pressure) per unit area, a: distance between ½ support points of ball array plate (2a = maximum) Distance between conductive balls and spacers on the outer periphery), E: Young's modulus, h: thickness of the ball array plate.

In equation (1), it is assumed that a load is applied during the ball mounting process, and the ball array plate 19 is supported by the conductive balls B and the spacers 20 in the periphery thereof. ω _max indicates the amount of displacement of the ball array plate 19 when the suction head 12 is set to a positive pressure. The constant α is determined by the Poisson ratio ν and the plate shape, and the constant β is determined in consideration of various uncertain factors.

Next, FIG. 9 shows an example of determining the arrangement position of the spacer 20 in consideration of the amount of deflection (displacement) of the ball array plate 19 when the suction head 12 is set to a positive pressure using the equation (1). Based on this explanation.
The material of the ball array plate 19 is hard Ni (E = 219.2 Gpa), thickness h = 100 μm, α = 0.171, and p = 1 kgf / cm ² . When the diameter of the conductive balls B mounted on the wafer W is 100 μmφ and the diameter of the suction holes of the ball array plate 19 is 70 μmφ, the distance from the surface of the ball array plate 19 to the surface of the wafer W when the balls are mounted is Since a part of the conductive ball B enters the suction hole, the thickness is about 85 μm. The spacer 20 is deformed to a height H ′ by a load, and a material and a thickness are applied so that the conductive ball B and the surface of the wafer W are in contact with each other.

Further, the distance from the surface of the ball array plate 19 to the surface of the wafer W when the balls are mounted is ω _max , and if the ball array plate 19 is bent beyond this, the surface of the wafer W is contacted and contaminated. That is, in order to avoid contact, the maximum deflection ω _max <85 μm must be satisfied. Accordingly, the position of the spacer 20 is adjusted, and the distance 2a between the conductive ball and the spacer on the outermost periphery is calculated so that the deflection ω _max <85 μm. Therefore, the following equation (2) is derived from the equation (1).
2a = [ω _max Eh ³ / αβp] ^1/4 (2)

  The spacer 20 is installed so that it may become 2a or less derived | led-out by (2) Formula. As a result of the experiment, it was confirmed that when the equation (2) is β = 1 or more, preferably 3 or more, the conductive ball B can be mounted without the ball array plate 19 contacting the wafer W. For example, if β = 1, the value in the above example is 2a≈11 mm. Therefore, if the spacer 20 is installed within 11 mm, the ball array plate 19 will contact the wafer W when the suction head 12 is set to a positive pressure. Could be prevented. When β = 0.2 or less, the ball array plate 19 may come into contact with the wafer W.

  The thickness h of the ball array plate 19 ranges from about 30 μm to 200 μm or more, and it is preferable that the thickness is larger in consideration of bending. On the other hand, when processing the suction hole, the thinner one is easier to process, and therefore it is necessary to fully consider both bending and processing. By using the above formula, design guidelines can be obtained easily.

Although the present invention has been described in the embodiment, the present invention is not limited to the above-described embodiment, and can be appropriately modified within the scope of the present invention.
For example, the spacer 20 in the first embodiment may be configured to be vertically adjustable with respect to the stage 10 so that its height H can be adjusted. By making the spacer 20 adjustable in height in this way, it is possible to always accurately absorb the eccentric load that slightly acts on the conductive ball B.

  Further, the spacer 20 in the second embodiment can be configured to be inserted into and removed from the wafer W in conjunction with the movement of the suction head 12. For example, when the wafer W is carried in and out of the stage 10, it may be automatically installed only when the ball is mounted. Thus, by making the spacer 20 insertable / removable, it can be used for each wafer W.

  In addition, the material of the ball array plate 19 in the third embodiment may be a material other than Ni, such as a Ni alloy, an alloy containing Fe or Fe, an alloy containing Co or Co, or glass. In any case, the same effects as those of the above embodiment can be obtained.

It is a figure explaining the outline | summary of the bump formation process system using the conductive ball which concerns on this invention. It is a figure which shows schematic structure of this invention apparatus. It is a sectional side view which shows the structure around the ball | bowl mounting head in this invention apparatus. It is a top view which shows the example of the wafer in which the conductive ball in embodiment of this invention is mounted. It is a perspective view which shows the effect | action of the spacer in the 1st Embodiment of this invention. It is a figure which shows the modification of the spacer in this invention. It is a sectional side view which shows the effect | action of the spacer in the 2nd Embodiment of this invention. It is a sectional side view which shows the effect | action of the spacer in the 3rd Embodiment of this invention. It is a sectional side view which shows the effect | action of the spacer in the 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Ball mounting stage 11 Guide rail 12 Ball mounting head 13 Ball supply apparatus 14 Ball container (ball tray)
15 Exciter 16 Ball removal mechanism 17 Array inspection camera 18 Suction mechanism 19 Array plate 19a Suction hole 20 Spacer W Wafer

Claims (9)

A ball array mounting method in which the conductive balls are collectively mounted on the electrodes of the mounting object on which the balls are to be mounted after the conductive balls are suction-arranged on the array plate,
When mounting the conductive balls on the electrodes, a spacer is brought into contact with a peripheral portion of the array plate so that either or both of contamination of the array plate and a biased load on the balls are prevented by the spacer. A ball array mounting method characterized by that.   The ball array mounting method according to claim 1, wherein the spacer is in contact with part or all of a peripheral portion of the array plate.   The said spacer is indirectly or directly inserted between the said mounting target object and the said arrangement | positioning board, and prescribes | regulates the height direction distance between the said mounting target object and the said arrangement | positioning board. Ball array mounting method. A ball array mounting device in which the conductive balls are collectively mounted on the electrodes of the mounting object on which the balls are mounted after the conductive balls are sucked and arrayed on the array plate,
When the conductive ball is mounted on the electrode, the conductive ball has a spacer that abuts on the peripheral edge of the array plate, and the spacer prevents either or both of contamination of the array plate and a biased load on the ball. A ball array mounting device characterized by the above.   The ball array mounting device according to claim 4, wherein the spacer is in contact with a part or all of a peripheral portion of the array plate.   6. The ball array mounting device according to claim 4, wherein the spacer is disposed on a side of the mounting target on a stage on which the mounting target is mounted.   The ball array mounting device according to claim 4, wherein the spacer is disposed on a peripheral portion of the mounting object.   The ball array mounting method according to claim 1, wherein the spacer is made of an elastic body and is deformed when the ball is mounted.   The ball array mounting device according to claim 4, wherein the spacer is made of an elastic body and is deformed when the ball is mounted.

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