JP2005294387A - Case for electronic component and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem in a case of electronic component of the conventional ceramic structure that it is difficult to highly accurately control each size of the case body after the baking process, because the baking process is used as the forming means thereof and therefore ceramic is contracted before and after the baking process and the contraction coefficient thereof is not constant. <P>SOLUTION: The case body for electronic component is formed of a metal or an alloy the bottom is formed with an organic multilayer plate, a side wall is erected and fixed at a side edge of one main surface, and an electrode pad for connection of electronic element of the bottom is formed. In the manufacturing method of the case for electronic component, a plurality of cases are manufactured simultaneously by conducting the etching and cutting of the case sheet formed by laminating each member forming the case body described above. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a container body constituting a surface-mount type electronic component package and a method for manufacturing the same.

  In recent years, there has been a strong demand for downsizing of electronic parts such as piezoelectric vibrators and piezoelectric oscillators mounted on electronic devices, and the accompanying increase in precision and cost of parts dimensions. The invention is devised.

  As a prior art, an example of a container body constituting a package for an electronic component used for a piezoelectric vibrator, a piezoelectric oscillator, or the like is shown in the drawing. That is, the container body is formed of a bottom portion made of ceramic as an insulating material, and a side wall portion made of ceramic as the insulating material, which stands upright on the edge of the bottom portion.

  A plurality of metal electronic device connection electrode pads that are electrically connected to the electronic device to be mounted are formed on one main surface of the bottom portion that constitutes the space for mounting the electronic device, surrounded by the side wall portion, A conductive portion is formed from this electrode pad to an external connection electrode pad for electrical connection and fixation to another motherboard or the like formed on the other main surface of the bottom.

  In order to form the lead of the conductive portion, a plurality of ceramic layers are formed, and the conductive wires made of the metal film formed on the main surface of each ceramic layer are electrically connected by a through hole penetrating the ceramic layer. A container body is formed by electrical conduction between the electronic element connection pad and the external connection pad.

  Generally, a metallized layer or the like is formed on the top of the side wall of such a container body, and a metal lid is disposed on the metallized layer so as to cover the opening of the side wall. By adhering, an electronic component is configured by a package in which the internal space surrounded by the side wall is hermetically sealed.

  In addition, as a method of manufacturing the container body as described above, a plurality of containers are obtained by cutting and separating a lump of ceramic sheets in which a part of each container body shape is formed by firing processing at a predetermined cutting position. Methods for manufacturing the body are commonly used.

  The following documents are disclosed about the structure of the container for electronic components as described above.

JP 2002-26680 A

  In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.

  As electronic components become smaller and thinner, the length and width of electronic components are several mm or less and the thickness is 1 mm or less, and these electronic components are mounted with high density. Therefore, it is necessary to have a component dimensional accuracy in units of μm in a package, particularly a container body. However, in the container body for an electronic component having the conventional ceramic structure described above, since the firing process is used as the forming means, the ceramic shrinks before and after the firing process and the shrinkage rate is not constant. It is difficult to control each dimension of the container body with high accuracy.

  Further, when a plurality of container bodies are cut and formed from a lump of ceramic sheets, there is a concern about the warpage caused by the shrinkage that occurs in the ceramic sheets and the variation of the container body size from sheet to sheet. Furthermore, a container made of ceramic is relatively weak against bending stress from the outside, and may easily crack when the limit is exceeded. Furthermore, the unit price of a ceramic used for a container of an electronic component is often high.

  Furthermore, among the conventional container bodies formed of materials other than ceramic, the unit price of the container body made of resin is lower than that of ceramic, but the material is not airtight as a container body and is heated or A gas may be generated due to a change with time, and a problem caused by this gas may be a problem. In addition, in a container body formed by laminating a large number of organic insulating plates, it is necessary to form a space for mounting electronic elements in the container body and to expose patterns such as electrode pads for connecting electronic elements, which increases man-hours and costs. Furthermore, there is a problem that dust generation during processing must be processed.

  The present invention has been made to solve the above-mentioned problems. As a first aspect of the present invention, a side wall formed with a bottom part and a side wall part standing upright on the edge part of the bottom part is mounted. A conduction portion including both electrode pads is formed from the electrode pad for connecting an electronic element formed on the inner main surface of the bottom surrounded by the portion to the electrode pad for external connection formed on the outer main surface of the bottom. In the container for electronic components, the bottom is formed of an organic multilayer plate, and the side wall is upright and fixed to the edge on the main surface side where the electrode pad for connecting the electronic device of the bottom is formed The part is a container body for an electronic component characterized by being formed of a metal or an alloy.

  Further, the container body for an electronic component as described in the preceding item, wherein the edge surface of the bottom part and the bottom surface of the side wall part are bonded and fixed with a prepreg.

As a second invention, a bottom portion and a side wall portion standing upright on the edge portion of the bottom portion are formed, and the bottom portion is formed on the inner main surface of the bottom portion surrounded by the side wall portion on which the electronic element is mounted. In the method of manufacturing a container body for an electronic component that forms a conduction portion including both electrode pads, from the electrode pad for connecting an electronic element to the electrode pad for external connection formed on the bottom outer side main surface,
A plurality of organic insulating plates having a size matching the bottom of a plurality of container bodies are stacked, and a plurality of electrode pads for connecting electronic devices are placed on the outermost surface which is the inner surface of the container body. A plurality of external connection electrode pads are formed on the other outermost surface, which is the bottom surface of the container body. Forming an organic multilayer board electrically connected to the electrode pad by a desired wiring formed by a through hole and a conductive portion;
A step of disposing a prepreg on one outermost surface where the electrode pad for connecting an electronic element of the organic multilayer plate is formed;
A metal or alloy plate having the same vertical and horizontal dimensions as the organic multilayer plate is disposed on the upper surface of the prepreg, and the organic multilayer plate and the metal or alloy plate are fixed to each other via the prepreg. Forming a step;
Forming a resist film with a uniform thickness on a metal or alloy plate;
On the surface of the resist film, a mask in which an opening shape pattern of a desired side wall part for forming a metal or alloy plate is disposed, the resist film is exposed from above the mask, and developed,
A step of removing the exposed metal or alloy plate by etching after removing the resist film by development to form a portion to be a side wall portion of each container body;
Removing the prepreg exposed at the inner bottom of the side wall and exposing an electrode pad for connecting an electronic device under the prepreg;
And a step of cutting and separating the processed container sheet into individual container bodies.

  Further, the present invention is also the container for electronic parts and the method for manufacturing the same according to the preceding item, wherein copper is used as the material of the side wall or the metal or alloy plate constituting the container sheet.

  In the container for an electronic component of the present invention and the manufacturing method thereof, a simple construction method that does not involve mechanical and thermal action such as laminating processing and etching processing of an organic multilayer plate and a metal or alloy plate is used. Since the photolithographic method is used for the part, a large number of containers having the same size can be manufactured simultaneously with high dimensional accuracy.

  In addition, since each process is performed according to the sheet shape, it is not necessary to reduce the size and accuracy of the jig and the manufacturing equipment as the size of the container body is reduced, so that productivity is improved. Further, the container body according to the present invention has a large ECM (Electronic Counter Measurement) effect because the side wall portion is formed of a metal or an alloy. In particular, when copper having a relatively high conductivity is used as the side wall member, the effect is further increased. It becomes large and it can prevent that the malfunction arises in the characteristic of the electronic element mounted in a container body inside.

  Due to the above-described actions, the present invention has an effect of providing a container for an electronic component that can be manufactured at a low cost with a very high dimensional accuracy and high reliability, and a manufacturing method thereof.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a container body for an electronic component and a method for manufacturing the same according to the present invention will be described with reference to the drawings.
FIG. 1 is a process diagram showing a method for manufacturing a container for an electronic component according to the present invention. FIG. 2 is a perspective view showing the shape of the container body produced by the manufacturing method disclosed in FIG. In FIGS. 1 and 2, a part of the structure is not shown and the dimensions are partially exaggerated for the sake of clarity. In particular, the thickness dimension of each part is shown in a deformed form for easy understanding of the present invention.

  That is, in FIG. 1A, a plurality of organic insulating plates having a size combining a plurality of bottom portions of the container body formed in the final process are stacked, and one outermost surface 13 serving as an inner surface of the container body. A plurality of electrode pads 12 for connecting electronic devices are formed on each container body, and a plurality of electrode pads for external connection (see FIG. (Not shown) is formed in accordance with the individual container body, and is electrically connected with the desired wiring formed by through holes and conductive portions between the electrode pads for electronic element connection 12 and the electrode pads for external connection. A plate 11 is formed, a prepreg 14 having an adhesive action is disposed on one outermost surface 13 of the organic multilayer plate 11 on which the electrode pads 12 for connecting electronic elements are formed, and the side wall of the container body is disposed on the upper surface of the prepreg 14. The height of the part is the thickness dimension and Placing copper plate 15 of the same length and width as the organic multilayer board 11.

  Next, in FIG.1 (b), the organic multilayer board 11 and the copper plate 15 are adhere | attached through the prepreg 14, and the container sheet | seat 10 is formed. As an action of the prepreg 14, in addition to adhesion and fixation between the organic multilayer substrate 11 and the copper plate 15, one outermost surface 13 of the organic multilayer plate including the electronic element connection electrode pads 12 is protected during the etching process described later. It also has an effect.

  Next, in FIG.1 (c), from the surface of the position used as the top part of the side wall part of each container body in the subsequent process in the copper plate 15 which comprises the container sheet | seat 10, it is for earthing | grounding currently formed in the organic multilayer substrate 11 A via hole 16 reaching the conductive pattern is formed and plated. Thus, the side wall portions of the individual container bodies formed in the subsequent process are grounded, and an ECM effect is produced.

  Next, in FIG. 1D, a resist film is formed on the copper plate 15 constituting the container sheet 10 with a uniform film thickness, and a desired side wall portion formed on the copper plate 15 is formed on the surface of the resist film. A mask having an opening pattern is disposed, and the resist film is exposed and developed from above the mask. The resist film is removed by development, and the exposed copper plate 15 is removed by etching to form a portion that becomes a side wall portion of each container body. FIG. 1D shows a state after etching, and the prepreg 14 is exposed at the bottom of the portion where the copper plate 15 is removed by etching.

  Next, in FIG.1 (e), the prepreg 14 exposed to the inner bottom part of the side wall part of a container body is removed, and the organic multilayer board 11 in which the electrode pad 12 for electronic element connection under the prepreg 14 is formed is exposed. . As a method for removing the prepreg 14, a method for removing the prepreg 14 by chemical treatment or a method for mechanically removing it by cutting with a laser or the like is used. Thereafter, the container sheet 10 is cut and separated into individual container bodies along a cutting line.

  In FIG. 2, the container body 20 created by the manufacturing method of the said process is shown. That is, the bottom portion 21 is formed by laminating organic insulating plates having insulating properties, and conductive patterns are formed on the surface of each organic insulating plate, and through holes penetrating the organic insulating plates are used for conducting between the conductive patterns. It is formed with the organic multilayer board comprised by this. An electrode pad 12 for connecting an electronic element is formed on one main surface 23 which is an inner bottom portion of the side wall portion 22 of the bottom portion 21. An external connection electrode pad is formed on the other main surface of the bottom 21. Furthermore, between the electrode pad 12 for electronic element connection and the electrode pad for external connection, the electroconductive part comprised by the conductive wire and electrode pad formed in the surface of each organic board, and the electroconductive part mutually electrically It is electrically connected through a through hole for connection. Both electrode pads and the conductive part are made of gold.

  On the edge of one main surface 23 of the bottom portion 21, a vertically upstanding side wall portion 22 is disposed so as to surround the electronic device mounting region including the electronic device connection electrode pad 12 on the one main surface 23. ing. The side wall portion 22 is made of copper, and is electrically connected to the ground pattern formed on the bottom portion 21 by plating formed in the via hole 16. The edge portion of one main surface 23 of the bottom portion 21 and the bottom surface of the side wall portion 22 are adhered to each other by an adhesive prepreg 14 to constitute a container body 20.

  In the above embodiment, copper is used as the material of the side wall portion 22 of the container body 20. However, the effect of the present invention is a metal having conductivity and capable of being etched in the manufacturing process. Any alloy can be used, and the material of the side wall 22 is not limited to copper. Further, glass epoxy, polyimide, composite, or the like is used as the material of the organic insulating plate disclosed in the above embodiment.

FIG. 1 is a process diagram showing an embodiment of a manufacturing process of a container body for an electronic component according to the present invention. FIG. 2 is a perspective view showing an embodiment of an electronic component container manufactured by the manufacturing process disclosed in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, Container sheet 11, Organic multilayer board 12, Electrode element connection electrode pad 13, One outermost main surface of organic multilayer board 14, Prepreg 15, Copper plate 20, Container body 21, Bottom part 22, Side wall part 23, Bottom part 21 One main surface of

Claims (4)

An electronic device connection electrode pad formed on an inner main surface of the bottom portion formed from a bottom portion and a side wall portion standing upright on the edge portion of the bottom portion and surrounded by the side wall portion on which the electronic device is mounted. In a container body for an electronic component in which a conductive portion including both electrode pads is formed, leading to an electrode pad for external connection formed on the outer side main surface of
The bottom portion is formed of an organic multilayer plate, and the side wall portion that is upright and fixed to the edge on the main surface side where the electrode pad for connecting an electronic element is formed is formed of a metal or an alloy. A container for electronic parts, characterized in that   2. The electronic component container according to claim 1, wherein the edge of the bottom and the bottom of the side wall are bonded and fixed by a prepreg. An electrode pad for connecting an electronic device formed on a main surface on the inner side of the bottom portion surrounded by the side wall portion on which the electronic device is mounted is formed on the bottom portion and a side wall portion standing upright on the edge portion of the bottom portion In the method of manufacturing a container body for an electronic component that forms a conduction portion including both electrode pads, from the external connection main surface formed on the outer main surface of the bottom,
A plurality of organic insulating plates having a size matching the bottoms of a plurality of container bodies are laminated, and a plurality of electronic device connecting electrode pads are individually provided on one outermost surface which is an inner surface of the container body. A plurality of external connection electrode pads are formed on the other outermost surface, which is the bottom surface of the container body, so as to match the container body, and the electronic element connection electrode pad is formed. Forming an organic multilayer board electrically connected by a desired wiring formed by through holes and conductive portions between the electrode pads for external connection and the external connection electrodes;
Disposing a prepreg on one outermost surface of the organic multilayer plate on which the electrode pad for connecting an electronic element is formed;
A metal or alloy plate having the same height and width as the organic multilayer plate is disposed on the upper surface of the prepreg, and the organic multilayer plate and the metal or alloy plate are disposed through the prepreg. Adhering and forming a container sheet;
Forming a resist film with a uniform thickness on the metal or alloy plate constituting the container sheet;
Placing a mask on the surface of the resist film on which a desired side wall opening shape pattern for forming the metal or alloy plate is formed, exposing the resist film from above the mask, and developing;
Removing the resist or the exposed portion of the metal or alloy plate by development to form a portion to be a side wall portion of each container body;
Removing the prepreg exposed at the inner bottom of the side wall and exposing an electrode pad for connecting an electronic device under the prepreg;
And a step of cutting and separating the processed container sheet into individual container bodies.   3. A container body for an electronic component and a method for manufacturing the same according to claim 1, wherein copper is used as a material of the side wall and a material of a metal or alloy plate constituting the container sheet.

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