JP2005292573A - Method of manufacturing board for display device, and the display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance productivity of a board for a display device without increasing manufacturing cost, even when the board for the display device is manufactured, using a substrate made of a metallic material. <P>SOLUTION: A method of manufacturing a board for a display panel provided with a metal substrate 100; and gate electrodes 106 and source electrodes 111 which are arranged in matrix on the metal substrate 100, is disclosed, wherein in the process of cutting a first and a second cutting parts of the metal substrate 100, cutting is carried out, in such a manner that the projecting direction of burrs 8a and 8b produced at the first and the second cutting parts aligns in either one of the thickness directions of the metal substrate 100. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a display device manufacturing method and a display device in which matrix wiring is provided on a metal substrate insulated by an insulator.

  Thin film transistors (TFTs) are used in liquid crystal display elements, EL (Electroluminescent) display elements, electrophoretic display devices, and the like. For example, in an electrophoretic display device, each pixel is used as an element for controlling a control electrode potential in order to apply an electric field to toner enclosed in an electrophoretic solution.

  A semiconductor film used for a TFT provided in each pixel includes an amorphous silicon thin film (a-Si thin film) and a polycrystalline silicon thin film (poly-Si thin film).

  Conventionally, these techniques are often used as a substrate made of a glass material for liquid crystal display applications such as display devices, and therefore, depending on the application, impact resistance and flexibility are not sufficient.

  In recent years, as a display device using the above-described electrophoretic method, the development of a thin, hard to break and flexible display such as paper, which has not been realized in the past, has been actively developed. Has been done.

  Along with this, TFT (Thin Film Transistor) backplanes for driving display elements are not glass substrates made of conventional glass, but metal substrates made of relatively thin metal plates and plastics made of plastic materials. It is considered to form on a substrate.

  Conventionally, for example, a technique for forming a TFT backplane on a metal substrate made of stainless steel (SUS: Steel Use Stainless) has been disclosed (see Patent Document 1).

As described above, when a metal substrate made of a thin plate such as stainless steel is used, a metal plate having a desired external dimension is cut by a cutting machine using a rolling process and the like, and a metal plate that is thinly rolled and wound into a roll shape. In subsequent steps, it is necessary to remove burrs generated on the cut surface of the metal substrate at the time of cutting. In order to remove all burrs generated at the outer peripheral edge when cutting the metal plate, align the multiple metal plates so that the protruding direction of the burr is the same direction, then laser toward the outer peripheral end A manufacturing method for removing burrs by irradiating is disclosed (see Patent Document 2).
JP 09-179106 A JP-A-11-151671

  As shown in FIG. 8, the cut metal substrate 201 usually has protrusions (burrs) 208a and 208b that are curved in the thickness direction of the metal substrate 201 and the metal substrate material protrudes at the cut portion. The burrs 208a and 208b protrude on opposite surfaces of the metal substrate 201, respectively. For this reason, for example, when wiring is formed on the metal substrate 201 with the burrs 208a and 208b remaining, some problems occur.

  First, in the manufacturing process of the substrate for a display device, as a method for fixing the metal substrate at the time of processing, it may be necessary to hold the metal substrate by vacuum suction on the suction stage. At this time, as shown in FIG. 8, when either one of the burrs 208 a and 208 b generated at the outer peripheral end of the metal substrate 201 faces downward to protrude toward the suction stage side, the metal substrate 201 is sucked. Since it floats up from the stage, it becomes difficult to hold it by suction.

  Similarly, it is usually necessary to apply a photoresist film on a substrate and bake it when forming a wiring. When a hot plate is used at that time, the entire surface of the substrate is also uniformly heated. It is difficult to form a photoresist film uniformly without contacting the heating stage.

  Also, when exposing the photoresist film, if any one of the burrs generated on the outer peripheral edge of the metal substrate is facing downward against the exposure stage, the metal substrate is lifted from the exposure stage. End up. For this reason, in addition to difficult to hold and hold the metal substrate satisfactorily, the surface height of the photoresist film applied on the metal substrate is different, and as a result, when performing exposure of the photoresist film There is a problem that exposure under uniform conditions cannot be achieved due to partial focusing.

  It is necessary to remove burrs generated on the metal substrate for the above reasons, etc., as a method of removing burrs, a method of pressing the entire metal substrate after cutting and rolling the burrs of the substrate to process it smoothly A method of polishing the outer peripheral end portion of the metal substrate after cutting that protrudes from the burr is mentioned.

  However, after the metal substrate is cut out, the number of rolling processes in which the metal substrate is pressed to extend the burr increases, which increases the manufacturing cost. Similarly, polishing the outer peripheral end surface of the metal substrate increases the manufacturing cost, and for example, the processing itself of polishing the outer peripheral end surface of a thin metal substrate having a thickness of about 300 μm is very difficult.

  Further, in the cutting step of cutting the metal substrate to a desired size using the metal substrate, it is possible to cut the metal substrate so that no burrs or the like are generated using a laser cutter or the like. However, in this case, there is a disadvantage that the processing cost itself for cutting the metal substrate increases.

  Also, in the manufacturing method of Patent Document 2, it is inevitable that the processing cost is increased because a plurality of metal plates are stacked with high precision and laser irradiation is necessary.

  Therefore, the present invention eliminates adverse effects in the manufacturing process of a display device substrate caused by burrs that occur when the substrate is cut, and increases the manufacturing cost even when a substrate made of a metal material is used to manufacture a display device substrate. An object of the present invention is to provide a method for manufacturing a display device substrate and a display device that can improve the productivity of the display device substrate.

  In order to achieve the above-described object, a display device substrate manufacturing method according to the present invention includes a substrate made of a metal material, and a scan electrode and an information electrode arranged in a matrix on the substrate. In this manufacturing method, when cutting a plurality of cut portions of the substrate, there is a cutting step in which the direction in which the protruding portions generated at the plurality of cut portions protrude is aligned with any one of the thickness directions of the substrate.

  According to the method for manufacturing a substrate for a display device according to the present invention described above, the direction in which the protruding portions generated at the plurality of cut portions of the substrate protrude is aligned to one side, thereby holding the surface on which the protruding portions do not protrude. By using the post-process of the display device substrate production line, the surface on which the protruding portion protrudes is used as the functional surface for forming various functional films for display. It becomes possible to hold. Similarly, according to this manufacturing method, by setting the surface on which the protruding portion does not protrude as the mounting surface, for example, various functional films formed on the surface on which the protruding portion protrudes are excellent. Can be formed. Therefore, according to this manufacturing method, the inconvenience caused by the protruding portion generated in the substrate in the manufacturing process of the display device substrate is eliminated, and the process for removing the protruding portion is not required, and the productivity is improved. .

  Further, a display device according to the present invention includes a display device substrate manufactured by the above-described display device substrate manufacturing method of the present invention, a second substrate disposed opposite to the display device substrate, A pair of electrodes in which one electrode is provided on at least one of the display device substrate and the second substrate, and an optical modulation element provided between the display device substrate and the second substrate.

  Moreover, the cutting device according to the present invention has a supply means for supplying a metal plate and a cutting means for cutting the metal plate supplied from the supply means. The cutting means has at least two pairs of guide members arranged vertically so as to sandwich the transport path of the metal plate in order to support the metal plate, and a press member for sandwiching and cutting the metal plate. Drive means for driving at least the press member in the vertical direction so as to sandwich the metal plate.

  As described above, according to the present invention, even when a display device substrate is manufactured using a substrate made of a metal material, the productivity of the display device substrate can be improved without increasing the manufacturing cost. .

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a cross-sectional view for explaining a cutting step of cutting a metal plate in the method for manufacturing a display panel substrate of the present embodiment.

  As shown in FIG. 1, in the cutting process of the present embodiment, a supply device 6 that supplies a strip-shaped metal plate 1 wound in a roll shape, and a predetermined length from the metal plate 1 supplied from the supply device 6. A press device 7 for cutting the metal substrate 100 and a transport device (not shown) for transporting the metal plate 1 supplied from the supply device 6 to the press device 7 are used.

  The supply device 6 rotatably supports a roll body around which a metal plate 1 formed of a SUS material and having a desired plate thickness is wound.

  The pressing device 7 sandwiches and cuts (shears) the metal plate 1 from the pair of upper guide members 2a and 2b and lower guide members 4a and 4b for sandwiching the metal plate 1 supplied from the supply device 11. A set of upper punch 3 and lower punch 5 and a drive mechanism (not shown) that drives upper guide members 2a, 2b and upper punch 3 in the vertical direction in FIG. 1 with respect to lower guide members 4a, 4b and lower punch 5. As shown).

  The upper punch 3 is provided between the upper guide member 2a and the upper guide member 2b. Similarly, the lower punch 5 is provided between the lower guide member 4a and the lower guide member 4b.

  The cutting process which the manufacturing method of the substrate for display panels of this embodiment has is demonstrated with reference to drawings.

  First, as shown in FIG. 1A, one end of the metal plate 1 is drawn out from the supply device 6 into the press device 7 and placed on the lower guide members 4 a and 4 b and the lower punch 5.

  Subsequently, as shown in FIG. 1B, when pressing is started by the press device 7, the upper guide members 2a and 2b and the upper punch 3 are lowered as shown in FIG. It abuts on the plate 1.

  Further, as shown in FIG. 1C, the upper punch 3 is further lowered, and the upper punch 3 is lowered together with the lower punch 5 in a state where the metal plate 1 is sandwiched between the upper punch 3 and the lower punch 5. Is done.

  Finally, the lower punch 5 is lowered following the descending upper punch 3, and the upper guide members 2a and 2b are lowered together with the upper punch 3, thereby intersecting the traveling direction in which the metal plate 1 is pulled out. These two opposite sides are simultaneously cut, and the metal substrate 100 is separated from the metal plate 1. As a result, as shown in FIG. 2, burrs 8a and 8b, which are protrusions, are formed on the two opposite sides at the outer peripheral end of the cut metal substrate 100, respectively. In these burrs 8a and 8b, the protruding direction in the thickness direction of the metal substrate 100 is aligned with one of the front and back surfaces.

  Using the metal substrate 100 in a state in which the burrs 8a and 8b whose projection directions are uniformly aligned are left without removing the burrs 8a and 8b from the metal substrate 100 cut by the cutting process described above. A method for manufacturing a thin display panel to be manufactured will be described.

  FIG. 3 is a cross-sectional view schematically showing the thin display panel of the present embodiment.

  As shown in FIG. 3, a silicon oxide film is formed on a metal substrate 100 having burrs 8a and 8b by a CVD (Chemical Vapor Deposition) method to form a substrate insulating layer 101. Subsequently, for example, when a TFT (Thin Film Transistor) having a bottom gate structure is used, a wiring forming the gate electrode 106 is formed.

  Here, a method for forming a wiring forming the gate electrode 106 will be briefly described. For example, when an Al wiring with a relatively low resistivity is used and there is a process that exceeds the melting point of Al in the subsequent manufacturing process, for example, Cr, Ta, or Al—Nd is deposited by sputtering to form a conductive film. To do.

  Subsequently, when forming various wirings, a photoresist film is applied to the metal substrate 100 with a roll coater, pre-baked with a hot plate, and then the applied photoresist film is selectively exposed, developed and removed, Post baking is performed, and finally, patterning is performed by etching, and the photoresist film is peeled off.

  In such a manufacturing process, since the protruding directions of the burrs 8a and 8b of the metal substrate 100 are aligned in one of the thickness directions, the burrs 8a and 8b are well held by baking with a hot plate or vacuum suction on the exposure stage of the exposure apparatus. can do. Further, no exposure failure or the like due to focus shift occurred during the exposure of the photoresist film.

  Note that there is no wiring pattern or the like for the burr portion near the outer peripheral edge of the metal substrate, so there is no problem even if the focus shifts during exposure of the photoresist film.

  Next, a gate insulating layer 108 is formed to insulate the gate electrode 106, and then an amorphous semiconductor layer 109 is formed, for example, and an ohmic contact layer 110 is formed by, for example, ion implantation, and one of the ohmic contact layers 110 is formed. By selectively removing the part, the source electrode 111 and the drain electrode 112 are formed.

  FIG. 4 is a schematic diagram showing a part of a TFT active matrix array of 300 rows × 250 columns according to the present embodiment.

  As shown in FIG. 4, the thin display panel 10 of the present embodiment includes a conductive metal substrate 100, a group of gate electrodes 106 and a group of source electrodes 111 provided in a matrix on the metal substrate 100, Pixel electrodes arranged in a matrix, for example, a pixel electrode 114 arranged at each intersection of the gate electrode group 106 and the source electrode group 111, a gate line driving circuit 125 for driving the gate electrode group 106 and the source electrode group 111, and And a source line driver circuit 126. The gate line driving circuit 125 has a gate line driving voltage set to, for example, an on voltage [+] 20 V and an off voltage [−] 20 V, and the source line driving circuit 126 has a source line driving voltage of, for example, 0 V to 15 V. Is set. In addition, as shown in FIG. 4, a TFT 130 is provided for each pixel.

  Next, the display panel of this embodiment will be described in more detail.

  FIG. 5A is a cross-sectional view schematically showing the thin display panel of this embodiment. FIG. 5B is a schematic diagram showing a part of the TFT active matrix array having 300 rows × 250 columns according to the present embodiment.

  Hereinafter, each process from forming the substrate insulating layer 101 on the metal substrate 100 to forming a TFT matrix array including each pixel will be described with reference to the drawings.

  1) A SiN film is formed with a film thickness of 300 nm on a metal substrate 100 made of a SUS material having a thickness of 0.2 mm by a CVD (Chemical Vapor Deposition) method to form a substrate insulating layer 101.

  2) An Al—Nd film having a thickness of 200 nm is formed on the substrate insulating layer 101 by sputtering, and a lower electrode of the TFT 130 such as the gate electrode 106 and the pixel capacitor forming electrode (Cs wiring) 107 is formed using a photomask. Form. Note that since the electrophoretic display panel of this embodiment requires an auxiliary capacitor for holding and driving the TFT 130, the pixel capacitor forming electrode 107 is formed in the same layer as the gate electrode 106.

  3) On the gate electrode 106, an SiN film is formed as a gate insulating layer 108 with a thickness of 250 nm by a CVD method, and an a-Si film is formed as an amorphous semiconductor layer 109 with a thickness of 200 nm by a CVD method.

4) As the ohmic contact layer 110, an a-Si (n ⁺ ) film is formed at 20 nm by a CVD method.

  5) On the ohmic contact layer 110, an Al film is formed to a thickness of 200 nm by sputtering.

  6) Wet etching using a photomask is performed on the Al film to form the source electrode 111 and the drain electrode 112 each including the TFT 130 portion. Subsequently, the ohmic contact layer 110 in the TFT channel portion is removed by dry etching using the resist pattern, and a SiN film 113 is formed with a film thickness of 300 nm.

  7) A contact hole is formed in the SiN film 113 by dry etching as shown by a part a in FIG. 5B, and a part of the drain electrode 112 is exposed.

  8) An Al film is formed with a film thickness of 200 nm on the SiN film 113 by sputtering.

  9) The pixel electrode 114 is formed by subjecting the Al film to wet etching using a photomask.

10) An acrylic resin containing TiO ₂ is applied at a film thickness of 4 μm to form the white scattering layer 115.

  11) An acrylic resin film having a thickness of 1 μm is formed on the white scattering layer 115 as the insulating layer 116.

  12) A Ti layer 117 is formed with a film thickness of 300 nm on the white scattering layer 115, and further a photoresist layer 118 containing carbon is formed with a film thickness of 300 nm thereon.

  13) Next, by forming another photoresist layer with a film thickness of 15 μm on the photoresist layer 118, the inter-pixel portion is formed so that the partition wall 119 between the pixels is formed by the other photoresist layer. Remove and develop.

  14) The Ti layer 117 and the photoresist layer 118 are etched using the partition wall 119 made of another photoresist layer to form the TFT back plane 128.

  15) Finally, as an optical modulation element, a dispersion liquid in which black chargeable particles 121 made of polystyrene resin containing carbon black are dispersed in an insulating liquid 120 containing a paraffinic hydrocarbon solvent as a main component is used as a partition wall. The space partitioned by 119 is filled, and the transparent second substrate 122 is fixed on the partition wall 119 with an adhesive (not shown).

  As described above, in the method for manufacturing a display panel substrate according to this embodiment, the protruding direction of the burrs 8a and 8b generated when the metal substrate 100 is cut out is any one of the thickness direction of the metal substrate 100, that is, the front and back surfaces. It has the cutting process cut | disconnected so that it may align with a direction.

  Conventionally, if the burr generated when cutting to cut out the metal substrate from the metal plate is not removed, it may be difficult to attract and hold the metal substrate in a subsequent display panel manufacturing process, Inconveniences such as it becomes difficult to accurately focus the photoresist film during exposure, and the photoresist film cannot be baked by a hot plate. Therefore, in the conventional method for manufacturing a display panel, when a metal substrate is used, it is necessary to add a removal process for removing burrs at a cut portion of the metal substrate, which increases the manufacturing cost.

  On the other hand, according to the method for manufacturing a display panel substrate of the present embodiment, since the burrs 8a and 8b at the cut portions are manufactured using the metal substrate 100 cut so as to protrude in one direction in the thickness direction, Even in the state where the burrs 8a and 8b are generated, various functions for displaying an image on the surface on which the burrs 8a and 8b are projected while the surface on which the burrs 8a and 8b are not projected are used as suction surfaces. As a functional surface for forming a film, the metal substrate 100 can be satisfactorily held by suction by performing a post-process on the display panel substrate production line.

  Similarly, by setting the surface on which the burrs 8a and 8b do not protrude as the mounting surface, exposure of the photoresist film, baking of the photoresist film by a hot plate, and the like can be performed satisfactorily. As a result, even when a metal substrate is used, it is possible to manufacture a display panel with good image quality without adding a burr removal step that has caused an increase in manufacturing cost. That is, according to the manufacturing method of this embodiment, even when a metal substrate is used, a display panel substrate can be manufactured satisfactorily without increasing the manufacturing cost.

(Second Embodiment)
In the cutting process included in the manufacturing method of the first embodiment described above, the metal substrate was cut by press working using a punch. The cutting process using a cutting machine and a turntable will be described.

  FIG. 6 is a cross-sectional view for explaining a cutting step of cutting a metal plate in the method for manufacturing a display panel substrate according to the second embodiment. Since the other steps after the cutting step are the same as the method for manufacturing the display panel substrate of the first embodiment described above, description thereof is omitted.

  As shown in FIG. 6, in the cutting step of the manufacturing method of the second embodiment, a supply device 6 that supplies a strip-shaped metal plate 1 wound in a roll shape, and a metal supplied from the supply device 6 The first and second cutting devices 12 and 13 for cutting the metal substrate 100 of a predetermined length from the plate 1 and the metal plate 1 supplied from the supply device 6 to the first and second cutting devices 12 and 13 A conveying device 14 for conveying and a turntable 15 for rotating the metal plate 1 180 degrees around an axis in the thickness direction of the metal plate 1 are used.

  The 1st and 2nd cutting devices 12 and 13 are arrange | positioned at predetermined intervals along the conveyance direction of the metal plate 1 by the conveying apparatus 14. FIG. In the first and second cutting devices 12 and 13, the cutting edges of the cutters 12 a and 13 a are arranged in the same direction with respect to the metal plate 1. About the conveyance roller etc. which the conveyance apparatus 14 has, since it is not the structure which concerns on the principal part of this invention, description is abbreviate | omitted. The turntable 15 is disposed between the first cutting machine 12 and the second cutting machine 13 and is provided so as to be rotatable around an axis in the thickness direction of the metal plate 1.

  The cutting process of this embodiment is demonstrated with reference to drawings.

  First, as shown in FIG. 6A, the metal plate 1 wound in a roll shape is larger than the size of the metal substrate 100 that is required when the manufacturing process of the display panel is finally performed. Cutting is performed by the first cutting machine 12 with the cutting allowance 18 left as a cutting allowance remaining. Each burr at the outer peripheral end of the metal substrate 100 cut from the metal plate 1 while being cut by the first cutting machine 12 has one end protruding downward and the other end protruding upward. ing.

  Next, the metal plate 1 transported by the transporting device 14 is placed on the turntable 15, and as shown in FIG. 6B, the turntable 15 rotates around the axis in the thickness direction of the metal substrate. It is rotated 180 degrees horizontally.

  Finally, as shown in FIG. 6 (c), by cutting and removing the margin 18 of the metal substrate 100 rotated 180 degrees by the turntable 14, and the margin for discarding the metal substrate 100 by the second cutting machine 13. It is formed in a size required when the subsequent manufacturing process is performed.

  By the above cutting process, as shown in FIG. 6C, the metal substrate 100 in which the protruding directions of the burrs 8a and 8b are aligned in one of the thickness directions is obtained.

  As a result, the display panel can be satisfactorily manufactured even using the metal substrate 100 in which the burrs 8a and 8b are left as in the first embodiment.

(Third embodiment)
In the cutting process of the manufacturing method of the second embodiment described above, the metal plate is rotated by the turntable, but the cutting process for cutting without rotating the metal plate will be described.

  FIG. 7 is a cross-sectional view for explaining a cutting process for cutting a metal plate in the method for manufacturing a display panel substrate according to the third embodiment. Since the other steps after the cutting step are the same as the method for manufacturing the display panel substrate of the first embodiment described above, description thereof is omitted.

  As shown in FIG. 7, in the cutting step of the manufacturing method of the third embodiment, a supply device 6 that supplies a strip-shaped metal plate 1 wound in a roll shape, and a metal supplied from the supply device 6 First and second cutting devices 22 and 23 for cutting the metal substrate 100 of a predetermined length from the plate 1, and the metal plate 1 supplied from the supply device 6 to the first and second cutting devices 22 and 23. Conveying devices 14 and 16 for conveying are used.

  The 1st and 2nd cutting devices 22 and 23 are arrange | positioned at predetermined intervals along the conveyance direction of the metal plate 1 by the conveying apparatuses 14 and 16. FIG. In the first and second cutting devices 22 and 23, the cutting edge of the cutter 22 a and the cutting edge of the cutter 23 a are arranged symmetrically with respect to a plane perpendicular to the conveying direction of the metal plate 1. About the conveyance roller etc. which the conveying apparatuses 14 and 16 have, since it is not the structure which concerns on the principal part of this invention, description is abbreviate | omitted.

  The cutting process of this embodiment is demonstrated with reference to drawings.

  First, as shown in FIG. 7A, the metal plate 1 wound in a roll shape is larger than the size of the metal substrate 100 required when the manufacturing process of the display panel is finally performed. It is cut by the first cutting machine 22 with the cutting margin 18 that is the cutting margin left. Each burr at the outer peripheral end of the metal substrate 100 cut from the metal plate 1 while being cut by the first cutting machine 22 has one end protruding downward and the other end protruding upward. ing.

  Next, the metal plate 1 is transported by the transport device 14 to a position where it can be cut by the second cutting machine 23. Then, as shown in FIGS. 7B and 7C, the second cutting device 23 is a cutter arranged in plane symmetry with the cutter 22 a with respect to a plane orthogonal to the conveying direction of the metal plate 1. The cut-off margin 18 of the metal substrate 100 is cut and removed by 23a. As a result, the metal substrate 100 is made to have a desired size required when a subsequent manufacturing process is performed.

  As described above, the cutter 23 a of the second cutting machine 23 is different from the cutter 22 a of the first cutting machine 22 in the alignment direction of the cutting edges for cutting the metal substrate 100. In other words, the cutting edge of the cutter 23a is arranged in a direction rotated 180 degrees around the axis in the thickness direction of the metal plate 1 with respect to the direction of the cutting edge that causes the burr to protrude in the same direction as when cutting with the cutter 22a. Yes.

  For this reason, in the 1st cutting location by the 1st cutting machine 22, and the 2nd cutting location by the 2nd cutting machine 23, the protrusion direction of the burr | flash which arises when cut | disconnecting the same edge | side of the same metal substrate is carried out. Although the directions are opposite, since the two sides to be cut of the metal substrate 100 face each other, as a result, it is possible to obtain the metal substrate 100 in which the direction in which the burrs 8a and 8b protrude is aligned in one of the thickness directions. it can. Therefore, according to the present embodiment, as in the first and second embodiments described above, it is possible to satisfactorily manufacture a display panel using the metal substrate 100 in which the burrs 8a and 8b are left. Become.

  In the manufacturing method of the present embodiment, the cutting process described above is performed in a product form as a display panel from a metal plate wound in a roll shape, that is, a final size in the product (final form). In the previous process of the above-described cutting process in the display panel production line, the metal plate was once cut into a metal substrate of a predetermined size, and was cut into the predetermined size in advance. In order to cut the metal substrate into a final size as a display panel, the above-described cutting process may be performed.

  The present embodiment is configured as a TFT backplane of an electrophoretic display panel, but is not limited to this configuration, and can be applied to, for example, a reflective liquid crystal display panel. In the case of this configuration, for example, a common electrode (counter electrode) is formed by forming a transparent conductive film such as an ITO (Indium Tin Oxide) film on the second substrate 122, and the common electrode and the drain are formed. It is possible to display an image by sandwiching a liquid crystal between the electrode and applying a predetermined electric field between the drain electrode and the common electrode.

  In the present embodiment, a so-called inverted stagger structure using amorphous silicon, that is, a bottom gate type configuration in which the gate electrode 106 is provided below the gate insulating layer 108 (SiN film) is employed. Even if a top gate structure or the like is adopted, there is no problem.

  In addition, the TFT is not limited to a TFT using amorphous silicon. For example, a polysilicon TFT having a polysilicon active layer obtained by performing laser annealing on amorphous silicon, or a single crystal TFT for transferring the TFT to a substrate. Even when the transfer technique is used, the same effect can be obtained.

  Finally, the above-described electrophoretic display panel is flexible enough to cope with a certain degree of bending, and therefore, for example, can be replaced with a paper medium or information such as a personal digital assistant (PDA). It is suitable for use as a display panel for processing equipment.

It is sectional drawing for demonstrating the cutting process which cut | disconnects a metal plate in the manufacturing method of the board | substrate for display panels of 1st Embodiment. It is a perspective view which shows the protrusion direction of the burr | flash of the metal substrate by this embodiment. It is sectional drawing which shows the principal part of the display panel using the said metal substrate. It is a schematic diagram which shows the TFT backplane of the said display panel. It is a schematic diagram which shows the said display panel. It is sectional drawing for demonstrating the cutting process which cut | disconnects a metal plate in the manufacturing method of the board | substrate for display panels of 2nd Embodiment. It is sectional drawing for demonstrating the cutting process which cut | disconnects a metal plate in the manufacturing method of the board | substrate for display panels of 3rd Embodiment. It is a perspective view which shows the protrusion direction of the burr | flash of the conventional metal substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal plate 2,2 'Upper board guide 3 Upper punch 4,4' Lower board guide 5 Lower punch 8a, 8b Burr 12 1st cutting machine 13 2nd cutting machine 14 Turntable 22 1st cutting machine 23 1st Cutting machine 2 100 Metal substrate 101 Insulating layer (SiN film)
106 Gate electrode 107 Pixel capacitance forming electrode (Cs wiring)
108 Gate insulating layer (SiN film)
109 Amorphous semiconductor layer 110 Ohmic contact layer (a-Si (n ⁺ ))
111 Source electrode 112 Drain electrode 113 SiN film 114 Pixel electrode 115 White scattering layer 116 Insulating layer (acrylic resin)
117 Ti layer 118 Photoresist layer 119 Partition 120 Insulating liquid 121 Chargeable particle 122 Second substrate 125 Gate line driving circuit 126 Source line driving circuit 128 TFT backplane 130 TFT

Claims (11)

In a method for manufacturing a substrate for a display device, comprising a substrate made of a metal material, and scanning electrodes and information electrodes arranged in a matrix on the substrate,
When cutting a plurality of cut portions of the substrate, the method includes a cutting step of cutting so that the protruding portion generated at the plurality of cut portions is aligned with any one of the thickness directions of the substrate. The manufacturing method of the board | substrate for display apparatuses.   The method for manufacturing a substrate for a display device according to claim 1, wherein the plurality of cut portions include two opposite sides of the substrate.   The method for manufacturing a substrate for a display device according to claim 1, wherein, in the cutting step, the plurality of cut portions are simultaneously cut by pressing the substrate.   The cutting step includes a first cutting step in which the first cutting means cuts the first cutting portion of the substrate while leaving a recut margin, and a second cutting means cuts the recut margin by the second cutting means. The method for manufacturing a display device substrate according to claim 1, further comprising: a cutting step.   In the cutting step, after the first cutting step, the substrate is rotated by 180 degrees around an axis in the thickness direction of the substrate, and in the second cutting step, the recutting is performed by the second cutting means. The manufacturing method of the board | substrate for display apparatuses of Claim 4 which cut | disconnects a margin.   In the cutting step, the substrate advances from the first cutting means side to the second cutting means side, and in the second cutting step, the first cutting means side with respect to a plane orthogonal to the traveling direction of the substrate. 5. The method for manufacturing a substrate for a display device according to claim 4, wherein the recutting margin is cut by a cutter of the second cutting means arranged in plane symmetry with the cutter of the first cutting means.   The method for manufacturing a substrate for a display device according to claim 1, wherein, in the cutting step, the substrate having a desired size is cut out from a metal plate that is formed and stored in a desired thickness.   2. The method for manufacturing a display device substrate according to claim 1, wherein in the cutting step, the substrate having a size in a final form is cut out from a metal plate previously cut into a desired size in the manufacturing process of the display device. . A display device substrate manufactured by the display device substrate manufacturing method according to claim 1;
A second substrate disposed opposite to the display device substrate;
A pair of electrodes provided with one electrode on at least one of the display device substrate and the second substrate;
A display device comprising: an optical modulation element provided between the display device substrate and a second substrate.   The display device according to claim 9, wherein the optical modulation element includes electrophoretic particles and a medium in which the electrophoretic particles are dispersed. In a cutting device comprising: a supply means for supplying a metal plate; and a cutting means for cutting the metal plate supplied from the supply means.
The cutting means includes at least two pairs of guide members arranged vertically so as to sandwich the conveyance path of the metal plate to support the metal plate, and a press member for sandwiching and cutting the metal plate. And a driving means for driving the press member in the vertical direction so as to sandwich the metal plate.

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