JP2005290422A - Aluminum alloy and method for producing aluminum alloy member - Google Patents
Aluminum alloy and method for producing aluminum alloy member Download PDFInfo
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- JP2005290422A JP2005290422A JP2004103701A JP2004103701A JP2005290422A JP 2005290422 A JP2005290422 A JP 2005290422A JP 2004103701 A JP2004103701 A JP 2004103701A JP 2004103701 A JP2004103701 A JP 2004103701A JP 2005290422 A JP2005290422 A JP 2005290422A
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- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 229910052742 iron Inorganic materials 0.000 claims abstract description 6
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 239000000919 ceramic Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000000265 homogenisation Methods 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 27
- 238000000034 method Methods 0.000 abstract description 14
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000005266 casting Methods 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 229910018134 Al-Mg Inorganic materials 0.000 description 1
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- 229910018467 Al—Mg Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229910018566 Al—Si—Mg Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【課題】鋳造法によって製造することができ且つ高い放熱性を維持したまま熱膨張係数が低下したアルミニウム合金およびそのアルミニウム合金からなるアルミニウム合金部材の製造方法を提供する。
【解決手段】アルミニウムに０．１〜２０重量％のＢ、好ましくは０．１〜１５重量％のＢを添加し、必要に応じてＦｅ、ＮｉおよびＣｏの少なくとも一種の元素を総量で０．１〜４０重量％添加し、さらに必要に応じて５〜１５重量％のＳｉや１〜１０重量％のＭｇを添加することにより、アルミニウム合金の２０℃における熱膨張係数を１０〜２０×１０−６／Ｋまで小さくし、２０℃における熱伝導率を１００〜２００W／ｍ・Ｋに維持する。
【選択図】なしThe present invention provides an aluminum alloy that can be manufactured by a casting method and has a low thermal expansion coefficient while maintaining high heat dissipation, and a method for manufacturing an aluminum alloy member made of the aluminum alloy.
0.1 to 20% by weight of B, preferably 0.1 to 15% by weight of B is added to aluminum, and if necessary, at least one element of Fe, Ni and Co is added in a total amount of 0. By adding 1 to 40% by weight, and further adding 5 to 15% by weight of Si or 1 to 10% by weight of Mg as necessary, the thermal expansion coefficient of the aluminum alloy at 20 ° C. is 10 to 20 × 10 − The temperature is reduced to 6 / K and the thermal conductivity at 20 ° C. is maintained at 100 to 200 W / m · K.
[Selection figure] None
Description
本発明は、アルミニウム合金およびアルミニウム合金部材の製造方法に関し、特に、アルミニウム−セラミックス接合基板の放熱板などに使用されるアルミニウム合金部材の材料であるアルミニウム合金およびそのアルミニウム合金からなるアルミニウム合金部材の製造方法に関する。 TECHNICAL FIELD The present invention relates to an aluminum alloy and a method for producing an aluminum alloy member, and in particular, an aluminum alloy that is a material of an aluminum alloy member used for a heat sink of an aluminum-ceramic bonding substrate, and an aluminum alloy member made of the aluminum alloy. Regarding the method.
自動車用エンジンやギアのハウジングなどの部材や、産業用・民生用の電気・電子製品の放熱部品などの材料として、高い放熱性を有し且つ他の部材との接続や接合の信頼性の観点から熱膨張係数が小さい材料が求められている。このような材料として、安価且つ軽量のアルミニウムを使用することが検討されているが、アルミニウムは金属の中でも熱膨張係数が高いという欠点がある。 As a material for automobile engines, gear housings, and other heat-dissipating parts for industrial and consumer electrical and electronic products, it has high heat dissipation and is reliable in connection and joining with other members. Therefore, a material having a small thermal expansion coefficient is demanded. As such a material, it has been studied to use inexpensive and lightweight aluminum, but aluminum has a disadvantage that it has a high thermal expansion coefficient among metals.
このようなアルミニウムの欠点を克服するために、アルミニウムの高い放熱性を維持したまま熱膨張係数を低下させる方法として、１３〜８０重量％のＳｉを含有するＡｌ−Ｓｉ合金をダイキャスト法によって３００〜８００Ｋ／ｓｅｃの速度で急冷し、成形することにより、Ｓｉ相の結晶粒径が５０μｍ以下、熱膨張係数が１６×１０−６／Ｋ以下、熱伝導率が１００／ｍ・Ｋ以上の特性を有する放熱材料を得る方法が知られている（例えば、特許文献１参照）。 In order to overcome such disadvantages of aluminum, as a method of reducing the thermal expansion coefficient while maintaining high heat dissipation of aluminum, an Al—Si alloy containing 13 to 80% by weight of Si is formed by die casting. By quenching and molding at a speed of ˜800 K / sec, the crystal grain size of the Si phase is 50 μm or less, the thermal expansion coefficient is 16 × 10 −6 / K or less, and the thermal conductivity is 100 / m · K or more. There is known a method of obtaining a heat dissipation material having a thickness (for example, see Patent Document 1).
しかし、特許文献１に開示された方法では、ダイキャスト法によって特定の冷却条件で急冷する必要があり、高い放熱性を維持したまま熱膨張係数が低下した所望の特性を有するアルミニウム合金を鋳造法によって製造することができない。 However, in the method disclosed in Patent Document 1, it is necessary to rapidly cool under a specific cooling condition by a die-cast method, and an aluminum alloy having a desired characteristic whose thermal expansion coefficient is reduced while maintaining high heat dissipation is cast. Cannot be manufactured by.
したがって、本発明は、このような従来の問題点に鑑み、鋳造法によって製造することができ且つ高い放熱性を維持したまま熱膨張係数が低下したアルミニウム合金およびそのアルミニウム合金からなるアルミニウム合金部材の製造方法を提供することを目的とする。 Therefore, in view of such a conventional problem, the present invention provides an aluminum alloy that can be manufactured by a casting method and has a low thermal expansion coefficient while maintaining high heat dissipation, and an aluminum alloy member made of the aluminum alloy. An object is to provide a manufacturing method.
本発明者らは、上記課題を解決するために鋭意研究した結果、アルミニウムに０．１〜２０重量％のＢを添加することにより、高い放熱性を維持したまま熱膨張係数が低下したアルミニウム合金部材を鋳造法によって製造することができることを見出し、本発明を完成するに至った。 As a result of diligent research to solve the above-mentioned problems, the present inventors have found that an aluminum alloy having a low thermal expansion coefficient while maintaining high heat dissipation by adding 0.1 to 20% by weight of B to aluminum. The present inventors have found that a member can be manufactured by a casting method and have completed the present invention.
すなわち、本発明によるアルミニウム合金は、０．１〜２０重量％のＢ、好ましくは０．１〜１５重量％のＢを含有し、残部がＡｌと不可避元素からなることを特徴とする。このアルミニウム合金は、Ｆｅ、ＮｉおよびＣｏからなる群の少なくとも１種の元素を総量で０．１〜４０重量％含有するのが好ましい。また、このアルミニウム合金は、５〜１５重量％のＳｉを含有するのが好ましく、１〜１０重量％のＭｇを含有するのが好ましい。さらに、このアルミニウム合金は、２０℃における熱膨張係数が１０〜２０×１０−６／Ｋであり且つ２０℃における熱伝導率が１００〜２００W／ｍ・Ｋであるのが好ましい。 That is, the aluminum alloy according to the present invention is characterized by containing 0.1 to 20% by weight of B, preferably 0.1 to 15% by weight of B, with the balance being made of Al and inevitable elements. This aluminum alloy preferably contains a total amount of at least one element selected from the group consisting of Fe, Ni and Co in an amount of 0.1 to 40% by weight. The aluminum alloy preferably contains 5 to 15% by weight of Si, and preferably contains 1 to 10% by weight of Mg. Further, this aluminum alloy preferably has a thermal expansion coefficient at 20 ° C. of 10 to 20 × 10 −6 / K and a thermal conductivity at 20 ° C. of 100 to 200 W / m · K.
また、本発明によるアルミニウム合金部材の製造方法は、０．１〜２０重量％のＢ、好ましくは０．１〜１５重量％のＢを含有し、残部がＡｌと不可避元素からなる組成のアルミニウム合金を、６８０〜７５０℃で溶解した後に凝固させて成形することを特徴とする。このアルミニウム合金部材の製造方法において、アルミニウム合金が、Ｆｅ、ＮｉおよびＣｏからなる群の少なくとも１種の元素を総量で０．１〜４０重量％含有するのが好ましい。また、アルミニウム合金が、５〜１５重量％のＳｉを含有するのが好ましく、１〜１０重量％のＭｇを含有するのが好ましい。また、このアルミニウム合金部材の製造方法では、成形の後に、固相線より低い温度で熱処理を施すのが好ましく、あるいは、成形の後に、固相線より低い温度で均質化処理を施し、その後、５〜５０％の圧延加工を施すのが好ましい。 Further, the method for producing an aluminum alloy member according to the present invention comprises 0.1 to 20% by weight of B, preferably 0.1 to 15% by weight of B, with the balance being composed of Al and inevitable elements. Is melted at 680 to 750 ° C. and then solidified and molded. In this method for producing an aluminum alloy member, the aluminum alloy preferably contains 0.1 to 40% by weight in total of at least one element of the group consisting of Fe, Ni and Co. Moreover, it is preferable that an aluminum alloy contains 5 to 15 weight% Si, and it is preferable to contain 1 to 10 weight% Mg. Further, in this method for producing an aluminum alloy member, it is preferable to perform heat treatment at a temperature lower than the solidus after molding, or, after molding, to perform a homogenization treatment at a temperature lower than the solidus, It is preferable to perform a 5-50% rolling process.
さらに、本発明によるアルミニウム−セラミックス接合部材は、上記のアルミニウム合金のうち、０．１〜１５重量％のＢを含有するアルミニウム合金からなるアルミニウム合金部材がセラミックス部材に接合していることを特徴とする。 Furthermore, the aluminum-ceramic bonding member according to the present invention is characterized in that an aluminum alloy member made of an aluminum alloy containing 0.1 to 15% by weight of B among the above aluminum alloys is bonded to the ceramic member. To do.
本発明によれば、アルミニウムに０．１〜２０重量％のＢを添加することにより、高い放熱性を維持したまま熱膨張係数が低下したアルミニウム合金部材を鋳造法によって製造することができる。 According to the present invention, by adding 0.1 to 20% by weight of B to aluminum, an aluminum alloy member having a reduced thermal expansion coefficient while maintaining high heat dissipation can be produced by a casting method.
本発明によるアルミニウム合金の実施の形態では、アルミニウムに０．１〜２０重量％のＢを添加し、必要に応じてＦｅ、ＮｉおよびＣｏの少なくとも一種の元素を総量で０．１〜４０重量％添加し、さらに必要に応じて５〜１５重量％のＳｉや１〜１０重量％のＭｇを添加することにより、アルミニウム合金の２０℃における熱膨張係数を１０〜２０×１０−６／Ｋまで小さくし、２０℃における熱伝導率を１００〜２００W／ｍ・Ｋに維持することができる。また、上記のアルミニウム合金中のＢの含有量を０．１〜１５重量％にすることにより、アルミニウム−セラミックス接合部材に適したアルミニウム合金にすることができる。 In an embodiment of the aluminum alloy according to the present invention, 0.1 to 20% by weight of B is added to aluminum, and if necessary, at least one element of Fe, Ni and Co is added in a total amount of 0.1 to 40% by weight. By adding 5 to 15 wt% Si and 1 to 10 wt% Mg as necessary, the thermal expansion coefficient of the aluminum alloy at 20 ° C. is reduced to 10 to 20 × 10 −6 / K. The thermal conductivity at 20 ° C. can be maintained at 100 to 200 W / m · K. Moreover, it can be set as the aluminum alloy suitable for an aluminum-ceramics joining member by content of B in said aluminum alloy being 0.1 to 15 weight%.
また、ＪＩＳ４０００番台のＡｌ−Ｓｉ系合金、ＪＩＳ５０００番台のＡｌ−Ｍｇ系合金またはＪＩＳ６０００番台のＡｌ−Ｓｉ−Ｍｇ系合金にＢを添加することによってアルミニウム合金を製造してもよい。なお、Ｍｇの添加量は、１〜１０重量％が好ましく、３〜６重量％がさらに好ましい。このような量のＭｇを添加することによっても上記の熱膨張係数および熱伝導率を達成することができる。 Alternatively, an aluminum alloy may be produced by adding B to a JIS 4000 series Al-Si based alloy, a JIS 5000 series Al-Mg based alloy, or a JIS 6000 series Al-Si-Mg based alloy. In addition, the addition amount of Mg is preferably 1 to 10% by weight, and more preferably 3 to 6% by weight. The above thermal expansion coefficient and thermal conductivity can also be achieved by adding such an amount of Mg.
以下、本発明によるアルミニウム合金およびそのアルミニウム合金部材からなるアルミニウム合金部材の製造方法の実施例について詳細に説明する。 Hereinafter, the Example of the manufacturing method of the aluminum alloy member which consists of the aluminum alloy by this invention and its aluminum alloy member is described in detail.
［実施例１〜７および比較例１〜３］
表１に示す元素を含むアルミニウム溶湯（溶湯温度６８０℃〜７００℃）を、それぞれ６８０〜７００℃に加熱したカーボン製の鋳型に流し込んで円筒状に鋳造した。この円筒状の鋳造品から試験片を切り出して、ＪＩＳ Ｒ３１０２「ガラス系材料の線膨張係数測定法」に準じた方法により熱膨張係数を測定し、レーザーフラッシュ法により２０℃における熱伝導率を測定した。
[Examples 1-7 and Comparative Examples 1-3]
Molten aluminum containing the elements shown in Table 1 (melt temperature: 680 ° C. to 700 ° C.) was poured into carbon molds heated to 680 to 700 ° C., respectively, and cast into a cylindrical shape. A test piece is cut out from this cylindrical cast product, the thermal expansion coefficient is measured by a method according to JIS R3102 “Method for measuring linear expansion coefficient of glass-based material”, and the thermal conductivity at 20 ° C. is measured by a laser flash method. did.
表１に示すように、純アルミニウムの例である比較例１と比べて、実施例１〜７では、高い放熱性を維持したまま熱膨張係数を低下させることができることがわかった。 As shown in Table 1, it was found that in Examples 1 to 7, the thermal expansion coefficient can be reduced while maintaining high heat dissipation as compared with Comparative Example 1 which is an example of pure aluminum.
次に、内部の所定の位置にセラミックス板を配置した後にその両面にアルミニウムを流し込んで３９ｍｍ×３９ｍｍ×０．４ｍｍの大きさのアルミニウム板を接合させる形状のカーボン製の鋳型を用意し、その鋳型内の所定の位置に４０ｍｍ×４０ｍｍ×０．６３５ｍｍの大きさのＡｌＮからなるセラミックス板を配置し、酸素濃度１００ｐｐｍ以下の窒素雰囲気の炉内に入れ、７５０℃まで加熱した後、表１に示す元素を含む溶融状態のアルミニウムを、カーボン製シリンダで圧力をかけて酸化被膜を取り除きながら鋳型に流し込んだ。その後、鋳型を冷却してアルミニウムを凝固させることによりアルミニウム板をセラミックス板と接合させた後、室温まで冷却し、接合体を鋳型から取り出した。その後、厚さ０．４ｍｍのアルミニウム板の表面に所定形状のエッチングレジストを印刷し、塩化第二鉄溶液でエッチング処理して一方の面に回路パターンを形成した後、レジストを剥離し、回路パターンをめっきした。 Next, after placing a ceramic plate at a predetermined position inside, a carbon mold having a shape in which aluminum is poured into both surfaces to join an aluminum plate having a size of 39 mm × 39 mm × 0.4 mm is prepared. A ceramic plate made of AlN having a size of 40 mm × 40 mm × 0.635 mm is placed at a predetermined position in the inside, placed in a furnace in a nitrogen atmosphere with an oxygen concentration of 100 ppm or less, heated to 750 ° C., and then shown in Table 1 Molten aluminum containing elements was poured into the mold while applying pressure with a carbon cylinder to remove the oxide film. Thereafter, the mold was cooled to solidify the aluminum to join the aluminum plate to the ceramic plate, and then cooled to room temperature, and the joined body was taken out of the mold. After that, an etching resist having a predetermined shape is printed on the surface of an aluminum plate having a thickness of 0.4 mm, and a circuit pattern is formed on one surface by etching with a ferric chloride solution. Was plated.
このめっき後のセラミックス板とアルミニウム板の接合界面を超音波探傷装置によって調べたところ、いずれの実施例および比較例の場合も接合界面に欠陥がなかった。また、実体顕微鏡観察によってセラミックス板の反りなどによるクラックの発生を確認したところ、いずれの実施例および比較例の場合もクラックの発生がなかった。 When the bonding interface between the plated ceramic plate and the aluminum plate was examined by an ultrasonic flaw detector, no defects were found in the bonding interface in any of the examples and the comparative examples. Moreover, when the occurrence of cracks due to warpage of the ceramic plate was confirmed by observation with a stereomicroscope, no cracks were generated in any of the examples and comparative examples.
また、上記の各々の実施例および比較例のアルミニウム−セラミックス接合基板について、−４０℃で３０分間保持→２５℃で１０分間保持→１２５℃で３０分間保持→２５℃で１０分間保持を１サイクルとするヒートサイクルを１０００回繰り返した後に、アルミニウム板を塩化鉄溶液で剥離し、実体顕微鏡によってセラミックス板の表面を観察したところ、実施例２の場合にはクラックの発生がなく、実施例１および実施例３〜６の場合には微小クラックが発生しただけであったが、実施例７の場合には貫通クラックが発生した。これは、実施例７の場合にＢの含有量が多過ぎることに起因すると考えられる。したがって、本発明によるアルミニウム合金をアルミニウム−セラミックス接合基板に使用する場合には、Ｂの含有量を実施例７の量より少なくし、１５重量％以下にするのが好ましい。また、比較例１および３の場合にはクラックの発生がなかったが、比較例２の場合には貫通クラックが発生した。 For each of the aluminum-ceramic bonding substrates of the above examples and comparative examples, hold at -40 ° C. for 30 minutes → hold at 25 ° C. for 10 minutes → hold at 125 ° C. for 30 minutes → hold at 25 ° C. for 10 minutes for one cycle After repeating the heat cycle 1000 times, the aluminum plate was peeled off with an iron chloride solution, and the surface of the ceramic plate was observed with a stereomicroscope. In the case of Example 2, no crack was generated. In the case of Examples 3 to 6, only a micro crack was generated, but in the case of Example 7, a through crack was generated. This is considered to be due to the excessive content of B in the case of Example 7. Therefore, when the aluminum alloy according to the present invention is used for an aluminum / ceramic bonding substrate, the B content is preferably less than that of Example 7 and not more than 15% by weight. In Comparative Examples 1 and 3, no crack was generated, but in Comparative Example 2, a through crack was generated.
また、１００ｍｍ×６０ｍｍ×３ｍｍの銅ベース板の中央に、３９ｍｍ×３９ｍｍ×０．２ｍｍの大きさになるように、Ｓｎ−３．０Ａｇ−０．５Ｃｕの鉛フリー半田を印刷し、その上に上記の各々の実施例および比較例のアルミニウム−セラミックス接合基板を回路面が上になるように載せ、窒素雰囲気中において２８０℃で１０分間保持して半田付けを行った。これらの各々について上記と同じ条件のヒートサイクルを行い、半田の様子を超音波探傷装置によって観察したところ、比較例１の場合（純アルミニウムの場合）には半田クラックが発生したが、その他の実施例および比較例の場合には半田クラックが発生しなかった。 In addition, Sn-3.0Ag-0.5Cu lead-free solder is printed on the center of a 100 mm × 60 mm × 3 mm copper base plate so as to have a size of 39 mm × 39 mm × 0.2 mm. The aluminum-ceramic bonding substrates of each of the above examples and comparative examples were placed so that the circuit surface was facing upward, and soldered by holding at 280 ° C. for 10 minutes in a nitrogen atmosphere. Each of these was subjected to a heat cycle under the same conditions as described above, and the state of the solder was observed with an ultrasonic flaw detector. In the case of Comparative Example 1 (in the case of pure aluminum), a solder crack occurred. In the case of the example and the comparative example, no solder crack occurred.
また、セラミックス板の両面に３９ｍｍ×３９ｍｍ×０．４ｍｍの同じ大きさのアルミニウム板を接合した代わりに、セラミックス板の一方の面に３９ｍｍ×３９ｍｍ×０．４ｍｍの大きさのアルミニウム板を接合し、他方の面に１００ｍｍ×６０ｍｍ×４ｍｍの大きさのアルミニウム板を接合した以外は、上述した方法と同様の方法により接合体を作製した。その後、厚さ４ｍｍのアルミニウム板の表面をフライス盤により１ｍｍ研削して、厚さを３ｍｍにするとともに表面のうねりが１００μｍ以下の平らな状態にした。次いで、厚さ０．４ｍｍのアルミニウム板の表面に所定形状のエッチングレジストを印刷し、塩化第二鉄溶液でエッチング処理して回路パターンを形成した後、レジストを剥離した。これらの各々について、上述した条件と同じ条件の窒素雰囲気中において２８０℃で１０分間保持し、通炉後のベース板（研削したアルミニウム板）の裏面の反りをレーザー式の反りうねり測定器で測定したところ、実施例１〜７および比較例２〜３の場合には、反りの変化が１００μｍ／１００ｍｍのスパン以内であったが、比較例１の場合（純アルミニウム板の場合）には、反りの変化が３００μｍ／１００ｍｍのスパンもあった。
Also, instead of joining the same size aluminum plate of 39 mm x 39 mm x 0.4 mm on both sides of the ceramic plate, an aluminum plate of 39 mm x 39 mm x 0.4 mm is joined to one side of the ceramic plate. A joined body was produced by the same method as described above, except that an aluminum plate having a size of 100 mm × 60 mm × 4 mm was joined to the other surface. Thereafter, the surface of the aluminum plate having a thickness of 4 mm was ground by 1 mm with a milling machine to obtain a thickness of 3 mm and a flat surface with a surface undulation of 100 μm or less. Next, an etching resist having a predetermined shape was printed on the surface of an aluminum plate having a thickness of 0.4 mm, and a circuit pattern was formed by etching with a ferric chloride solution, and then the resist was peeled off. About each of these, it hold | maintains for 10 minutes at 280 degreeC in the nitrogen atmosphere of the conditions same as the above-mentioned conditions, and measured the curvature of the back surface of the base plate (ground aluminum plate) after passing through the furnace with a laser type warpage undulation measuring instrument. As a result, in Examples 1 to 7 and Comparative Examples 2 to 3, the warpage change was within a span of 100 μm / 100 mm, but in the case of Comparative Example 1 (in the case of a pure aluminum plate), the warp There was also a span of 300 μm / 100 mm.
Claims (14)
An aluminum-ceramic bonding member, wherein an aluminum alloy member made of the aluminum alloy according to claim 6 is bonded to a ceramic member.
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| US7531904B2 (en) | 2005-04-26 | 2009-05-12 | Mitsui Mining & Smelting Co., Ltd. | Al-Ni-B alloy wiring material and element structure using the same |
| US7755198B2 (en) | 2005-04-26 | 2010-07-13 | Mitsui Mining & Smelting Co., Ltd. | Al-Ni-based alloy wiring material and element structure using the same |
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