JP2005286051A5 - - Google Patents

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Publication number
JP2005286051A5
JP2005286051A5 JP2004096886A JP2004096886A JP2005286051A5 JP 2005286051 A5 JP2005286051 A5 JP 2005286051A5 JP 2004096886 A JP2004096886 A JP 2004096886A JP 2004096886 A JP2004096886 A JP 2004096886A JP 2005286051 A5 JP2005286051 A5 JP 2005286051A5
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JP
Japan
Prior art keywords
heater unit
exhaust ports
processing chamber
processing apparatus
substrate
Prior art date
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Application number
JP2004096886A
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English (en)
Japanese (ja)
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JP2005286051A (ja
JP4495498B2 (ja
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Priority to JP2004096886A priority Critical patent/JP4495498B2/ja
Priority claimed from JP2004096886A external-priority patent/JP4495498B2/ja
Publication of JP2005286051A publication Critical patent/JP2005286051A/ja
Publication of JP2005286051A5 publication Critical patent/JP2005286051A5/ja
Application granted granted Critical
Publication of JP4495498B2 publication Critical patent/JP4495498B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004096886A 2004-03-29 2004-03-29 基板処理装置および半導体装置の製造方法 Expired - Lifetime JP4495498B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004096886A JP4495498B2 (ja) 2004-03-29 2004-03-29 基板処理装置および半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004096886A JP4495498B2 (ja) 2004-03-29 2004-03-29 基板処理装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005286051A JP2005286051A (ja) 2005-10-13
JP2005286051A5 true JP2005286051A5 (zh) 2007-10-25
JP4495498B2 JP4495498B2 (ja) 2010-07-07

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ID=35184102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004096886A Expired - Lifetime JP4495498B2 (ja) 2004-03-29 2004-03-29 基板処理装置および半導体装置の製造方法

Country Status (1)

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JP (1) JP4495498B2 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100782484B1 (ko) 2006-07-13 2007-12-05 삼성전자주식회사 열처리 설비
JP4791303B2 (ja) * 2006-09-19 2011-10-12 株式会社日立国際電気 基板処理装置およびこの装置に用いられる冷却手段、ｉｃの製造方法
KR100932965B1 (ko) * 2007-02-09 2009-12-21 가부시키가이샤 히다치 고쿠사이 덴키 단열 구조체, 가열 장치, 가열 시스템, 기판 처리 장치 및반도체 장치의 제조 방법
JP5721219B2 (ja) * 2010-07-09 2015-05-20 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び加熱装置
JP5743746B2 (ja) * 2011-06-27 2015-07-01 東京エレクトロン株式会社 熱処理炉及び熱処理装置
JP5274696B2 (ja) * 2012-07-12 2013-08-28 株式会社日立国際電気 断熱構造体、加熱装置、加熱システム、基板処理装置および半導体装置の製造方法
JP6255267B2 (ja) * 2014-02-06 2017-12-27 株式会社日立国際電気 基板処理装置、加熱装置、天井断熱体及び半導体装置の製造方法
JP6306151B2 (ja) * 2014-03-20 2018-04-04 株式会社日立国際電気 基板処理装置、断熱構造体及び半導体装置の製造方法
JP7015923B2 (ja) * 2018-08-03 2022-02-03 株式会社Kokusai Electric 基板処理装置およびデバイス製造方法
CN114395804B (zh) * 2022-01-14 2022-12-02 浙江大学杭州国际科创中心 一种导电型碳化硅衬底加工方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102045A (ja) * 1991-10-11 1993-04-23 Furukawa Electric Co Ltd:The 気相成長装置
US6005225A (en) * 1997-03-28 1999-12-21 Silicon Valley Group, Inc. Thermal processing apparatus
JP2001257172A (ja) * 2000-03-09 2001-09-21 Hitachi Kokusai Electric Inc 半導体製造装置

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