JP2005283830A - Mounting structure, electrooptic device, electronic equipment, inspection method of mounting structure and inspection method of electrooptic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide mounting structure capable of easily specifying a position of a terminal which outputs a signal to be a cause of a failure even without tracing wiring in the case of inspection, etc., and to provide an electrooptic device equipped with the mounting structure, electronic equipment equipped with the electrooptic device, an inspection method of the mounting structure and an inspection method of the electrooptic device. <P>SOLUTION: In the electrooptic device 1a, output pads 61 with first indexes having the first indexes 610 are arranged for every 10 pieces and output pads 62 with second indexes having the second indexes 620 are arranged for every 100 pieces on output pads 60 formed in a mounting area of a first IC4. Thus, when a position of a predetermined output pad 60 is desired to be specified, it is specified from the rear side of the substrate based on the output pads 61 and 62 with indexes. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mounting structure in which a mounting body is mounted on a mounted body, an electro-optical device including the mounting structure, an electronic apparatus including the electro-optical device, a mounting structure inspection method, and an electric The present invention relates to an inspection method for an optical device.

In electro-optical devices such as active matrix liquid crystal devices and organic electroluminescence display devices, pixels are formed in the image display area at positions corresponding to intersections of a large number of data lines and a large number of scanning lines. Each pixel is driven by supplying a predetermined signal to each pixel via the line and the scanning line. Therefore, in the electro-optical device, the driving IC is mounted on the electro-optical device substrate holding the electro-optical material by COG (Chip On Glass), and the signal output from the driving IC or the driving IC is output. A signal generated based on the signal is output to the data line and the scanning line (see, for example, Patent Document 1).
FIG. 4 of Japanese Patent Laid-Open No. 2003-57677

  In the electro-optical device having such a configuration, in a manufacturing process or the like, a signal is output from the driving IC to light each pixel, and there is a problem in the connection between the pad of the electro-optical device substrate and the bump of the driving IC. Check for any. Here, when a failure occurs in any of the pixel columns, the wiring pattern connected to the corresponding pixel column is traced from the back side of the electro-optical device substrate, and a signal is output to the defective pixel column. The position of the pad is identified, and the mounting state of this pad and bump is confirmed.

  However, in recent years, with the increase in the number of pixels, the number of wiring patterns and pads has increased, and their pitch has become narrower. Therefore, there is a problem that it is becoming difficult to specify the position of the pad that outputs a signal to the defective pixel column by tracing the wiring pattern during the inspection.

  In view of the above problems, a mounting structure that can easily identify the position of a terminal that outputs a signal that causes a failure without tracing the wiring during inspection or the like is provided. To provide an electro-optical device, an electronic apparatus including the electro-optical device, a mounting structure inspection method, and an electro-optical device inspection method.

  In order to solve the above-described problem, in the present invention, a mounting body in which a plurality of wiring patterns and a plurality of first terminals connected to the plurality of wiring patterns are formed, and the first terminals are provided. A mounting structure in which a plurality of provided second terminals are arranged, and the first terminal and the second terminal are electrically connected to each other. The terminal includes an indexed terminal to which an index indicating a position in the plurality of first terminals is added.

  In the present invention, since the plurality of first terminals include an indexed terminal with an index indicating the position in the plurality of first terminals, when the mounting structure is operated, When a problem occurs in the mounting structure, the first terminal that may have caused the problem can be identified based on the indexed terminal without identifying the first terminal by tracing the wiring pattern. Therefore, even when the number of wiring patterns and terminals is increased and the pitch thereof is narrowed, the position of the first terminal that may have caused the problem can be easily identified. The connection state with the second terminal can be inspected.

  In the present invention, the first terminal is, for example, an output terminal that outputs a signal via the wiring pattern. In the case of an electro-optical device, the number of output terminals increases as the number of pixels increases, and therefore it is effective to apply the present invention to the output terminals.

  In the present invention, it is preferable that the substrate has translucency in the mounted body. If comprised in this way, even if it does not remove a mounting body, a mounting area | region can be confirmed from the surface on the opposite side to the side in which the mounting body of the to-be-mounted body is mounted, and a terminal can be specified.

  In this invention, it is preferable that the said parameter | index is a hole penetrated to the said base-material surface formed in the said terminal with a parameter | index. If comprised in this way, the position of the terminal with a parameter | index can be confirmed from the surface on the opposite side to the side in which the mounting body of a to-be-mounted body is mounted. In addition, if the index is configured with such holes, when the first terminal is patterned, the index can be formed at the same time, and the index can be given to a terminal that is becoming increasingly smaller. .

  In the present invention, it is preferable that the indicator-attached terminal is provided with the indicator at a position shifted from a region overlapping the second terminal in plan view. If comprised in this way, when the 2nd terminal is mounted in the terminal with a parameter | index, the reliability of mounting will not fall by presence of a parameter | index.

  In the present invention, it is preferable that the indicator-attached terminal is provided with the indicator at a position shifted from a center position of a region overlapping the second terminal in a plan view. If comprised in this way, when mounting a 2nd terminal in the terminal with a parameter | index, it can suppress that the reliability of mounting falls by presence of a parameter | index.

  In this invention, it is preferable that the said terminal with an index | index is arrange | positioned for every predetermined number of terminals in the arrangement direction of these 1st terminals. In this case, the indicator-equipped terminal has at least a first indicator-equipped terminal arranged at a predetermined number in the arrangement direction of the plurality of first terminals, and a form different from the first indicator-equipped terminal. It is preferable that an index is provided and second indexed terminals arranged at a different number from the first indexed terminals in the arrangement direction of the plurality of first terminals are included. For example, it is preferable that the first indexed terminals are formed every 10 and the second indexed terminals are formed every 100.

  In the present invention, the mounted body is, for example, a substrate including a pad as the first terminal, and the mounted body is an IC including a bump as the second terminal.

  The mounting structure according to the present invention can be used for an electro-optical device. In this case, the mounted body is an electro-optical device substrate that holds the electro-optical device, and in the image display region of the electro-optical substrate, a large number of pixels are arranged in a matrix, and the first terminal Supplies a signal to a plurality of pixels electrically connected to the first terminal via the wiring pattern.

  The electro-optical device according to the present invention is a liquid crystal device, an electroluminescence display device, or the like, and such an electro-optical device is used in an electronic apparatus such as a mobile phone or a mobile computer.

  In the present invention, a translucent substrate on which a plurality of wiring patterns and a plurality of first terminals connected to the plurality of wiring patterns are formed, and a mounting body on which a plurality of second terminals are arranged, And the plurality of first terminals have positions within the plurality of first terminals. In the mounting structure inspection method in which the first terminals and the second terminals are electrically connected to each other, As an index indicating the above, a terminal with an index in which a hole penetrating to the substrate surface is formed is included, and a signal is supplied to the first terminal via the second terminal to operate the mounting structure. When the trouble occurs in the mounting structure, the position of the first terminal that outputs a signal that causes the trouble is the side on which the mounting body of the base is mounted based on the terminal with the index It is characterized by specifying from the opposite side.

  According to the present invention, a translucent electro-optical device substrate on which a plurality of wiring patterns and a plurality of first terminals connected to the plurality of wiring patterns are formed, and the electro-optical device substrate are held. The electro-optic material, and a driving IC in which a plurality of second terminals are arranged, the first terminal and the second terminal are electrically connected, and the electro-optic substrate In the image display area, in the inspection method of the electro-optical device in which a plurality of pixels are arranged in a matrix, the plurality of first terminals are used as indices indicating positions in the plurality of first terminals, An indexed terminal having a hole penetrating to the surface of the base material is included, a signal is supplied to the first terminal via the second terminal to operate the electro-optical device, and the plurality When a malfunction occurs in any of the pixels Specifying the position of the first terminal that outputs a signal to the pixel in which the defect has occurred from the side opposite to the side on which the driving IC is mounted based on the terminal with the index. Features.

  Embodiments of the present invention will be described below with reference to the drawings.

(Overall configuration of electro-optical device)
FIG. 1 is a block diagram illustrating an electrical configuration of the electro-optical device. 2A and 2B are a schematic perspective view of the electro-optical device to which the present invention is applied as seen from the element substrate side, and a schematic perspective view of the electro-optical device as seen from the counter substrate side. FIG. 3 is a cross-sectional view of the electro-optical device shown in FIG. 2 cut in the Y direction at a portion passing through the pixel electrode.

  The electro-optical device 1a shown in FIG. 1 is an active matrix type liquid crystal device using TFD (Thin Film Diode / Thin Film Diode Element) as a pixel switching element. Scanning lines 51a extend in the X direction (row direction), and a plurality of data lines 52a extend in the Y direction (column direction). In the image display area 2 of the electro-optical device 1a, pixels 53a are formed at positions corresponding to the intersections of the scanning lines 51a and the data lines 52a, and a large number of pixels 53a are arranged in a matrix. In these pixels 53a, a liquid crystal layer 54a and a TFD element 56a for pixel switching are connected in series. Each scanning line 51a is driven by a scanning line driving circuit 57a, and each data line 52a is driven by a data line driving circuit 58a.

  In constructing such an electro-optical device 1a, as shown in FIGS. 2A, 2B, and 3, the element substrate 10 (electro-optical device substrate / mounted body) and the counter substrate 20 are assembled. The liquid crystal 19 as an electro-optical material is sealed in a region surrounded by both substrates and the sealing material 30 while being bonded together by the sealing material 30. The sealing material 30 is formed in a substantially rectangular frame shape along the edge of the counter substrate 20, but a part thereof is opened to enclose the liquid crystal 19. For this reason, after the liquid crystal 19 is sealed, the opening is sealed with the sealing material 31.

  The base materials 10a and 20a of the element substrate 10 and the counter substrate 20 are both plate members having light transmissivity such as glass, quartz, and plastic. A plurality of data lines 52a, a pixel switching TFD element (not shown), a pixel electrode 34a, an alignment film (not shown), and the like are formed on the inner surface (the liquid crystal 19 side) surface of the element substrate 10. Is done. On the other hand, a plurality of scanning lines 51a are formed on the inner surface of the counter substrate 20, and an alignment film (not shown) is formed on the surface side of the scanning lines 51a.

  In practice, a polarizing plate for polarizing incident light, a phase difference plate for compensating interference colors, and the like are appropriately attached to the outer surfaces of the element substrate 10 and the counter substrate 20. When performing color display, R (red), G (green), and B (blue) color filters (not shown) are provided in a region facing the pixel electrode 34a with respect to the counter substrate 20. A black matrix (not shown) is formed in a region which is formed in the arrangement and does not face the pixel electrode 34a. Further, the surface on which the color filter and the black matrix are formed is coated with a planarization layer for planarization and protection, and the scanning line 51a is formed on the surface of the planarization layer. Therefore, illustration and description thereof are omitted.

(Configuration of TFD element)
FIG. 4 is an explanatory diagram of a TFD element used as a pixel switching element in the electro-optical device shown in FIG.

In FIG. 4, the element substrate 10 has a base layer 14 formed on the surface of a base material 10a, and the TFD element 56a has two first TFD elements 33a and second TFD elements 33b formed on the base layer 14. A so-called back-to-back structure is constituted by TFD element elements. Therefore, in the TFD element 56a, the current-voltage nonlinear characteristic is symmetric in both positive and negative directions. The underlayer 14 is made of, for example, tantalum oxide (Ta ₂ O ₅ ) having a thickness of about 50 to 200 nm to improve the adhesion of the TFD element 56 a and prevent diffusion of impurities from the element substrate 10. Is provided. The first TFD element 33a and the second TFD element 33b include a first metal layer 32a, an insulating layer 32b formed on the surface of the first metal layer 32a, and a second metal layer formed on the surface of the insulating layer 32b so as to be separated from each other. It is comprised by the metal layers 32c and 32d.

In this embodiment, the first metal layer 32a is formed of, for example, a tantalum single film, a tantalum alloy film or the like having a thickness of about 100 to 500 nm, and the insulating layer 32c is formed of the first metal by, for example, an anodic oxidation method or thermal oxidation method. It is tantalum oxide (Ta ₂ O ₅ ) having a thickness of 10 to 35 nm formed by oxidizing the surface of the layer 32a. The second metal layers 32c and 32d are formed to a thickness of about 50 to 300 nm by a metal film such as chromium (Cr). The second metal layer 32c directly forms part of the data line 52a, and the other second metal layer 32d is connected to a pixel electrode 34a made of a transparent conductive material such as ITO (Indium Tin Oxide). ing.

  In FIG. 2 again, in the electro-optical device 1a, the element substrate 10 is projected from the outer peripheral edge of the sealing material 30 to one side in a state where the element substrate 10 and the counter substrate 20 are bonded together by the sealing material 30. A wiring pattern 8 that is integral with the data line 52a and a wiring pattern 8 that is electrically connected to the scanning line 51a through the inter-substrate conduction extend in the projecting region 10a. In conducting conduction between the substrates, a resin in which a large number of conductive particles having conductivity are dispersed is used as the sealing material 30. Here, the conductive particles are, for example, plastic particles plated with metal or conductive resin particles, and a function of electrically connecting the wiring patterns formed on each of the element substrate 10 and the counter substrate 20. It has. For this reason, in this embodiment, the first IC 4 (face-down bonding type IC chip / mounting body) that outputs an image signal to the data line 52a and the two second ICs that output the scanning signal to the scanning line 51a. IC 5 (face-down bonding type IC chip / mounting body) is COG mounted on the overhanging region 10 a of the element substrate 10, and no IC is mounted on the counter substrate 20 side.

(Explanation of mounting structure)
5A and 5B are explanatory views schematically showing a part of the first IC mounting region formed on the element substrate of the electro-optical device according to the present invention, and schematically showing a part of the bumps of the IC. FIG. FIG. 6 is an explanatory diagram schematically showing a state in which the bumps shown in FIG. 5B are overlapped in a plane with the pads shown in FIG.

  In the electro-optical device 1a of the present embodiment, as shown in FIGS. 2A and 2B, the first IC mounting area 6 has a data line driving circuit built in the central area in the direction along the substrate edge 11. The first IC mounting area 6 in which the first IC 4 is COG mounted is formed, and on both sides of the first IC mounting area 6, the second IC 5 incorporating the scanning line driving circuit is COG mounted. Two IC mounting regions 50 are formed. Further, in the protruding region 10 a of the element substrate 10, a substrate connection region 70 to which the flexible substrate 7 is connected is formed along the substrate edge 11 further on the substrate edge 11 side than the IC mounting regions 6 and 50. Has been.

  In the present embodiment, the first IC mounting area 6 and the second IC mounting area 50 can basically adopt the same configuration. Therefore, referring to FIG. 5 and FIG. The description will focus on the mounting structure of the first IC 4 in the mounting area 6, and the description of the second IC mounting area 50 will be omitted. Further, in the present embodiment, since the present invention is applied to the output pad in the first IC mounting region 6, the configuration on the output pad side will be described with reference to FIGS. 5 and 6, and the description on the input pad side will be omitted. .

  As shown in FIGS. 5A and 5B, in the first IC mounting region 6 of the electro-optical device 1a of this embodiment, the output bumps 40 of the first IC 4 are anisotropic conductive materials (anisotropic). A large number of output pads 60 connected by a conductive material-containing film or an anisotropic conductive material-containing paste) are arranged in parallel with the substrate edge. The output pad 60 is composed of a part of the wiring pattern 8.

  In the output pad 60, the wiring pattern 8 extends with respect to the first pad group 68 arranged in the X direction on the side where the wiring pattern 8 extends in the Y direction, and the first pad group 68. The output pad 60 belonging to the first pad group 68 and the output pad 60 belonging to the second pad group 69 are composed of the second pad group 69 arranged in the X direction on the opposite side. Are aligned at overlapping positions. Of the output pads 60, the wiring pattern 8 connected to the output pads 60 belonging to the first pad group 68 extends as it is toward the image display area and is connected to the data line 52a. On the other hand, the wiring pattern 8 connected to the output pad 60 belonging to the second pad group 69 extends obliquely between the pads 60 belonging to the first pad group 68, and between these pads 60. It extends to the image display area and is connected to the data line 52a. Note that one wiring pattern 8 passes between the output pads 60 belonging to the first pad group 68, and the oblique portions of the wiring pattern 8 are all inclined in the same direction.

  The output pad 60 belonging to the first pad group 68 is formed with an extended portion 630 extending toward the side opposite to the side on which the wiring pattern extends, and the extended portion 630 is formed in the second pad group. After extending obliquely between the pads 60 belonging to 68, it extends linearly through the pads 60. In contrast to this, the output pad 60 belonging to the second pad group 69 is also provided with an extended portion 640 extending toward the side opposite to the side on which the wiring pattern 8 extends. As it is, it extends in parallel with the extended portion 630.

  Corresponding to the arrangement of the output pads 60, the first bump group mounted on the output pads 60 belonging to the first pad group 68 arranged in the X direction on the mounting surface 40 of the first IC 4. 48 and a second bump group 49 mounted on the output pad 60 belonging to the second pad group 69 by being arranged in the X direction at a position adjacent to the first bump group 48 in the Y direction. Thus, the output bumps 40 belonging to the first bump group 48 and the output bumps 40 belonging to the second bump group 49 are aligned at positions overlapping in the Y direction.

  In the electro-optical device 1a configured as described above, in this embodiment, the output pads 60 located in the first, sixth, eleventh,... Among the output pads 60 belonging to the first pad group 68, that is, the first. When including the pad group 68 and the second pad group 69, the output pad 60 located at the first, eleventh, twenty-first,... Has an output pad at the end on the side where the wiring pattern 8 extends. The first index 610 is formed of one small hole that reaches the surface of the base material 10a through the metal layer and the like constituting the output pad 60. The output pad 60 to which the first index 610 is attached is 1 as a pad 61 with an index.

  Further, among the output pads 60 belonging to the first pad group 68, the output pads 60 located at the 51st, 101st,..., That is, the first pad group 68 and the second pad group 69 are counted. The two output pads 60 located at the 101st, 201st,... Reach the surface of the substrate 10a through the metal layer constituting the output pad 60 at the end where the wiring pattern 8 extends. A second indicator 620 made of a small hole is attached, and the output pad 60 attached with such a second indicator 620 is configured as a second indicator-attached pad 62.

  Here, as shown in FIG. 6, the output pad 60 is larger than the output bump 40 of the IC 4, and the first index 610 and the second index 620 are both the first indexed output pad 61 and the second index pad 620. In the output pad 62 with the index, the position is shifted from the region overlapping the bump 40 in a plane. In addition, the width dimension of any output pad 60 is, for example, 10 μm, whereas the first index 610 and the second index 620 are each configured by a hole having a diameter of 3 μm, for example. In the output pad 61 with the index and the output pad 62 with the second index, the terminal portions of at least 6 μm or more remain even in the portions where the indexes 610 and 620 are attached.

(Inspection method of electro-optical device and effect of this embodiment)
In such an inspection process of the electro-optical device 1a, a test terminal is applied to the extending portions 630 and 640 before the ICs 4 and 5 and the flexible substrate 7 are mounted, and a signal is output to the wiring pattern 8. The pixel is turned on, and the presence or absence of a short circuit or disconnection of the wiring pattern 8 is inspected.

  In the inspection process of the electro-optical device 1a, as shown in FIGS. 2A and 2B, after the ICs 4 and 5 and the flexible substrate 7 are mounted, signals and power are supplied via the flexible substrate 7. A potential or the like is supplied, an image signal is output from the output bump 40 of the first IC 4, and a scanning signal is output from the second IC 5. As a result, the image signal is output to the data line 52a via the output pad 60 and the wiring pattern 8, and the scanning signal is output to the scanning line 51a via the wiring pattern 8 and the inter-substrate conduction portion, and the electro-optical device 1a. A predetermined inspection image is displayed.

  In the inspection process after mounting the ICs 4 and 5 and the flexible substrate 7, for example, when a line defect occurs in the inspection image, the position of the output pad 60 that outputs a signal to the pixel column is specified, and this It is necessary to confirm the mounting state of the output pad 60 and the bump 40. Here, in the element substrate 10, pixel addresses are marked in the middle of the wiring pattern 8, but the output pads 60 are not marked with pixel addresses due to space limitations. .

  However, in the electro-optical device 1a of the present embodiment, the base material 10a of the element substrate 10 has translucency, and the output pads 60 are provided with the first output pads 61 with the first index every ten, and 100 A second indexed output pad 62 is included for each. Therefore, even when the IC 4 is mounted on the element substrate 10, if the address of the pixel column in which the line defect has occurred is known, the position of the output pad 60 corresponding to the address of the first indexed output pad 61 and the first output pad 61 It can be easily specified from the back side of the element substrate 10 (the side opposite to the side on which the IC 4 is mounted) on the basis of the output pad 62 with 2 indices. Therefore, even when the wiring patterns 8 and the output pads 60 are increased and the pitches thereof are increased, the positions of the output pads 60 that may have caused the defective bumps can be easily identified. And the bump 40 can be easily analyzed, and the result can be fed back efficiently.

  Here, in specifying the pad, the pad may be automatically specified using a determination device, in addition to the method of visually identifying using a camera or the like.

  Further, in the inspection process performed by applying the inspection terminals to the extending portions 630 and 640 in a state before the ICs 4 and 5 and the flexible substrate 7 are mounted, the position of the specific output pad 60 needs to be specified. In this case, the first indexed output pad 61 and the second indexed output pad 62 may be used.

  In this embodiment, since a small hole is made in the output pad 60 and used as the indicators 610 and 620, the indicators 610 and 620 can be formed simultaneously when the pad 60 is patterned. In addition, the indicators 610 and 620 made of small holes can be applied to the output pad 60 that is being miniaturized. In addition, when an anisotropic conductive material is used for mounting the IC 4, even if the conductive particles accumulate on the indicators 610 and 620, if the hole is formed in the output pad 60, the cut formed on the side end surface of the output pad 60 is used. Unlike the notch, there is no possibility that the accumulated conductive particles short-circuit the adjacent output pads 60.

  Further, in the output pads 61 and 62 with indicators, since the terminal portions of 6 μm or more remain in the portions to which the indicators 610 and 620 are attached, the output pad 60 is on the side opposite to the side on which the wiring pattern 8 extends. Even when the output bumps 40 are mounted, problems such as an increase in resistance at the output pad 60 do not occur.

  In addition, in this embodiment, the indexed output pads 61 and 62 are provided with the indices 610 and 620 at positions shifted from the area overlapping the output bump 40 in plan view. Therefore, when the output bumps 40 are mounted on the indexed output pads 61 and 62, a sufficient facing area can be secured, so that the mounting reliability is not lowered.

  In addition, if the indicators 610 and 620 are attached to the positions of the output pad 60 that are shifted from the region overlapping the output bump 40 in a plan view, for example, as shown in FIG. Even if there is a slight deviation, the indicators 610 and 620 are located at positions shifted from the center of the area overlapping the output bump 40 in the output pads 61 and 62 with the indicators, so that the mounting reliability is improved. The decrease can be suppressed.

  Furthermore, in the present embodiment, on the mounting surface 40 of the first IC 4, two bump groups 48 and 49 arranged in the X direction are arranged in adjacent areas in the Y direction and belong to the first bump group 48. The output bumps 40 and the output bumps 40 belonging to the second bump group 49 are aligned at positions overlapping in the Y direction. Further, in the IC mounting region 6 for the first IC 4 of the element substrate 10, two pad groups 68 and 69 arranged in the X direction are arranged in adjacent regions in the Y direction, and the first pad group 68 has The pads 60 belonging to the pads 60 belonging to the second pad group 69 are aligned at positions overlapping in the Y direction. For this reason, in this embodiment, the number of output pads 60 and output bumps 40 arranged in a predetermined area can be increased by the amount of pads 60 arranged in two rows, and the output pads 60 are arranged densely in this way. Even in this case, in the present embodiment, the position of the specific output pad 60 can be easily specified from the back side of the element substrate 10 based on the first output pad 61 with the index and the second output pad 62 with the index. it can.

  In addition, since the pads 60 belonging to the first pad group 68 and the pads 60 belonging to the second pad group 69 are aligned at positions overlapping in the Y direction, the first IC 4 is formed using an anisotropic conductive material. When mounting, excess resin or the like smoothly flows out in the Y direction, so that unnecessary anisotropic conductive particles do not accumulate locally. Therefore, the first IC 4 can be mounted with high reliability.

[Other embodiments]
In the above embodiment, the indicators 610 and 620 are attached to the positions deviated from the area overlapping the output bump 40 in a plane, and when the mounting position of the IC 4 is slightly deviated as shown in FIG. Although the indicators 610 and 620 are positioned at positions shifted from the center of the region overlapping the bump 40 in a plan view, it overlaps the output bump 40 in a plan view as shown in FIG. A configuration in which the indicators 610 and 620 are located in the region and the indicators 610 and 620 are located at positions shifted from the center of the region overlapping the output bump 40 in plan view may be possible. In such a case, as shown in FIG. 7B, the mounting can be performed more reliably than the case where the indicators 610 and 620 are located at the center of the area overlapping the output bump 40 in a plan view.

  In addition, in the output pads 61 and 62 with the index, if a terminal portion of 6 μm or more remains in the portion to which the indices 610 and 620 are attached, as shown in FIG. Even when the indicators 610 and 620 are located at the center of the region, reliable electrical connection can be achieved.

  Moreover, in the said form, although the parameter | indexes 610 and 620 which consist of a round hole were attached | subjected to the output pad 60, about the shape, a polygon etc. may be sufficient. Furthermore, numbers may be engraved on the output pad 60 to provide the indicators 610 and 620. However, the indicators 610 and 620 made of holes have an advantage that they can be applied to a small output pad 60 as compared with the case of engraving numbers.

  Further, in the above embodiment, the indicators 610 and 620 made of round holes are attached to the output pad 60. However, as shown in FIG. 7C, the notch 630 formed at the edge of the output pad 60 is used as an indicator. Also good.

  Moreover, in the said form, although the form was made to differ by the number of holes as the 1st parameter | index 610 and the 2nd parameter | index 620, the 1st parameter | index 610 and the 2nd parameter | index are not restricted according to the number and the shape and position of an index | index. The form of the index 620 may be different.

  Moreover, although the said form applied this invention to the output side of IC4, 5, you may apply this invention also to the input side.

  In the above embodiment, the base material is provided with translucency, and the indicator is penetrated to the base material surface, so that the terminal can be specified from the back surface side of the base material while the IC is mounted. Later, when the IC is removed and the terminal is specified, and then the IC is remounted, the base material does not have to be translucent, and the indicator penetrates to the surface of the base material. It does not have to be.

  In the above embodiment, the present invention is applied to the case where the IC is mounted on the electro-optical device substrate such as glass. However, the present invention is applied to mount the IC on the flexible substrate in COF (Chip On Film). May be. Even in this case, if the IC mounting region has translucency in the base material of the flexible substrate, the terminal can be specified from the back side.

  Although the above embodiment is an example in which the present invention is applied to an active matrix liquid crystal device, the present invention may be applied to a passive matrix liquid crystal device. The above embodiment is an example in which the present invention is applied to a transmissive active matrix liquid crystal device. However, the present invention may be applied to a reflective or transflective active matrix liquid crystal device. Furthermore, the present invention may be applied to the electro-optical device described below with reference to FIGS. 8 and 9.

  FIG. 8 is a block diagram schematically illustrating a configuration of an electro-optical device including an active matrix liquid crystal device using a thin film transistor (TFT) as a pixel switching element. FIG. 9 is a block diagram of an active matrix electro-optical device including an electroluminescence element using a charge injection type organic thin film as an electro-optical material.

  As shown in FIG. 8, in the electro-optical device 100b composed of an active matrix liquid crystal device using TFTs as pixel switching elements, a pixel for controlling the pixel electrode 109b is provided for each of a plurality of pixels formed in a matrix. A switching TFT 130b is formed, and a data line 106b for supplying an image signal is electrically connected to the source of the TFT 130b. An image signal written to the data line 106b is supplied from the data line driver circuit 102b. Further, the scanning line 131b is electrically connected to the gate of the TFT 130b, and a scanning signal is supplied to the scanning line 131b in a pulsed manner from the scanning line driving circuit 103b at a predetermined timing. The pixel electrode 109b is electrically connected to the drain of the TFT 130b. By turning on the TFT 130b serving as a switching element for a certain period, an image signal supplied from the data line 106b is given to each pixel at a predetermined timing. Write in. The sub-image signal of a predetermined level written in the liquid crystal through the pixel electrode 109b in this way is held for a certain period with the counter electrode formed on the counter substrate (not shown). Here, in order to prevent the held sub-image signal from leaking, a storage capacitor 170b (capacitor) may be added in parallel with the liquid crystal capacitor formed between the pixel electrode 109b and the counter electrode. . The storage capacitor 170b holds the voltage of the pixel electrode 109b, for example, for a time that is three orders of magnitude longer than the time when the source voltage is applied. As a result, the charge retention characteristics are improved, and an electro-optical device capable of performing display with a high contrast ratio can be realized. Note that the method of forming the storage capacitor 170b is different from the case of forming the storage capacitor 170b between the capacitor line 132b, which is a wiring for forming a capacitor, or the case of forming the storage capacitor 170b between the storage line 170b and the preceding scanning line 131b. Also good.

  Even in the liquid crystal device having such a configuration, the whole or a part of the data line driving circuit 102b or the scanning line driving circuit 103b may be built in an IC mounted on the electro-optical device substrate. Therefore, the present invention may be applied to such IC mounting.

  As shown in FIG. 9, an active matrix electro-optical device 100p including an electroluminescence element using a charge injection type organic thin film has an EL (electroluminescence) element that emits light when a driving current flows through an organic semiconductor film, or It is an active matrix type display device that drives and controls light emitting elements such as LED (light emitting diode) elements with TFTs, and since all of the light emitting elements used in this type of display device self-emit, no backlight is required. In addition, there are advantages such as less viewing angle dependency.

  In the electro-optical device 100p shown here, a plurality of scanning lines 103p, a plurality of data lines 106p extending in a direction intersecting with the extending direction of the scanning lines 103p, and the data lines 106p are arranged in parallel. A plurality of common power supply lines 123p and pixels 115p corresponding to the intersections of the data lines 106p and the scanning lines 103p are configured. A data line driving circuit 101p including a shift register, a level shifter, a video line, and an analog switch is configured for the data line 106p. A scanning line driving circuit 104p including a shift register and a level shifter is configured for the scanning line 103p. Each pixel 115p holds a first TFT 131p to which a scanning signal is supplied to the gate electrode via the scanning line 103p and an image signal supplied from the data line 106p via the first TFT 131p. The storage capacitor 133p, the second TFT 132p to which the image signal held by the storage capacitor 133p is supplied to the gate electrode, and the common power supply line when electrically connected to the common power supply line 123p via the second TFT 132p The light emitting element 140p into which a drive current flows from 123p is comprised. The light-emitting element 140p has a configuration in which a counter electrode made of a metal film such as a hole injection layer, an organic semiconductor film as an organic electroluminescence material layer, lithium-containing aluminum, or calcium is laminated on the upper side of the pixel electrode. The counter electrode is formed over the plurality of pixels 115p across the data line 106p and the like.

  In the electroluminescence type electro-optical device having such a configuration, the data line driving circuit 101p or the scanning line driving circuit 104p may be entirely or partially incorporated in an IC mounted on the electro-optical device substrate by COG. Therefore, the present invention may be applied to such IC mounting.

  In addition to the above-described embodiments, plasma display devices, FED (field emission display) devices, LED (light emitting diode) display devices, electrophoretic display devices, thin cathode ray tubes, liquid crystal shutters, and the like are used as electro-optical devices. The present invention can be applied to various electro-optical devices such as a small television and a device using a digital micromirror device (DMD).

  Further, in the above embodiment, the electro-optical device has been described as an example of a mounting structure in which the electro-optical device substrate is a mounted body and the IC is a mounting body. The present invention may be applied to a mounting structure using a conductive substrate as a mounting body, or a mounting structure using a flexible substrate as a mounted body and an IC as a mounting body.

  The above electro-optical device can be used as a display unit in various electronic devices such as a mobile phone and a mobile computer.

FIG. 2 is a block diagram schematically illustrating a configuration of an electro-optical device including an active matrix liquid crystal device using a TFD element as a pixel switching element. 1A and 1B are a schematic perspective view of an electro-optical device to which the present invention is applied as viewed from the element substrate side, and a schematic perspective view of the electro-optical device as viewed from the counter substrate side. FIG. 3 is a cross-sectional view when the electro-optical device shown in FIG. 2 is cut in the Y direction at a portion passing through a pixel electrode. FIG. 3 is an explanatory diagram of a TFD element used as a pixel switching element in the electro-optical device shown in FIG. 2. FIGS. 2A and 2B are explanatory diagrams schematically showing a part of the first IC mounting region formed on the element substrate of the electro-optical device shown in FIG. 2 and part of the bumps of the IC schematically. It is explanatory drawing shown. It is explanatory drawing which shows typically the state which piled up the bump shown to FIG. 5 (B) planarly with respect to the pad shown to FIG. 5 (A). (A), (B), (C) is explanatory drawing which shows typically the modification of the output pad formed in the element substrate of the electro-optical apparatus shown in FIG. 1 is a block diagram schematically showing a configuration of an electro-optical device including an active matrix type liquid crystal device using a thin film transistor (TFT) as a pixel switching element. 1 is a block diagram of an active matrix display device including an electroluminescence element using a charge injection type organic thin film as an electro-optical material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a Electro-optical device, 2 Image display area, 4 1st IC (mounting body), 7 Flexible substrate, 8 Wiring pattern, 10 Element substrate (Electro-optical device substrate / mounting body), 10a Base of element substrate Material, 20 counter substrate, 40 output bump, 60 output pad 61 first output pad with index, 62 second output pad with index, 610 first index, 620 second index

Claims (13)

A mounted body in which a plurality of wiring patterns and a plurality of first terminals respectively connected to the plurality of wiring patterns are formed, and a plurality of second terminals provided corresponding to the first terminals are arranged. In the mounting structure in which the first terminal and the second terminal are electrically connected,
The mounting structure according to claim 1, wherein the plurality of first terminals include an indexed terminal to which an index indicating a position in the plurality of first terminals is attached.   2. The mounting structure according to claim 1, wherein the first terminal is an output terminal that outputs a signal through the wiring pattern.   3. The mounting structure according to claim 1, wherein a base material of the mounted body has translucency.   4. The mounting structure according to claim 3, wherein the index is a hole penetrating to the surface of the base member formed in the terminal with the index.   5. The mounting structure according to claim 1, wherein, in the terminal with an indicator, the indicator is attached at a position shifted from a region overlapping the second terminal in a plan view.   5. The mounting structure according to claim 1, wherein the indicator-attached terminal is provided with the indicator at a position shifted from a center position of a region overlapping the second terminal in a plan view. .   7. The mounting structure according to claim 1, wherein the indexed terminals are arranged for each predetermined number of terminals in the arrangement direction of the plurality of first terminals.   8. The terminal with an index according to claim 7, wherein the terminal with the index is different from at least the first index-equipped terminal arranged at a predetermined number in the arrangement direction of the plurality of first terminals. And a plurality of second index terminals arranged in a different number from the first index terminals in the arrangement direction of the plurality of first terminals. Mounting structure.   9. The device according to claim 1, wherein the mounted body is a substrate including a pad as the first terminal, and the mounted body is an IC including a bump as the second terminal. A mounting structure characterized by being. An electro-optical device provided with a mounting structure defined in any one of claims 1 to 9,
The mounted body is an electro-optical device substrate holding an electro-optical material, and a plurality of pixels are arranged in a matrix in the image display region of the electro-optical substrate,
The electro-optical device, wherein the first terminal is electrically connected to the pixel through the wiring pattern.   An electronic apparatus comprising the electro-optical device defined in claim 10. A translucent substrate on which a plurality of wiring patterns and a plurality of first terminals respectively connected to the plurality of wiring patterns are formed, and a mounting body on which a plurality of second terminals are arranged, In the inspection method of the mounting structure in which the first terminal and the second terminal are electrically connected,
The plurality of first terminals include an indexed terminal in which a hole penetrating to the base material surface is formed as an index indicating a position in the plurality of first terminals,
When the mounting structure is operated by supplying a signal to the first terminal via the second terminal, and a failure occurs in the mounting structure, the signal that causes the failure is output. A mounting structure inspection method, wherein the position of one terminal is specified from the side opposite to the side on which the mounting body is mounted based on the terminal with an index. A translucent electro-optic device substrate on which a plurality of wiring patterns and a plurality of first terminals connected to the plurality of wiring patterns are formed; and an electro-optic material held on the electro-optic device substrate; A drive IC in which a plurality of second terminals are arranged; the first terminal and the second terminal are electrically connected; and the image display area of the electro-optic substrate includes In an inspection method for an electro-optical device in which a plurality of pixels are arranged in a matrix,
The plurality of first terminals include, as an index indicating a position in the plurality of first terminals, an indexed terminal in which a hole penetrating to the base material surface is formed,
When the electro-optical device is operated by supplying a signal to the first terminal via the second terminal and a failure occurs in any of the plurality of pixels, a signal is sent to the pixel in which the failure occurs. An inspection method for an electro-optical device, wherein a position of the first terminal to be output is specified from a side opposite to a side on which the driving IC is mounted based on the terminal with an index.

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