JP2005283359A - Kelvin probe - Google Patents

Kelvin probe Download PDF

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Publication number
JP2005283359A
JP2005283359A JP2004098274A JP2004098274A JP2005283359A JP 2005283359 A JP2005283359 A JP 2005283359A JP 2004098274 A JP2004098274 A JP 2004098274A JP 2004098274 A JP2004098274 A JP 2004098274A JP 2005283359 A JP2005283359 A JP 2005283359A
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probe
tube
fitted
linear bodies
tip contact
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JP4562122B2 (en
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Shigeo Kiyota
茂男 清田
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KIYOTA SEISAKUSHO KK
Kiyota Manufacturing Co
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KIYOTA SEISAKUSHO KK
Kiyota Manufacturing Co
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a Kelvin probe with two probes enabling to inspect a soldering ball using the two probes without trouble. <P>SOLUTION: Two thin metal wires are fitted into an insulated heat-shrinkable tube, and the protrusion from the tube is formed as a needle part. A dummy member is fitted into the tube so that the shape of the tube nearly becomes a round shape. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、2探針ケルビンプローブに係り、詳記すれば、半導体の裏側の半田ボールに2探針を当てて支障無く検査することができる2探針ケルビンプローブに関する。   The present invention relates to a two-probe Kelvin probe. More specifically, the present invention relates to a two-probe Kelvin probe that can be inspected with no trouble by applying two probes to a solder ball on the back side of a semiconductor.

エレクトロニクスの分野において、半導体の裏側には半田ボールが使用されている。以前はこの半田ボールは検査されていなかったが、最近になってこの半田ボールの導通検査の必要性が指摘され、検査されるようになってきている。   In the field of electronics, solder balls are used on the back side of semiconductors. Previously, this solder ball was not inspected, but recently, the necessity of a continuity test of this solder ball has been pointed out and inspected.

また、デバイスのピッチ間隔が狭くなることに伴って、半田ボール間のピッチが日増しにファイン化されてきている。しかして、半田ボールの導通検査においては、従来は1本のプローブを当てて検査していたが、最近になって半田電極が益々ファイン化することに伴い検査値の完璧さを期する目的で、2探針ケルビンプローブが広く求められるようになってきている。しかして従来、半田ボールを検査し得る2探針ケルビンプローブは、全く知られていない。   In addition, as the pitch interval of devices becomes narrower, the pitch between solder balls is becoming finer day by day. In the conventional solder ball continuity test, a single probe is used for the inspection, but recently the solder electrodes have become increasingly finer, with the aim of ensuring perfect inspection values. A two-probe Kelvin probe has been widely demanded. Conventionally, there is no known two-probe Kelvin probe that can inspect solder balls.

この発明は、このような点に着目してなされたものであり、半田ボールを2探針で支障なく検査し得る2探針ケルビンプローブを提供することを目的とする。   The present invention has been made paying attention to such a point, and an object thereof is to provide a two-probe Kelvin probe capable of inspecting a solder ball with two probes without trouble.

上記目的に沿う本発明の構成は、絶縁性熱収縮チューブ内に、好ましくは絶縁コーティングを施した2本の細い金属線状体を嵌合させ、該チューブから突出した部分をニードル部としてなり、該チューブ内にはダミー部材を嵌合させて、前記チューブが略円形を保持するように構成したことを特徴とする。尚、絶縁性熱収縮チューブは、プローブを束ね、外径が大きくなるのを防止する役割をしている。   The configuration of the present invention that meets the above-mentioned purpose is to fit two thin metal wire bodies, preferably coated with an insulating coating, into an insulating heat shrinkable tube, and the portion protruding from the tube becomes a needle portion, A dummy member is fitted in the tube, and the tube is configured to maintain a substantially circular shape. The insulating heat-shrinkable tube plays a role of bundling probes and preventing the outer diameter from increasing.

両線状体の両ニードル部先端コンタクト部は、両先端コンタクト部が一緒になって山形の凹部を形成するような斜面に形成し、該山形凹部斜面が半田ボールに当接するようにすれば、小径の半田ボールでも支障なく2探針検査をすることができる(請求項2)。この山形の凹部は、断面逆V字形でV字の角度は、鋭角とするのが好ましい。   If both tip contact parts of both linear bodies are formed on a slope such that both tip contact parts together form a chevron-shaped recess, and the chevron-shaped recess slope contacts the solder ball, Even with a small-sized solder ball, two-probe inspection can be performed without any problem (claim 2). This angled recess is preferably an inverted V-shaped cross section, and the V-shaped angle is preferably an acute angle.

前記両線状体の先端コンタクト部は、半田の付着を拒否する材料で構成するのが好ましい(請求項3)。このような材料としては、硬い材質のチタン合金で形成するのが好ましい。また、先端コンタクト部に、イリジウムの粉体をコーティングすることもできる。   It is preferable that the tip contact portions of the two linear bodies are made of a material that refuses to adhere solder (Claim 3). Such a material is preferably formed of a hard titanium alloy. Further, the tip contact portion can be coated with iridium powder.

板体に多数の貫通孔を穿設し、該貫通孔に上記プローブを嵌合固定することによって、多数の半田ボールを同時に検査するプローブとすることができる(請求項4)。   A plurality of through holes are formed in the plate body, and the probe is fitted and fixed in the through hole, whereby a probe for simultaneously inspecting a large number of solder balls can be obtained.

板体と対向してプローブ後方に、第2の板体を設け、両板体をバネで連結することにより、前記プローブを上下動し得るように構成することができる(請求項5)。   The probe can be configured to move up and down by providing a second plate behind the probe facing the plate and connecting the two plates with a spring.

要するに本発明は、細い金属線状体をダミー部材と共に絶縁性熱収縮チューブに嵌合させることによって、略円形形状を保持し得るようにすると共に細い線状体でも十分な強度を有する2探針ケルビンプローブとしたことを要旨とするものである。また2探針の先端コンタクト部を、逆V字形とすることによって、小径の半田ボールでも支障なく2探針検査することができる。   In short, the present invention enables a substantially circular shape to be maintained by fitting a thin metal linear body with an insulating heat-shrinkable tube together with a dummy member, and has a sufficient strength even with a thin linear body. The gist is that it is a Kelvin probe. In addition, by making the tip contact portion of the two probes have an inverted V shape, the two-probe inspection can be performed without any trouble even with a small-diameter solder ball.

本発明によれば、小さな半田ボールであっても2探針で支障なく検査し得るので、半田ボールの検査値の完璧さを期することができるという従来のプローブでは全く得られない絶大な効果を奏する。   According to the present invention, even a small solder ball can be inspected with two probes without any trouble, so that it is possible to expect perfection of the inspection value of the solder ball. Play.

図1(A)及び(B)は、本発明の一実施例を示すものであり、円筒状絶縁性熱収縮チューブ1内に、2本の細い金属線状体2,2´が嵌合し、前記チューブ1内には線状のダミー部材3,3´を嵌合して、前記チューブ1が略円形を保持するように構成した例を示す。   FIGS. 1A and 1B show an embodiment of the present invention, in which two thin metal linear bodies 2 and 2 ′ are fitted in a cylindrical insulating heat-shrinkable tube 1. An example is shown in which linear dummy members 3 and 3 'are fitted in the tube 1 so that the tube 1 maintains a substantially circular shape.

金属線状体2,2´の外周は、絶縁材をコーティングするか、金属線状体2と2´との間に絶縁材を介装する。   The outer periphery of the metal linear bodies 2 and 2 ′ is coated with an insulating material, or an insulating material is interposed between the metal linear bodies 2 and 2 ′.

ダミー線材3,3´は、プラスチックのような絶縁材で形成するか、金属線に絶縁材をコーティングして使用する。   The dummy wires 3 and 3 'are formed of an insulating material such as plastic, or a metal wire is coated with an insulating material.

両線状体2,2´の両ニードル部4,4´先端コンタクト部は、両線状体が一緒になって逆V字形(山形)の凹部を形成するような斜面6,6´に形成されている。山形の凹部の斜面6,6´が半田ボール5に当接する。山形の凹部の山形頂点の角度は、鋭角とするのが好ましく、更に好ましくは60〜90℃であり、特に好ましくは70〜85°である。   Both needle portions 4 and 4 'tip contact portions of both linear bodies 2 and 2' are formed on slopes 6 and 6 'such that both linear bodies together form an inverted V-shaped (mountain) recess. Has been. The slopes 6 and 6 ′ of the chevron-shaped recess abut against the solder ball 5. The angle of the peak of the chevron-shaped recess is preferably an acute angle, more preferably 60 to 90 ° C, and particularly preferably 70 to 85 °.

両線状体2,2´のチューブ1から上方に突出した線状体7,7´は、リード線の役割をするようになっている。   The linear bodies 7 and 7 'protruding upward from the tube 1 of the two linear bodies 2 and 2' serve as lead wires.

金属線状体2,2´は、半田の付着を拒否する硬度のあるチタン合金で形成されているので、繰り返し支障なく使用することができる。   Since the metal linear bodies 2 and 2 ′ are formed of a titanium alloy having a hardness that refuses the adhesion of solder, the metal linear bodies 2 and 2 ′ can be used repeatedly without any trouble.

このプローブを、多数の半田ボールを同時に検査し得るプローブとするには、板体に多数の貫通孔を穿設し、該貫通孔にプローブを嵌合固定すれば良い。   In order to make this probe a probe capable of inspecting a large number of solder balls at the same time, a large number of through holes may be formed in the plate body, and the probes may be fitted and fixed in the through holes.

また、このプローブを半田ボールに当接させることによって上下動させるには、板体と対向してプローブ後方に第2の板体を設け、両板体をバネで連結すればよい。   Further, in order to move the probe up and down by contacting the solder ball, a second plate may be provided behind the probe so as to face the plate, and both plates may be connected by a spring.

金属線状体2,2´としては、例えば、銅、銅合金から形成することができる。また、金属線状体2,2´の径は、好ましくは0.1〜0.5mm、特に好ましくは0.2〜0.3mmである。   The metal linear bodies 2 and 2 'can be formed from, for example, copper or a copper alloy. Moreover, the diameter of the metal linear bodies 2 and 2 'is preferably 0.1 to 0.5 mm, particularly preferably 0.2 to 0.3 mm.

絶縁性熱収縮チューブ1の径は、好ましくは0.3〜1.0mm、特に好ましくは、0.4〜0.7mmである。ダミー線材3,3´の径は、金属線状体2,2´を挟む隙間に嵌合し得る大きさとすれば良い。絶縁性熱収縮チューブ1に、金属線状体2,2´とダミー線材3,3´とを嵌合させた後、熱収縮チューブ1を加熱収縮させる。   The diameter of the insulating heat-shrinkable tube 1 is preferably 0.3 to 1.0 mm, particularly preferably 0.4 to 0.7 mm. The diameter of the dummy wire rods 3 and 3 ′ may be set to a size that can be fitted into a gap between the metal wire bodies 2 and 2 ′. After the metal linear bodies 2, 2 ′ and the dummy wires 3, 3 ′ are fitted to the insulating heat shrinkable tube 1, the heat shrinkable tube 1 is heated and shrunk.

熱収縮チューブ1の長さは、10〜30mmとするのが好ましく、金属製線状体2,2´のチューブ1から突出しているニードル部4,4´の長さは、3mm〜15mmとするのが好ましい。ダミー線材3,3´の長さは、絶縁性熱収縮チューブ1の長さと同程度の長さとするのが好ましい。   The length of the heat-shrinkable tube 1 is preferably 10 to 30 mm, and the length of the needle portions 4 and 4 ′ protruding from the tube 1 of the metal linear bodies 2 and 2 ′ is 3 to 15 mm. Is preferred. The lengths of the dummy wires 3 and 3 ′ are preferably set to the same length as that of the insulating heat-shrinkable tube 1.

金属製線状体2,2´は、先端斜面6,6´の中央コンタクト部を除いて絶縁体被膜が形成されている。絶縁材は、好ましくは3〜5μコーティングするのが良い。   The metal linear bodies 2 and 2 ′ are formed with an insulator coating except for the central contact portion of the tip slopes 6 and 6 ′. The insulating material is preferably 3 to 5 μm.

本発明の一実施例を示す(A)横断面図、(B)縦断面図である。It is (A) horizontal cross-sectional view and (B) longitudinal cross-sectional view which show one Example of this invention.

符号の説明Explanation of symbols

1・・………絶縁性熱収縮チューブ
2,2´・・………金属線状体
3,3´・・………ダミー部材(ダミー線状体)
4,4´・・………ニードル部
5・・………半田ボール
6,6´・・………先端斜面
7,7´・・………リード線
1 .... Insulating heat-shrinkable tube 2, 2 '... Metal wire 3, 3, 3 ... Dummy member (dummy wire)
4, 4 '····················································································· Lead wire

Claims (5)

絶縁性熱収縮チューブ内に、2本の細い金属線状体を嵌合させ、該チューブから突出した部分をニードル部としてなり、該チューブ内にはダミー部材を嵌合させて、前記チューブが略円形を保持するように構成したことを特徴とする2探針ケルビンプローブ。 Two thin metal wires are fitted into an insulating heat-shrinkable tube, and a portion protruding from the tube is used as a needle portion, and a dummy member is fitted into the tube so that the tube is substantially A two-probe Kelvin probe configured to hold a circular shape. 前記両線状体の両ニードル部先端コンタクト部は、両先端コンタクト部が一緒になって山形の凹部を形成するような斜面に形成し、該山形の凹部斜面が半田ボールに当接する請求項1記載のプローブ。 2. The tip contact portions of both needle portions of the two linear bodies are formed on a slope such that the tip contact portions together form a chevron-shaped recess, and the chevron-shaped recess slope contacts the solder ball. The probe as described. 前記両線状体の先端コンタクト部を、半田の付着を拒否する材料で構成してなる請求項1又は2記載のプローブ。 The probe according to claim 1 or 2, wherein the tip contact portions of the two linear bodies are made of a material that refuses to adhere solder. 板体に多数の貫通孔を穿設し、該貫通孔に請求項1または2に記載のプローブを嵌合固定したことを特徴とするプローブ。 A probe comprising a plurality of through-holes formed in a plate and the probe according to claim 1 or 2 fitted and fixed to the through-holes. 前記板体と対向してプローブ後方に、第2の板体を設け、両板体をバネで連結して、前記プローブが上下動し得るように構成してなる請求項4記載のプローブ。 The probe according to claim 4, wherein a second plate is provided behind the probe so as to face the plate, and the two plates are connected by a spring so that the probe can move up and down.
JP2004098274A 2004-03-30 2004-03-30 Two-probe Kelvin probe for solder ball inspection Expired - Fee Related JP4562122B2 (en)

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JP2004098274A JP4562122B2 (en) 2004-03-30 2004-03-30 Two-probe Kelvin probe for solder ball inspection

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JP2004098274A JP4562122B2 (en) 2004-03-30 2004-03-30 Two-probe Kelvin probe for solder ball inspection

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JP4562122B2 JP4562122B2 (en) 2010-10-13

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007285970A (en) * 2006-04-19 2007-11-01 Nec Electronics Corp Device and method of measuring kelvin contact
US7710133B2 (en) 2007-05-25 2010-05-04 Toko, Inc. Testing method for semiconductor device having ball-shaped external electrode

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JPS6333472U (en) * 1986-08-20 1988-03-03
JPH02245673A (en) * 1989-03-17 1990-10-01 Fujitsu Ltd Electric-resistance measuring method
JPH06273484A (en) * 1993-03-18 1994-09-30 I C T:Kk Inspection device of semiconductor element
JPH0723284U (en) * 1993-10-01 1995-04-25 日置電機株式会社 Fine pitch probe unit
JP2001242193A (en) * 2000-02-28 2001-09-07 Kiyota Seisakusho:Kk Ultra-thin contact probe and its manufacturing method
JP2002005958A (en) * 2000-06-26 2002-01-09 Tokyo Cathode Laboratory Co Ltd Measuring needle for probe card, probe card, and manufacturing method of measuring needle
JP2002065598A (en) * 2000-06-13 2002-03-05 Olympus Optical Co Ltd Treatment instrument for endoscope
JP2003043104A (en) * 2001-08-01 2003-02-13 Matsushita Electric Ind Co Ltd Inspection device for semiconductor device

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JPS5741168U (en) * 1980-08-20 1982-03-05
JPS6333472U (en) * 1986-08-20 1988-03-03
JPH02245673A (en) * 1989-03-17 1990-10-01 Fujitsu Ltd Electric-resistance measuring method
JPH06273484A (en) * 1993-03-18 1994-09-30 I C T:Kk Inspection device of semiconductor element
JPH0723284U (en) * 1993-10-01 1995-04-25 日置電機株式会社 Fine pitch probe unit
JP2001242193A (en) * 2000-02-28 2001-09-07 Kiyota Seisakusho:Kk Ultra-thin contact probe and its manufacturing method
JP2002065598A (en) * 2000-06-13 2002-03-05 Olympus Optical Co Ltd Treatment instrument for endoscope
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JP2003043104A (en) * 2001-08-01 2003-02-13 Matsushita Electric Ind Co Ltd Inspection device for semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007285970A (en) * 2006-04-19 2007-11-01 Nec Electronics Corp Device and method of measuring kelvin contact
JP4574588B2 (en) * 2006-04-19 2010-11-04 ルネサスエレクトロニクス株式会社 Kelvin contact measuring device and measuring method
US7710133B2 (en) 2007-05-25 2010-05-04 Toko, Inc. Testing method for semiconductor device having ball-shaped external electrode

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