JP2005281510A5 - - Google Patents

Description

The present invention relates to a pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet, in particular, even when dicing the semiconductor member was attached to the adhesive sheet to the Chi-up shape without vain scatter the semiconductor member, to put the scraping up of the pressure-sensitive adhesive allowed without further static electricity is not generated even when the switch-up of semiconductor members and pins Tsu Kua-up after the dicing pressure-sensitive adhesive composition and a pressure-sensitive adhesive sheet.

In the semiconductor wafer-fixing pressure-sensitive adhesive sheet of Patent Document 1, although Chi-up jump or the like is used up, the miniaturization of recent Chi Tsu Pusaizu, further improvement of the adhesive strength has become necessary. In addition, adhesive adhesion to the semiconductor member by scraping the blade during dicing has been washed with chlorofluorocarbon. However, in recent years, there is a concern about the influence of chlorofluorocarbon on the environment, and it is desired that the adhesive does not adhere.

Further, the static electricity generated at the time of peeling at the time of peak Tsu Kua-up after the semiconductor member dicing, also occurs a problem that the semiconductor member is destroyed.

Accordingly, the present invention, the adhesive also pasted semiconductor member into a sheet by dicing the Chi-up shape without vain scatter the semiconductor member, without causing scraping up of the adhesive, more Chi-up into diced semiconductor member to provide pressure-sensitive adhesive composition static electricity is not generated even if the pin Tsu Kua-up and pressure-sensitive adhesive sheet.

In the present invention, by a pressure-sensitive adhesive composition to the above configuration, even when dicing the semiconductor member was attached to the adhesive sheet to the Chi-up shape without vain scatter the semiconductor element, scraping the adhesive without causing elevated static it does not cause even further switch-up of semiconductor members and pins Tsu Kua-up after dicing. Moreover, in other invention, the said effect can be exhibited at an adhesive sheet by setting an adhesive sheet as the said structure.

The pressure-sensitive adhesive sheet of Example 1 according to the present invention is a sheet made of polyethylene having a thickness of 150 μm as a base material and a pressure-sensitive adhesive layer having a thickness of 25 μm provided on one surface of the base material. Here, the pressure-sensitive adhesive layer is composed of 100 parts by mass of an acrylic acid alkyl ester / acrylic acid alkoxyalkyl ester copolymer having a halogen (chlorine) -containing monomer content of 5% by mass as an elastomer, an ultraviolet crosslinkable oligomer (manufactured by Negami Kogyo Co., Ltd.). Art Resin UN3320) 30 parts by mass, 3 parts by mass of a photopolymerization initiator (Irgacure 184 manufactured by Ciba Geigy) and 5 parts by mass of N-benzylethylenediamine (Sumicur AF manufactured by Sumitomo Chemical Co., Ltd.) as an amine curing agent are blended. In addition, the comparative example mentioned later is the same as that of a present Example except the part mentioned especially.

Table 1 Dicing property (jumping Chi-up) is such pressure-sensitive adhesive sheet of the present embodiment, affixed to the semiconductor member which is molded by Pas Tsu cage forming mold resin does not enter air bubbles, 5 mm after 10-minute standing □ diced to, is a switch-up jump number for the 100 Chi-up the total number at the time of repeating this work five times. This value is better as the numerical value is smaller for work, and is preferably 0/100.

Splashed Table 1 adhesive, such adhesive sheet in this embodiment, pasted to the semiconductor member which is molded by Pas Tsu cage forming mold resin does not enter air bubbles, and diced into 5 mm □ after left for 10 minutes, this operation was repeated five times, a number of adhesion was observed in the pressure-sensitive adhesive to the Chi-up side for 100 Chi-up the total. This value is better for work as the numerical value is smaller, and 0/100 is preferable.

The adhesive force in Table 1, such pressure-sensitive adhesive sheet of the present embodiment, affixed not to introduce air bubbles into the semiconductor component which is molded by Pas Tsu cage forming mold resin is measured in accordance with JIS Z 0237 . This value must be 5.0 N / 20 mm or more for work.

The surface resistance values in Table 1 are obtained by measuring the resistance value of the pressure-sensitive adhesive surface of the pressure-sensitive adhesive sheet according to this example using a surface resistance measuring instrument (Advantest R8340A) in an atmosphere at a temperature of 23 ° C. and a humidity of 55%. It is. This value must be less than 1.0 × 10 ¹² Ω / □ for work.

Adhesive sheet flew Chi-up in this embodiment, scraping up of the adhesive is not confirmed, the surface resistance of 5.0 × 10 ¹¹ Ω / □, a chlorine ion extraction amount is less than 0.1 ppm, the better there were.

Comparative Example 1, although Chi-up jump is not, scraped up of the adhesive, and the adhesive surface resistance was bad. Comparative Example 2 is not scraping up of the adhesive, although adhesive surface resistance good adhesive strength was low, was observed many fly Ji-up. Although the comparative example 3 had little chlorine ion extraction amount, the adhesive surface resistance value was bad. Although the comparative example 4 had little chloride ion extraction amount, the adhesive surface resistance value was bad. Comparative Example 5, although scraping up not of the pressure-sensitive adhesive, chlorine ions extracted large amount was seen many fly Ji-up.

Claims (9)

100 mass parts of elastomer and 0.05-30 mass parts of amine curing agent having at least two or more functional groups, the elastomer is a copolymer of at least one halogen-containing polymerizable monomer, and halogen-containing polymerizable A pressure-sensitive adhesive composition having a monomer content of 0.1 to 55 mass% of the entire elastomer. The pressure-sensitive adhesive composition according to claim 1, wherein the amine curing agent is N-benzylethylenediamine. The pressure-sensitive adhesive composition according to claim 1 or 2, wherein the halogen-containing polymerizable monomer is an epihalohydrin. 4. The pressure-sensitive adhesive composition according to claim 1, wherein the halogen contained in the elastomer is selected from at least one of chlorine and fluorine . The pressure-sensitive adhesive composition according to any one of claims 1 to 4, wherein the elastomer is a copolymer of a halogen-containing polymerizable monomer and a halogen-free polymerizable monomer, and the halogen-free polymerizable monomer is a (meth) acrylic acid ester. . A sheet substrate, the pressure-sensitive adhesive sheet obtained by laminating a pressure-sensitive adhesive composition according to claims 1 to 5 on one or both surfaces of the substrate. The pressure-sensitive adhesive sheet according to claim 6, wherein the halogen contained in the elastomer is selected from at least one of chlorine and fluorine . The pressure-sensitive adhesive sheet according to claim 6 or 7, wherein the elastomer is a copolymer of a halogen-containing polymerizable monomer and a halogen-free polymerizable monomer, and the halogen-free polymerizable monomer is a (meth) acrylic acid ester. . The pressure-sensitive adhesive sheet according to claim 6 , wherein the pressure-sensitive adhesive sheet is for fixing a semiconductor member.