JP2005275693A - Information processor, and cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an information processor, and a cooling device capable of improving capacity of the cooling device without raising a rotational frequency of a fan, and capable of improving quietness. <P>SOLUTION: A radiation component 7 arranged in thermal connection to an arithmetic process unit 4 is arranged in a duct component 13, and two fans 11 and 12 for intake and exhaust are arranged so as to face each other on both ends of the duct component 13. In an air flow path 14 of the duct component 13, a cross section of an intermediate portion is smaller than opening cross sections at both ends respectively connected to the two fans 11 and 12 for intake and exhaust. By this air flows of the fans efficiently contact the radiation component 7, and the cooling capacity can be improved without raising the rotational frequencies of the fans. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an information processing apparatus such as a computer equipped with a high-speed arithmetic processing unit, and a cooling apparatus for cooling an arithmetic processing unit that can be mounted on the information processing apparatus.

  In recent years, for example, operating frequencies of arithmetic processing units such as CPU (Central Processing Unit) and GPU (Graphic Processing Unit) mounted on computers such as PCs (Personal Computers) have been improved, and cooling with high cooling capacity has been achieved. The use of equipment has become essential. In general, the cooling mechanism of the arithmetic processing unit includes a heat dissipating part (heat sink) made of a material having high thermal conductivity, which is arranged in close contact with the part to be cooled, and a fan for air-cooling the heat dissipating part. A combination of In order to increase the cooling capacity of the fan, there are a method of increasing the size of the fan and a method of increasing the rotational speed of the fan.

  However, the method of increasing the size of the fan can be said to be an unsuitable measure particularly in a space-saving electronic device device, such as a higher space ratio occupied by the fan inside the device. On the other hand, although the method of increasing the rotation speed of the fan can alleviate the problem of space occupancy, a problem of noise such as wind noise occurs instead.

There is also a method of increasing the overall air volume by arranging an intake fan and an exhaust fan facing each other with a heat radiation component sandwiched between them and exhausting on the other hand (push-pull method) on the other side (for example, Patent Document 1).
Japanese Patent Laying-Open No. 2003-188327 (see paragraph 0010, FIG. 2)

In the push-pull system, where the intake fan and the exhaust fan are placed facing each other with the heat dissipation component sandwiched between them, the issue is how to efficiently contact the airflow from the intake fan to the exhaust fan to the heat dissipation component. . However, the space between the intake fan and the exhaust fan is generally an open space in which the heat dissipation component is exposed. In this case, the airflow generated by each fan is radial, and the airflow cannot be efficiently contacted with the heat radiating component.
Therefore, a duct component that forms an air flow path between the intake fan and the exhaust fan is arranged, and a heat radiating component is arranged inside the duct component so that the air flow efficiently touches the heat radiating component. The method to make is considered.

  However, if there is not much freedom in selecting the fan and heat dissipation parts due to cost restrictions, the combination that the fan occupies is larger than the surface occupies the heat dissipation parts when viewed from the axial direction of the fan's rotation axis. Can occur. In such a case, there is a problem that part of the airflow of the fan passes without touching the heat radiating component, and the capacity of the fan cannot be fully utilized.

  The present invention has been made to solve such a problem, and an information processing apparatus capable of improving the performance of the cooling device without increasing the rotational speed of the fan and improving the quietness. It aims to provide a cooling device.

  In order to achieve such an object, the information processing apparatus of the present invention is disposed so as to face the cooling processing unit, the heat dissipating component disposed in thermal connection with the processing unit, and the heat dissipating component interposed therebetween. Arranged so as to form an air flow path through which the heat dissipating component passes between the intake fan and the exhaust fan, and between the intake fan and the exhaust fan. And a duct part smaller than the opening cross section at both ends connected to the fan respectively.

  In the present invention, more specifically, the air flow path of the duct component includes a road surface that is inclined with respect to the axis of the rotation axis of the fan.

  According to the present invention, the airflow of the fan is guided in the air flow path of the duct part so that the airflow of the fan efficiently contacts the heat dissipating part, thereby improving the capacity of the cooling device without increasing the rotational speed of the fan. It is possible to realize an information processing apparatus that is excellent in quietness.

  Further, in the information processing apparatus of the present invention, each fan is detachably attached to the duct part. Therefore, compared to the conventional method in which the fan is attached to the heat radiating part, the connection part with the socket of the arithmetic processing unit, etc. The fan can be easily and safely replaced without stress.

  According to the information processing apparatus and the cooling apparatus of the present invention, the capacity of the cooling apparatus can be increased without increasing the rotational speed of the fan, and the quietness can be improved.

  Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a layout of an internal device of an information processing apparatus 100 according to an embodiment of the present invention.
As shown in the figure, a housing 1 of the information processing apparatus 100 includes a power supply unit 2 that secures a power source necessary for operating the information processing apparatus 100, and a main board 3 that connects the devices. An arithmetic processing unit 4 such as a CPU, a cooling device 10 for cooling the arithmetic processing unit 4, a memory module 5, a storage unit 6 such as an HDD, and the like are arranged. Of course, this configuration is merely an example, and any device combination may be used as long as it can operate as a computer system.

  The information processing apparatus 100 is, for example, a compact design computer. In a computer with a compact design, devices are arranged at a high density in the housing 1, so the internal air permeability is poor and the internal temperature tends to be high. For this reason, the cooling device 10 that cools the arithmetic processing unit 4 such as a CPU is required to have a high cooling capacity. Further, even in a computer other than the compact design as shown in FIG. 1, that is, a computer that can keep the distance between devices relatively large, when a processing unit with a high operating frequency is mounted, it has a high cooling capacity. Needless to say, a cooling device is required.

  In the information processing apparatus 100, control is performed to switch the rotational speed of the fan of the cooling apparatus 10 in a stepwise manner based on the temperature of the CPU. That is, the temperature of the CPU is detected by a sensor built in the CPU, and is input to a circuit that controls the fan speed. This circuit performs control so that the higher the temperature, the higher the fan speed, based on the correspondence table between the CPU temperature and the fan speed.

FIG. 2 is a view showing a longitudinal section (A-A ′ section) of the cooling device 10.
As shown in the figure, the cooling device 10 includes two intake and exhaust air units arranged opposite to each other with a heat radiation component (heat sink) 7 disposed in thermal connection with the arithmetic processing unit 4 to be cooled. Two fans 11 and 12 and a duct part 13 arranged to accommodate the heat radiation part 7 are configured. Although it is ideal that the two fans 11 and 12 for intake and exhaust each have the same specifications (size, air volume, and rotation speed), this is not necessarily the case. The intake fan 11 sucks air from inside the casing 1 and introduces it into the air flow path 14 of the duct part 13, and the exhaust fan 12 moves from the inside of the air flow path 14 of the duct part 13 to the outside of the casing 1. Exhaust the air.

  Thus, the method using the two fans 11 and 12 for intake and exhaust is called a push-pull method. In the push-pull method, compared to the case where one fan with the same capacity is used for either intake or exhaust, the overall air volume can be increased without changing the noise level, and the desired cooling capacity can be achieved. The number of fan rotations necessary to obtain can also be lowered. Therefore, it can be said that this is an effective method for improving the quietness.

  The two fans 11 and 12 for intake and exhaust are arranged so that the axis lines 15 of the respective rotary shafts are parallel to each other, or the axis lines 15 are connected by a single straight line. Yes. In FIG. 2, an example in which two fans 11 and 12 for intake and exhaust having the same specifications are arranged such that the shaft centers 15 of the rotation shafts of the fans 11 and 12 are connected by a single straight line. It is shown.

  The two fans 11 and 12 for intake and exhaust are connected by a duct component 13 that forms an air flow path 14 between the two fans 11 and 12. Fan connecting portions at both ends of the duct component 13 are opened, and screw receiving portions 16 having screw holes for receiving the screws 17 for mounting the fans are provided around the respective openings as shown in FIG. Is provided. Further, a pedestal portion 18 for mounting a fan is provided protruding from both ends of the duct component 13. Four screw holes 19 corresponding to individual screw receiving portions 16 provided in the duct part 13 are provided in the two fans 11 and 12 for intake and exhaust. The two fans 11, 12 are respectively disposed on a pedestal portion 18 provided at both ends of the duct part 13 and are detachably attached to the duct part 13 with four screws 17.

  Conventionally, it has been the mainstream that the fan is detachably attached to the heat radiating component. However, in the present embodiment, the fans 11 and 12 are detachably attached to the duct component 13. As a result, no stress is applied to the socket connection portion of the arithmetic processing unit 4 when the fans 11 and 12 are replaced, and the fans 11 and 12 can be replaced easily and safely.

  Furthermore, an opening 20 is provided at the bottom of the duct component 13 so as to accommodate the heat dissipation component 7. Further, the housing 1 is provided with an opening 24 that exposes an exhaust port of the exhaust fan 12.

  In this cooling device 10, the area of the intake / exhaust port of the fans 11, 12 is the area of the heat dissipation component 7 when viewed from the direction of the axis 15 of the rotation shafts of the two fans 11, 12 for intake and exhaust. Contains. In the example shown in FIG. 2, with reference to the height of the surface of the main board 3, the height H1 from the reference height to the upper ends of the intake / exhaust ports of the fans 11 and 12 is the height of the upper end of the heat dissipation component 7. Higher than H2.

  Further, the air flow path 14 of the duct part 13 has a cross section at an intermediate portion smaller than opening cross sections at both ends connected to the two fans 11 and 12 for intake and exhaust. The cross section of the air flow path 14 here is a cross section when the heat radiating component 7 disposed in the duct component 13 is ignored. More specifically, in order to guide the air flow generated by the fans 11 and 12 to be brought into intensive contact with the heat radiating component 7 in the air flow path 14 of the duct component 13, the axis of the rotation shaft of each of the fans 11 and 12. Road surfaces 21 and 22 that are inclined with respect to the line 15 are provided. In the example shown in FIG. 2, the first inclined road surface 21 for gradually reducing the height of the ceiling of the air flow path 14 with the opening on the intake side of the duct part 13 toward the back of the air flow path 14 and A second inclined road surface 22 is provided for gradually increasing the height of the ceiling of the air flow path 14 toward the back of the air flow path 14 with the opening on the exhaust side of the duct part 13 as an end. The space between the first inclined road surface 21 and the second inclined road surface 22 is a surface 23 parallel to the axis 15 of the rotation axis of each of the fans 11 and 12, and the height is higher than the upper end of the heat radiating component 7. The position is set to be slightly higher.

  Since the air flow path 14 of the duct part 13 is configured in this way, the air flow of the fans 11 and 12 is induced in the air flow path 14 of the duct part 13 so that the air flow efficiently contacts the heat radiating part 7, and the rotation of the fan The capacity of the cooling device 10 can be increased without increasing the number, and the information processing device 100 excellent in silence can be realized.

  As shown in FIG. 1, if an opening 25 other than the opening for connecting the fan is provided in the duct part 13, another flow for introducing air into the duct part 13 can be created through the opening 25. In the example of FIG. 1, the opening 25 is provided on the side surface of the duct component 13, and the heat generating component 26 on the main board 3 disposed in the vicinity of the opening 25 can be cooled. For example, a heat generating component 26 for supplying a power supply voltage to the arithmetic processing unit 4 is disposed in the vicinity of the arithmetic processing unit 4, and such a heat generating component 26 can be cooled simultaneously with the arithmetic processing unit 4. .

  Further, the inclined road surface may be provided not only on the ceiling surface of the air flow path 14 of the duct part 13 but also on the side surface of the same air flow path 14.

  FIG. 4 is an example of a cooling device 10 </ b> A in which an inclined road surface is provided on the side surface of the air flow path 14 of the duct part 13.

  In this cooling device 10A, the axial centers 15 of the rotation shafts of the two fans 11 and 12 for intake and exhaust are parallel to each other, and the width W1 of the intake / exhaust ports of the fans 11 and 12 is the width of the heat dissipation component 7. It is larger than W2. In order to absorb this difference in width, the air flow path 14 of the duct part 13 is gradually narrowed on both sides of the air flow path 14 with the opening on the intake side of the duct part 13 facing toward the back of the air flow path 14. A first inclined road surface 21A for going, and a second inclined road surface 22A for gradually expanding both sides of the air flow path 14 toward the back of the air flow path 14 with the opening on the exhaust side of the duct part 13 as an end. Is provided. A space between the first inclined road surface 21A and the second inclined road surface 22A is a surface 23A parallel to the axis 15 of the rotation shaft of each of the fans 11 and 12, and is slightly between the side surfaces of the heat radiation component 7. It is set to create a clear gap.

  Since the air flow path 14 of the duct part 13 is configured in this way, the air flow of the fans 11 and 12 is induced in the air flow path 14 of the duct part 13 so that the air flow efficiently contacts the heat radiating part 7, and the rotation of the fan The capacity of the cooling device 10A can be increased without increasing the number, and the information processing apparatus 100 excellent in silence can be realized.

  Needless to say, the inclined road surface may be provided on both the ceiling surface and the side surface of the air flow path 14 of the duct component 13.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

  In the above-described embodiment, the cooling devices 10 and 10A for the arithmetic processing unit 4 that is a CPU have been described. However, the present invention is not limited to this, and the cooling device may be a cooling device for an arithmetic processing unit that generates a large amount of heat other than the CPU. Available.

It is a perspective view which shows the layout of the internal device of the information processing apparatus concerning one Embodiment of this invention. It is a figure which shows the longitudinal cross-section of the cooling device of FIG. It is a figure which shows the longitudinal cross-section of the fan attachment part of the cooling device of FIG. It is a figure which shows the longitudinal cross-section of the cooling device which is other embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Case, 2 ... Power supply unit, 3 ... Main board, 4 ... Arithmetic processing unit, 5 ... Memory module, 6 ... Storage unit, 7 ... Radiation component, 10 ... Cooling device, 11 ... Fan for intake, 12 ... Exhaust fan, 13 ... duct parts, 14 ... air flow path, 15 ... axial center line, 16 ... screw receiving part, 17 ... screw, 18 ... pedestal part, 19 ... screw hole, 21, 22 ... inclined road surface, 100 ... Information processing device

Claims (6)

An arithmetic processing unit to be cooled;
A heat dissipating component arranged in thermal connection with the arithmetic processing unit;
An intake fan and an exhaust fan disposed opposite to each other with the heat dissipating component interposed therebetween;
Between the intake fan and the exhaust fan is disposed so as to form an air flow path that passes through the heat dissipating component, and a cross section of an intermediate portion of the air flow path includes the intake fan and the exhaust fan. An information processing apparatus comprising: a duct component smaller than an opening cross section at each end connected to each other. The information processing apparatus according to claim 1, wherein the air flow path of the duct part includes a road surface that is inclined with respect to an axis of a rotation axis of the fan. The information processing apparatus according to claim 1, wherein each of the fans is detachably attached to the duct component. An intake fan and an exhaust fan disposed opposite to each other with a heat dissipation component disposed in thermal connection with the processing unit to be cooled;
Between the intake fan and the exhaust fan is disposed so as to form an air flow path that passes through the heat dissipating component, and a cross section of an intermediate portion of the air flow path includes the intake fan and the exhaust fan. And a duct part smaller than the opening cross section at both ends connected to each other. The cooling device according to claim 4, wherein the air flow path of the duct component includes a road surface that is inclined with respect to an axial center line of a rotation shaft of the fan. Each said fan is attached to the said duct component so that attachment or detachment is possible. The cooling device of Claim 4 or 5 characterized by the above-mentioned.

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