JP2005272245A - Silicon single crystal pulling device - Google Patents

Silicon single crystal pulling device Download PDF

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JP2005272245A
JP2005272245A JP2004090197A JP2004090197A JP2005272245A JP 2005272245 A JP2005272245 A JP 2005272245A JP 2004090197 A JP2004090197 A JP 2004090197A JP 2004090197 A JP2004090197 A JP 2004090197A JP 2005272245 A JP2005272245 A JP 2005272245A
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single crystal
radiation shield
silicon single
attached
ring
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Kiwa Sakuma
喜和 佐久間
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Coorstek KK
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Toshiba Ceramics Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a single crystal pulling device capable of controlling the temperature distribution in a crystal side radial direction in a single crystal silicon with a simple structure and without deteriorating an essential function of a radiation shield and capable of manufacturing a high quality single crystal even if pulling is quickened. <P>SOLUTION: The single crystal pulling device is mounted with a reflection plate consisting of a high reflectivity member and whose section is a concave shape and a ring shape at the inside of the radiation shield used for pulling the single crystal in a Czockralski method. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明はシリコン単結晶引上装置に係り、特に輻射シールドの構造を改良したシリコン単結晶引上装置に関する。   The present invention relates to a silicon single crystal pulling apparatus, and more particularly to a silicon single crystal pulling apparatus having an improved radiation shield structure.

一般に半導体デバイスの基板には主にシリコン単結晶が用いられているが、このシリコン単結晶は、多結晶シリコンからチョクラルスキー法(以下、CZ法という。)により製造される。   In general, a silicon single crystal is mainly used for a substrate of a semiconductor device. This silicon single crystal is manufactured from polycrystalline silicon by the Czochralski method (hereinafter referred to as CZ method).

図6に示すように、このCZ法は、単結晶引上装置21内に設置した石英ガラスルツボ22に原料であるポリシリコンを充填し、石英ガラスルツボ22の外周に設けたヒータ23によってポリシリコンを加熱溶解した上、シードチャックに取付けた種結晶を融液Mに浸漬し、シードチャックおよび石英ガラスルツボ22を同方向または逆方向に回転させながらシードチャックを引上げて単結晶Igを成長させる方法である。   As shown in FIG. 6, in this CZ method, a quartz glass crucible 22 installed in a single crystal pulling apparatus 21 is filled with polysilicon as a raw material, and polysilicon is formed by a heater 23 provided on the outer periphery of the quartz glass crucible 22. The seed crystal attached to the seed chuck is immersed in the melt M, and the seed chuck is pulled up while rotating the seed chuck and the quartz glass crucible 22 in the same direction or in the opposite direction to grow a single crystal Ig. It is.

単結晶引上装置21には、シリコン融液の上方に単結晶引上領域の周囲に輻射シールド24が設置され、この輻射シールド24は、下部開口部24dの直径が上部開口部24uの直径より小さい截頭円錐形状の筒体をなしている。輻射シールド24は、単結晶シリコンの引上速度を向上させるために結晶中鉛直方向の温度勾配制御及び融液からの輻射熱を遮断する目的で用いている。   The single crystal pulling device 21 is provided with a radiation shield 24 around the single crystal pulling region above the silicon melt. The radiation shield 24 has a lower opening 24d having a diameter larger than that of the upper opening 24u. It has a small frustoconical cylinder. The radiation shield 24 is used for the purpose of controlling the temperature gradient in the vertical direction in the crystal and blocking radiant heat from the melt in order to improve the pulling speed of the single crystal silicon.

しかしながら、従来の輻射シールドにあっては、単結晶内の温度分布は引上速度が増すほど中心と外周で温度分布に差が生じる。すなわち、結晶中心部は温度が高く、結晶外周部は温度が低いという温度勾配が生じる。逆に単結晶の径方向の温度勾配を均一にしようとすれば、引上速度を抑えなければならず、この両者を損なわず向上させることは困難であった。また、従来の輻射シールドは、これを用いることにより引上速度が増し、ボイド形成温度帯となる1100℃〜1000℃の温度帯幅を短くして通過時間を短縮してきたが、引上速度がより速くなると単結晶の径方向の温度勾配が大きくなり、かつ単結晶の1100℃〜1000℃となる領域がより融液側ヘシフトするため通過時間の短縮が困難となる。   However, in the conventional radiation shield, the temperature distribution in the single crystal has a difference in temperature distribution between the center and the outer periphery as the pulling speed increases. That is, a temperature gradient occurs in which the temperature is high in the center of the crystal and the temperature is low in the outer periphery of the crystal. On the contrary, if the temperature gradient in the radial direction of the single crystal is made uniform, the pulling speed must be suppressed, and it has been difficult to improve both of them without impairing both. In addition, the conventional radiation shield increases the pulling speed by using this, and shortens the passage time by shortening the temperature band width of 1100 ° C. to 1000 ° C. which is the void forming temperature band, but the pulling speed is high. If it is faster, the temperature gradient in the radial direction of the single crystal increases, and the region of the single crystal at 1100 ° C. to 1000 ° C. shifts more to the melt side, making it difficult to shorten the passage time.

なお、特許文献1には、輻射シールドの下端及び上端にリング状の断熱材を設けて、中間部においてその断熱性能を低くするように構成した単結晶引上装置が提案されているが、この装置は単結晶シリコン中の温度分布を制御することにより、引上速度をより速くしても結晶側径方向の温度勾配の増加を抑制して、引上げ時間の短縮を可能とするものではない。   In addition, Patent Document 1 proposes a single crystal pulling apparatus configured to provide a ring-shaped heat insulating material at the lower and upper ends of the radiation shield so as to lower the heat insulating performance in the intermediate portion. By controlling the temperature distribution in the single crystal silicon, the apparatus does not allow an increase in the temperature gradient in the crystal side diameter direction and shorten the pulling time even if the pulling speed is increased.

また、特許文献2には、下端にリング状の石英で被覆した金属反射部材を設けた輻射シールドを有する単結晶引上装置が提案されているが、この装置は温度を制御したい所定の部位に確実に輻射熱を反射させることができない。さらに、特許文献3には、輻射シールドの内側に冷却用部材を設けた単結晶引上装置が提案されているが、この装置は単結晶シリコン中の温度分布を制御することにより、引上速度をより速くしても結晶側径方向の温度勾配の増加を抑制して、引上げ時間の短縮を可能とするものではない。
特開平9−202687号公報(段落[0008]、[0012]、図2) 特開平11−236294号公報(段落[0018]、[0031]、図1) 特開2001−220289号公報(段落[0034]、図6)
Further, Patent Document 2 proposes a single crystal pulling apparatus having a radiation shield provided with a metal reflecting member coated with ring-shaped quartz at the lower end. This apparatus is applied to a predetermined part where the temperature is to be controlled. The radiant heat cannot be reflected reliably. Further, Patent Document 3 proposes a single crystal pulling apparatus in which a cooling member is provided inside the radiation shield. This apparatus controls the pulling speed by controlling the temperature distribution in single crystal silicon. Even if it is made faster, the increase in temperature gradient in the crystal side diameter direction is suppressed, and the pulling time cannot be shortened.
Japanese Patent Laid-Open No. 9-202687 (paragraphs [0008] and [0012], FIG. 2) JP 11-236294 A (paragraphs [0018], [0031], FIG. 1) JP 2001-220289 A (paragraph [0034], FIG. 6)

本発明は上述した事情を考慮してなされたもので、構造が簡単で輻射シールドの本来の機能を損なうことなく、単結晶シリコン中の結晶側径方向の温度分布を制御することができ、引上速度を速くしても高品質な単結晶を製造できるシリコン単結晶引上装置を提供することを目的とする。   The present invention has been made in consideration of the above-described circumstances, and can control the temperature distribution in the crystal side radial direction in single crystal silicon without compromising the original function of the radiation shield. An object of the present invention is to provide a silicon single crystal pulling apparatus capable of producing a high quality single crystal even if the upper speed is increased.

上記目的を達成するため、本発明の1つの態様によれば、チャンバと、このチャンバ内に設けられ原料シリコンが収納される石英ガラスルツボと、この石英ガラスルツボを周囲から加熱するヒータと、前記石英ガラスルツボの上方に設けられシリコン単結晶が貫通する開口が形成された輻射シールドと、この輻射シールドを貫通しシードチャックが取付けられた引上げ用ワイヤと、このワイヤを昇降させるワイヤ回転装置とを有し、前記輻射シールドの内側には、高反射率部材からなり断面が凹状でリング形状の反射板が取付けられたことを特徴とするシリコン単結晶引上装置が提供される。これにより、構造が簡単で輻射シールドの本来の機能を損なうことなく、単結晶シリコン中の温度分布を制御することができ、高品質な単結晶を製造できるシリコン単結晶引上装置が実現される。   To achieve the above object, according to one aspect of the present invention, a chamber, a quartz glass crucible provided in the chamber and containing raw silicon, a heater for heating the quartz glass crucible from the surroundings, A radiation shield provided above a quartz glass crucible and having an opening through which a silicon single crystal penetrates, a pulling wire penetrating the radiation shield and having a seed chuck attached thereto, and a wire rotating device for raising and lowering the wire A silicon single crystal pulling apparatus is provided, characterized in that a ring-shaped reflecting plate made of a highly reflective member and having a concave cross section is attached to the inside of the radiation shield. As a result, a silicon single crystal pulling apparatus capable of controlling the temperature distribution in the single crystal silicon and producing a high quality single crystal without compromising the original function of the radiation shield is realized. .

好適な一例では、前記輻射シールドは、中空截頭円錐状のシールド主体と、このシールド主体から内方に延びるリング形状の水平部と、この水平部から上方にリング形状に立上がる立上部と、前記シールド主体から外方に延びたリング形状の取付部を有し、前記反射板が前記立上部に取付けられる。   In a preferred example, the radiation shield includes a hollow frustoconical shield main body, a ring-shaped horizontal portion extending inwardly from the shield main body, and an upright portion rising upward from the horizontal portion into a ring shape, The reflector has a ring-shaped attachment portion extending outward from the shield main body, and the reflector is attached to the upright portion.

また、他の好適な一例では、前記反射板は、前記輻射シールドの前記立上部に取付けられており、シールド主体と水平部と立上部の空間にリング状の断熱材を取付ける。   In another preferred example, the reflector is attached to the upright portion of the radiation shield, and a ring-shaped heat insulating material is attached to a space between the shield main body, the horizontal portion, and the upright portion.

以下、本発明に係るシリコン単結晶引上装置の一実施形態について添付図面を参照して説明する。   Hereinafter, an embodiment of a silicon single crystal pulling apparatus according to the present invention will be described with reference to the accompanying drawings.

図1は本発明に係る単結晶引上装置の一実施形態の概念図である。   FIG. 1 is a conceptual diagram of an embodiment of a single crystal pulling apparatus according to the present invention.

図1に示すように、本発明に係る単結晶引上装置1は、チャンバ2と、このチャンバ2内に設置され半導体原料が充填される石英ガラスルツボ3と、この石英ガラスルツボ3を保持する黒鉛ルツボ4と、この黒鉛ルツボ4を囲繞しこの石英ガラスルツボ3の半導体原料を加熱して融液Mにするヒータ5と、黒鉛ルツボ4に取付けられチャンバ2の底部6を貫通し、モータ(図示せず)に結合されて回転され、かつ昇降装置(図示せず)によって昇降されるルツボ回転軸7とを有している。   As shown in FIG. 1, a single crystal pulling apparatus 1 according to the present invention holds a chamber 2, a quartz glass crucible 3 installed in the chamber 2 and filled with a semiconductor raw material, and the quartz glass crucible 3. A graphite crucible 4, a heater 5 surrounding the graphite crucible 4 and heating the semiconductor raw material of the quartz glass crucible 3 to melt M, and attached to the graphite crucible 4 through the bottom 6 of the chamber 2 and passing through a motor ( And a crucible rotating shaft 7 which is connected to and rotated by a lifting device (not shown).

また、単結晶引上装置1には、単結晶引上げ用のシード8を保持するシードチャック9が取付けられた引上げ用ワイヤ10が、石英ガラスルツボ3の上方に設けられており、引上げ用ワイヤ10は、チャンバ2外に設けられいずれも図示しないモータにより駆動されワイヤ回転装置に巻取りあるいは解放自在に取付けられており、ワイヤ10は上下に昇降可能になっている。   Further, in the single crystal pulling apparatus 1, a pulling wire 10 to which a seed chuck 9 for holding a single crystal pulling seed 8 is attached is provided above the quartz glass crucible 3. Is provided outside the chamber 2 and is driven by a motor (not shown) and is attached to a wire rotating device so as to be wound or released, and the wire 10 can be moved up and down.

さらに、石英ガラスルツボ3の上方の引上領域を囲むように設置され不活性ガスGの流れを整流し、単結晶Igが貫通する開口部11aが設けられた輻射シールド11を有しており、さらに、チャンバ2の上方には、不活性ガス供給口12が設けられており、チャンバ2の底部6には不活性ガス排出口13が設けられている。 Furthermore, it has a radiation shield 11 installed so as to surround the pulling region above the quartz glass crucible 3 and rectifying the flow of the inert gas G and provided with an opening 11a 1 through which the single crystal Ig passes. Further, an inert gas supply port 12 is provided above the chamber 2, and an inert gas discharge port 13 is provided at the bottom 6 of the chamber 2.

図2に示すように、上記輻射シールド11は、熱伝導性が小さく断熱性に優れた黒鉛基材からなり、その表面はクリーンな雰囲気を保つように炭化珪素で被覆されており、上記開口部11aが設けられ単結晶Igを囲うように配置された中空筒状、例えば中空截頭円錐状のシールド主体11aと、このシールド主体11aから内方に延びるリング形状の水平部11bと、この水平部11bから単結晶に沿って上方にリング形状に立上る立上部11cと、シールド主体11aから外方に延びリング形状の取付部11dとを有している。 As shown in FIG. 2, the radiation shield 11 is made of a graphite base material having low thermal conductivity and excellent heat insulation, and the surface thereof is covered with silicon carbide so as to maintain a clean atmosphere. 11a 1 is provided so as to surround the single crystal Ig and is a hollow cylindrical shape, for example, a hollow truncated conical shield main body 11a, a ring-shaped horizontal portion 11b extending inwardly from the shield main body 11a, and the horizontal It has a raised portion 11c that rises in a ring shape upward along the single crystal from the portion 11b, and a ring-shaped attachment portion 11d that extends outward from the shield main body 11a.

輻射シールド11には、その下部近傍内側、すなわち水平部11bに近接した上方には反射板13が設けられており、図3に示すように、この反射板13は高反射率部材からなり、断面が所定の曲率を有する曲面の凹状でリング形状例えば無底ボウル形状をなしている。   The radiation shield 11 is provided with a reflection plate 13 on the inner side near the lower portion thereof, that is, on the upper side in the vicinity of the horizontal portion 11b. As shown in FIG. Has a concave shape of a curved surface having a predetermined curvature, and has a ring shape, for example, a bottomless bowl shape.

反射板13には例えば6個の取付部材13aが設けられており、図2及び図4に示すように、この取付部材13aを立上部11cに嵌込むことにより、反射板13は輻射シールド11に着脱自在に取付けられ、この取付けにより、取付部材13aと立上部11c間には、不活性ガスの一部が通過するリング状の通気路13bが形成され、不活性ガスが滞ることなく流れるようになっている。   The reflection plate 13 is provided with, for example, six attachment members 13a. As shown in FIGS. 2 and 4, the reflection plate 13 is attached to the radiation shield 11 by fitting the attachment member 13a into the upright portion 11c. A ring-shaped air passage 13b through which a part of the inert gas passes is formed between the mounting member 13a and the upright portion 11c so that the inert gas flows without stagnation. It has become.

輻射シールド11は、上記のような構造を有しており、構造が簡単であり、既存の輻射シールドに取付けることにより、容易に単結晶シリコン中の温度分布を制御することができ、また、その着脱が容易であるので、清掃作業等も容易に行える。   The radiation shield 11 has the structure as described above, has a simple structure, and can be easily controlled in temperature distribution in single crystal silicon by being attached to an existing radiation shield. Since attachment and detachment are easy, cleaning work etc. can be performed easily.

次に本発明に係わる単結晶引上装置を用いた単結晶引上方法について説明する。   Next, a single crystal pulling method using the single crystal pulling apparatus according to the present invention will be described.

図1に示すように、原料のポリシリコンを石英ガラスルツボ3に充填し、不活性ガスGをチャンバ2の上方の不活性ガス供給口12からチャンバ2内に流入させ、ヒータ5を付勢して、石英ガラスルツボ3を加熱し、ルツボ回転用モータを付勢してこのモータに結合されたルツボ回転軸7により石英ガラスルツボ3を回転させる。   As shown in FIG. 1, raw material polysilicon is filled in a quartz glass crucible 3, an inert gas G is caused to flow into the chamber 2 from an inert gas supply port 12 above the chamber 2, and the heater 5 is energized. Then, the quartz glass crucible 3 is heated, the crucible rotating motor is energized, and the quartz glass crucible 3 is rotated by the crucible rotating shaft 7 coupled to the motor.

一定時間が経過した後、ワイヤ回転装置を回転させて引上げ用ワイヤ10を降下させ、シードチャック9を降ろし、シード8をシリコン融液Mに接触させ、結晶を成長させ、単結晶Igを引上げる。   After a certain time has elapsed, the wire rotating device is rotated to lower the pulling wire 10, the seed chuck 9 is lowered, the seed 8 is brought into contact with the silicon melt M, the crystal is grown, and the single crystal Ig is pulled up. .

このようなシリコン単結晶引上工程において、チャンバ2の上方の不活性ガス供給口12より供給された不活性ガスGは、立上部11cによって、よりよく整流されて反射板13が取付けられた輻射シールド11と単結晶Igの間を通り、水平部11bの存在により、融液面から単結晶Igへの熱は遮断されるとともに、不活性ガスGは融液Mの表面に到達する。融液Mの表面より蒸発する酸化物は、融液表面上を流れる不活性ガスGにより捕獲される。酸化物を含んだ不活性ガスGは、輻射シールド11の外側と石英ガラスルツボ3の間を通過し、不活性ガス排出口13からチャンバ2外部へと排出される。このように、輻射シールド11は本来の機能を損なうことなく、その本来の機能を果たす。   In such a silicon single crystal pulling step, the inert gas G supplied from the inert gas supply port 12 above the chamber 2 is rectified by the upright portion 11c and radiated with the reflector 13 attached thereto. Passing between the shield 11 and the single crystal Ig, heat from the melt surface to the single crystal Ig is blocked by the presence of the horizontal portion 11b, and the inert gas G reaches the surface of the melt M. The oxide that evaporates from the surface of the melt M is captured by the inert gas G that flows on the melt surface. The inert gas G containing oxide passes between the outside of the radiation shield 11 and the quartz glass crucible 3 and is discharged from the inert gas discharge port 13 to the outside of the chamber 2. Thus, the radiation shield 11 performs its original function without impairing its original function.

また、上記シリコン単結晶引上工程において、図5に示すように、反射板13の凹部曲面の曲率半径(反射板の焦点距離)はシリコン単結晶Igの温度を制御したい部位に反射板の焦点が合されているので、輻射シールド11により、ヒータ5及び融液Mからシリコン単結晶Igに加えられる輻射熱を遮断して、シリコン単結晶Igから発せられる輻射熱は断面凹状の反射板13によってシリコン単結晶Igの温度制御したい部位に反射される。これにより、単結晶シリコン中の径方向の温度分布を制御することができ、さらに、反射板13の存在は、シリコン単結晶Igから発せられる輻射熱を反射させて集中させるために、シリコン単結晶Ig外周を加熱させて温度制御させる一方で、その反射板13の上万に存在する1100℃〜1000℃の温度領域をより上方にシフトすることができる。上方にシフトすると融液から離れるため、それだけ冷却効果が高くなり、結果、通過時間を低減させることができる。   In the silicon single crystal pulling step, as shown in FIG. 5, the curvature radius (focal length of the reflecting plate) of the concave curved surface of the reflecting plate 13 is the focal point of the reflecting plate at a portion where the temperature of the silicon single crystal Ig is to be controlled. Therefore, the radiation shield 11 cuts off the radiant heat applied to the silicon single crystal Ig from the heater 5 and the melt M, and the radiant heat emitted from the silicon single crystal Ig is reflected by the reflecting plate 13 having a concave cross section. The crystal Ig is reflected to the part where the temperature is desired to be controlled. As a result, the temperature distribution in the radial direction in the single crystal silicon can be controlled, and the presence of the reflecting plate 13 reflects and concentrates the radiant heat generated from the silicon single crystal Ig. While the outer periphery is heated to control the temperature, the temperature region of 1100 ° C. to 1000 ° C. existing in the upper part of the reflector 13 can be shifted upward. Shifting upward moves away from the melt, so that the cooling effect is increased, and as a result, the passage time can be reduced.

また、シールド主体11a、水平部11b、立上部11cに囲まれた空間11eに、断熱材を敷き詰めて、輻射シールド11の断熱効果を向上させることがより好ましい。このように空間11eに断熱材を敷き詰めることで、融液からの輻射熱をより遮断できるため、反射板13の上方に存在する1100℃〜1000℃の温度領域通過時間をより低減することができる。   Further, it is more preferable to spread a heat insulating material in a space 11e surrounded by the shield main body 11a, the horizontal portion 11b, and the upright portion 11c to improve the heat insulating effect of the radiation shield 11. By laying the heat insulating material in the space 11e in this way, the radiant heat from the melt can be further blocked, so that the temperature region passage time of 1100 ° C. to 1000 ° C. existing above the reflector 13 can be further reduced.

上記本シリコン単結晶引上装置は、従来の輻射シールドの内側に凹状でリング形状の反射板を設けることで、単結晶シリコン中の結晶径方向の温度勾配を制御することができ、また、引上速度を速くしても高晶質な単結晶を製造することが可能になる。   The silicon single crystal pulling apparatus can control the temperature gradient in the crystal diameter direction in single crystal silicon by providing a concave ring-shaped reflector inside the conventional radiation shield. Even if the upper speed is increased, a highly crystalline single crystal can be produced.

なお、本発明のシリコン単結晶引上装置は上記実施例に限定されず、例えば、輻射シールドに別個に取付け部を設けて、そこに係合させるように上記反射板を取り付けてもよい。   Note that the silicon single crystal pulling apparatus of the present invention is not limited to the above-described embodiment, and for example, a separate attachment portion may be provided on the radiation shield, and the reflection plate may be attached so as to be engaged therewith.

上述のように本実施形態のシリコン単結晶引上装置によれば、構造が簡単で輻射シールドの本来の機能を損なうことなく、単結晶シリコン中の径方向の温度分布を制御することができ、引上速度を速くしても高品質な単結晶を製造できる。   As described above, according to the silicon single crystal pulling apparatus of the present embodiment, the temperature distribution in the radial direction in the single crystal silicon can be controlled without damaging the original function of the radiation shield with a simple structure, Even if the pulling speed is increased, a high-quality single crystal can be produced.

図1に示すような本発明のシリコン単結晶引上装置を用い、表1に示すような条件でシリコン単結晶の引上げを行った。次に、引上げたシリコン単結晶インゴットをスライス、ラッピング、エッチング、ポリッシングを行ない、厚さ725μmの片面ミラーウェーハを作製し、そのミラー面のLSTD(Laser Scattering Tomography Defect)密度を、ウェーハ中心とウェーハ外周部(測定点4、外周部ベベル部5mm)で調べた(実施例1)。   Using the silicon single crystal pulling apparatus of the present invention as shown in FIG. 1, the silicon single crystal was pulled under the conditions shown in Table 1. Next, the pulled silicon single crystal ingot is sliced, lapped, etched, and polished to produce a single-sided mirror wafer having a thickness of 725 μm, and the LSTD (Laser Scattering Tomography Defect) density of the mirror surface is determined from the wafer center and the wafer outer periphery. Example 1 (measurement point 4, outer peripheral bevel part 5 mm).

次に、本発明のシリコン単結晶引上装置のうち、輻射シールドの空間(図1中符号11e)に円形の断熱材を敷き詰めた状態で反射板を立上部に嵌込み、実施例1と同様の条件にてシリコン単結晶を引上げ、同様の方法にてLSTDの評価を行った(実施例2)。   Next, in the silicon single crystal pulling apparatus of the present invention, the reflector is fitted into the upright portion in a state where a circular heat insulating material is spread in the space of the radiation shield (reference numeral 11e in FIG. 1), and the same as in the first embodiment. The silicon single crystal was pulled under the conditions described above, and LSTD was evaluated by the same method (Example 2).

また、比較例1として、図1に示す反射板を設置しない状態でシリコン単結晶の引上げを行ない、実施例1と同様の条件で評価を行った。

Figure 2005272245
Further, as Comparative Example 1, the silicon single crystal was pulled up without installing the reflector shown in FIG. 1 and evaluated under the same conditions as in Example 1.
Figure 2005272245

Figure 2005272245
Figure 2005272245

表2からもわかるように、実施例1においては、比較例1に比べて、LSTD密度が減少していると共に、中心部と外周部の差も低減しており面内均一性が良化しているのが確認できた。また、実施例2では、断熱材を設けることで、実施例1よりもLSTD密度の低減効果が得られることが確認できた。   As can be seen from Table 2, in Example 1, the LSTD density is decreased as compared with Comparative Example 1, and the difference between the central portion and the outer peripheral portion is also reduced, and the in-plane uniformity is improved. I was able to confirm. Moreover, in Example 2, it has confirmed that the reduction effect of the LSTD density was acquired rather than Example 1 by providing a heat insulating material.

本発明に係る単結晶引上装置の一実施形態の概念図。The conceptual diagram of one Embodiment of the single crystal pulling apparatus which concerns on this invention. 本発明に係る単結晶引上装置に用いられる輻射シールド及び反射板の一部を示す概念図。The conceptual diagram which shows a part of radiation shield and reflector which are used for the single crystal pulling apparatus which concerns on this invention. 本発明に係る単結晶引上装置に用いられる反射板の斜視図。The perspective view of the reflecting plate used for the single crystal pulling apparatus which concerns on this invention. 本発明に係る単結晶引上装置に用いられる反射板の取外し状態を示す断面図。Sectional drawing which shows the removal state of the reflecting plate used for the single crystal pulling apparatus which concerns on this invention. 本発明に係る単結晶引上装置の一実施形態の使用状態を示す概念図。The conceptual diagram which shows the use condition of one Embodiment of the single crystal pulling apparatus which concerns on this invention. 従来の単結晶引上装置の概念図。The conceptual diagram of the conventional single crystal pulling apparatus.

符号の説明Explanation of symbols

1 単結晶引上装置
2 チャンバ
3 石英ガラスルツボ
4 黒鉛ルツボ
5 ヒータ
10 引上げ用ワイヤ
11 輻射シールド
11a シールド主体
11b 水平部
11c 立上部
11d 取付部
11e 空間
13 反射板
13a 取付部材
13b 通気路
DESCRIPTION OF SYMBOLS 1 Single crystal pulling apparatus 2 Chamber 3 Quartz glass crucible 4 Graphite crucible 5 Heater 10 Pulling wire 11 Radiation shield 11a Shield main body 11b Horizontal portion 11c Upright portion 11d Mounting portion 11e Space 13 Reflecting plate 13a Mounting member 13b Air passage

Claims (3)

チャンバと、このチャンバ内に設けられ原料シリコンが収納される石英ガラスルツボと、この石英ガラスルツボを周囲から加熱するヒータと、前記石英ガラスルツボの上方に設けられシリコン単結晶が貫通する開口が形成された輻射シールドと、この輻射シールドを貫通しシードチャックが取付けられた引上げ用ワイヤと、このワイヤを昇降させるワイヤ回転装置とを有し、前記輻射シールドの内側には、高反射率部材からなり断面が凹状でリング形状の反射板が取付けられたことを特徴とするシリコン単結晶引上装置。 A chamber, a quartz glass crucible provided in the chamber and containing raw silicon, a heater for heating the quartz glass crucible from the periphery, and an opening provided above the quartz glass crucible and through which the silicon single crystal passes are formed. A radiation wire, a pulling wire that penetrates the radiation shield and has a seed chuck attached thereto, and a wire rotating device that raises and lowers the wire. The radiation shield is made of a highly reflective member. A silicon single crystal pulling apparatus, characterized in that a ring-shaped reflector is attached with a concave cross section. 前記輻射シールドは、中空截頭円錐状のシールド主体と、このシールド主体から内方に延びるリング形状の水平部と、この水平部から上方にリング形状に立上がる立上部と、前記シールド主体から外方に延びたリング形状の取付部を有し、前記反射板が前記立上部に取付けられたことを特徴とする請求項1に記載のシリコン単結晶引上装置。 The radiation shield includes a hollow frustoconical shield main body, a ring-shaped horizontal portion extending inwardly from the shield main body, an upright portion rising upward from the horizontal portion into a ring shape, and an outer portion from the shield main body. The silicon single crystal pulling apparatus according to claim 1, further comprising a ring-shaped attachment portion extending in the direction, wherein the reflector is attached to the upright portion. 前記反射板は、前記輻射シールドの前記立上部に取付けられており、シールド主体と水平部と立上部の空間にリング状の断熱材を取付けたことを特徴とする請求項1または2に記載のシリコン単結晶引上装置。 The said reflecting plate is attached to the said upright part of the said radiation shield, The ring-shaped heat insulating material was attached to the space of a shield main body, a horizontal part, and an upright part, The Claim 1 or 2 characterized by the above-mentioned. Silicon single crystal pulling device.
JP2004090197A 2004-03-25 2004-03-25 Silicon single crystal pulling device Pending JP2005272245A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111334853A (en) * 2020-04-03 2020-06-26 大连连城数控机器股份有限公司 Heat radiation reflection device for improving growth speed of czochralski single crystal

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993000462A1 (en) * 1991-06-24 1993-01-07 Komatsu Electronic Metals Co., Ltd. Device for pulling up single crystal
JP2001270797A (en) * 2000-03-28 2001-10-02 Wacker Nsce Corp Apparatus for producing silicon single crystal

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993000462A1 (en) * 1991-06-24 1993-01-07 Komatsu Electronic Metals Co., Ltd. Device for pulling up single crystal
JP2001270797A (en) * 2000-03-28 2001-10-02 Wacker Nsce Corp Apparatus for producing silicon single crystal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111334853A (en) * 2020-04-03 2020-06-26 大连连城数控机器股份有限公司 Heat radiation reflection device for improving growth speed of czochralski single crystal

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